KR20150077523A - Unit for supplying chemical - Google Patents

Abstract

The present invention is to provide a device for supplying processing liquid to a substrate and a method thereof. A processing liquid supplying unit comprises: a nozzle; a processing liquid supplying line to connect a processing tank and the nozzle to supply a processing liquid provided to the processing tank to the nozzle; and a flow rate control member to control the flow rate of the processing liquid so the flow rate of the processing liquid corresponds to a predetermined flow rate value by being installed on the processing liquid supplying line. The flow rate control member comprises: a temperature measuring sensor to measure the temperature of the processing liquid; a flow rate control valve to control the flow rate of the processing liquid; and a controller to control the opening ratio of the flow rate control valve. The controller provides different opening ratios for each temperature measuring value provided from the temperature measuring sensor. Accordingly, it is controlled that the supply flow rate corresponds to a predetermined flow rate because more flow rates are supplied than a measured flow rate of the processing liquid when a light temperature processing liquid is used.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001]

The present invention relates to an apparatus and a method for liquid-treating a substrate, and more particularly to an apparatus and a method for supplying a processing liquid.

In order to manufacture semiconductor devices or liquid crystal displays, various processes such as photolithography, etching, ashing, ion implantation, and thin film deposition are performed on the substrate. Before or after such a process, a cleaning process is performed to clean the substrate to remove contaminants and particles generated in each process.

The cleaning process is a process for removing contaminants and particles adhered on a substrate by supplying a chemical on the substrate. These processes are provided differently depending on the type of the chemical and the substrate, and the temperature of the chemical depending on the cleaning purpose. Therefore, the volume of the chemical according to the temperature is changed differently by the thermal expansion, and the density is provided differently depending on the temperature. 1 is a cross-sectional view showing a general treatment liquid supply apparatus. Referring to Fig. 1, the flow rate control valve 4 is adjusted so that the flow rate of the process liquid supplied from the process liquid supply source is measured by the flow rate meter 2, and supplied at a predetermined flow rate.

However, the higher the temperature of the treatment liquid, the greater the difference between the measured flow rate and the actual flow rate. This is because the volume of the processing liquid increases as the processing liquid is thermally expanded, and an error occurs between the measured flow rate and the actual flow rate. In addition, the flow meter 2 is thermally deformed by a high-temperature chemical and a measurement error is generated.

The present invention seeks to provide an apparatus and a method that can more accurately supply a flow rate of a treatment liquid.

Another object of the present invention is to provide an apparatus and method capable of minimizing the occurrence of a measurement error of the flow rate depending on the temperature of the treatment liquid.

Another object of the present invention is to provide an apparatus and a method for minimizing the occurrence of errors in the measurement of the flow rate of the treatment liquid due to the thermal deformation of the flow rate measuring apparatus by the treatment liquid at a high temperature.

An embodiment of the present invention provides an apparatus and a method for supplying a treatment liquid onto a substrate. Wherein the processing liquid supply unit includes a nozzle, a processing liquid supply line connecting the processing tank and the nozzle to supply the processing liquid supplied to the processing tank to the nozzle, and a processing liquid supply line provided on the processing liquid supply line, And a flow rate regulating member for regulating a flow rate of the process liquid so as to match a predetermined flow rate value, wherein the flow rate regulating member includes a temperature measuring sensor for measuring a temperature of the process liquid, a flow rate regulating valve And a controller for controlling an opening rate of the flow control valve, wherein the controller provides the opening rate differently for the temperature measurement value provided from the temperature measurement sensor.

Wherein the controller comprises: a data storage unit for storing data on a plurality of flow set values corresponding to each of the plurality of reference temperature values; and a data storage unit for storing data on a reference temperature value corresponding to the temperature measurement value among the plurality of reference temperature values And a data processing unit for adjusting the opening ratio based on the received data.

Alternatively, the flow rate regulating member may further include a flow rate measuring sensor for measuring a flow rate of the process liquid, wherein the controller calculates data on the flow rate of the process liquid based on a difference value between the reference temperature value and the temperature measurement value And a data processor for controlling the opening rate so that the flow rate measurement value provided from the flow rate sensor is added or subtracted based on the data.

The controller can increase the opening ratio as the temperature of the processing liquid is higher than the room temperature.

Wherein the flow rate regulating member further comprises an open / close valve for opening / closing the process liquid supply line so as to be positioned between the flow rate regulating valve and the nozzle on the process liquid supply line, and a sensor for measuring an abnormality of the flow rate regulating valve, The control unit may adjust the open / close valve so that the process liquid supply line is closed when the detection information is received from the detection sensor.

The substrate processing apparatus includes a substrate holding unit for holding a substrate, and a processing liquid supply unit for supplying the processing liquid onto a substrate supported by the substrate holding unit, wherein the processing liquid supply unit includes a nozzle, a processing liquid supplied to the processing tank A processing liquid supply line that connects the processing tank and the nozzle to supply the processing liquid to the nozzle and a processing liquid supply line which is provided on the processing liquid supply line and controls the flow rate of the processing liquid so that the flow rate of the processing liquid coincides with the predetermined flow rate value Wherein the flow rate regulating member includes a temperature measuring sensor for measuring a temperature of the process liquid, a flow rate control valve for controlling a flow rate of the process liquid, and a controller for controlling an opening rate of the flow rate control valve Wherein the controller provides the opening rate differently for a temperature measurement value provided from the temperature measurement sensor.

Wherein the controller comprises: a data storage unit for storing data on a plurality of flow set values corresponding to each of the plurality of reference temperature values; and a data storage unit for storing data on a reference temperature value corresponding to the temperature measurement value among the plurality of reference temperature values And a data processing unit for adjusting the opening ratio based on the received data.

The flow rate control member may further include a flow rate measuring sensor for measuring a flow rate of the process liquid, and the controller calculates data on the flow rate of the process liquid based on a difference value between the reference temperature value and the temperature measurement value And a data processing unit for adjusting the opening rate so that the flow rate measurement value provided from the flow rate measuring sensor is added or subtracted based on the data.

A method for controlling a flow rate of a process liquid supplied to a substrate includes supplying a process liquid through a process liquid supply line provided with a flow rate control valve, based on data of the temperature of the process liquid and an opening rate of the flow rate control valve The flow rate of the treatment liquid is adjusted.

Wherein the data is a plurality of flow rate setting values corresponding to each of a plurality of reference temperature values, and the adjustment of the flow rate of the process liquid is based on a flow rate setting value corresponding to a temperature of the process liquid among the reference temperature values. The opening rate can be adjusted. Wherein the data is an additional flow rate value based on a difference between the reference temperature and the temperature of the treatment liquid, and the adjustment of the flow rate of the treatment liquid is performed by adjusting the flow rate of the treatment liquid, The opening rate can be adjusted.

The temperature of the treatment liquid may be higher than the normal temperature. The higher the temperature of the treatment liquid is, the larger the opening rate can be provided.

According to the embodiment of the present invention, when the high-temperature treatment liquid is used, the supply flow rate can be adjusted to a predetermined flow rate by supplying more flow rate than the measurement flow rate of the treatment liquid.

Further, according to the embodiment of the present invention, the error range generated by thermal deformation of the flow measurement sensor when using the high-temperature treatment liquid is calculated as the difference between the measurement temperature of the treatment liquid and the preset temperature, Can be measured more accurately.

According to the embodiment of the present invention, when the high-temperature treatment liquid is used, the flow rate of the treatment liquid can be accurately supplied by controlling the opening rate of the flow control valve based on the data corresponding to the measurement temperature of the treatment liquid.

1 is a cross-sectional view showing a general treatment liquid supply apparatus.
2 is a plan view showing a substrate processing apparatus according to an embodiment of the present invention.
3 is a cross-sectional view showing the substrate processing apparatus of FIG.
Fig. 4 is a sectional view showing the treatment liquid supply member of Fig. 3; Fig.
5 is a sectional view showing the flow rate adjusting member of FIG.
6 is a view showing the data storage unit of FIG.
7 is a block diagram showing a process of supplying a process liquid using the flow rate control member of FIG.

The embodiments of the present invention can be modified into various forms and the scope of the present invention should not be interpreted as being limited by the embodiments described below. The present embodiments are provided to enable those skilled in the art to more fully understand the present invention. Accordingly, the shapes of the components and the like in the drawings are exaggerated in order to emphasize a clearer description.

In this embodiment, an apparatus for cleaning a substrate with a high-temperature treatment liquid will be described. However, the present embodiment is not limited to this, and can be applied to various processes such as an etching process using a high-temperature treatment liquid.

Hereinafter, an example of the present invention will be described in detail with reference to FIG. 2 to FIG.

2 is a plan view showing a substrate processing apparatus according to an embodiment of the present invention. Referring to FIG. 2, the substrate processing apparatus 1 has an index module 10 and a process processing module 20. The index module 10 has a load port 120 and a transfer frame 140. The load port 120, the transfer frame 140, and the process module 20 are sequentially arranged in a line. The direction in which the load port 120, the transfer frame 140 and the processing module 20 are arranged is referred to as a first direction 12 and a direction perpendicular to the first direction 12 Direction is referred to as a second direction 14 and a direction perpendicular to the plane including the first direction 12 and the second direction 14 is referred to as a third direction 16. [

The carrier 130 in which the substrate W is accommodated is seated in the load port 140. A plurality of load ports 120 are provided, and they are arranged in a line along the second direction 14. The number of load ports 120 may increase or decrease depending on the process efficiency and footprint conditions of the process module 20 and the like. A plurality of slots (not shown) are formed in the carrier 130 for accommodating the substrates W horizontally with respect to the paper surface. As the carrier 130, a front opening unified pod (FOUP) may be used.

The process module 20 has a buffer unit 220, a transfer chamber 240, and a process chamber 260. The transfer chamber 240 is disposed such that its longitudinal direction is parallel to the first direction 12. The substrate processing units 300a and 260 are disposed on both sides of the transfer chamber 240, respectively. At one side and the other side of the transfer chamber 240, the substrate processing units 300a and 260 are provided to be symmetrical with respect to the transfer chamber 240. On one side of the transfer chamber 240, a plurality of substrate processing units 300a and 260 are provided. Some of the process chambers 260 are disposed along the longitudinal direction of the transfer chamber 240. In addition, some of the process chambers 260 are stacked together. That is, at one side of the transfer chamber 240, the process chambers 260 may be arranged in an array of A X B. Where A is the number of process chambers 260 provided in a row along the first direction 12 and B is the number of process chambers 260 provided in a row along the third direction 16. When four or six process chambers 260 are provided on one side of the transfer chamber 240, the process chambers 260 may be arranged in an array of 2 X 2 or 3 X 2. The number of process chambers 260 may increase or decrease. Unlike the above, the process chamber 260 may be provided only on one side of the transfer chamber 240. In addition, the process chamber 260 may be provided as a single layer on one side and on both sides of the transfer chamber 240.

The buffer unit 220 is disposed between the transfer frame 140 and the transfer chamber 240. The buffer unit 220 provides a space for the substrate W to stay before the transfer of the substrate W between the transfer chamber 240 and the transfer frame 140. [ In the buffer unit 220, a slot (not shown) in which the substrate W is placed is provided. A plurality of slots (not shown) are provided to be spaced along the third direction 16 from each other. The buffer unit 220 is opened on the side facing the transfer frame 140 and on the side facing the transfer chamber 240.

The transfer frame 140 transfers the substrate W between the buffer unit 220 and the carrier 130 that is seated on the load port 120. The transfer frame 140 is provided with an index rail 142 and an index robot 144. The index rail 142 is provided so that its longitudinal direction is parallel to the second direction 14. The index robot 144 is installed on the index rail 142 and is linearly moved along the index rail 142 in the second direction 14. The index robot 144 has a base 144a, a body 144b, and an index arm 144c. The base 144a is installed so as to be movable along the index rail 142. The body 144b is coupled to the base 144a. The body 144b is provided to be movable along the third direction 16 on the base 144a. Also, the body 144b is provided to be rotatable on the base 144a. The index arm 144c is coupled to the body 144b and is provided to be movable forward and backward relative to the body 144b. A plurality of index arms 144c are provided and each is provided to be individually driven. The index arms 144c are stacked in a state of being spaced from each other along the third direction 16. Some of the index arms 144c are used to transfer the substrate W from the processing module 20 to the carrier 130 and another portion of the index arms 144c from the carrier 130 to the processing module 20, ). ≪ / RTI > This can prevent the particles generated from the substrate W before the process processing from adhering to the substrate W after the process processing in the process of loading and unloading the substrate W by the index robot 144. [

The transfer chamber 240 transfers the substrate W between the buffer unit 220 and the process chamber 260 and between the process chambers 260. The transfer chamber 240 is provided with a guide rail 242 and a main robot 244. The guide rails 242 are arranged so that their longitudinal directions are parallel to the first direction 12. The main robot 244 is installed on the guide rails 242 and is linearly moved along the first direction 12 on the guide rails 242. The main robot 244 has a base 244a, a body 244b, and a main arm 244c. The base 244a is installed so as to be movable along the guide rail 242. The body 244b is coupled to the base 244a. The body 244b is provided to be movable along the third direction 16 on the base 244a. Body 244b is also provided to be rotatable on base 244a. The main arm 244c is coupled to the body 244b, which is provided for forward and backward movement relative to the body 244b. A plurality of main arms 244c are provided and each is provided to be individually driven. The main arms 244c are stacked in a state of being spaced from each other along the third direction 16.

The process chamber 260 is provided with a substrate processing apparatus 300 for performing a cleaning process on the substrate W. The substrate processing apparatus 300 may have a different structure depending on the type of the cleaning process to be performed. The substrate processing apparatus 300 in each process processing chamber 260 may have the same structure. Optionally, the process chambers 260 are divided into a plurality of groups such that the substrate processing apparatuses 300 in the process chambers 260 belonging to the same group are identical to one another, (300) may be provided differently from each other.

3 is a cross-sectional view showing the substrate processing apparatus of FIG. 3, the substrate processing apparatus 300 includes a housing 320, a spin head 340, a lift unit 360, and a process liquid supply unit 380. The housing 320 has a cylindrical shape with an open top. The housing 320 has an inner recovery cylinder 322 and an outer recovery cylinder 326. Each of the recovery cylinders 322 and 326 recovers different chemical fluids among the chemical fluids used in the process. The inner recovery cylinder 322 is provided in an annular ring shape surrounding the spin head 340 and the outer recovery cylinder 326 is provided in an annular ring shape surrounding the inner recovery cylinder 326. The inner space 322a of the inner recovery cylinder 322 and the space 326a between the inner recovery cylinder 322 and the outer recovery cylinder 326 are connected to the inner recovery cylinder 322 and the outer recovery cylinder 326, And serves as an inflow port. According to one example, each inlet may be located at a different height from each other. Collection lines 322b and 326b are connected under the bottom of each of the collection bins 322 and 326. The chemical liquids flowing into the respective recovery cylinders 322 and 326 can be supplied to an external chemical liquid recovery system (not shown) through the recovery lines 322b and 326b and can be reused.

The spin head 340 supports the substrate W and rotates the substrate W during the process. The spin head 340 has a body 342, a support pin 344, a chuck pin 346, and a support shaft 348. The body 342 has a top surface that is generally circular when viewed from the top. A supporting shaft 348 rotatable by a driving unit 349 is fixedly coupled to the bottom surface of the body 342. [

A plurality of support pins 344 are provided. The support pins 344 are spaced apart from the edge of the upper surface of the body 342 and protrude upward from the body 342. The support pins 344 are arranged so as to have a generally annular ring shape in combination with each other. The support pins 344 support the rear edge of the substrate W such that the substrate W is spaced from the upper surface of the body 342 by a predetermined distance.

A plurality of the chuck pins 346 are provided. The chuck pin 346 is disposed farther away from the center of the body 342 than the support pin 344. The chuck pin 346 is provided to protrude upward from the body 342. The chuck pin 346 supports the side of the substrate W so that the substrate W is not laterally displaced in place when the spin head 340 is rotated. The chuck pin 346 is provided to allow linear movement between the standby position and the support position along the radial direction of the body 342. The standby position is a distance from the center of the body 342 relative to the support position. The chuck pin 346 is positioned in the standby position when the substrate W is loaded or unloaded onto the spin head 340 and the chuck pin 346 is positioned in the supporting position when the substrate W is being processed. At the support position, the chuck pin 346 contacts the side of the substrate W.

The lifting unit 360 moves the housing 320 linearly in the vertical direction. The relative height of the housing 320 with respect to the spin head 340 is changed as the housing 320 is moved up and down. The lifting unit 360 has a bracket 362, a moving shaft 364, and a driver 366. The bracket 362 is fixed to the outer wall of the housing 320 and the bracket 362 is fixedly coupled to the moving shaft 364 which is moved up and down by the actuator 366. The housing 320 is lowered so that the spin head 340 protrudes to the upper portion of the housing 320 when the substrate W is placed on the spin head 340 or lifted from the spin head 340. In addition, the height of the housing 320 may be adjusted so that the chemical solution may flow into the predetermined recovery container 360 according to the type of the chemical solution supplied to the substrate W when the process is performed. Alternatively, the lifting unit 360 can move the spin head 340 in the vertical direction.

The treatment liquid supply units 380 and 400 include a jetting member 380 and a treatment liquid supply member 400. The ejection member 380 ejects the processing solutions onto the substrate W. [ The injection member 380 may be provided in plural. Each injection member 380 includes a support shaft 386, a support 382, and a nozzle 390. The support shaft 386 is disposed on one side of the housing 320. The support shaft 386 has a rod shape whose longitudinal direction is provided in a vertical direction. The support shaft 386 is rotatable and liftable by the drive member 388. Alternatively, the support shaft 386 can linearly move and move up and down in the horizontal direction by the drive member 388. Support base 382 supports nozzle 390. The support stand 382 is coupled to the support shaft 386, and the nozzle 390 is fixedly coupled to the bottom end surface. The nozzle 390 can be swung by the rotation of the support shaft 386. According to one example, the treatment liquid may be a chemical. The chemical may include sulfuric acid (H ₂ SO ₃ ).

The treatment liquid supply member 400 supplies the treatment liquid of the predetermined flow rate to the nozzle 390. [ Fig. 4 is a sectional view showing the treatment liquid supply member of Fig. 3; Fig. Referring to FIG. 4, the treatment liquid supply member 400 includes a treatment tank, a treatment liquid supply line 420, and a flow control member 430. The treatment liquid supplied to the treatment tank is supplied to the nozzle 390 through the treatment liquid supply line 420. The flow rate regulating member 430 regulates the flow rate of the treatment liquid so that the flow rate of the treatment liquid is supplied at a predetermined flow rate.

The treatment tank includes a first tank 411, a second tank 412, a circulation line 414, and a heater 416. Each of the first tank 411 and the second tank 412 is provided to have the same shape as each other. Each of the first tank 411 and the second tank 412 provides a storage space for storing the processing liquid therein. The circulation line 414 circulates the treatment liquid supplied to each of the first tank 411 and the second tank 412. According to one example, the treatment liquid provided in the first tank 411 and the treatment liquid provided in the second tank 412 can all be provided in the same chemical. The treatment liquid supplied to the first tank 411 is circulated through the circulation line 414 to the first tank 411 or the second tank 412 and the treatment liquid provided to the second tank 412 is circulated through the circulation line 414 To the first tank 411 or to the second tank 412 through the first tank 411 and the second tank 412. On the circulation line 414, a heater 416 and a pump 418 are installed. The heater 416 heats the processing liquid circulated through the circulation line 414 to a preset temperature. The pump 418 pumps the treatment liquid so that the treatment liquid supplied to the circulation line 414 is circulated.

The treatment liquid supply line 420 connects the first tank 411 and the second tank 412 with the nozzle 390, respectively. The treatment liquid supplied to the first tank 411 or the second tank 412 is supplied to the nozzle 390 through the treatment liquid supply line 420.

The flow rate regulating member 430 regulates the flow rate of the process liquid supplied to the nozzle 390. The flow rate regulating member 430 is located between the process tank and the nozzle 390 in the process liquid supply line 420. 5 is a sectional view showing the flow rate adjusting member of FIG. 5, the flow rate regulating member 430 includes a temperature measuring sensor 432, a flow rate measuring sensor 434, a flow rate regulating valve 436, a sensing sensor, an on-off valve 438 and a controller. The temperature measuring sensor 432, the flow rate measuring sensor 434, the flow rate regulating valve 436 and the opening / closing valve 438 are sequentially installed on the process liquid supply line 420. The temperature measuring sensor 432, the flow rate measuring sensor 434, the flow rate regulating valve 436 and the on / off valve 438 are sequentially positioned along the direction downstream from the upstream side of the process liquid supply line 420.

The temperature measuring sensor 432 measures the temperature of the process liquid supplied through the process liquid supply line 420. The temperature measurement sensor 432 measures the temperature measurement value of the process liquid. The flow rate measuring sensor 434 measures the flow rate of the process liquid supplied to the nozzle 390. The flow rate measuring sensor 434 measures the flow rate of the processing solution passing through the cross-sectional area for a predetermined period of time. The flow rate measurement sensor 434 measures the flow rate measurement value of the process liquid. The flow control valve 436 regulates the flow rate of the processing liquid supplied through the processing liquid supply line 420. The opening and closing valve 438 opens and closes the process liquid supply line 420.

The controller controls the opening rate of the flow control valve 436. The controller controls the flow regulating valve 436 such that the opening rate is different for the temperature measurement value provided from the temperature measuring sensor 432. [ The controller includes a data storage unit 454 and a data processing unit 452. FIG. 6 is a view showing the data storage unit 454 of FIG. 4, and FIG. 7 is a block diagram showing a process of supplying a process liquid using the flow rate control member of FIG. 6 and 7, the data storage unit 454 has a plurality of data. The data is provided as the flow rate setting value M _n corresponding to the reference temperature value T _n . Each data is provided with mutually different flow set values M _n corresponding to different reference temperature values T _n . According to one example, the first data includes a first flow setpoint value M ₁ corresponding to a first reference temperature value T ₁ and the second data comprises a first flow rate setting value M ₁ corresponding to a second reference temperature value T ₂ And a second flow rate set value (M ₂ ).

The data processing unit 452 adjusts the opening rate of the flow control valve 436 based on the data corresponding to the temperature measurement value T _n provided from the temperature measurement sensor 432. The data processing unit 452 adjusts the opening rate of the flow control valve 436 to the flow rate set value M _n of the data corresponding to the temperature measurement value of the reference temperature value T _n . According to one example, the temperature of the treatment liquid can be provided higher than the normal temperature. The controller can increase the opening rate as the temperature of the processing liquid becomes higher.

Further, the controller can determine the supply flow rate of the process liquid to the next process in the standby state in which the process is not performed, and can provide the process liquid to the standby standby state. The controller causes the process liquid to be pre-filled in the process liquid supply line 420 before the process proceeds. According to one example, the process liquid supply line 420 is provided in a closed state by the open / close valve 438, and the process liquid can be filled with the flow rate regulated by the flow control valve 436. As a result, it is possible to prevent the supply of the treatment liquid from being supplied less than the set flow rate at the initial stage.

Further, the detection sensor senses an abnormality of the flow control valve 436. The detection sensor senses the operation of the flow control valve 436 and sends an operation signal to the controller. Sensors may be provided according to the malfunction range of the flow control valve 436, respectively. The sensing sensor may include a first sensor and a second sensor. The first sensor can sense the first motion of the flow control valve 436, and the second sensor can sense the second motion including the first motion. The first operation falls within the allowable operating range of the flow control valve 436 and the second operation except the first operation can be provided to fall within the error operating range. When the controller receives the detection signal from the second sensor, the controller can control the opening / closing valve 438 so that the processing liquid supply line 420 is closed.

The controller has a data storage unit 454 and a data processing unit 452 and the data processing unit 452 controls the opening rate thereof through data provided to the data storage unit 454 and corresponding temperature measurement values. .

Alternatively, in another embodiment, the controller may include a data calculator and a data processor 452. Unlike the data storage unit, the data calculation unit can calculate data in real time without using the stored data. The data calculating unit can calculate data on the flow rate of the process liquid based on the difference value between the reference temperature value and the temperature measurement value. According to an example, the larger the difference between the reference temperature value and the temperature measurement value, the larger the flow rate of the treatment liquid to the data can be provided.

The data processing unit 452 adjusts the opening rate of the flow control valve 436 through the flow rate measurement value provided from the flow rate measurement sensor 434 and the data provided from the data calculation unit. The data processing unit 452 adjusts the opening rate so that the flow measurement value is added or subtracted based on the data. According to one example, the data processing unit 452 can increase the opening rate as the temperature of the processing liquid increases.

Next, a process of controlling the flow rate of the process liquid through the controller of the other embodiment described above will be described. Prior to describing the process, the present invention is intended to solve the error between the actual flow rate and the measured flow rate, and the flow rate to be described next will be more clearly defined. The measured flow rate value is a measurement value obtained by measuring the flow rate of the process liquid from the flow rate measuring sensor 434. The actual flow rate is the actual flow rate of the process liquid supplied to the process liquid supply line 420. The preset flow rate value is the flow rate value of the processing liquid desired by the operator.

And receives the measured information from the temperature measuring sensor 432 and the flow rate measuring sensor 434 to control the flow rate regulating valve 436. The controller receives the temperature measurement value from the temperature measurement sensor 432 and receives the measured flow rate value from the flow measurement sensor 434. [ The controller receives the temperature measurement value and the measured flow rate value, and controls the flow rate control valve 436 so that the actual flow rate of the process liquid coincides with the predetermined flow rate value. The controller calculates the difference between the temperature measurement value and the preset temperature value through the feature that the density becomes smaller as the temperature of the treatment liquid becomes higher. For example, the predetermined temperature value may be provided lower than the temperature measurement value. The controller controls the flow regulating valve 436 such that an additional flow rate of the difference value is supplied with the measured flow rate. That is, the controller determines that the preset flow rate value of the process liquid is the value obtained by adding the additional flow rate value to the measured flow rate value, and the actual flow rate value should match the preset flow rate value. According to one example, an additional flow rate according to the difference between the temperature measurement value and the preset temperature value is provided differentially, and the controller controls the flow rate control valve 436 so that the additional flow rate corresponding to the difference value is further supplied to the measured flow rate value. Can be controlled.

On the contrary, if the temperature measurement value of the treatment liquid is provided lower than the predetermined temperature value, the flow control valve 436 is controlled so as to be supplied less to the measured flow rate by the additional flow amount of the difference value.

380: injection member 390: nozzle
400: process liquid supply unit 430: flow rate regulating member
432: Temperature measurement sensor 434: Flow rate adjustment sensor
436: Flow control valve 452: Data processing section
454: Data storage unit

Claims (2)

A nozzle;
A processing liquid supply line connecting the processing tank and the nozzle to supply the processing liquid supplied to the processing tank to the nozzle;
And a flow control member provided on the treatment liquid supply line and adjusting the flow rate of the treatment liquid so that the flow rate of the treatment liquid coincides with the predetermined flow rate value,
Wherein the flow rate control member comprises:
A temperature measurement sensor for measuring the temperature of the treatment liquid;
A flow control valve for controlling the flow rate of the treatment liquid;
And a controller for controlling an opening rate of the flow rate control valve,
Wherein the controller provides the opening rate differently for a temperature measurement value provided from the temperature measurement sensor. The method according to claim 1,
The controller comprising:
A data storage unit for storing data on a plurality of flow rate setting values corresponding to each of a plurality of reference temperature values;
And a data processing unit for adjusting the opening ratio based on data on a reference temperature value corresponding to the temperature measurement value among the plurality of reference temperature values.

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