KR20180084674A - Photosensitive film laminate, and cured product formed by using same - Google Patents

Photosensitive film laminate, and cured product formed by using same Download PDF

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Publication number
KR20180084674A
KR20180084674A KR1020180005874A KR20180005874A KR20180084674A KR 20180084674 A KR20180084674 A KR 20180084674A KR 1020180005874 A KR1020180005874 A KR 1020180005874A KR 20180005874 A KR20180005874 A KR 20180005874A KR 20180084674 A KR20180084674 A KR 20180084674A
Authority
KR
South Korea
Prior art keywords
photosensitive film
photosensitive
same
cured product
film laminate
Prior art date
Application number
KR1020180005874A
Other languages
Korean (ko)
Other versions
KR102371010B1 (en
Inventor
치히로 후나코시
마리코 시마미야
가즈야 오카다
가즈야 사토
히데유키 이토
야스아키 아라이
노부히토 이토
Original Assignee
다이요 잉키 세이조 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이요 잉키 세이조 가부시키가이샤 filed Critical 다이요 잉키 세이조 가부시키가이샤
Publication of KR20180084674A publication Critical patent/KR20180084674A/en
Application granted granted Critical
Publication of KR102371010B1 publication Critical patent/KR102371010B1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/24All layers being polymeric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/40Properties of the layers or laminate having particular optical properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558Impact strength, toughness

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)

Abstract

The present invention provides a photosensitive film lamination capable of preventing a furrow of a pattern from collapsing and of suppressing influence on the surface of a photosensitive film by strong impact and compression when a substrate on which the photosensitive film lamination is laminated overlaps. The photosensitive film lamination also can improve yield in exterior inspection of a cured film. The photosensitive film lamination includes: a support film; a middle layer; and a photosensitive film composed of photosensitive resin composition, in order. The photosensitive film includes a side having an uneven surface. An average interval Sm of an uneven part on the surface of the uneven part is equal to or is greater than 5μm and is equal to or less than 90 μm.
KR1020180005874A 2017-01-17 2018-01-17 Photosensitive film laminate, and cured product formed by using same KR102371010B1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2017-006196 2017-01-17
JP2017006196 2017-01-17
JPJP-P-2017-186951 2017-09-27
JP2017186951A JP6345855B1 (en) 2017-01-17 2017-09-27 Photosensitive film laminate and cured product formed using the same

Publications (2)

Publication Number Publication Date
KR20180084674A true KR20180084674A (en) 2018-07-25
KR102371010B1 KR102371010B1 (en) 2022-03-07

Family

ID=62635704

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180005874A KR102371010B1 (en) 2017-01-17 2018-01-17 Photosensitive film laminate, and cured product formed by using same

Country Status (4)

Country Link
JP (1) JP6345855B1 (en)
KR (1) KR102371010B1 (en)
CN (1) CN108327357B (en)
TW (3) TWI776614B (en)

Cited By (1)

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WO2020145457A1 (en) * 2019-01-10 2020-07-16 삼성디스플레이 주식회사 Window and manufacturing method therefor

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220066322A1 (en) 2020-08-26 2022-03-03 Tamura Corporation Photosensitive dry film, and printed wiring board with photosensitive dry film
CN116710845A (en) * 2020-12-25 2023-09-05 富士胶片株式会社 Transfer material and method for producing laminate
JP2022157524A (en) 2021-03-31 2022-10-14 太陽インキ製造株式会社 Insulating film for electronic component, and method of manufacturing insulating film for electronic component

Citations (1)

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JP2010085513A (en) * 2008-09-30 2010-04-15 Toyo Ink Mfg Co Ltd Photosensitive dry film

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JPH0289631A (en) * 1988-09-27 1990-03-29 Somar Corp Chemical mat film and photosensitive film used therewith
JPH0836258A (en) * 1994-07-25 1996-02-06 Hitachi Chem Co Ltd Photosensitive element, its laminating method and resist forming method
JPH0961996A (en) * 1995-08-28 1997-03-07 Hitachi Chem Co Ltd Photosensitive resin composition, photosensitive element, and production of back plate of plasma display
JP4415175B2 (en) * 2003-11-06 2010-02-17 ソニー株式会社 Electroforming mold manufacturing method
CN101341444B (en) * 2005-12-21 2011-12-14 富士胶片株式会社 Photosensitive sheets and method and apparatus for manufacturing the same
CN101432661B (en) * 2006-04-28 2012-09-05 旭化成电子材料株式会社 Photosensitive resin laminate
JP2009186510A (en) * 2008-02-01 2009-08-20 Fujifilm Corp Photosensitive composition, photosensitive film, photosensitive laminate, method for forming permanent pattern, and printed wiring board
JP5279423B2 (en) * 2008-05-19 2013-09-04 富士フイルム株式会社 Photosensitive composition, photosensitive film, photosensitive laminate, permanent pattern forming method, and printed circuit board
JP5768521B2 (en) * 2010-07-13 2015-08-26 日立化成株式会社 Photosensitive element, resist pattern forming method using the same, and printed wiring board manufacturing method
JP5511597B2 (en) * 2010-09-06 2014-06-04 日東電工株式会社 Method for manufacturing printed circuit board
JP2012116130A (en) * 2010-12-02 2012-06-21 Fujifilm Corp Method for manufacturing laminate having metal film
KR101444044B1 (en) * 2010-12-16 2014-09-23 히타치가세이가부시끼가이샤 Photosensitive element, method for forming resist pattern, and method for producing printed circuit board
WO2012157135A1 (en) * 2011-05-17 2012-11-22 三共化成株式会社 Method for manufacturing molded circuit board
EP3012097A3 (en) * 2012-06-13 2016-06-22 Asahi Kasei E-materials Corporation Function transfer product, functional layer transfer method, packed product, and function transfer film roll
WO2014077406A1 (en) * 2012-11-19 2014-05-22 タツタ電線株式会社 Multilayer film and shielded printed wiring board
JP5882510B2 (en) * 2014-06-30 2016-03-09 太陽インキ製造株式会社 Photosensitive dry film and method for producing printed wiring board using the same
JP2017165589A (en) * 2014-08-01 2017-09-21 旭硝子株式会社 Supporter substrate with inorganic film and glass laminate, manufacturing method thereof, and manufacturing method of electronic device
JP2016151578A (en) * 2015-02-16 2016-08-22 旭化成株式会社 Production apparatus for optical base material and production method of optical base material

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Publication number Priority date Publication date Assignee Title
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020145457A1 (en) * 2019-01-10 2020-07-16 삼성디스플레이 주식회사 Window and manufacturing method therefor

Also Published As

Publication number Publication date
TW202144919A (en) 2021-12-01
JP2018116255A (en) 2018-07-26
TWI735731B (en) 2021-08-11
JP6345855B1 (en) 2018-06-20
TW201839516A (en) 2018-11-01
CN108327357A (en) 2018-07-27
KR102371010B1 (en) 2022-03-07
CN108327357B (en) 2021-09-28
TWI776613B (en) 2022-09-01
TW202144918A (en) 2021-12-01
TWI776614B (en) 2022-09-01

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E701 Decision to grant or registration of patent right
GRNT Written decision to grant