KR20180000976A - 발광 다이오드 패키지 - Google Patents

발광 다이오드 패키지 Download PDF

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Publication number
KR20180000976A
KR20180000976A KR1020160079400A KR20160079400A KR20180000976A KR 20180000976 A KR20180000976 A KR 20180000976A KR 1020160079400 A KR1020160079400 A KR 1020160079400A KR 20160079400 A KR20160079400 A KR 20160079400A KR 20180000976 A KR20180000976 A KR 20180000976A
Authority
KR
South Korea
Prior art keywords
housing
region
light emitting
emitting diode
reflective surface
Prior art date
Application number
KR1020160079400A
Other languages
English (en)
Korean (ko)
Inventor
김혁준
이형근
Original Assignee
서울반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 서울반도체 주식회사 filed Critical 서울반도체 주식회사
Priority to KR1020160079400A priority Critical patent/KR20180000976A/ko
Priority to CN201710363240.1A priority patent/CN107546310B/zh
Priority to CN201810698176.7A priority patent/CN108511580A/zh
Publication of KR20180000976A publication Critical patent/KR20180000976A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
KR1020160079400A 2016-06-24 2016-06-24 발광 다이오드 패키지 KR20180000976A (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020160079400A KR20180000976A (ko) 2016-06-24 2016-06-24 발광 다이오드 패키지
CN201710363240.1A CN107546310B (zh) 2016-06-24 2017-05-22 发光二极管封装件
CN201810698176.7A CN108511580A (zh) 2016-06-24 2017-05-22 发光二极管封装件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160079400A KR20180000976A (ko) 2016-06-24 2016-06-24 발광 다이오드 패키지

Publications (1)

Publication Number Publication Date
KR20180000976A true KR20180000976A (ko) 2018-01-04

Family

ID=60966735

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160079400A KR20180000976A (ko) 2016-06-24 2016-06-24 발광 다이오드 패키지

Country Status (2)

Country Link
KR (1) KR20180000976A (zh)
CN (2) CN107546310B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111463334A (zh) * 2020-04-16 2020-07-28 中国科学院半导体研究所 一种陶瓷基板及其封装方法
CN114512591A (zh) * 2021-12-31 2022-05-17 佛山市国星光电股份有限公司 支架及led器件
CN114520284A (zh) * 2021-12-31 2022-05-20 佛山市国星光电股份有限公司 框架及发光器件

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10041686A1 (de) * 2000-08-24 2002-03-14 Osram Opto Semiconductors Gmbh Bauelement mit einer Vielzahl von Lumineszenzdiodenchips
US7652301B2 (en) * 2007-08-16 2010-01-26 Philips Lumileds Lighting Company, Llc Optical element coupled to low profile side emitting LED
CN201549507U (zh) * 2009-07-28 2010-08-11 浙江迈勒斯照明有限公司 一种多芯片集成封装的led
KR101298406B1 (ko) * 2010-05-17 2013-08-20 엘지이노텍 주식회사 발광소자
TWI557951B (zh) * 2010-06-01 2016-11-11 Ｌｇ伊諾特股份有限公司 發光元件封裝
KR101693642B1 (ko) * 2010-12-21 2017-01-17 삼성전자 주식회사 발광소자 패키지 제조방법
CN202049997U (zh) * 2011-05-20 2011-11-23 安徽中智光源科技有限公司 用于表面贴装led支架及led光源
CN103187485A (zh) * 2011-12-27 2013-07-03 展晶科技(深圳)有限公司 发光二极管的制造方法
KR20140029617A (ko) * 2012-08-29 2014-03-11 엘지이노텍 주식회사 발광 소자 패키지
CN103887397A (zh) * 2012-12-22 2014-06-25 展晶科技(深圳)有限公司 发光二极管
KR101831249B1 (ko) * 2015-10-14 2018-02-23 엘지이노텍 주식회사 발광소자 패키지 및 조명 장치
CN205881937U (zh) * 2016-06-24 2017-01-11 首尔半导体股份有限公司 发光二极管封装件
CN206040686U (zh) * 2016-06-24 2017-03-22 首尔半导体股份有限公司 发光二极管封装件
CN206022415U (zh) * 2016-06-24 2017-03-15 首尔半导体股份有限公司 发光二极管封装件

Also Published As

Publication number Publication date
CN107546310B (zh) 2020-05-19
CN107546310A (zh) 2018-01-05
CN108511580A (zh) 2018-09-07

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