KR20170075412A - Light emitting device moudle and lighting apparatus including the same - Google Patents

Abstract

An embodiment includes a substrate including a first surface and a second surface; A plurality of light emitting device packages electrically connected to one surface of the substrate; A plurality of first protrusions disposed between the plurality of light emitting device packages; And a transparent cover disposed entirely on one surface of the substrate and covering the light emitting device package, wherein the transparent cover has a thickness greater than the thickness of the light emitting device package, and a lighting device including the same.

Description

TECHNICAL FIELD [0001] The present invention relates to a light emitting device module and a lighting device including the light emitting device module.

Embodiments relate to a light emitting device module and a lighting apparatus including the same.

A light emitting device (LED) is a compound semiconductor device that converts electric energy into light energy. By controlling the composition ratio of the compound semiconductor, various colors can be realized.

The nitride semiconductor light emitting device has advantages of low power consumption, semi-permanent lifetime, fast response speed, safety, and environmental friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps. Accordingly, a light emitting diode backlight replacing a cold cathode fluorescent lamp (CCFL) constituting a backlight of an LCD (Liquid Crystal Display) display device, a white light emitting diode lighting device capable of replacing a fluorescent lamp or an incandescent lamp, And traffic lights.

In recent years, Explosion-proof Lamps using light emitting devices have also been used in gas stations and refineries. However, since gas stations and oil refineries are exposed to explosive atmospheres, explosion-proof functions are strictly required.

The embodiments provide a light emitting device module with improved explosion-proof function, and a lighting device including the same.

The embodiment provides a light emitting device module with improved light flux control function, and a lighting device including the same.

The problems to be solved in the embodiments are not limited to these, and the objects and effects that can be grasped from the solution means and the embodiments of the problems described below are also included.

A light emitting device module according to an embodiment of the present invention includes: a substrate including a first surface and a second surface; A plurality of light emitting device packages electrically connected to one surface of the substrate; A plurality of first protrusions disposed between the plurality of light emitting device packages; And a transparent cover disposed entirely on one surface of the substrate and covering the light emitting device package, wherein the thickness of the transparent cover is thicker than the thickness of the light emitting device package.

The light emitting device package may include a pad electrically connected to the substrate, a light emitting device electrically connected to the pad, and an optical lens controlling light emitted from the light emitting device.

The height of the first protrusion may be higher than the height of the pad.

The height of the first protrusion may be higher than the height of the lens.

The height (Ht) of the first protrusion may satisfy the following relational expression (1).

[Relation 1]

Ht? Tan (? / 4) L

Where? Is the directivity angle of the plurality of light emitting device packages, and L is the distance from the center of the light emitting device package to the center of the solder.

The transparent cover may include a lens unit disposed on the light emitting device package.

The curvature of the lens unit may be smaller than the curvature of the optical lens.

The transparent cover may cover the side surface of the substrate.

And a second projection disposed on a side surface of the substrate.

The substrate may include a first hole passing through one surface and the other surface.

The transparent cover may extend to the other surface of the substrate and include a coupling portion filled in the first hole.

The thickness of the transparent cover may be 3.0 mm or more.

According to an embodiment of the present invention, there is provided a lighting apparatus comprising: a body accommodating a light emitting element module; And a power supply unit for supplying power to the light emitting device module, wherein the light emitting device module includes: a substrate including a first surface and a second surface; A plurality of light emitting device packages electrically connected to one surface of the substrate; A plurality of first protrusions disposed between the plurality of light emitting device packages; And a transparent cover disposed entirely on one surface of the substrate and covering the light emitting device package, wherein the thickness of the transparent cover is thicker than the thickness of the light emitting device package.

According to the embodiment, it is possible to prevent the stress applied to the light emitting element according to the temperature change. Therefore, the explosion-proof function can be improved and the lifetime of the light-emitting element can be extended.

Further, the directivity angle of the light emitting element module can be improved.

The various and advantageous advantages and effects of the present invention are not limited to the above description, and can be more easily understood in the course of describing a specific embodiment of the present invention.

1 is a view showing a lighting apparatus according to an embodiment of the present invention,
FIG. 2 is a side view of the light emitting device module of FIG. 1,
3 is an enlarged view of a portion A in Fig. 2,
4 is a conceptual view of a light emitting device package,
5 is a conceptual diagram of a light emitting device module according to another embodiment of the present invention,
6 is a conceptual diagram of a light emitting device module according to another embodiment of the present invention,
7 is a conceptual diagram of a light emitting device module according to another embodiment of the present invention,
8A to 8D are views for explaining a method of manufacturing a light emitting device module according to an embodiment of the present invention.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. It should be understood, however, that the embodiments of the present invention are not intended to be limited to the specific embodiments but include all modifications, equivalents, and alternatives falling within the spirit and scope of the embodiments.

Terms including ordinals, such as first, second, etc., may be used to describe various elements, but the elements are not limited to these terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the embodiments, the second component may be referred to as a first component, and similarly, the first component may also be referred to as a second component. And / or < / RTI > includes any combination of a plurality of related listed items or any of a plurality of related listed items.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the embodiments of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

In the description of the embodiments, in the case where one element is described as being formed "on or under" another element, the upper (upper) or lower (lower) or under are all such that two elements are in direct contact with each other or one or more other elements are indirectly formed between the two elements. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings, wherein like or corresponding elements are denoted by the same reference numerals, and redundant description thereof will be omitted.

1 is a view illustrating a lighting apparatus according to an embodiment of the present invention.

1, a lighting apparatus according to an embodiment includes a body 1 in which a light emitting element module 10 is accommodated, and a power source unit 3 that supplies power to the light emitting element module 10. And a mounting box 2.

The body 1 may include a housing 1a and a light emitting device module 10 disposed in the housing 1a.

The shape of the housing 1a is not limited as long as the housing accommodates the light emitting element module 10. [ Although not shown, a plurality of radiating fins may be mounted on the housing 1a. An inert gas may be injected into the housing 1a.

The power supply unit 3 may include an SMPS (Switching Mode Power Supply), and the mounting box 2 may include various electronic components. The power supply unit 3 may be disposed in the mounting box 2.

The illumination device according to the embodiment may be an Explosion-proof Lamp used in an area exposed to an explosive gas such as an oil refinery, a chemical factory, or a shipyard, but is not limited thereto. The lighting device can be anchored to the installation site (building wall, ceiling, etc.). However, the present invention is not limited to this, and the lighting apparatus may be arranged in a stand-shape.

FIG. 2 is a side view of the light emitting device module of FIG. 1, and FIG. 3 is an enlarged view of a portion A of FIG.

2, the light emitting device module 10 includes a substrate 11 including a first surface 11a and a second surface 11b, a plurality of light emitting device packages 100 electrically connected to one surface of the substrate 11, A plurality of first protrusions 13 disposed between the plurality of light emitting device packages 100 and a transparent cover 12 disposed entirely on one surface of the substrate 11 and covering the light emitting device package 100.

The substrate 11 can be selected from various types of circuit boards on which a circuit pattern is formed on one surface 11a. The substrate 11 may be a metal PCB.

The light emitting device package 100 may be mounted on the substrate 11 and electrically connected thereto. The first protrusion 13 may be disposed between the plurality of light emitting device packages 100. The first protrusion 13 may have various shapes such as a strip shape, a rod shape, and the like.

The transparent cover 12 may be entirely disposed on one surface of the substrate 11 to cover the light emitting device package 100 and the first protrusion 13. [ Explosive gases can penetrate into small gaps in the fixture. Therefore, a large explosion may occur when the spark generated when power is applied to the load comes into contact with the explosive gas. Accordingly, the transparent cover 12 can completely cover one surface 11a of the substrate on which sparks may occur, thereby blocking the contact with the gas.

The transparent cover 12 may comprise a silicon material. However, the present invention is not limited thereto, and any transparent material satisfying the requirements of explosion-proof, moisture-proof and pressure-proof can be applied without limitation. The transparent cover 12 may have a thickness of 3.0 mm or more to satisfy explosion-proof, moisture-proof, and pressure-resistant conditions.

The transparent cover 12 may include a plurality of lens units 12a disposed in regions corresponding to the plurality of light emitting device packages 100. [ The lens portion 12a can improve the directivity angle of the light emitted from the light emitting device package 100. [

3, the plurality of light emitting device packages 100 include a pad 102 electrically connected to the substrate 11, a light emitting device 101 electrically connected to the pad 102, and a light emitting device 101, And an optical lens 103 for controlling the light emitted from the light source. The light emitting device 101 may be connected to the pad 102 using a wire or the like.

The first protrusion 13 can prevent the light emitting device package 100 from being damaged due to the difference in thermal expansion coefficient between the transparent cover 12 and the substrate 11. [

The transparent cover 12 varies in the range of 120 ° C. to 180 ° C. at the time of curing and can be exposed to a low temperature environment of -40 ° C. depending on the installation position. On the other hand, the light emitting device package 100 can be repeatedly changed to 100 ° C or more. Accordingly, a temperature deviation may occur between the substrate 11 and the transparent cover 12. [

Generally, the thermal expansion coefficient (CTE) of the metal PCB is 20 to 30 ppm / ° C, and the thermal expansion coefficient (CTE) of silicon is 200 to 300 ppm / ° C. Therefore, stress is generated due to the CTE difference between the bonded substrate 11 and the transparent cover 12, and such stress may be applied to the light emitting device package 100 to cause a failure.

The first protrusion 13 may be made of a polymer material or a metal material. The first protrusion 13 may be higher than the height H2 of the pad 102. [ In this case, the stress applied to the interface between the pad 102 of the light emitting device package 100 and the optical lens 103 can be cut off. When the height Ht of the first projection 13 is equal to or higher than the height H1 of the optical lens, the stress can be effectively blocked. If the thickness of the first projection 13 is 1.6 mm or more, external stress can be effectively blocked.

The height Ht of the first protrusion 13 can satisfy the following relational expression (1).

[Relation 1]

Ht? Tan (? / 4) L

Here,? Is a directivity angle of the plurality of light emitting device packages 100, and L is a distance from the center of the light emitting device package 100 to the center of the first protrusion 13.

The directivity angle of light emitted from the light emitting device package 100 can be controlled by the optical lens 103 and the lens unit 12a. At this time, the curvature of the lens portion 12a may be smaller than the curvature of the optical lens 103. [ That is, the lens portion 12a can be relatively flat. The problem of narrowing the directivity angle by the first projection 13 can be solved when the above-described relational expression 1 is satisfied.

4 is a conceptual view of a light emitting device package.

4, the light emitting device package 100 includes a pad 102, a light emitting element 101 disposed on the pad 102, and an optical lens 103 covering the light emitting element 101.

The pad 102 may include a pair of first bumps 104 disposed on one surface, a pair of second bumps 105 disposed on the other surface, and a penetrating electrode 106 connecting them.

The light emitting device 101 includes a light emitting structure disposed under the substrate 110 and electrode pads 150 and 160 disposed on the light emitting structure and electrically connected to the first bump 104.

The substrate 110 includes a conductive substrate or an insulating substrate. The substrate 110 may be a material suitable for semiconductor material growth or a carrier wafer. The substrate 110 may be formed of a material selected from the group consisting of sapphire (Al ₂ O ₃ ), SiC, GaAs, GaN, ZnO, Si, GaP, InP, and Ge. The substrate may be removed as needed.

A buffer layer (not shown) may be further provided between the first semiconductor layer 120 and the substrate 110. The buffer layer may mitigate lattice mismatch between the substrate 110 and the light emitting structure provided on the substrate 110.

The buffer layer may be a combination of Group III and Group V elements or may include any one of GaN, InN, AlN, InGaN, AlGaN, InAlGaN, and AlInN. The buffer layer may be doped with a dopant, but is not limited thereto.

The buffer layer can be grown as a single crystal on the substrate 110, and the buffer layer grown with a single crystal can improve the crystallinity of the first semiconductor layer 120.

The light emitting structure includes a first semiconductor layer 120, an active layer 130, and a second semiconductor layer 140. In general, the above-described light emitting structure may be cut together with the substrate 110 and separated into a plurality of light emitting structures.

The first semiconductor layer 120 may be formed of a compound semiconductor such as group III-V or II-VI, and the first semiconductor layer 120 may be doped with a first dopant. The first semiconductor layer 120 may be a semiconductor material having a composition formula of In _{x 1} Al _{y 1} Ga _{1 -x1-y1} N (0? _{X1? 1} , 0 _{? Y1? 1} , 0? X1 + y1? GaN, AlGaN, InGaN, InAlGaN, and the like. The first dopant may be an n-type dopant such as Si, Ge, Sn, Se, or Te. When the first dopant is an n-type dopant, the first semiconductor layer 120 doped with the first dopant may be an n-type semiconductor layer.

The active layer 130 is a layer where electrons (or holes) injected through the first semiconductor layer 120 and holes (or electrons) injected through the second semiconductor layer 140 meet. As the electrons and the holes recombine, the active layer 130 transitions to a low energy level and can generate light having a wavelength corresponding thereto.

The active layer 130 may have any one of a single well structure, a multiple well structure, a single quantum well structure, a multi quantum well (MQW) structure, a quantum dot structure, Is not limited thereto.

The second semiconductor layer 140 is formed on the active layer 130 and may be formed of a compound semiconductor such as group III-V or II-VI group. The second semiconductor layer 140 may be doped with a second dopant . A second semiconductor layer 140 is a semiconductor material having a compositional formula of _{In x5 Al y2 Ga 1 -x5- y2} N (0≤x5≤1, 0≤y2≤1, 0≤x5 + y2≤1) or AlInN, AlGaAs , GaP, GaAs, GaAsP, and AlGaInP. When the second dopant is a p-type dopant such as Mg, Zn, Ca, Sr, or Ba, the second semiconductor layer 140 doped with the second dopant may be a p-type semiconductor layer.

An electron blocking layer (EBL) may be disposed between the active layer (130) and the second semiconductor layer (140). The electron blocking layer can block the flow of electrons supplied from the first semiconductor layer 120 to the second semiconductor layer 140 and increase the probability of recombination of electrons and holes in the active layer 130. [ The energy band gap of the electron blocking layer may be greater than the energy band gap of the active layer 130 and / or the second semiconductor layer 140.

The electron blocking layer may be formed of a semiconductor material having a composition formula of In _{x 1} Al _{y 1} Ga _{1 -x 1 -y 1} N (0? _{X 1 ? 1} , 0? _{Y 1 ? 1} , 0? _{X 1 + y 1 ? 1} ), for example, AlGaN, InGaN, InAlGaN, and the like, but is not limited thereto.

The first electrode pad 150 may be electrically connected to the first semiconductor layer 120. The first electrode pad 150 may be formed of a material selected from the group consisting of In, Co, Si, Ge, Au, Pd, Pt, Ru, Re, Mg, Zn, Hf, Ta, Rh, Ir, W, Ti, Ag, Al, Ni, Cu, and WTi. The second electrode pad 160 may be electrically connected to the second semiconductor layer 140.

The optical lens 103 may include a sealing material and a wavelength converting material P for converting the wavelength of the light emitted from the light emitting element 101. [ The wavelength converting material (P) may include a phosphor, a quantum dot, a pigment, and the like. The optical lens 103 may be made of silicon in a dome shape, but is not limited thereto, and may have a flat top.

FIG. 5 is a conceptual diagram of a light emitting device module according to another embodiment of the present invention, FIG. 6 is a conceptual diagram of a light emitting device module according to another embodiment of the present invention, FIG. 7 is a cross- Fig.

Referring to FIG. 5, the first protrusion 13 may include a core 13b made of a silicon material and a surface layer 13a made of a metal. According to this structure, the first protrusion 13 can be integrally formed on the substrate 11 in the surface mounting step.

The transparent cover 12 can cover the side surface of the substrate 11. At this time, the second protrusion 14 is formed on the side surface of the substrate 11, so that the coupling force between the transparent cover 12 and the substrate 11 can be improved. Excessive stress can be applied to the light emitting device package 101 when the transparent cover 12 is peeled off from the substrate 11. [ According to the embodiment, since the bonding force between the substrate 11 and the transparent cover 12 is further improved, the stress applied to the light emitting device package can be reduced.

6, the substrate 11 includes a first hole 11a passing through one surface and the other surface of the substrate 11. The transparent cover 12 extends to the other surface 11b of the substrate 11, And a coupling portion 12d filled in the coupling portion 11a. According to the embodiment, the coupling force between the substrate 11 and the transparent cover 12 is further improved by the engaging portion 12d, thereby reducing the stress applied to the light emitting device package.

Referring to Fig. 7, the transparent cover 12 may include an insertion groove 12d into which the substrate 11 can be fitted. According to the embodiment, since the transparent cover 12 and the substrate 11 are manufactured and coupled, stress due to the difference in thermal expansion coefficient between the transparent cover 12 and the substrate 11 may not be generated.

8A to 8D are views for explaining a method of manufacturing a light emitting device module according to an embodiment of the present invention.

Referring to FIG. 8A, a plurality of light emitting device packages 100 are mounted on a substrate 11. The light emitting device package 100 includes a pad 102 soldered with the substrate 11, a light emitting device 101 electrically connected to the pad 102, and an optical lens 103 covering the light emitting device 101 can do.

Referring to FIG. 8B, the first protrusions 13 are disposed between the plurality of light emitting device packages 100. The first protrusions 13 may be formed on the substrate 11 or by using a surface mounting technique (SMT). The height of the first projection 13 may be higher than the pad 102. In addition, the height of the first protrusion 13 can satisfy the above-described relational expression 1.

Referring to FIG. 8C, the manufactured light emitting element module 10 may be disposed between the molds B1 and B2, and then the resin may be injected to entirely cover one side of the substrate 11. FIG. The thickness of the transparent cover 12 is set to about 3.0 mm or more and covers the side surface of the substrate 11 so that the contact between the explosive gas and the substrate 11 can be originally blocked. When the cross section of the first projection 13 is a dome or triangular shape, the flow of resin may be smooth during injection. Thereafter, as shown in FIG. 8D, the molding die is removed to complete the fabrication of the light emitting device module 10. FIG.

Although the light emitting device module is used in the illumination device in this embodiment, the application field of the light emitting device module is not limited thereto.

The light emitting device module of the embodiment further includes optical members such as a light guide plate, a prism sheet, and a diffusion sheet, and can function as a backlight unit.

At this time, the display device may include a bottom cover, a reflector, a light emitting module, a light guide plate, an optical sheet, a display panel, an image signal output circuit, and a color filter. The bottom cover, the reflector, the light emitting module, the light guide plate, and the optical sheet may form a backlight unit.

The reflector is disposed on the bottom cover, and the light emitting module emits light. The light guide plate is disposed in front of the reflection plate to guide light emitted from the light emitting module forward, and the optical sheet includes a prism sheet or the like and is disposed in front of the light guide plate. The display panel is disposed in front of the optical sheet, and the image signal output circuit supplies an image signal to the display panel, and the color filter is disposed in front of the display panel.

And, the lighting device may include a lamp, a head lamp, a street lamp or the like.

It will be apparent to those skilled in the art that various changes, substitutions, and alterations can be made hereto without departing from the spirit and scope of the invention as defined in the appended claims. Will be apparent to those of ordinary skill in the art.

1: Body
10: Light emitting device module
11: substrate
12: Transparent cover
13: first projection
100: Light emitting device package
101: Light emitting element
102: Pad
103: Optical lens

Claims (16)

A substrate including a first surface and a second surface;
A plurality of light emitting device packages electrically connected to one surface of the substrate;
A plurality of first protrusions disposed between the plurality of light emitting device packages; And
And a transparent cover disposed entirely on one surface of the substrate and covering the light emitting device package,
Wherein a thickness of the transparent cover is greater than a thickness of the light emitting device package.
The method according to claim 1,
Wherein the light emitting device package includes a pad electrically connected to the substrate, a light emitting device electrically connected to the pad, and an optical lens controlling light emitted from the light emitting device.
3. The method of claim 2,
The height of the first protrusion is higher than the height of the pad.
3. The method of claim 2,
Wherein the height of the first protrusion is higher than the height of the lens.
3. The method of claim 2,
And a height (Ht) of the first protrusion satisfies the following relational expression (1).
[Relation 1]
Ht? Tan (? / 4) L
Where? Is the directivity angle of the plurality of light emitting device packages, and L is the distance from the center of the light emitting device package to the center of the solder.
3. The method of claim 2,
And the transparent cover includes a lens portion disposed on the light emitting device package.
The method according to claim 6,
Wherein a curvature of the lens portion is smaller than a curvature of the optical lens.
The method according to claim 1,
And the transparent cover covers a side surface of the substrate.
9. The method of claim 8,
And a second projection disposed on a side surface of the substrate.
9. The method of claim 8,
Wherein the substrate includes a first hole passing through one surface and the other surface.
11. The method of claim 10,
Wherein the transparent cover extends to the other surface of the substrate and includes a coupling portion filled in the first hole.
The method according to claim 1,
Wherein the transparent cover has a thickness of 3.0 mm or more.
A body accommodating the light emitting device module; And
And a power supply unit for supplying power to the light emitting device module,
The light emitting device module includes:
A substrate including a first surface and a second surface;
A plurality of light emitting device packages electrically connected to one surface of the substrate;
A plurality of first protrusions disposed between the plurality of light emitting device packages; And
And a transparent cover disposed entirely on one surface of the substrate and covering the light emitting device package,
Wherein a thickness of the transparent cover is thicker than a thickness of the light emitting device package.
14. The method of claim 13,
Wherein the light emitting device package includes a pad electrically connected to the substrate, a light emitting device electrically connected to the pad, and an optical lens controlling light emitted from the light emitting device.
15. The method of claim 14,
And the height of the first projection is higher than the height of the optical lens.
14. The method of claim 13,
And the height (Ht) of the first projection satisfies the following relational expression (1).
[Relation 1]
Ht? Tan (? / 4) L
Where? Is the directivity angle of the plurality of light emitting device packages, and L is the distance from the center of the light emitting device package to the center of the solder.

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