KR20180084809A - 반도체 기판을 운반하기 위한 로봇 아암 - Google Patents

반도체 기판을 운반하기 위한 로봇 아암 Download PDF

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Publication number
KR20180084809A
KR20180084809A KR1020187014404A KR20187014404A KR20180084809A KR 20180084809 A KR20180084809 A KR 20180084809A KR 1020187014404 A KR1020187014404 A KR 1020187014404A KR 20187014404 A KR20187014404 A KR 20187014404A KR 20180084809 A KR20180084809 A KR 20180084809A
Authority
KR
South Korea
Prior art keywords
carrying
semiconductor substrate
robot arm
robot
arm
Prior art date
Application number
KR1020187014404A
Other languages
English (en)
Other versions
KR102455772B1 (ko
Inventor
후이 왕
준 우
즈여우 팡
Original Assignee
에이씨엠 리서치 (상하이) 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에이씨엠 리서치 (상하이) 인코포레이티드 filed Critical 에이씨엠 리서치 (상하이) 인코포레이티드
Publication of KR20180084809A publication Critical patent/KR20180084809A/ko
Application granted granted Critical
Publication of KR102455772B1 publication Critical patent/KR102455772B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
KR1020187014404A 2015-11-20 2015-11-20 반도체 기판을 운반하기 위한 로봇 아암 KR102455772B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2015/095089 WO2017084079A1 (en) 2015-11-20 2015-11-20 Robot arm for transporting semiconductor substrates

Publications (2)

Publication Number Publication Date
KR20180084809A true KR20180084809A (ko) 2018-07-25
KR102455772B1 KR102455772B1 (ko) 2022-10-18

Family

ID=58718038

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187014404A KR102455772B1 (ko) 2015-11-20 2015-11-20 반도체 기판을 운반하기 위한 로봇 아암

Country Status (4)

Country Link
KR (1) KR102455772B1 (ko)
CN (1) CN108292620B (ko)
SG (1) SG11201804177WA (ko)
WO (1) WO2017084079A1 (ko)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08107136A (ja) * 1994-10-03 1996-04-23 Dainippon Screen Mfg Co Ltd 基板搬送装置
KR19980087124A (ko) * 1997-05-15 1998-12-05 히가시 테쯔로우 기판반송장치 및 기판반송방법
JP2005012033A (ja) * 2003-06-20 2005-01-13 Nikon Corp 搬送装置
JP2006156616A (ja) * 2004-11-29 2006-06-15 Jel:Kk 基板保持装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4873895B2 (ja) * 2005-07-04 2012-02-08 東芝機械株式会社 平板状搬送物の搬送方法及びその装置
JP4740414B2 (ja) * 2007-04-24 2011-08-03 東京エレクトロン株式会社 基板搬送装置
KR20100077523A (ko) * 2008-12-29 2010-07-08 윤점채 웨이퍼 이송 아암
JP5581713B2 (ja) * 2009-02-12 2014-09-03 株式会社Ｓｕｍｃｏ ウェーハ表面測定装置
KR20110101808A (ko) * 2010-03-10 2011-09-16 주식회사 엘지실트론 웨이퍼 이송장치
JP2012009751A (ja) * 2010-06-28 2012-01-12 Fujikura Ltd 真空ピンセット
DE102010026610A1 (de) * 2010-07-09 2012-01-12 Centrotherm Thermal Solutions Gmbh + Co. Kg Unterdruck-Saugeinheit und Greifer
JP2012033723A (ja) * 2010-07-30 2012-02-16 Fujikura Ltd 真空ピンセット及び真空吸着方法
JP6186124B2 (ja) * 2012-12-14 2017-08-23 東京応化工業株式会社 搬送アーム、搬送装置および搬送方法
KR20140102782A (ko) * 2013-02-14 2014-08-25 삼성전자주식회사 웨이퍼 이송용 블레이드 및 이를 포함하는 웨이퍼 이송 장치
US20150164187A1 (en) * 2013-03-13 2015-06-18 Georgia Ann NEBLETT Twist Locking Apparatus
JP6224437B2 (ja) * 2013-11-26 2017-11-01 東京エレクトロン株式会社 基板搬送装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08107136A (ja) * 1994-10-03 1996-04-23 Dainippon Screen Mfg Co Ltd 基板搬送装置
KR19980087124A (ko) * 1997-05-15 1998-12-05 히가시 테쯔로우 기판반송장치 및 기판반송방법
JP2005012033A (ja) * 2003-06-20 2005-01-13 Nikon Corp 搬送装置
JP2006156616A (ja) * 2004-11-29 2006-06-15 Jel:Kk 基板保持装置

Also Published As

Publication number Publication date
WO2017084079A1 (en) 2017-05-26
KR102455772B1 (ko) 2022-10-18
SG11201804177WA (en) 2018-06-28
CN108292620A (zh) 2018-07-17
CN108292620B (zh) 2022-08-09

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X701 Decision to grant (after re-examination)
GRNT Written decision to grant