KR20180070468A - Chip component carrying device - Google Patents

Abstract

An objective of the present invention is to prevent chip components from being mixed between different lots. A chip component transport device comprises: a transport rotor (13); an inspection unit to inspect whether a chip component (100) transported by the transport rotor (13) is a good product or a defective product; a discharge device to discharge a good chip component (100) from the transport rotor; a good product collection box (41A) to collect the good chip component discharged by the discharge device; and a box retaining body (70) to detachably retain the good product collection box (41A). The transport rotor (13) has a plurality of retaining units (15) installed in a transport direction of the chip component (100) to retain the chip component (100). The plurality of retaining units (15) have a plurality of accommodation holes (15a) installed in parallel in a direction crossing the transport direction to accommodate the chip component (100). The good product collection box (41A) has a collection port (65) facing the accommodation holes (15a) of the retaining units (15), and directly collecting the good chip component (100) discharged from the accommodation holes (15a).

Description

{CHIP COMPONENT CARRYING DEVICE}

The present invention relates to a chip component carrying apparatus.

A chip component transfer device for rotating a conveying rotor holding a chip component in a cavity formed in a plurality of concentric circles in a concentric shape and inspecting the electrical characteristics and the like of the chip components and sorting and classifying the chip components after inspection into good and defective components (See, for example, Patent Document 1). The collection box for collecting a plurality of kinds of chip parts such as good and defective parts is set to a size large enough to accommodate a plurality of chip parts. Therefore, the recovery box is connected to the conveying rotor by a hose. The chip component conveying device recovers the chip components after inspection from the conveying rotor to the recovery box through a hose.

Japanese Patent Application Laid-Open No. 2014-152021

However, there is a risk that the chip component is left in the hose in the chip component transferring device for transferring the minute chip component. Such a residue of the chip component may cause incorporation of the chip component between the other lots. Measures for cleaning the hoses between the lots are dealt with in order to prevent mixing of the chip parts between these other lots. However, in order to check the presence or absence of the chip component in the hose by the operator's eyes, it is difficult to confirm whether or not the chip component is present in the hose when the chip component is small enough to be visibly difficult to see. Furthermore, in the cleaning operation of the hose, it takes time to clean the hose because it is cleaned while confirming the presence of the chip parts in the hose.

It is an object of the present invention to provide a chip component transport apparatus which makes it possible to easily suppress the incorporation of chip components between different lots.

The chip component transporting apparatus for solving the problems described above is characterized by comprising: a transporting body for transporting chip components; an inspection section for inspecting whether the chip component transported by the transporting body is a good product or a defective product; A good product collecting box for collecting chip components of the good product discharged from the carrier by the discharging device on the basis of the inspection result of the inspection unit; Wherein the carrying body has a plurality of holding portions provided along the carrying direction of the chip parts and capable of holding the chip parts, wherein each of the plurality of holding portions intersects the carrying direction And a plurality of receiving holes which are juxtaposed along the direction in which the chip parts are received and accommodate the chip components, Number holding unit holding at least one face the plurality of reception hole portions of a sphere and has a number of direct retrieval of the chip component of the non-defective product discharged from the containing hole by the discharging device.

According to this configuration, the chip parts of the good product discharged from the receiving hole are directly recovered in the good product collecting box. This eliminates the need for a hose that is connected to the good product collecting box and constitutes the discharge path of the good product collecting box and the receiving hole. Therefore, there is no stagnation of the chip component and the mixing of the chip component between the other lots is easily suppressed can do.

In the chip component transportation device, when viewed from the carrying direction, the size of the collection port is larger than the size of the line segment extending from the edge of the receiving hole at an inclination angle of 45 degrees or more and less than 90 degrees .

According to this configuration, the chip parts of the good product discharged from the holding portion are easily discharged into the recovery port of the good product recovery box. Therefore, it is possible to prevent the chip parts of the good products discharged from the holding portion from being discharged to the outside of the good product return box.

In the above-mentioned chip component transportation device, it is preferable that the collection port is formed to extend over the plurality of receiving holes.

According to this configuration, the chip parts of the good product discharged from the receiving hole can be easily discharged into the recovery port of the good product recovery box. Therefore, it is possible to suppress the discharge of the chip parts of the good product discharged from the receiving hole to the outside of the good product return box.

In the above-mentioned chip component transfer apparatus, the discharging device discharges the chip component from the receiving hole by jetting compressed air toward each of the plurality of receiving holes, and the good product collecting box does not discharge the chip component And an exhaust port for exhausting the air in the good product recovery box.

When discharging the chip parts of the good product to the good product recovery box by the discharge device, the compressed air flows together with the chip component of the good product in the good product recovery box, so that the pressure in the good product recovery box tends to be high. If the pressure in the good product recovery box becomes excessively high, there is a fear that the chip components of good products are difficult to get into the good product recovery box by the pressure.

In this respect, in the present chip component conveying apparatus, since the good product recovery box has an exhaust port, air in the good product recovery box flows out to the outside through the exhaust port, so that the pressure in the good product recovery box can be prevented from becoming excessively high. Therefore, it becomes easy for the chip parts of good products to enter the good product collecting box.

In the above-mentioned chip component conveying device, it is preferable that the exhaust port is formed at a position not opposed to the recovery port in the good product recovery box.

According to this configuration, since the chip components are prevented from collecting in the exhaust port, the chip components gathered in the exhaust port are prevented from obstructing the flow of air between the exhaust port and the outside of the good product recovery box. Therefore, it becomes easy to suppress the excessive increase in the pressure of the good product recovery box.

In the above-mentioned chip component conveying device, it is preferable that the exhaust port is provided at the upper end in the vertical direction in the good product collecting box.

According to this configuration, since the exhaust port is formed at a position where the chip parts are difficult to collect in the good product collecting box, it is easy to suppress disturbance of the airflow between the exhaust port and the outside of the good product collecting box by the chip component.

And a defective product collection box provided in correspondence with one of the holding parts and collecting the chip component of the defective product discharged from the receiving hole by the discharge device on the basis of the inspection result of the inspection part Wherein said defective product recovery box has a recovery port for directly recovering said defective product chip component discharged from said receiving hole by said discharge device so as to face said receiving hole, and said good product recovery box and said defective product recovery box And extend in the transport direction.

According to this configuration, it is possible to dispose the good product recovery box and the defective product recovery box so that the chip parts can be recovered without making the size of the good product recovery box and the defective product recovery box excessively small. Therefore, the number of chip parts that can be accommodated in the good product recovery box and the defective product recovery box can be increased, so that the number of chip components in the lot can be increased.

In the above-mentioned chip component conveying device, it is preferable that the good product recovery box is located on the downstream side of the defective product recovery box in the conveying direction.

According to this configuration, since the chip component of the defective product is discharged from the holding portion until the holding portion is transported to the position corresponding to the good product collecting box, it is possible to reduce the possibility that the defective chip component is collected in the good product collecting box.

In the above-mentioned chip component conveying device, it is preferable that the good product collecting box and the box holding member are provided with attachment regulating portions capable of attaching only the predetermined number of the good product collecting boxes to the box holding member.

If the good product recovery box can be used as a recovery box for recovering chip components of defective products in another lot, if the defective component chip components remain in the good product recovery box in the lot, Chip parts of good products and chip parts of defective products are mixed in the good product recovery box when used for recovery.

In this regard, according to the present chip component transporting apparatus, the good product returning box can be a dedicated chip component returning box of good products. Therefore, there is no case where the good product recovery box is disposed at a position where the chip component of the defective product is retrieved. Therefore, mixing of good products and defective product chip components can be suppressed in the good product recovery box.

The chip part carrying device may further comprise a control device for controlling the operation of the chip component carrying device, wherein when the good product collecting box is disposed at a position other than a predetermined position with respect to the box holding member It is preferable that the operation of the chip component transport apparatus is not started.

According to this configuration, when the good product recovery box is disposed at a position where the chip component of the defective product is collected, the control device does not operate the chip component transfer device, and therefore, recovery of the defective chip component in the good product recovery box is suppressed. Therefore, it is possible to suppress mixing of good parts and defective parts into the good product collecting box.

It is preferable that the chip component conveying apparatus further include a notifying section that notifies the box retaining body when the good product returning box is disposed at a position other than a predetermined position.

In the case where the good product recovery box is disposed at a position where the chip component of the defective product is recovered, the operator notifies the worker of the incorrect position of the good product recovery box, thereby reducing the possibility that the defective chip component is recovered in the good product recovery box .

Wherein the good product recovery box in the carrying direction is located downstream of a position at which the chip component of the defective product is to be recovered and that controls the operation of the chip component carrying apparatus, Further comprising a detecting section for detecting whether the chip component is accommodated in the receiving hole on a downstream side of a position upstream of the good product collecting box and for retrieving the chip component of the defective product, , When the detecting unit detects the acceptance of the defective chip component in the receiving hole in a state in which the defective chip component based on the inspection result of the defective product is received in the receiving hole desirable.

According to this configuration, it is possible to suppress the possibility that the defective chip component held in the holding portion faces the recovery receptacle of the good product recovery box, thereby reducing the possibility that the defective chip component is recovered to the good product recovery box.

(Effects of the Invention)

According to the chip component transport apparatus of the present invention, mixing of chip components between different lots can be easily suppressed.

1 is a schematic front view of a first embodiment of a chip component transportation device.
2 is a schematic cross-sectional view of a first embodiment of a chip component transportation device.
3 is a perspective view of a chip component.
Fig. 4 (a) is a schematic front view of a chip component carrying apparatus when a chip component is supplied from a supply unit to a holding section, Fig. 4 (b) is a schematic front view of the chip component carrying apparatus when the chip component is inspected by the inspection section (C) is a schematic front view of the chip component transportation apparatus when the chip component is discharged to the collection unit.
5 is a perspective view of the front side of the recovery unit.
6 is an exploded perspective view of the good product recovery box in the recovery unit.
7 is a perspective view of the back side of the recovery unit.
8 is a perspective view when the recovery unit is at the withdrawal position.
Fig. 9 is an exploded perspective view of the good product recovery box and the box holding member in the recovery unit. Fig.
10 is a schematic sectional view of the recovery unit and the conveying rotor.
11 is an exploded perspective view of a part of the recovery unit in the second embodiment of the chip component transportation device.
12 is a front view showing the positional relationship between the holding plate, the good product recovery box and the defective product recovery box in the recovery unit.
Fig. 13 is a schematic front view of the conveying rotor and the collecting unit, and Fig. 13 (b) is a schematic cross-sectional view of the conveying rotor and the collecting unit in the third embodiment of the chip component conveying apparatus.
14 is a schematic cross-sectional view of a recovery unit in a modified example of the chip component transportation device.
15 is a schematic cross-sectional view of a recovery unit in a modified example of the chip component transportation device.
16 is a schematic perspective view of a carry section in a modified example of the chip component transfer apparatus.
17 is a schematic perspective view of a carry section in a modified example of the chip component transfer apparatus.
18 is a schematic plan view of the carry section in a modified example of the chip component transfer apparatus.

Hereinafter, each embodiment of the chip component transportation device will be described with reference to the drawings. In addition, the accompanying drawings may be enlarged to show the components in order to facilitate understanding. In addition, the dimensional ratio of the components may be different from that of the actual or other drawings.

(First Embodiment)

A first embodiment of a chip component transportation device will be described with reference to Figs. 1 to 10. Fig.

1, the chip component conveying apparatus 1 includes a conveying unit 10, a feeding unit 20, an inspection unit 30, a collecting unit 40, and a control device 50. [ The carry section 10 carries the chip component 100. The supply unit 20 supplies the chip component 100 to the carry section 10. As the supply unit 20, a hopper, a feeder, and a suitable electronic component supply device can be used. The inspection unit 30 checks whether the chip component 100 is a good product or a defective product on the conveying path of the chip component 100 by the carry section 10. [ The inspection section (30) has terminals for inspecting electrical characteristics of the chip component (100). The inspection items of the electrical characteristics include electric capacity, electrical resistance, and the like, and are set by the type of the chip component. The inspection unit 30 may also have an imaging unit for inspecting the appearance of the chip component 100. [ Inspection items of appearance include breakage, existence of defects, existence of scratches, dimensions and the like.

The recovery unit 40 includes a good product recovery box 41A and five defective product recovery boxes 41B to 41F. The number of defective-item collection boxes is set according to the number of defective-item classification items of the chip component (100). In the present embodiment, as described above, since the number of inspection items is five, the number of classification items of defective products in the chip component 100 is five. The defective product recovery box 41B is a box for recovering the chip component 100 determined to be defective with respect to the electric capacity. The defective product recovery box 41C is a box for recovering the chip component 100 determined to be defective with respect to the electrical resistance. The defective product recovery box 41D is a box for recovering the chip component 100 in which cracks or defects are detected. The defective product recovery box 41E is a box for recovering the chip component 100 from which a scratch has been detected. The defective product recovery box 41F is a box for withdrawing from the chip component 100 of a dimension excluded from the range of the regulation dimensions. In addition, the recovery unit 40 may be provided with a plurality of good product recovery boxes 41A.

The control device 50 controls the carry section 10. The control device 50 retrieves the chip parts 100 corresponding to the good product recovery box 41A and the defective product recovery boxes 41B to 41F of the recovery unit 40 based on the inspection result of the inspection unit 30. [

The carry section (10) has a transfer base (11). The transporting base 11 is provided, for example, on the bottom surface and extends in the vertical direction. Further, the transporting base 11 may extend in the direction inclined with respect to the vertical direction, or may extend in the horizontal direction perpendicular to the vertical direction.

On the front face of the transporting base 11, a disc-shaped transporting support body 12 is attached. On the front surface of the conveying support body 12, a disc-shaped conveying rotor 13, which is an example of a conveying body, is disposed. The carrying rotor 13 carries the chip component 100. A rotary shaft 14 is attached to the conveying rotor 13. The conveying rotor 13 rotates integrally with the rotary shaft 14 with respect to the conveying support body 12. A plurality of holding portions 15 capable of holding the chip component 100 are provided on the conveying rotor 13 at intervals in the conveying direction of the chip component 100 by the conveying rotor 13. The holding portions 15 are arranged at the same angular intervals in the circumferential direction (conveying direction) of the conveying rotor 13. [ In Fig. 1, the number of the holding portions 15 is reduced for convenience. The holding portion 15 is juxtaposed in the direction crossing the carrying direction and has a plurality of receiving holes 15a for receiving the chip component 100. [ The plurality of receiving holes 15a of the present embodiment are arranged radially with the center axis C of the rotary shaft 14 as a center. It is preferable that the number of the receiving holes 15a in one holding portion 15 is in a range of 2 or more or 30 or less. The number of receiving holes 15a in one holding portion 15 of this embodiment is four.

The carry section 10 further includes a drive device 16, a holding device 17, and a discharge device 18. The driving device 16, the holding device 17 and the discharging device 18 are controlled by the control device 50. The drive device 16 rotates the rotary shaft 14 in, for example, the clockwise direction. The control device 50 continuously or intermittently rotates the conveying rotor 13 by the driving device 16. [ The drive device 16 includes an electric motor and a speed reducer connected to the output shaft of the electric motor. The holding device 17 holds the chip component 100 in the holding portion 15 of the conveying rotor 13. The holding device 17 has a suction pump for sucking air and a pipe for connecting the suction pump and the conveying support body 12. The discharging device 18 discharges the chip component 100 from the holding part 15. Fig. The discharging device 18 has a fan for discharging air and a pipe for connecting the fan and the conveying support body 12. The ejection device 18 may include an ejector pin for ejecting the chip component 100 from the holding part 15 and an electric actuator for actuating the ejector pin instead of the fan and the pipe.

As shown in Fig. 2, the holding portion 15 of the conveying rotor 13 has a first suction groove 15b communicating with each receiving hole 15a. The first suction grooves 15b are formed concentrically with the center axis C as a center. It is preferable that the first suction groove 15b is formed in accordance with the number of the receiving holes 15a in one holding portion 15. [ The first suction groove 15b communicates with the receiving hole 15a formed at the same position in the radial direction of the conveying rotor 13 in the circumferential direction.

The transport support body 12 has a second suction groove 12a which faces the first suction groove 15b and communicates with the first suction groove 15b. The second suction grooves 12a are formed concentrically with the center axis C as a center. The second suction groove 12a is preferably formed in accordance with the number of the first suction grooves 15b. For example, two suction holes 12b are formed in the circumferential direction at intervals in one second suction groove 12a. The two suction holes 12b are connected to the piping of the holding device 17 (see Fig. 1). In addition, the positions of the two suction holes 12b in the circumferential direction may be different for each of the second suction grooves 12a.

The chip component 100 housed in the receiving hole 15a is an electronic component such as a multilayer ceramic capacitor, a thermistor, and a coil component. As shown in Fig. 3, the chip component 100 of the present embodiment is a multilayer ceramic capacitor in which external electrodes 102 are formed on both ends of a substantially rectangular parallelepiped or substantially cubic base portion 101, for example. The length L of the chip component 100 is greater than 0.1 mm or less than 5 mm (0.1 mm <L <5 mm). The width W of the chip component 100 is greater than 0.05 mm or less than 4 mm (0.05 mm <W <4 mm). The thickness t of the chip component 100 is greater than 0.01 mm or less than 4 mm (0.01 mm <t <4 mm). 2, the Wt surface 103 (see FIG. 3) of the chip component 100 is accommodated in the receiving hole 15a in the present embodiment. The opening of the receiving hole 15a is rectangular in plan view and the length of one side thereof is larger than the width W of the chip component 100 by 0.01 mm or more and 0.5 mm or less, Is larger than the thickness (t) of the chip component (100) by 0.01 mm or more or 0.5 mm or less. The depth of the receiving hole 15a may be shallower or deeper than the length L of the chip component 100 and may be not less than 0.6 times or not more than 1.2 times the length L. [ It is preferable that the distance between the adjacent receiving holes 15a in the plurality of receiving holes 15a is 0.9 times or more of the depth of the receiving hole 15a. The LW surface 104 or the Lt surface 105 of the chip component 100 may be accommodated in the receiving hole 15a.

According to such a configuration of the carry section 10, the suction pump of the holding device 17 (see FIG. 1) is driven by the piping, the second suction The receiving holes 15a are brought into the negative pressure state through the groove 12a and the first suction groove 15b. As a result, a suction force is applied to the chip component 100 through each receiving hole 15a toward the first suction groove 15b, so that the chip component 100 is held in each receiving hole 15a.

The transport support body 12 communicates with the receiving hole 15a and has an ejection hole 12c opposed to the chip component 100 when the chip component 100 is received in the receiving hole 15a. The spray holes 12c are preferably formed in accordance with the number of the receiving holes 15a. Each spray hole 12c is connected to a pipe of the discharge device 18 (see Fig. 1). Thus, when the chip component 100 is accommodated in the receiving hole 15a, the fan of the discharging device 18 drives the compressed air to the chip component 100 through the pipe and the spray hole 12c . As a result, the chip component 100 is discharged from the receiving hole 15a. The discharge device 18 can individually control the supply of the compressed air to each spray hole 12c. Therefore, the discharging device 18 discharges the chip component 100 from each receiving hole 15a by ejecting the compressed air toward each of the receiving holes 15a.

The outline of the operation of the chip component transport apparatus 1 will be described with reference to Fig. 4, only one holding portion 15 of the plurality of holding portions 15 is enlarged as three receiving holes 15a for convenience of explanation, and the other holding portions 15 are omitted .

When the carrying rotor 13 rotates in the clockwise direction and the receiving hole 15a of the holding portion 15 moves to a position opposed to the supply unit 20 as shown in Fig. (13) temporarily stops and the chip component (100) is supplied from the supply unit (20) to the receiving hole (15a). After the chip component 100 is supplied to the receiving hole 15a, the conveying rotor 13 rotates again in the clockwise direction.

4 (b), when the chip component 100 accommodated in the receiving hole 15a is moved to a position opposed to the inspection portion 30, the conveying rotor 13 temporarily stops and the inspection portion 30 The electrical characteristics and the like of the chip component 100 are inspected. In this inspection section 30, the control device 50 classifies the chip component 100 as a good product and a defective product, and classifies the defective product into each defective item. After the inspection of the chip component 100 is completed, the conveying rotor 13 rotates again in the clockwise direction.

4 (c), when the chip component 100 housed in the receiving hole 15a moves to the position facing the collecting unit 40, the control device 50 checks the inspection result of the inspection unit 30 The chip component 100 is collected by the discharging device 18 into the corresponding good product collecting box 41A or the defective product collecting boxes 41B to 41F. More specifically, when the carrier rotor 13 rotates at a position corresponding to the defective product recovery box 41B, the control device 50 determines that the chip component 100 (Defective product), the defective chip component 100 is discharged by the discharging device 18 to the defective product recovery box 41B. On the other hand, if there is no defective product, the discharge device 18 is not operated and the chip component 100 is not discharged. The control device 50 discharges the chip component 100 to the defective product recovery boxes 41C to 41F by the discharge device 18 in the case of the defective product recovery cases 41C to 41F similarly corresponding to the defective products. The control device 50 judges that the chip component 100 (good product) judged to be good for all inspection items when the carrier rotor 13 rotates to the position corresponding to the good product recovery box 41A, The good product is discharged by the discharging device 18 from the conveying rotor 13 (holding portion 15) to the good product collecting box 41A. On the other hand, if there is no good article, the discharge device 18 does not operate and the chip component 100 is not discharged from the conveying rotor 13 (holding portion 15). The conveying rotor 13 is also configured so that when the chip component 100 is supplied from the supply unit 20 to the receiving hole 15a and when the chip component 100 is inspected by the inspection unit 30, Rotation may be maintained.

Next, a detailed configuration of the recovery unit 40 will be described with reference to Figs. 5 to 10. Fig. 5 and 8, for convenience of explanation, the conveying rotor 13 is shown in a simplified form.

As shown in Fig. 5, the collecting unit 40 is close to or opposite to the front surface 13a of the conveying rotor 13. The recovery unit 40 includes a box holding body 70 for detachably holding the good product recovery box 41A and the five defective parts recovery boxes 41B to 41F and a swing mechanism 42 for turning the box holding body 70 And a turning regulating mechanism 43 for regulating the turning of the box holding body 70. As shown in Fig. The recovery unit (40) is mounted on a support base (44).

The good product recovery box 41A and the defective product recovery boxes 41B to 41F have the same structure. Each of the collection boxes 41A to 41F is provided corresponding to one holding portion 15 (see Fig. 1). That is, each of the collection boxes 41A to 41F is provided so as to face the plurality of receiving holes 15a of the holding portion 15. [ Although not shown in the present embodiment, the collection boxes 41A to 41F are provided at pitch intervals equal to the arrangement pitch of the holding portions 15, respectively. The recovery boxes 41A to 41F are arranged along the conveying direction of the conveying section 10, that is, the rotating direction of the conveying rotor 13. [ The good product recovery box 41A is disposed on the downstream side of the defective product recovery boxes 41B to 41F in the transport direction. In addition, the collection boxes 41A to 41F may be provided at pitch intervals of integral multiples of the arrangement pitch of the holding portions 15, respectively. In the case where the recovery unit 40 includes a plurality of good product recovery boxes 41A, the plurality of good product recovery cases 41A are provided so as to face the plurality of reception holes 15a of the plurality of holding members 15 Respectively.

6, the good product collecting box 41A has a box body 60 capable of accommodating the chip component 100 (see FIG. 3) and a lid 64 covering the one end of the box body 60 do. The box body 60 has a substantially rectangular shape when viewed from its side. The box body 60 has a receiving portion 61, a collecting portion 62, and a grip portion 63. The accommodating portion 61 has a space capable of accommodating the chip component 100 to be discharged from the conveying rotor 13. The end of the receiving portion 61 on the side of the cover 64 is opened. The collecting portion 62 has a first opening 62a that opens to allow the receiving portion 61 to communicate with the outside in order to accommodate the chip component 100 in the receiving portion 61. [ The first opening 62a is open so as to be continuous with the opening of the receiving portion 61 on the side of the lid 64. [ The recovery portion 62 is provided on the side of the lid 64 in a direction orthogonal to the longitudinal direction when viewed from one end in the longitudinal direction of the box body 60 or the side surface of the box body 60 . The collecting portion 62 has a protruding wall 62b protruding from the receiving portion 61 and formed with the first opening 62a. The grip portion 63 is provided at an end portion of the receiving portion 61 on the side opposite to the collecting portion 62 in the longitudinal direction of the box body 60. A conductive alumite treatment is applied to the surface of the sidewall of the box body 60 where the collecting part 62 is provided. This prevents the box body 60 from adhering to the box holder 70 due to the static electricity since the charging of the side wall on which the recovery section 62 is provided is suppressed in the box body 60. [

The lid 64 extends in the longitudinal direction of the box body 60 so as to cover the opening of the first opening 62a on the side of the lid 64 and the opening of the accommodating portion 61. [ The end wall 64a of the lid 64 covers the first opening 62a. The end wall 64a has a second opening 64b formed in a curved shape so as to be away from the first opening 62a. The first opening portion 62a and the second opening portion 64b constitute a recovery port 65 for recovering the chip component 100 into the accommodating portion 61. [

The good yield collecting box 41A has an exhaust port 66 for discharging the air in the accommodating portion 61 without discharging the chip component 100 in the accommodating portion 61. [ The discharge port 66 is formed at a position not opposed to the recovery port 65 in the good product recovery box 41A. Concretely, the exhaust port 66 is formed at the upper end in the vertical direction in the good product recovery box 41A. More specifically, the vent hole 66 is formed in a portion of the lid 64 corresponding to the opening of the accommodating portion 61. The exhaust port 66 is constituted by a plurality of minute holes which allow the circulation of the air inside and outside the accommodating portion 61 but do not permit the distribution of the chip component 100. Further, a plurality of air outlets 66 may be formed in the cover 64. In addition, the shape of the air outlet 66 as viewed in a plane can be arbitrarily changed. Further, a plurality of holes of the exhaust port 66 may be formed in a mesh shape.

5, the box holding member 70 includes a holding plate 71 and a support plate 72. [ The holding plate 71 holds the respective collection boxes 41A to 41F. The holding plate 71 is opposed to the front surface 13a of the conveying rotor 13 and is parallel to the front surface 13a. That is, the holding plate 71 extends in the vertical direction. The supporting plate 72 is fixed to the holding plate 71 by bolts. The support plate 72 supports the retaining plate 71. The support plate 72 has a horizontal portion 72a extending in the horizontal direction perpendicular to the vertical direction at the lower end of the holding plate 71. [ A lever 72b is fixed to the horizontal portion 72a by bolts.

The holding plate 71 is provided with six box supporting portions 73 for supporting the respective recovery boxes 41A to 41F. The box supporting portions 73 are attached to the holding plates 71 at positions corresponding to the respective collection boxes 41A to 41F. The recovery boxes 41A to 41F are held in the holding plate 71 by fitting them between the plunger 74 (see FIG. 6) and the box supporting portion 73. As shown in Fig. 6, the plunger 74 is attached to an attaching portion 75 attached to the holding plate 71. As shown in Fig. The box supporting portion 73 is provided with a guide wall 73a for guiding both sides of the collection boxes 41A to 41F in the conveying direction.

As shown in Fig. 7, the holding plate 71 is provided with six insertion holes 71a. The six insertion holes 71a are formed so as to have an isosceles value centering on the central axis C of the conveying rotor 13 (see Fig. 1). The pitches of the six insertion holes 71a are the same as the arrangement pitch of the holding portions 15 of the conveying rotor 13. The insertion hole 71a extends in a radial direction about the central axis C.

5, the swivel mechanism 42 includes a strut 76 and a swivel portion 77. As shown in Fig. The struts 76 are provided standing on the right end of the support table 44. The pivot portion 77 is attached to the right end of the holding plate 71 and is pivotally attached to the pillar 76 about the pivot axis R. [ Thereby, the box holder 70 can be pivoted about the pivot axis R. [ The swivel mechanism 42 changes the position of the box holding body 70 to the return position shown in Fig. 5 and the extraction position shown in Fig. 8 by operating the lever 72b by the operator. The worker uncovers the plunger 74 (see Fig. 6) at the extraction position and withdraws the respective recovery boxes 41A to 41F from the box holding body 70. Fig. At this time, the operator has the grip portion 63 and the recovery boxes 41A to 41F are taken out of the box holding body 70, so that the recovery boxes 41A to 41F are easily taken out.

As shown in Fig. 5, the swirl regulating mechanism 43 includes a regulating plate 78 and a gripping portion 79. As shown in Fig. The regulating plate 78 is installed upright on the left end of the support base 44. The holding portion 79 is attached to the regulating plate 78 to sandwich the left end of the holding plate 71 between the holding portion 79 and the regulating plate 78. The swivel restricting mechanism 43 allows the left end of the holding plate 71 to be fitted by the regulating plate 78 and the holding portion 79 when the box holding body 70 is in the recovery position, From the recovery position.

As shown in Fig. 9, the good product collecting box 41A is inserted into the box supporting portion 73. As shown in Fig. At this time, since the good product recovery box 41A is guided by the pair of guide walls 73a of the box support portion 73, the maintenance plate 71 is moved in the conveying direction of the conveying rotor 13 (see FIG. 8) As shown in Fig. The protruded wall 62b of the good product recovery box 41A is correctly inserted into the insertion hole 71a of the holding plate 71 when the good product recovery box 41A contacts the retaining plate 71 7). The plunger 74 attached to the attachment portion 75 can be fastened with the projecting wall 62b inserted into the insertion hole 71a so that the plunger 74 can be engaged with the lid 64, . Thus, the good product recovery box 41A is sandwiched by the box support portion 73 and the plunger 74. [ Similar to the good product recovery box 41A, the defective product recovery boxes 41B to 41F are attached to the box retention member 70 by the box support portion 73 and the plunger 74. [

10, when the box holding member 70 is at the recovery position, the holding plate 71 and the conveying rotor 13 face each other with a slight gap therebetween. Therefore, in the state where the good product recovery box 41A is attached to the box holding member 70, the recovery port 65 of the good product recovery box 41A faces the conveying rotor 13 with a slight gap therebetween. In other words, in the horizontal direction, no other member is interposed between the plurality of holding portions 15 of the conveying rotor 13 and the recovery port 65 of the good product recovery box 41A. The distance between the front surface 13a of the conveying rotor 13 and the recovery tool 65 is preferably 0.5 mm or more or 30 mm or less.

The size of the collection port 65 is preferably larger than that of the receiving hole 15a. More specifically, the size of the collection port 65 is set to be larger than the inclination angle of 45 degrees or more and less than 90 degrees from the edge of the reception port 15a in the state of facing the reception port 15a, It is preferable to be within the range of the line segment extending toward the edge. Accordingly, the collection port 65 may be formed over a plurality of (two or more) receiving holes 15a. In the present embodiment, as shown in Fig. 10, the collection port 65 is formed to extend over four reception holes 15a. The edge of the recovery port 65 is connected to the recovery port 65 from the radial end of the receiving hole 15a at both ends in the radial direction of the conveying rotor 13 among the four receiving holes 15a of one holding portion 15, It is preferable that a line segment extending toward the center axis C is located in a range of 45 degrees or more and less than 90 degrees with respect to the central axis C. [

When the conveying rotor 13 is temporarily stopped, the receiving hole 15a and the recovery port 65 of the good product recovery box 41A are opposed to each other by the discharge device 18 from the conveying rotor 13 to the chip component 100 is discharged, it is accommodated in the accommodating portion 61 through the recovery port 65 of the good product recovery box 41A. That is, the recovery tool 65 directly recovers the chip component 100 ejected from the receiving hole 15a by the ejection device 18. At this time, the compressed air ejected from the ejection device 18 also flows into the accommodating portion 61, while the air in the accommodating portion 61 flows out of the accommodating portion 61 through the exhaust port 66. Similar to the good yield collecting box 41A, the rejecting collecting boxes 41B to 41F are provided with the receiving holes 15a and the collecting holes 65 of the reject collecting boxes 41B to 41F when the conveying rotor 13 is temporarily stopped Are directly opposed to each other, and the chip components 100 are directly recovered from the carrier rotor 13 through the respective recovery ports 65. [

As described above, according to the present embodiment, the following effects are exhibited.

(1-1) The chip component 100 discharged from the holding portion 15 is directly recovered into the good product recovery box 41A and the defective product recovery boxes 41B to 41F. That is, when the recovery ports 65 of the good product recovery box 41A and the defective product recovery boxes 41B to 41F are opposed to the holding portion 15, the respective collection ports 65 and the holding portion 15 are close to each other Or there is no other member between each of the collection ports 65 and the holding portion 15 in the discharge path of the chip component 100. [ This eliminates the need for a hose connecting the recovery boxes 41A to 41F and the holding portion 15, so that it is possible to suppress an increase in the working time due to the hose cleaning operation. Moreover, it is possible to suppress mixing of the chip component 100 and other types of chip components between other lots due to the chip component 100 remaining in the hose.

(1-2) In the case of recovering the chip component in the recovery box through the hose, due to the unevenness of the dimension of the receiving hole of the conveying rotor, the unevenness of the position, and the positional deviation of the receiving hole due to thermal expansion of the conveying rotor, And the receiving hole do not face exactly, and the chip component discharged from the receiving hole can not pass through the hose, and there is a possibility that a return miss occurs.

In this regard, in this embodiment, the size of the collection port 65 is 45 ° from the edge of the receiving hole 15a in the state of facing the receiving hole 15a when viewed from the carrying direction of the conveying rotor 13 The chip component 100 ejected from the holding portion 15 is easily discharged into the recovery port 65 because it is within the range of the line segment extending at an inclination angle with respect to the central axis C of less than 90 degrees, And is easily accommodated in the portion 61. Therefore, the chip components 100 discharged from the holding portion 15 can be prevented from being discharged to the outside of the recovery boxes 41A to 41F.

The edge of the recovery port 65 extends from the radial end of the receiving hole 15a at both ends in the diameter direction of the conveying rotor 13 among the plurality of receiving holes 15a toward the recovery port 65 The chip component 100 discharged from the plurality of receiving holes 15a is easily discharged into the recovery port 65 because the chip component 100 is located in the range of 45 degrees or more and less than 90 degrees with respect to the central axis C. Therefore, it is possible to further suppress the discharge of the chip component 100 discharged from the receiving hole 15a to the outside of the recovery boxes 41A to 41F.

(1-3) Since the recovery ports 65 of the recovery boxes 41A to 41F are formed over the plurality of receiving holes 15a, the chip components 100 discharged from the receiving holes 15a are collected And is easily collected into the collection boxes 41A to 41F through the collection ports 65 of the boxes 41A to 41F. Therefore, the chip component 100 discharged from the receiving hole 15a can be prevented from being discharged to the outside of the collection boxes 41A to 41F.

(1-4) Since the chip parts 100 are not discharged to the recovery boxes 41A to 41F and the exhaust ports 66 for discharging the air in the recovery boxes 41A to 41F are formed, 41A to 41F can be restrained from being excessively increased. Therefore, the chip component 100 can easily enter the recovery boxes 41A to 41F.

(1-5) Since the exhaust port 66 is formed at a position not opposed to the recovery port 65, it is possible to prevent the chip component 100 from collecting in the exhaust port 66. Therefore, it is possible to prevent the air from flowing from the exhaust port 66 to the outside of the accommodating portion 61 due to the gathering of the chip component 100 in the exhaust port 66. Therefore, it is possible to suppress excessive increase in the pressure inside the receiving portion 61 of each of the recovery boxes 41A to 41F, and the chip component 100 can easily enter the recovery boxes 41A to 41F.

(1-6) The chip components 100 recovered in the recovery boxes 41A to 41F are deposited on the bottom of the accommodating portion 61 by gravity. Since the exhaust ports 66 are formed to be the upper end portions in the vertical direction of the recovery boxes 41A to 41F in the state that the recovery boxes 41A to 41F are attached to the box holding member 70, It is possible to further suppress the filling of the chip 66 by the chip component 100. Therefore, it is possible to further suppress the obstruction of the airflow from the exhaust port 66 to the outside of the accommodating portion 61 by the chip component 100. [

(1-7) Since the collection boxes 41A to 41F are arranged in the conveying direction of the conveying rotor 13, the size of each of the collection boxes 41A to 41F is not excessively reduced, The recovery boxes 41A to 41F can be disposed so as to be recovered. Therefore, the number of chip components 100 in the lot can be increased.

(1-8) Since the good product recovery box 41A is located on the downstream side of the defective product recovery boxes 41B to 41F in the conveying direction of the conveying rotor 13, The defective chip components 100 are recovered to the defective product recovery boxes 41B to 41F until they face each other. Therefore, mixing of the defective chip component 100 into the good product recovery box 41A can be suppressed.

(1-9) Since the recovery unit 40 is provided with the turning mechanism 42 for changing the position of the box holding body 70 to the recovery position shown in FIG. 5 and the extraction position shown in FIG. 8, The operation of removing the boxes 41A to 41F from the box holding bodies 70 of the recovery boxes 41A to 41F after positioning the box holding bodies 70 at positions where the boxes 41A to 41F are easily separated from the box holding bodies 70 .

(1-10) The recovery unit 40 has the swirl regulating mechanism 43 for regulating the movement of the box holding body 70 from the recovery position. Therefore, the recovery boxes 41A- 41F can be precisely positioned.

(Second Embodiment)

A second embodiment of the chip component transportation device 1 will be described with reference to Figs. 11 and 12. Fig. The chip component transport apparatus 1 of the present embodiment differs from the chip component transport apparatus 1 of the first embodiment in the installation structure of the box container 70 and the collection boxes 41A to 41F. In the present embodiment, the same constituent members as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be appropriately omitted. Also, the description of the relationship between the same constituent members will be appropriately omitted.

11, the recovery unit 40 includes an attachment restricting portion 45 which allows the good product recovery box 41A to be attached only to a predetermined position with respect to the holding plate 71 of the box holding member 70 do. The attachment restricting portion 45 has a plurality of projections 45a and a plurality of engagement holes 45b. The plurality of protrusions 45a are formed in a portion of the box body 60 of the good yield collecting box 41A that is in contact with the holding plate 71. [ The plurality of fitting holes 45b are formed in a portion of the holding plate 71 which is in contact with the box body 60. [ As shown in Fig. 12, the collection unit 40 has a plurality of protrusions 45a and a plurality of fitting holes 45b in the reject collection bins 41B to 41F, like the good product collection box 41A. In the present embodiment, two projections 45a are formed in the box main body 60 of each of the good product recovery box 41A and the defective product recovery boxes 41B to 41F. The distance P1 between the two protrusions 45a of the good product recovery box 41A and the distance P2 between the two protrusions 45a of the defective product recovery box 41B and the distance between the two protrusions 45a of the defective product recovery box 41C, The distance P3 between the two protrusions 45a of the defective product recovery box 41E and the distance P4 between the two protrusions 45a of the defective product recovery box 41D, The distances between the two protrusions 45a of the rejects collection box 41F are different from each other. The distance H1 between the fitting holes 45b corresponding to the good product recovery box 41A and the distance H2 between the fitting holes 45b corresponding to the defective product recovery box 41B correspond to the defective product recovery box 41C A distance H4 between the fitting holes 45b corresponding to the defective product recovery box 41D and a distance H4 between the fitting holes 45b corresponding to the defective product recovery box 41E The distance H5 between the distance H5 and the fitting hole 45b corresponding to the defective product recovery box 41F is different from each other. The distance H1 is equal to the distance P1 and the distance H2 is equal to the distance P2 and the distance H3 is equal to the distance P3 and the distance H4 is equal to the distance P4 , The distance H5 is equal to the distance P5, and the distance H6 is equal to the distance P6.

According to such a configuration, for example, when the good product recovery box 41A is attached to the position where the defective product recovery box 41B is attached, the distance P1 between the two protrusions 45a of the good product recovery box 41A becomes The two protrusions 45a are not inserted into the two fitting holes 45b because the distance H2 between the two fitting holes 45b is different from the distance H2 between the two fitting holes 45b. Therefore, the good product recovery box 41A can not be attached at a position other than the predetermined position in the box holding member 70. [ Thus, the operator can recognize that the good product recovery box 41A is attached at a different position. Likewise, the defective product recovery boxes 41B to 41F can not be attached to the defective product recovery boxes 41B to 41F at positions other than the predetermined positions in the box holding member 70. [

In addition, the number of the projections 45a and the number of the fitting holes 45b can be arbitrarily changed. For example, one projection 45a and one fitting hole 45b may be provided. The projections 45a may be formed in the holding plate 71 and the fitting holes 45b may be formed in the good product recovery box 41A and the defective product recovery boxes 41B to 41F. In addition, the position of the projection 45a and the position of the fitting hole 45b can be arbitrarily changed. As a result, it is sufficient that the recovery boxes 45A and 45B have a relationship such that the recovery boxes 41A to 41F can be attached only to the box holding member 70 (holding plate 71) at a predetermined position.

As described above, according to the present embodiment, in addition to the same effects as those of the first embodiment, the following effects can be obtained.

(2-1) Because the collection boxes 41A to 41F are attached only to the predetermined positions in the box holding member 70 by the attachment restricting section 45, even if the lots are different, And the defective product recovery boxes 41B to 41F serve as dedicated recovery boxes for recovering the chip components 100 for each defective item. Therefore, even if the chip components 100 remain in the recovery boxes 41A to 41F in the previous lot, the chip components 100 of the other inspection results are prevented from being mixed into the recovery boxes 41A to 41F .

(Third Embodiment)

Referring to Fig. 13, a third embodiment of the chip component transportation device 1 will be described. The chip component transport apparatus 1 of the present embodiment is different from the chip component transport apparatus 1 of the first embodiment in that a mechanism for suppressing the recovery of the defective chip component 100 in the good product recovery box 41A It differs from the added point. In the present embodiment, the same constituent members as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be appropriately omitted. Also, the description of the relationship between the same constituent members will be appropriately omitted. For convenience of explanation, only one holding portion 15 is shown in Fig. 13 (a), and the chip component 100 held in the holding portion 15 in Fig. 13 (a) is omitted Respectively.

As shown in Fig. 13 (a), a gap is formed between the good product recovery box 41A and the defective product recovery box 41F in the transport direction of the conveying rotor 13. As shown in Fig. A through hole 71b extending radially around the central axis C is formed at a portion of the holding plate 71 corresponding to between the good product recovery box 41A and the defective product recovery box 41F.

The chip component carrying apparatus 1 includes a detecting section 80 for detecting a defective chip component 100 between the good product collecting box 41A and the defective product collecting box 41F in the carrying direction of the conveying rotor 13 Respectively. The detection unit 80 is, for example, a transmission type fiber sensor or a laser sensor. As shown in Fig. 13 (b), the detecting section 80 includes a plurality of light emitting sections 81 and a plurality of light receiving sections 82. [ The plurality of light emitting portions 81 are arranged on the side opposite to the collecting unit 40 (on the left side in the drawing) with respect to the conveying rotor 13. [ The plurality of light receiving portions 82 are disposed on the side of the collecting unit 40 (on the right side in the drawing) with respect to the conveying rotor 13. The number of each of the light emitting portion 81 and the light receiving portion 82 in the present embodiment is four. The light emitting portion 81 and the light receiving portion 82 are disposed at the same position as the receiving hole 15a in the radial direction of the conveying rotor 13. The light emitting portion 81 is provided on the substrate 83. The substrate 83 is attached to, for example, the transporting base 11. The light receiving portion 82 is provided on the substrate 84. The light receiving portion 82 and the substrate 84 are housed in a case 85. The case 85 is attached to the holding plate 71.

The detection unit 80 may use an inductive proximity sensor instead of a photoelectric sensor such as a fiber sensor or a laser sensor. The light emitting portion 81 and the light receiving portion 82 can be changed in accordance with the number of the holding portions 15 of the conveying rotor 13. [ The light emitting portion 81 may be disposed on the side of the collecting unit 40 with respect to the conveying rotor 13 and the light receiving portion 82 may be disposed on the side opposite to the collecting unit 40 with respect to the conveying rotor 13.

The light emitting portion 81 and the light receiving portion 82 are electrically connected to the control device 50 through the substrates 83 and 84. The control device 50 causes the light emitting portion 81 to emit light when the receiving hole 15a of the conveying rotor 13 is located at the same position as the light emitting portion 81 in the conveying direction of the conveying rotor 13. [ The light receiving section 82 transmits a reception signal to the control device 50 when receiving light from the light emitting section 81. The control device 50 determines whether or not the chip component 100 is accommodated in the accommodation hole 15a based on the received signal. More specifically, the control device 50 determines that the chip component 100 is accommodated in the receiving hole 15a corresponding to the light receiving portion 82 that does not receive the received signal. When the controller 50 determines that the chip component 100 is accommodated in the receiving hole 15a, the control device 50 stops the electric motor of the driving device 16 to stop the defective chip component 100 accommodated in the receiving hole 15a. Is not opposed to the recovery port 65 of the good product recovery box 41A.

The chip component 100 determined to be defective in each inspection item has a defect that the receiving hole 15a in which the chip component 100 is held is placed in the defective product recovery boxes 41B to 41F corresponding to the inspection item And are collected by the discharging device 18 into the defective product recovery boxes 41B to 41F when facing each other. However, there is a case where the chip component 100 remains in the receiving hole 15a by some state (for example, the non-operation of the nozzle for injecting the compressed air). If the receiving hole 15a in which the defective chip component 100 is left confronts the recovery port of the good product recovery box 41A, the remaining chip component 100 may fall on the good product recovery box 41A . Therefore, by stopping the chip component carrying apparatus 1, the defective chip component 100 does not fall to the good product collecting box 41A.

When the control device 50 determines that the chip component 100 is accommodated in the receiving hole 15a, the control device 50 stops the injection of the compressed air by the ejection device 18, 15a.

As described above, according to the present embodiment, in addition to the same effects as those of the first embodiment, the following effects are exhibited.

(3-1) In the carrying direction of the conveying rotor 13, the defective chip component 100 (100) is held in the holding portion 15 by the detecting portion 80 disposed between the defective product recovery box 41D and the good product recovery box 41A. It is possible to prevent the defective chip component 100 from being collected in the good product recovery box 41A by stopping the chip component carrying apparatus 1. [

(Modified example)

The description related to each of the above embodiments is an example of a form that the chip component carrying apparatus of the present invention can take, and is not intended to limit the form thereof. The chip component transporting apparatus of the present invention can take the form of, for example, a modification of the above-described embodiments and a combination of at least two variations which do not contradict each other.

The detection unit 80 of the chip component transport apparatus 1 of the third embodiment may be added to the chip component transport apparatus 1 of the second embodiment.

In the second embodiment, the attachment regulating portion 45 is formed with at least one of the collection boxes 41A to 41F and the holding plate 71 with a hole for attaching a screw or a pin constituting the projection 45a .

In the second embodiment, the attachment restricting portion 45 may be provided only at the portion where the good product recovery box 41A of the good product recovery box 41A and the holding plate 71 is attached. In this case, at least the good product recovery box 41A can be attached to the box holding member 70 at a predetermined position.

In the second embodiment, instead of the attachment regulating portion 45, the recovery unit 40 is configured such that the control device 50 controls the conveying rotor 13 such that the good product recovery box 41A is located at a position other than a predetermined position The operation of the chip component carrying apparatus 1 may not be started. The control device 50 also starts the operation of the chip component carrying apparatus 1 when at least one of the defective product recovery boxes 41B to 41F is attached to the carrying rotor 13 at a position other than a predetermined position .

As shown in Fig. 14, as an example of the configuration that the control device 50 controls, a position for detecting whether or not the good product recovery box 41A and the defective product recovery boxes 41B to 41F are attached at preset positions And a detection unit 46. [ Six position detecting portions 46 are provided corresponding to the respective collection boxes 41A to 41F. The position detecting section 46 has an IC tag 46a attached to the box main body 60 and a reading section 46b attached to the box holding member 70, for example. When the protruding wall 62b of each of the collection boxes 41A to 41F is inserted into the insertion hole 71a of the holding plate 71, the reading unit 46b reads the identification information of the IC tag 46a, . The IC tag 46a includes information for identifying the collection boxes 41A to 41F. The reading section 46b is electrically connected to the control device 50 and outputs the read information to the control device 50. [ The control device 50 determines whether the good product recovery box 41A and the defective product recovery boxes 41B to 41F are at preset positions based on the information read by the reading unit 46b. The control device 50 prohibits the drive of the drive device 16 when at least one of the good product recovery box 41A and the defective product recovery boxes 41B to 41F is different from the predetermined position. The control device 50 prohibits the driving of the drive unit 16 until, for example, both the good product recovery box 41A and the defective product recovery boxes 41B to 41F are at preset positions. Further, the position detecting section 46 may have a barcode instead of the IC tag 46a. As a result, the position detecting section 46 may be configured to be able to read the identification information of each of the collection boxes 41A to 41F.

According to the configuration shown in Fig. 14, when the good product recovery box 41A is disposed at any one of the defective product recovery boxes 41B to 41F, the operation of the chip component transportation device 1 is stopped, (Refer to FIG. 3) of the defective chip component 100 is restrained from being recovered. Therefore, mixing of the good and defective chip components 100 can be suppressed. When any one of the defective product recovery boxes 41B to 41F is disposed at a position different from the predetermined position, the operation of the chip component carrying apparatus 1 is stopped. Therefore, the defective product recovery boxes 41B to 41F It is possible to suppress the incorporation of the defective chip component 100.

14, the chip component carrying apparatus 1 including the recovery unit 40 may further include a notch portion 90 as shown in Fig. The notifying unit 90 has, for example, an acoustic device such as a buzzer or a display unit. The notifying unit 90 is electrically connected to the control device 50. [ The control device 50 causes the notifier 90 to inform the operator of the good product return box 41A and the defective article collection box 41B when the at least one of the good article collection box 41A and the defective product collection boxes 41B- At least one of the collection boxes 41B to 41F is different from a preset position by displaying an error message on the voice or display unit. In addition, the control device 50 may inhibit the drive of the drive device 16 (see Fig. 14) in conjunction with the notification to the operator by the notifying part 90. Fig.

According to the configuration shown in Fig. 15, when the good product recovery box 41A is disposed at any one of the defective product recovery boxes 41B to 41F, the notch portion 90 allows the operator to position the good product recovery box 41A It is possible to reduce the possibility that the defective chip component 100 (see FIG. 3) is recovered in the good product recovery box 41A. When any one of the defective product recovery boxes 41B to 41F is disposed at a position different from the predetermined position, the notification unit 90 notifies the operator that the position of the defective product recovery box is wrong, It is possible to reduce the possibility that other defective chip components 100 are recovered in the recovery boxes 41B to 41F.

In the chip component carrying apparatus 1 of the modified example shown in Figs. 14 and 15, only the position detecting portion 46 (only the position corresponding to the good product collecting box 41A) in the good product collecting box 41A and the holding plate 71 ) May be formed. In this case, the control device 50 does not start the operation of the chip component transportation apparatus 1 when the good product recovery box 41A is disposed at a position other than a predetermined position with respect to the box holding member 70. [ Alternatively, the controller 50 notifies the operator of the box retention member 70 by the notification unit 90 when the good product recovery box 41A is disposed at a position other than a predetermined position.

In each of the above embodiments, the configuration of the carry section 10 may be changed to the configurations of the following (A) to (C). 16 to 18 show two defective collection boxes 41B and 41C for the sake of convenience, but the type and the number of defective collection boxes can be arbitrarily changed.

(A) As shown in Fig. 16, the carry section 10A includes a first roller 91, a second roller 92, and an endless conveyor belt 93 which is an example of a carrier. The first roller 91 is a driving roller connected to the driving device 16 and the second roller 92 is a driven roller that rotates and follows the first roller 91. The conveyor belt 93 has a holding portion 15. The conveyor belt 93 rotates in the direction of a white arrow, for example, as the first roller 91 is rotated by the drive unit 16. [ The good product recovery box 41A and the defective product recovery boxes 41B and 41C are disposed so as to face the holding unit 15 at a predetermined position on the conveying path of the conveyor belt 93. [

(B) As shown in Fig. 17, the carry section 10B includes a roller 94 which is an example of a carrier. The roller 94 is connected to the driving device 16. The roller 94 has a holding portion 15. The good product recovery box 41A and the defective product recovery boxes 41B and 41C are disposed so as to be opposed to each other in the diameter direction of the holding portion 15 of the roller 94 and the roller 94. [

(C) As shown in Fig. 18, the carry section 10C includes a transport platform 95, which is an example of a transport object. The transport platform 95 is connected to the drive device 96. The drive device 96 has an electric motor and a conversion mechanism which is connected to the output shaft of the electric motor and converts the rotation of the output shaft into a reciprocating motion along the axial direction. The transport platform 95 is attached to the conversion mechanism. Thus, the transport platform 95 is movable in the direction of the white arrow in Fig. The transport platform 95 has a holding portion 15. The good product recovery box 41A and the defective product recovery boxes 41B and 41C are disposed so as to face the holding unit 15 on the transport path of the transport platform 95. [

In each of the above embodiments, the size and number of the recovery ports 65 of the recovery boxes 41A to 41F can be arbitrarily changed. For example, the collection port 65 may be formed in accordance with the number of the receiving holes 15a (all, see FIG. 1) of one holding portion 15. In this case, the size of the collection port 65 is 45 degrees or more and less than 90 degrees from the edge of the receiving hole 15a in a state of facing the receiving hole 15a when viewed from the carrying direction of the conveying rotor 13. [ Of the line segment extending at an angle of inclination. The collection port 65 may be formed so as to extend over two to five receiving holes 15a in one holding portion 15. [ As a result, the collection port 65 may be formed to extend over the plurality of receiving holes 15a in one holding portion 15.

In each of the above-described embodiments, the conveying rotor 13 is in the form of a disk having the same thickness, but the shape of the conveying rotor 13 is not limited to this. For example, the thickness of the radially outer portion of the carrier rotor 13 may be thicker than the thickness of the other portion of the receiving hole 15a at the outermost position.

In each of the above embodiments, at least one of the defective product recovery boxes 41B to 41F may be used to recover the chip component 100 through a hose corresponding to each containing hole 15a. According to this configuration, at least the good product collecting box 41A can be prevented from cleaning the hose, and the chip components can be prevented from being mixed between the other lots.

In each of the above embodiments, the recovery port 65 of the good product recovery box 41A may be opposed to the plurality of receiving holes 15a of the plurality of holding portions 15. For example, the recovery port 65 of the good product recovery box 41A may be of a size that opposes all of the four receiving holes 15a of the adjacent two holding portions 15 in the carrying direction.

One… Chip component transfer device, 13 ... The conveying rotor (conveying body)
15 ... The holding portion 15a ... Receiving hole,
18 ... Discharge device, 30 ... Inspection department,
41A ... Good product recovery box, 41B ~ 41F ... Defective collection box,
45 ... Attachment restraint, 50 ... controller,
65 ... Reclaimed area, 66 ... Exhaust port,
70 ... Box holder, 80 ... Detection unit,
90 ... Notification section, 100 ... Chip parts

Claims (12)

A carrying member for carrying the chip component,
An inspection unit for inspecting whether the chip component conveyed by the carrying body is a good product or a defective product;
A discharging device for discharging the chip component of the good product from the carrying body based on the inspection result of the inspection unit;
A good product collecting box for collecting the chip components of the good product discharged from the carrier by the discharging device based on the inspection result of the inspection unit,
And a box holding body for detachably holding the good yield collecting box,
Wherein said carrying member has a plurality of holding portions provided along the carrying direction of said chip parts and capable of holding said chip parts,
Wherein each of the plurality of holding portions is provided along a direction intersecting with the carrying direction and has a plurality of receiving holes for receiving the chip component,
Wherein the good product recovery box is provided with a chip having a recovery port which directly faces the plurality of receiving holes of at least one holding portion of the plurality of holding portions and which directly discharges the chip component of the good product discharged from the receiving hole by the discharging device Component transport device. The method according to claim 1,
Wherein the size of the collection port is within a range of a line segment extending from an edge of the receiving hole at an inclination angle of 45 degrees or more and less than 90 degrees in a state in which the collection port faces the receiving hole. 3. The method according to claim 1 or 2,
And the recovery port is formed over the plurality of receiving holes. 3. The method according to claim 1 or 2,
Wherein the discharging device discharges the chip component from the receiving hole by ejecting compressed air toward each of the plurality of receiving holes,
Wherein the good product recovery box has an exhaust port for discharging the air in the good product recovery box without discharging the chip component. 5. The method of claim 4,
And the exhaust port is formed at a position not opposed to the recovery port in the good product recovery box. 6. The method of claim 5,
And said exhaust port is formed in an upper end portion in a vertical direction in said good product collecting box. 3. The method according to claim 1 or 2,
And a defective product collection box provided corresponding to one of the holding portions and adapted to collect the defective chip component discharged from the receiving hole by the discharge device based on the inspection result of the inspection portion,
The defective product recovery box has a recovery port that directly faces the defective product chip component which is opposed to the receiving hole and discharged from the receiving hole by the discharge device,
And the defective product recovery box and the defective product recovery box are arranged in the transport direction. 8. The method of claim 7,
And the good product recovery box is located on the downstream side of the defective product recovery box in the transport direction. 3. The method according to claim 1 or 2,
Wherein the good product recovery box and the box retention member are provided with attachment regulating portions capable of attaching only the predetermined number of the good product recovery boxes to the box retention member. 3. The method according to claim 1 or 2,
And a control device for controlling the operation of said chip component transportation device,
Wherein the control device does not start the operation of the chip component transportation device when the good product recovery box is disposed at a position other than a predetermined position with respect to the box retention housing. 3. The method according to claim 1 or 2,
Further comprising a notifying unit for notifying the box holding body when the good product returning box is disposed at a position other than a predetermined position. 3. The method according to claim 1 or 2,
In the carrying direction, the good product recovery box is located on the downstream side of the position where the chip component of the defective product is recovered,
A control device for controlling the operation of the chip component conveying device, and a control device for controlling the operation of the chip component conveying device in such a manner that the chip component is housed in the receiving hole on the upstream side of the good product collecting box and on the downstream side of the position for retrieving the defective chip component Further comprising:
When the detection unit detects the acceptance of the defective chip component in the receiving hole in a state where the defective chip component based on the inspection result of the inspection unit is received in the receiving hole, And stops the operation of the chip component.

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