KR20180084674A - Photosensitive film laminate, and cured product formed by using same - Google Patents
Photosensitive film laminate, and cured product formed by using same Download PDFInfo
- Publication number
- KR20180084674A KR20180084674A KR1020180005874A KR20180005874A KR20180084674A KR 20180084674 A KR20180084674 A KR 20180084674A KR 1020180005874 A KR1020180005874 A KR 1020180005874A KR 20180005874 A KR20180005874 A KR 20180005874A KR 20180084674 A KR20180084674 A KR 20180084674A
- Authority
- KR
- South Korea
- Prior art keywords
- photosensitive film
- photosensitive
- same
- cured product
- film laminate
- Prior art date
Links
- 238000003475 lamination Methods 0.000 abstract 4
- 230000006835 compression Effects 0.000 abstract 1
- 238000007906 compression Methods 0.000 abstract 1
- 238000007689 inspection Methods 0.000 abstract 1
- 239000011342 resin composition Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/24—All layers being polymeric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/558—Impact strength, toughness
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Epoxy Resins (AREA)
Abstract
The present invention provides a photosensitive film lamination capable of preventing a furrow of a pattern from collapsing and of suppressing influence on the surface of a photosensitive film by strong impact and compression when a substrate on which the photosensitive film lamination is laminated overlaps. The photosensitive film lamination also can improve yield in exterior inspection of a cured film. The photosensitive film lamination includes: a support film; a middle layer; and a photosensitive film composed of photosensitive resin composition, in order. The photosensitive film includes a side having an uneven surface. An average interval Sm of an uneven part on the surface of the uneven part is equal to or is greater than 5μm and is equal to or less than 90 μm.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2017-006196 | 2017-01-17 | ||
JP2017006196 | 2017-01-17 | ||
JPJP-P-2017-186951 | 2017-09-27 | ||
JP2017186951A JP6345855B1 (en) | 2017-01-17 | 2017-09-27 | Photosensitive film laminate and cured product formed using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20180084674A true KR20180084674A (en) | 2018-07-25 |
KR102371010B1 KR102371010B1 (en) | 2022-03-07 |
Family
ID=62635704
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020180005874A KR102371010B1 (en) | 2017-01-17 | 2018-01-17 | Photosensitive film laminate, and cured product formed by using same |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6345855B1 (en) |
KR (1) | KR102371010B1 (en) |
CN (1) | CN108327357B (en) |
TW (3) | TWI776614B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020145457A1 (en) * | 2019-01-10 | 2020-07-16 | 삼성디스플레이 주식회사 | Window and manufacturing method therefor |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220066322A1 (en) | 2020-08-26 | 2022-03-03 | Tamura Corporation | Photosensitive dry film, and printed wiring board with photosensitive dry film |
CN116710845A (en) * | 2020-12-25 | 2023-09-05 | 富士胶片株式会社 | Transfer material and method for producing laminate |
JP2022157524A (en) | 2021-03-31 | 2022-10-14 | 太陽インキ製造株式会社 | Insulating film for electronic component, and method of manufacturing insulating film for electronic component |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010085513A (en) * | 2008-09-30 | 2010-04-15 | Toyo Ink Mfg Co Ltd | Photosensitive dry film |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0289631A (en) * | 1988-09-27 | 1990-03-29 | Somar Corp | Chemical mat film and photosensitive film used therewith |
JPH0836258A (en) * | 1994-07-25 | 1996-02-06 | Hitachi Chem Co Ltd | Photosensitive element, its laminating method and resist forming method |
JPH0961996A (en) * | 1995-08-28 | 1997-03-07 | Hitachi Chem Co Ltd | Photosensitive resin composition, photosensitive element, and production of back plate of plasma display |
JP4415175B2 (en) * | 2003-11-06 | 2010-02-17 | ソニー株式会社 | Electroforming mold manufacturing method |
CN101341444B (en) * | 2005-12-21 | 2011-12-14 | 富士胶片株式会社 | Photosensitive sheets and method and apparatus for manufacturing the same |
CN101432661B (en) * | 2006-04-28 | 2012-09-05 | 旭化成电子材料株式会社 | Photosensitive resin laminate |
JP2009186510A (en) * | 2008-02-01 | 2009-08-20 | Fujifilm Corp | Photosensitive composition, photosensitive film, photosensitive laminate, method for forming permanent pattern, and printed wiring board |
JP5279423B2 (en) * | 2008-05-19 | 2013-09-04 | 富士フイルム株式会社 | Photosensitive composition, photosensitive film, photosensitive laminate, permanent pattern forming method, and printed circuit board |
JP5768521B2 (en) * | 2010-07-13 | 2015-08-26 | 日立化成株式会社 | Photosensitive element, resist pattern forming method using the same, and printed wiring board manufacturing method |
JP5511597B2 (en) * | 2010-09-06 | 2014-06-04 | 日東電工株式会社 | Method for manufacturing printed circuit board |
JP2012116130A (en) * | 2010-12-02 | 2012-06-21 | Fujifilm Corp | Method for manufacturing laminate having metal film |
KR101444044B1 (en) * | 2010-12-16 | 2014-09-23 | 히타치가세이가부시끼가이샤 | Photosensitive element, method for forming resist pattern, and method for producing printed circuit board |
WO2012157135A1 (en) * | 2011-05-17 | 2012-11-22 | 三共化成株式会社 | Method for manufacturing molded circuit board |
EP3012097A3 (en) * | 2012-06-13 | 2016-06-22 | Asahi Kasei E-materials Corporation | Function transfer product, functional layer transfer method, packed product, and function transfer film roll |
WO2014077406A1 (en) * | 2012-11-19 | 2014-05-22 | タツタ電線株式会社 | Multilayer film and shielded printed wiring board |
JP5882510B2 (en) * | 2014-06-30 | 2016-03-09 | 太陽インキ製造株式会社 | Photosensitive dry film and method for producing printed wiring board using the same |
JP2017165589A (en) * | 2014-08-01 | 2017-09-21 | 旭硝子株式会社 | Supporter substrate with inorganic film and glass laminate, manufacturing method thereof, and manufacturing method of electronic device |
JP2016151578A (en) * | 2015-02-16 | 2016-08-22 | 旭化成株式会社 | Production apparatus for optical base material and production method of optical base material |
-
2017
- 2017-09-27 JP JP2017186951A patent/JP6345855B1/en active Active
-
2018
- 2018-01-15 CN CN201810034610.1A patent/CN108327357B/en active Active
- 2018-01-16 TW TW110127641A patent/TWI776614B/en active
- 2018-01-16 TW TW110127640A patent/TWI776613B/en active
- 2018-01-16 TW TW107101481A patent/TWI735731B/en active
- 2018-01-17 KR KR1020180005874A patent/KR102371010B1/en active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010085513A (en) * | 2008-09-30 | 2010-04-15 | Toyo Ink Mfg Co Ltd | Photosensitive dry film |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020145457A1 (en) * | 2019-01-10 | 2020-07-16 | 삼성디스플레이 주식회사 | Window and manufacturing method therefor |
Also Published As
Publication number | Publication date |
---|---|
TW202144919A (en) | 2021-12-01 |
JP2018116255A (en) | 2018-07-26 |
TWI735731B (en) | 2021-08-11 |
JP6345855B1 (en) | 2018-06-20 |
TW201839516A (en) | 2018-11-01 |
CN108327357A (en) | 2018-07-27 |
KR102371010B1 (en) | 2022-03-07 |
CN108327357B (en) | 2021-09-28 |
TWI776613B (en) | 2022-09-01 |
TW202144918A (en) | 2021-12-01 |
TWI776614B (en) | 2022-09-01 |
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