KR20180053473A - Direct Bonding Machine - Google Patents

Abstract

According to an aspect of the present invention, there is provided a direct bonding apparatus comprising: a flow path through which a working fluid supplied from the outside flows; a stage having a work pattern hole communicated with the flow path and exposed to the outside; Wherein at least a part of the diaphragm is made of a material having an adhesive force, and when the working fluid is injected into the working pattern hole through the flow path beyond the saturation state, The diaphragm opposed to the hole is expanded.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001]

The present invention relates to a direct bonding apparatus, and more particularly, to a direct bonding apparatus for gradually separating a bonding object from a work plate by using expansion of a diaphragm or pressing a bonding object.

2. Description of the Related Art Recently, a touch panel is mounted as an input device capable of inputting information such as text and graphics on a smart phone or a tablet terminal.

Also, the touch panel is provided with an image display device such as a flat panel display such as a liquid crystal display device (LCD), a plasma display panel (PDP), and an organic electro-luminescence display (OELD) The user uses the touch screen to select information while viewing the image display device.

In addition, smart phones and tablet terminals are used in various indoor and outdoor environments, and visibility is required to be easily used even outdoors in the sunlight.

In contrast to the air gap bonding method in which only the end portions of the touch panel and the display are bonded to improve the visibility, a direct bonding method for bonding the touch panel and the display to the front side is widely used.

More specifically, the direct bonding method places an optically clear resin (OCR) between the touch panel and the liquid crystal display and combines the touch panel and the liquid crystal display so that no bubbles remain.

However, the direct bonding method according to the related art is implemented by various methods, but in the case of the vacuum adsorption method, a mark is formed on a vacuum region and the quality of the product is deteriorated. When the ESC stage is used, the attraction force is not strong on the stage where the object to be bonded is seated, so that the protective material can not be peeled off easily. Next, when a stage having an attraction force is used, a mark of the pressing pin is left behind due to the use of the pressing pin for separating from the stage, and the quality of the product is lowered.

In addition, when the bonding material is pressed during the bonding process, if the balance degree is changed between the pressing material and the bonding target material, a defective product is generated and a separate equipment for adjusting the balance degree is installed.

Further, in the case of performing the bonding process for the flat bonding target material and the bonding target material having a three-dimensional shape, each of the individual facilities must be provided and the bonding process must be performed through each of the individual facilities. .

Korean Patent Publication No. 2013-0078894

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems of the prior art, and it is an aspect of the present invention to provide a direct bonding apparatus capable of separating from a stage without damaging the object to be bonded and being easily unloaded.

Another aspect of the present invention is to provide a direct bonding apparatus capable of pressing a bonding object with the same pressure even when the parallelism between the pressing member and the bonding target is not maintained during the bonding process.

Another aspect of the present invention is to provide a direct bonding apparatus capable of bonding a bonding object irrespective of the shape of a bonding target material.

The direct bonding apparatus according to an embodiment of the present invention includes a flow path through which a working fluid supplied from the outside flows, a stage having a work pattern hole communicated with the flow path and exposed to the outside, Wherein at least a part of the diaphragm is made of a material having an adhesive force, and when the working fluid is injected into the working pattern hole through the flow path beyond the saturated state, The diaphragm opposed to the pattern hole expands.

In the direct bonding apparatus, one surface of the diaphragm is in contact with the stage, and the other surface of the diaphragm is seated on the other surface.

Further, in the direct bonding apparatus, the bonding object includes a first bonding target material contacting the diaphragm and a second bonding target material laminated on the first bonding target material, wherein the first bonding target material is OCA ( Optical Clear Adhesive) or POLED, and the second object to be bonded may be a cover glass or a board assembly.

In the direct bonding apparatus, the diaphragm may be made of an adhesive and sealant (ASC).

The direct bonding apparatus may further include an air supply unit that supplies a working fluid to the flow path of the stage, a supply body that supplies or presses the object to be bonded to the diaphragm, and a drive assembly that moves the supply body .

The direct bonding apparatus according to another embodiment of the present invention includes a flow path through which a working fluid supplied from the outside flows, a stage formed with a work pattern hole communicated with the flow path and exposed to the outside, And a working body body positioned to face the diaphragm and having a bonding object mounted thereon, wherein the working fluid is injected into the working pattern hole through the flow path to a position above the saturated state, The diaphragm opposed to the working pattern hole is inflated and presses the object to be bonded of the working unit body.

Further, the direct bonding apparatus may further include an air supply unit for supplying air to the flow path of the stage, wherein the air supply unit includes an air pump and a supply pipe, and the supply pipe is connected to the flow path.

In addition, in the direct bonding apparatus, the working body may include a flow path through which a working fluid supplied from the outside flows, a stage formed with a work pattern hole communicated with the flow path and exposed to the outside, And a diaphragm coupled to the stage to cover the working pattern hole, wherein at least a portion of the diaphragm is made of a material having an adhesive force.

According to another aspect of the present invention, there is provided a direct bonding apparatus including a first flow path through which a working fluid supplied from the outside flows, a first stage communicating with the first flow path and having a work pattern hole exposed to the outside, A first diaphragm portion including a first diaphragm coupled to the first stage to cover the first work pattern hole of the first stage and a second diaphragm portion including a first diaphragm portion coupled to the first stage and a second flow path through which a working fluid supplied from the outside flows, A second stage communicating with the second flow path and having a second work pattern hole exposed to the outside and a second diaphragm coupled to the second stage to cover the second work pattern hole of the second stage, Wherein the first diaphragm and the second diaphragm are opposed to each other, the first diaphragm is seated with a first object to be bonded, and the first diaphragm and the second diaphragm are opposed to each other, The first diaphragm is expanded when the second object is stacked on the upper side of the upper material, and the working fluid is supplied to the first flow path in a saturation or more in the first working pattern hole, and the first diaphragm is inflated, To the second bonding target material side.

When the diaphragm of the first diaphragm is inflated, the first object to be bonded corresponds to the three-dimensional shape of the second object to be bonded. In the direct bonding apparatus, the second object to be bonded has a three-dimensional shape. Lt; / RTI >

Further, in the direct bonding apparatus, when the working fluid is supplied to the second working pattern hole through the second flow path more than saturation, the second diaphragm is inflated, 1 to the side of the object to be bonded.

In the direct bonding apparatus, at least a part of the first diaphragm may be made of a material having an adhesive force.

The details of other embodiments are included in the detailed description and drawings.

According to the direct bonding apparatus of the present invention, since the diaphragm is gradually expanded to separate a part of the object to be bonded without damaging it from the stage as it is pressed, and the unloading is realized in an easy state, However, high quality products can be obtained.

Further, as the object to be bonded is pressed through the expanded diaphragm, even if the degree of parallelism between the diaphragm and the object to be bonded is not maintained, it is possible to press the object to be bonded with the same pressure, No separate equipment is required, no maintenance is required, and the manufacturing cost is reduced, the defect occurrence rate is reduced, and the productivity is improved.

In addition, since a bonding process can be performed for a plate-shaped or three-dimensional object to be bonded using one apparatus, the manufacturing cost is reduced, the time and cost for maintenance are reduced, and the productivity is improved.

It will be appreciated that embodiments of the technical idea of the present invention can provide various effects not specifically mentioned.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram for explaining a technical concept of a direct bonding apparatus according to the present invention. FIG. 1 (a) is a structural view, and FIG.
2 (a) is a perspective view, and Fig. 2 (b) is a cross-sectional view of the direct bonding apparatus according to the first embodiment of the present invention, AA section of FIG.
Fig. 3 is a schematic use state of the direct bonding apparatus shown in Fig. 2. Fig.
Figs. 4 to 6 are schematic views showing the operation pattern holes according to the first to third embodiments in the direct bonding apparatus shown in Fig. 2. Fig.
FIG. 7 is a schematic configuration diagram of a direct bonding apparatus according to the first embodiment of the present invention; FIG.
8 is a schematic configuration diagram of a direct bonding apparatus according to a second embodiment of the present invention;
9 is a schematic configuration diagram of a direct bonding apparatus according to a third embodiment of the present invention;
10 is a first use state view of the direct bonding apparatus shown in Fig.
11 is a second use state view of the direct bonding apparatus shown in Fig.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and how to accomplish them, will become apparent by reference to the embodiments described in detail below with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are provided so that the disclosure can be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the meaning in the context of the relevant art and are to be construed as ideal or overly formal in meaning unless explicitly defined in the present application Do not.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Fig. 1 is a schematic structural view for explaining a technical concept of a direct bonding apparatus according to the present invention. Fig. 1 (a) is a structural view, and Fig. 1 (b) is a state of use.

As shown in the drawing, the direct bonding apparatus 100 includes a stage 110 and a diaphragm 120. The diaphragm 120 is coupled to the stage 110 so as to cover the stage 110.

More specifically, the stage 110 is formed with a flow path 111 and a work pattern hole 112 communicating with each other.

The flow path 111 is for inflating and restoring the diaphragm 120 opposed to the operation pattern hole 112 by flowing air from the outside into the operation pattern hole 112.

The work pattern hole 112 is exposed to the outside of the stage 110. Thus, one side of the working pattern hole 112 is connected to the flow path 111, and the other side is in contact with the diaphragm 120.

That is, the diaphragm 120 is coupled to the stage 110 so as to cover one surface of the stage 110 on which the operation pattern hole 112 is formed.

The work pattern holes 112 may have various patterns according to the purpose.

1 (b), when the working fluid is injected into the flow path 111 and supplied to the working pattern hole 112 in a saturated state or more, the working pattern hole 112, The diaphragm 120 opposed to the diaphragm 120 is expanded. When the working fluid injected through the flow path (111) is discharged, the expanded diaphragm (120) is restored to its original state.

As described above, the direct bonding device 100 according to the present invention utilizes the technical features that supply the working fluid and thus the diaphragm 120 expands.

That is, when the diaphragm 120 is applied to the process of separating the product after the bonding process, the material to be bonded to the diaphragm 120 can be separated from the stage 110 without damage from the stage 110.

In addition, when the expansion of the diaphragm 120 is applied to a pressing process during the bonding process, the pressure can be increased to the same pressure regardless of the shape of the material to be bonded.

2 (a) is a perspective view, and Fig. 2 (b) is a cross-sectional view of the direct bonding apparatus according to the first embodiment of the present invention, FIG.

As shown in the figure, the direct bonding apparatus includes a stage 1100 and a diaphragm 1200. The diaphragm 1200 is coupled to cover at least one surface of the stage 1100.

More specifically, the stage 1100 is formed with a flow path 1110 and a work pattern hole 1120 communicating with each other. The flow path 1110 is for supplying the working fluid introduced from the outside to the working pattern hole 1120.

The work pattern hole 1120 is connected to the end of the flow path 1110 and is exposed to the outside of the stage 1100. The working pattern hole 1120 is for supplying the working fluid introduced through the flow path 1110 to the diaphragm 1200 to expand and restore a part of the area of the diaphragm 1200.

To this end, the diaphragm 1200 is coupled to the stage 1100 so as to cover one surface of the stage where the operation pattern hole 1120 is formed.

That is, when the working fluid is supplied to the working pattern hole 1120 more than the saturated state, the diaphragm 1200 opposed to the working pattern hole 1120 is expanded. When the working fluid escapes from the working pattern hole 1120, the expanded diaphragm 1120 is restored to its original state.

4 to 6, the work pattern hole 1120 can be variously formed according to the bonding object, which will be described later.

In addition, the diaphragm 1200 may be made of an adhesive (Adhesive and Sealant Council) having an adhesive force. An adhesive layer may be formed on the upper surface of the diaphragm 1200.

That is, the diaphragm 1200 may be made of a material having an adhesive force to peel the protective paper of the object to be bonded, which is seated on the diaphragm 1200 during the bonding process, or may be formed on one surface of the object to be bonded.

Fig. 3 is a schematic view of the diaphragm shown in Fig. 2. Fig. 3 (a) shows a state before the diaphragm is expanded, and Fig. 3 (b) It is.

As shown in FIG. 3 (a), the diaphragm 1200 is laminated with a first bonding target material 10 and a second bonding target material 20 for implementing a bonding process.

The first bonding target 10 may be made of a flexible material such as Optical Clear Adhesive (OCA) or POLED, and is mounted on the diaphragm 1200.

The second bonding object 20 may be formed of a cover glass or a board assembly to be bonded to the first bonding target 10 and may be stacked on the first bonding target 10. [

The diaphragm 1200 is made of a material having adhesive force.

That is, when the direct bonding device is applied to a tempered glass manufacturing process for protecting liquid crystal, the first bonding target 10 is OCA and the second bonding target 20 is a cover glass.

When the direct bonding device 1000 is applied to a display manufacturing process, the first bonding target 10 is OCA and the second bonding target 20 is a touch screen panel (TSP) or a liquid crystal display (LDC) ≪ / RTI >

As described above, since the diaphragm 1120 is made of a material having an adhesive force, the OCA that is the first bonding target 10 can be placed on the diaphragm 1120, and the protection sheet of OCA can be easily removed.

Next, FIG. 3 (b) shows a process of separating the first bonding target material 10 from the diaphragm 1120 after the bonding operation is completed.

More specifically, when the working fluid is injected from the outside of the stage 1100 through the flow path 1110, the working fluid flows into the working pattern hole 1120.

When the working fluid is continuously injected in the state where the working fluid is saturated in the flow path 1110 and the working pattern hole 1120, the pressure is concentrated in the diaphragm 1120 opposed to the working pattern hole 1120, do.

The first bonding object 10 and the second bonding object 20 seated on the diaphragm 1200 are gradually separated from the diaphragm 1200.

That is, in the process of expanding the diaphragm 1200, the area of contact between the first bonding object 10 and the diaphragm 1120 attached to the diaphragm by the adhesive force of the diaphragm 1200 is sequentially reduced. The first bonding target material 10 and the second bonding target material 20 can be easily separated from the diaphragm 1200.

In addition, as the diaphragm 1200 is gradually swollen, breakage of the object to be bonded, which may occur during separation, is prevented.

Figs. 4 to 6 are schematic diagrams showing the operation pattern holes according to the first to third embodiments in the direct bonding apparatus shown in Fig. 2. Fig.

As shown in the drawing, FIG. 4 shows that the working pattern hole is formed in a donut shape. More specifically, the working pattern hole 1120a includes a first donut portion 1121a and a second donut portion 1122a. The centers of the first donut portion 1121a and the second donut portion 1122a are the same and the first donut portion 1121a is located at the outer periphery of the second donut portion 1122a.

Next, Fig. 5 shows that the working pattern holes are formed in a square shape. More specifically, the work pattern holes 1120b are formed in a rectangular shape, and a plurality of work pattern holes 1120b are arrayed.

Next, Fig. 6 shows that the working part pattern is formed into a plurality of arrayed circles. More specifically, the work pattern hole 1120c is circular, and a plurality of work pattern holes 1120c are arrayed.

Fig. 7 is a schematic configuration diagram of a direct bonding apparatus according to the first embodiment including the diaphragm of Fig. 2;

The direct bonding apparatus 1000 includes a stage 1100, a diaphragm 1200, an air supply unit 1300, a supply unit body 1400, and a drive unit assembly 1500.

More specifically, the stage 1100 and the diaphragm 1200 are the same as the stage 1100 and the diaphragm 1200 shown in FIG. The air supply unit 1300 is for supplying air as a working fluid to the stage 1100 and includes an air pump 1310 and a supply pipe 1320.

And the supply pipe 1320 is connected to the flow path of the stage 1100 (denoted by 1110 in Fig. 3).

The supply part body 1400 is raised and lowered by the drive assembly 1500 to press the object to be bonded (not shown), which supplies the subject material or is seated on the upper part of the diaphragm 1200.

When air is supplied to the working pattern hole (indicated by reference numeral 1120 in FIG. 3) through the flow path of the stage 1100 (denoted by reference numeral 1110 in FIG. 3) to the saturation state or more, Lt; / RTI >

8 is a schematic configuration diagram of a direct bonding apparatus according to the second embodiment of the present invention.

As shown, the direct bonding apparatus 2000 includes a stage 2100, a diaphragm 2200, an air supply unit 2300, and a work unit body 2400.

More specifically, the stage 2100 and the diaphragm 2100 are the same as the stage 110 and the diaphragm 120 shown in FIG. That is, when air is supplied to the working pattern hole (indicated by 112 in FIG. 1) through the flow path (shown by 111 in FIG. 1) of the stage 2100 over the saturated state, the diaphragm 2200 Is expanded.

The air supply unit 2300 is for supplying air to the stage 2100 and includes an air pump 2310 and a supply pipe 2320.

The working unit body 2400 is for supporting the object to be bonded and is positioned to face the diaphragm 2100.

In this way, the first bonding target material 10 and the second bonding target material 20 to be bonded are placed on the working body 2400. Air is injected into the work pattern hole (112 in FIG. 1) through the flow path (indicated by 111 in FIG. 1) of the stage 2100 by using the air supply part 2300.

The diaphragm 2200 is inflated when air is supplied above the saturated state, and the expanded diaphragm 2200 presses the second object 20 to be bonded.

Accordingly, the direct bonding apparatus 2000 does not include a separate driving unit module, and the bonding object can be uniformly pressed even by air injection alone, and the pressing amount can be easily adjusted by changing the air pressure.

In addition, even when the parallelism between the bonding target material 10, 20 and the diaphragm 2200 does not coincide with each other during operation, the bonding object is uniformly pressed as the diaphragm 2200 is gradually expanded .

The working part body 2400 of the direct bonding device 2000 may have a coupling structure of the stage 1100 and the diaphragm 1200 shown in FIG.

In this case, after the pressing process of the bonding target materials 10 and 20 is completed by the expansion of the diaphragm 2200, air is injected into the stage, and as shown in FIG. 3 (b) And the second bonding object 20 and the second bonding object 20 are placed in a state where they can be easily separated from the diaphragm (indicated by 1200 in Fig. 3).

9 is a schematic configuration diagram of a direct bonding apparatus according to the third embodiment of the present invention. As shown in the figure, the direct bonding apparatus 3000 includes a first diaphragm 3100, a second diaphragm 3200, and an air supply unit 3300.

More specifically, the first diaphragm 3100 is the same as the coupling structure of the diaphragm 120 and the stage 110 shown in FIG. 1, and the second diaphragm 3200 is similar to the coupling structure of the stage 110 And the coupling structure of the diaphragm 120 or the coupling structure of the stage 1100 and the diaphragm 1200 shown in FIG.

That is, the first diaphragm portion includes a first flow path (indicated by 111 in Fig. 1) through which a working fluid supplied from the outside flows, a second flow path communicating with the first flow path, 1) 112 formed on the first stage (shown in FIG. 1) and a first diaphragm (shown in FIG. 1) formed on the first stage to cover the first work pattern hole of the first stage 120 < / RTI >

The second diaphragm portion 3200 includes a second flow path through which a working fluid supplied from the outside flows, a second stage 322 communicating with the second flow path, And a second diaphragm coupled to the second stage to cover the second working pattern hole of the second stage.

The first diaphragm portion 3100 supports the object to be bonded from below and the second diaphragm portion 3200 presses the object to be bonded from the upper portion.

Accordingly, the direct bonding apparatus 3000 can pressurize the bonding target material during the bonding process by using the second diaphragm unit 3200, and the first diaphragm 3100 can be used for separating the bonding target material, Bonding becomes possible.

This will be described in more detail with reference to FIG. 10 and FIG.

10 is a first use state view of the direct bonding apparatus shown in Fig. As shown in FIG. 10 (a), the first bonding target material 10 and the second bonding target material 20 are laminated on the first diaphragm portion 3100. The second diaphragm of the second diaphragm portion 3200 is inflated to press the second object 20 to be bonded.

10 (b), the first diaphragm (denoted by reference numeral 1200 in FIG. 3) of the first diaphragm 3100 is expanded so that the bonding target material 10, So that it can be separated from the portion 3100 easily.

11 is a second use state diagram of the direct bonding apparatus shown in Fig. As shown in the figure, the direct bonding apparatus 3000 shows a step of bonding the first bonding target material 10 to the second bonding target material 20 having a three-dimensional shape.

More specifically, as shown in FIG. 11A, the first object to be bonded 10 is placed on the first diaphragm 3100.

Then, as shown in FIG. 11 (b), a second bonding object 20 having a three-dimensional shape is laminated on the first bonding target material 10. Next, as shown in FIG.

That is, the three-dimensional shape means not having a flat plate shape as a whole but at least a part having a curved shape.

Then, air is supplied to the first diaphragm 3100 to expand the first diaphragm (indicated by 120 in FIG. 1).

Accordingly, the first object 10 to be bonded is pressed against the first diaphragm 3100 and joined to the second object 20 having a three-dimensional shape.

11 (c), air is supplied to the second diaphragm portion 3200 to press the first bonding target material 10 and the second bonding target material 20. Next, as shown in Fig.

11 (d), when the first diaphragm 3100 and the second diaphragm 3200 are restored to their original states, the first bonding target 10 and the second bonding The object 20 is in a state where bonding is completed and unloading is possible.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that the invention may be practiced. It is therefore to be understood that one embodiment described above is illustrative in all aspects and not restrictive.

10: first bonding target material 20: second bonding target material
10, 20: Bonding material
100: Direct bonding device 110: Stage
111: flow path 112: operation pattern hole
120: diaphragm
1000: Direct bonding device
1100: stage 1110:
1120: diaphragm 1121a: first donut portion
1122a: second donut portion 1120a, 1120b, 1120c: operation pattern hole
1200: diaphragm 1300: air supply part
1310: air pump 1320: supply pipe
1400: Supply body 1500: Assembly
2000: direct bonding device 2100: stage
2200: working part body 2300: air supply part
2310: Air pump 2320: Supply pipe
3000: direct bonding apparatus 3100: first diaphragm unit
3200: second diaphragm portion 3300: air supply portion

Claims (12)

A flow path through which a working fluid supplied from the outside flows; a stage communicating with the flow path and having a work pattern hole exposed to the outside; And
And a diaphragm coupled to the stage to cover the working pattern hole of the stage,
Wherein at least a part of the diaphragm is made of a material having an adhesive force,
When the working fluid is injected into the working pattern hole through the flow path beyond the saturated state, the diaphragm opposed to the working pattern hole is inflated
Direct bonding device.
The method of claim 1, wherein
One surface of the diaphragm is in contact with the stage, and a bonding target is seated on the other surface
Direct bonding device.
3. The method of claim 2,
The bonding object
A first bonding target material contacting the diaphragm and a second bonding target material laminated on the first bonding target material,
The first bonding object may be OCA (Optical Clear Adhesive) or POLED,
The second bonding object may be a cover glass or a board assembly.
Direct bonding device.
The method according to claim 1,
The diaphragm is made of ASC (Adhesive and Sealant Council)
Direct bonding device.
The method according to claim 1,
An air supply unit for supplying working fluid to the flow path of the stage,
A supply body for supplying or pressing a material to be bonded to the diaphragm,
Further comprising a drive assembly for moving the supply body
Direct bonding device.
A flow path through which a working fluid supplied from the outside flows; a stage communicating with the flow path and having a work pattern hole exposed to the outside;
A diaphragm coupled to the stage to cover the working pattern hole of the stage; And
And a working body positioned to face the diaphragm and to which a bonding object is seated,
When the working fluid is injected into the working pattern hole through the flow path in a saturated state or more, the diaphragm opposed to the working pattern hole expands and presses the object to be bonded of the working body
Direct bonding device.
The method according to claim 6,
Further comprising an air supply part for supplying air to the flow path of the stage,
Wherein the air supply portion includes an air pump and a supply pipe, and the supply pipe is connected to the flow path
Direct bonding device.
6. The method of claim 5,
The working unit body
A stage in which a working fluid supplied from the outside flows, a stage in which a working pattern hole communicated with the flow path and exposed to the outside is formed, and a diaphragm coupled to the stage to cover the working pattern hole of the stage And at least a part of the diaphragm is made of a material having an adhesive force
Direct bonding device.
A first stage in which a working fluid supplied from the outside flows, a first stage in which a working pattern hole communicated with the first flow path and exposed to the outside is formed, A first diaphragm portion including a first diaphragm coupled to the first stage to cover the first diaphragm portion; And
A second stage in which a second work pattern hole communicating with the second flow path and exposed to the outside is formed, and a second stage in which the second work pattern And a second diaphragm including a second diaphragm coupled to the second stage to cover the hole,
Wherein the first diaphragm and the second diaphragm are opposed to each other,
A first object to be bonded is placed on the first diaphragm, a second object is laminated on the first object to be bonded,
When the working fluid is supplied to the first flow path in the first working pattern hole more than saturation, the first diaphragm is inflated and presses the first object to be bonded toward the second object material to be bonded
Direct bonding device.
10. The method of claim 9,
Wherein the second object to be bonded has a three-dimensional shape,
When the diaphragm of the first diaphragm portion is inflated, the first object to be bonded is pressed so as to correspond to the three-dimensional shape of the second object to be bonded
Direct bonding device.
10. The method of claim 9,
When the working fluid is supplied to the second working pattern hole through the second flow path more than saturation, the second diaphragm is inflated and presses the second object to be bonded toward the first object to be bonded
Direct bonding device.
10. The method of claim 9,
Wherein at least a portion of the first diaphragm is made of a material having an adhesive force
Direct bonding device.

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