KR20180075240A - Substrate procesing apparatus - Google Patents

Abstract

The present invention relates to a substrate processing apparatus, performing a polishing process for a substrate. The apparatus comprises: a stage on which a substrate is mounted; and a polishing part polishing a surface of the substrate while performing a first linear motion in the first direction with respect to the substrate and a second linear motion in the second direction crossing to the first direction. Accordingly, polishing uniformity of a large area substrate can be improved, and a yield can be increased.

Description

[0001] SUBSTRATE PROCESSING APPARATUS [0002]

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus capable of accurately controlling the polishing thickness of a large area substrate and improving polishing efficiency.

In recent years, there has been a growing interest in information display and a demand for a portable information medium has increased, and a lightweight flat panel display (FPD) that replaces a cathode ray tube (CRT) And research and commercialization are being carried out.

In the field of flat panel displays, a liquid crystal display device (LCD), which is light and consumes little power, has attracted the greatest attention, but the liquid crystal display device is not a light emitting device but a light receiving device, ratio, and viewing angle. Therefore, a new display device capable of overcoming such drawbacks is actively developed. One of the next-generation displays, which has recently come to the fore, is an organic light emitting display (OLED).

Generally, a glass substrate having excellent strength and transparency is used in a display device. In recent years, since a display device is slim and high-pixel, a corresponding glass substrate must be prepared.

Particularly, the glass substrate is becoming larger and larger, and the process of polishing the unnecessary portion while uniformizing the transmittance of the glass substrate requires stable polishing reliability as a very important process as the transmittance itself determines the completeness of the product.

More specifically, if the flatness (surface uniformity) of the glass substrate is lower as the size of the display device increases and the number of pixels increases as the number of pixels increases, the image is distorted and the image quality deteriorates due to the transmittance deviation caused by the surface thickness deviation of the glass substrate. Should be able to be polished to have high surface uniformity.

Conventionally known polishing methods for glass substrates include a method of mechanically polishing a glass substrate and a method of polishing the entire glass substrate by immersing the glass substrate in a polishing solution. However, there is a problem in that a method of polishing a glass substrate only mechanically or immersing it in an abrasive solution has low abrasive precision and low production efficiency.

On the other hand, there is a chemical mechanical polishing (CMP) method in which mechanical polishing and chemical polishing are performed in parallel as one of the methods capable of precisely polishing the surface of the substrate. Chemical mechanical polishing is a method in which a substrate is polished by rotating contact with a polishing pad, and a slurry for chemical polishing is supplied together.

However, since a large-area glass substrate (for example, a sixth-generation substrate of 1500 mm * 1850 mm) has a very large size, an existing chemical mechanical polishing system must inevitably rotate the substrate during polishing, There is a problem that it is very difficult to apply a conventional chemical mechanical polishing method as a precision polishing method of a glass substrate.

In other words, in order to perform chemical mechanical polishing on a large-area glass substrate, it is inevitably necessary to rotate the large-area glass substrate, which is not only difficult to rotate due to its large size, There is a problem that it is difficult to precisely polish the large-area glass substrate by the conventional chemical mechanical polishing method because it is difficult to stably maintain and requires a very large rotating equipment and space.

To this end, in recent years, various studies have been made to increase the polishing uniformity of a large-area substrate (a substrate having a length of 1 m or more on one side) and to improve the polishing efficiency, but development thereof has been demanded.

An object of the present invention is to provide a substrate processing apparatus capable of increasing the polishing uniformity of a large area substrate and improving the yield.

In particular, it is an object of the present invention to minimize the formation of scratches on the surface of a substrate during a polishing process and to improve polishing quality.

It is another object of the present invention to shorten the response speed required for polishing control and keep the pressing force applied to the large-area substrate constant.

It is another object of the present invention to improve the conditioning efficiency of an abrasive belt for polishing a substrate.

It is another object of the present invention to increase the surface uniformity of a large-area glass substrate.

According to a first aspect of the present invention, there is provided a method of manufacturing a semiconductor device, including: a stage on which a substrate is mounted; a first linear movement along a first direction and a second linear movement along a second direction And polishing the surface of the substrate while performing the second linear movement along the second polishing surface.

This is because the polishing of a large-area substrate (a substrate having a side of 1 m or more on one side) is precisely performed by a mechanical polishing or a chemical mechanical polishing process in which mechanical polishing and chemical polishing are performed in parallel to increase the polishing uniformity of a large- .

In particular, by allowing the polishing part to polish the surface of the substrate while simultaneously performing a first linear movement and a first direction along the first direction with respect to the substrate and a second linear movement along the second direction intersecting the substrate, An advantageous effect of minimizing the occurrence of scratches on the substrate can be obtained.

That is, when the polishing part linearly moves only in the first direction with respect to the substrate, particles of different sizes (10 nm to 60 nm) included in the slurry move linearly in the first direction only between the polishing part and the substrate Therefore, a texture is formed linearly on the surface of the substrate along the movement direction (first direction) of the substrate, and micro-scratches occur if the linear shape is repeatedly formed on the same portion. Particularly, in the method in which the polishing part linearly moves only in the first direction with respect to the substrate, there is a problem that micro-scratches occur frequently because the linearity is likely to be repeatedly formed on the same area on the surface of the substrate. However, by allowing the polishing part to move along the first direction and to reciprocate in the second direction orthogonal to the first direction, the polishing part can have a continuous non-linear shape (e.g., It is possible to remarkably lower the probability that the texture of the slurry particles is repeatedly formed on the same area on the surface of the substrate during the polishing process, ) Is repeatedly formed at the same site, it is possible to obtain an advantageous effect of minimizing the occurrence of micro-scratches.

At this time, the first direction and the second direction in which the polishing part moves can be variously changed according to required conditions and design specifications. Preferably, the second direction is defined to intersect perpendicularly to the first direction. More preferably, the polishing part continuously reciprocates along the second direction while moving along the first direction with respect to the substrate, thereby polishing the surface of the substrate. By thus allowing the polishing part to reciprocate continuously along the second direction orthogonal to the first direction while moving along the first direction and to polish the surface of the substrate, the polishing part has a continuous curved Since the substrate can be polished while moving along the path, an advantageous effect of minimizing the occurrence of scratches on the substrate during the polishing process can be obtained.

Preferably, the polishing part polishes the substrate while moving along a path satisfying a function that the peak at the point of change of the polishing part along the second direction is a curved line.

For example, the reciprocating motion of the polishing part along the second direction polishes the substrate while moving along a path satisfying the following equation [1].

[Equation 1]

Here, x is an x coordinate value, y is a y coordinate value, a is an amplitude, b is a period, and c is an offset value.

In another example, the reciprocating movement of the polishing part along the second direction polishes the substrate while moving along a path satisfying the following equation [2].

&Quot; (2) "

Here, x is an x coordinate value, y is a y coordinate value, a is an amplitude, b is a period, and c is an offset value.

Thus, by controlling the reciprocating motion of the polishing part along the second direction to a sin function or a cos function (periodic function), the polishing part can move along a smooth curved polishing path instead of an oblique polishing path , It is possible to obtain an advantageous effect of minimizing the formation of scratches by the slurry particles on the surface of the substrate 10 during the polishing process. In some cases, the peak of the polishing part may be formed in a smooth curve shape by using an original function or other periodic function.

More specifically, the polishing part includes a roller unit, an abrasive belt moving by the roller unit and polishing the surface of the substrate, and a moving unit for moving the roller unit in the first direction and the second direction.

In one example, the roller unit includes a first roller and a second roller disposed so as to be spaced apart from the first roller, and the abrasive belt rotates along a path determined by the first roller and the second roller. At this time, other guide rollers may be provided between the first roller and the second roller, and the present invention is not limited or limited by the number and arrangement of the guide rollers. In some cases, the abrasive belt may be rotated in an open loop manner in a reel-to-reel take-up manner (a manner in which the abrasive belt is wound on a first reel and then wound in a direction opposite to a second reel) It is also possible to move (or wind) along the movement trajectory of the shape.

Further, the substrate processing apparatus includes a pressing force forming portion that forms a pressing force of the polishing belt against the substrate.

The pressing force generating portion may be formed in various structures capable of forming the pressing force of the polishing belt against the substrate. In one example, the pressing force generating portion may be configured to be pressed in a state of being in contact with the inner surface of the abrasive belt or in a noncontact state.

Preferably, the pressing force forming portion forms a pressing force of the polishing belt against the substrate in a non-contact manner using an electromagnetic force. This is to improve uniformity of the surface of the substrate (polishing uniformity) by keeping the pressing force of the polishing belt against the substrate uniform, and to shorten the response speed required for polishing control of the substrate.

In other words, as a method of controlling the pressing force of the polishing belt against the substrate, there is a method in which the inner surface of the polishing belt is directly pressed with a pressing body, or a fluid (for example, air or water) is sprayed onto the inner surface of the polishing belt.

However, in the method of directly pressing the inner surface of the abrasive belt with the pressing body, abrasion and damage are generated on the inner surface of the abrasive belt as the pressing body directly contacts the inner surface of the abrasive belt. To control the pressing pressure of the pressing body Since the pressing force of the pressing body must be mechanically adjusted, not only the response speed according to the pressing force control is slow, but also it is difficult to finely control the pressing force.

Further, in the method of spraying the fluid on the inner surface of the abrasive belt, as both side edge portions of the abrasive belt are opened to the outside, a part of the fluid ejected from the edge portion of the abrasive belt escapes to the outside from the edge portion of the abrasive belt There is a problem that it is difficult to uniformly maintain the pressing force at the edge portion of the abrasive belt. Further, in the pressurizing method using the fluid, it is difficult to keep the pressing force by the fluid constant due to the pulsating phenomenon of the pump that controls the supply amount of the fluid. In order to control the pressurizing pressure by the fluid, Therefore, there is a problem that the response speed is slow and it is difficult to control the pressing force finely.

Accordingly, the pressing force of the abrasive belt against the substrate is formed by the pressing force forming unit using the electromagnetic force, so that the pressing force can be uniformly maintained not only at the center portion but also at the edge portion of the abrasive belt, It is possible to obtain an advantageous effect of increasing the surface uniformity.

Further, by controlling the pressing force of the abrasive belt by controlling the electromagnetic force, it is possible to obtain a favorable effect of shortening the response speed required for polishing control and enabling fine adjustment.

Specifically, the pressing force generating portion includes a magnetic belt provided on the inner surface of the abrasive belt, and a pressing magnet portion spaced from the inner surface of the abrasive belt and forming a mutual repulsive force with the magnetic belt, The pressing force of the polishing belt against the substrate is formed by the repulsive force.

At this time, the pressing magnet portion is formed of an electromagnet or permanent magnet capable of forming a mutual repulsive force with the magnetic belt.

In addition, the pressing force of the abrasive belt by the repulsive force between the pressing magnet portion and the abrasive belt can be adjusted in various ways. For example, the pressing magnet portion is formed of an electromagnet, and the pressing force of the polishing belt on the substrate can be controlled by controlling the voltage applied to the pressing magnet portion. In another example, the pressing magnet portion is formed of a permanent magnet and is selectively and proximally provided to the magnetic belt, and the distance between the magnetic belt and the pressing magnet portion can be controlled to adjust the pressing force of the polishing belt against the substrate.

Further, the substrate processing apparatus includes a conditioner for modifying the outer surface of the abrasive belt.

Preferably, the conditioner is disposed so as to be spaced apart from the roller unit that forms the movement locus of the abrasive belt. As described above, according to the present invention, the outer surface of the polishing belt is modified in a state where the conditioner is disposed apart from the roller unit, thereby sufficiently securing the modifying area by the conditioner, It is possible to prevent an influence on the roller and to obtain an advantageous effect of improving the polishing quality.

Also provided is a belt support which is arranged to face the conditioner and which supports the inner surface of the abrasive belt. By thus allowing the inner surface of the abrasive belt to be supported by the belt supporting portion, an advantageous effect of preventing sagging of the abrasive belt as the conditioner is pressed on the abrasive belt can be obtained.

Preferably, by supporting the inner surface of the abrasive belt in a noncontact state, advantageously, the advantage of minimizing the polishing efficiency deterioration due to frictional resistance (a factor that hinders the movement (rotation) of the abrasive belt) can be obtained.

In addition, the belt support supports the inner surface of the abrasive belt parallel to the conditioner. In this way, the inner surface of the abrasive belt is supported parallel to the conditioner by the belt supporting portion, whereby an advantageous effect of more effectively ensuring the contact area of the conditioner with the abrasive belt (surface contact) can be obtained.

In one example, the belt support is configured to support the inner surface of the abrasive belt in noncontact manner using an electromagnetic force. More specifically, the inner surface of the abrasive belt is provided with a magnetic belt, and the inner surface of the abrasive belt is supported by the electromagnetic force between the magnetic belt and the belt supporter disposed so as to be spaced from the inner surface of the abrasive belt. At this time, the belt supporting portion is formed of an electromagnet or a permanent magnet capable of forming a mutual repulsive force with the magnetic belt. By forming the magnetic belt with a rubber magnet having flexibility, it is possible to obtain an advantageous effect of ensuring circulating rotation of the magnetic belt without damaging the magnetic belt.

Thus, by supporting the inner surface of the abrasive belt in a noncontact manner by the belt supporting portion using the electromagnetic force, the supporting force can be uniformly maintained not only at the center portion of the inner surface but also at the inner surface portion of the abrasive belt, It is possible to obtain an advantageous effect of increasing the flatness of the abrasive belt.

Further, by controlling the holding force of the polishing belt by controlling the electromagnetic force, it is possible to obtain a favorable effect of shortening the response speed required for the conditioning control and enabling fine adjustment.

In another example, the belt supporting portion may spray the fluid on the inner surface of the abrasive belt and support the inner surface of the abrasive belt by the jetting force by the fluid. At this time, the belt supporting portion can inject at least one of gas and liquid onto the inner surface of the abrasive belt.

For reference, the substrate in the present invention is formed of a rectangular substrate having at least one side longer than 1 m. As an example, a sixth generation glass substrate having a size of 1500 mm * 1850 mm may be used as a substrate to be subjected to the chemical mechanical polishing process.

INDUSTRIAL APPLICABILITY As described above, according to the present invention, an advantageous effect of accurately controlling the polishing thickness of a large area substrate and improving polishing efficiency can be obtained.

In particular, by allowing the polishing part to polish the surface of the substrate while simultaneously performing a first linear movement and a first direction along the first direction with respect to the substrate and a second linear movement along the second direction intersecting the substrate, An advantageous effect of minimizing the occurrence of scratches on the substrate can be obtained.

That is, when the polishing part linearly moves only in the first direction with respect to the substrate, particles of different sizes (10 nm to 60 nm) included in the slurry move linearly in the first direction only between the polishing part and the substrate Therefore, a texture is formed linearly on the surface of the substrate along the movement direction (first direction) of the substrate, and micro-scratches occur if the linear shape is repeatedly formed on the same portion. Particularly, in the method in which the polishing part linearly moves only in the first direction with respect to the substrate, there is a problem that micro-scratches occur frequently because the linearity is likely to be repeatedly formed on the same area on the surface of the substrate. However, by allowing the polishing part to move along the first direction and to reciprocate in the second direction orthogonal to the first direction, the polishing part can have a continuous non-linear shape (e.g., It is possible to remarkably lower the probability that the texture of the slurry particles is repeatedly formed on the same area on the surface of the substrate during the polishing process, ) Is repeatedly formed at the same site, it is possible to obtain an advantageous effect of minimizing the occurrence of micro-scratches.

Further, according to the present invention, by controlling the reciprocating movement of the polishing part along the second direction by a periodic function (sin function or cos function), the polishing part is not moved along a polishing path of a slant shape but along a polishing path of a smooth curved shape It is possible to more effectively prevent the scratches due to the slurry particles from being formed on the surface of the substrate during the polishing process.

Further, according to the present invention, the pressing force of the polishing belt on the substrate can be uniformly maintained, thereby improving the surface uniformity (polishing uniformity) of the substrate and shortening the response speed required for polishing control.

In other words, as a method of controlling the pressing force of the polishing belt against the substrate, there is a method in which the inner surface of the polishing belt is directly pressed with a pressing body, or a fluid (for example, air or water) is sprayed onto the inner surface of the polishing belt. However, in the method of directly pressing the inner surface of the abrasive belt with the pressing body, abrasion and damage are generated on the inner surface of the abrasive belt as the pressing body directly contacts the inner surface of the abrasive belt. To control the pressing pressure of the pressing body Since the pressing force of the pressing body must be mechanically adjusted, not only the response speed according to the pressing force control is slow, but also it is difficult to finely control the pressing force. Further, in the method of spraying the fluid on the inner surface of the abrasive belt, as both side edge portions of the abrasive belt are opened to the outside, a part of the fluid ejected from the edge portion of the abrasive belt escapes to the outside from the edge portion of the abrasive belt There is a problem that it is difficult to uniformly maintain the pressing force at the edge portion of the abrasive belt. Further, in the pressurizing method using the fluid, it is difficult to keep the pressing force by the fluid constant due to the pulsating phenomenon of the pump that controls the supply amount of the fluid. In order to control the pressurizing pressure by the fluid, Therefore, there is a problem that the response speed is slow and it is difficult to control the pressing force finely.

However, according to the present invention, the pressing force of the polishing belt against the substrate is formed in a non-contact manner by the pressing force forming unit using the electromagnetic force, so that the pressing force can be uniformly maintained not only at the center portion but also at the edge portion, Ultimately, an advantageous effect of increasing the surface uniformity of the large-area glass substrate can be obtained.

Further, according to the present invention, by controlling the pressing force of the abrasive belt by controlling the electromagnetic force, it is possible to obtain a favorable effect of shortening the response speed required for polishing control and enabling fine adjustment.

Further, according to the present invention, the surface of the polishing belt is modified in a state in which the conditioner is disposed apart from the roller unit that forms the movement locus of the polishing belt, thereby sufficiently securing the contact area of the conditioner with respect to the polishing belt The conditioner is in surface contact with the outer surface of the abrasive belt so that an advantageous effect of improving the conditioning efficiency can be obtained and the vibration generated while the conditioner is in contact with the abrasive belt can be applied to the abrasive belt It is possible to obtain an advantageous effect of preventing the sheet from being conveyed to the roller unit. As a result, the movement locus of the abrasive belt can be uniformly maintained without irregular flow, and an advantageous effect of improving the polishing quality of the substrate can be obtained.

In addition, according to the present invention, the outer surface of the abrasive belt is supported by the belt supporting portion, whereby advantageous effects of preventing sagging of the abrasive belt due to pressing of the conditioner on the abrasive belt can be obtained. Particularly, according to the present invention, by supporting the outer surface of the abrasive belt in a noncontact manner by means of a belt supporting portion using an electromagnetic force, it is possible to maintain a uniform supporting force not only at the center portion of the inner surface but also at the inner surface portion of the abrasive belt, It is possible to obtain an advantageous effect of increasing the flatness of the polishing belt in which conditioning is ultimately performed.

Further, according to the present invention, the outer surface of the abrasive belt is supported by the belt supporting part using the electromagnetic force in a noncontact manner, thereby obtaining a favorable effect of shortening the response speed required for the conditioning control and enabling fine adjustment .

Further, according to the present invention, it is possible to obtain an advantageous effect of improving the conditioning efficiency of the polishing belt and shortening the time required for conditioning.

1 is a view showing a configuration of a substrate processing apparatus according to the present invention,
FIG. 2 is a perspective view for explaining the polishing part of FIG. 1,
Fig. 3 is a sectional view for explaining the polishing part of Fig. 1,
Fig. 4 is a plan view for explaining the polishing part of Fig. 1,
FIG. 5 is a plan view for explaining a movement form of the polishing part of FIG. 1,
Fig. 6 is a view showing a movement path of the polishing part of Fig. 1,
Fig. 7 is a view showing a modified example of the movement path of the polishing part of Fig. 1,
FIGS. 8 and 9 are views for explaining a pressing force forming process by the pressing force forming unit and the pressing force forming unit, respectively, according to the present invention,
10 is a view for explaining a modified example of the pressing force forming unit, which is a substrate processing apparatus according to the present invention,
11 and 12 are diagrams for explaining a conditioner and a belt supporting unit,
13 is a view for explaining a modified example of the belt supporting portion of Fig.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments. For reference, the same numbers in this description refer to substantially the same elements and can be described with reference to the contents described in the other drawings under these rules, and the contents which are judged to be obvious to the person skilled in the art or repeated can be omitted.

1 is a perspective view for explaining a polishing part of FIG. 1, FIG. 3 is a sectional view for explaining a polishing part of FIG. 1, and FIG. 4 Is a plan view for explaining the polishing part of Fig. Fig. 5 is a plan view for explaining a movement form of the polishing part of Fig. 1, Fig. 6 is a view showing a movement path of the polishing part of Fig. 1, and Fig. 7 is a view showing a modification of the movement path of the polishing part of Fig. Fig.

1 to 7, a substrate processing apparatus 1 according to the present invention includes a stage 20 on which a substrate 10 is placed, a first linear movement And a polishing part 100 for polishing the surface of the substrate while performing a second linear movement along a second direction 100b intersecting the first direction 100a.

A mechanical polishing process or a chemical mechanical polishing (CMP) process for the substrate 10 is performed by the polishing part 100 and is performed while the polishing part 100 is in contact with the surface of the substrate 10 At least one of the substrates 10 is supplied with a slurry for chemical polishing.

For reference, the substrate 10 of the present invention is formed of a rectangular substrate 10 having at least one side longer than 1 m. As an example, a sixth generation glass substrate 10 having a size of 1500 mm * 1850 mm is used as the substrate 10 to be processed, on which the chemical mechanical polishing process is performed. In some cases, the 7th generation and the 8th generation glass substrates may be used as the substrates to be processed.

The substrate 10 is mounted on the upper surface of the stage 20. The stage 20 may be provided with suction means, releasing restricting member, or the like in order to prevent the substrate 10 from being separated. The present invention is not limited or limited by the structure and the kind of the stage 20.

The polishing part 100 performs a first linear movement along the first direction 100a and a second linear movement along the second direction 100b intersecting the first direction 100a with respect to the substrate, As shown in FIG.

For reference, the polishing part 100 polishes the surface of the substrate is defined as polishing the surface of the substrate in a state where the polishing part 100 is in contact with (e.g., in rotation contact with) the substrate.

The first direction 100a and the second direction 100b in which the polishing part 100 moves can be variously changed according to required conditions and design specifications. In one example, the first direction 100a is defined along the longitudinal direction of the substrate, and the second direction 100b is defined along the direction crossing the first direction 100a. Preferably, the second direction 100b is defined to intersect perpendicularly to the first direction 100a. More preferably, the polishing part 100 continuously reciprocates along the second direction 100b while moving along the first direction 100a relative to the substrate, thereby polishing the surface of the substrate.

By thus allowing the polishing part 100 to continuously reciprocate along the second direction 100b while polishing along the first direction 100a to polish the surface of the substrate, The substrate can be polished while moving along a continuous curved path (101 in Fig. 5) with respect to the substrate 10, so that an advantageous effect of minimizing the occurrence of scratches on the substrate 10 during the polishing process can be obtained.

That is, when the polishing part 100 moves linearly only in the first direction 100a with respect to the substrate, particles of different sizes (10 nm to 60 nm) included in the slurry between the polishing part 100 and the substrate A texture is formed on the surface of the substrate along the moving direction of the substrate (the first direction), and if such a linear array is repeatedly formed on the same portion, There is a problem in that it occurs. Particularly, in the method in which the polishing part linearly moves only in the first direction with respect to the substrate, there is a problem that micro-scratches occur frequently because the linearity is likely to be repeatedly formed on the same area on the surface of the substrate. However, according to the present invention, by moving the polishing part 100 along the first direction 100a and reciprocating in the second direction 100b orthogonal to the first direction 100a, It is possible to polish the substrate while the polishing part 100 moves along the path 101 of a continuous non-linear shape (e.g., a curved shape) with respect to the substrate, It is possible to remarkably reduce the probability that the texture due to the particles are repeatedly formed at the same site and to minimize the occurrence of micro-scratches due to repeated formation of the texture at the same site, Can be obtained.

The polishing part 100 preferably polishes the substrate while moving along a path satisfying a function that the peak 101a at the point of change of the polishing part 100 along the second direction 100b is a curved line, do. Here, the peak 101a at the direction changing point of the polishing part 100 refers to a curve in which the direction of the polishing part 100 along the second direction 100b is changed in FIGS. 5 to 7 101a are defined by curves.

For example, referring to FIG. 6, the reciprocating motion of the polishing part 100 along the second direction 100b polishes the substrate while moving along a path satisfying the following equation (1).

[Equation 1]

Where y is the position value (coordinate value), a is the amplitude, b is the period, x is the time, and c is the offset value.

7, the reciprocating movement of the polishing part 100 along the second direction 100b polishes the substrate while moving along a path satisfying the following equation (2).

&Quot; (2) "

Where y is the position value (coordinate value), a is the amplitude, b is the period, x is the time, and c is the offset value.

As described above, by controlling the reciprocating movement of the polishing part 100 along the second direction 100b with a periodic function (sin function or cos function), the polishing part 100 is not an oblique polishing path but a smooth curve Shaped surface, it is possible to obtain an advantageous effect of minimizing the formation of scratches by the slurry particles on the surface of the substrate 10 during the polishing process. In some cases, the peak of the polishing part may be formed in a smooth curve shape by using an original function or other periodic function.

More specifically, the polishing part 100 includes a roller unit 110, an abrasive belt 120 which is moved by the roller unit 110 and polishes the surface of the substrate, a roller unit 110, And a mobile unit 130 for moving the mobile unit 100a in the second direction 100b.

The roller unit 110 is provided to form a circulation locus of the abrasive belt 120. More specifically, the roller unit 110 includes a first roller 112 and a second roller 114 disposed horizontally spaced from the first roller 112, and the first roller 112 and the second roller 114 The roller 114 is configured to rotate by a normal drive motor (a single motor or a plurality of motors).

In some cases, other guide rollers may be provided between the first roller and the second roller, and the present invention is not limited or limited by the number and arrangement of guide rollers. In addition, the guide roller may include at least one of a driving roller and an idle roller. For example, the roller unit may include a first roller and a second roller disposed adjacent to the substrate, a second roller disposed on the upper side of the first roller and the second roller and having a circulation path of the abrasive belt together with the first roller and the second roller The first roller, the second roller, the first guide roller, and the second guide roller may cooperatively form a substantially rectangular (trapezoidal) abrasive belt 120 ) Circulation path.

The abrasive belt 120 is circularly rotated in an infinite loop manner by the first roller 112 and the second roller 114 and is provided to linearly polish the surface of the substrate 10. [

In one example, the abrasive belt 120 may have a length along the axial direction (the direction of rotation axis of the roller) to a length corresponding to the width of the substrate 10 (width along the axial direction of the abrasive belt). In some cases, the axial length of the abrasive belt may be formed to be larger or smaller than the width of the substrate.

More specifically, the circulating rotating abrasive belt 120 has an upper polishing surface and a lower polishing surface, and the substrate 10 is polished by an upper polishing surface or a lower polishing surface.

The abrasive belt 120 is formed of a material suitable for mechanical polishing of the substrate 10. For example, the abrasive belt 120 may be formed of a material such as polyurethane, polyurea, polyester, polyether, epoxy, polyamide, polycarbonate, polyethylene, polypropylene, fluoropolymer, vinyl polymer, acrylic and methacrylic polymer, The material and properties of the abrasive belt 120 may be formed using various copolymers of silicone, latex, nitrile rubber, isoprene rubber, butadiene rubber, and styrene, butadiene and acrylonitrile, And can be variously changed.

For reference, in the embodiment of the present invention, a single abrasive belt 120 is used. However, in some cases, it is possible to polish a substrate simultaneously or sequentially using a plurality of abrasive belts.

Also, at least one of the first roller 112 and the second roller 114 may be configured to be movable (e.g., the second roller may be spaced apart from the first roller) so as to adjust the tension of the abrasive belt 120 Or a separate tension adjusting device for adjusting the tension of the abrasive belt 120 may be provided.

A cleaning unit for cleaning the surface of the polishing belt 120 may be provided around the polishing belt 120. The cleaning unit can clean the surface of the polishing belt 120 by a contact method or a non-contact method, and the present invention is not limited or limited by the kind of the cleaning unit.

On the other hand, in the above-described embodiment of the present invention, the abrasive belt is circulatingly rotated along a path defined by a plurality of rollers. However, in some cases, the abrasive belt may not be circulatingly rotated, It is also possible to construct (rewind) the cassette tape along a movement trajectory in the form of an open loop in a reel-to-reel take-up manner (a manner in which the reel is wound on the first reel and then wound in the opposite direction to the second reel) It is possible.

The moving unit 130 may have various structures that can move the roller unit 110 in the first direction 100a and the second direction 100b. 4, the mobile unit 130 includes a first guide rail 132 disposed along the first direction 100a and a second guide rail 132 extending along the first guide rail 132, And a second guide rail 134 disposed along the second guide rail 100b.

The first guide rail 132 and the second guide rail 134 are spaced apart from each other by a predetermined distance. The roller unit 110 can be movably mounted along the second guide rail 134 and can move along the second guide rail 134 in the second direction 100b and the second guide rail 134 can move along the second guide rail 134 along the first As the roller unit 110 moves along the guide rail 132, the roller unit 110 can move in the first direction 100a.

For reference, in the embodiment of the present invention, the second guide rail 134 is moved along the first guide rail 132. However, in some cases, the roller unit may be mounted on the first guide rail, It is also possible to configure the first guide rail to move along the second guide rail.

8 and 9 are views for explaining a pressing force forming process by the pressing force forming unit and the pressing force forming unit according to the present invention. FIG. 10 is a view for explaining a substrate processing apparatus according to the present invention, Fig. In addition, the same or equivalent portions as those in the above-described configuration are denoted by the same or equivalent reference numerals, and a detailed description thereof will be omitted.

8 to 10, the substrate processing apparatus 1 includes a pressing force forming unit 140 that forms a pressing force of the abrasive belt 120 with respect to the substrate 10.

The pressing force forming unit 140 may be formed in various structures capable of forming the pressing force of the polishing belt 120 with respect to the substrate 10. For example, the pressing force generating portion may be configured to press in a state of being in contact with the inner surface of the abrasive belt 120 or to press it in a noncontact state.

Hereinafter, an example in which the pressing force forming portion 140 is disposed inside the polishing belt 120 and the inner surface of the polishing belt 120 is pressed in a non-contact state will be described. As described above, by pressing the inner surface of the abrasive belt 120 in a noncontact state, the pressing force forming portion 140 minimizes the deterioration of the polishing efficiency due to frictional resistance (a factor that hinders the movement (rotation) of the abrasive belt) An advantageous effect can be obtained.

8 to 10, the pressing force forming portion 140 is provided to form a pressing force of the abrasive belt 120 with respect to the substrate 10 using an electromagnetic force.

This improves the surface uniformity (polishing uniformity) of the substrate 10 by keeping the pressing force of the polishing belt 120 on the substrate 10 uniform and shortens the response speed required for the polishing control of the substrate 10 It is for this reason.

That is, a method of controlling the pressing force of the polishing belt 120 with respect to the substrate 10 includes a method in which the inner surface of the polishing belt 120 is directly pressed with a pressing body, , Air or water).

However, in the method of directly pressing the inner surface of the abrasive belt with the pressing body, abrasion and damage occur on the inner surface of the abrasive belt as the pressing body directly contacts the inner surface of the abrasive belt. The pressing force of the pressing body must be mechanically adjusted in order to adjust the pressing force. Therefore, not only is the response speed slowed down by the pressing force control, but also it is difficult to finely control the pressing force.

In addition, in the method of spraying the fluid on the inner surface of the abrasive belt, as both side edge portions of the abrasive belt are opened to the outside, a part of the fluid ejected from the edge portion of the abrasive belt exits from the edge portion of the abrasive belt There is a problem that it is difficult to uniformly maintain the pressing force at the edge of the abrasive belt. Further, in the pressurizing method using the fluid, it is difficult to keep the pressing force by the fluid constant due to the pulsating phenomenon of the pump that controls the supply amount of the fluid. In order to control the pressurizing pressure by the fluid, Therefore, there is a problem that the response speed is slow and it is difficult to control the pressing force finely.

Accordingly, the present invention can prevent the abrasive belt 120 from being pressed against the substrate 10 in a non-contact manner by the pressing force forming unit 140 using an electromagnetic force, The pressing force can be uniformly maintained and ultimately an advantageous effect of increasing the surface uniformity of the large-area glass substrate 10 can be obtained.

Further, by controlling the pressing force of the polishing belt 120 by controlling the electromagnetic force, it is possible to obtain a favorable effect of shortening the response speed required for polishing control and enabling fine adjustment.

The pressing force forming unit 140 includes a magnetic belt 116 provided on the inner surface of the abrasive belt 120 and a pressing force generating unit 140 disposed inside the abrasive belt 120 and having a mutual repulsive force RF1, And the urging force of the abrasive belt 120 against the substrate 10 is formed by the repulsive force between the magnetic belt 116 and the pressing magnet portion 142. [

The advantageous effect of ensuring circulating rotation of the magnetic belt 116 without damaging the magnetic belt 116 can be obtained by preferably forming the magnetic belt 116 with a rubber magnet having flexibility.

In addition, the magnetic belt 116 is attached to the inner surface of the abrasive belt 120 via the adhesive layer 116a, and is modularized integrally with the abrasive belt 120. The magnetic belt 116 and the abrasive belt 120 are integrally modularized in that the magnetic belt 116 and the abrasive belt 120 are integrally connected to each other through the adhesive layer 116a to form a single component abrasive belt 120 < / RTI > assembly.

The pressing magnet portion 142 is disposed on the abrasive belt 120 so as to face the inner surface of the magnetic belt 116 and forms a repulsive force RF1 with the magnetic belt 116, (10). For example, the pressing magnet portion 142 may be formed of an electromagnet or permanent magnet capable of forming a mutual repulsive force with the magnetic belt 116.

At this time, the pressing force by the repulsive force RF1 between the pressing magnet portion 142 and the abrasive belt 120 can be adjusted in various ways.

For example, the pressing magnet portion 142 is formed of an electromagnet and can control the pressing force of the polishing belt 120 with respect to the substrate 10 by controlling the voltage applied to the pressing magnet portion 142. 8 and 9, the repulsive force between the pressing magnet portion 142 and the abrasive belt 120 (RF1) between the pressing magnet portion 142 and the abrasive belt 120 is controlled by controlling the voltages V1 and V2 applied to the pressing magnet portion 142, , RF2) of the abrasive belt 120 to adjust the pressing force of the abrasive belt 120 with respect to the substrate 10. More specifically, the repulsive forces RF1 and RF2 between the pressing magnet portion 142 and the abrasive belt 120 can be adjusted in proportion to the voltage applied to the pressing magnet portion 142, The repulsive force RF2 between the pressing magnet portion 142 and the abrasive belt 120 can be increased when the applied voltage V2 is increased.

In another example, the pressing magnet portion 142 is formed of a permanent magnet and is selectively and proximately provided to the magnetic belt 116 and controls the distance between the magnetic belt 116 and the pressing magnet portion 142 The pressing force of the polishing belt 120 with respect to the substrate 10 can be adjusted. 10, the repulsive forces RF1 and RF2 between the pressing magnet portion 142 and the abrasive belt 120 are adjusted by differently adjusting the distances H1 and H2 between the magnetic belt 116 and the pressing magnet portion 142, The pressing force of the abrasive belt 120 with respect to the substrate 10 can be adjusted. More specifically, the repulsive forces RF1 and RF2 between the pressing magnet portion 142 and the abrasive belt 120 can be adjusted in proportion to the distances H1 and H2 between the magnetic belt 116 and the pressing magnet portion 142 The repulsive force RF2 between the pressing magnet portion 142 and the abrasive belt 120 can be increased if the distance H2 between the magnetic belt 116 and the pressing magnet portion 142 is small.

11 and 12 are views for explaining a conditioner and a belt supporting unit according to the present invention, and Fig. 13 is a view for explaining a modification of the belt supporting unit in Fig.

Referring to Figs. 11 and 12, the substrate processing apparatus includes a conditioner 200 for modifying the outer surface of the abrasive belt 120 (the surface contacting the substrate).

The conditioner 200 presses the surface of the abrasive belt 120 with a predetermined pressing force and finely cuts the surface of the abrasive belt 120 so that the air formed on the surface of the abrasive belt 120 comes out of the surface. In other words, the conditioner 200 finely cuts the outer surface of the abrasive belt 120 so that a large number of foam micropores serving as a slurry in which an abrasive and a chemical are mixed are not clogged on the outer surface of the abrasive belt 120 , So that the slurry filled in the foam pores of the abrasive belt 120 is smoothly supplied to the substrate.

Preferably, the conditioner 200 is spaced apart from the roller unit 110 and is in rotational contact with the outer surface of the abrasive belt 120.

The conditioner 200 is disposed so as to be spaced apart from the roller unit 110 because the conditioner 200 is rotated by the roller (the first roller 112 or the second roller 114) constituting the roller unit 110, And the roller unit 110 is in contact with the inner surface area of the abrasive belt 120 corresponding to the outer surface area of the abrasive belt 120 to which the conditioner 200 is contacted, I never do that. In one example, the conditioner 200 is disposed between the first roller 112 and the second roller 114 and configured to contact the upper polishing surface. In some cases, it is also possible that the conditioner is brought into contact with the lower polishing surface between the first roller and the second roller.

As described above, according to the present invention, the outer surface of the polishing belt 120 is modified in a state where the conditioner 200 is spaced apart from the roller unit 110, thereby sufficiently securing the modifying area by the conditioner 200 It is possible to prevent the vibration generated during the reforming process by the conditioner 200 from affecting the roller unit 110 and to obtain an advantageous effect of improving the polishing quality.

That is, it is also possible to configure the conditioner 200 to modify the outer surface portion of the abrasive belt 120 supported by the roller unit 110 on the outer side of the roller unit 110. In other words, when the contact area (the abrasive belt 120 is brought into contact with the first roller 112) with the inner surface of the abrasive belt 120 being in contact (supported) with the first roller 112 (or the second roller) The outer surface of the conditioner 200 may be modified.

However, the conditioning disk of the conditioner 200, in which the polishing belt 120 supported on the surface of the first roller 112 is curved along the curved surface of the first roller 112 and in which a substantially conditioning process is performed, The conditioner 200 is brought into line contact with the outer surface of the abrasive belt 120 so that the contact surface of the conditioner 200 with respect to the abrasive belt 120 The abrasion resistance of the abrasive belt 120 may be deteriorated. Since the first roller 112 directly contacts the inner surface of the abrasive belt 120 on which the conditioner 200 is pressed, the vibration generated during the contact of the conditioner 200 with the abrasive belt 120 is transmitted to the abrasive belt 120, The movement path of the abrasive belt 120 (movement trajectory) is hard to be kept constant while the rotation of the first roller 112 is caused to oscillate due to the rotation displacement of the first roller 112, There is a problem that the polishing quality by the polishing belt 120 is lowered.

However, in the present invention, the conditioner 200 is disposed so as to be spaced apart from the roller unit 110, and the conditioning process is performed at a flat portion (for example, an upper polishing surface) of the polishing belt 120 spaced apart from the roller unit 110 The conditioner 200 is provided on the outer surface of the abrasive belt 120 so that the contact surface of the conditioner 200 with respect to the abrasive belt 120 can be sufficiently secured (surface contact) The vibration generated during the contact of the conditioner 200 with the abrasive belt 120 is transmitted to the first roller 112 via the abrasive belt 120. In this case, It is possible to obtain an advantageous effect of preventing the occurrence of the problem. As a result, the movement locus of the abrasive belt 120 can be uniformly maintained without irregular flow, and an advantageous effect of improving the polishing quality of the substrate can be obtained.

Preferably, there is provided a belt support 300 that is disposed to face the conditioner 200 and supports the inner surface of the abrasive belt 120. By providing the belt supporting portion 300 in this way, an advantageous effect of preventing sagging of the polishing belt 120 due to the pressing of the conditioner 200 on the polishing belt 120 can be obtained.

The belt supporting part 300 may be formed in a variety of structures spaced apart from the roller unit 110 and arranged to face the conditioner 200 to support the inner surface of the polishing belt 120. In one example, the belt support 300 may be configured to support the inner surface of the abrasive belt 120 in a contact state or in a noncontact state.

Hereinafter, an example in which the belt supporting part 300 is disposed on the inner surface of the polishing belt 120 so as to be spaced apart and supports the inner surface of the polishing belt 120 in a noncontact state will be described. As described above, by supporting the inner surface of the abrasive belt 120 in a non-contact state, the belt supporting portion 300 is advantageous in minimizing degradation of polishing efficiency due to frictional resistance (a factor that hinders the movement (rotation) of the abrasive belt) Effect can be obtained.

Preferably, the belt support 300 supports the inner surface of the abrasive belt 120 parallel to the conditioner 200. By thus supporting the inner surface of the polishing belt 120 in parallel with the conditioner 200 by the belt supporting portion 300, the contact area of the conditioner 200 with respect to the polishing belt 120 can be more effectively ensured (Surface contact) can be obtained.

The belt support 300 may be configured to support the inner surface of the abrasive belt 120 in various manners depending on the required conditions and design specifications. In one example, the belt support 300 may be configured to support the inner surface of the abrasive belt 120 in an uncontacted manner using an electromagnetic force.

12, a magnetic belt 116 is provided on the inner surface of the abrasive belt 120 and a gap between the belt supporting portion 300 disposed inside the abrasive belt 120 and the magnetic belt 116 The inner surface of the abrasive belt 120 is supported by an electromagnetic force.

The advantageous effect of ensuring circulating rotation of the magnetic belt 116 without damaging the magnetic belt 116 can be obtained by preferably forming the magnetic belt 116 with a rubber magnet having flexibility.

In addition, the magnetic belt 116 is attached to the inner surface of the abrasive belt 120 via the adhesive layer 116a and is modularized integrally with the abrasive belt 120. The magnetic belt 116 and the abrasive belt 120 are integrally modularized in that the magnetic belt 116 and the abrasive belt 120 are integrally connected to each other through the adhesive layer 116a to form a single component abrasive belt 120 < / RTI > assembly.

The belt support 300 is disposed inside the abrasive belt 120 so as to face the inner surface of the magnetic belt 116 and forms a repulsive force RF1 with the magnetic belt 116, As shown in Fig. In one example, the belt support 300 may be formed of an electromagnet or a permanent magnet capable of forming a mutual repulsive force with the magnetic belt 116.

At this time, the supporting force by the repulsive force RF1 between the belt supporting portion 300 and the magnetic belt 116 can be adjusted in various ways.

For example, the belt supporter 300 may be formed of an electromagnet, and may control a supporting force of the abrasive belt 120 by controlling a voltage applied to the belt supporter 300. By adjusting the repulsive force RF1 between the belt supporter 300 and the magnetic belt 116 by controlling the voltage applied to the belt supporter 300 with the electromagnet formed thereon, Can be adjusted. More specifically, the repulsive force between the belt supporter 300 and the magnetic belt 116 can be adjusted in proportion to the voltage applied to the belt supporter 300. When the voltage applied to the belt supporter 300 increases, The repulsive force RF2 between the magnet 300 and the magnetic belt 116 can be increased.

In another example, the belt support 300 is formed of a permanent magnet and is selectively and proximally provided to the magnetic belt 116 to control the distance between the magnetic belt 116 and the belt support 300, (Repulsive force) of the support member 120 can be adjusted. The holding force of the abrasive belt 120 can be adjusted by adjusting the repulsive force between the belt supporting portion 300 and the magnetic belt 116 by adjusting the distance between the magnetic belt 116 and the belt supporting portion 300 differently have. More specifically, the repulsive force between the belt supporter 300 and the magnetic belt 116 can be adjusted in proportion to the distance between the magnetic belt 116 and the belt supporter 300, and the magnetic belt 116 and the belt supporter 300, the repulsive force between the belt supporting portion 300 and the magnetic belt 116 can be increased.

13, the belt supporting portion 300 'ejects fluid onto the inner surface of the abrasive belt 120, and supports the inner surface of the abrasive belt 120 by the jetting force JF1 by the fluid .

At this time, the belt supporting portion 300 'may inject at least one of a gas (for example, air) and a liquid (for example, pure water) onto the inner surface of the abrasive belt 120.

However, in the method of spraying the fluid on the inner surface of the abrasive belt 120, as both side edge portions of the abrasive belt 120 are opened to the outside, a part of the fluid ejected from the edge portion of the abrasive belt 120, A phenomenon that the edge of the abrasive belt 120 escapes to the outside is generated, and it is therefore difficult to uniformly maintain the lifting force (supporting force) at the edge of the abrasive belt 120. Further, in the case of the fluid-based support system, it is difficult to maintain the fluid-based support force constant due to the pulsating phenomenon of the pump that controls the fluid supply amount, and in order to regulate the support pressure by the fluid, The response speed is slow, and it is difficult to control the pressing force finely.

In contrast, by supporting the inner surface of the polishing belt 120 in a non-contact manner by the belt supporting unit 300 using the electromagnetic force, the supporting force is uniformly distributed not only at the center portion of the inner surface but also at the inner surface portion of the polishing belt 120 And it is possible to obtain an advantageous effect of increasing the flatness of the polishing belt 120 which is ultimately subjected to conditioning.

Further, by controlling the electromagnetic force to adjust the supporting force of the abrasive belt 120, it is possible to obtain a favorable effect of shortening the response speed required for the polishing control and enabling fine adjustment.

Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. It will be understood that the present invention can be changed.

10: substrate
20: stage
100: abrasive part
110: Roller unit
112: first roller
114: second roller
116: magnetic belt
116a:
120: abrasive belt
130: mobile unit
132: first guide rail
134: second guide rail
140: pressing force forming portion
142:
200: Conditioner
300: Belt support

Claims (15)

A substrate processing apparatus for polishing a substrate, comprising:
A stage on which the substrate is mounted;
A polishing part for polishing the surface of the substrate while performing a first linear movement along the first direction with respect to the substrate and a second linear movement along the second direction intersecting with the first direction;
The substrate processing apparatus comprising:
The method according to claim 1,
And the second direction intersects perpendicularly to the first direction.
The method according to claim 1,
The polishing part continuously reciprocating along the second direction while moving along the first direction,
Wherein the polishing part polishes the substrate while moving along a continuous curved path with respect to the substrate.
The method of claim 3,
Wherein the polishing part moves along a path satisfying a function that a peak at a turning point of the polishing part along the second direction is a curved line.
5. The method of claim 4,
Wherein the polishing part polishes the substrate while moving along a path satisfying the following equation [1].
[Equation 1]

(Where y is the position value, a is the amplitude, b is the period, x is the time, and c is the offset value).
5. The method of claim 4,
Wherein the polishing part polishes the substrate while moving along a path satisfying the following expression [2].
&Quot; (2) "

(Where y is the position value, a is the amplitude, b is the period, x is the time, and c is the offset value).
The method according to claim 1,
The polishing part may comprise:
A roller unit;
An abrasive belt moving by the roller unit and polishing the surface of the substrate;
A moving unit for moving the roller unit in the first direction and the second direction;
The substrate processing apparatus comprising:
8. The method of claim 7,
Wherein the abrasive belt rotates in a circulating manner along a path determined by the roller unit.
The method of claim 8,
The roller unit includes:
A first roller;
A second roller spaced apart from the first roller; Including,
Wherein the abrasive belt is circularly rotated along the path defined by the first roller and the second roller.
10. The method of claim 9,
Further comprising a guide roller disposed between the first roller and the second roller for guiding movement of the abrasive belt.
8. The method of claim 7,
The mobile unit includes:
A first guide rail disposed along the first direction;
A second guide rail moving along the first guide rail and disposed along the second direction; Including,
Wherein the roller unit linearly moves in the first direction along the first guide rail and linearly moves in the second direction along the second guide rail.
8. The method of claim 7,
Wherein the polishing belt is formed to have a width covering the entire surface of the substrate.
8. The method of claim 7,
Wherein the polishing belt is formed to have a width that partially covers the substrate.
14. The method according to any one of claims 1 to 13,
Wherein the substrate is a rectangular substrate having at least one side longer than 1 m.
14. The method according to any one of claims 1 to 13,
Wherein a slurry for chemical polishing is supplied together with a chemical mechanical polishing (CMP) process while mechanical polishing is performed on the substrate by the polishing part.

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