KR20170087652A

KR20170087652A - Smart multi card and method for manufacuring smart multi card

Info

Publication number: KR20170087652A
Application number: KR1020160007483A
Authority: KR
Inventors: 배재훈; 정병철
Original assignee: 브릴리언츠 주식회사
Priority date: 2016-01-21
Filing date: 2016-01-21
Publication date: 2017-07-31
Also published as: KR101783719B1

Abstract

The present invention relates to a smart multi-card and smart multi-card manufacturing method.
A method of manufacturing a smart multi-card according to an exemplary embodiment of the present invention includes: a coupling step (S100) of forming a coupling by coupling at least one PCB plate to a guide frame; A first film joining step (S300) of filling the molding liquid onto the PCB plate up to the height of the guide frame and joining the first film to the joining body; And a guide frame cutting step (S800) for cutting the guide frame.
According to the present invention, as the various devices are combined, the molding liquid is filled on the curved PCB plate and the protective film is attached, so that the surface becomes flat, so that it can be manufactured in the same shape as a general card.

Description

TECHNICAL FIELD [0001] The present invention relates to a smart multi-card and a smart multi-

The present invention relates to a smart multi-card and a method of manufacturing a smart multi-card, and more particularly, to a smart multi-card which is flat without involving several parts or elements but which is similar to a general plastic card and a method of manufacturing the same.

Since the industrialization of modern society, credit card called "plastic money" has been used for money as much as money after going through rapid information and credit. As a result, the number of credit cards held by ordinary adults has also increased significantly, and the number of credit cards held by ordinary adults has increased frequently. In addition, according to the activation of marketing, issuance of various point cards became an essential marketing item in most companies based on B2C, and now it is a common means to increase sales in small shops located in the alley.

As a result, it is a reality that dozens of cards have been issued by individuals without knowing them. However, in most cases, unnecessary issuance costs are incurred, and it is also true that they are discarded and cause social costs. Furthermore, point cards and discount cards at stores that are not frequently visited frequently are not available at the time of actual visit. This phenomenon leads to the avoidance of card issuance due to troublesome and complicated card management from the viewpoint of the consumer and wastes and unreasonableness in all aspects of demand and supply which cause unnecessary marketing cost in the view of the enterprise. In the case of credit cards, which are deemed to be relatively more efficient than actual point cards, the number of credit cards held by the credit card lender continued to increase after the credit card liquidity crisis, The number of credit cards per person is 4.9, and the total number of card issuance is about 121.23 million.

Meanwhile, the number of cards issued has been steadily increasing, but only 1.4 cards are actually used. As a result, most of the credit cards held by individuals become dormant cards, and more than 20 million (about 40 billion won) are being abandoned. It would not be an exaggeration to say that if you include a variety of cards such as debit, check, cash, and prepaid cards or cards for marketing purposes such as point cards or discount cards, astronomical costs are wasted.

Therefore, it is necessary to develop a card that can integrate various cards such as a debit card, a check card, a credit card, and a membership card.

Unlike ordinary cards, smart cards contain many parts inside the card. The surface may not be flat and may be curved due to the difference in height (or thickness) of parts mounted in the card. It is difficult to attach a protective film to the surface of the curved card or to perform printing. Accordingly, it is an object of the present invention to provide a smart multi-card and smart multi-card manufacturing method capable of preventing the film from adhering to the surface by making the surface completely flat.

The present invention also provides a method of manufacturing a smart multi-card which can reduce the time required for manufacturing a flexible printed circuit board by performing a process of filling a molding liquid and a process of attaching a film to a surface in one operation.

In addition, by adding a color to the side exposed through a wight frame or a frame portion as a design element, a smart multi-card having a higher esthetics than a conventional card and a method of manufacturing the same are provided.

A method of manufacturing a smart multi-card according to an embodiment of the present invention includes combining at least one PCB plate with a guide frame to form a combined body, the PCB including one or more elements constituting a smart multi- The frame having a constant thickness and being thicker than the PCB plate; A first film bonding step of filling a molding liquid onto the PCB plate up to the height of the guide frame and bonding the first film to the bonding body; A guide frame cutting step of cutting the guide frame to include the PCB plate; And a guide frame cutting step of cutting the guide frame.

Etching the IC chip to a depth at which the IC chip of the PCB plate is exposed from the first film attached to the coupling body; And a metal mounting step of mounting a metal on the etched area, wherein the metal is allowed to transmit current from the outside to the IC chip.

In addition, the first film bonding step may include: a molding liquid application step of applying a molding liquid to a specific point of each PCB plate; And a molding liquid smoothing step of applying heat or ultraviolet rays while placing the first film on the assembly and then applying pressure using a compression plate, Lt; / RTI >

The pressurizing plate may be transparent. The molding liquid leveling step irradiates ultraviolet rays toward the upper surface of the PCB plate at the upper end of the pressing device.

The first film joining step may further include a bubble removing step of applying a vibration to a specific point on each PCB plate in a state of being pressed by the press plate.

In addition, the guide frame may include at least one bubble removing groove between the respective PCB plate insertion openings.

In addition, the combined body forming step is characterized by selecting the guide frame of a specific color that matches the design of the smart multi-card, wherein the smart multi-card can expose a specific color of the guide frame on the side .

The guide frame includes one or more guide grooves serving as a reference for a cutting position. The guide frame includes at least one guide pin included in the smart multi-card manufacturing apparatus and the guide grooves corresponding to the guide pins. As shown in FIG.

In addition, the first film is a film on which an image exposed to the outside is pre-printed, and the first film combining step is performed such that the transparent area of the first film corresponding to the display of the smart multi- And the like.

Further, the method may further include printing on the first film attached to the binding body.

In addition, the thickness of the guide frame may be equal to or greater than a maximum height of elements included in the PCB plate, and may be less than a maximum allowable thickness of the smart card.

The method may further include a second film bonding step of filling the PCB plate up to the height of the guide frame and bonding the second film to the rear surface of the bonding body.

According to another aspect of the present invention, there is provided a smart multi-card including: a PCB plate including at least one element; A rim surrounding the PCB and having a thickness greater than that of the PCB; A molding liquid filled in the upper or lower surface of the PCB plate to a height of the rim and cured; A first film attached on the mold liquid and the rim portion; And a metal terminal inserted into the etched region from the first film to a depth at which the IC chip included in the PCB plate is exposed, wherein the metal terminal is adapted to transfer current from the outside to the IC chip.

In addition, the thickness of the rim portion may be equal to or greater than a maximum height of elements included in the PCB plate, and may be less than a maximum allowable thickness of the smart multi-card.

The frame part is formed by cutting the guide frame along a line parallel to the rim of the PCB plate after the PCB plate is coupled to the guide frame, And at least one groove corresponding to the shape of the groove.

According to the present invention as described above, the following various effects are obtained.

First, as the various devices are combined, the molding liquid is filled on the curved PCB plate surface, and the protective film is attached, so that the surface becomes flat, so that it can be manufactured in the same shape as a general card.

Second, a card having a desired thickness can be manufactured by the guide frame. That is, since the card can be pressed only until it comes into contact with the guide frame, the thickness of the smart card to be manufactured can be determined according to the thickness of the guide frame.

Third, the desired color can be exposed on the side. That is, as the smart multi-card is cut while the part of the guide frame is included, the side color can be determined according to the color of the guide frame. This makes it possible to consider side colors and design aesthetics when designing a card.

Fourth, there is an effect that the time required for the production of the smart multi-card can be reduced by performing the adhesion of the first film simultaneously with the flattening of the molding liquid using the press plate. Particularly, when the molding liquid applied by heat is softened and spread, it is possible to perform the molding liquid flattening and the protective film (i.e., the first film or the second film) in a state in which the image to be displayed on the upper or lower surface of the card is already printed Thus, the time required for the production of the smart multi-card can be further reduced.

Fifth, bubbles generated between the molding fluid remaining up to the height of the guide frame or the protective film and the molding liquid are removed into the bubble removing grooves, so that bubbles remain on the surface or the height compensation volume (that is, The volume of the card is filled up to the height), and the card surface is prevented from being rugged by the remaining molding liquid.

Sixth, since the guide pin included in the smart multi-card manufacturing apparatus is combined with the guide grooves provided in the guide frame, cutting, etching, printing, and the like are performed, and the manufacturing process can be performed at an accurate position, .

1 is a side view of a PCB plate on which at least one element is mounted according to an embodiment of the present invention.
2 is a top view of a PCB plate according to an embodiment of the present invention.
FIG. 3 is an exemplary view illustrating a PCB plate and a frame portion according to an embodiment of the present invention.
4 is an exemplary view of a guide frame according to an embodiment of the present invention.
FIG. 5 is an exemplary view of a combined body formed by coupling one or more PCB plates to a guide frame according to an embodiment of the present invention. FIG.
6 (a) is a side view of a smart multi-card manufactured using a separately manufactured frame according to an embodiment of the present invention.
6 (b) is a side view of a smart multi-card manufactured using a guide frame according to an embodiment of the present invention.
7 is a flowchart of a method of manufacturing a smart multi-card according to an embodiment of the present invention.
8 is a flowchart of a method of manufacturing a smart multi-card for performing flattening of a molding liquid and adhering a first film using a press plate after applying a molding liquid according to an embodiment of the present invention.
9 is a flowchart of a method for manufacturing a smart multi-card, which further includes a step of removing bubbles through vibration application according to an embodiment of the present invention.
FIG. 10 is a flowchart of a method for manufacturing a smart multi-card, which further includes a step of etching an upper portion of an IC chip or a charging terminal according to an embodiment of the present invention to thereby join the metal terminal.
11 is a flowchart of a method of manufacturing a smart card in which cards are manufactured by assembling a guide groove of a guide frame to a guide pin of a manufacturing apparatus according to an embodiment of the present invention.
12 is a flowchart of a method of manufacturing a smart multi-card including a second film adhering step according to an embodiment of the present invention.
FIG. 13 is an exemplary view showing that a molding liquid is applied to the top surface of a PCB according to an embodiment of the present invention. FIG.
FIG. 14 is an exemplary view illustrating the pressing operation in the state where the first film is placed on the coupling body coated with the molding liquid according to an embodiment of the present invention.
FIG. 15 is an exemplary view for performing the molding liquid flattening and the first film adhering through the compression of the compression plate according to an embodiment of the present invention. FIG.
16 is an exemplary view showing that the molding liquid is flattened on the top surface of the PCB according to an embodiment of the present invention, and an extra molding liquid or bubble is included in the bubble removing groove.
17 is an exemplary view showing a process of etching an upper end of an IC chip or a charging terminal and coupling a metal terminal according to an embodiment of the present invention.
FIG. 18 is an exemplary view showing a first film to which an image is printed and a portion corresponding to the display portion is treated in a transparent manner according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. The terms " comprises "and / or" comprising "used in the specification do not exclude the presence or addition of one or more other elements in addition to the stated element.

Hereinafter, a method of manufacturing a smart multi-card and a smart multi-card according to embodiments of the present invention will be described with reference to the drawings.

A smart multi-card according to another embodiment of the present invention includes a PCB plate 100; A frame part 200; A molding liquid 400; And a first film (500).

As shown in FIGS. 1 and 2, the PCB 100 (printed circuit board) is a component in which various electrical components of a smart multi-card are installed. The flexible printed circuit board 100 can be flexibly bent So that there is no risk of damage even if a flexural stress is applied to the smart card during the carrying process. Since the structure and manufacturing method of the PCB 100 are well-known technologies, a detailed description thereof will be omitted.

The PCB plate 100 may include (or mount) one or more elements. The PCB 100 includes an IC chip 110, a magnetic stripe 120, a micro controller unit (MCU) 130, a storage unit 140, a display unit 140, (Display), a user input unit, and the like.

Specifically, the IC chip 110 may be provided on the upper surface of the PCB 100. The IC chip 110 can exchange data with the contact card reader. That is, the IC chip 110 is exposed to the outside of the PCB 100 when the connector is physically contacted with the card reader, and when the smart card is inserted into the contact type card reader, It is possible to perform direct data exchange by contacting the card contact portion of the reader.

The IC chip 110 may be mounted in the PCB 100 in various forms. In one embodiment, the IC chip 110 may be mounted on the PCB 100 so that the IC chip 110 is not exposed to the bottom surface but is exposed only to the top surface. At this time, the IC chip 110 can partially protrude outward due to the difference in thickness between the IC chip 110 and the PCB plate 100, and the recognition surface (the connector portion or the contact portion) And may be exposed to the upper surface of the plate 100. The IC chip 110 may not be exposed to the outside by the molding liquid 400 and the first film 500 which will be described later when the recognition surface of the IC chip 110 is arranged in the direction of the top surface of the PCB, ) And the metal terminal 150 through which the electric current can flow can be connected to the terminal of the card reader of the IC system to perform data exchange.

In addition, in another embodiment, the IC chip 110 may be exposed to the outside through the bottom surface of the PCB 100 in a state where the IC chip 110 is positioned on the top surface of the PCB 100. For example, the IC chip 110 may be mounted so that the connector does not protrude from the bottom surface, and the thickness of the IC chip 110 is thicker than the thickness of the PCB 100, so that the IC chip 110 may protrude upward.

The magnetic field generator 120 outputs the card data in the form of a magnetic signal and transmits the card data to the card reader. The magnetic field generator 120 may include one or more magnetic cells for generating a magnetic field through current flow and outputting a card information magnetic signal. The magnetic field generating unit 120 may be provided to be exposed to the upper or lower surface of the PCB 100 along the long side adjacent to a specific long side of the PCB 100.

The magnetic field generating unit 120 may be mounted on the PCB 100 in various forms. For example, the magnetic field generating portion 120 may be arranged to be exposed to the undersurface without protruding from the underside. As a result, the magnetic field generating part 120 does not protrude in the downward direction, so that the bottom surface becomes flat, so that the height compensation by the molding liquid 400 may not be performed. Only the upper surface of the PCB plate 100 400) can be performed. However, the method of mounting the magnetic field generator 120 on the PCB 100 is not limited to this, and various methods can be applied.

The display unit 140 may be a liquid crystal display, a thin film transistor-liquid crystal display, an organic light-emitting diode, a flexible display, an electronic paper E -paper). < / RTI > In addition, there may be two or more display units 140 according to the implementation of the multi-card. For example, the display unit 140 may be provided on the front and rear portions of the multi-card.

The display unit 140 may be disposed on one side of the front surface of the PCB 100. In particular, the display unit 140 may be disposed in an area that does not overlap with the IC chip 110 disposed on one side of the front surface of the PCB 100 and the magnetic field generating unit 120 disposed on one side of the rear surface of the PCB 100 have. Accordingly, it is possible to prevent the display unit 140 from being damaged when the magnetic field generating unit 120 performs sweeping in the magnetic card reader or inserts the multi-card into the IC card reader. The display unit 140 may be disposed at a position on the PCB 100 adjacent to a user input unit (e.g., a touch unit or a touch pad) so that the user can easily perform a touch operation while viewing the display unit 140 .

The user input unit receives input data for controlling the operation of the smart multi-card from the user. The user input unit may include a key pad, a dome switch, a touch pad (static / static), a jog wheel, a jog switch, and the like. The user input unit may be provided on the upper surface of the PCB 100 on which the display unit 140 is exposed.

The elements such as the IC chip 110 may be provided so as to protrude from a top surface or a bottom surface of the PCB by a specific thickness, and may be provided with various resistors or capacitors protruding from the surface. There may be a difference in the height protruding from the top or bottom surface of the PCB 100 due to the thickness of each device and the depth difference in the PCB 100. Accordingly, the PCB plate 100 may have a height different from that of the device, and a curved region may occur between the devices (i.e., the upper surface of the PCB 100 and the IC chip 110) ) May be formed, and the surface may be formed to be bent.

The rim portion 200 surrounds the PCB 100 and is formed to have a specific thickness thicker than the PCB 100. That is, the rim portion 200 may be equal to the thickness from the lower surface of the PCB 100 to the maximum height of the device, or may be thicker than the maximum height of the devices from the lower surface of the PCB 100. In particular, the thickness of the rim 200 may be greater than or equal to a maximum height of elements included in the PCB 100, and may be less than a maximum allowable thickness of the smart card.

The rim 200 may provide a reference height for filling the upper or lower surface of the curved PCB 100 with the molding liquid 400 in a planar manner. For example, when the lower surface of the PCB 100 is flat, the lower end of the frame 200 is aligned with the lower surface of the PCB 100 and the molding liquid 400 is placed on the edge of the PCB 100 200 may be filled up to the top of the molding liquid 400.

The rim 200 may be formed around the PCB 100 in a variety of ways, as shown in FIG. 4 (i.e., it may be formed in contact with the rim of the PCB 100). The frame 200 is formed in a predetermined thickness and width in advance before the smart multi card is manufactured and the PCB 200 is inserted in a space (i.e., a groove) into which the PCB 100 of the frame 200 can be inserted, After inserting the plate 100, the molding liquid 400 may be filled up to the top of the rim 200.

6, after the PCB 100 is coupled to the guide frame 300, the guide frame 300 is cut along a line parallel to the edge of the PCB 100, The unit 200 can be generated. The guide frame 300 may have one or more grooves corresponding to the shape of the PCB 100 to which the at least one PCB 100 is coupled, as shown in FIG. The PCB plate 100 is inserted into the guide frame 300 having a constant thickness and the molding liquid 400 is filled up to the upper surface of the guide frame 300 and then the guide frame 300 is cut (for example, NC cutting) The edge portion 200 can be generated.

The frame part 200 may be implemented in various colors. It can be formed in a color suitable for the design of a smart multi-card. For example, if the top and bottom surfaces of the smart multi-card are designed with a particular color (e.g., black), then the edge 200 of the same color (e.g., black) Can be applied. The rim portion 200 may be formed of various materials.

The molding liquid 400 is filled up to the height of the guide frame 300 on the top or bottom surface of the PCB 100 and cured. The molding liquid 400 may correspond to a polymer and may be softened in response to UV or heat so as to fill a region between the edge portion 200 and the upper surface of the PCB 100 and then be cured.

One or more films are attached onto the molding liquid 400 and the rim portion 200. The film is a part of the outer shape of the smart card and includes a first film 500 positioned on the upper surface of the PCB 100 (i.e., a combination of the molding liquid 400, the frame 200 and the PCB 100) And a second film positioned on the lower surface of the PCB substrate. The first film 500 and the second film may be formed to be transparent or semitransparent to allow transmission of UV light in the form of a thin film or may be made transparent or semitransparent as well as opaque when they are bonded by heat .

In addition, the smart multi-card according to an embodiment of the present invention may further include a metal terminal 150. When the connector portion of the IC chip 110 is mounted in the top surface direction without being exposed in the bottom direction of the PCB 100 and covered with the molding liquid 400, current can not be supplied to the IC chip 110. Therefore, the depth of the IC chip 110 exposed from the first film 500 coupled to the top surface of the card reader and the IC chip 110, The metal terminal 150 can be inserted into the corresponding region.

Hereinafter, a method of manufacturing a smart multi-card according to an embodiment of the present invention will be described in detail. The method of manufacturing the smart multi-card is not limited to the following description, and various methods can be applied.

7 is a flowchart of a method of manufacturing a smart multi-card according to an embodiment of the present invention.

Referring to FIG. 7, a method of fabricating a smart multi-card according to an exemplary embodiment of the present invention includes forming a coupling body S100 by coupling one or more PCB plates 100 to a guide frame 300 to form a coupling body; A step S300 of filling a first film 500 with the molding liquid 400 on the PCB 100 up to the height of the guide frame 300 and bonding the first film 500 to the assembly; And cutting the guide frame 300 to cut the guide frame 300 (S800). A method of manufacturing a smart multi-card according to an embodiment of the present invention will be described in order.

One or more PCB plates 100 are coupled to the guide frame 300 to form an assembly (S100). The PCB plate 100 corresponds to one that includes one or more elements constituting a smart multi-card (i.e., a component in which various electric parts of the smart multi-card are installed). The PCB plate 100 may have a side surface as shown in FIG. 1 as the components are mounted and exposed on the top surface.

The guide frame 300 has a predetermined thickness and is thicker than the PCB plate 100 and serves to provide a reference height for filling the molding liquid 400 to flatten the card surface.

Also, when the molding liquid 400 is flattened by using the press plate 600 and the film is attached, the guide frame 300 can play a role of setting the maximum press-fit range. That is, the guide frame 300 restricts the compression plate 600 from further performing the compression, and plays the role of making the smart multi-card with a thickness desired to be produced. The thickness of the guide frame 300 is not less than the maximum height of the elements included in the PCB 100 and is less than the maximum allowable thickness of the smart card, Can be performed.

As shown in FIG. 5, the guide frame 300 may include at least one bubble removing groove 330 between the inserting openings of the respective PCB plates 100. The bubble removing groove 330 may be formed in the bubble removing groove 330 to fill up the bubble 410 or the guide frame 300 between the first film 500 and the molding liquid 400 when the first film 500 is coupled, It is possible to provide a space in which the molding liquid 400 can be embedded (or inserted). For example, as will be described later, when the compression bonding is performed with the compression plate 600 for bonding the first film 500 and planarizing the molding liquid 400, The bubble 410 generated in the bubble removing groove 330 can be pushed out to the bubble removing groove 330 at the time of pressing.

6, the PCB plate 100 is joined to the grooves of the guide frame 300 (see FIG. 5) corresponding to the size of the PCB 100, And a different number of PCBs 100 may be coupled according to the number of grooves formed in the guide frame 300. For example, when four grooves are formed in the guide frame 300 in the form of a PCB 100, the four PCB plates 100 and the guide frame 300 may be combined to form a single assembly.

Then, the molding liquid 400 is filled on the PCB 100 to a height of the guide frame 300, and the first film 500 is joined to the assembly (S300). Through this, the surface can form a non-rugged (i.e., non-bendable) bond surface, which allows the card requester to print the desired surface design precisely.

Various methods can be applied in a method of filling the molding liquid 400 on one surface of the assembly and then bonding the first film 500. In one embodiment, the molding solution 400 may be applied, and the first film 500 may be squeezed on the upper surface of the assembly.

For example, as shown in FIG. 8, the joining step S300 of the first film 500 may include a step of applying a molding liquid 400 for applying the molding liquid 400 to specific points of the PCB 100, (S310); (S320) of placing the first film (500) on the bonding body and applying heat or ultraviolet rays under pressure using the press plate (600). The press plate 600 may be included in the smart multi-card manufacturing apparatus.

First, the molding liquid 400 may be applied to a specific point of each PCB 100 (S310). 13, a predetermined point (for example, a center point of each PCB plate 100) of one or more PCB plates 100 included in the combined body to spread the molding liquid 400 by applying heat or UV light, ). The amount of the molding liquid 400 to be applied may be more than a volume (hereinafter referred to as a height compensation volume) that can fill the space above the PCB plate 100 up to the height of the guide frame 300. When the molding liquid 400 having a height compensation volume or more is applied, the molding liquid 400 remaining after filling the space on the PCB 100 to the height of the guide frame 300 is removed from the bubble removing groove 400 of the guide frame 300, (Not shown).

14, after the first film 500 is positioned on the coupling body, heat or ultraviolet rays may be applied in a state of applying pressure using the compression plate 600 (S320). The molding liquid 400 softens as the heat or ultraviolet ray is applied and the molding liquid 400 can be spread in the space above the PCB 100 as the pressure is applied to the compression plate 600. In addition, since the first film 500 is placed on the molding liquid 400 and heat or UV light is applied to the first film 500, the molding liquid 400 may be planarized and the first film 500 may be bonded simultaneously . 15, the molding liquid 400 may be planarized to fill the height compensation volume and the first film 500 may be attached flat.

In the case of softening the molding liquid 400 which applies ultraviolet light (UV light), the press plate 600 and the first film 500 may be transparent. UV light is transmitted through the pressing plate 600 and the first film 500 in order to irradiate the UV light from the outside with the molding liquid 400. Therefore, the pressing plate 600 and the first film 500 are irradiated with UV light Transparent or translucent, and UV light can be irradiated onto the pressing plate 600 in the direction of the top surface of the bonded body.

In addition, in the step S300 of joining the first film 500, a film on which an image exposed to the outside by the first film 500 is printed may be used. When the molding liquid 400 is softened and spread through heat transfer, the protective film (i.e., the first film 500) does not need to be transparent, so that the first film 500 is printed with an image The molding liquid 400 may be adhered onto the applied assembly. 18, the area of the first film 500 corresponding to the display unit 140 is formed to be transparent, and the area of the first film 500 It is possible to determine the coupling position of the first film 500 and perform the coupling so that the transparent region and the display unit 140 are exactly matched. The guide pins provided in the smart multi-card manufacturing apparatus and the guide grooves 320 provided in the guide frame 300 are provided to accurately match the transparent area of the first film 500 with the display unit 140, The first film 500 may be attached (or bonded) to the correct position by performing a manufacturing process.

9, the joining step S300 of the first film 500 may be performed by pressing a bubble (not shown) that vibrates at a specific point on each PCB plate 100 in a state of being pressed by the press plate 600 410) removing step (S330). In the step S330 of removing the bubbles 410, vibration is applied to the bonded body by the vibration module provided in the manufacturing apparatus during the pressing operation by the press plate 600 to remove the bubbles 410 and remove the excess molding liquid 400 can be moved to the bubble removing groove 330 by the vibration applied in a state in which they are disposed between the upper and lower press plates 600. 16, the bubbles 410 and the excess molding liquid 400 are contained in the bubble removing groove 330 and the upper end of the PCB 100 can be flat without the bubbles 410 .

One or more vibration modules may be disposed in a region where the PCB plate 100 of the combination is disposed. Particularly, the vibration module may be disposed at the lower end of the display unit 140 so that the bubble 410 does not exist on the display unit 140 that is kept transparent.

Thereafter, the guide frame 300 is cut (S800). When the PCB 100 is in the form of a card, the guide frame 300 can be cut along a line parallel to the rim of the PCB 100. In addition, when the PCB 100 is not a card shape, it is possible to perform cutting in a square shape (for example, a rectangular curved shape having a specific curvature) so that the smart multi-card is a card shape.

In addition, when the smart card is manufactured in a shape other than a rectangular shape, the guide frame 300 can be cut into a desired shape. Thus, a smart multi-card having a desired shape can be manufactured irrespective of the shape of the PCB plate 100.

In addition, by cutting the guide frame 300, the side color of the smart multi card according to the color of the guide frame 300 selected in the combined body formation step S100 can be realized. That is, the guide frame 300 can be selected with a specific color matching the design of the smart multi-card. By performing cutting with the part including the guide frame 300, the color of the guide frame 300 Can be exposed.

Conventionally, the side of the card can not be designed by selecting a color, so that a color that does not match the design of the top or bottom surface may appear on the side. According to one embodiment of the present invention, a part of the guide frame 300 is cut so as to be included in the smart multi-card, the color appearing on the side of the smart multi-card can be determined through color determination of the guide frame 300, To create even better smart multi-cards.

As shown in FIG. 10, the outer shape etching step (S500) of etching the first film (500) attached to the coupling body to a depth at which the IC chip (110) of the PCB plate (100) is exposed; And a metal mounting step (S600) of mounting a metal on the etched area, wherein the metal allows the current to be transferred from the outside to the IC chip (110). The IC chip 110 can make settlement or accumulation in direct contact with the terminal of the card terminal of the IC system and through the current flow. However, when the connector portion (i.e., the contact terminal) of the IC chip 110 is disposed in the upper direction of the PCB 100, if the connector portion is covered with the molding liquid 400 and the first film 500, It is not possible to make direct contact with the terminals of the reader. 17, the IC chip 110 is exposed to the outside by etching the region on the contact terminal of the IC chip 110, and the metal terminal 150 is mounted on the upper end of the IC chip 110 as the first May be raised or exposed above the height of the film (500).

When the IC chip 110 is etched so as to be exposed to the outside, etching may be performed including a part of the IC chip 110 so that the current flows through the metal terminal 150 well.

The method of etching an IC chip can be equally applied to a charging terminal which must receive current through contact with the outside. Further, the etching for the IC chip or the charging terminal and the like can be performed in various ways. For example, it may be etched by CNC cutting or NC cutting, and may be etched by chemical treatment.

11, the guide frame 300 includes at least one guide groove 320 as a reference for a cutting position, and includes at least one guide pin included in the manufacturing apparatus of the smart multi- (S200) coupling the guide groove 320 corresponding to the pin. 4, the guide frame 300 may be formed by etching the area joining the metal terminal 150, cutting the guide frame 300, or printing (or printing) the first film 500 The guide groove 320 may include at least one guide groove 320 which serves as a reference for accurate position determination. If the positions of the assembled bodies are not precisely distinguished, defective products can be produced during the manufacturing process. For example, when a wrong point is cut at the time of cutting the guide frame 300, the PCB 100 may be cut to produce a defective product, and the IC chip 110 or the top of the charging terminal may not be accurately etched If the other device area is etched, the smart multi card may not operate properly. Also, for example, when an image is printed on the first film 500, if the position is not accurately determined by the reference point, the image is output on the display unit 140, which should be kept transparent, 140 may be generated.

Therefore, the guide groove 320 of the guide frame 300 is coupled to the guide pin included in the manufacturing apparatus, and cutting, etching, printing, and the like are performed at a precise point set with reference to the guide frame 300 Occurrence of defective products can be prevented. That is, when the guide groove 300 includes the step of engaging the guide pin 320 and the guide groove 320, the guide groove 320 of the guide frame 300 is coupled to the guide groove 320 of the smart multi- The apparatus can perform cutting, etching, or printing at a position determined based on the positions of the guide pins and the guide grooves 320. For example, the smart multi-card manufacturing apparatus can store coordinate information set on the basis of one or more guide pins at the time of performing each process, thereby performing the process at a precise position on the assembly.

The method may further include printing (S700) printing on the first film (500) attached to the binding body.

Further, as shown in FIG. 12, a second film bonding step (S400) of bonding the second film to the rear surface of the coupling body may be further included. The molding liquid 400 may be filled up to the height of the guide frame 300 and the second film may be joined to the PCB 100 as in the joining step S300 of the first film 500. [ Further, when the back surface of the joined body is flat, the second film can be attached to the back surface of the joined body by using an adhesive without filling the separate molding liquid 400.

Further, after the second film is first placed on the production apparatus (that is, laid), the adhesive or the molding liquid 400 may be applied on the production apparatus, and then the assembly may be bonded to the production apparatus. As a result, the first film 500 bonding and the second film bonding can be performed at the same time, so that the card can be manufactured quickly.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, You will understand. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

100: PCB plate 110: IC chip
120: magnetic field generator 130:
140: display part 150: metal terminal
200: rim 300: guide frame
310: PCB plate insertion groove 320: guide groove
330: bubble removing groove 400: molding liquid
410: Bubble 500: First film
600:

Claims

Wherein the at least one PCB plate is coupled to the guide frame to form an assembly, the PCB plate comprising at least one element forming a smart multi-card, the guide frame having a constant thickness and being thicker than the PCB plate, Forming step;
A first film bonding step of filling a molding liquid onto the PCB plate up to the height of the guide frame and bonding the first film to the bonding body;
And a guide frame cutting step of cutting the guide frame to include the PCB plate.

The method according to claim 1,
An outer shape etching step of etching from the first film attached to the coupling body to a depth at which the IC chip of the PCB plate is exposed; And
Wherein the metal is mounted on the etched area, wherein the metal is adapted to transfer current from the exterior to the IC chip.

The method according to claim 1,
Wherein the first film combining step comprises:
A molding liquid applying step of applying a molding liquid to a specific point of each PCB plate;
And a molding liquid leveling step of applying heat or ultraviolet rays while placing the first film on the bonding body and applying pressure using a compression plate,
Wherein the press plate is included in a manufacturing apparatus of the smart multi-card.

The method of claim 3,
Characterized in that the press plate is transparent,
Wherein the molding liquid leveling step comprises:
And irradiating ultraviolet rays toward the top surface of the PCB plate at an upper end of the manufacturing apparatus.

The method of claim 3,
Wherein the first film combining step comprises:
And applying a vibration to a specific point on each PCB plate in a state of being pressed by the press plate.

6. The method of claim 5,
The guide frame
Wherein at least one bubble removing groove is provided between the respective PCB plate inserting openings.

The method according to claim 1,
The coupling-
Characterized in that the guide frame of a specific color matching the design of the smart multi card is selected,
The smart multi-
Wherein a specific color of the guide frame is exposed on the side surface.

The method according to claim 1,
Wherein the guide frame includes at least one guide groove as a reference of a cutting position,
And combining the at least one guide pin included in the manufacturing device of the smart multi-card with the guide groove corresponding to each guide pin.

9. The method of claim 8,
Wherein the first film comprises:
The image exposed to the outside is a pre-printed film,
Wherein the first film combining step comprises:
Wherein the display of the smart multi-card is matched with the transparent area of the first film corresponding to the display.

9. The method of claim 8,
And performing printing on the first film attached to the binding body.

The method according to claim 1,
The thickness of the guide frame may be,
The maximum height of the elements included in the PCB plate,
Wherein the maximum allowable thickness of the smart multi-card is less than or equal to the maximum allowable thickness of the smart multi-card.

The method according to claim 1,
And a second film bonding step of filling the PCB plate up to the height of the guide frame with a molding liquid and bonding the second film to the rear surface of the combination body.

A PCB plate containing one or more devices;
A rim surrounding the PCB and having a thickness greater than that of the PCB;
A molding liquid filled in the upper or lower surface of the PCB plate to a height of the rim and cured;
A first film attached on the mold liquid and the rim portion; And
And a metal terminal inserted into the etched region from the first film to a depth at which the IC chip included in the PCB plate is exposed,
And the metal terminal is adapted to allow current to be transmitted from the outside to the IC chip.

14. The method of claim 13,
The thickness of the rim portion
The maximum height of the elements included in the PCB plate,
Wherein the smart card is less than or equal to the maximum allowable thickness of the smart card.

14. The method of claim 13,
The rim portion
The guide frame is formed by cutting the guide frame along a line parallel to the rim of the PCB plate after coupling the PCB plate to the guide frame,
Wherein the guide frame has at least one groove corresponding to the shape of the PCB plate to which the at least one PCB plate is coupled.