KR20170081000A - Pad electrode and display panel and display device therewith - Google Patents

Abstract

Disclosed is a pad pattern structure, a display panel and a display device having the same. The disclosed invention provides a display device comprising: a first pattern provided on an upper portion of a substrate to be positioned in a pad region provided for electrical connection between a display panel and a driver; And a second pattern provided on the first pattern so as to be positioned between the driving unit and the first pattern, wherein in a part or whole section divided in the longitudinal direction of the first pattern, And the first pattern is located in the widthwise inner side region of the second pattern.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a pad pattern structure,

The present invention relates to a pad pattern structure, a display panel and a display device having the pad pattern structure, and more particularly, to a pad pattern structure provided for connecting a display panel with a driver for providing a signal for driving the display panel, A display panel, and a flat panel display.

In the field of information technology, the field of display that displays electrical information signals visually has been rapidly developed. As a result, a variety of flat display devices having excellent performance such as thinning, light weight, and low power consumption have been developed. Devices have been developed and are rapidly replacing existing cathode ray tubes (CRTs).

Specific examples of such a flat panel display include a flat panel display such as a liquid crystal display (LCD), a plasma display panel (PDP), and an organic light emitting diode (OLED) .

Among the above flat panel display devices, an organic light emitting element (hereinafter referred to as "OLED") is a self light emitting element and can be lightweight and thin because it does not require a backlight used in a liquid crystal display device as a non-light emitting element.

OLEDs are superior to liquid crystal display devices in viewing angle and contrast ratio, are advantageous in terms of power consumption, can be driven by DC low voltage, have a fast response speed, are resistant to external impacts due to their solid internal components, And has a merit in that the production cost can be saved more than the conventional liquid crystal display device because the manufacturing process is simple.

1 is a view schematically showing a structure of a general OLED.

1, an OLED 10 includes an array substrate 1 on which driving and switching thin film transistors DTr and STr and an organic light emitting diode E are formed, and an in-cap substrate 2 for encapsulation do.

Here, the array substrate 1 is divided into a display area AA for displaying an image and a non-display area NA for covering an edge of the display area AA. In the display area AA, And a data line DL extending in a second direction intersecting the first direction and defining a pixel region P in addition to the gate line GL is formed in the data line DL, A power supply line PL for applying a power supply voltage is formed.

In each pixel region P, a switching thin film transistor STr connected to the two lines is formed at a portion where the gate line GL and the data line DL intersect each other. The switching thin film transistor STr includes a thin film transistor A transistor DTr and a storage capacitor StgC and the driving thin film transistor DTr is connected between the power supply line PL and the organic electroluminescent diode E. [

A data driver 30 is formed on the non-display area NA outside the display area AA and a gate driver 20 is formed on one edge of the data driver 30 perpendicular to the edge. The pixel region P is divided and scanned.

A power supply line 40 for supplying power to each electrode of the organic electroluminescent diode E is formed on the other edge of the non-display area NA perpendicular to the edge where the data driver 30 is formed. And the data driving units 20 and 30 and the power supply line 40 process signals provided from the outside through the pad unit PA of the non-display area NA.

The pad portion PA is formed with a pad electrode PAD to be electrically connected to a flexible printed circuit board (FPC) 60 in the form of a film. The gate and data drivers 20 and 30 are formed of various control signals, And a driving IC connected to the OLED and the printed circuit board and adapted to apply a signal to the wiring of the OLED.

An extended line extending from the gate line GL or the data line DL to the non-display area NA is connected to the pad portion PA and the pad portion PA connected to the line is connected to the non- NA from the outside through a flexible printed circuit board 60, which is referred to at one end.

A pad electrode PAD electrically connected to the pad portion PA through a via hole formed by partially removing the insulating film is provided on the pad portion PA.

At this time, the pad electrode PAD is electrically connected to the flexible printed circuit board 60 through an anisotropic conductive film (ACF).

That is, the pad portion PA is electrically connected to the flexible printed circuit board 60 through the pad electrode PAD.

According to the above configuration, it can not be accurately grasped whether the flexible printed circuit board 60 and the pad electrode PAD on the pad portion 60 are properly aligned to be accurately connected.

If the flexible printed circuit board 60 and the pad electrode PAD on the pad portion 60 are not correctly connected due to misalignment between the flexible printed circuit board 60 and the pad electrode PAD, PAD) may be exposed to the outside and corroded, which causes a short defect due to the opening of the pad portion (PAD).

An object of the present invention is to provide a pad pattern structure improved in structure so that alignment between an electrode of a connection circuit board such as a flexible printed circuit board and a pad electrode can be effectively performed, and a display panel and a display device having the same.

According to an aspect of the present invention, there is provided a pad pattern structure comprising: a first pattern provided on an upper portion of a substrate so as to be positioned in a pad region provided for electrical connection between a display panel and a driver; And a second pattern provided on the first pattern so as to be positioned between the driving unit and the first pattern, wherein in a part or whole section divided in the longitudinal direction of the first pattern, And the first pattern is located in the widthwise inner side region of the second pattern.

It is preferable that the first pattern has a width narrower than that of the second pattern so that a width direction end of the second pattern is exposed outward in the width direction of the first pattern.

An alignment state confirmation interval is provided on one side of the pad pattern structure in the longitudinal direction; In the alignment state checking section, it is preferable that the first pattern is disposed in a widthwise inner region of the second pattern.

Preferably, the second pattern is located in a widthwise inner side region of the first pattern in a remaining portion of the pad pattern structure except for the alignment state checking period.

Further, the present invention may further comprise a transparent pad electrode provided on the second pattern so as to be positioned between the driver and the second pattern; The second pattern may be located in a widthwise inner region of the driving unit that contacts the pad electrode.

Further, the present invention may further comprise a transparent pad electrode provided on the second pattern so as to be positioned between the driver and the second pattern; The pad electrode is preferably covered on the upper portion of the second pattern so that a contact surface contacting the driving portion has a width equal to or greater than the width of the second pattern.

According to another aspect of the present invention, there is provided a display panel comprising: a substrate; And a pad pattern structure provided on the substrate so as to be positioned in a pad region provided for electrical connection between the display panel and the driving unit, wherein the pad pattern structure includes a first pattern provided on the substrate, And a second pattern provided on the first pattern so as to be positioned between the driving unit and the first pattern, wherein in a part or whole section divided in the longitudinal direction of the first pattern, And the second pattern is located in a widthwise inner area of the second pattern.

The present invention further includes a pad electrode provided on the second pattern so as to be positioned between the driving unit and the second pattern; The substrate and the pad electrode are preferably made of a transparent material.

According to another aspect of the present invention, there is provided a display device comprising: a driver for generating a signal for defining a pixel; And a display panel connected to the driving unit, wherein the display panel comprises: a substrate; And a pad pattern structure provided on the substrate so as to be positioned in a pad region provided for electrical connection between the display panel and the driving unit, wherein the pad pattern structure includes a first pattern provided on the substrate, And a second pattern provided on the first pattern so as to be positioned between the driving unit and the first pattern, wherein in a part or whole section divided in the longitudinal direction of the first pattern, And the first pattern is located in the widthwise inner side region of the second pattern.

The driving unit may include a connection circuit board and a connection electrode provided on the connection circuit board and in contact with the pad pattern structure, The first pattern may be formed to have a width that can be positioned in a widthwise inner side region of the connection electrode.

According to the pad pattern structure of the present invention and the display panel and display device having the same, the first pattern and the second pattern on the dielectric film can be easily aligned through the connection section, And it is possible to provide both of the two effects by which alignment accuracy between the connection electrode of the connection circuit board and the electrode of the pad pattern structure can be improved through the alignment state confirmation period.

1 is a view schematically showing a structure of a general OLED.
FIG. 2 is a schematic view illustrating a pad region of a display device according to an exemplary embodiment of the present invention. Referring to FIG.
Fig. 3 is an enlarged view of the portion "III" in Fig. 2.
4 is a cross-sectional view taken along the line "IV-IV" in Fig.
FIG. 5 is a cross-sectional view illustrating a state where a driving unit is positioned on the pad pattern structure shown in FIG.
6 is a cross-sectional view illustrating an electrode stacking structure in a connection section of a pad pattern structure according to an embodiment of the present invention.
FIG. 7 is a schematic view showing an example in which an alignment state between a pad pattern structure and a driving unit according to an exemplary embodiment of the present invention is confirmed.
FIG. 8 is a schematic view showing another example in which the alignment state between the pad pattern structure and the driving part is checked according to an embodiment of the present invention.

Hereinafter, a pad pattern structure according to the present invention, a display panel having the same, and a display device will be described with reference to the accompanying drawings. For convenience of explanation, the thicknesses of the lines and the sizes of the components shown in the drawings may be exaggerated for clarity and convenience of explanation. In addition, the terms described below are defined in consideration of the functions of the present invention, which may vary depending on the intention or custom of the user, the operator. Therefore, definitions of these terms should be made based on the contents throughout this specification.

FIG. 2 is a schematic view showing a pad region of a display device according to an embodiment of the present invention. FIG. 3 is an enlarged view of a portion "III" of FIG. 2, IV ". FIG. 5 is a cross-sectional view illustrating a state in which a driving unit is positioned on the pad pattern structure shown in FIG. 4, and FIG. 6 is a cross-sectional view illustrating an electrode stacking structure in a connection region of the pad pattern structure according to an embodiment of the present invention. to be.

2 to 4, a display device 300 according to an embodiment of the present invention includes a driving unit 100 and a display panel 200.

The driving unit 100 generates a signal to be transferred to a wiring for defining a pixel. The driving unit 100 includes a circuit board having a circuit pattern and a driving IC (not shown) mounted on the circuit board.

The circuit board includes a main circuit board on which the driving integrated circuit is mounted, and a connection circuit board connecting the main circuit board and the display panel.

The main circuit board may be a printed circuit board (PCB) having a wiring pattern formed in a single layer or a multilayer structure, which is difficult to warp or fold, or a flexible printed circuit board (Flexible Printed Circuit Board, FPCB) may be applied.

It is preferable that the connection circuit board has a wiring pattern formed as a single layer or a multilayer, and it can be bent or folded by itself. An FPC (Flexible Printed Circuit) may be used as the connection circuit board, and a COF (Chip On Film) in which a chip is mounted on the film may be applied.

In this embodiment, it is exemplified that COF is applied as a connection circuit board. The connection circuit board may include a film made of a polymer material and a connection electrode 110 provided on a surface of the film to be attached to the display panel 200.

The display panel 200 includes a display area in which an image is displayed and a non-display area provided so as to surround the display area.

In the display area, various wirings, for example, a plurality of gate wirings and data wirings for defining pixel regions, and power supply wirings for applying a power supply voltage may be provided.

The non-display area corresponds to a frame portion that does not display an image and surrounds the display area.

In this non-display area, a pad portion PA is provided in an extended line extending from the wiring of the display area to the non-display area, that is, in a region where the extended line is connected to the connection circuit board of the driver 100. [

The pad part PA is provided in a non-display area and is connected to the area provided for electrical connection between the display panel 200 and the driving part 100, that is, the connection between the non-display area of the display panel 200 and the driving part 100 And is provided in an area where bonding is performed between circuit boards.

In the pad portion PA, a plurality of pad pattern structures 250 are provided. In each of the pad pattern structures 250 thus formed, extension lines extending from the display region to the non-display region are connected.

In the non-display area, a plurality of pad portions PA are arranged at predetermined intervals along the width direction or the longitudinal direction of the display panel 200. In each pad portion PA, a plurality of pad pattern structures 250 are disposed at predetermined intervals along a direction in which a plurality of pad portions PA are arranged.

According to the present embodiment, each pad pattern structure 250 is provided on the top of the substrate 210 so as to be located in the pad portion PA region.

Each of the pad pattern structures 250 includes a first pattern 251 and a second pattern 253.

The first pattern 251 is provided on the substrate 210 so that the gate wiring of the display region extends to the pad region PA of the non-display region and is positioned in the pad region PA.

The first pattern 251 is provided on the substrate 210 and is located at the bottom of the pad pattern structure 250 and is formed of an opaque metal such as copper or aluminum .

On the other hand, the substrate 210 positioned below the first pattern 251 is made of a transparent material. As such a substrate 210, a substrate made of a glass material which is strong against heat, excellent in translucency and high in air and moisture barrier property, or made of a plastic material which is light and thin, Can be applied.

A buffer layer 220 is provided between the substrate 210 and the first pattern 251. The buffer layer 220 is formed in the form of a transparent insulating material made of silicon oxide (SiO ₂ ), and functions to prevent impurities on the substrate 210 from rising to the upper side and to prevent current from leaking toward the substrate 210 during driving .

In addition, a dielectric film (ILD) 230 is provided on the buffer layer 220. The dielectric layer 230 may be deposited on the buffer layer 220 to surround the first pattern 251 to prevent shorting between the first pattern 251 and a second pattern 253 have. The dielectric film 230 may be provided in a transparent film form.

The second pattern 253 is provided on the substrate 210 so that the data line of the display area extends to the pad area PA of the non-display area and is positioned in the pad area PA.

The second pattern 253 may be formed on the first pattern 251 to be positioned between the driving unit 100 and more specifically the connecting electrode 110 of the connecting circuit board and the first pattern 251. [ Respectively.

The second pattern 253 may be formed of an opaque metal such as copper (Cu) or aluminum (Al), as in the case of the first pattern 251.

In addition, the pad pattern structure 250 according to the present embodiment further includes a pad electrode 255.

The pad electrode 255 is provided on the substrate 210 so as to be positioned in the pad region PA and is electrically connected to the driving unit 100, more specifically, the connecting electrode 110 of the connecting circuit board, 253 so as to be positioned between the first pattern 253 and the second pattern 253.

The pad electrode 255 may be formed of a transparent material such as ITO or the like.

The pad electrode 255 is located at the top of the pad pattern structure 250 according to the present embodiment and can be electrically connected to the connection electrode 110 of the connection circuit board.

According to the present embodiment, the pad electrode 255 is formed to have a width greater than the width of the second pattern 253 so that the contact surface, which is in contact with the driver 100, more specifically, the connection electrode 110 of the connection circuit board, And is covered on top of the pattern 253.

The second pattern 253 is formed to have a wider width than the first pattern 251 and the pad electrode 255 covered on the upper portion of the second pattern 253 so as to cover the outside of the second pattern 253, The width of the first pattern 251 is wider than that of the second pattern 253.

This increases the contact area between the connection circuit board of the driving part 100 and the electrode of the pad pattern structure 250 so that the bonding resistance between the connection circuit board of the driving part 100 and the electrode of the pad pattern structure 250 increases So that the bonding between the connection circuit board of the driving unit 100 and the pad unit PA can be more effectively performed.

The pad pattern structure 250 having the above structure is electrically connected to the connection electrode 110 of the connection circuit board by bonding between the driving part 100 and the panel part PA, And an alignment state confirmation period B located at one end of the pad pattern structure 250 in the longitudinal direction.

That is, the alignment state checking section B corresponds to a section of the pad pattern structure 250 that is electrically connected to the connection electrode 110 of the connection circuit board, as in the connection section A, .

In this embodiment, the alignment state confirmation period B is exemplified as a section located on the end side of the pad pattern structure 250 toward the outside of the display panel 200.

The first pattern 251 is connected to the data electrode 253 so that the width direction end of the second pattern 253 is exposed outward in the width direction of the first pattern 251, And has a narrower width.

In other words, in the alignment state checking period B, the first pattern 251 is provided so as to be located in the widthwise inner area of the second pattern 253.

The width direction end portions of the connection electrodes 110 provided on the connection circuit board of the driving unit 100 are exposed to the outside in the width direction of the first pattern 251 and the second pattern 253 The first pattern 251 and the second pattern 253 are formed to have a width narrower than that of the connection electrode 110.

That is, in the alignment state checking period B, the first pattern 251 is arranged to be located in the widthwise inner region of the second pattern 253, and the second pattern 253 is provided to the connecting electrode 110 of the connecting circuit board. As shown in Fig.

A transparent substrate 210, a buffer layer 220 in the form of a transparent insulating layer, and a buffer layer 220 in the form of a transparent insulating layer are formed on the bottom of the alignment state checking section B, A first pattern 251 of an opaque metal material, a dielectric film 230 provided in the form of a transparent film surrounding the first pattern 251, a second pattern 253 of an opaque metal material, And electrodes 255 are stacked in this order.

According to the laminated structure of the pad pattern structure 250, since the first pattern 251 is disposed in the widthwise inner region of the second pattern 253, the pad pattern structure 250 The both end portions in the width direction of the second pattern 253 can be exposed outward in the width direction of the first pattern 251. [

That is, when the pad pattern structure 250 is viewed from the lower side of the substrate 210, the entire second pattern 253 is not obscured by the first pattern 251 located on the lower side, A part of both sides in the width direction of the pattern 253 can be seen outward in the width direction of the first pattern 251. [

At this time, it is preferable that the second pattern 253 has an exposure width of 3 占 퐉 or more for each portion exposed to the outside in the width direction of the first pattern 251. [

When the pad pattern structure 250 is viewed from the lower side of the substrate 210, a width direction end portion of the second pattern 253 exposed to the outside in the width direction of the first pattern 251 and a width direction end portion of the first pattern 251, It is preferable that the misalignment generated between the electrodes of the pad pattern structure 250 can be clearly confirmed.

5, the first pattern 251 and the second pattern 253 are electrically connected to the connection electrode 110 of the connection circuit board 250. In this case, When the pad pattern structure 250 is viewed from the lower side of the substrate 210, both end portions in the width direction of the connection electrode 110 are positioned in the widthwise inner side region of the first pattern 251 and the second pattern 252 253 in the width direction.

That is, when the connection electrode 110 of the connection circuit board located above the pad pattern structure 250 is viewed from the lower side of the substrate 210, the first pattern 251 and the second pattern 251, A part of both sides of the connecting electrode 110 in the width direction can be seen outside the width direction of the first pattern 251 and the second pattern 253, .

 6, in the remaining section of the pad pattern structure 250 excluding the alignment state check interval B as described above, the second pattern 253 is divided into the first pattern 251 As shown in Fig.

In other words, in the connection section A, the first pattern 251 is formed to have a width equal to or greater than the width of the second pattern 253, and the second pattern 253 is formed thereon at a width equal to or greater than the width of the first pattern 251 And are stacked on the first pattern 251 and the dielectric film 230. The first pattern 251 and the dielectric film 230 are formed on the first pattern 251 and the dielectric film 230, respectively.

In this embodiment, it is exemplified that the first pattern 251 is formed to have a wider width than the second pattern 253 in the connection section (A).

According to the pad pattern structure 250 of this embodiment having the connection section A having such a configuration, the first pattern 251 is wider than the second pattern 253 in the connection section A, 2 pattern 253 can be easily stacked and the width of the first pattern 251 can be ensured to a sufficient level to suppress the resistance of the first pattern 251 from rising.

According to the process of forming the pad pattern structure 250, the first pattern 251 is first formed on the substrate 210 and then the first pattern 251 and the dielectric film 230 And the second pattern 253 is patterned on the upper portion of the second pattern 253.

When the width of the first pattern 251 is smaller than the width of the second pattern 253 to be stacked, the first pattern 251 may be viewed from the upper side of the substrate 210 on which the second pattern 253 is patterned. It is difficult to properly align the position of the second pattern 253 with respect to the first pattern 251 in the process of forming the second pattern 253 because the whole is hidden by the second pattern 253.

Also, as the width of the first pattern 251 decreases, the resistance of the first pattern 251 through which the current flows increases is not preferable. Therefore, it is not preferable that the width of the first pattern 251 narrows more than necessary.

The first pattern 251 may be formed to have a wider width than the second pattern 253 in the connection section A so that the first pattern 251 is formed at the time of stacking the second pattern 253, And the second pattern 253 on the dielectric film 230 can be easily performed and the resistance of the first pattern 251 is increased by ensuring that the width of the first pattern 251 is sufficiently secured .

FIG. 7 is a schematic view showing an example in which an alignment state between a pad pattern structure and a driving part is confirmed according to an embodiment of the present invention. FIG. 8 is a view showing an alignment state between a pad pattern structure and a driving part according to an embodiment of the present invention Fig. 5 is a schematic view showing another example to be confirmed; Fig.

7, the laminated structure of the pad pattern structure 250 in the alignment state checking period B includes a transparent substrate 210, a buffer layer 220 in the form of a transparent insulating film, an opaque metal material A dielectric film 230 provided in the form of a transparent film surrounding the first pattern 251, a second pattern 253 made of an opaque metal material, a pad electrode 255 made of a transparent electrode material, Are stacked in this order.

The connection circuit board of the driving unit 100 is connected to the pad pattern structure 250 thus prepared.

The connection between the connection circuit board of the driving unit 100 and the pad unit PA (see FIG. 2) is achieved by connecting the connection electrode 110 provided on the connection circuit board of the driving unit 100 and the pad electrode 255). ≪ / RTI >

Although not shown in the drawing, electrical connection between the connection electrode 110 provided on the connection circuit board of the driving unit 100 and the pad electrode 255 of the pad pattern structure 250 is performed by using an anisotropic conductive film Can be accomplished by an intermediary bonding operation.

The anisotropic conductive film may be provided in a form including an insulating film and a conductive ball and is disposed between the connection circuit board of the driving unit 100 and the pad pattern structure 250 in the region of the pad portion PA.

A bonding operation or bonding operation between the driving unit 100 and the pad unit PA is performed by applying an anisotropic conductive film between the connection circuit board of the driving unit 100 and the pad pattern structure 250 in the area of the pad unit PA. The connection electrodes 110 of the connection circuit board and the electrodes of the pad pattern structure 250 are physically connected to each other by the insulating film while being pressed to the conductive balls by using a pressing tool (not shown) And the like.

In order for the connection between the driving part 100 and the pad part PA to be performed properly, it is necessary to align the connection circuit board of the driving part 100 with the pad pattern structure 250 in the area of the pad part PA, Alignment between the connection electrode 110 of the circuit board and the electrodes of the pad pattern structure 250 must be performed with high accuracy.

The alignment of the connection circuit board of the driving unit 100 with the pad pattern structure 250 of the pad area PA can be performed in the alignment state confirmation period B by connecting the connection electrode 110 of the connection circuit board, And the electrodes of the pad pattern structure 250 may be monitored and the position of the connecting circuit board of the driving unit 100 may be adjusted according to the monitored result.

The monitoring of the positional relationship between the connection electrode 110 of the connection circuit board and the electrodes of the pad pattern structure 250 in the alignment state checking period B is performed by using the photographing apparatus C provided on the lower side of the substrate 210 .

The photographing apparatus C acquires an image photographed in the direction toward the connecting electrode 110 side located on the upper side of the pad pattern structure 250 in the lower side of the substrate 210, can do.

As the photographing apparatus C, an apparatus for photographing an object such as a CCD camera and acquiring an image can be applied.

In order to acquire information about the distance between the width direction end portion of the second pattern 253 and the end portion of the connecting electrode 110 of the connecting circuit board exposed to the outside of the second pattern 253 using this photographing apparatus C Images can be acquired.

Information on the widthwise end portion of the second pattern 253 and the distance between the end portions of the connection electrodes 110 of the connection circuit board exposed to the outside can be obtained through the obtained image.

The positional relationship between the connection electrode 110 of the connection circuit board and the electrode of the pad pattern structure 250, that is, the positional relationship between the connection circuit board of the driver 100 and the pad pattern It is possible to confirm the positional alignment state between the structures 250.

The second pattern 253 is provided on the inner side in the width direction of the connecting electrode 110 of the connecting circuit board, and the first pattern 251 is disposed on the inner side in the width direction of the second pattern 253, Area.

The widthwise ends of the second pattern 253 are exposed to the outside in the width direction of the first pattern 251 as viewed from the lower side to the upper side of the substrate 210, May be exposed to the outside in the width direction of the second pattern 253.

Accordingly, both the image necessary for grasping the alignment state between the first pattern 251 and the second pattern 253 and the image necessary for grasping the alignment state between the second pattern 253 and the connection electrode 110 are formed on the substrate 210 Can be obtained through the photographing apparatus C installed on the lower side.

If the width of the first pattern 251 is wider than the width of the second pattern 253 and the second pattern 253 is located in the widthwise inner region of the first pattern 251, The second pattern 253 is obscured by the first pattern 251 when viewed from the upper direction.

Thus, information on the alignment state between the second pattern 253 and the connection electrode 110 can be acquired because the imaging device C can not grasp the alignment state of the second pattern 253 I will not.

In this embodiment, the first pattern 251 is formed to have a width (width) of the second pattern 253 so that the both ends of the second pattern 253 in the width direction can be exposed outward in the width direction of the first pattern 251, Direction inner region.

Information on how the second pattern 253 is aligned and how the second pattern 253 and the connection electrode 110 are aligned can be acquired effectively through the image pickup device C, The alignment between the connection electrode 110 of the connection circuit board and the electrode of the pad pattern structure 250 can be performed with high accuracy through the obtained information.

According to the electrode stacking structure of the pad pattern structure 250, as shown in FIG. 8, even when a distortion occurs in the stacking of the second patterns 253, the second patterns 253, The alignment between the connection electrode 110 of the connection circuit board and the electrode of the pad pattern structure 250 can be accurately obtained through the imaging device C, .

As a result of the alignment between the connection electrode 110 of the connection circuit board and the electrode of the pad pattern structure 250 in the alignment state checking period B, The connection electrodes 110 of the connection circuit board and the electrodes of the pad pattern structure 250 are simultaneously aligned with each other.

This makes it easy to align the first pattern 251 and the second pattern 253 on the dielectric film 230 through the connection section A and to increase the resistance of the first pattern 251 It is possible to provide both of the two effects of achieving high accuracy in alignment between the connection electrode 110 of the connection circuit board and the electrode of the pad pattern structure 250 through the alignment state checking period B .

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. I will understand. Accordingly, the true scope of protection of the present invention should be defined by the following claims.

100:
110: connecting electrode
200: Display panel
210: substrate
220: buffer layer
230: dielectric film
250: Pad pattern structure
251: First pattern
253: the second pattern
255: pad electrode
A: Connection section
B: Alignment status check section
C: Photographing apparatus
PA: pad portion

Claims (10)

A first pattern provided on the top of the substrate so as to be positioned in a pad region provided for electrical connection between the display panel and the driving unit; And
And a second pattern provided on the first pattern to be positioned between the driving unit and the first pattern,
Wherein the first pattern is located in a widthwise inner region of the second pattern in a part or entire section of the first pattern that is divided along the longitudinal direction of the first pattern.
The method according to claim 1,
Wherein the first pattern has a width narrower than that of the second pattern so that a width direction end of the second pattern is exposed in a width direction outer side of the first pattern.
The method according to claim 1,
An alignment state confirmation section is provided on one side of the pad pattern structure in the longitudinal direction;
Wherein the first pattern is located in a widthwise inner region of the second pattern in the alignment state checking period.
The method of claim 3,
And the second pattern is located in a widthwise inner side region of the first pattern in a remaining portion of the pad pattern structure excluding the alignment state checking period.
The method according to claim 1,
And a transparent electrode pad disposed on the second pattern so as to be positioned between the driver and the second pattern;
Wherein the second pattern is located in a widthwise inner region of the driving unit that contacts the pad electrode.
The method according to claim 1,
And a transparent electrode pad disposed on the second pattern so as to be positioned between the driver and the second pattern;
Wherein the pad electrode is covered on the upper portion of the second pattern so that a contact surface contacting the driving portion has a width equal to or greater than the width of the second pattern.
Board; And
And a pad pattern structure provided on the substrate so as to be positioned in a pad region provided for electrical connection between the display panel and the driving unit,
The pad pattern structure may include:
A first pattern provided on the substrate; And
And a second pattern provided on the first pattern to be positioned between the driving unit and the first pattern,
Wherein the first pattern is disposed in a widthwise inner area of the second pattern in a part or entire section that is divided along the length direction of the first pattern.
8. The method of claim 7,
And a pad electrode provided on the second pattern so as to be positioned between the driving unit and the second pattern;
Wherein the substrate and the pad electrode are made of a transparent material.
A driving unit for generating a signal for defining a pixel; And
And a display panel connected to the driving unit,
The display panel includes:
Board; And
And a pad pattern structure provided on the substrate so as to be positioned in a pad region provided for electrical connection between the display panel and the driving unit,
The pad pattern structure may include:
A first pattern provided on the substrate; And
And a second pattern provided on the first pattern to be positioned between the driving unit and the first pattern,
Wherein the first pattern is disposed in a widthwise inner area of the second pattern in a part or whole section of the first pattern that is divided along the longitudinal direction of the first pattern.
10. The method of claim 9,
The driving unit includes a connection circuit board and a connection electrode provided on the connection circuit board and in contact with the pad pattern structure,
Wherein the second pattern is formed to have a width that can be located in a widthwise inner region of the connection electrode.

Images