KR20170130285A - Substrate conveyance device - Google Patents

Substrate conveyance device Download PDF

Info

Publication number
KR20170130285A
KR20170130285A KR1020170057179A KR20170057179A KR20170130285A KR 20170130285 A KR20170130285 A KR 20170130285A KR 1020170057179 A KR1020170057179 A KR 1020170057179A KR 20170057179 A KR20170057179 A KR 20170057179A KR 20170130285 A KR20170130285 A KR 20170130285A
Authority
KR
South Korea
Prior art keywords
substrate
pad
hand
protruding
contact
Prior art date
Application number
KR1020170057179A
Other languages
Korean (ko)
Other versions
KR101931876B1 (en
Inventor
유키 아이자와
노보루 오노지마
신스케 무라카미
Original Assignee
캐논 톡키 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 캐논 톡키 가부시키가이샤 filed Critical 캐논 톡키 가부시키가이샤
Publication of KR20170130285A publication Critical patent/KR20170130285A/en
Application granted granted Critical
Publication of KR101931876B1 publication Critical patent/KR101931876B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

Abstract

The present invention provides a substrate conveyance device which receives a weight of a substrate in each pad as uniformly as possible, and further, can increase a contact area between the pad and the substrate to stably convey the substrate even though a conveyance speed is high. The substrate conveyance device comprises: a conveyance robot conveying a substrate (1); a hand (2) installed in the conveyance robot; and a pad (3) installed on an upper surface of the hand (2) to support an outer circumferential portion of a lower surface of the substrate (1). A plurality of pads (3) are installed on an upper surface of the hand (2) to support the substrate (1) in a plurality of points, and an operating piece unit (4) coming in contact with the substrate (1) to be bent and deformed is installed in the pad (3).

Description

기판 반송 장치{SUBSTRATE CONVEYANCE DEVICE}[0001] SUBSTRATE CONVEYANCE DEVICE [0002]

본 발명은 기판 반송 장치에 관한 것이다.The present invention relates to a substrate transport apparatus.

진공 장치 내에서 기판의 반송에 이용하는 반송용 로봇의 핸드의 기판과의 접촉부에는, 수지제의 패드가 설치되어 있다(특허문헌 1 등 참조).A resin pad is provided at the contact portion of the hand of the carrying robot used for carrying the substrate in the vacuum apparatus with the substrate (see Patent Document 1, etc.).

그런데, 반송용 로봇의 기판의 반송 속도를 빠르게 하는 등 하여, 패드와 기판과의 사이에 발생하는 마찰력(최대 정지 마찰력)보다도 큰 운동 에너지(힘)가 기판에 걸리면, 기판이 미끄러져 버려 반송을 할 수 없게 된다. 특히, 로봇 선회 시에 기판의 미끄러짐이 생기기 쉽다.However, if kinetic energy (force) greater than the frictional force (maximum static frictional force) generated between the pad and the substrate is applied to the substrate by increasing the transfer speed of the substrate of the transfer robot, etc., the substrate slips, I can not do it. Particularly, slippage of the substrate tends to occur at the time of turning the robot.

반송 시의 기판의 미끄러짐을 방지하기 위해서 패드는 다수 개 설치되어 있지만, 기판의 뒤틀림이나 기판을 보유 지지했을 때의 휘는 형태가 매회 달라서, 기판의 일부가 패드와 접촉하지 않고 뜨는 경우가 있는 등, 기판의 중량을 모든 패드에 균일하게 받게 하는 것은 곤란하며, 일부의 패드에 치우쳐 하중이 걸리기 때문에, 패드 1개당의 최대 정지 마찰력을 크게 할 필요가 있는 것이 현재의 상황이다.A plurality of pads are provided in order to prevent slippage of the substrate at the time of transportation. However, there is a case where the substrate is twisted and the shape of warping when the substrate is held is changed every time, It is difficult to uniformly receive the weight of the substrate on all the pads, and since a load is imposed on a part of the pads, it is necessary to increase the maximum traction frictional force per pad.

일본특허출원공개 제2000－277585호 공보Japanese Patent Application Laid-Open No. 2000-277585

본 발명은, 상술한 바와 같은 현재의 상황을 감안하여 이루어진 것으로, 패드에, 휨 변형 가능한 가동 편부를 각각 설치하고, 기판마다의 뒤틀림이나 휘어짐 의한 접촉의 치우침을 흡수할 수 있도록 함으로써, 각 패드에서 기판의 중량을 가급적 균일하게 받는 것이 가능하고, 나아가, 패드와 기판과의 접촉 면적을 증가시킬 수 있고, 반송 속도를 빠르게 하여도 안정적인 반송이 가능한 기판 반송 장치를 제공하는 것이다.SUMMARY OF THE INVENTION The present invention has been made in view of the above-described circumstances, and it is an object of the present invention to provide a movable piece capable of being deformed by bending, and capable of absorbing the tilting of contact due to warpage and warping for each substrate, The present invention is to provide a substrate transport apparatus capable of receiving the weight of a substrate as uniformly as possible and capable of increasing the contact area between the pad and the substrate and capable of stable transportation even when the transport speed is increased.

기판을 반송하는 반송용 로봇과, 이 반송용 로봇에 설치되는 핸드와, 이 핸드의 상면에 설치되어 상기 기판 하면의 외주부를 지지하는 패드를 갖는 기판 반송 장치로서, 상기 패드는 상기 기판을 복수 점에서 지지하도록 상기 핸드의 상면에 복수 개 설치되고, 이 패드에는 상기 기판과 접촉하여 휨 변형하는 가동 편부가 설치되어 있는 것을 특징으로 하는 기판 반송 장치에 관한 것이다.1. A substrate transfer apparatus having a transfer robot for transferring a substrate, a hand provided on the transfer robot, and a pad provided on an upper surface of the hand and supporting an outer peripheral portion of the lower surface of the substrate, And a plurality of the movable piece portions are provided on the upper surface of the hand so as to support the movable piece portion in contact with the substrate.

본 발명은 상술한 바와 같이 구성하였기 때문에, 패드에, 휨 변형 가능한 가동 편부를 각각 설치하고, 기판마다의 뒤틀림이나 휨에 의한 접촉의 치우침을 흡수할 수 있도록 함으로써, 각 패드에서 기판의 중량을 가급적 균일하게 받는 것이 가능하고, 나아가, 패드와 기판과의 접촉 면적을 증가시킬 수 있고, 반송 속도를 빠르게 하여도 안정적인 반송이 가능한 기판 반송 장치가 된다.Since the present invention is configured as described above, it is possible to provide a movable piece portion capable of being deformed by bending, and to absorb the tilting of contact due to warpage and warping for each substrate, The substrate can be uniformly received, and the contact area between the pad and the substrate can be increased, and the substrate can be transported stably even if the transport speed is increased.

도 1은 본 실시예의 개략 설명 평면도이다.
도 2는 본 실시예의 일부를 절결한 확대 개략 설명 측면도이다.
도 3은 본 실시예의 확대 개략 설명 측면도이다.
도 4는 다른 예 1의 확대 개략 설명 측면도이다.
도 5는 다른 예 1의 확대 개략 설명 측면도이다.
도 6은 다른 예 2의 확대 개략 설명 측면도이다.
도 7은 다른 예 2의 확대 개략 설명 측면도이다.1 is a schematic plan view of this embodiment.
Fig. 2 is an enlarged schematic explanatory side view of a part of this embodiment.
3 is an enlarged schematic explanatory side view of this embodiment.
4 is an enlarged schematic explanatory side view of another example 1. Fig.
5 is an enlarged schematic explanatory side view of another example 1. Fig.
6 is an enlarged schematic explanatory side view of another example 2. Fig.
7 is an enlarged schematic explanatory side view of another example 2. Fig.

바람직하다고 생각되는 본 발명의 실시형태를, 도면에 기초하여 본 발명의 작용을 나타내어 간단히 설명한다.BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages of the present invention will be more apparent from the following description taken in conjunction with the accompanying drawings, in which: FIG.

반송용 로봇의 핸드(2)로 기판(1)을 수취하고, 수취한 기판(1)을 반송 장소로 반송할 때, 핸드(2)의 상면에 설치된 각 패드(3)에서 기판(1)의 중량을 가급적 균일하게 받을 수가 있다.When the substrate 1 is received by the hand 2 of the transport robot and the received substrate 1 is transported to the transporting position, the pads 3 provided on the upper surface of the hand 2 It is possible to receive the weight as uniformly as possible.

즉, 기판(1)을 핸드(2) 상에 놓으면, 기판(1) 하면의 외주부와 접촉하는 각 패드(3)의 가동 편부(4)가 기판(1)의 중량에 의해 휨 변형하여, 예를 들어 기판(1)의 뒤틀림 등에 의해 각 패드(3)로 닿는 형태가 달라지더라도(접촉에 치우침이 있더라도), 각 패드(3)의 가동 편부(4)가 각각 닿는 형태에 맞추어 휨 변형하여 일부가 뜨는 일 없이 각 패드(3)에서 각각 기판(1)을 받칠 수 있고, 각 패드(3)에서 평균적으로 하중을 받는 것이 가능하게 된다. 따라서, 기판(1)의 반송 속도를 빠르게 하더라도 안정적인 반송이 가능하게 된다.That is, when the substrate 1 is placed on the hand 2, the movable piece 4 of each pad 3, which contacts the outer periphery of the lower surface of the substrate 1, is deformed by the weight of the substrate 1, The movable piece portions 4 of the pads 3 are deformed in accordance with the shapes of the contact portions 4 contacted by the respective pads 3 due to warping of the substrate 1 It is possible to support the substrate 1 on each of the pads 3 without lifting a part, and it becomes possible to receive an average load on each pad 3. Therefore, stable conveyance is possible even if the conveying speed of the substrate 1 is increased.

또한, 예를 들어, 상기 가동 편부(4)를, 평탄한 접촉면을 갖고 상기 기판(1)의 하중에 의해 휨 변형함으로써 상기 기판(1)과의 접촉 면적이 증가하는 탄성 부재로 구성한 경우에는, 휨 변형에 맞추어 기판(1)과의 접촉 면적을 증가시켜 최대 정지 마찰력을 확보하는 것이 가능하게 되어, 보다 안정적인 반송이 가능하게 된다.Further, for example, when the movable piece 4 is formed of an elastic member having a flat contact surface and increasing in contact area with the substrate 1 by flexural deformation due to the load of the substrate 1, It is possible to increase the contact area with the substrate 1 in accordance with the deformation, thereby securing the maximum static friction force, and it is possible to carry out more stable transportation.

[실시예][Example]

본 발명의 구체적인 실시예에 대해 도면에 기초하여 설명한다.A specific embodiment of the present invention will be described with reference to the drawings.

본 실시예는, 기판(1)을 진공 분위기 하에서 반송하는 반송용 로봇과, 이 반송용 로봇에 설치되는 핸드(2)와, 이 핸드(2)의 상면에 설치되고 상기 기판(1) 하면의 성막 영역 범위 밖의 주변부를 지지하는 패드(3)를 갖는 기판 반송 장치이다.This embodiment is characterized in that it comprises a transfer robot for transferring the substrate 1 under a vacuum atmosphere, a hand 2 provided on the transfer robot, And a pad (3) for supporting a peripheral portion outside the film forming region.

본 실시예의 반송용 로봇은, 소위 클러스터형의 성막 장치의 반송실에 설치되어 있다. 이 반송실의 주위에는 성막실 등의 작업실이 연결 설치되어 있고, 반송용 로봇은 각 작업실로의 기판(1)의 반입 및 작업실로부터의 기판(1)의 반출을 행한다.The transport robot of this embodiment is provided in a transport chamber of a so-called cluster type film forming apparatus. A work chamber such as a deposition chamber is connected to the periphery of the transport chamber, and the transport robot carries the substrates 1 into and out of the respective work chambers.

구체적으로는, 본 실시예는, 핸드(2)의 상면에 수지제의 패드(3)가 기판(1)을 복수 점에서 지지하도록 복수 설치되어 있고, 이 패드(3)에 기판(1)과 접촉하여 휨 변형하는 가동 편부(4)가 설치된 구성이다.Specifically, in the present embodiment, a plurality of pads 3 made of resin are provided on the upper surface of the hand 2 so as to support the substrate 1 at a plurality of points, and the pads 3 are provided with the substrate 1 And the movable piece portion 4 which is deformed by bending and contact is provided.

핸드(2)는 반송용 로봇의 신축 아암의 선단에 설치되어 있다.The hand 2 is provided at the distal end of the telescopic arm of the carrying robot.

구체적으로는, 도 1에 도시된 바와 같이, 핸드(2)는 신축 아암과 연결되는 2개의 평행한 봉 형상의 기부(8)를 갖고, 이 기부(8)에는 기부(8)의 길이 방향과 직교하는 방향으로 돌출 설치되는 제1 포크부(9)가 설치되어 있다.More specifically, as shown in Fig. 1, the hand 2 has two parallel bar-shaped base portions 8 connected to the telescopic arms, And a first fork portion 9 projecting in a direction orthogonal to each other.

또한, 최외 위치의 제1 포크부(9)의 바깥 측에는, 상기 기부(8)와 평행한 방향으로 돌출 설치되는 분기부(10)가 설치되어 있다. 또한, 기부(8)의 기단측 위치 및 선단측 위치에는, 각각 상기 분기부(10)와 나란히 설치되는 제2 포크부(11)가 설치되어 있다.On the outer side of the first fork portion 9 at the outermost position, a branch portion 10 projecting in a direction parallel to the base portion 8 is provided. A second fork portion 11 is provided at the proximal end side position and the distal end side position of the base portion 8, respectively, which are arranged side by side with the branch portion 10.

또한, 각 포크부(9, 11) 및 분기부(10)는, 그 돌출 선단측이 기부(8)보다 상방에 위치하도록 선단부가 선단 측으로 갈수록 위로 경사진 구성으로 하고 있다.The fork portions 9 and 11 and the branched portion 10 are configured such that their tip portions are inclined upward toward the tip side so that the projecting tip side thereof is located above the base portion 8.

이 핸드(2)의 각 포크부(9, 11) 및 분기부(10)의 선단에 패드(3)가 각각 설치되어 있다.A pad 3 is provided at the tip of each of the fork portions 9 and 11 and the branch portion 10 of the hand 2, respectively.

제1 포크부의 선단에 설치된 패드(3)는 기판(1) 하면의 외주부의 긴 길이 방향 측변부에 각각 접촉하고, 제2 포크부 및 분기부의 선단에 설치된 패드(3)는 기판(1) 하면의 외주부의 짧은 길이 방향 측변부에 각각 접촉한다.The pad 3 provided at the tip of the first fork portion is in contact with the longitudinally long side portion of the outer peripheral portion of the lower surface of the substrate 1 and the pad 3 provided at the tip of the second fork portion and the branch portion is in contact with the surface of the substrate 1 Respectively, of the outer circumferential portion.

패드(3)는, 각 포크부(9, 11) 및 분기부(10)에 설치된 장착 구멍(12)에 장착되는 장착부(13)와, 이 장착부(13)의 상부에 설치되는 가동 편부(4)로 구성되어 있다.The pad 3 has a mounting portion 13 to be mounted on a mounting hole 12 provided in each fork portion 9 and 11 and a branch portion 10 and a movable piece portion 4 provided on the upper portion of the mounting portion 13 ).

장착부(13)에는, 장착 구멍(12) 내에 압입되는 통 형상의 몸체부(14)와, 몸체부(14)의 선단에 마련된 장착 구멍(12)으로부터의 빠짐을 방지하는 몸체부(14)보다 직경이 큰 빠짐 방지 걸림부(15)가 설치되어 있다.The mounting portion 13 is provided with a tubular body portion 14 which is press-fitted into the mounting hole 12 and a body portion 14 which prevents the body portion 14 from being detached from the mounting hole 12 provided at the tip of the body portion 14 And a large-diameter fall-off preventing hook 15 is provided.

본 실시예에 있어서는, 장착 구멍(12)이 3개 설치되어 있고, 3개의 장착 구멍(12)에 대응하여 상기 몸체부(14) 및 빠짐 방지 걸림부(15)를 3개 설치한 구성으로 하고 있다.In the present embodiment, three mounting holes 12 are provided, and three body portions 14 and three slip-off preventing portions 15 are provided corresponding to the three mounting holes 12 have.

가동 편부(4)는, 평탄한 접촉면을 가지고 상기 기판(1)의 하중에 의해 휨 변형함으로써 상기 기판(1)과의 접촉 면적이 증가하는 탄성 부재로 구성되어 있다.The movable piece portion 4 is composed of an elastic member having a flat contact surface and being flexibly deformed by the load of the substrate 1 so that the contact area with the substrate 1 increases.

구체적으로는, 불소 고무, 실리콘, 네오프렌 고무 또는 니트릴 고무 등의 유연하며 높은 마찰력을 갖는 소재로 구성되어 있다. 본 실시예에서는 불소 고무제로 하고 있다.Specifically, it is made of a flexible and highly frictional material such as fluorine rubber, silicone, neoprene rubber or nitrile rubber. In this embodiment, fluorocarbon rubber is used.

본 실시예의 가동 편부(4)는, 도 2 및 도 3에 도시한 바와 같이, 상기 기판(1)의 중심에 대하여 안쪽으로 돌출하도록 설치된 판상의 돌출편(5)을 갖고, 이 돌출편(5)은 상기 기판(1)이 접촉하였을 때 상기 기판(1)의 하중에 의해 상기 돌출편(5)의 돌출 방향과 교차하는 방향으로 휨 변형할 수 있도록 구성되어 있다.As shown in Figs. 2 and 3, the movable piece portion 4 of the present embodiment has a plate-like projecting piece 5 projected inward relative to the center of the substrate 1, and the projecting piece 5 Is configured to be capable of bending deformation in a direction intersecting with the projecting direction of the projecting piece (5) by a load of the substrate (1) when the substrate (1) is contacted.

구체적으로는, 가동 편부(4)는, 심층(芯層; 6)과, 이 심층(6)으로부터 상기 기판(1)의 중심에 대해 안쪽으로 일부가 튀어나오도록 적층된 판 형상으로, 상면에 평탄한 접촉면이 마련된 탄성층(7)을 갖고, 이 탄성층(7)의 상기 심층(6)으로부터 튀어 나온 돌출 부분이 상기 돌출편(5)으로 설정되어 있다.Specifically, the movable piece portion 4 has a core layer 6 and a plate-like shape laminated so as to partially protrude from the core layer 6 inward with respect to the center of the substrate 1, And a protruding portion protruding from the deep layer 6 of the elastic layer 7 is set as the protruding piece 5. [

본 실시예에서는, 심층(6)은, 각 포크부(9, 11) 및 분기부(10)의 상면에 접촉하는 토대부(18)와, 토대부(18) 상에 마련되어 탄성층(7)을 지지하는 탄성층 지지부(19)로 구성되고, 이 탄성층 지지부(19)로부터 튀어 나온 돌출 부분이 상기 돌출편(5)으로 설정되어 있다. 도면 중에서, 부호 "16"은 기판(1)의 이탈을 방지하는 기판 이탈 방지부, "17"은 심층(6)에 걸리어 위치 결정하기 위한 위치 결정 걸림부이다.In this embodiment, the core layer 6 includes a toe portion 18 which is in contact with the upper surfaces of the fork portions 9 and 11 and the branch portion 10, a toe portion 18 provided on the toe portion 18, And the protruding portion protruding from the elastic layer supporting portion 19 is set as the protruding piece 5. The elastic layer supporting portion 19 is formed with a protruding portion. In the drawings, reference numeral 16 denotes a substrate separation preventing portion for preventing the substrate 1 from being separated from the substrate 1, and 17 denotes a positioning engagement portion for positioning the substrate 1 with respect to the core layer 6.

따라서, 유연한 가동 편부(4)는 기판(1)의 하중에 의해 변형하여 접촉 면적을 증가시켜, 최대 정지 마찰력을 확보할 수 있고, 또한, 탄성층(7)의 돌출편(5)은 심층(6)에 의해 지지되지 않는 외팔보 형상(설편(舌片) 형상)으로 되어, 돌출 방향 및 돌출 방향과 직교하는 방향으로 용이하게 휨 변형하여, 기판(1)의 뒤틀림이나 휨에 의한 접촉의 치우침을 양호하게 흡수하는 것이 가능하게 된다.Therefore, the flexible movable piece 4 can be deformed by the load of the substrate 1 to increase the contact area, thereby securing the maximum static friction force. Further, the protruding piece 5 of the elastic layer 7 is formed in the deep layer (Tongue piece) shape that is not supported by the substrate 1 and 6 and is easily bent and deformed in a direction orthogonal to the projecting direction and the projecting direction so that the deviation of the contact due to the warpage or warping of the substrate 1 So that it becomes possible to absorb it well.

또한, 대형 글라스 기판 등을 핸드(2)로 지지하였을 때, 패드(3)가 접촉하지 않는 중앙 측이 아래쪽으로 휘고, 기판(1) 외주부가 위쪽으로 젖혀지는 경우에도, 기판(1)의 중심에 대하여 안쪽으로 돌출하는 돌출편(5)을 갖는 가동 편부(4)가 기판(1)의 젖혀짐(휨)에 양호하게 추종하여 변형됨으로써, 접촉 면적을 확보할 수 있다(도 3 참조).Even when a large glass substrate or the like is supported by the hand 2 and the center side where the pad 3 does not contact is bent downward and the outer peripheral portion of the substrate 1 is turned upwards, The movable piece 4 having the projecting piece 5 protruding inward with respect to the substrate 1 satisfactorily deforms to warp (warp) of the substrate 1, whereby the contact area can be ensured (see Fig. 3).

따라서, 기판(1)의 반송 속도(핸드(2)의 회전 속도·신축 아암의 신축 속도)를 빠르게 하더라도 안정적인 반송이 가능하게 된다.Therefore, even if the conveying speed of the substrate 1 (the rotation speed of the hand 2, the stretching speed of the stretching arm) is increased, stable conveyance becomes possible.

또한, 가동 편부(4)는, 도 4 및 도 5에 도시한 다른 예 1과 같이, 심층(6)으로부터 탄성층(7)이 핸드(2)의 바깥쪽으로 튀어나오도록 적층함으로써 돌출편(5)을 기판(1)의 중심에 대하여 바깥쪽으로 돌출시킨 구성으로 하여도 좋다.4 and 5, the movable piece 4 is formed by laminating the elastic layer 7 from the core layer 6 so as to protrude to the outside of the hand 2, May be protruded outward with respect to the center of the substrate 1. In this case,

또한, 도 6 및 도 7에 도시한 다른 예 2와 같이, 기판(1)과 접촉하였을 때에 기판(1)의 중심에 대하여 바깥쪽으로 쓰러지도록 탄성층(7)의 상면에 판 형상의 돌출편(5)을 기판(1)의 중심에 대하여 바깥쪽으로 경사시킨 상태로 세워 설치한 구성으로 하여도 좋다. 다른 예 2에서는 돌출편(5)을 복수개(2개) 나란히 설치하고 있다.6 and 7, on the upper surface of the elastic layer 7 so as to collapse outward with respect to the center of the substrate 1 when the substrate 1 is brought into contact with the substrate 1, 5 may be erected in a state of being inclined outward with respect to the center of the substrate 1. In the second example 2, a plurality of (two) projecting pieces 5 are provided side by side.

다른 예 1 및 다른 예 2의 경우도, 돌출편(5)의 휨 변형에 의해, 양호하게 기판(1)의 뒤틀림이나 휨을 흡수하여 각 패드(3)에서 균등하게 하중을 받는 것이 가능하게 된다.Also in the case of the other examples 1 and 2, it is possible to absorb the warpage and warpage of the substrate 1 favorably by the bending deformation of the projecting pieces 5, and it becomes possible to receive a load uniformly on each pad 3. [

또한, 본 발명은 본 실시예에 한정되지 않고, 각 구성 요건의 구체적 구성은 적절히 설계할 수 있는 것이다.Further, the present invention is not limited to this embodiment, and the specific configuration of each constituent requirement can be appropriately designed.

1: 기판
2: 핸드
3: 패드
4: 가동 편부
5: 돌출편
6: 심층
7: 탄성층1: substrate
2: Hand
3: Pad
4:
5:
6: In-depth
7: elastic layer

Claims (4)

기판을 반송하는 반송용 로봇과, 이 반송용 로봇에 설치되는 핸드와, 이 핸드의 상면에 설치되어 상기 기판 하면의 외주부를 지지하는 패드를 갖는 기판 반송 장치로서,
상기 패드는 상기 기판을 복수 점에서 지지하도록 상기 핸드의 상면에 복수 개 설치되고, 이 패드에는 상기 기판과 접촉하여 휨 변형하는 가동 편부가 설치되어 있는 것을 특징으로 하는 기판 반송 장치.1. A substrate transfer apparatus having a transfer robot for transferring a substrate, a hand provided on the transfer robot, and a pad provided on an upper surface of the transfer robot for supporting an outer peripheral portion of the lower surface of the substrate,
Wherein a plurality of the pads are provided on an upper surface of the hand so as to support the substrate at a plurality of points, and the pads are provided with movable piece portions that are deformed by bending in contact with the substrate. 제1항에 있어서,
상기 가동 편부는, 평탄한 접촉면을 갖고 상기 기판의 하중에 의해 휨 변형함으로써 상기 기판과의 접촉 면적이 증가하는 탄성 부재로 구성되어 있는 것을 특징으로 하는 기판 반송 장치.The method according to claim 1,
Wherein the movable piece portion is composed of an elastic member having a flat contact surface and being flexibly deformed by a load of the substrate to increase a contact area with the substrate. 제1항 또는 제2항에 있어서,
상기 가동 편부는, 상기 기판의 중심에 대하여 안쪽 또는 바깥쪽으로 돌출하도록 설치된 돌출편 또는 상기 핸드에 세워 설치된 돌출편을 갖고, 이 돌출편은 상기 기판이 접촉하였을 때 상기 기판의 하중에 의해 상기 돌출편의 돌출 방향과 교차하는 방향으로 휨 변형할 수 있도록 구성되어 있는 것을 특징으로 하는 기판 반송 장치.3. The method according to claim 1 or 2,
Wherein the movable piece portion has a protruding piece protruding inwardly or outwardly with respect to the center of the substrate or a protruding piece provided upright on the hand, the protruding piece having, when the substrate is brought into contact, And is capable of bending deformation in a direction intersecting the projecting direction. 제3항에 있어서,
상기 패드는, 심층(芯層)과 이 심층으로부터 상기 기판의 중심에 대하여 안쪽 또는 바깥쪽으로 일부가 튀어 나오도록 적층된 탄성층을 갖고, 이 탄성층의 상기 심층으로부터 튀어 나온 돌출 부분이 상기 돌출편으로 설정되어 있는 것을 특징으로 하는 기판 반송 장치.The method of claim 3,
Wherein the pad has a core layer and an elastic layer laminated so as to protrude inwardly or outwardly from the center of the substrate from the core layer, and a protruding portion protruding from the core layer of the elastic layer is provided on the protruding portion Is set to a predetermined value.
KR1020170057179A 2016-05-18 2017-05-08 Substrate conveyance device KR101931876B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016099846A JP6298099B2 (en) 2016-05-18 2016-05-18 Substrate transfer device
JPJP-P-2016-099846 2016-05-18

Publications (2)

Publication Number Publication Date
KR20170130285A true KR20170130285A (en) 2017-11-28
KR101931876B1 KR101931876B1 (en) 2018-12-21

Family

ID=60404394

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170057179A KR101931876B1 (en) 2016-05-18 2017-05-08 Substrate conveyance device

Country Status (3)

Country Link
JP (1) JP6298099B2 (en)
KR (1) KR101931876B1 (en)
CN (1) CN107403744B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101971824B1 (en) * 2018-03-05 2019-04-23 캐논 톡키 가부시키가이샤 Robot, Robot system, Manufacturing apparatus of device, Manufacturing method of device and Method for adjusting teaching positions
JP7265336B2 (en) * 2018-10-29 2023-04-26 キヤノントッキ株式会社 Conveying device, film forming device, organic EL element manufacturing system, and organic EL element manufacturing method
JP7131334B2 (en) * 2018-11-29 2022-09-06 株式会社安川電機 Substrate support device, substrate transfer robot and aligner device
CN112466798B (en) * 2020-11-30 2022-05-27 长江存储科技有限责任公司 Semiconductor machine

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120096599A (en) * 2010-02-05 2012-08-30 도쿄엘렉트론가부시키가이샤 Substrate holder, substrate transfer apparatus, and substrate processing apparatus
KR20120106586A (en) * 2011-03-18 2012-09-26 도쿄엘렉트론가부시키가이샤 Substrate supporting device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001179672A (en) 1999-12-21 2001-07-03 Mitsubishi Electric Corp Robot hand
JP2002353291A (en) * 2001-05-30 2002-12-06 Ulvac Japan Ltd Apparatus for transferring substrate
JP2010239087A (en) * 2009-03-31 2010-10-21 Tokyo Electron Ltd Substrate supporting device and method of supporting substrate
JP5379589B2 (en) 2009-07-24 2013-12-25 東京エレクトロン株式会社 Vacuum suction pad, transfer arm and substrate transfer device
JP5577817B2 (en) * 2010-04-22 2014-08-27 凸版印刷株式会社 Substrate mounting pad mechanism
JP3166983U (en) * 2011-01-18 2011-03-31 東京エレクトロン株式会社 Substrate holding device
JP2012212746A (en) * 2011-03-31 2012-11-01 Tokyo Electron Ltd Substrate transfer device and substrate transfer method
US10137576B2 (en) * 2011-12-16 2018-11-27 Brooks Automation, Inc. Transport apparatus
JP6224437B2 (en) * 2013-11-26 2017-11-01 東京エレクトロン株式会社 Substrate transfer device
US9698035B2 (en) * 2013-12-23 2017-07-04 Lam Research Corporation Microstructures for improved wafer handling
JP6486140B2 (en) 2015-02-25 2019-03-20 キヤノン株式会社 Conveying hand, lithographic apparatus, and method for conveying an object to be conveyed

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120096599A (en) * 2010-02-05 2012-08-30 도쿄엘렉트론가부시키가이샤 Substrate holder, substrate transfer apparatus, and substrate processing apparatus
KR20120106586A (en) * 2011-03-18 2012-09-26 도쿄엘렉트론가부시키가이샤 Substrate supporting device

Also Published As

Publication number Publication date
JP2017208451A (en) 2017-11-24
CN107403744A (en) 2017-11-28
CN107403744B (en) 2022-04-29
JP6298099B2 (en) 2018-03-20
KR101931876B1 (en) 2018-12-21

Similar Documents

Publication Publication Date Title
KR101931876B1 (en) Substrate conveyance device
JP5033886B2 (en) Robot hand for substrate transfer
JP2021048406A (en) Substrate transfer robot end effector
JP5144434B2 (en) Support device
JP2011228625A (en) Substrate transfer hand and substrate transfer robot
JP2012522386A (en) Vacuum gripper assembly stabilized by a spring
JP6024267B2 (en) Substrate holding ring gripping mechanism
US9004564B2 (en) Wafer handling apparatus
KR101356952B1 (en) Non slip pad for substrates transporting device
TWD198930S (en) Part of the holding pad for substrate transportation
JP2019026465A (en) Conveyance system and substrate processing system
JP2019010692A (en) Hand for industrial robot and industrial robot
JP2013243203A (en) Support device
KR20200056922A (en) Substrate transfer apparatus
KR100962953B1 (en) Robot for transferring glass
US9412638B2 (en) End effector pads
KR101989322B1 (en) Robot hand for transporting film
KR200488775Y1 (en) Blade for transferring wafer
TWI628131B (en) Handling device, handling system
KR20200001624U (en) Wafer blade
CN110295356B (en) Substrate cushion block, substrate conveying equipment and film forming system
CN112466808B (en) Wafer clamping component and mechanism
KR100949686B1 (en) Apparatus for transfering substrate and substrate treating apparatus having it
CN109256353B (en) Positioning base
CN115206865A (en) Substrate clamping device

Legal Events

Date Code Title Description
A201 Request for examination
A302 Request for accelerated examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant