SG11201804177WA - Robot arm for transporting semiconductor substrates - Google Patents

Robot arm for transporting semiconductor substrates

Info

Publication number
SG11201804177WA
SG11201804177WA SG11201804177WA SG11201804177WA SG11201804177WA SG 11201804177W A SG11201804177W A SG 11201804177WA SG 11201804177W A SG11201804177W A SG 11201804177WA SG 11201804177W A SG11201804177W A SG 11201804177WA SG 11201804177W A SG11201804177W A SG 11201804177WA
Authority
SG
Singapore
Prior art keywords
shanghai
international
cups
semiconductor substrate
bld
Prior art date
Application number
SG11201804177WA
Inventor
Hui Wang
Jun Wu
Zhiyou Fang
Original Assignee
Acm Res Shanghai Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acm Res Shanghai Inc filed Critical Acm Res Shanghai Inc
Publication of SG11201804177WA publication Critical patent/SG11201804177WA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property - Organization International Bureau (43) International Publication Date ..... .....r ...) 26 May 2017(26.05.2017) WIPO I PCT (10) WO International 111111111111311111111111111111111111111111111111111111111111111111111311111111111111111 2017/084079 Publication Al Number (51) International Patent Classification: (81) Designated States (unless otherwise indicated, for every HO1L 21/677 (2006.01) HO1L 21/683 (2006.01) kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, (21) International Application Number: BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, PCT/CN2015/095089 DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, (22) International Filing Date: HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, 20 November 2015 (20.11.2015) KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, (25) Filing Language: English PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, (26) Publication Language: English SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (71) Applicant: ACM RESEARCH (SHANGHAI) INC. [CN/CN]; Bld. 4, No. 1690 Cailun Road, Zhangjiang (84) Designated States (unless otherwise indicated, for every High-tech Park, Shanghai 201203 (CN). kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, (72) Inventors: WANG, Hui; Bld. 4, No. 1690 Cailun Road, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, Zhangjiang High-tech Park, Shanghai 201203 (CN). WU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, Jun; Bld. 4, No. 1690 Cailun Road, Zhangjiang High-tech DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, Park, Shanghai 201203 (CN). FANG, Zhiyou; Bld. 4, No. LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, 1690 Cailun Road, Zhangjiang High-tech Park, Shanghai SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, 201203 (CN). GW, KM, ML, MR, NE, SN, TD, TG). (74) Agent: SHANGHAI PATENT & TRADEMARK LAW Published: OFFICE, LLC; 435 Guiping Road, Shanghai 200233 — with international search report (Art 21(3)) (CN). (54) Title: ROBOT ARM FOR TRANSPORTING SEMICONDUCTOR SUBSTRATES 300 301 303b 3021 -4, 1Zirl 1. o 0 r 1-1 302 303c .4t 303a 01 IC - - 0 71. FIG 4 GC (57) : A robot arm (300, 400, 500, 600) for transporting semiconductor substrates (304, 404) comprises a body portion C (301, 401, 501, 601), an end portion (302, 402, 502, 602) extending from the body portion (301, 401, 501, 601), a plurality of vacu - IN um cups disposed on the end portion (302, 402, 502, 602), and a plurality of vacuum lines connecting to the plurality of vacuum 1-1 O cups respectively. The distance between any two adjacent vacuum cups satisfies the following condition: a vertical displacement of el the semiconductor substrate (304, 404) produced by one of the two adjacent vacuum cups sucking down the semiconductor substrate 0 is greater than a warpage of the semiconductor substrate (304, 404) in the range of the two adjacent vacuum cups, so that once the ,-t one of the two adjacent vacuum cups sucks the semiconductor substrate (304, 404), the other vacuum cup of the two adjacent vacu - .,- um cups is followed to suck the semiconductor substrate (304, 404).
SG11201804177WA 2015-11-20 2015-11-20 Robot arm for transporting semiconductor substrates SG11201804177WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2015/095089 WO2017084079A1 (en) 2015-11-20 2015-11-20 Robot arm for transporting semiconductor substrates

Publications (1)

Publication Number Publication Date
SG11201804177WA true SG11201804177WA (en) 2018-06-28

Family

ID=58718038

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201804177WA SG11201804177WA (en) 2015-11-20 2015-11-20 Robot arm for transporting semiconductor substrates

Country Status (4)

Country Link
KR (1) KR102455772B1 (en)
CN (1) CN108292620B (en)
SG (1) SG11201804177WA (en)
WO (1) WO2017084079A1 (en)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3172375B2 (en) * 1994-10-03 2001-06-04 大日本スクリーン製造株式会社 Substrate transfer device
JP3850951B2 (en) * 1997-05-15 2006-11-29 東京エレクトロン株式会社 Substrate transport apparatus and substrate transport method
JP2005012033A (en) * 2003-06-20 2005-01-13 Nikon Corp Carrying device
JP2006156616A (en) * 2004-11-29 2006-06-15 Jel:Kk Substrate holding device
JP4873895B2 (en) * 2005-07-04 2012-02-08 東芝機械株式会社 Method and apparatus for transporting flat plate-like conveyed product
JP4740414B2 (en) * 2007-04-24 2011-08-03 東京エレクトロン株式会社 Substrate transfer device
KR20100077523A (en) * 2008-12-29 2010-07-08 윤점채 A moving arm for wafer
JP5581713B2 (en) * 2009-02-12 2014-09-03 株式会社Ｓｕｍｃｏ Wafer surface measuring device
KR20110101808A (en) * 2010-03-10 2011-09-16 주식회사 엘지실트론 A wafer transfer apparatus
JP2012009751A (en) * 2010-06-28 2012-01-12 Fujikura Ltd Vacuum tweezers
DE102010026610A1 (en) * 2010-07-09 2012-01-12 Centrotherm Thermal Solutions Gmbh + Co. Kg Vacuum suction unit and gripper
JP2012033723A (en) * 2010-07-30 2012-02-16 Fujikura Ltd Vacuum tweezer and vacuum suction method
JP6186124B2 (en) * 2012-12-14 2017-08-23 東京応化工業株式会社 Transfer arm, transfer device, and transfer method
KR20140102782A (en) * 2013-02-14 2014-08-25 삼성전자주식회사 Blade for transferring wafer and wafer transferring apparatus having the same
US20150164187A1 (en) * 2013-03-13 2015-06-18 Georgia Ann NEBLETT Twist Locking Apparatus
JP6224437B2 (en) * 2013-11-26 2017-11-01 東京エレクトロン株式会社 Substrate transfer device

Also Published As

Publication number Publication date
KR20180084809A (en) 2018-07-25
WO2017084079A1 (en) 2017-05-26
KR102455772B1 (en) 2022-10-18
CN108292620A (en) 2018-07-17
CN108292620B (en) 2022-08-09

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