KR20170115408A - Display module and display apparatus - Google Patents

Abstract

A display module according to an embodiment includes a panel assembly having a plurality of light emitting panels arranged in M rows and N columns (M > 1, N >1); A cabinet coupled to the first surface of the panel assembly; And a plurality of heat dissipating frames coupled to corner areas of the cabinet and corresponding to corner areas of the panel assembly, each of the light emitting panels including a circuit board and a pixel area having a plurality of light emitting diodes on the circuit board And the cabinet includes a plurality of engaging portions coupled to a part of the plurality of heat radiating frames.

Description

DISPLAY MODULE AND DISPLAY APPARATUS HAVING THE SAME -

An embodiment relates to a display module.

An embodiment relates to a display device having a display module.

The embodiment relates to a display module and a display device using a light emitting diode.

A light emitting diode (LED) is one of semiconductor devices that emits light when current is applied. The light emitting diode is capable of emitting light with high efficiency at a low voltage, thus providing excellent energy saving effect. In recent years, the problem of brightness of a light emitting diode has been greatly improved, and it has been applied to various devices such as a light unit of a liquid crystal display, a display board, a display, and a home appliance.

2. Description of the Related Art Demand for large screens is increasingly increasing in advertisements and displays on public places, and light emitting diodes (LEDs) are used as display means for large screens. This is because it is easy to increase in size, consumes little electric energy, and has a long service life with low maintenance cost as compared with the display means using the conventional liquid crystal light emitting panel. 2. Description of the Related Art Recently, large-sized display means using light emitting diodes (LEDs) have been used in various fields such as TVs, monitors, stadium signs, outdoor advertising, indoor advertising, public signs, and information display boards.

The embodiment provides a display module having a cabinet supporting a luminescent panel in which light emitting diodes are arranged.

The embodiment provides a display module having a cabinet in which a heat radiating frame is disposed behind the corners of a luminescent panel in which light emitting diodes are arranged.

An embodiment provides a display module having a heat radiating frame integrally coupled to a cabinet made of resin at the rear of a luminescent panel.

Embodiments provide a display device which is arranged in a matrix form of a plurality of display modules and in which the heat radiation frames of each display module can be brought into contact with each other.

Embodiments provide a display module in which a plurality of magnets are arranged along an outer side of a rear cabinet of a luminescent panel, and a display device having the display module.

Embodiments provide a display device in which a plurality of magnets and heat radiating frames are in contact with each other, with the side surfaces facing each other among the side surfaces of the plurality of display modules being non-contacted.

A display module according to an embodiment includes a panel assembly having a plurality of light emitting panels arranged in M rows and N columns (M > 1, N >1); A cabinet coupled to the first surface of the panel assembly; And a plurality of heat dissipating frames coupled to corner areas of the cabinet and corresponding to corner areas of the panel assembly, each of the light emitting panels including a circuit board and a pixel area having a plurality of light emitting diodes on the circuit board And the cabinet includes a plurality of engaging portions coupled to a part of the plurality of heat radiating frames.

A display device according to an embodiment includes: a plurality of display modules arranged in a horizontal and vertical direction; And a fixing plate for fixing the plurality of display modules in a center area of the plurality of display modules, wherein each of the plurality of display modules includes a plurality of light emitting panels arranged in M rows and N columns (M > 1, N &); A cabinet coupled to the first surface of the panel assembly; And a plurality of heat dissipating frames coupled to corner areas of the cabinet and corresponding to corner areas of the panel assembly, each of the light emitting panels including a circuit board and a pixel area having a plurality of light emitting diodes on the circuit board Wherein the cabinet includes a plurality of magnets disposed along a sidewall of the cabinet, the plurality of magnets including a plurality of engaging portions coupled to a part of the plurality of heat radiating frames, The magnets of the cabinet being in contact with each other.

Embodiments can reduce the thickness of the display module by providing the heat radiation frame in the cabinet.

The embodiment can reduce the weight of the display module by providing the heat radiation frame in the cabinet.

In the embodiment, the power supply board is accommodated between the cabinet and the circuit board of the luminescent panel, thereby preventing an increase in thickness of the display module due to the power supply board.

The embodiment can improve the heat dissipation of the luminescent panel.

The embodiment can improve the heat dissipation of a display device having a plurality of luminescent panels.

The embodiment has an effect of facilitating assembly of a plurality of display modules.

1 is an exploded perspective view of a display module according to an embodiment.
Figure 2 is a perspective view of the display module of Figure 1;
Figure 3 is a front view of the display module of Figure 2;
4 is a cross-sectional view of the display module of Fig. 2 on the AA side.
5 is an example of a luminescent panel of the display module according to the embodiment.
6 is a rear view of the cabinet of the display module according to the embodiment.
7 is a view for explaining a cabinet structure of the display module according to the embodiment.
Figure 8 is a partial enlarged view of the cabinet of Figure 7;
9 is a view showing a heat radiation frame of the cabinet of the display module of FIG.
Fig. 10 is a sectional view of the cabinet and the heat radiation frame of Fig. 9 taken along the BB side. Fig.
Fig. 11 is a cross-sectional side view of the cabinet and the heat radiation frame of Fig. 9 on the CC side.
Fig. 12 is a DD side sectional view of the cabinet and the heat radiation frame of Fig. 9;
13 is a state before coupling of the display module of the display device according to the embodiment.
14 is a rear view of a display device according to the embodiment.
15 is a detailed view illustrating a coupling structure of the center side display modules in the display device according to the embodiment.
16 is a view for explaining a coupling structure of the side display modules in the display device according to the embodiment.
17 is a view showing a detailed structure of a heat radiating frame of the display module according to the embodiment.
18 to 20 show another example of the heat radiation frame of the display module according to the embodiment.
21 to 24 are diagrams comparing stresses of heat radiation frames of the display module according to the embodiment.
25 is a view for comparing equivalent stresses according to the shape of the rear rib of the cabinet in the display module according to the embodiment.
26 is a view showing a temperature distribution in the luminescent panel in the display module according to the embodiment.
FIG. 27 is a view showing a temperature distribution by the driver ICs in the display module according to the embodiment. FIG.
28 is a view showing a modification of the circuit board of the light emitting panel by heat in the display module according to the embodiment.
29 is a view showing a temperature distribution in a luminescent panel according to a material of a cabinet of a display module according to an embodiment.
30 is a diagram showing the temperature distribution in the driver IC according to the material of the cabinet of the display module according to the embodiment.
31 is a diagram comparing temperature distributions in the light emitting diode and the driver IC of the display module according to the embodiment.

Throughout the specification, when an element is referred to as "comprising ", it means that it can include other elements as well, without excluding other elements unless specifically stated otherwise. In order to clearly explain the present invention in the drawings, parts not related to the description are omitted, and like parts are denoted by similar reference numerals throughout the specification.

In the description of the embodiments, when a portion such as a layer, a film, an area, a plate, or the like is referred to as being "on" another portion, it includes not only the case where it is "directly on" another portion but also the case where there is another portion in the middle. Conversely, when a part is "directly over" another part, it means that there is no other part in the middle.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

A display module and a display device according to embodiments will be described in detail with reference to the accompanying drawings. 2 is an exploded perspective view of the display module according to the embodiment, FIG. 2 is an assembled perspective view of the display module of FIG. 1, FIG. 3 is a front view of the display module of FIG. 2, FIG. 6 is a rear view of a cabinet of a display module according to an embodiment of the present invention. FIG. 7 is a cross-sectional view illustrating a cabinet structure of a display module according to an embodiment of the present invention. Fig. 9 is a partially enlarged view of the cabinet of Fig. 7, Fig. 9 is a view showing a heat radiation frame of the cabinet of the display module of Fig. 6, Fig. 11 is a cross-sectional side view of the cabinet and the heat radiation frame of Fig. 9, and Fig. 12 is a DD side sectional view of the cabinet and heat radiation frame of Fig.

The light emitting device referred to in the present specification includes a light emitting diode (LED), which can emit a single peak wavelength or emit a plurality of peak wavelengths. The light emitting diode may be formed of an LED chip, a phosphor layer may be provided on the LED chip, or a light emitting diode package in which the LED chip is packaged may be selectively used. The phosphor layer is excited by the light emitted from the LED chip to emit a peak wavelength of one or more colors. The light emitting diode according to the embodiment may include an element such as a zener diode or a FET, which may be implemented by a semiconductor laminated structure. To easily explain various embodiments of the present invention, an LED and a device having a configuration added thereto will be described as a light emitting device.

1 to 3, the display module 100 includes a panel assembly 110 having a plurality of luminescent panels 111, 112, 113, and 114 in which light emitting devices are arranged, and a plurality of light emitting panels 111, 112, 113, And a cabinet 130 for supporting and dissipating the luminescent panels 111, 112, 113, and 114. A power supply board 173 for supplying power to the luminescent panels 111, 112, 113 and 114 and a control board 175 for controlling the power supply board 173 may be disposed on the rear surface of the cabinet 130 according to the embodiment. A cover 170 for protecting the power board 173 and the control board 175 may be coupled to the first side of the cabinet 130, for example.

The cabinet 130 is disposed on a first surface of a panel assembly 110 and the panel assembly 110 includes a plurality of luminescent panels 111, 112, 113, and 114. Each of the plurality of light emitting panels 111, 112, 113, and 114 may have the same size. The panel assembly 110 may include an array of M rows and N columns (M> 1, N> 1, M + N 2) of light emitting panels 111, 112, 113 and 114, for example, two rows and two columns or more. As shown in FIG. 3, the lengths X3 and Y3 of the light emitting panels 111, 112, 113 and 114 may be different from each other. For example, the width X3 may be longer than the length Y3. The lateral length X3 of each of the light emitting panels 111, 112, 113, and 114 may provide an aspect ratio in a range of 1.5 times or more, for example, 1.5 times to 2 times the vertical length Y3. The width X2 of the panel assembly 110 may be 480 mm or more, and the length Y2 may be 250 mm or more, but the present invention is not limited thereto. As another example, at least one of the plurality of luminescent panels 111, 112, 113, and 114 may be of different sizes and is not limited thereto. Each of the luminescent panels 111, 112, 113, and 114 includes a polygonal shape. For example, the luminescent panels 111, 112, 113, and 114 may have a rectangular shape, a square shape, or a polygonal shape of a square or more.

6) of the cabinet 130 may be equal to the transverse length X2 of the panel assembly 110 and the longitudinal length Y1 of the cabinet 130 may be equal to or greater than the transverse length X1 of the panel assembly 110. [ The vertical length Y3 of the protruding portion may be equal to the vertical length Y3 of the protruding portion. As another example, the horizontal and vertical lengths X1 and Y1 of the cabinet 130 may be different from the horizontal and vertical lengths X2 and Y2 of the panel assembly 110. For example, May be larger than the size of the cabinet 130. Accordingly, the cabinet 130 can be prevented from being exposed to the front surface of the panel assembly 110.

The plurality of luminescent panels 111, 112, 113, and 114 may be arranged on the same plane or on different planes on the cabinet 130, but the present invention is not limited thereto. The plurality of luminescent panels 111, 112, 113, and 114 may be disposed on a horizontal plane, or at least one may be tilted from a horizontal plane.

Each of the light emitting panels 111, 112, 113, and 114 of the panel assembly 110 includes unit pixels having sub pixels of a light emitting device arranged in a matrix, and the unit pixels may include light emitting diodes Or by using light emitting diodes which emit light of the same color to each other. The light emitting device of the unit pixel may include blue, green, and red light emitting diodes.

5, the light emitting panels 111, 112, 113 and 114 include a circuit board 1, a pixel region 2 including a plurality of light emitting elements 2A, 2B and 2C arranged on the circuit board 1, And a light-transmitting layer (3) disposed on the substrate (1). The circuit board 1 may be a single-layer or multi-layer rigid substrate or a flexible substrate. The circuit board 1 may include, for example, a resin-based printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, and an FR-4 substrate. The circuit board 1 may include a film having an electrode pattern. For example, the circuit board 1 may be formed of a PI (polyimide) film, a PET (polyethylene terephthalate) film, an EVA (ethylene vinyl acetate) film, a PEN (PAC), polyphenylene sulfide (PPS), resin film (PE), polyacetal resin (PAC), polyacetal resin PP, PET), and the like.

A circuit pattern may be disposed on the circuit board 1, and the circuit pattern may be electrically connected to the plurality of light emitting devices 2A, 2B, and 2C. A black matrix layer (not shown) may be disposed on the circuit board 1, and the black matrix layer may improve the contrast ratio on the circuit board 1. The block matrix layer may be disposed between the pixel regions 2 to improve the contrast ratio. The material of the black matrix layer may be, for example, carbon black, graphite, or poly pyrrole. The surface of the black matrix material is formed with a roughness such as a concavo-convex pattern, so that the diffusibility of light can be controlled.

The thickness of the circuit board 1 may be in the range of 100 占 퐉 or more, for example, in the range of 100 占 퐉 to 500 占 퐉, for example, 100 占 퐉 to 400 占 퐉. When the thickness of the circuit board 1 is larger than the above range, there is a difficulty in processing a via electrode (not shown). When the thickness of the circuit board 1 is thinner than the above range, it is difficult to handle, and cracks, scratches, Problems can arise. By providing the circuit board 1 with the thickness described above, it is possible to support the light emitting devices 2A, 2B, and 2C and to prevent a decrease in heat radiation efficiency.

The light emitting device (2A, 2B, 2C) is implemented as a unit pixel region (2) as a plurality of subpixels, and the pixel region (2) includes a blue LED chip, a green LED chip and a red LED chip, And at least one or both of a green phosphor layer and a red phosphor layer. The light emitting diode may include at least one of a Group II-VI compound semiconductor and a Group III-V compound semiconductor. The light emitting diode may selectively include a semiconductor light emitting device manufactured using a semiconductor of a series of AlInGaN, InGaN, GaN, GaAs, InGaP, AllnGaP, InP, InGaAs or the like. The light emitting diode may include an n-type semiconductor layer, a p-type semiconductor layer, and an active layer. The active layer may be formed of InGaN / GaN, InGaN / AlGaN, InGaN / InGaN, GaN / AlGaN, InAlGaN / InAlGaN, AlGaAs / / GaAs, InGaP / GaP, AlInGaP / InGaP, InP / GaAs. The light emitting diode may be implemented by at least one of a horizontal chip structure, a vertical chip structure, a flip chip structure, or a structure having a via electrode, but is not limited thereto.

A light-transmitting layer 3 is disposed on the light-emitting devices 2A, 2B, and 2C, and the light-transmitting layer 3 includes a transparent resin material such as silicon or epoxy. The light-transmitting layer 3 may cover the light-emitting elements 2A, 2B and 2C and may be in contact with the upper surface of the circuit board 1. [ The light-transmitting layer 3 can block moisture penetrating through the top surface of the circuit board 1 by transmitting light.

A protective layer 4 may be disposed on the light transmitting layer 3 and the protective layer 4 may protect the surface of the light transmitting layer 3. The protective layer 4 may be formed of a transparent material such as silicon or epoxy, and may transmit incident light. A part of the protective layer 4 can be brought into contact with the edge portion of the circuit board 1, thereby suppressing moisture penetration through the side surface of the circuit board 1. [

The upper surface area of each of the circuit board 1, the light-transmitting layer 3 and the protective layer 4 may be the same as the upper surface area of each of the luminescent panels 111, 112, 113 and 114, but is not limited thereto.

Each of the luminescent panels 111, 112, 113, and 114 may have a sub-pixel of a unit pixel as a light emitting diode, thereby minimizing a pitch between the pixels. For example, the light emitting panels 111, 112, 113, and 114 may be classified into SD (standard definition) resolution 760480, HD (high definition) resolution 1180720, FHD (full HD) resolution 19201080, UH Resolution (34802160) or a UHD-class resolution or higher (e.g., 4K (K = 1000), 8K, etc.). By implementing these luminescent panels 111, 112, 113, and 114 with pixels having LEDs, power consumption can be reduced, can be provided with a long lifetime at a low maintenance cost, and can be provided as a high-luminance self-luminous display.

A plurality of fastening members 19 may be disposed on the rear surfaces of the luminescent panels 111, 112, 113 and 114. The fastening members 19 may be bonded to the rear surface of the luminescent panels 111, 112, 113, Material. The fastening member 19 may include a nut joined to the rear surface of the circuit board 1. [ It is not necessary to form a member for fastening in the circuit board 1 by bonding the fastening member 19 to the back surface of the circuit board 1 and the thickness of the circuit board 1 can be thinned. Further, the fastening member can be removed from the upper surface of the circuit board 1. The nuts may be made of a metal material to stably fix the luminescent panels 111, 112, 113, and 114 to the cabinet 130, and improve the heat transfer efficiency. The fastening member 19 may be a groove having a hook structure or a protrusion structure, but the present invention is not limited thereto.

A plurality of driver ICs 5 may be arranged on the rear surface of the circuit board 1. The driver IC 5 may control driving and currents of the light emitting devices 2A, 2B and 2C.

2 and 4, a panel assembly 110, for example, a plurality of luminescent panels 111, 112, 113, and 114, is disposed on a front surface of the cabinet 130. The plurality of luminescent panels 111, 112, 113 and 114 are disposed on the front surface of the cabinet 130 and the fastening holes 192 in the cabinet 130 and the fastening members 191, To be fixed to the luminescent panels 111, 112, 113, and 114 in the cabinet 130. As shown in FIG.

The cabinet 130 is coupled to the rear of the plurality of luminescent panels 111, 112, 113, and 114 and supports the plurality of panel panels 111, 112, 113, and 114 to be formed of a material having high heat dissipation characteristics and less heat deformation. The cabinet 130 may include a resin material or plastic such as heat-resistant plastic, reinforced plastic, or a thermally conductive resin material. The cabinet 130 may include a resin material such as polycarbonate (PC) to improve heat resistance. The cabinet 130 may include at least one of polyethylene (PE), polyethylene terephthalate (PET), polypropylene (PP), styrene resin, and thermoplastics (FRTP).

6 and 7, a plurality of cable holes 132 may be disposed in the cabinet 130, a cable (not shown) may be inserted through the cable hole 132, and the light emitting panels 111, 112, 113, And the driver IC 5 can be exposed. The horizontal distance B1 between the cable holes 132 may be larger than the width B2 of the power supply board 173, but the present invention is not limited thereto.

The cabinet 130 may be provided with a heat dissipation hole 133 and the heat dissipation hole 133 may be arranged in a matrix form in a center area of the panel assembly 110. Since each of the heat dissipation holes 133 is disposed in a shape longer than the horizontal length, heat dissipation in the vertical direction can be facilitated. The number of the heat dissipation holes 133 may be larger in the corner areas of the lower and third light emitting panels 111, 112, 113 and 114 than in the corner areas of the first and second luminescent panels 111, 112, 113 and 114, Heat radiation due to heat transfer between the upper and lower luminescent panels 111, 112, 113 and 114 can be improved. Here, the size of the heat dissipation hole 133 may vary depending on the position, and for example, the size of the hole arranged in the center column may be larger than the size of the hole arranged in the upper and lower rows. The size of the heat dissipation hole 133 may be larger than the size of the hole in the other area so as to reduce the concentration of heat, which is disposed in a region corresponding to the center area of the panel assembly 110.

7 and 8, a plurality of front ribs 31, 32, 33, and 34 are disposed on a front portion of the cabinet 130, and the plurality of front ribs 31, 32, May include first ribs 31 and 34 arranged vertically, and second ribs 32 and 33 arranged horizontally. The first and second ribs 31, 32, 33, and 34 may intersect with each other. The first and second ribs 31, 32, 33, and 34 may be disposed in an edge region and an inner region of the cabinet 130, and the first ribs 34 disposed in the inner region may have a plurality of vertical And a plurality of second ribs 33 arranged in the inner region are arranged in parallel in the horizontal direction. The spacing C2 between the plurality of first ribs 34 in the inner region may be the same as or different from the spacing C4 between the plurality of second ribs 33, . The first and second ribs 31 and 32 disposed in the edge region of the cabinet 130 are spaced apart from the side walls 40A, 40B, 40C, and 40D by first and second ribs 33, 34 between the first and second electrodes 34, 34. The first and second ribs 31, 32, 33, and 34 can reduce the stress on deformation in the edge area and the inside area on the front surface of the cabinet 130. The interval C1 between the first ribs 31 and 34 in the inside / outside area may be larger than the interval C3 between the second ribs 32 and 33 in the inside / outside area.

A bridge rib 33A is disposed between the first and second ribs 33 and 34 disposed in the inner region of the cabinet 130 to connect the first ribs 33 to each other or to connect the second ribs 34 ) To each other. The bridge ribs 33A may be connected to the ribs 33 and 34 to which the fastening members 19 of the panel assembly 110 shown in FIG. 4 are coupled. A guide rib 36 having an insertion groove 36A into which the fastening members (19 in FIG. 4) of the light emitting panels 111, 112, 113 and 114 are inserted is formed in a predetermined portion of the first and second ribs 31, And the guide ribs 36 protrude in the direction of the luminescent panel and may be inserted into the inner insertion groove 36A by inserting the coupling member 19 in FIG. A fastening hole 192 is provided in the insertion groove 36A and can be fastened to the fastening member 19 (FIG. 4) through the fastening means 191. FIG. The insertion grooves 36A and the fastening holes 192 may be disposed at positions corresponding to the fastening members 19 of the luminescent panels 111, 112, 113, and 114, respectively. The first and second ribs 31, 33, and 34, respectively, or in a region adjacent thereto, so that the rigidity can be prevented from being lowered.

1, 4 and 6, a flat area 131 is disposed on a rear portion of the cabinet 130, and a heat radiating plate 171 and a control board 175 are coupled to the flat area 131. [ And a power board 173 may be coupled to the rear of the heat radiating plate 171. [ The heat dissipation plate 171 may dissipate heat conducted through the circuit board 1 and the power supply board 173 of the panel assembly 110. The plurality of protrusions 171A protrude in the direction of the luminescent panels 111, 112, 113 and 114 and are arranged in a vertical direction so that the heat dissipation plate 171 And may optionally overlap the hole 133. [ Here, the control board 175 and the power board 173 may be provided with a gap member 195 for electrical protection. The gap member 195 may be disposed between the control board 175 and the heat radiating plate 171 and between the power board 173 and the cabinet 130. [ Thereafter, the power supply board 173 and the control board 175 may be fastened to the cabinet 130 by using the fastening means 191. [

As shown in FIG. 6, a plurality of rear ribs 41 and 42 may be disposed on the rear portion of the cabinet 130. The plurality of rear ribs 41 and 42 is a back rib, and a plurality of horizontal ribs 41 and a plurality of vertical ribs 42 are disposed. The ribs R5 disposed in the center region B3 among the third ribs 41 are arranged narrower than the density or spacing of the ribs disposed on the outer side of the ribs 41 to prevent the cabinet 130 from being twisted in the horizontal direction can do. The third and fourth ribs 41 and 42 may be selectively connected to the rear side walls 40A, 40B, 40C and 40D of the cabinet 130. [

Ribs R2 that are horizontally overlapped or disposed between the heat-radiating frames 141, 142, 143, and 144 in regions adjacent to the upper and lower sidewalls 40B and 40D of the third ribs 41, At least two ribs may be disposed to prevent the cabinet 130 from being twisted in the horizontal direction. The ribs R2 may overlap the region A2 of the heat-radiating frames 141, 142, 143 and 144 in the horizontal direction.

The ribs R1 overlapping the regions adjacent to the left and right side walls 40A and 40C of the fourth ribs 42 such as the heat radiating frames 141, 142, 143 and 144 in the vertical direction or disposed between the heat radiating frames 141, 142, 143, At least two of them can be disposed to reinforce the rigidity of the cabinet 130 in the vertical direction. The ribs (R1) overlap the region (A1) of the heat radiating frames (141, 142, 143, 144) in the vertical direction, and can prevent warping and stress in the vertical direction.

The density of the rear ribs 41 and 42 of the cabinet 130 is higher than the density of the front ribs 31, 32, 33 and 34, It is possible to reinforce the load in the vertical direction.

The cabinet 130 according to the embodiment includes heat dissipating frames 141, 142, 143 and 144, and the heat dissipating frames 141, 142, 143 and 144 may be disposed such that a plurality of heat dissipating frames 141, 142, 143 and 144 are spaced apart from each other. The heat radiating frames 141, 142, 143 and 144 include first to fourth heat radiating frames 141, 142, 143 and 144 disposed at corner areas of the cabinet 130. The first to fourth heat radiating frames 141, 142, , And a rectangular shape. The heat radiating frames 141, 142, 143 and 144 correspond to the rear corner areas of the panel assembly 110 and may be coupled to any one corner of the light emitting panels 111, 112, 113 and 114.

The heat radiating frames 141, 142, 143, and 144 may be integrally coupled to the cabinet 130. The cabinet 130 includes a coupling portion 50 coupled to the heat radiating frames 141, 142, 143 and 144. The coupling portion 50 may be coupled to a part of the heat radiating frames 141, 142, 143 and 144, for example. The engaging portion 50 may be coupled to two different side portions of the heat radiating frames 141, 142, 143 and 144.

The outer surfaces of the first to fourth heat-radiating frames 141, 142, 143 and 144 may protrude further outward than the side walls 40A, 40B, 40C and 40D of the cabinet 130. [ The transverse length X1 of the cabinet 130 is a distance between the outer surfaces of the first and second heat dissipating frames 141 and 142 and the longitudinal length Y1 is a distance between the outer sides of the first and third heat dissipating frames 141 and 143 .

As shown in FIGS. 8 to 12, the heat radiating frames 141, 142, 143 and 144 may have recesses 60A and 60B on the outer peripheral side wall frame 60 and on the front and rear sides of the side wall frame 60, respectively . The side wall frame 60 may include a plurality of fastening holes 69.

The first recess 60A and the plurality of holes H1 and H2 are disposed in the front portion of the heat dissipating frame 141, 142, 143 and 144, (E3 in Fig. 11) from the frame 60, and may correspond to the luminescent panels 111, 112, 113, and 114. [ The outer hole H1 of the holes H1 and H2 is engaged with the coupling member 19 of Fig. 4 of the luminescent panels 111, 112, 113 and 114 and the inner hole H2 is a hole adjacent to the cabinet 130, And a part of the cabinet 130 may be coupled as shown in FIG. 9, at least one of the plurality of inner holes H2 may be disposed in the engaging portion 50 of the cabinet 130, and the remainder may be disposed in contact with or open to the engaging portion 50 . The heat radiating frames 141, 142, 143 and 144 may be formed without a separate rib, and may protrude from the bottom of the front surface of the cabinet 130 as shown in FIG.

As shown in FIGS. 6 and 9, the heat dissipating frames 141, 142, 143 and 144 are provided with a second recess 60B at a rear portion thereof and the second recess 60B has a plurality of fastening ribs 62, And a coupling rib 67 connecting the coupling ribs 62 and the coupling ribs 62 adjacent to each other.

The second recess 60B may be disposed at a predetermined depth (E4 in FIG. 11) from the side wall frame 60, and the second recess 60B may have a depth E4, The depth of the recess 60A is greater than the depth E3 of the recess 60A and the coupling strength with the engaging portion 50 of the cabinet 130 can be enhanced.

A plurality of the fastening ribs 62 may be spaced apart from each other in the second recess 60B. The connecting ribs 62 may be arranged in a polygonal shape, for example, a rhombic shape, a rectangular shape, a pentagonal shape, or a trapezoidal shape. Adjacent fastening ribs of the plurality of fastening ribs 62 are disposed diagonally and non-adjacent fastening ribs may be disposed on a vertical line or a horizontal line. The fastening ribs 62 may function as bosses. The embodiment provides a plurality of fastening ribs 62 in a rhombic shape, and can distribute the stress to the load in the vertical direction when arranged in the rhombic shape. The shape of each of the fastening ribs 62 may include a columnar shape, such as a circular columnar shape or a polygonal columnar shape, and may have a fastening groove 62A therein. The fastening groove 62A may be fastened to the outer wall or case by fastening means.

The plurality of ribs 61 may be disposed between the respective coupling ribs 62 and the adjacent side wall frame 60. The multiple ribs 61 connected to the respective coupling ribs 62 may be gradually spaced apart from each other toward the side wall frame 60. The multiple ribs 61 are separated from each other by a portion connected to the coupling ribs 62 and the side wall frame 60 to disperse a force transmitted from the outside. The maximum spacing of the multiple ribs 61 may be greater than the maximum width of the fastening ribs 62 so that a force exerted through the multiple ribs 161 having a larger area or a larger area, (62). More than two, for example three or more, of the multiple ribs 61 can be connected to the respective coupling ribs 62, and the number of the ribs 61 is twice or more than that of the coupling ribs 67 between the coupling ribs 62 Lt; / RTI > Here, the total number of the multiple ribs 61 in the first heat dissipating frame 141 may be three times or more, for example, 3.5 times or more than the total number of the connecting ribs 67.

The coupling ribs 67 between the coupling ribs 62 connect the coupling ribs 62 arranged in the diagonal direction, and may be bridge ribs. The coupling ribs 67 connect the different coupling ribs 62 and distribute the external stress transmitted to the coupling ribs 62 to other coupling ribs 62 and transmit the external stresses. As another example, the connecting ribs 67 may further include horizontal and / or vertical connecting ribs 67 connecting the fastening ribs 62 arranged in the horizontal or vertical direction, but the present invention is not limited thereto.

The multiple ribs 61 and the connecting ribs 67 may serve as ribs for connecting the fastening ribs 62 and the side wall frame 60 and the fastening ribs 62. The sum of the back surface areas of the coupling ribs 62 and the connecting ribs 67 may be set to be 40% or less, for example, 20% to 30% of the back surface area of each of the heat radiation frames 141, 142, 143, The weight of the heat radiating frames 141, 142, 143 and 144 may be increased. If the heat radiating frames 141, 142, 143 and 144 are less than the above range, the dispersion efficiency and heat dissipation efficiency of the ribs 61, A rear area of the heat radiation frame (141 142 143 144) may vary depending on the size of and be at least ^2, for example 2000mm, 2100mm ^2, the cabinets 130).

The total sum of the back surface areas of the plurality of heat dissipating frames 141, 142, 143, and 144 may be set to 10% or less, for example, 4% to 8% of the sum of the back surface area of the cabinet 130. If the sum of the back surfaces of the plurality of heat radiating frames 141, 142, 143 and 144 exceeds the above range, the total weight may be increased when the plurality of display modules 100 are laminated. If the sum is less than the above range, Can be lowered.

The heat radiating frames 141, 142, 143, and 144 may be made of a metal material such as aluminum or an aluminum alloy. The heat-radiating frames 141, 142, 143 and 144 may be made of a metal or an alloy having a high thermal conduction characteristic and a good bonding strength with the cabinet 130 after injection and having rigidity. The heat dissipation frames 141, 142, 143, and 144 may be made of any one of titanium, copper, nickel, gold, chromium, tantalum, platinum, tin, ), Silver (Ag), phosphorus (P), iron (Fe), or an alloy thereof. The bottom thickness of the heat-radiating frames 141, 142, 143, and 144 may be 0.5 mm or more, but is not limited thereto.

In the embodiment, the heat radiating frames 141, 142, 143 and 144 are integrally formed in the cabinet 130, so that the problem caused by the increase in weight by the cabinet 130 formed of a metal material, for example, , Or there are high cost problems. The embodiment can reduce the problem of the weight of the unit module or the entire set by the heat radiating frames 141, 142, 143 and 144 disposed at at least the corner portions of the cabinet 130, . Further, the thickness of the cabinet 130 can be reduced by injecting the heat-radiating frames 141, 142, 143 and 144. Accordingly, the coupling portion 50 of the cabinet 130 can block the flow of the heat radiating frames 141, 142, 143 and 144 in the up / down / left / right directions.

The structure of the coupling portion 50 of the first heat dissipating frame 141 and the cabinet 130 will be described in detail below. The second through fourth heat dissipating frames 142, 143, Reference will be made to the coupling structure.

9 and 10, at least one fitting hole 69, for example, a plurality of fitting holes 69 may be disposed in the side wall frame 60 in the first heat dissipating frame 141, And can be introduced at the time of injection of the engaging portion 50 through the engaging hole 69. The coupling portions 50 are coupled through the plurality of coupling holes 69 so that the surfaces of the first radiating frame 141 and the cabinet 130 can be coupled with each other in the up / down / left / right directions. The outer surface of the first heat dissipating frame 141 may be disposed at a predetermined distance E1 from the side surface of the engaging portion 50 so that the contact area of the outer surfaces of the heat dissipating frames .

9 and 11, the coupling portion 50 of the cabinet 130 is coupled to the inner region 64 of the side wall frame 60 of the first heat dissipating frame 141 and the plurality of support ribs 61 . The engaging portion 50 may be in contact with or spaced from any one of the engaging ribs 62, but is not limited thereto.

9 and 12, the engaging portion 50 of the cabinet 130 includes a region disposed on the outer side with respect to the inner contacting portion 64 of the side wall frame 60 of the first radiating frame 141, And the width D5 of the inner region of the contact portion 64 or the area thereof may be greater than the width D1 of the outer region or the area thereof (D5 > D1). For example, the width D5 of the inner region is arranged to be twice as large as the width D1 of the outer region, and the contact area of the first heat-radiating frame 141 with the inside of the engaging portion 50 is increased And the adhesive strength can be enhanced.

The thickness D2 of the side wall frame 60 of the heat radiating frames 141, 142, 143 and 144 includes a range of 1.6 mm ± 0.4 mm. The abutting portion 64 to be joined may be at least two sides. The thickness D2 of the side wall frame 60 and the contact portion 64 may be the same as the width D1 of the outer region or may be in a range of 1.6 mm +/- 0.4 mm.

A portion 50A of the coupling portion 50 of the cabinet 130 may be coupled to at least one of the coupling holes 69 of the heat radiating frames 141, 142, 143, The height D4 of the engaging hole 69 may be more than 1/2 of the depth E4 of the second recess 60B of Fig. 11 to facilitate the introduction of the solution at the time of submersion, .

The engaging portion 50 of the cabinet 130 is protruded by a predetermined thickness D4 from the side wall frame 60 of the first heat dissipating frame 141 so that the abutting portion 64 of the side wall frame 60 moves rearward Can be prevented. The thickness D4 may be equal to or greater than the thickness D2 of the side wall frame 60 to prevent breakage due to the flow of the side wall frame 60. [

This allows the contact portions 64 of at least two sidewall frames of the heat dissipating frames 141, 142, 143 and 144 to be integrally joined with the engaging portions 50 of the cabinet 130. The inner region of the engaging portions 50 has a larger area The first heat radiation frame 141 may be coupled to the cabinet 130 by being engaged with the contact portion 64 of the side wall frame 60. [

A plurality of receiving portions 38 may be disposed along the rim of the display module 100 and the plurality of receiving portions 38 may be disposed on the upper surface of the cabinet 130. [ And may be formed as perforated holes arranged at predetermined intervals along the rim. A magnet 151 may be disposed in the plurality of storage portions 38 and the magnet 151 may be disposed in the storage portion 38, respectively. The magnet portion 151 may be inserted through the front surface and / or the rear surface of the receiving portion 38, and a portion of the magnet 151 may protrude through the guide hole of the side surface portion. It is possible to prevent the magnet 151 from deviating laterally.

13 is a view showing a display device having a display module according to the embodiment, FIG. 14 is a rear view of the display device in which the display modules of FIG. 13 are assembled, and FIG. to be.

13 to 15, a plurality of display modules 100, 101, 102, and 103 may be assembled with each other in a display device. At least two of the plurality of display modules 100, 101, 102, and 103 may be closely arranged in the horizontal direction and / or the vertical direction. The plurality of display modules 100, 101, 102 and 103 can be attached to each other with magnets 151 disposed on the outer periphery thereof, and the display modules 100, 101, 102 and 103 disposed on the adjacent sides can be closely contacted and assembled into a display device.

When the magnets 151 of the display modules 100, 101, 102 and 103 are closely contacted, the sidewall frames of the heat radiating frames 141, 142, 143 and 144 of the adjacent display modules 100, 101, 102 and 103 may contact each other in the vertical direction or the horizontal direction. At this time, the cabinets 130 of the display modules 100, 101, 102, and 103 may be spaced apart from each other by a predetermined gap G2. The heat radiating frames 141, 142, 143 and 144 of the respective display modules 100, 101, 102 and 103 of the display device support loads transmitted in the vertical direction and the front ribs (31, 33, 33 and 34 of FIG. 7) (41, 42 of FIG. 6) can support the area between the heat-radiating frames 141, 142, 143,

As shown in FIGS. 15 and 16, when the plurality of display modules 100, 101, 102, and 103 are assembled, the corner areas of the plurality of display modules 100, 101, 102, and 103 are assembled using the fixing plate 155. That is, the fastening ribs (62 in FIG. 9) formed in the heat radiating frames 141, 142, 143, and 144 disposed at the corners of the plurality of display modules 100, 101, 102 and 103 are fastened with fastening means 191 through fastening holes of the fastening plate 155 can do. The fastening means 191 may be a screw or a rivet. The fixing plate 155 may be made of metal or plastic, and the bottom view may have a polygonal or circular shape. The display device may comprise two rows and two or more columns of display modules.

The center region of the fixing plate 155 is provided with a circular or polygonal opening 155B and the alignment of a plurality of display modules exposed through the hole 155B is confirmed, 111, 112, 113, and 114 are aligned. In the embodiment, when two or more display modules are arranged in the vertical direction in the display device, the inner ribs 161, 162, 167 of the heat radiating frames 141, 142, 143, 144 and the cabinet 130, .

17, the first heat dissipating frame 141 according to the embodiment is received by the side wall frame 60 and is subjected to the external force F1 in the vertical direction when the multiple ribs 61, the fastening ribs 62, The force F2 dispersed through the ribs 67 can be transmitted to the lower portion.

18 shows a first modification of the heat dissipating frame according to the embodiment in which a plurality of fastening ribs 62 are arranged in the rear recess 60B of the heat dissipating frame 140A and no other sub ribs are provided. The plurality of fastening ribs 62 are spaced apart from the side wall frame 60, so that they can not support a vertical load.

Fig. 19 shows a second modification of the heat dissipating frame, in which the sub ribs 61A and 67A are connected to the plurality of fastening ribs 62 in the rear recess 60B of the heat dissipating frame 140B. The sub ribs 61A and 67A are connected to the sidewall frame 60 and the coupling ribs 62 or to the coupling ribs 62 in a single structure in the horizontal and vertical directions. These sub ribs 61A and 67A are arranged in the horizontal and vertical directions, so that the ability to distribute the load transmitted through the side wall frame 60 may be degraded.

20 shows a third modification of the heat dissipating frame. Sub ribs 61A and 67A connecting a plurality of fastening ribs 62 are disposed in the rear recess 60B of the heat dissipating frame 140C. The sub ribs 61A and 67A may have a single structure rib disposed between the sidewall frame 60 and the coupling rib 62 so that the dispersing ability and the force for supporting the load may be reduced.

17, the multiple ribs 61 are arranged between the side wall frame 60 and the fastening ribs 62 of the heat dissipating frames 141, 142, 143 and 144 so that the multiple ribs 61 are fastened to the fastening ribs 62 It is possible to distribute the transmitted load.

Table 1 is a table comparing the equivalent stress, the safety factor, and the strain rate of the embodiment and Modifications 1, 2, and 3.

Tensile strength of material (MPa) Yield strength of the material (MPa) Von-Mises stress (Mpa) Safety factor Strain rate (m) Modification 1 207 110 7.096 35.3 0.00825 Modification 2 4.774 15.5 0.0022 Modification 3 4.804 23.0 0.00205 Example 3.115 22.9 0.000631

Since the embodiment and the modifications 1, 2 and 3 have the same materials, the recognized strength and the yield strength are the same, and the von-Mises stress is lowered according to the rib structure, that is, the equivalent stress of the embodiment is lowest, , And 3 is the next lowest. In addition, it can be seen that the safety factor and the deformation ratio are as low as 50% or more in the embodiment. Accordingly, in the structure according to the embodiment, deformation of the display device due to the load can be minimized, the stability coefficient can be lowered, the strain can be reduced, and the size and weight of the cabinet 130 can be reduced.

Figs. 21 to 24 are views showing stress distributions of the heat radiation frame of the embodiment and the modifications 1, 2, and 3. Fig.

As shown in FIG. 21, it can be seen that the stress distribution of the heat radiation frame of the embodiment is lower than that of the heat radiation frames of the modification examples 1, 2, and 3.

25 is a view showing an equivalent stress according to the shape of the rear rib in the cabinet 130 having the heat radiation frame according to the embodiment.

It is found that the equivalent stress is lower by about 3% than that of the embodiment (B) in the case where there is no vertical rib between the heat radiation frames 141, 142, 143 and 144 on the rear surface of the cabinet 130 as shown in FIG. . In the modified example 4, the equivalent stress is about 1,984 Kpa, and the equivalent stress of the embodiment is 1,937 Kpa. Here, the load was set to 5 kg.

26 to 28 are diagrams showing the temperature distribution of the display module according to the embodiment. 26 to 28 show the temperature distribution when the structure is not provided with the heat radiation plate in Fig. 26 shows the temperature distribution generated from the LED of the luminescent panel, and it is seen that the center of the display module is higher toward the center of the panel assembly. FIG. 27 shows the temperature distribution generated from the driver IC of the luminescent panel, and it is seen that the center of the display module is higher toward the center of the panel assembly. Fig. 28 is a view showing a case where a deformation amount of the circuit board of the luminescent panel is generated by the above-described temperature distribution, and the amount of deformation is corrected by providing a margin in the fastening holes of the heat dissipating frame, Can be reduced.

29 and 30 show the temperature distribution of the LED and the temperature distribution of the driver IC when the material of the cabinet according to the embodiment is changed to a thermally conductive material.

31 is a graph comparing temperature distributions of the LED panel and the driver IC according to the heat transfer coefficient of the cabinet according to the embodiment.

As shown in Fig. 31, when the heat transfer coefficient of the material of the cabinet is changed to 20 W / mK, 10 W / mK and 5 W / mK, the temperature distribution of the light emitting panel and the driver IC increases in proportion to the heat transfer coefficient . The material of the cabinet according to the embodiment may be provided with a material having a heat transfer coefficient of 5 W / mK or more.

The features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention and are not necessarily limited to one embodiment. Further, the features, structures, effects, and the like illustrated in the embodiments can be combined and modified by other persons having ordinary skill in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

1: circuit board
2: Pixel area
2A, 2B, 2C: Light emitting element
3:
4: Protective layer
31, 32, 33, 34, 41,
60: side wall frame
60A, 60B: recess
61: multiple ribs
62: fastening rib
67: connection rib
100, 101, 102, 103:
111: Panel assembly
111, 112, 113, 114:
130: Cabinet
141, 142, 143, 144:
151: Magnet
171: heat radiating plate
173: Power board
165: control board
170: protective cover

Claims (20)

A panel assembly in which a plurality of light emitting panels are arranged with M rows and N columns (M > 1, N >1);
A cabinet coupled to the first surface of the panel assembly; And
And a plurality of heat dissipating frames coupled to respective corner areas of the cabinet and corresponding to corner areas of the panel assembly,
Each of the luminescent panels comprising a circuit board and a pixel area having a plurality of light emitting diodes on the circuit board,
Wherein the cabinet includes a plurality of engaging portions coupled to a portion of the plurality of heat radiating frames. The method according to claim 1,
A front portion of the cabinet is coupled to the rear of the panel assembly,
And the coupling portion of the cabinet is coupled to a rear portion of the heat radiating frame. 3. The method of claim 2,
Wherein each of the heat radiating frames includes a sidewall frame on the outer circumference, a plurality of engagement holes disposed along the sidewall frame, a first recess on the front portion of the sidewall frame, and a second recess on the rear portion,
Wherein a coupling portion of the cabinet is coupled to a second recess of the side wall frame and a portion of the plurality of engagement holes. The method of claim 3,
Wherein each of the heat dissipation frames includes a plurality of fastening ribs disposed in the second recess, multiple ribs connected between the fastening ribs and the side wall frame, and connecting ribs connecting the plurality of fastening ribs. 5. The method of claim 4,
And the gap between the multiple ribs gradually widens from the coupling rib toward the side wall frame. The method according to claim 4 or 5,
Wherein the coupling rib is connected to the coupling ribs in an oblique direction,
And the shape in which the coupling ribs are connected has a polygonal shape in the first recess. The method according to claim 4 or 5,
A plurality of fastening members are disposed on a rear surface of the circuit board,
Wherein the heat dissipation frame includes a plurality of fastening holes, and fastening means is coupled to the fastening member through at least one of the plurality of fastening holes. The method according to claim 4 or 5,
Wherein a fastening groove is disposed in the fastening rib,
Wherein the coupling portion has an area of an inner area disposed in the second recess with respect to the side wall frame is larger than an area of the outer area. The method according to claim 4 or 5,
Wherein the sum of the back surface areas of the plurality of heat dissipation frames is 10% or less of the sum of the back surface areas of the cabinet. The method according to claim 4 or 5,
And the outer side surfaces of the plurality of heat dissipation frames are disposed outside the side walls of the cabinet. 6. The method according to any one of claims 1 to 5,
A plurality of front ribs vertically and horizontally disposed on a front portion of the cabinet; And a plurality of rear ribs vertically and horizontally disposed on a rear portion of the cabinet,
Wherein the density of the rear ribs is higher than the density of the front ribs. 8. The method of claim 7,
And a plurality of guide ribs connected to the front ribs and having insertion grooves into which the coupling members are inserted. 6. The method according to any one of claims 1 to 5,
A plurality of receiving portions spaced apart from each other along a side wall of the cabinet; and a magnet coupled within the receiving portion. 6. The method according to any one of claims 1 to 5,
Wherein the cabinet includes a flat area on the rear face and a plurality of heat dissipation holes arranged in the flat area,
And a heat radiating plate is coupled to a flat area of the cabinet. A plurality of display modules arranged in the horizontal and vertical directions; And
And a fixing plate for fixing the plurality of display modules to a center area of the plurality of display modules,
Wherein each of the plurality of display modules includes:
A panel assembly in which a plurality of light emitting panels are arranged with M rows and N columns (M > 1, N >1);
A cabinet coupled to the first surface of the panel assembly; And
And a plurality of heat dissipating frames coupled to respective corner areas of the cabinet and corresponding to corner areas of the panel assembly,
Each of the luminescent panels comprising a circuit board and a pixel area having a plurality of light emitting diodes on the circuit board,
Wherein the cabinet includes a plurality of engaging portions coupled to a portion of the plurality of heat radiating frames,
A plurality of magnets disposed along a side wall of the cabinet,
Wherein the magnets of the cabinet corresponding to the vertical or horizontal direction among the plurality of display modules are in contact with each other. 16. The method of claim 15,
The cabinets of the display modules are non-contact,
Wherein the heat-radiating frames of the display modules are in contact with each other. 16. The method of claim 15,
The fixing plate is fastened to the heat radiating frame of each display module by fastening means,
And a corner of the plurality of display modules or a corner of the plurality of luminescent panels is exposed through the open hole. 18. The method according to any one of claims 15 to 17,
A front portion of the cabinet is coupled to the rear of the panel assembly,
The coupling portion of the cabinet is coupled to the rear portion of the heat-
A plurality of front ribs vertically and horizontally disposed on a front portion of the cabinet; And a plurality of rear ribs vertically and horizontally disposed on a rear portion of the cabinet,
Wherein the density of the rear ribs is higher than the density of the front ribs. 18. The method according to any one of claims 15 to 17,
Wherein each of the heat radiating frames includes a sidewall frame on the outer circumference, a plurality of engagement holes disposed along the sidewall frame, a first recess on the front portion of the sidewall frame, and a second recess on the rear portion,
The coupling portion of the cabinet is coupled to a second recess of the side wall frame and a portion of the plurality of engagement holes,
And each of the heat dissipation frames includes a plurality of fastening ribs disposed in the second recess, multiple ribs connected between the fastening ribs and the side wall frame, and connecting ribs connected between the plurality of fastening ribs. 20. The method of claim 19,
The gap between the multiple ribs gradually increases from the coupling rib to the side wall frame,
Wherein the coupling rib is connected to the coupling ribs in an oblique direction,
The shape in which the coupling ribs are connected has a polygonal shape in the first recess,
A plurality of fastening members are disposed on a rear surface of the circuit board,
Wherein the heat dissipating frame includes a plurality of fastening holes, and fastening means is coupled to the fastening member through at least one of the plurality of fastening holes.

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