KR20180053473A - 다이렉트 본딩장치 - Google Patents

다이렉트 본딩장치 Download PDF

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Publication number
KR20180053473A
KR20180053473A KR1020160150378A KR20160150378A KR20180053473A KR 20180053473 A KR20180053473 A KR 20180053473A KR 1020160150378 A KR1020160150378 A KR 1020160150378A KR 20160150378 A KR20160150378 A KR 20160150378A KR 20180053473 A KR20180053473 A KR 20180053473A
Authority
KR
South Korea
Prior art keywords
diaphragm
stage
flow path
pattern hole
working
Prior art date
Application number
KR1020160150378A
Other languages
English (en)
Korean (ko)
Inventor
박배혁
박종환
이민형
박민규
Original Assignee
주식회사 탑 엔지니어링
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 탑 엔지니어링 filed Critical 주식회사 탑 엔지니어링
Priority to KR1020160150378A priority Critical patent/KR20180053473A/ko
Priority to CN201710462746.8A priority patent/CN107219649B/zh
Priority to CN201720828042.3U priority patent/CN207156477U/zh
Publication of KR20180053473A publication Critical patent/KR20180053473A/ko

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Human Computer Interaction (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Die Bonding (AREA)
KR1020160150378A 2016-11-11 2016-11-11 다이렉트 본딩장치 KR20180053473A (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020160150378A KR20180053473A (ko) 2016-11-11 2016-11-11 다이렉트 본딩장치
CN201710462746.8A CN107219649B (zh) 2016-11-11 2017-06-19 直接接合机
CN201720828042.3U CN207156477U (zh) 2016-11-11 2017-07-10 直接接合机

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160150378A KR20180053473A (ko) 2016-11-11 2016-11-11 다이렉트 본딩장치

Publications (1)

Publication Number Publication Date
KR20180053473A true KR20180053473A (ko) 2018-05-23

Family

ID=59950293

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160150378A KR20180053473A (ko) 2016-11-11 2016-11-11 다이렉트 본딩장치

Country Status (2)

Country Link
KR (1) KR20180053473A (zh)
CN (2) CN107219649B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200013355A (ko) 2018-07-30 2020-02-07 주식회사 탑 엔지니어링 도전 재료 도포 장치

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180053473A (ko) * 2016-11-11 2018-05-23 주식회사 탑 엔지니어링 다이렉트 본딩장치

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI266104B (en) * 2002-03-14 2006-11-11 Sharp Kk Manufacturing method of liquid crystal display apparatus and substrate assembling apparatus
KR101152232B1 (ko) * 2010-07-15 2012-06-08 에이피시스템 주식회사 기판 접합 장치 및 이를 이용한 기판 처리 방법
CN102371678A (zh) * 2010-08-11 2012-03-14 纬创资通股份有限公司 压合方法及其压合设备
CN202319208U (zh) * 2011-11-18 2012-07-11 郑春晓 一种气囊式真空贴合机
CN104347467A (zh) * 2013-07-23 2015-02-11 Ap系统股份有公司 衬底固持模块和包含所述衬底固持模块的衬底处理设备
KR20180053473A (ko) * 2016-11-11 2018-05-23 주식회사 탑 엔지니어링 다이렉트 본딩장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200013355A (ko) 2018-07-30 2020-02-07 주식회사 탑 엔지니어링 도전 재료 도포 장치

Also Published As

Publication number Publication date
CN107219649A (zh) 2017-09-29
CN107219649B (zh) 2021-05-14
CN207156477U (zh) 2018-03-30

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