KR20170022171A - Connector, light source module and light source module array using the same - Google Patents

Connector, light source module and light source module array using the same Download PDF

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Publication number
KR20170022171A
KR20170022171A KR1020150116838A KR20150116838A KR20170022171A KR 20170022171 A KR20170022171 A KR 20170022171A KR 1020150116838 A KR1020150116838 A KR 1020150116838A KR 20150116838 A KR20150116838 A KR 20150116838A KR 20170022171 A KR20170022171 A KR 20170022171A
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KR
South Korea
Prior art keywords
connector
light source
portion
plurality
source module
Prior art date
Application number
KR1020150116838A
Other languages
Korean (ko)
Inventor
장준
Original Assignee
삼성전자주식회사
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Priority to KR1020150116838A priority Critical patent/KR20170022171A/en
Publication of KR20170022171A publication Critical patent/KR20170022171A/en

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    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00Protecting lighting devices from damage
    • F21V15/01Housings, e.g. material or assembling of housing parts
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/28Clamped connections, spring connections
    • H01R4/48Clamped connections, spring connections utilising a spring, clip, or other resilient member
    • H01R4/4809Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring
    • H01R4/4845Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring insertion of a wire only possible by pressing on the spring
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00Point-like light sources
    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133602Direct backlight
    • G02F1/133603Direct backlight with LEDs
    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133602Direct backlight
    • G02F2001/133612Electrical details
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCBs], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCBs], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/53Fixed connections for rigid printed circuits or like structures connecting to cables except for flat or ribbon cables
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCBs], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/72Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/732Printed circuits being in the same plane
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/28Clamped connections, spring connections
    • H01R4/48Clamped connections, spring connections utilising a spring, clip, or other resilient member
    • H01R4/4809Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring
    • H01R4/4818Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring adapted for axial insertion of a wire end
    • H01R4/4836Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring adapted for axial insertion of a wire end with integral release means

Abstract

A connector according to an embodiment of the present invention includes first and second connecting portions coupled to an inserted wire and disposed to face each other in opposite directions, a housing covering the first and second connecting portions, And a push button for releasing the engagement between the first and second connection portions and the wire by an externally applied force.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a connector, a light source module, and a light source module array using the connector,

The present invention relates to a connector, a light source module, and a light source module array using the same.

2. Description of the Related Art A light emitting diode (LED), which is a kind of semiconductor light emitting device, is a semiconductor device capable of generating light of various colors due to recombination of electrons and holes at a junction portion of p and n type semiconductors when an electric current is applied. Such a light emitting diode has been continuously increasing in demand because it has many advantages such as a long lifetime, a low power supply, an excellent initial driving characteristic, and a high vibration resistance as compared with a light emitting device based on a filament. Particularly, in recent years, a group III nitride semiconductor capable of emitting light in a short wavelength range of a blue series has been spotlighted.

Conventional cold cathode fluorescent lamps (CCFL) have been used for the light emitting modules used for LCD backlight, but since CCFL uses mercury gas, it can cause environmental pollution, has a slow response time, And it was not suitable for light-weight shortening of LCD panel. On the other hand, light emitting diodes are eco-friendly, and response speed is as high as several nanoseconds, which is effective for video signal streams, enables impulsive driving, has a color reproducibility of 100% or more, The color temperature and the like can be arbitrarily changed by adjusting the light quantity of the LCD panel, and the LCD panel has merits that are suitable for light-weight and short-circuiting of the LCD panel.

As the range in which the light emitting diode is employed as a light emitting module for backlighting is widened, studies for lowering the manufacturing cost and shortening the manufacturing time have been continued. In particular, techniques have been proposed to reduce the cost of fabricating light source modules and light source module arrays and the time required for assembly.

One of the technical problems to be solved by the technical idea of the present invention is to provide a connector, a light source module and a light source module array using the same, which are used to reduce the manufacturing cost and shorten the manufacturing time of the light source module and the light source module array .

A connector according to an embodiment of the present invention includes first and second connecting portions coupled to an inserted wire and disposed to face each other in opposite directions, a housing covering the first and second connecting portions, And a push button for releasing the engagement between the first and second connection portions and the wire by an externally applied force.

For example, a push button exposure hole is provided on the upper surface of the housing to expose the push button in an upward direction of the housing, and a path for moving the push button in a downward direction of the housing, As shown in FIG.

For example, the first and second connecting portions may each include a soldering portion in the form of a plate soldered to a circuit board, a plurality of soldering portions extending along a direction intersecting the upper surface of the soldering portion, A covering portion extending from the covering portion and having a width narrower toward the one end of the covering portion, a coupling portion coupling with the inserted wire in an area adjacent to one end of the covering portion, And a coupling release part having a gap through which a part of the push button is inserted and releasing the engagement between the inserted wire and the coupling part when a part of the push button is inserted into the gap.

For example, the push button is supported by an elastic member, and can be separated from the unlocking portion by the elastic member.

For example, the first and second connection portions may further include an insulating partition disposed between the first and second connection portions to electrically isolate the first and second connection portions from each other.

For example, the push button may release the engagement between the first and second connecting portions and the inserted wire by the externally applied force.

For example, the first and second connection portions may be disposed symmetrically with respect to the push button.

For example, the housing may be formed by molding the first and second connecting portions.

For example, at least a portion of the soldering portion may be exposed to the lower portion of the housing to bend along a direction in which the inserted wire extends.

A light source module according to an embodiment of the present invention includes a circuit board having a plurality of light emitting elements arranged along a first direction and a connector disposed on one surface of the circuit board and electrically connected to the plurality of light emitting elements, The connector includes first and second connectors coupled to an inserted wire and disposed opposite to each other, a housing covering the first and second connectors, and a connector disposed on the first and second connectors, And a push button for releasing the engagement of the wire with the first and second connecting portions by an applied force.

In one example, the circuit board may be bar-shaped.

For example, the connector may be disposed only on one side with respect to the plurality of light emitting elements.

For example, the connector may include first and second connectors, and the first and second connectors may be disposed apart from the plurality of light emitting devices by a predetermined distance.

For example, the first and second connection portions may be disposed to face both ends of the circuit board, respectively.

For example, the circuit board may include a coupling hole into which the housing is inserted.

A light source module array according to an exemplary embodiment of the present invention includes a circuit board having a plurality of light emitting elements arranged along a first direction and a plurality of light emitting elements arranged on one surface of the plurality of circuit boards and electrically connected to the plurality of light emitting elements 1 and a second connector, wherein each of the first and second connectors includes first and second connectors mechanically coupled to the inserted wire and disposed opposite to each other, The inserted wire electrically connects the second connector of one of the plurality of light source modules to the first connector of another adjacent light source module.

For example, the plurality of light source modules may be connected to each other in series.

For example, the inserted wire may electrically connect the second connection portion of the second connector of any one of the plurality of light source modules with the first connection portion of the first connector of the adjacent another light source module.

For example, the plurality of light source modules may be connected in parallel with each other.

For example, the inserted wire electrically connects the first connection portion of the second connector of any one of the plurality of light source modules to the first connection portion of the first connector of the adjacent other light source module, The second connector of the second connector of the light source module may be electrically connected to the second connector of the first connector of the adjacent light source module.

The width of the light source module can be reduced and the time for connecting the wires to manufacture the light source module array can be shortened so that the light source module and the light source module array with reduced manufacturing time and manufacturing cost can be provided.

Also, a connector that can be used to manufacture such a light source module and a light source module array can be provided.

The various and advantageous advantages and effects of the present invention are not limited to the above description, and can be more easily understood in the course of describing a specific embodiment of the present invention.

1 is a schematic plan view of a light source module according to an embodiment of the present invention.
Figure 2 is a perspective view of the connector of Figure 1;
3 is an exploded perspective view of the connector of Fig.
FIG. 4 is a cross-sectional view showing a state where a wire is inserted into the connector of FIG. 2. FIG.
5 (a) to 6 (b) are views showing a state in which connection of the wire is released by depressing a push button.
7 is a modification of the connector of Fig.
8 shows an example in which a plurality of light source modules are connected in series.
9 is an example in which a plurality of light source modules are connected in parallel.
10 is an example of a light source module array.
11 (a) is another example of the light source module array.
11 (b) is a cross-sectional view showing a state in which the connector of Fig. 11 (a) is mounted.
12 and 13 show an example of a light emitting device employed in the light source module of FIG.
14 shows an example of a lighting device employing the light source module of Fig.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

The embodiments of the present invention may be modified into various other forms or various embodiments may be combined, and the scope of the present invention is not limited to the following embodiments. Further, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shapes and sizes of the elements in the drawings may be exaggerated for clarity of description, and the elements denoted by the same reference numerals in the drawings are the same elements.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. As used herein, terms such as " comprise, "" comprise ", or "have ", and the like, specify features, numbers, steps, operations, elements, parts, or combinations thereof described in the specification Steps, operations, elements, parts, or combinations thereof, which do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof. The term "and / or" includes any and all combinations of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various elements, components, regions, layers and / or portions, these members, components, regions, layers and / It is obvious that no. These terms are only used to distinguish one region, layer or portion from another region, layer or portion. Therefore, the first connecting portion or the first connector, which will be described below, can refer to the second connecting portion or the first connector without departing from the teachings of the present invention.

A light source module according to an embodiment of the present invention will be described with reference to FIG. 1 is a schematic plan view of a light source module according to an embodiment of the present invention.

1, the light source module 10 may include a circuit board 400 on which a plurality of light emitting devices 300 are disposed, and connectors 100 and 200 disposed on one side of the circuit board 400 .

The circuit board 400 has circuit wirings electrically connected to the plurality of light emitting devices 300 and may have a bar shape extending in one direction. The circuit board 400 may be adapted to be configured as a backlight unit by vertically or laterally aligning the chassis structure of the LCD panel by such a shape. However, the shape of the circuit board 400 is not limited thereto, and may be variously modified.

The circuit board 400 may be a printed circuit board (PCB), and may be formed of an organic resin material containing epoxy, triazine, silicone, polyimide or the like and other organic resin materials. The circuit board 400 may be formed of a ceramic material such as AlN, Al 2 O 3 , or a metal or a metal compound. For example, the circuit board 400 may include MCPCB, which is a kind of metal PCB.

The light emitting device 300 may be any device that emits light when an electrical signal is applied. In one embodiment, a light emitting diode (LED) may be used as the light emitting device 300. As such a light emitting diode, a semiconductor light emitting element in which a semiconductor layer is epitaxially grown on a growth substrate can be used.

The growth substrate may be sapphire, but is not limited thereto. For example, growth substrates such as spinel, SiC, GaN, and GaAs may be used. In detail, the light emitting device 300 may be made of BN, SiC, ZnSe, GaN, InGaN, InAlGaN, AlGaN, BAlGaN, BInAlGaN or the like and may be doped with Si or Zn.

The active layer of the light emitting device 300 may be formed of a nitride semiconductor made of Al x In y Ga 1 -x- y N (0? X? 1, 0? Y? 1, 0? X + And can have a single or multiple quantum well structure to enhance the light output.

The light emitting device 300 may be a nitride semiconductor that emits a short wavelength of 300 to 460 nm so that the emitted light can be converted into white light by a wavelength converting material such as a phosphor or a quantum dot.

A plurality of the light emitting devices 300 may be provided on the circuit board 400, and the plurality of light emitting devices 300 may be electrically connected to each other. For example, the plurality of light emitting devices 300 may be connected to one another in series or in parallel. It may also be configured to be connected in series-parallel.

When the circuit board 400 has a bar shape, the plurality of light emitting devices 300 may be arranged at regular intervals along the longitudinal direction d1 of the circuit board 400. [ In addition, the light emitting device 300 may be disposed at a position that divides the width d2 of the circuit board 400 by half. The light emitting device 300 may be mounted on the circuit board 400 in a chip state (so-called COB structure), and may be packaged and mounted.

Specifically, in one embodiment, as shown in FIG. 1, a total of 24 light emitting devices 300 can be arranged in the longitudinal direction d1 of the bar-shaped circuit board 400. [ At this time, the 24 light emitting devices 300 can form the light emitting device strings S1 to S3 in 8 units. Each of the light emitting element strings S1 to S3 may be arranged in parallel with each other. The eight light emitting elements 300 forming each of the light emitting element strings S1 to S3 may be arranged in series with each other. However, the number and arrangement of the light emitting devices 300 are not limited thereto and can be variously modified.

The connectors 100 and 200 are configured to apply power to the plurality of light emitting devices 300, and at least one pair of the connectors 100 and 200 may be provided on one surface of the circuit board 400. The light emitting device 300 may be disposed on only one side of the circuit board 400 with reference to the plurality of light emitting devices 300 in one area of the surface on which the light emitting device 300 is mounted.

First connectors 120 and 220 and second connectors 130 and 230 may be disposed on both ends of the connectors 100 and 200, respectively, to which power wires are inserted and fixed. Since the first connection portions 120 and 220 and the second connection portions 130 and 230 are disposed opposite to each other at both ends of the connectors 100 and 200, the first connection portions 120 and 220, Each of the wires inserted into the connection portions 130 and 230 can be inserted in directions opposite to each other.

The light source module 10 employing the connectors 100 and 200 of one embodiment is advantageous in that the manufacturing cost is reduced and the manufacturing time is shortened as compared with the light source module in which the conventional connector is employed. This will be described.

The light source module of one embodiment can be applied to various fields, but a case where the light source module is applied to a back light of an LCD panel will be described as an example. The backlight should be able to illuminate the LCD panel with uniform light. Therefore, in order to illuminate the light more uniformly, there was a necessity to dispose a larger number of light source modules in the chassis structure of the LCD panel.

Conventionally, a light source module is configured using a so-called two-pin connector in which first and second connecting portions connecting wires are arranged in the same direction on one end of a connector. In such a two-pin connector, since the first and second connecting portions are arranged parallel to each other in the same direction, the width of the connector has to be such that the two wires can be inserted.

Therefore, in order to mount the 2-pin connector, it has been required to use a wide circuit board. Such a wide circuit board has a problem in that it increases the manufacturing cost and hinders the placement of a larger number of light source modules in the chassis structure of the LCD panel.

In order to solve this problem, a relatively narrow one-pin connector has been used. However, since the one-pin connector is a connector in which only one connecting portion is disposed, a connector twice as large as that in the case of using a two-pin connector has to be mounted. Therefore, the manufacturing time is increased. In addition, the number of connectors increases and manufacturing costs increase.

In order to solve these problems, the present embodiment is characterized in that the connectors 100, 200 having the structure in which the first connecting portions 120, 220 for inserting the wires and the second connecting portions 130, 230 are arranged on the same line, ).

Therefore, the width of the connector 100 can be narrowed to less than half as compared with the case of using a conventional two-pin connector in which the first and second connecting portions are provided in the same direction at one end of the connector have. Therefore, there is an advantage that the area for mounting the connector is reduced to half or less. Therefore, a circuit board with a narrower width (d2) than that of the conventional circuit board can be used, so that the manufacturing cost is reduced.

Since the first connecting portions 120 and 220 and the second connecting portions 130 and 230 are disposed opposite to each other at both ends of the connectors 100 and 200, the first and second connecting portions, The shorting between the wires inserted into the first and second connecting portions is fundamentally prevented as compared with the conventional two-pin connector arranged so as to face the same direction.

In addition, the number of necessary connectors is reduced to half as compared with the case of using a one-pin connector, so that the manufacturing cost is reduced and the time required for mounting the connector is reduced.

The connector 100 will be described in detail with reference to Figs. 2 to 6 (b). Fig. 2 is a perspective view of the connector of Fig. 1, and Fig. 3 is an exploded perspective view of the connector of Fig. 2. Fig. Fig. 4 is a cross-sectional view showing a state where a wire is inserted into the connector of Fig. 2, and Figs. 5 (a) to 6 (b) are views showing a state where connection of a wire is released by pressing a push button.

2, the connector 100 includes first and second connection portions 120 and 130 to which wires are connected, a housing 110 that covers the first and second connection portions 120 and 130, And a push button 140 for releasing the connection of the first and second connection portions 120 and 130.

Referring to FIG. 3, the first and second connecting portions 120 and 130 include soldering portions 121 and 131, covering portions 122 and 132, fastening portions 123 and 133, and fastening releasing portions 124 and 134 ). When the connector 100 is mounted on the circuit board 400, the first and second connecting portions 120 and 130 are electrically connected to the circuit board 400 And may be arranged to face both ends. The first and second connection portions 120 and 130 may be spaced apart from each other so that an electrical short circuit does not occur. Also, the first and second connection units 120 and 130 may be arranged to be symmetrical with respect to the push button 140, which will be described later.

Further, an insulator for electrically separating the first and second connection portions 120 and 130 may be further disposed. One embodiment may form an insulating barrier 114 in one region of the housing 110 as an insulator (see FIG. 4).

Since the first connection unit 120 and the second connection unit 130 have the same configuration, only the first connection unit 120 will be described in order to avoid repetitive explanations with respect to the detailed structure.

The soldering portion 121 is a portion to be soldered and attached when the connector 100 is mounted on the circuit board 400. The soldering portion 121 may be formed in a flat plate shape to facilitate soldering.

The covering portion 122 may extend along a direction crossing the upper surface of the soldering portion 121. The covering portion 122 may be formed in a pair so that a part of the upper portion of the covering portion 122 may be bent so as to surround the wire inserted in the one end direction of the soldering portion 121. Each of the covering portions 122 extends vertically upward from the soldering portion 121 so that the outer surface of the vertically extending portion of the covering portion 122 is coupled with the side surface of the housing 110, And the engagement protrusions 122a are formed to protrude outward.

The fastening portions 123 may extend from the respective covering portions 122 and may have a width narrower toward one end of the covering portion 122. The fastening part 123 may be fastened while being coupled with a wire inserted in an area adjacent to one end of the covering part 122.

The fastening part 123 includes a first extending part 123a extending from the covering part 122 to the other end direction of the soldering part 121 and bent in a direction opposite to the direction opposite to the first extending part 123a, A second extending portion 123b extending from the second extending portion 123b to the other end direction of the soldering portion 121 and extending in parallel to the other end direction of the soldering portion 121, And a third extending portion 123c extending obliquely to the viewing direction and having a wire inserted and fastened between the end portions. With this bending structure, the fastening portion 123 has an elastic force.

Unlocking portions 124 are respectively disposed on the upper portions of the fastening portions 123 and are arranged to face each other with a gap through which a part of the push button 140 is inserted. In particular, it may extend from the top of the second extending portion 123b.

The first and second fitting portions 142 and 143 of the push button 140 are inserted into the gap to widen the coupling portion 123 when the wire is disengaged, As shown in FIG.

The housing 110 may be formed by molding an insulating resin. The housing 110 has a side surface and an upper surface. The upper surface of the housing 110 is formed with a push button exposing hole 113 for exposing the push button 140 upward, and wire insertion holes 111 and 112, Respectively.

The housing 110 may be formed by inserting the first and second connecting portions 120 and 130 and performing insert injection molding. The housing 110 may be formed by double injection molding, but the present invention is not limited thereto. The housing 110 may be separately manufactured and coupled to the first and second connecting portions 120 and 130. The insulating partition wall 114 may be disposed inside the housing 110 such that the first and second connection portions 120 and 130 are electrically separated from each other.

The push button 140 is accommodated in the inner space of the housing 110 and is disposed on the first and second connection portions 120 and 130 so that the first push button 140 is pushed by the external force, And the second connection units 120 and 130 can be disconnected. The push button 140 may include a locking part 141 and first and second fitting parts 142 and 143. [

An upper portion of the push button 140 is arranged to be smaller than a push button exposure hole 113 so that the upper portion of the push button 140 is exposed through a push button exposure hole 113, As shown in FIG.

The latching part 141 may be formed to have a larger size than the push button exposure hole 113 as a whole so that the push button 140 is not separated through the push button exposure hole 113. [

The first and second fitting portions 142 and 143 may be disposed under the locking portion 141. [ The first and second fitting portions 142 and 143 are disposed on the unlocking portions 124 and 134 so that when an external force is applied to the push button 140, 124 and 134, so that the fastening portions 123 and 133 can be opened and the wire can be removed. Therefore, by pressing the push button 140, the respective wires sandwiched between the fastening portions 123 and 133 can be removed at a time.

The first and second fitting portions 142 and 143 are disposed under the push button 140. However, the first and second fitting portions 142 and 143 It is also possible to deform the push button to be disposed.

A resilient member such as a spring 150 is disposed under the latching portion 141 so that the push button 140 can be configured to be lifted when the external force is applied to the push button 140 have.

A process of releasing the fastening of the wire 500 inserted into the connector 100 will be described with reference to Figs. 4 to 6 (b).

4 shows a state in which a wire 500 is inserted into the first and second connection portions 120 and 130 so that the covering portion 520 of the wire 500 is inserted into the covering portion 122, And the wire portion 510 is fastened. Fig. 5 (a) is a cross-sectional view taken along the line B-B 'in Fig. 4, and Fig. 5 (b) is a cross-sectional view taken along the line C-C' in Fig.

5 (a), the first fitting portion 142 is spaced apart from the upper portion of the unlocking portion 124 before the push button 140 is pressed. 5 (b), the third extended portion 123c of the fastening portion 123 is connected to the wire portion 510. As shown in Fig.

When the push button 140 is pressed as shown in FIG. 6 (a), the first fitting portion 142 is fitted between the unlocking portions 124. 6 (b), the third extended portion 123c of the fastening portion 123 is separated from the wire portion 510 and the fastening is released.

When the wire 500 is unfastened and the wire 500 is removed and the force pressing the push button 140 is released, the push button 140 is released by the elastic force of the spring 150 supporting the push button 140, Is returned to its original state.

The connector 100 may be modified as shown in Fig.

7 is a side view of the connector 100a of the modified example. The modified example 100a has the extended portions 121a and 131a in which the soldering portions 121 and 131 are exposed to the lower portion of the housing 110 and the extended portions 121a and 131b in which the wires are bent in the extending portions 121a and 131a And flat portions 121b and 131b.

The connector 100a of the modified example is characterized in that the flat portions 121b and 131b of the soldering portions 121 and 131 are arranged to be spaced apart from the housing 110. [ With this configuration, when the light source module is mounted on the chassis structure, there is an advantage that the wire can be inserted from the other surface of the surface on which the light emitting element is mounted, as described later.

A plurality of the light source modules 10 may be connected in series or in parallel. This will be described with reference to Figs. 8 and 9. Fig.

FIG. 8 shows an example in which a plurality of light source modules are connected in series, and FIG. 9 shows an example in which a plurality of light source modules are connected in parallel.

The two light source modules 11 and 12 can be connected to each other in series by connecting one of the light source modules 11 and the adjacent light source module 12 with one wire 500a as shown in FIG. More specifically, by connecting the first connection part 120 of the light source module 12 adjacent to the second connection part 230 of any one of the light source modules 11 with the wire 500a, the two light source modules 11, They can be connected in series.

The light source module 11 and the adjacent light source module 12 are connected by a pair of wires 500b and 500c so that the two light source modules 11 and 12 can be connected to each other in parallel have. More specifically, the first connection part 120 of the light source module 12 adjacent to the first connection part 220 of any one of the light source modules 11 is connected with the wire 500b, The second connection part 230 of the light source module 12 and the second connection part 130 of the adjacent light source module 12 are connected by the wire 500c so that the two light source modules 11 and 12 can be connected in parallel to each other.

Therefore, if necessary, only the wire connection between the plurality of light source modules 11, 12 of the embodiment is changed, so that circuit connection of the plurality of light source modules 11, 12 can be easily changed.

10 shows an example in which the light source module array 1000 is composed of a plurality of light source modules 11 to 14. [

The light source module array 1000 of one embodiment shows that the four light source modules 11 to 14 are arranged in two rows and two columns in the chassis structure 600 of the LCD panel. As described above, the circuit connection of the plurality of light source modules 11 to 14 may be performed by changing the wiring of the wire 500, for example, You can easily change it.

The light source module array 1000 may be configured by disposing the light source module arrays 11 to 14 in the chassis structure 600 and then connecting the wires 500 to the connectors 100 and 200.

11 (a) and 11 (b) show another embodiment of the light source module array. The present embodiment differs from the one embodiment in the configuration of the connectors 100a and 200a. The connectors 100a and 200a employed in this embodiment are the connectors shown in Fig. The wiring method of the wire 500 of the light source module array 2000 is changed by adopting a connector different from the above-described one embodiment.

As shown in FIG. 11 (b), the light source module array 2000 of this embodiment is provided with coupling holes 410a and 610a penetrating through the circuit board 400 and the chassis structure 600a, respectively. The coupling holes 410a and 610a may be formed to have a size that allows the housing 110 of the connector 100a to be inserted and may be formed to have a size not to be inserted into the flat portions 121b and 131b . Therefore, the flat portions 121b and 131b of the connector 100a can be disposed so as to be in contact with a predetermined region of the circuit board 400. [

Therefore, the circuit board 400 and the flat portions 121b and 131b can be connected by soldering 700. [ Since the housing 110 protrudes through the coupling holes 410a and 610a, the wire 500 can be coupled to the lower portion of the chassis structure 600a.

12 and 13 show examples of the light emitting device 300 employed in the light source module of FIG.

12, the light source module 3100 may include an array of a plurality of white light emitting devices 3100a mounted on a circuit board 3110 and a circuit board 3110. [ A conductive pattern connected to the white light emitting device 3100a may be formed on the upper surface of the circuit board 3110. [

Each of the white light emitting devices 3100a may have a structure in which a light emitting device 3130 emitting blue light is directly mounted on a circuit board 3110 by a COB (Chip On Board) method. Each of the white light emitting devices 3100a does not have a separate reflecting wall and the wavelength converting portion 3150a is provided in a hemispherical shape having a lens function to exhibit a wide directing angle. This wide divergence angle can contribute to reducing the thickness or width of the LCD display.

13, the light source module 3200 may include an array of a plurality of white light emitting devices 3100b mounted on a circuit board 3110 and a circuit board 3110. [ Each of the white light emitting devices 3100b may include a light emitting element 3130 that emits blue light that is mounted in a reflective cup of the package body 3125 and a wavelength converting portion 3150b that encapsulates the light emitting element 3130.

The wavelength converting units 3150a and 3150b may be formed in a form that the wavelength converting materials 3154 and 3156 such as a fluorescent material and / or a quantum dot are contained in the resin 3152.

Referring to FIG. 15, the flat panel illumination device 4100 may include a light source module 4110, a power supply device 4120, and a housing 4030. According to an exemplary embodiment of the present invention, the light source module 4110 may include the light source module 10 of FIG. 1 described above as a light source, and the power source device 4120 may include a driving unit of the light source module 4110 .

The light source module 4110 may include a plurality of light emitting devices, and may be formed to have a planar phenomenon as a whole. According to an exemplary embodiment of the present invention, the light emitting element array may include a light emitting element and a controller that stores driving information of the light emitting element.

The power supply 4120 may be configured to supply power to the light source module 4110. The housing 4130 may have a receiving space such that the light source module 4110 and the power supply 4120 are received therein, and the housing 4130 may be formed in a hexahedron shape opened on one side, but is not limited thereto. The light source module 4110 may be arranged to emit light to one opened side of the housing 4130. [

The present invention is not limited by the above-described embodiment and the accompanying drawings, but is intended to be limited by the appended claims. It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. something to do.

10: Light source module
100, 200: Connector
110: Housing
111, 112: wire insertion hole
113: Push-button exposure hole
114: insulating barrier
120: first connection
121, 131: soldering portion
122 and 132:
123, 133:
124 and 134:
130:
140: push button
141:
142: first fitting portion
143: second fitting portion
150: spring
300: Light emitting element
400: circuit board
500: wire
510:
520:

Claims (20)

  1. First and second connectors coupled to the inserted wire and disposed opposite to each other;
    A housing covering the first and second connection portions; And
    And a push button that is disposed on the first and second connecting portions and releases a coupling between the first and second connecting portions and the wire by an externally applied force.
  2. The method according to claim 1,
    A pushbutton exposure hole provided on an upper surface of the housing to expose the pushbutton in an upper direction of the housing and provide a path for moving the pushbutton in a downward direction of the housing by an external force; Further comprising:
  3. The method according to claim 1,
    Wherein the first and second connection portions are respectively connected to the first,
    A soldering portion in the form of a plate soldered to a circuit board;
    A covering portion extending along a direction intersecting the upper surface of the soldering portion and at least a portion of the upper portion is bent to surround the inserted wire;
    A fastening portion extending from the covering portion and having a width narrower toward one end of the covering portion and engaging with the inserted wire in an area adjacent to one end of the covering portion; And
    A coupling release portion disposed at an upper portion of the coupling portion and having a gap through which a portion of the push button is inserted and releasing the coupling between the inserted wire and the coupling portion when a portion of the push button is inserted into the gap; The connector comprising:
  4. The method of claim 3,
    Wherein the push button is supported by an elastic member, and is separated from the unlocking portion by the elastic member.
  5. The method according to claim 1,
    And an insulating partition wall disposed between the first and second connection portions to electrically isolate the first and second connection portions from each other.
  6. The method according to claim 1,
    Wherein the pushbutton releases the engagement between the first and second connection portions and the inserted wire by an externally applied force.
  7. The method according to claim 1,
    Wherein the first and second connection portions are disposed symmetrically with respect to the push button.
  8. The method according to claim 1,
    And the housing is molded with the first and second connecting portions.
  9. The method of claim 3,
    And at least a part of the soldering portion is exposed to a lower portion of the housing and is bent along a direction in which the inserted wire extends.
  10. A circuit board having a plurality of light emitting elements arranged along a first direction; And
    And a connector disposed on one side of the circuit board and electrically connected to the plurality of light emitting elements,
    Wherein the connector comprises:
    First and second connectors coupled to the inserted wire and disposed opposite to each other;
    A housing covering the first and second connection portions; And
    And a push button disposed on the first and second connection parts and releasing the connection between the first and second connection parts and the wire by a force externally applied to the light source module.
  11. 11. The method of claim 10,
    Wherein the circuit board is bar-shaped.
  12. 12. The method of claim 11,
    Wherein the connector is disposed only at one side relative to the plurality of light emitting elements.
  13. 13. The method of claim 12,
    The connector including first and second connectors,
    Wherein the first and second connectors are disposed apart from the plurality of light emitting devices by a predetermined distance.
  14. 11. The method of claim 10,
    Wherein the first and second connection portions are disposed to face both ends of the circuit board, respectively.
  15. 11. The method of claim 10,
    Wherein the circuit board includes a coupling hole into which the housing is inserted.
  16. A circuit board having a plurality of light emitting elements arranged along a first direction; And
    And a plurality of light source modules each having a first connector and a second connector arranged on one surface of the plurality of circuit boards and electrically connected to the plurality of light emitting elements,
    Wherein each of the first and second connectors includes first and second connectors mechanically coupled to the inserted wire and disposed to face each other in opposite directions,
    Wherein the inserted wire electrically connects the second connector of any one of the plurality of light source modules to the first connector of another adjacent light source module.
  17. 17. The method of claim 16,
    Wherein the plurality of light source modules are connected in series with each other.
  18. 18. The method of claim 17,
    Wherein the inserted wire electrically connects the second connection portion of the second connector of any one of the plurality of light source modules to the first connection portion of the first connector of the adjacent another light source module, .
  19. 17. The method of claim 16,
    Wherein the plurality of light source modules are connected in parallel to each other.
  20. 20. The method of claim 19,
    Wherein the inserted wire electrically connects the first connection portion of the second connector of any one of the plurality of light source modules to the first connection portion of the first connector of the adjacent other light source module,
    And the second connector of the second connector of any one of the light source modules is electrically connected to the second connector of the first connector of the adjacent light source module.
KR1020150116838A 2015-08-19 2015-08-19 Connector, light source module and light source module array using the same KR20170022171A (en)

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US15/150,960 US9995960B2 (en) 2015-08-19 2016-05-10 Connector, light source module including the connector, and light source module array including the light source module
CN201610685600.5A CN106468838A (en) 2015-08-19 2016-08-18 Adapter, the light source module including this adapter and arrays of light source modules
US15/982,613 US10216035B2 (en) 2015-08-19 2018-05-17 Connector, light source module including the connector, and light source module array including the light source module

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018166292A1 (en) * 2017-03-17 2018-09-20 欧普照明股份有限公司 Illumination device
CN106989362A (en) * 2017-03-17 2017-07-28 欧普照明股份有限公司 Lighting device

Family Cites Families (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1918193A1 (en) * 1969-04-10 1970-10-15 Merten Geb Screwless connecting terminal for electrical appliances, in particular installation devices
DE3514099C2 (en) * 1985-04-16 1994-11-17 Wago Verwaltungs Gmbh Connecting terminal for electrical conductors
DE4016770A1 (en) * 1990-05-25 1991-11-28 Guenter Trautmann Cable connector for coarse and fine wires - relies on compression of wire between teeth of moulding and upper surface of depressed flat spring
DE69739376D1 (en) 1996-08-27 2009-06-04 Seiko Epson Corp Deposition method and method for transferring a thin film device
USRE38466E1 (en) 1996-11-12 2004-03-16 Seiko Epson Corporation Manufacturing method of active matrix substrate, active matrix substrate and liquid crystal display device
JPH1197124A (en) * 1997-09-22 1999-04-09 Japan Aviation Electron Ind Ltd High-speed transmitting system and connector
US7208725B2 (en) 1998-11-25 2007-04-24 Rohm And Haas Electronic Materials Llc Optoelectronic component with encapsulant
JP3906654B2 (en) 2000-07-18 2007-04-18 ソニー株式会社 Semiconductor light emitting device and semiconductor light emitting device
ES1047528Y (en) * 2000-11-03 2001-09-01 Codina Maria Cristina Moret Terminal block for quick connection
US6660935B2 (en) 2001-05-25 2003-12-09 Gelcore Llc LED extrusion light engine and connector therefor
EP1420463A4 (en) 2001-08-22 2008-11-26 Sony Corp Nitride semiconductor element and production method for nitride semiconductor element
JP2003218034A (en) 2002-01-17 2003-07-31 Sony Corp Method for selective growth, semiconductor light- emitting element, and its manufacturing method
JP3815335B2 (en) 2002-01-18 2006-08-30 ソニー株式会社 Semiconductor light emitting device and manufacturing method thereof
KR100499129B1 (en) 2002-09-02 2005-07-04 삼성전기주식회사 Light emitting laser diode and fabricatin method thereof
US7002182B2 (en) 2002-09-06 2006-02-21 Sony Corporation Semiconductor light emitting device integral type semiconductor light emitting unit image display unit and illuminating unit
KR100714639B1 (en) 2003-10-21 2007-05-07 삼성전기주식회사 light emitting device
JP4297825B2 (en) 2003-11-04 2009-07-15 モレックス インコーポレイテドMolex Incorporated Cable connector
KR100506740B1 (en) 2003-12-23 2005-08-08 삼성전기주식회사 Nitride semiconductor light emitting device and method of manufacturing the same
KR100664985B1 (en) 2004-10-26 2007-01-09 삼성전기주식회사 Nitride based semiconductor device
US7377669B2 (en) 2005-03-28 2008-05-27 U.S. Led, Ltd. LED module and system of LED modules with integral branch connectors
KR100665222B1 (en) 2005-07-26 2007-01-09 삼성전기주식회사 Led package with diffusing material and method of manufacturing the same
KR100661614B1 (en) 2005-10-07 2006-12-19 삼성전기주식회사 Nitride semiconductor light emitting device and method of manufacturing the same
KR100723247B1 (en) 2006-01-10 2007-05-22 삼성전기주식회사 Chip coating type light emitting diode package and fabrication method thereof
KR100735325B1 (en) 2006-04-17 2007-06-27 삼성전기주식회사 Light emitting diode package and fabrication method thereof
KR100930171B1 (en) 2006-12-05 2009-12-07 삼성전기주식회사 The white light emitting device and a white light source module using the same.
KR20080086105A (en) 2007-03-21 2008-09-25 주식회사 옵토필 Led module including connectors structure
KR100855065B1 (en) 2007-04-24 2008-08-29 삼성전기주식회사 Light emitting diode package
KR100982980B1 (en) 2007-05-15 2010-09-17 삼성엘이디 주식회사 Plane light source and lcd backlight unit comprising the same
KR101164026B1 (en) 2007-07-12 2012-07-18 삼성전자주식회사 Nitride semiconductor light emitting device and fabrication method thereof
KR100891761B1 (en) 2007-10-19 2009-04-07 삼성전기주식회사 Semiconductor light emitting device, manufacturing method thereof and semiconductor light emitting device package using the same
US7628640B2 (en) * 2007-12-14 2009-12-08 Actuant Corporation Electrical connector for connection to multiple conductors
KR101332794B1 (en) 2008-08-05 2013-11-25 삼성전자주식회사 Light emitting device, light emitting system comprising the same, and fabricating method of the light emitting device and the light emitting system
KR20100030470A (en) 2008-09-10 2010-03-18 삼성전자주식회사 Light emitting device and system providing white light with various color temperatures
KR101530876B1 (en) 2008-09-16 2015-06-23 삼성전자 주식회사 Light emitting element with increased light emitting amount, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device
US8008683B2 (en) 2008-10-22 2011-08-30 Samsung Led Co., Ltd. Semiconductor light emitting device
KR101016112B1 (en) 2008-11-04 2011-02-21 에프씨산업 주식회사 Light emitted diode light with connecter for multiple connection
KR100894258B1 (en) 2008-11-24 2009-04-21 진영정보통신 주식회사 A led lighting module
US8382322B2 (en) 2008-12-08 2013-02-26 Avx Corporation Two part surface mount LED strip connector and LED assembly
JP5366688B2 (en) * 2009-07-16 2013-12-11 日本航空電子工業株式会社 Socket, substrate assembly, and apparatus including the same
KR101744970B1 (en) 2010-06-17 2017-06-08 엘지이노텍 주식회사 Light emitting module and light unit using the same
JP5571539B2 (en) * 2010-07-23 2014-08-13 京セラコネクタプロダクツ株式会社 Connector and LED lighting apparatus using the connector
KR101295119B1 (en) 2010-11-10 2013-08-12 삼성전자주식회사 Light emitting module
JP5736262B2 (en) 2011-07-14 2015-06-17 モレックス インコーポレイテドMolex Incorporated Multi-contact connector
DE102011056410B4 (en) * 2011-12-14 2013-06-27 Wago Verwaltungsgesellschaft Mbh terminal
US9166327B2 (en) * 2012-07-12 2015-10-20 Vode Lighting Llc Circuit board connector system
DE202013002763U1 (en) * 2013-03-21 2013-05-27 Liang-Chih Cheng Screwless terminal block
JP5480990B1 (en) * 2013-03-28 2014-04-23 日本航空電子工業株式会社 Connector assembly
US20140299893A1 (en) * 2013-04-05 2014-10-09 Joint Tech Electronic Industrial Co., Ltd. Conductive Connector For Use With Circuit Board, and LED Module Having the Same
KR20150002046A (en) 2013-06-28 2015-01-07 엘지이노텍 주식회사 Circuit board and lighting device having the circuit board

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US10216035B2 (en) 2019-02-26
US20180267346A1 (en) 2018-09-20
CN106468838A (en) 2017-03-01
US9995960B2 (en) 2018-06-12
US20170051906A1 (en) 2017-02-23

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