KR20170138593A - Apparatus and Method for Transferring Chips Respectively - Google Patents

Apparatus and Method for Transferring Chips Respectively Download PDF

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Publication number
KR20170138593A
KR20170138593A KR1020160008187A KR20160008187A KR20170138593A KR 20170138593 A KR20170138593 A KR 20170138593A KR 1020160008187 A KR1020160008187 A KR 1020160008187A KR 20160008187 A KR20160008187 A KR 20160008187A KR 20170138593 A KR20170138593 A KR 20170138593A
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South Korea
Prior art keywords
tape
chip
stage
selector
target position
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KR1020160008187A
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Korean (ko)
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KR101879029B1 (en
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양진석
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양진석
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G61/00—Use of pick-up or transfer devices or of manipulators for stacking or de-stacking articles not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A chip transfer apparatus by selective transfer method is disclosed. The chip transfer apparatus of the present invention can transfer a chip selectively from a first stage to a second stage implemented with a tape or a film, and transfer the chip to the second stage by selectively transferring the desired chip to the second stage without a separate medium such as a picker .

Description

Technical Field [0001] The present invention relates to a chip transfer apparatus and a transfer method using a selective transfer method,

The present invention relates to a chip transfer apparatus for selectively transferring a chip from a first stage to a second stage, which is implemented with a tape such as a blue tape or a film, and a transfer method thereof.

The process of transferring the chips during the semiconductor production process occurs very frequently. Typically, the chips in the semiconductor chip production process are processed with the chip loaded in a 'stage' called Blue Tape and are reclassified as a new stage for the next process.

For example, a semiconductor chip in a production process is classified by performance or by classification of a good product and a defective product through an inspection process. The chip stage is implemented as a fixed frame with a blue tape and a blue tape fixed. An adhesive is applied to the outer surface of the blue tape, so that the chip is stuck to the outer surface of the blue tape.

When transferring all chips of the blue tape stage to a new stage at once, it is common to transfer all the chips at a time, but it is common to transfer them individually for the purpose of sorting and the like. In this case, A separate transport means provided between the first stage and the second stage is used as the device.

FIG. 1 is a view showing a configuration of a conventional chip sorting apparatus, and FIG. 2 is a view showing a configuration of another conventional chip sorting apparatus. Referring to FIGS. 1 and 2, a conventional chip sorting apparatus uses a picker 20 that moves a chip from a loading unit 10 to an unloading unit 30. The picker 20 shown in FIG. 1 feeds a chip while horizontally rotating about a vertical axis. The picker 20 shown in FIG. 2 feeds a chip while rotating vertically about a horizontal axis.

Basically, the transfer of the chip by the picker 20 is performed through the process of (chip grasping) → (transfer) → (unloading of the chip). Therefore, the picker 20 can accurately select a desired chip in the loading unit 10 and accurately transfer it to a desired place of the unloading unit 30. However, as the picker 20 is conveyed in various stages There is a problem that a long chip transfer time is required. In addition, the chip may be damaged in the process of the picker 20 grasping the chip or the like.

In addition, since the picker 20 has a limitation on the size of the transferable chip, it is necessary to replace the chip with a new picker 20 in order to transfer chips of different sizes, and this picker replacement time may delay the whole process time have.

In addition to the above configuration, the prior art for a conventional chip sorting device is disclosed in Korean Patent No. 1209637. [

Korea Patent No. 1209637

The present invention has been devised to solve the above problems, and provides a chip transfer apparatus for selectively transferring a chip from a first stage to a second stage implemented with a tape such as a blue tape or a film, and a transfer method thereof. .

A chip transfer apparatus according to an embodiment of the present invention includes a first stage capable of receiving a first tape having semiconductor chips mounted on its front side and a second stage having chips attached to the first tape to receive a second tape to be transferred to the front side A second stage for receiving the selected portion of the first tape and the second tape to receive the selected portion of the first tape and the target portion of the second tape so that the front surface of the second tape faces the front surface of the first tape; And a chip selector (Selector) for transferring the selected chip to the second tape.

According to an embodiment, the chip selector may be disposed on the back surface of the first tape so as to push the selected chip from the back surface of the first tape to contact the target position of the second tape. In this case, the apparatus may further include a second stage adsorption unit disposed on the rear surface of the second tape corresponding to the chip selector. The second stage adsorption unit fixes the second tape by vacuum suction when the chip selector makes contact with the second tape.

According to another embodiment, the chip selector may be disposed on the rear surface of the second tape so as to push the target position portion from the rear surface of the second tape to contact the selected chip, and further include a first stage suction portion You may.

On the other hand, the chip selectors may be provided individually corresponding to the semiconductor chips attached to the first tape.

The chip selector may be implemented in various forms. For example, the chip selector may include (1) a niddle portion having at least one needle to push back the first tape with the selected chip attached thereto, (2) And an air unit provided with a nozzle for outputting air of a predetermined temperature. In addition, the chip selector may further include a vacuum adsorption part provided along the outer periphery of the Niddle part or the air part and vacuum-sucking the rear surface of the first tape.

Meanwhile, the ends of the needles may be sharpened so that the selected chips may be pushed in a manner that the first tapes are punched to contact the target positions of the second tapes. For example, such a method is preferable in the case where the first tape is a non-ductile film.

A chip transfer apparatus according to another embodiment of the present invention includes a stage alignment unit to align a target position of the second tape, the chip selector, and the selected chip on a virtual axis to transfer a desired selected chip to an arbitrary target position .

For example, the stage arrangement may include: a chip selector-transfer unit for aligning the chip selector with the virtual axis passing through the selected chip; a chip selector-transfer unit for aligning the target position of the second stage with the virtual axis, And a second stage feeder for feeding the second stage. In this case, the first stage is in a fixed state.

Alternatively, the stage alignment section may include a first stage transfer section for aligning the selected chips of the first stage on the imaginary axis passing through the chip selector, and a second stage transfer section for aligning the target position of the second stage on the imaginary axis And a second stage transferring unit for transferring the second stage. This case corresponds to the case where the position of the chip selector is fixed.

The chip transfer apparatus according to another embodiment of the present invention may further include a receiver arranged opposite to the chip selector. The receiver pushes the second tape corresponding to the transferring process of the chip selector so that the selected chip comes into contact with the target position in the space between the first stage and the second stage. Since the receiver has the same structure as the chip selector, the chip transfer device is like having two chip selectors.

The present invention also relates to a chip transfer method of a chip transfer apparatus having the first stage and the second stage. The chip transferring method according to the present invention includes the steps of arranging the front surface of the first tape and the front surface of the second tape so as to face each other and selecting a chip selected by at least one selected from chips attached to the first tape And transferring the selected chip to the target position of the second tape by bringing the chip and the target portion of the second tape into contact with each other.

The step of transferring to the second tape may be performed by a chip selector arranged on the rear surface of the second tape pushing the second tape to adhere to at least one selected chip among the chips attached to the first stage, And the selected chips may be transferred to the second tape.

The chip transfer apparatus according to the present invention can transfer the chip loaded on the first stage having the tape or the film to the second stage without any intermediary means such as a picker.

Since the method of the present invention transports the chip by one transfer without passing through various steps such as picker and the like, the chip transferring time and the transferring time are relatively short. In addition, since the chips are directly transferred from the tape to the tape without a gripping operation by a separate structure such as a picker, the possibility of chip damage is reduced.

The chip transfer apparatus of the present invention can selectively transfer a desired chip from the entire chip of the first stage to a desired place of the second stage without receiving a picker or the like.

1 and 2 show a conventional chip sorting apparatus,
3 is a sectional view of a chip transfer apparatus according to the first embodiment of the present invention,
4 is a view for showing the structure of the first tape portion and the coupling with the first stage,
5 is a cross-sectional view of a chip transfer apparatus according to the second and third embodiments of the present invention,
6 is a cross-sectional view of a chip transfer apparatus according to a fourth embodiment of the present invention,
FIG. 7 is a view for explaining the operation of the chip transferring apparatus according to the first embodiment of the present invention,
8 is a cross-sectional view of a chip transfer apparatus according to a fifth embodiment of the present invention,
Fig. 9 is a view provided for explaining the operation of the chip transfer apparatus according to the fifth embodiment, and Fig.
10 is a cross-sectional view of a chip transfer apparatus according to a sixth embodiment of the present invention.

Hereinafter, the present invention will be described in detail with reference to the drawings.

≪ Embodiment 1 >

3 and 4, the chip transfer apparatus 300 of the present invention includes a first stage 310 capable of receiving a first tape unit 311 having semiconductor chips L mounted on its front side, A second stage 330 for receiving the second tape portion 331 to which the chips L attached to the first tape portion 311 are to be transferred to the front side, A selector 350, and a stage arrangement unit 370.

The first stage 310 is a starting stage in which the chips L in the pre-transfer stage are loaded and the second stage 330 is a target stage in which the chips L selected in the first stage 310 are to be transferred. Referring to FIG. 4, the first tape portion 311 has a frame 313 and a first tape 315 fixed by a frame 313. The first tape 311 is fixed by a frame 313. The first tape 315 may be a flexible tape such as 'Blue Tape' or a normal film having no ductility. An adhesive is applied to the front surface of the first tape 315, and the semiconductor chips L are attached and fixed. The second tape portion 331 has a frame 333 and a second tape 335 in the same manner as the first tape portion 311 and an adhesive is applied to the entire surface of the second tape 225. Hereinafter, the case where the first tape 315 and the second tape 335 are soft blue tapes will be mainly described.

The chip transfer apparatus 300 of the present invention does not have a conventional picker but has the following advantages: (1) the front surface of the first tape unit 311 and the front surface of the second tape unit 331 (2) The chip selector 350 disposed on the rear surface of the first tape portion 311 transports the chips. However, in the method of the present invention, the entire chip attached to the first tape portion 311 is not directly transferred to the second tape portion 331, but the chips attached to the first tape portion 311 are sorted, (Hereinafter, referred to as a " target chip ") is relocated to an arbitrary position (hereinafter referred to as a target position) of the second tape unit 331, (3) , The target positions of the chip selector 350 and the second tape portion 331 on which the selected chip and the chip are to be transferred should be aligned on one imaginary axis x. According to the embodiment, a plurality of chips can be transferred by one transfer, but this does not mean that the entire chip attached to the first tape portion 311 is transferred as it is.

The chip transfer device 300 transfers the selected chips L1 selected for transfer among the chips L loaded on the first tape portion 311 individually to the second tape portion 331. In order to transfer the selected chips L1 to be transferred to the second tape portion 331 individually, The chip selector 350 disposed on the rear surface of the semiconductor chip 311 is used. As described below, the chip selector 350 may be disposed on the rear surface of the second tape portion 331 as shown in Fig.

The chip selector 350 pushes a portion of the rear surface of the first tape 315 of the first tape portion 311 with the selected chip L1 toward the front surface of the second tape portion 331, (L1) is brought into contact with the target position (T1) of the second tape section (331). At this time, the direction in which the selected chip L1 is pushed out becomes a direction perpendicular to the surface of the first tape portion 311 (hereinafter, referred to as a chip transport direction). Hereinafter, even if the chip selector 350 is expressed as 'pushing out the first tape unit 311 or pushing out the selected chip L 1', the rear surface of the first tape 315 with the selected chip L 1 Pushing out '.

Since the first tape portion 311 is a flexible tape, the portion of the selected chip L1 is extended toward the second tape portion 331 by the operation of the chip selector 350. The selected chip L1 transferred by the chip selector 350 is attached to the front surface of the second tape portion 331 because an adhesive is applied to the entire surface of the second tape portion 331. [ When the chip selector 350 returns to its original position, the first tape unit 311 is restored to its original state. At this time, the difference in adhesive force between the first tape unit 311 and the second tape unit 331 The selected chip L1 is adhered to the second tape portion 331 and the transfer is completed.

On the other hand, the area contacted by the chip selector 350 with the first tape portion 311 for transferring the selected chip L1 is preferably smaller than the size of the selected chip L1. This may cause some separation between the first tape portion 311 and the selected chip L1 in the course of pushing out the selected chip L1 by the chip selector 350, have.

The means for pushing the selected chip L1 by the chip selector 350 can be variously implemented. 3, the chip selector 350 includes needle portions 351 and 355 for pushing out the selected chip L1 and a plurality of needle portions 351 and 355 provided along the outer periphery of the needle portions 351 and 355, And a chip selector-suction portion 353 for vacuum-sucking the rear surface of the chip 311.

The needle portions 351 and 355 move at least along the chip transport direction while pushing the selected chip L1 portion of the rear surface of the first tape 315 toward the second tape portion 331 in the chip transport direction And a hole 355 accommodating at least one needle 351 so that the needle 351 protrudes along the chip transport direction to transfer the selected chip L1 to the original state Return. One needle 351 may suffice depending on the size of the selected chip L1. However, when the size of the selected chip L1 is large, a plurality of needles may move simultaneously to transfer the selected chip L1. As described above, it is preferable that the end portion of the needle 351 contacting the first tape portion 311 is smaller than the chip size. Further, the ends of the needles 351 may be formed to be pointed, so that the first tape 315 may be pierced. Another embodiment in which the ends of the needles 351 are pointed is described further below.

The chip selector 350 is a means for pushing out the selected chip L1 and a nozzle for discharging air of a constant pressure instead of a rigid body such as a needle of the needle portions 351 and 355 (Not shown) provided with an air blower (not shown).

The chip selector-suction portion 353 forms a negative pressure on the entire surface of the chip selector-suction portion 353 using a separate suction means (not shown) to suction the first tape 315. Not only between the first tape 315 and the selected chip L1 but also in the chips around the selected chip L1 in the process of pushing the selected chip L1 by the needle 351, This shape can cause a problem in chip loading of the first tape portion 311, so that the chip selector-suction portion 353 adsorbs the portion other than the selected chip region to prevent the chip selector- do.

On the other hand, when the needle portions 351 and 355 are returned to the original state, the selected chip L1 is not separated from the first tape portion 311 and the second tape 335 can be pulled in the direction of the first stage 310 have. In this case, since the separation of the selected chip L1 and the first tape 315 becomes more difficult, as shown in FIG. 3, the second tape 335 is vacuum-sucked and fixed to the rear end of the second stage 330 It is preferable that the second stage adsorption unit 390 is provided.

The stage alignment unit 370 aligns the chip selector 350, the selected chip L1 and the target position T1. The position of the selected chip L1 and the target position T1 and the chip selector 350 are opposed to each other according to the mutual arrangement state of the chip selector 350, the first stage 310 and the second stage 330 The stage alignment unit 370 aligns the required configuration among the chip selector 350, the first stage 310 and the second stage 330 to align the chip selector 350, the selected chip L1 and the target position (T1) on one axis (x).

The stage alignment unit 370 may be implemented in various ways.

First, a method of aligning the chip selector 350 to be aligned and the first stage 310 and the second stage 330 while moving both is possible. The second method is a method of transferring the remaining configuration with the chip selector 350 and one of the first stage 310 and the second stage 330 being fixed. 3 is an example in which the first stage 310 is fixed according to the second method. The selected chip L1 to be transferred is selected in the first stage 310 in which the chips L are firstly loaded. Therefore, the first stage 310 is fixed to the chip selector L1 350 and the second stage 330 may be transported.

3 includes a chip selector-transfer unit 370a that can transfer the chip selector 350 along a virtual plane parallel to the surface of the first tape unit 311, a chip selector- And a second stage transfer unit 370b capable of transferring the first stage transfer unit 330 to the second tape unit 331 along a virtual plane horizontal to the surface of the second tape unit 331. The chip selector-transfer section 370a aligns the chip selector 350 at the position of the selected chip L1 and the second stage transfer section 370b transfers the target position T1 to face the selected chip L1, Aligns the chip selector 350 and the selected chip L1 with the target position T1.

In addition, the first stage 310, the second stage 330, and the chip selector 350 must be in close contact with each other as shown in FIG. 7 (b) to enable chip transfer, It is necessary to be spaced apart from each other as shown in Fig. 7 (a) for reasons such as replacement of the first tape section 311 and the second tape section 331. [ To this end, the second stage transfer part 370b may transfer the second stage 330 in a direction perpendicular to the surface of the second tape part 331. [ When the second stage suction part 390 is provided, the second stage transfer part 370b can simultaneously transfer the second stage suction part 390 and the second stage 330. [

≪ Second Embodiment: Another example of the stage alignment unit >

The chip transfer device 500 shown in FIG. 5 fixes the position of the chip selector 350 and transfers the first and second stages 310 and 330 to align them. The stage alignment unit 370 of the chip transfer apparatus 500 of FIG. 5 includes a first stage transfer unit (not shown) capable of transferring the first stage 310 in a horizontal direction to the surface of the first tape unit 311 And a second stage transporting portion 370b capable of transporting the second stage 330 in a horizontal direction to the surface of the second tape portion 331. [

The first stage transfer unit 370c aligns the selected chip L1 of the first tape unit 311 with the chip selector 350 and the second stage transfer unit 370b aligns the target position T1 with the selected chip L1. So that the chip selector 350 and the selected chip L1 are aligned with the target position T1.

≪ Third embodiment: another example of the stage arranging part >

The chip transfer apparatus of the present invention has the second stage 330 fixed and has a chip selector-transfer unit 370a and a first stage transfer unit 370c and is connected to the chip selector 350 and the first stage 310 ) May be transferred and aligned.

≪ Fourth Embodiment: Another Example of Stage Arranging Portion >

The chip transfer device 600 shown in FIG. 6 includes a plurality of chip selectors 350 and a chip selector stage 610 having a plurality of chip selectors corresponding to positions of all chips loaded on the first tape unit 311 And a second stage feed portion 370b. The second stage adsorption unit 390 may be optionally provided.

The second stage transfer unit 370b transfers the target position T1 of the second tape unit 331 to the selected chip L1 because the chip selector stage 610 is already aligned with all of the chips L and L1. .

<Operation of Chip Transfer Apparatus>

Hereinafter, a chip transfer method of the chip transfer apparatus will be described with reference to FIGS. 3 and 7. FIG. (a) The stage alignment unit 370 aligns the chip selector 350, the selected chip L1 and the target position T1 on one axis x. 3, the chip selector-transfer unit 370a and the second stage transfer unit 370b transfer and align the chip selector 350 and the second stage 330, respectively. (b) The needle 351 of the chip selector 350 pushes the selected chip L1 toward the second tape portion 331 in the chip transfer direction to contact the selected chip L1 to the second tape portion 331 . The portion of the selected chip L1 is extended toward the second tape portion 331 by the operation of the needle 351 because the first tape portion 311 is a flexible tape. At this time, the chip selector-suction part 353 adsorbs the peripheral area other than the selected chip area, thereby blocking extension along the selected chip area.

(c) Since the adhesive is applied to the entire surface of the second tape portion 331, the selected chip L1 transferred by the needle 351 is attached to the front surface of the second tape portion 331. [ Thereafter, when the needle 351 returns to its original position, the first tape portion 311 is also restored to its original state. At this time, the selected chip L1 is kept bonded to the second tape portion 331 do. The principle that the selected chip L1 remains on the second tape portion 331 is as follows: (1) a method of making the adhesive force of the second tape portion 331 stronger than the first tape portion 311, (2) A method in which the suction unit 390 sucks the second tape unit 331 and (3) the method in which the end of the needle 351 is made smaller than the chip size, And a method of separating the liquid from the liquid at a certain time.

<Fifth Embodiment>

The chip transferring apparatus 800 of FIG. 8 is an example in which the chip selector 350 'is disposed on the rear surface of the second tape unit 331 and is opposite to the case of FIG. 3, 331 are basically the same or similar in technical structure and structure to the embodiment of Fig.

The chip selector 350 'pushes the target position T1 of the second tape portion 331 to adhere to the selected chip L1 attached to the first tape portion 311, 2 tape unit 331 as shown in Fig. The chip selector 350 'of FIG. 8 has the same structure as the chip selector 350 of FIG. 3 and can be similarly described.

The chip transferring apparatus 800 of FIG. 8 includes a first stage adsorption unit 810 disposed on the rear surface of the first stage 310 in correspondence with the chip selector 350 'to vacuum-adsorb and fix the first tape unit 311 ).

The chip transfer apparatus 800 also includes a chip selector 350 ', a selected chip L1 and a stage arrangement unit 830 for aligning the target position T1 on one virtual axis x. The stage arranging unit 830 of FIG. 8 includes a chip selector-transferring unit 830a for transferring the chip selector 350 ', a first stage transferring unit 830a for transferring the first stage 310 and the first stage suctioning unit 810, (830c).

8 and 9, first, the stage alignment unit 830 aligns the chip selector 350 ', the selected chip L1 and the target position T1 on one virtual axis x. 8, the chip selector-transfer unit 830a and the first stage transfer unit 830c transfer and align the chip selector 350 'and the first stage 310, respectively.

9B, the needle 351 'of the chip selector 350' pushes the portion of the target position T1 toward the first tape portion 311 in the direction opposite to the chip conveying direction, 331 is brought into contact with the selected chip L1. Since the second tape portion 331 is a flexible tape, a portion of the target position T1 is extended toward the first tape portion 311 by the operation of the needle 351 '. At this time, the chip selector-suction portion 353 'adsorbs the region around the target position T1 and blocks extension thereof.

(c) Since the adhesive is applied to the entire surface of the second tape portion 331, the part of the target finger T1 is attached to the entire surface of the selected chip L1. Thereafter, when the needle 351 'returns to the original position, the second tape portion 331 is also restored to its original state. At this time, the selected chip L1 is transported together along the second tape portion 331. The force to which the selected chip L1 adhered to the first tape section 311 is transferred to the second tape section 331 depends on whether the adhesive force between the selected chip L1 and the second tape section 331 0.0 &gt; 311, &lt; / RTI &gt; which is the same as described in FIG.

&Lt; Sixth Embodiment > Receiver>

10, the chip transfer apparatus 900 of the present invention may include a receiver 910 for pushing the tape portion opposite to the transfer operation of the chip selector 350.

10 is an example having a receiver 910 disposed on the rear surface of the second stage 330 corresponding to the chip selector 350 disposed on the rear surface of the first stage 310. [ The receiver 910 pushes the second tape 335 toward the selected chip L1 in response to the needle 351 of the chip selector 350 pushing the first tape 315. [ Thereby, the selected chip L1 and the target position T1 meet each other between the first stage 310 and the second stage 330.

The receiver 910 has the same configuration as the chip selector 350. Therefore, the receiver 910 also includes the needle portion 911, and may further include the receiver-suction portion 913 as necessary. Therefore, the chip transfer device 900 of FIG. 10 is similar to that having two chip selectors disposed on the rear sides of the first stage 310 and the second stage 330, respectively.

&Lt; Embodiment: In the case of using a non-ductile film >

As described above, the first tape 315 and the second tape 335 can use a film having no ductility. In this case, the end of the chip selector 350 needle must be sharp.

When the first tape 315 and the second tape 335 are flexible, the ends of the needles 351 may be flat as shown in FIG. 3. However, the first tape 315 and the second tape 335 may be flat, 335 are made of a non-ductile film, the ends of the needles are pointed so that the first tape 315 can be pierced in the process of pushing the selected chip L1.

If the first tape 315 and the second tape 335 are disposed sufficiently close to each other, in the process of pushing the selected chip L1 toward the second tape 335 through the first tape 315, Even if the first chip L1 is separated from the first tape 315, the selected chip L1 can be seated at the target position T1 without departing from the path by the force given by the needle.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention.

310: first stage 311: first tape section
313, 333: frame 315: first tape
330: second stage 331: second tape section
335: second tape 350, 350 ': chip selector
351, 351 ': Needle 353: Chip selector-
370 and 830: stage alignment units 370a and 830a: chip selector-
370b: second stage conveyance portion 370c, 830c: first stage conveyance portion
390: second stage adsorption unit 610: chip selector stage
810: First stage adsorption unit

Claims (18)

In the chip transfer apparatus,
A first stage in which semiconductor chips can receive a first tape attached to the front side;
A second stage for receiving a second tape to be transferred to the front, wherein chips attached to the first tape are received so that a front surface of the second tape faces the front surface of the first tape; And
And a chip selector (Selector) for transferring the selected chips to the second tape by bringing a selected one of the chips of the first tape and a target portion of the second tape into contact with each other Chip transfer device.
The method according to claim 1,
Wherein the chip selector is disposed on a rear surface of the first tape and pushes the selected chip from the rear surface of the first tape to bring the selected chip into contact with the target position of the second tape.
3. The method of claim 2,
The chip selector includes a needle with at least one needle, wherein the tip of the needle is sharpened to pierce the first tape and push the selected chip into contact with the target position of the second tape Characterized by a chip transfer device.
The method according to claim 1,
Wherein the chip selector is disposed on a rear surface of the second tape and pushes the target position portion from the rear surface of the second tape to contact the selected chip.
The method according to claim 2 or 4,
And a plurality of the chip selectors corresponding to the semiconductor chips individually attached to the first tape.
The method according to claim 2 or 4,
Wherein the chip selector comprises:
And an air portion having a nozzle provided with at least one needle or a nozzle for outputting air at a predetermined pressure to push back the first tape or the second tape. Conveying device.
The method according to claim 6,
Wherein the chip selector further comprises a vacuum adsorption unit provided along the outer periphery of the needle or air unit for vacuum adsorbing the rear surface of the first tape or the second tape.
The method according to claim 1,
And a stage alignment unit for aligning the target position of the second tape, the chip selector and the selected chip on a virtual axis.
9. The method of claim 8,
The stage arranging unit,
A chip selector-transfer unit for aligning the chip selector on the imaginary axis passing through the selected chip; And
And a second stage feeder for feeding the second stage to align the target position of the second stage with the imaginary axis.
9. The method of claim 8,
The stage arranging unit,
A first stage feeder for aligning the selected chips of the first stage on the imaginary axis passing through the chip selector; And
And a second stage feeder for feeding the second stage to align the target position of the second stage with the imaginary axis.
3. The method of claim 2,
Further comprising a second stage adsorption unit disposed on the rear surface of the second tape for vacuum fixing and fixing the second tape when the chip selector makes contact with the second tape, .
5. The method of claim 4,
Further comprising a first stage adsorption unit disposed on a rear surface of the first tape and vacuum-adsorbing and fixing the first tape when the chip selector makes contact with the selected chip, .
3. The method of claim 2,
Further comprising a receiver disposed on a rear surface of said second tape for pushing said target position toward said first tape so as to contact said selected chip pushed by said chip selector.
14. The method of claim 13,
Wherein the receiver has a niddle portion or an air portion for pushing back the target position of the first tape.
A chip transfer device comprising a first stage capable of receiving a first tape attached to the front side of semiconductor chips and a second stage for receiving a second tape to be transferred to the front side of the chips attached to the first tape, In the transfer method,
Disposing the front surface of the first tape and the front surface of the second tape so as to face each other; And
Transferring the selected chip to the target location of the second tape by bringing a chip selector into contact with a target location portion of the selected tape and a selected one of the chips attached to the first tape Wherein the chip transferring method comprises the steps of:
16. The method of claim 15,
In the step of transferring to the second tape,
Wherein the chip selector is disposed on a rear surface of the first tape and pushes the first tape to bring the selected chip into contact with the target position of the second tape.
16. The method of claim 15,
In the step of transferring to the second tape,
Wherein the chip selector is disposed on the rear surface of the second tape and pushes the target portion of the second tape to contact the selected chip.
16. The method of claim 15,
Further comprising a stage aligning step of aligning the target position of the second tape, the chip selector, and the selected chip on a virtual axis.
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