KR20170134983A - Light emitting device moudle and lighting apparatus including the same - Google Patents

Abstract

The present invention relates to a light emitting device module and a lighting apparatus including the same, which can improve an explosion-proof function and increase durability of a light emitting device. The light emitting device module according to an embodiment of the present invention comprises: a substrate including a circuit pattern formed in one surface thereof; a plurality of light emitting device packages disposed in the substrate to electrically connect the circuit pattern; a light transmission cover coupled to the substrate to cover the plurality of light emitting device packages; a power supply unit electrically connected to a connection terminal of the circuit pattern of the substrate; and an insulation line disposed between the light transmission cover and the substrate. The insulation line forms a loop surrounding the plurality of light emitting device packages in the substrate. The connection terminal is disposed outside the loop.

Description

TECHNICAL FIELD [0001] The present invention relates to a light emitting device module and a lighting device including the light emitting device module.

Embodiments relate to a light emitting device module and a lighting apparatus including the same.

A light emitting device (LED) is a compound semiconductor device that converts electric energy into light energy. By controlling the composition ratio of the compound semiconductor, various colors can be realized.

The nitride semiconductor light emitting device has advantages of low power consumption, semi-permanent lifetime, fast response speed, safety, and environmental friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps. Accordingly, a light emitting diode backlight replacing a cold cathode fluorescent lamp (CCFL) constituting a backlight of an LCD (Liquid Crystal Display) display device, a white light emitting diode lighting device capable of replacing a fluorescent lamp or an incandescent lamp, And traffic lights.

In recent years, Explosion-proof Lamps using light emitting devices have also been used in gas stations and refineries. However, since gas stations and oil refineries are exposed to explosive atmospheres, explosion-proof functions are strictly required.

The embodiments provide a light emitting device module with improved explosion-proof function, and a lighting device including the same.

The problems to be solved in the embodiments are not limited to these, and the objects and effects that can be grasped from the solution means and the embodiments of the problems described below are also included.

A light emitting device module according to an embodiment of the present invention includes: a substrate including a circuit pattern formed on one surface; A plurality of light emitting device packages disposed on the substrate and electrically connected to the circuit patterns; A light emitting cover coupled to the substrate to cover the plurality of light emitting device packages; A power supply unit electrically connected to a connection terminal of a circuit pattern of the substrate; And an insulation line disposed between the translucent cover and the substrate, wherein the insulation line forms a loop surrounding the plurality of light emitting device packages on the substrate, and the connection terminal is disposed outside the loop.

The power supply unit may include a pair of wires electrically connected to the connection terminal.

Wherein the light-transmitting cover includes a socket portion to which the wire is fixed, the socket portion includes a protruding jaw supporting a wire connected to the connection terminal, a step portion supporting a first bent portion of the wire bent toward the substrate, And may include an exhaust hole that is exposed to the outside.

 And a socket portion for fixing the wire by being coupled with the light-transmitting cover. The socket portion may include a step portion for bending the wire toward the substrate, and a discharge hole for exposing the wire to the outside.

The light-transmitting cover may cover the side surface of the substrate.

The light-transmitting cover may include a plurality of hooks that engage with the substrate.

The light emitting device package may include a pad electrically connected to the substrate, a light emitting device electrically connected to the pad, and an optical lens controlling light emitted from the light emitting device.

The light emitter plate may include a plurality of lens units that accommodate the plurality of light emitting device packages.

And an air layer formed between the inner wall of the lens portion and the light emitting device package.

According to the embodiment, the explosion-proof function can be improved and the lifetime of the light-emitting element can be extended.

The various and advantageous advantages and effects of the present invention are not limited to the above description, and can be more easily understood in the course of describing a specific embodiment of the present invention.

1 is a view showing a lighting apparatus according to an embodiment of the present invention,
2 is a perspective view of a light emitting device module according to an embodiment of the present invention,
3 is a cross-sectional view of a light emitting device module according to an embodiment of the present invention,
FIG. 4 is a view showing a state in which an insulating line is disposed on a substrate,
Fig. 5 is an enlarged view of the socket portion of Fig. 2,
6 is a sectional view of the socket portion,
7 is a view illustrating a light emitting device module according to another embodiment of the present invention,
FIG. 8 is a view showing a state where the socket portion of FIG. 7 is mounted on the board,
9 is a conceptual view of a light emitting device package.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. It should be understood, however, that the embodiments of the present invention are not intended to be limited to the specific embodiments but include all modifications, equivalents, and alternatives falling within the spirit and scope of the embodiments.

Terms including ordinals, such as first, second, etc., may be used to describe various elements, but the elements are not limited to these terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the embodiments, the second component may be referred to as a first component, and similarly, the first component may also be referred to as a second component. And / or < / RTI > includes any combination of a plurality of related listed items or any of a plurality of related listed items.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the embodiments of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

In the description of the embodiments, in the case where one element is described as being formed "on or under" another element, the upper (upper) or lower (lower) or under are all such that two elements are in direct contact with each other or one or more other elements are indirectly formed between the two elements. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings, wherein like or corresponding elements are denoted by the same reference numerals, and redundant description thereof will be omitted.

1 is a view illustrating a lighting apparatus according to an embodiment of the present invention.

Referring to FIG. 1, a lighting apparatus according to an embodiment includes a body 4 in which a light emitting element module 1 is accommodated, and a power source unit 3 that supplies power to the light emitting element module. And a mounting box 2.

The body 4 may include a light emitting device module disposed in the housing 1a and the housing 1a.

The shape of the housing 4a is not limited as long as the housing 4a accommodates the light emitting element module. Although not shown, a plurality of radiating fins may be mounted on the housing 1a. An inert gas may be injected into the housing 4a.

The power supply unit 3 may include an SMPS (Switching Mode Power Supply), and the mounting box 2 may include various electronic components. The power supply unit 3 may be disposed in the mounting box 2.

The illumination device according to the embodiment may be an Explosion-proof Lamp used in an area exposed to an explosive gas such as an oil refinery, a chemical factory, or a shipyard, but is not limited thereto. The lighting device can be anchored to the installation site (building wall, ceiling, etc.). However, the present invention is not limited to this, and the lighting apparatus may be arranged in a stand-shape.

FIG. 2 is a perspective view of a light emitting device module according to an embodiment of the present invention, FIG. 3 is a sectional view of a light emitting device module according to an embodiment of the present invention, FIG. FIG.

2 and 3, the light emitting device module includes a substrate 20, a plurality of light emitting device packages 100 disposed on one surface of the substrate 20, And a light-transmitting cover (10) covering the light source (100).

Various types of circuit boards on which a circuit pattern is formed on one side of the substrate 20 can be selected. The substrate 20 may be a metal PCB, but is not particularly limited. The thickness of the substrate 20 may be about 1.0 mm to 3.0 mm, but is not limited thereto. An insulating layer 30 may be further formed on one surface of the substrate 20. The thickness of the insulating layer 30 may be about 50 [mu] m to 200 [mu] m.

The light emitting device package 100 may be mounted on the substrate 20 and electrically connected thereto.

The light-transmitting cover 10 may be disposed on one side of the substrate 20 to cover the light-emitting device package 100. Explosive gases (active gases) can penetrate into small gaps in the fixture. Therefore, a large explosion may occur when the spark, which occurs when power is applied to the load, contacts the active gas. Therefore, the light-transmitting cover 10 can completely cover one surface of the substrate 20 on which a spark may occur, thereby blocking the contact with the active gas.

The light-transmitting cover 10 may include a silicon material. However, the present invention is not limited thereto, and any material that satisfies explosion proof, moisture-proof, and pressure-resistant conditions is applicable without limitation. The light-transmitting cover 10 may have a total thickness of 3.0 mm or more in order to satisfy explosion-proof, moisture-proof, and pressure-resistant conditions.

The light-transmitting cover 10 may include a plurality of lens units 11 arranged in regions corresponding to the plurality of light-emitting device packages 100. The plurality of lens units 11 can adjust the directivity angle of the light emitted from the light emitting device package 100.

An air layer 13 may be formed between the inner wall of the lens unit 11 and the light emitting device package 100. Therefore, even if the lens unit 11 is contracted according to a change in temperature, damage to the light emitting device package 100 can be prevented. The volume area of the air layer 13 can be about 10 cm3, and the thickness can be about 0.1 mm to 0.4 mm.

The light-transmitting cover 10 may include a plurality of hooks 14 that engage with the substrate 20. The hook 14 can improve the bonding force between the transparent cover 10 and the substrate 20. [

Excessive stress can be applied to the light emitting device package 100 when the light emitting cover 10 is peeled off from the substrate 20. [ According to the embodiment, since the coupling strength between the substrate 20 and the transparent cover 10 is improved by the hook 14, the stress applied to the light emitting device package 100 can be reduced.

An insulation line 40 may be disposed between the substrate 20 and the translucent cover 10. The insulating line 40 can prevent the active gas from penetrating into the gap between the substrate 20 and the transparent cover 10. The insulation line 40 may be made of a rubber material, but is not limited thereto and is not particularly limited as long as it satisfies explosion-proof, moisture-proof, and pressure-resistant conditions.

Referring to FIG. 4, the insulation line 40 may form a loop surrounding the plurality of light emitting device packages 100 on the substrate 20. Therefore, since the active gas is prevented from penetrating into the inside of the loop, the explosion-proof function can be improved.

The power supply unit 50 may be disposed at one side to supply external power to each light emitting device package 100. Specifically, the power supply unit 50 may include a pair of wires 53 and 54 connected to the connection terminals 51 and 52 connected to the circuit pattern.

The connection terminals 51 and 52 are disposed outside the loop formed by the insulation line 40. Therefore, the light emitting device package 100 and the circuit pattern can be isolated in the loop.

FIG. 5 is an enlarged view of the socket portion of FIG. 2, FIG. 6 is a sectional view of the socket portion, FIG. 7 is a view illustrating a light emitting device module according to another embodiment of the present invention, Fig.

5 and 6, the wires 53 and 54 connected to the connection terminals 51 and 52 can be bent and inserted into the socket portion 12. [

The socket portion 12 includes a groove 15 surrounding the connection terminals 51 and 52, a projection 19 supporting the wires 53 and 54 connected to the connection terminals 51 and 52, A step portion 18 for supporting the first bent portion 54b of the bent wires 53 and 54 and a step portion 18 formed between the step portion 18 and the substrate 20 to externally expose the wires 53 and 54 And discharging holes 16a and 16b.

The wires 53 and 54 have a front end portion 54a supported by the protruding jaws 19 and a first bent portion 54b bent toward the substrate 20 at an end of the protruding jaws 19, And a second bent portion 54c bent in parallel with the substrate 20 at an end of the second substrate 54b.

According to this configuration, when an external force F1 for pulling the wires 53, 54 occurs, the contact surface 19a of the wires 53, 54 and the protruding jaws 19, the wires 53, 54, The frictional forces f2 and f3 are generated on the contact surface 18a of the contact surface 18a. Therefore, the external force F1 is not directly transmitted to the connecting terminals 51 and 52 and the connecting portions 54d of the wires 53 and 54, respectively. The molding member 55 is filled in the groove 15 to protect the connecting portions 51 and 52 and the connecting portion 54d of the wires 53 and 54. [

Referring to FIG. 7, in the light emitting device module according to another embodiment of the present invention, the socket portion 70 may be detachable from the transparent cover 10. In this case, the protruding jaws 19 may be formed integrally with the transparent cover 10.

The wires 53 and 54 are bent toward the substrate 20 when they are engaged with the socket unit 70 as shown in FIG. 8 in a state of being supported by the projecting step 19 and are exposed to the outside through the discharge holes 72a and 72b .

With such a configuration, the wires 53 and 54 can be bent and fixed simultaneously by only bonding the socket portion 70 to the translucent cover 10 and the substrate 20. Therefore, it is possible to omit the step of manually inserting the wires 53, 54 into the socket portion 70. [

9 is a conceptual view of a light emitting device package.

9, the light emitting device package includes a pad 102, a light emitting element 101 disposed on the pad 102, and an optical lens 103 covering the light emitting element 101. As shown in FIG.

The pad 102 may include a pair of first bumps 104 disposed on one surface, a pair of second bumps 105 disposed on the other surface, and a penetrating electrode 106 connecting them.

The light emitting device 101 includes a light emitting structure disposed under the substrate 110 and electrode pads 150 and 160 disposed on the light emitting structure and electrically connected to the first bump 104.

The substrate 110 includes a conductive substrate or an insulating substrate. The substrate 110 may be a material suitable for semiconductor material growth or a carrier wafer. The substrate 110 may be formed of a material selected from the group consisting of sapphire (Al ₂ O ₃ ), SiC, GaAs, GaN, ZnO, Si, GaP, InP, and Ge. The substrate may be removed as needed.

A buffer layer (not shown) may be further provided between the first semiconductor layer 120 and the substrate 110. The buffer layer may mitigate lattice mismatch between the substrate 110 and the light emitting structure provided on the substrate 110.

The buffer layer may be a combination of Group III and Group V elements or may include any one of GaN, InN, AlN, InGaN, AlGaN, InAlGaN, and AlInN. The buffer layer may be doped with a dopant, but is not limited thereto.

The buffer layer can be grown as a single crystal on the substrate 110, and the buffer layer grown with a single crystal can improve the crystallinity of the first semiconductor layer 120.

The light emitting structure includes a first semiconductor layer 120, an active layer 130, and a second semiconductor layer 140. In general, the above-described light emitting structure may be cut together with the substrate 110 and separated into a plurality of light emitting structures.

The first semiconductor layer 120 may be formed of a compound semiconductor such as group III-V or II-VI, and the first semiconductor layer 120 may be doped with a first dopant. The first semiconductor layer 120 may be a semiconductor material having a composition formula of In _{x 1} Al _{y 1} Ga _{1 -x1-y1} N (0? _{X1? 1} , 0 _{? Y1? 1} , 0? X1 + y1? GaN, AlGaN, InGaN, InAlGaN, and the like. The first dopant may be an n-type dopant such as Si, Ge, Sn, Se, or Te. When the first dopant is an n-type dopant, the first semiconductor layer 120 doped with the first dopant may be an n-type semiconductor layer.

The active layer 130 is a layer where electrons (or holes) injected through the first semiconductor layer 120 and holes (or electrons) injected through the second semiconductor layer 140 meet. As the electrons and the holes recombine, the active layer 130 transitions to a low energy level and can generate light having a wavelength corresponding thereto.

The active layer 130 may have any one of a single well structure, a multiple well structure, a single quantum well structure, a multi quantum well (MQW) structure, a quantum dot structure, Is not limited thereto.

The second semiconductor layer 140 is formed on the active layer 130 and may be formed of a compound semiconductor such as group III-V or II-VI group. The second semiconductor layer 140 may be doped with a second dopant . A second semiconductor layer 140 is a semiconductor material having a compositional formula of _{In x5 Al y2 Ga 1 -x5- y2} N (0≤x5≤1, 0≤y2≤1, 0≤x5 + y2≤1) or AlInN, AlGaAs , GaP, GaAs, GaAsP, and AlGaInP. When the second dopant is a p-type dopant such as Mg, Zn, Ca, Sr, or Ba, the second semiconductor layer 140 doped with the second dopant may be a p-type semiconductor layer.

An electron blocking layer (EBL) may be disposed between the active layer (130) and the second semiconductor layer (140). The electron blocking layer can block the flow of electrons supplied from the first semiconductor layer 120 to the second semiconductor layer 140 and increase the probability of recombination of electrons and holes in the active layer 130. [ The energy band gap of the electron blocking layer may be greater than the energy band gap of the active layer 130 and / or the second semiconductor layer 140.

The electron blocking layer may be formed of a semiconductor material having a composition formula of In _{x 1} Al _{y 1} Ga _{1 -x 1 -y 1} N (0? _{X 1 ? 1} , 0? _{Y 1 ? 1} , 0? _{X 1 + y 1 ? 1} ), for example, AlGaN, InGaN, InAlGaN, and the like, but is not limited thereto.

The first electrode pad 150 may be electrically connected to the first semiconductor layer 120. The first electrode pad 150 may be formed of a material selected from the group consisting of In, Co, Si, Ge, Au, Pd, Pt, Ru, Re, Mg, Zn, Hf, Ta, Rh, Ir, W, Ti, Ag, Al, Ni, Cu, and WTi. The second electrode pad 160 may be electrically connected to the second semiconductor layer 140.

The optical lens 103 may include a sealing material and a wavelength converting material P for converting the wavelength of the light emitted from the light emitting element 101. [ The wavelength converting material (P) may include a phosphor, a quantum dot, a pigment, and the like. The optical lens 103 may be made of silicon in a dome shape, but is not limited thereto, and may have a flat top.

Although the light emitting device module is used in the illumination device in this embodiment, the application field of the light emitting device module is not limited thereto.

The light emitting device module of the embodiment further includes optical members such as a light guide plate, a prism sheet, and a diffusion sheet, and can function as a backlight unit.

At this time, the display device may include a bottom cover, a reflector, a light emitting module, a light guide plate, an optical sheet, a display panel, an image signal output circuit, and a color filter. The bottom cover, the reflector, the light emitting module, the light guide plate, and the optical sheet may form a backlight unit.

The reflector is disposed on the bottom cover, and the light emitting module emits light. The light guide plate is disposed in front of the reflection plate to guide light emitted from the light emitting module forward, and the optical sheet includes a prism sheet or the like and is disposed in front of the light guide plate. The display panel is disposed in front of the optical sheet, and the image signal output circuit supplies an image signal to the display panel, and the color filter is disposed in front of the display panel.

And, the lighting device may include a lamp, a head lamp, a street lamp or the like.

It will be apparent to those skilled in the art that various changes, substitutions, and alterations can be made hereto without departing from the spirit and scope of the invention as defined in the appended claims. Will be apparent to those of ordinary skill in the art.

10: Floodlight cover
20: substrate
40: Isolation line
100: Light emitting device package

Claims (10)

A substrate including a circuit pattern formed on one surface;
A plurality of light emitting device packages disposed on the substrate and electrically connected to the circuit patterns;
A light emitting cover coupled to the substrate to cover the plurality of light emitting device packages;
A power supply unit electrically connected to a connection terminal of a circuit pattern of the substrate; And
And an insulating line disposed between the transparent cover and the substrate,
Wherein the insulation line forms a loop surrounding the plurality of light emitting device packages on the substrate, and the connection terminal is disposed outside the loop.
The method according to claim 1,
Wherein the power supply unit includes a pair of wires electrically connected to the connection terminal.
3. The method of claim 2,
Wherein the light-transmitting cover includes a socket portion to which the wire is fixed,
Wherein the socket portion includes a protrusion supporting a wire connected to the connection terminal, a step portion supporting a first bent portion of the wire bent toward the substrate, and a discharge hole exposing the wire to the outside.
3. The method of claim 2,
And a socket portion which is coupled with the light-transmitting cover to fix the wire,
Wherein the socket portion includes a step portion for bending the wire toward the substrate, and a discharge hole for exposing the wire to the outside.
The method according to claim 1,
And the light-transmitting cover covers a side surface of the substrate.
6. The method of claim 5,
And the light-transmitting cover includes a plurality of hooks engaging with the substrate.
The method according to claim 1,
Wherein the light emitting device package includes a pad electrically connected to the substrate, a light emitting device electrically connected to the pad, and an optical lens controlling light emitted from the light emitting device.
The method according to claim 1,
Wherein the light-transmitting cover includes a plurality of lens units that accommodate the plurality of light-emitting device packages.
9. The method of claim 8,
And an air layer formed between the inner wall of the lens part and the light emitting device package.
A body accommodating the light emitting device module; And
And a power supply unit for supplying power to the light emitting device module,
The light emitting device module includes:
A substrate including a circuit pattern formed on one surface;
A plurality of light emitting device packages disposed on the substrate and electrically connected to the circuit patterns;
A light emitting cover coupled to the substrate to cover the plurality of light emitting device packages;
A power supply unit electrically connected to a connection terminal of a circuit pattern of the substrate; And
And an insulating line disposed between the transparent cover and the substrate,
Wherein the insulation line forms a loop surrounding the plurality of light emitting device packages on the substrate, and the connection terminal is disposed outside the loop.

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