KR20180039458A - Apparatus for treating substrate, and apparatus and method for monitoring process fluid of the same - Google Patents

Abstract

The present invention relates to an apparatus and a method for monitoring a phase change in a process fluid used in an apparatus for treating a substrate in real time. According to an embodiment of the present invention, an apparatus for monitoring a process fluid may comprise: an information collection unit collecting temperature and pressure information from a storage tank storing a process fluid, a supply line supplying the process fluid, and a discharge line discharging the process fluid; a treatment unit calculating a material property of the process fluid with the temperature and pressure information; and a display unit displaying the material property of the process fluid in real time in accordance with temperature and pressure.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a substrate processing apparatus, a substrate processing apparatus,

The present invention relates to a substrate processing apparatus, a process fluid monitoring apparatus and a monitoring method thereof, and more particularly, to an apparatus and a method for monitoring a phase of a process fluid.

Substances exist in three states below the critical point: solid, liquid, and gas. At the critical point or higher, the gas-liquid coexistence state is present as a supercritical state.

Such a supercritical material has a very large change continuously from a state close to the gas to a state close to the liquid when the pressure is changed near the critical point, such as density, viscosity, thermal conductivity, diffusion coefficient and specific heat. Therefore, the properties of supercritical fluids can be applied to various physical and chemical manipulations and reactions. Particularly, supercritical fluids have advantages such as high dissolving power, low viscosity, and high diffusion coefficient, and thus technologies using supercritical fluids in distillation, adsorption, drying, and cleaning processes have attracted much attention.

 As a representative supercritical fluid, carbon dioxide is used. 1 is a graph showing a phase change of carbon dioxide. As shown in FIG. 1, the carbon dioxide has a critical temperature of 31.1 and a relatively low critical pressure of 7.38 MPa, which makes it easy to form a supercritical state, and it is easy to control the phase change by controlling the temperature and the pressure, . In addition, since carbon dioxide has no toxicity and is harmless to human body, it has the characteristics of nonflammability and inertness. Supercritical carbon dioxide has a diffusion coefficient of about 10 to 100 times that of water and other organic solvents, Substitution of solvent has fast characteristics.

However, since the phase of the supercritical fluid changes according to the temperature and pressure conditions, the supercritical fluid supplied to the process chamber using the supercritical fluid is monitored in real time for the phase change of the supercritical fluid, A technique capable of controlling the power consumption of the power supply is required.

An object of the present invention is to provide a monitoring apparatus and a monitoring method of a process fluid capable of real-time monitoring of a phase change of a process fluid in a process using a supercritical fluid.

It is a further object of the present invention to provide a method and apparatus for controlling the process conditions or adjusting the process conditions such that when the value of the physical property value is within the normal property range, that is, And to provide a monitoring device and a monitoring method of the process fluid.

The problems to be solved by the present invention are not limited to the above-mentioned problems, and the problems not mentioned can be clearly understood by those skilled in the art from the description and the accompanying drawings will be.

A monitoring apparatus for monitoring a phase of a process fluid used in a substrate processing process of a substrate processing apparatus, comprising: a storage tank for storing the process fluid; An information collecting unit for collecting temperature and pressure information from a supply line supplying the process fluid or an exhaust line discharging the process fluid; A processor for calculating a physical property value of the process fluid using the temperature and pressure information; And a display unit for displaying the physical properties of the process fluid in real time according to temperature and pressure.

In one embodiment, the process fluid is carbon dioxide (CO ₂ ), and the properties may include at least one of density, viscosity, thermal conductivity, diffusion coefficient, and specific heat.

In one embodiment, at least one of the temperature and pressure of the storage tank, the supply line, or the exhaust line, when the physical property value of the process fluid calculated by the processing unit is out of the property range of the supercritical state predetermined for the process fluid, And may further include a control unit for controlling one of them.

In one embodiment, the controller may generate an alarm or activate an interlock if the property of the process fluid deviates from an adjustable range that can be adjusted to a property range of the predetermined supercritical state .

In one embodiment, the processor computes the density of the process fluid from the pressure and temperature information using a Redlich-Kwong EoS or a Peng-Robinson EoS equation .

In one embodiment, the display may further display a supercritical region in which the process fluid corresponds to a supercritical phase.

In one embodiment, the alarm unit may further include an alarm unit for generating an alarm when the physical property value of the process fluid displayed on the display unit is displayed in an area other than the supercritical area.

A substrate processing apparatus according to an embodiment of the present invention includes a substrate processing unit in which a process of processing a substrate with a process fluid in a supercritical state is performed; A storage tank for storing the process fluid in the supercritical state; A process fluid supply unit including a supply line for supplying a supercritical process fluid to the substrate processing unit; A process fluid exhaust unit including an exhaust line for exhausting the process fluid from the substrate processing unit; And a monitoring unit for monitoring the phase of the process fluid, the monitoring unit comprising: a storage tank for storing the process fluid, a supply line for supplying the process fluid, or an exhaust line for exhausting the process fluid An information collecting unit for collecting temperature and pressure information; A processor for calculating a physical property value of the process fluid using the temperature and pressure information; And a display unit for displaying the physical properties of the process fluid in real time according to temperature and pressure.

In one embodiment, the process fluid is carbon dioxide (CO ₂ ), and the properties may include at least one of density, viscosity, thermal conductivity, diffusion coefficient, and specific heat.

In one embodiment, the temperature of the storage tank, the supply line, or the temperature of the exhaust line and the pressure of the exhaust line when the physical property value of the process fluid calculated by the processing unit deviates from the property value range of the supercritical state predetermined for the process fluid. And may further include a control unit for controlling at least one of the plurality of control units.

In one embodiment, the controller may generate an alarm or activate an interlock if the property of the process fluid deviates from an adjustable range that can be adjusted to a property range of the predetermined supercritical state .

In one embodiment, the processing unit may calculate the density of the process fluid from the pressure and temperature information using an Equation of State.

In one embodiment, the display may further display a supercritical region in which the process fluid corresponds to a supercritical phase.

In one embodiment, the alarm unit may further include an alarm unit for generating an alarm when the physical property value of the process fluid displayed on the display unit is displayed in an area other than the supercritical area.

A process fluid monitoring method according to an embodiment of the present invention is a method of monitoring a phase of a process fluid used for processing a substrate of a substrate processing apparatus comprising a storage tank for storing the process fluid, Storing temperature and pressure information collected from a supply line or an exhaust line exhausting the process fluid; Calculating a physical property of the process fluid using the temperature and pressure information; And outputting the physical property values of the process fluid through the display unit in real time according to temperature and pressure.

In one embodiment, adjusting at least one of the temperature and pressure of the storage tank, the supply line, or the exhaust line when the property of the process fluid is out of the property range of the supercritical state predetermined for the process fluid As shown in FIG.

In one embodiment, the method may further comprise generating an alarm or activating an interlock if the property of the process fluid deviates from an adjustable range that can be adjusted to the process fluid by the property range of the supercritical state have.

In one embodiment, the outputting through the display may further output a supercritical phase region corresponding to a supercritical phase of the process fluid.

In one embodiment, the method may further include generating an alarm when the physical property of the process fluid is output to a region other than the supercritical region.

According to an embodiment of the present invention, it is possible to monitor the phase change of the process fluid in real time in the process using the supercritical fluid.

According to an embodiment of the present invention, by calculating the physical property value of the process fluid in real time, when the physical property value deviates from the property range of the process fluid when it is in the normal property range, that is, in the supercritical state, .

The effects of the present invention are not limited to the effects described above. Unless stated, the effects will be apparent to those skilled in the art from the description and the accompanying drawings.

1 is a graph showing a phase change of carbon dioxide.
2 is a plan view of a substrate processing apparatus according to an embodiment of the present invention.
Figure 3 is a cross-sectional view of the first process chamber of Figure 2;
Figure 3 is a cross-sectional view of the second process chamber of Figure 2;
FIG. 4 is a diagram illustrating an example applied to the second process chamber of FIG. 2 as a substrate processing unit using a process fluid in a supercritical state according to an embodiment of the present invention.
5 is an exemplary block diagram of a process fluid monitoring apparatus in accordance with an embodiment of the present invention.
6 is an exemplary diagram illustrating a monitoring screen output through a display unit according to an embodiment of the present invention.
FIG. 7 is an exemplary diagram showing a monitoring screen in which a phase change of the process fluid is output in real time on the monitoring screen shown in FIG. 6. FIG.
8 is an exemplary flow chart illustrating a monitoring method in accordance with an embodiment of the present invention.

Other advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

Although not defined, all terms (including technical or scientific terms) used herein have the same meaning as commonly accepted by the generic art in the prior art to which this invention belongs. Terms defined by generic dictionaries may be interpreted to have the same meaning as in the related art and / or in the text of this application, and may be conceptualized or overly formalized, even if not expressly defined herein I will not. The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention.

In the present specification, the singular form includes plural forms unless otherwise specified in the specification. As used herein, the terms' comprise 'and / or various forms of use of the verb include, for example,' including, '' including, '' including, '' including, Steps, operations, and / or elements do not preclude the presence or addition of one or more other compositions, components, components, steps, operations, and / or components. Also, 'equipped' and 'possessed' should be interpreted in the same way.

The present invention relates to a monitoring apparatus and a monitoring method capable of real-time monitoring of a phase change of a process fluid used in a substrate processing apparatus, and an apparatus for monitoring a process fluid according to an embodiment of the present invention includes: An information collecting part for collecting temperature and pressure information from a tank, a supply line for supplying the process fluid or an exhaust line for exhausting the process fluid, a processing part for calculating the physical property value of the process fluid by using temperature and pressure information, May be displayed in real time according to temperature and pressure.

Hereinafter, a substrate drying apparatus will be described as an example of a substrate processing apparatus for processing a substrate using a supercritical fluid. However, this is for ease of explanation, and the substrate processing apparatus of the present invention can be applied to a substrate processing apparatus that performs a cleaning process or an etching process other than the drying process.

2 is a plan view of a substrate processing apparatus according to an embodiment of the present invention.

Referring to FIG. 2, the substrate processing apparatus 100 includes an index module 1000 and a processing module 2000.

The index module 1000 transfers the substrate S from the outside and transfers the substrate S to the process module 2000. The process module 2000 can perform the supercritical drying process.

The index module 1000 includes a load port 1100 and a transfer frame 1200 as an equipment front end module (EFEM).

The load port 1100 is provided with a container C in which the substrate S is accommodated. As the container C, a front opening unified pod (FOUP) may be used. The container C can be carried from the outside to the load port 1100 or taken out from the load port 1100 by an overhead transfer (OHT).

The transfer frame 1200 conveys the substrate S between the container C placed on the load port 1100 and the process module 2000. The transfer frame 1200 includes an index robot 1210 and an index rail 1220. The index robot 1210 moves on the index rail 1220 and can transport the substrate S. [

The process module 2000 includes a buffer chamber 2100, a transfer chamber 2200, a first process chamber 3000, and a second process chamber 4000 as a module for actually performing a process.

The buffer chamber 2100 provides a space for temporarily holding the substrate S conveyed between the index module 1000 and the processing module 2000. The buffer chamber 2100 may be provided with a buffer slot in which the substrate S is placed.

The transfer chamber 2200 carries the substrate S between the buffer chamber 2100, the first process chamber 3000 and the second process chamber 4000 disposed therearound. The transfer chamber 2200 may include a transfer robot 2210 and a transfer rail 2220. The transfer robot 2210 moves on the transfer rail 2220 and can transfer the substrate S.

The first process chamber 3000 and the second process chamber 4000 can perform a cleaning process. At this time, the cleaning process may be sequentially performed in the first process chamber 3000 and the second process chamber 4000. For example, in the first process chamber 3000, a chemical process, a rinsing process, and an organic solvent process may be performed in the cleaning process, and a supercritical drying process may be performed in the second process chamber 4000.

The first process chamber 3000 and the second process chamber 4000 are disposed on the side of the transfer chamber 2200. For example, the first process chamber 3000 and the second process chamber 4000 may be disposed on opposite sides of the transfer chamber 2200 to face each other.

In the process module 2000, a plurality of first process chambers 3000 and a plurality of second process chambers 4000 may be provided. The plurality of process chambers 3000 and 4000 may be arranged in a line on the side of the transfer chamber 2200, or may be stacked on top of each other, or a combination thereof.

Of course, the arrangement of the first process chamber 3000 and the second process chamber 4000 is not limited to the above example, and may be appropriately changed in consideration of various factors such as the footprint of the substrate processing apparatus 100, have. In one embodiment, the first process chamber 3000 may perform a chemical process, a rinsing process, and an organic solvent process. Of course, the first process chamber 3000 may selectively perform only some of these processes. The rinsing process is a process of rinsing the cleaning agent remaining on the substrate by providing a rinsing agent on the substrate, and the organic solvent process is a process of rinsing the substrate with an organic solvent Thereby replacing the rinsing agent remaining between the circuit patterns of the substrate with an organic solvent having a low surface tension.

Hereinafter, a second process chamber 4000 for performing a substrate drying process using a supercritical fluid will be described.

Figure 3 is a cross-sectional view of the second process chamber of Figure 2;

3, the second process chamber 4000 includes a housing 4100, an elevating member 4200, a supporting member 4300, a heating member 4400, a supply port 4500, a blocking member 4600, Port < / RTI >

The second process chamber 4000 may perform a supercritical drying process using a supercritical fluid. Of course, as described above, the process performed in the second process chamber 4000 may be a supercritical process other than the supercritical drying process, and further, the second process chamber 4000 may use another process fluid instead of the supercritical fluid May be used to perform the process.

The housing 4100 provides a space in which the supercritical drying process is performed. The housing 4100 is provided with a material capable of withstanding a high pressure exceeding a critical pressure.

The housing 4100 may be provided with an upper housing 4110 and a lower housing 4120 disposed below the upper housing 4110 to be divided into upper and lower portions.

The upper housing 4110 is fixed and the lower housing 4120 can be raised and lowered. When the lower housing 4120 is lowered and separated from the upper housing 4110, the inner space of the second process chamber 4000 is opened, the substrate S is carried into the inner space of the second process chamber 4000, . Here, the substrate S to be transferred to the second process chamber 4000 may be in a state where the organic solvent remains in the first process chamber 3000 through the organic solvent process. When the lower housing 4120 rises and comes into close contact with the upper housing 4110, the inner space of the second process chamber 4000 is sealed, and the supercritical drying process can be performed therein.

The elevating member 4200 moves the lower housing 4120 up and down. The elevating member 4200 may include a lifting cylinder 4210 and a lifting rod 4220. The lifting cylinder 4210 is coupled to the lower housing 4120 to generate a vertical driving force, that is, a lifting force. One end of the lifting rod 4220 is inserted into the lifting cylinder 4210 and extends vertically upward, and the other end is coupled to the upper housing 4110. When the driving force is generated in the lifting cylinder 4210 according to this structure, the lifting cylinder 4210 and the lifting rod 4220 are relatively lifted and the lower housing 4120 coupled to the lifting cylinder 4210 can be lifted and lowered.

The support member 4300 supports the substrate S between the upper housing 4110 and the lower housing 4120. The support member 4300 may be provided on the lower surface of the upper housing 4110 and extend vertically downward, and may be provided with a structure that is bent perpendicularly in the horizontal direction at the lower end thereof.

A horizontal adjustment member 4111 may be installed on the upper housing 4110 where the support member 4300 is installed. The horizontal adjustment member 4111 adjusts the horizontality of the upper housing 4110. When the horizontal degree of the upper housing 4110 is adjusted, the horizontal position of the substrate S mounted on the support member 4300 installed on the upper housing 4111 can be adjusted. In the supercritical drying process, when the substrate S is inclined, the organic solvent remaining on the substrate S flows along the inclined surface to dry or overdry a specific portion of the substrate S, . The horizontal adjustment member 4111 can align the substrate S to prevent this problem.

The heating member 4400 heats the interior of the second process chamber 4000. The heating member 4400 may heat the supercritical fluid supplied into the second process chamber 4000 to a supercritical fluid or to supercritical fluid if it is liquefied. The heating member 4400 may be embedded in the wall of at least one of the upper housing 4110 and the lower housing 4120. [ Such a heating member 4400 may be provided, for example, as a heater which receives power from the outside and generates heat.

The supply port 4500 supplies the supercritical fluid to the second process chamber 4000. The supply port 4500 may include an upper supply port 4510 and a lower supply port 4520. An upper supply port 4510 is formed in the upper housing 4110 to supply the supercritical fluid to the upper surface of the substrate S supported by the support member 4300. The lower supply port 4520 is formed in the lower housing 4120 and supplies the supercritical fluid to the lower surface of the substrate S supported by the support member 4300.

In the upper supply port 4510 and the lower supply port 4520, the lower supply port 4520 supplies the supercritical fluid first, and later the upper supply port 4510 supplies the supercritical fluid. Since the supercritical drying process can initially proceed in the state where the interior of the second process chamber 4000 is under the critical pressure, the supercritical fluid supplied into the second process chamber 4000 can be liquefied. Therefore, when a supercritical fluid is supplied to the upper supply port 4510 at an early stage of the supercritical drying process, the supercritical fluid may be liquefied and fall into the substrate S by gravity to damage the substrate S. The supercritical fluid is supplied to the second process chamber 4000 through the lower supply port 4520 to supply the supercritical fluid when the inner pressure of the second process chamber 4000 reaches the critical pressure. It is possible to prevent the supplied supercritical fluid from being liquefied and falling into the substrate S.

The blocking member 4600 blocks the supercritical fluid supplied through the supply port 4500 from being injected directly onto the substrate S. [ The blocking member 4600 may include a blocking plate 4610 and a support 4620.

When the supercritical fluid is supplied through the lower supply port 4520 at the initial stage of the supercritical drying process, the supercritical fluid supplied may be injected at a high rate because the internal pressure of the housing 4500 is low. When the supercritical fluid injected at such a high speed directly reaches the substrate S, the supercritical fluid is directly injected into the substrate S due to the physical pressure of the supercritical fluid, have. In addition, the substrate S may be pivoted by the jetting force of the supercritical fluid, and the organic solvent remaining on the substrate S may flow, thereby damaging the circuit pattern of the substrate S.

The blocking plate 4610 disposed between the lower supply port 4520 and the support member 4300 blocks the supercritical fluid from being injected directly onto the substrate S, S can be prevented from being damaged.

Alternatively, the blocking member 4600 may not be included in the second process chamber 4000.

The exhaust port 4700 exhausts the supercritical fluid from the second process chamber 4000.

The exhaust port 4700 may be formed in the lower housing 4120. In the latter stage of the supercritical drying process, the supercritical fluid is exhausted from the second process chamber 4000 and its internal pressure is lowered to a critical pressure or less, so that the supercritical fluid can be liquefied. The liquefied supercritical fluid can be discharged through the exhaust port 4700 formed in the lower housing 4120 by gravity.

Hereinafter, a substrate drying apparatus in which a supercritical fluid is supplied and discharged according to an embodiment of the present invention will be described. Figure 4 is a diagram of one embodiment of a substrate drying apparatus in which the supply and exhaust lines of process fluid are connected to the second process chamber of Figure 2;

4, the supercritical fluid is supplied into the housing 4100 of the second process chamber 4000 through the supply line 4800 and flows through the exhaust line 4910 into the housing of the second process chamber 4000 (4100).

The supply line 4800 includes a forward supply line 4880 and a back supply line 4890, 4891 and 4892, a first supply line 4810 and a second supply line 4820.

One end of the front supply line 4880 is connected to the storage tank 4850 and one end of the first and second rear supply lines 4891 and 4892 is connected to the second process chamber 4000. The first supply line 4810 and the second supply line 4820 are connected in parallel to each other and connect the front supply line 4880 and the rear supply line 4890.

The front supply line 4880 connects the storage tank 4850 to the first supply line 4810 and the second supply line 4820. One end of the front supply line 4880 is connected to the storage tank 4850 and the other end of the front supply line 4880 is connected to the branch point of the first supply line 4810 and the second supply line 4820 connected in parallel . The supercritical fluid is moved from the storage tank 4850 to the bifurcation point of the first supply line 4810 and the second supply line 4820 via the forward supply line 4880.

The first supply line 4810 and the second supply line 4820 are connected in parallel with each other. A forward supply line 4880 is connected to a branch point of the one end, and a backward supply line 4890 is connected to a branch point of the other end.

The first supply line 4810 includes a first opening / closing valve 4810a and a first flow valve 4810b. The first opening / closing valve 4810a controls whether the supercritical fluid moved in the front supply line 4880 is moved to the first supply line 4810. [ The first flow valve 4810b regulates the flow rate of the supercritical fluid to be transferred to the first supply line 4810. The first flow valve 4810b controls the pressure of the supercritical fluid flowing into the second process chamber 4000 by moving the supercritical fluid to a predetermined flow rate.

The second supply line 4820 includes a second open / close valve 4820a and a second flow valve 4820b. The second opening / closing valve 4820a controls whether or not the supercritical fluid moved in the front supply line 4880 is moved to the second supply line 4820. [ The second flow valve 4820b regulates the flow rate of the supercritical fluid to be transferred to the second supply line 4820. The second flow valve 4820b moves the supercritical fluid at a predetermined flow rate to regulate the pressure of supercritical fluid flowing into the second process chamber 4000. The second flow valve 4820b and the first flow valve 4810b are provided so that the flow rates of the supercritical fluid moving through the first supply line 4810 and the second supply line 4820 are set to be different. According to one example, the second supply flow rate is provided so as to be larger than the first supply flow rate.

The supercritical fluid introduced into the second process chamber 4000 at the beginning of the supply process of the supercritical fluid is supplied through the first supply line 4810. Since the flow rate of the supercritical fluid to be transferred to the first supply line 4810 is less than that of the second supply line 4820, the initial pressure of the supercritical fluid is formed low in the second process chamber 4000. Therefore, particles can be prevented from being generated in the second process chamber 4000. In addition, it is possible to prevent the substrate S from being damaged due to the initial pressing of the supercritical fluid. When the supercritical fluid is supplied through the first supply line 4810 and the interior of the second process chamber 4000 reaches a predetermined pressure, a supercritical fluid is supplied in a large amount through the second supply line 4820. As a result, the process time can be shortened and the process efficiency can be improved.

The back feed lines 4890, 4891 and 4892 supply supercritical fluid, which is moved at a different flow rate through the first feed line 4810 and the second feed line 4820, into the second process chamber 4000. The back feed line 4890 includes a first back feed line 4891 connected to the top of the second process chamber 4000 and a second back feed line 4892 connected to the bottom of the second process chamber 4000. According to one example, when the substrate S is located on the upper side of the second process chamber 4000, the supercritical fluid moved in the first supply line 4810 flows through the second rear supply line 4892 to the second And is provided below the process chamber 4000. This is to prevent the breakage of the substrate S due to the initial pressurization by supplying the supercritical fluid to the lower supply port 4520 far from the substrate S at the initial stage of supplying the supercritical fluid. Accordingly, when the supercritical fluid is supplied through the second rear supply line 4892 and reaches a predetermined pressure, it is possible to supply the supercritical fluid in a large amount through the first rear supply line 4891. [

One end of the exhaust line 4910 is connected to the second process chamber 4000, and the supercritical fluid is exhausted to the outside through the first exhaust line 4910. The first exhaust line 4910 includes a first opening / closing valve 4910a, a first flow valve 4910b, and a first check valve 4910c. The first opening / closing valve 4910a controls whether the supercritical fluid moved in the front exhaust line 4980 is moved to the first exhaust line 4910. The first flow valve 4910b regulates the flow rate of the supercritical fluid to be transferred to the first exhaust line 4910. The first flow valve 4910b moves the supercritical fluid to a predetermined first exhaust flow rate to regulate the pressure of the supercritical fluid exhausted from the second process chamber 4000. [ The first check valve 4910c causes the supercritical fluid to be moved only in the direction in which it is released to the atmosphere in the second process chamber 4000. [

5 is an exemplary block diagram of a process fluid monitoring apparatus in accordance with an embodiment of the present invention.

5, a process fluid monitoring apparatus according to an embodiment of the present invention includes an information collecting unit 6100, a CPU 6200, a processing unit 6300, a storage unit 6400, a control unit 6500, (6700).

The information collecting unit 6100 may collect temperature and pressure information from all the areas where temperature and pressure can be measured through a meter provided in the substrate processing apparatus. In one embodiment, the information collection unit may collect temperature and pressure information from a storage tank that stores process fluid (6100), a feed line that supplies process fluid, or an exhaust line that exhausts process fluid. As an example, temperature and pressure information can be collected in real time from the temperature sensor and the pressure sensor installed in the storage tank 4850, the front supply line 4880, the first exhaust line 4910 shown in FIG.

The CPU 6200 can perform a function of controlling the signal flow between the overall operation such as power supply control of the monitoring device and the internal configuration of the monitoring device. The processing unit 6300, the control unit 6500, and the storage unit 6400 of the monitoring device may logically or functionally classify the functions of the CPU 6200, which is the central processing unit. Accordingly, the CPU 6200 and the processing unit 6300, the storage unit 6400, or the control unit 6500 may be configured as a single module.

The processing unit 6300 can calculate the physical property of the process fluid using the temperature and pressure information collected from the information collection unit 6100. By way of example, the process fluid may be carbon dioxide, and the properties may include at least one of density, viscosity, thermal conductivity, diffusion coefficient, and specific heat of the process fluid.

In one embodiment, the processing portion 6300 may calculate the density value of carbon dioxide in real time from temperature and pressure information if the process fluid is carbon dioxide. In one embodiment, state equations can be used to calculate density values from temperature and pressure information, and the state equations include the Peng-Robinson EoS, Redlich-Kwong EoS, . ≪ / RTI > However, the present invention is not limited to this, and may include all state equations capable of calculating density values from temperature and pressure information. In order to calculate the property value of the process fluid, the REFPROP Database or DDB (Dortmund Data Bank) database of NIST (US National Institute of Standards and Technology) or the like, or the relationship of the property values according to the temperature and pressure information of the process fluid .

In one embodiment, the calculation of the density value can be calculated and calculated according to the order of Equation (2) to calculate Equation 1, which is the Peng-Robinson EoS equation, and Z, .

Where P is the pressure, T is the temperature, P _cr is the critical pressure of carbon dioxide, and T _cr is the critical temperature of carbon dioxide.

However, the method of calculating the property values of the process fluid is not limited to that calculated by the above-described Peng-Robinson state equations, and can be calculated using other state equations.

The storage unit 6400 may store the temperature and pressure information collected by the information collection unit 6100 and may store state equations and algorithms for calculating the properties of the process fluid from the temperature and pressure information, The process fluid can store a supercritical state property range corresponding to a supercritical state. The property information calculated by the processing unit 6300 may be stored together with the temperature and pressure information.

The control unit 6500 controls at least one of the temperature and the pressure of the storage tank, the supply line, or the exhaust line when the property of the process fluid calculated by the processing unit 6300 is out of the predetermined supercritical property range for the process fluid . In one embodiment, the range of property values for which the process fluid is supercritical to any temperature and pressure value may be stored in advance in storage 6400 and the property values calculated according to the measured temperature and pressure The control unit 6500 can control so that at least one of temperature and pressure of the storage tank, the supply line, or the exhaust line in which temperature and pressure are measured is controlled . In another embodiment, the control unit 6500 determines whether the property value calculated in the processing unit 6300 is an adjustable range that can be adjusted to a supercritical property range. If the temperature is within the adjustable range, And the temperature or pressure of the storage tank, the supply line, or the exhaust line where the pressure information is collected can be controlled, and an alarm can be generated or an interlock can be activated when the temperature is out of the adjustable range.

The display unit 6700 can display the property values calculated by the processing unit 6300 in real time on a graph of temperature and pressure. The display unit 6700 may further display a supercritical region on the monitoring screen as the supercritical state property range stored in the storage unit 6400. [ In this case, when the property value displayed in real time is displayed in an area outside the supercritical area of the monitoring screen, an alarm may be generated or the screen may be blinked.

6 is an exemplary diagram illustrating a monitoring screen output through a display unit according to an embodiment of the present invention.

As shown in FIG. 6, the monitoring screen can display a graph in which physical properties are displayed according to pressure and temperature. Further, a region where the value of the physical property depending on the pressure and the temperature becomes the supercritical state can be further displayed as the supercritical region 6750. Accordingly, it is possible to visualize in real time whether or not the measured process fluid is in a supercritical state.

FIG. 7 is an exemplary view showing a monitoring screen in which the physical property value of the process fluid is output in real time on the monitoring screen shown in FIG.

As shown in Figure 7, the calculated property values of the process fluid can be displayed in real time over time in x ₁ , x ₂ , x ₃ , x ₄ . That is, when the physical property value is displayed in real time, the change of the phase of the process fluid can be confirmed at a glance. When the output is outputted to the region outside the supercritical region 6750, As an example, temperature or pressure can be monitored. If an indication of real-time property values such as x ₁ , x ₂ , x ₃ , and x ₄ is output to an area other than the supercritical area 6750, an alarm is generated to notify the user that the abnormal process is activated, The process can be interrupted by activating the interlock.

8 is an exemplary flow chart illustrating a monitoring method in accordance with an embodiment of the present invention.

As shown in Figure 8, a method for monitoring a process fluid phase according to an embodiment of the present invention includes a storage tank for storing a process fluid, a supply line for supplying process fluid, A step S620 of calculating the physical property values of the process fluid using the temperature and pressure information and a step S640 of outputting the physical property values through display in real time in accordance with the temperature and the pressure, .

As an example, the step S630 may further include determining whether the property value calculated in step S620 is within a predetermined supercritical state property range (S630). Accordingly, if it is determined that the physical property value of the supercritical state is within the range, the physical property value can be outputted through the display unit in real time according to the temperature and the pressure (S640). If it is determined in step S630 that the physical property value of the supercritical state deviates from the supercritical state, at least one of temperature and pressure of the storage tank, the supply line, or the exhaust line of the process fluid in which the temperature and pressure information is collected (Step S632).

If it is determined in step S630 that the physical property range of the supercritical state is exceeded, the step S631 may further include determining whether the calculated physical property value is within a range that can be adjusted to the physical property range of the supercritical state (S631) . By way of example, the adjustable range can be preset according to the temperature and pressure adjustable range of the storage tank, the supply line, or the exhaust line from which temperature and pressure information is collected. Accordingly, if it is determined that the calculated property values fall within the adjustable range of the property value range of the supercritical state, at least one of temperature and pressure of the storage tank, the supply line, or the exhaust line is adjusted (S632) And generating an alarm or activating an interlock (S633) if it is not applicable.

It is to be understood that the above-described embodiments are provided to facilitate understanding of the present invention, and do not limit the scope of the present invention, and it is to be understood that various modifications are possible within the scope of the present invention. It is to be understood that the technical scope of the present invention should be determined by the technical idea of the claims and the technical scope of protection of the present invention is not limited to the literary description of the claims, To the invention of the invention.

Claims (20)

A monitoring apparatus for monitoring a phase of a process fluid used in a substrate processing process of a substrate processing apparatus,
An information collecting unit for collecting temperature and pressure information from a storage tank for storing the process fluid, a supply line for supplying the process fluid or an exhaust line for exhausting the process fluid;
A processor for calculating a physical property value of the process fluid using the temperature and pressure information; And
And a display unit for displaying the physical properties of the process fluid in real time according to temperature and pressure. The method according to claim 1,
The process fluid is carbon dioxide (CO ₂ )
Wherein the property values include at least one of density, viscosity, thermal conductivity, diffusion coefficient, and specific heat. The method according to claim 1,
And a control unit for controlling at least one of temperature and pressure of the storage tank, the supply line, or the exhaust line when the property value of the process fluid calculated by the processing unit is out of a predetermined supercritical state property range for the process fluid. Wherein the process fluid monitoring device further comprises: The method of claim 3,
Wherein the controller generates an alarm or activates an interlock when the property of the process fluid deviates from an adjustable range that can be adjusted to a property range of the predetermined supercritical state. The method according to claim 1,
Wherein the processor calculates the density of the process fluid from the pressure and temperature information using an Equation of State. The method according to claim 1,
Wherein the display further displays a supercritical region where the process fluid corresponds to a supercritical phase. The method according to claim 6,
And an alarm unit for generating an alarm when the physical property value of the process fluid displayed on the display unit is displayed in an area outside the supercritical area. The method according to claim 6,
Wherein,
And activating an interlock when the property of the process fluid displayed on the display is displayed in an area outside the supercritical area. A substrate processing unit in which a process of processing a substrate with a process fluid in a supercritical state is performed;
A storage tank for storing the process fluid in the supercritical state;
A process fluid supply unit including a supply line for supplying a supercritical process fluid to the substrate processing unit;
A process fluid exhaust unit including an exhaust line for exhausting the process fluid from the substrate processing unit; And
And a monitoring unit for monitoring the phase of the process fluid,
The monitoring unit comprises:
An information collecting unit for collecting temperature and pressure information from a storage tank for storing the process fluid, a supply line for supplying the process fluid or an exhaust line for exhausting the process fluid;
A processor for calculating a physical property value of the process fluid using the temperature and pressure information; And
And a display unit for displaying the physical properties of the process fluid in real time according to temperature and pressure. 10. The method of claim 9,
The process fluid is carbon dioxide (CO ₂ )
Wherein the physical properties include at least one of density, viscosity, thermal conductivity, diffusion coefficient, and specific heat. 10. The method of claim 9,
And a control unit for controlling at least one of temperature and pressure of the storage tank, the supply line, or the exhaust line when the property value of the process fluid calculated by the processing unit is out of a predetermined supercritical state property range for the process fluid. Wherein the substrate processing apparatus further comprises: 11. The method of claim 10,
Wherein the controller generates an alarm or activates an interlock when the property of the process fluid deviates from an adjustable range that can be adjusted to a property range of the predetermined supercritical state. 10. The method of claim 9,
Wherein the processing unit calculates the density of the process fluid from the pressure and temperature information using Equation of State. 10. The method of claim 9,
Wherein the display further displays a supercritical region where the process fluid corresponds to a supercritical phase. 15. The method of claim 14,
And an alarm unit for generating an alarm when the physical property value of the process fluid displayed on the display unit is displayed in an area outside the supercritical area. A method of monitoring a phase of a process fluid used in a substrate process of a substrate processing apparatus,
Storing a temperature and pressure information collected from a storage tank for storing the process fluid, a supply line for supplying the process fluid, or an exhaust line for exhausting the process fluid;
Calculating a physical property of the process fluid using the temperature and pressure information; And
And outputting the physical property values of the process fluid through a display unit in real time according to temperature and pressure. 17. The method of claim 16,
Further comprising adjusting at least one of a temperature and a pressure of the storage tank, the supply line, or the exhaust line when the property of the process fluid deviates from a predetermined supercritical state property range for the process fluid. How to monitor. 18. The method of claim 17,
Further comprising activating an alarm or activating an interlock when the property of the process fluid deviates from an adjustable range that can be adjusted to the process fluid by the property of the supercritical state. 17. The method of claim 16,
Wherein the outputting through the display unit comprises:
Wherein the process fluid further outputs a supercritical region corresponding to a supercritical phase. 20. The method of claim 19,
And generating an alarm when the property of the process fluid is output to a region outside the supercritical region.

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