KR20170043041A - Led lighting apparatus - Google Patents

Led lighting apparatus Download PDF

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Publication number
KR20170043041A
KR20170043041A KR1020150142403A KR20150142403A KR20170043041A KR 20170043041 A KR20170043041 A KR 20170043041A KR 1020150142403 A KR1020150142403 A KR 1020150142403A KR 20150142403 A KR20150142403 A KR 20150142403A KR 20170043041 A KR20170043041 A KR 20170043041A
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KR
South Korea
Prior art keywords
lens
cover
led
heat
punching
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KR1020150142403A
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Korean (ko)
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KR101800387B1 (en
Inventor
정연문
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정연문
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Priority to KR1020150142403A priority Critical patent/KR101800387B1/en
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Publication of KR101800387B1 publication Critical patent/KR101800387B1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0035—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/08—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters for producing coloured light, e.g. monochromatic; for reducing intensity of light
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

A heat dissipation cover having one surface opened and a space portion formed therein; A power supply unit disposed outside the heat radiating cover at predetermined intervals; An LED substrate accommodated in the space portion and closely coupled to the heat radiation cover; A panel part covering the opening and having a plurality of reflection holes formed in a predetermined pattern; And a lens part in which a lens is inserted and arranged in the reflection hole.

Description

LED LIGHTING APPARATUS

The present invention relates to a luminaire, and more particularly, to an LED luminaire capable of providing light in a dark room or an outside space by using an LED device as a light source in a lighting device.

A luminaire is a means for providing light corresponding to natural light, and usually uses a fluorescent light or an LED (light emitting diode) device. However, in order to provide light, the luminaire requires a separate power supply, such as a ballast, in addition to these light sources.

In recent years, fluorescent lamps are gradually being replaced by LED luminaires that use LED elements as a light source. This is because the LED device is excellent in energy consumption efficiency because it can be driven at a low power while having superior brightness of light without using harmful substances such as mercury as compared with a fluorescent lamp.

In addition, the LED device has a longer life than a fluorescent lamp and can provide various colors of light such as red, yellow, and the like, and thus can be widely used as a home lighting device as well as a variety of landscape lighting, advertisement signboards, traffic signals and the like.

In spite of these advantages, however, the LED luminaire has been limited in its diffusion due to the relatively high price and installation cost as compared to a conventional luminaire or incandescent lamp.

In addition, there has been a problem that a heat dissipating unit having a larger size has to be installed in order to efficiently emit heat generated in the LED device in proportion to an increase in the brightness of the LED device.

In recent years, LED lamps have been developed to be widely used as lighting fixtures by modifying and compacting components such as LED substrate and heat dissipation unit. However, it is not easy to arrange the LED element in the module, and the size of the LED element is limited due to the shape and size of the heat dissipation unit, and the installation is not easy when the LED element is installed on a ceiling or a wall.

In addition, there is a problem that a clearance occurs when assembling due to tolerance or assembly error occurring in the process of manufacturing the LED substrate and the heat dissipating unit, and the heat dissipating effect is deteriorated due to deformation due to long use.

Korean Registered Patent No. 10-1479492 (Registered on December 30, 2014)

SUMMARY OF THE INVENTION An embodiment of the present invention has been made to solve the above problems, and it is an object of the present invention to provide an LED lamp having a compact structure that maximizes heat dissipation effect and is easy to assemble.

In addition, it is effective to prevent glare of light, and it is intended to easily change the light distribution. At the same time, the object is to improve the light-operating performance of the lighting due to its excellent light condensing ability.

In addition, it is easy to attach and detach to a ceiling or a wall surface, so that maintenance for maintenance and management is easy. Further, the panel part is intended to have properties of absorbency, heat insulation, dimensional stability, harmlessness, nonflammability, light weight and workability.

It is also an object of the present invention to improve the durability and heat dissipation of the substrate on which the LED element is mounted.

In order to solve the above-described problems, an embodiment of the present invention provides a heat radiating cover having one surface opened and a space portion formed therein; A power supply unit disposed outside the heat radiating cover at predetermined intervals; An LED substrate accommodated in the space portion and closely coupled to the heat radiation cover; A panel part covering the opening and having a plurality of reflection holes formed in a predetermined pattern; And a lens part in which a lens is inserted and arranged in the reflection hole.

A heat dissipation fin made of copper may be formed on an outer surface of the heat dissipation cover.

The power supply unit may be attached and disposed by a heat-resistant tape having a predetermined thickness.

And an anti-vibration member provided on an inner upper edge of the heat-radiating cover.

And a heat radiation film and a heat radiation cream interposed between the heat radiation cover and the LED substrate.

Wherein the LED substrate includes a printed circuit board and a copper metal substrate, the copper metal substrate has a perforation pattern, the perforation pattern is formed across the positive and negative electrodes of the LED element, And an arc-shaped punching portion symmetrically formed on both sides of the linear punching portion.

The reflection hole may be formed in one of a cylinder and a truncated cone shape, and the surface of the reflection hole may be silver plated.

The reflector may have a hollow truncated cone shape, and the lower opening surface may have a diameter larger than that of the upper opening surface.

A cross-shaped partition wall vertically disposed on the lower opening surface of the reflector; And a lens groove formed concavely in the vicinity of an upper crossing point of the partition toward the lower opening surface.

And a color film covering the opening of the reflection hole may be attached to the bottom surface of the panel part.

The panel portion may have a resemblance shape in which the opening is proportionally enlarged, and a stationary ring may be formed at an edge of the panel portion.

The panel part may be formed of any one of gypsum board, wood, PVC, iron, and aluminum.

The lens unit may be a lens film having a size larger than an area of the opening, and the lens film may be disposed on the panel unit so that all the inner surfaces of the heat radiation cover are partially covered.

The lens unit is a lens film, and the lens is a clearance lens vertically disposed at a predetermined interval on the lens film, and the clearance lens may be formed to have a length protruding from the end portion of the clearance lens toward the outside of the panel unit.

And a wire connected to at least one of the heat radiating cover and the panel portion.

Wherein at least one fixing hole is formed on each of the heat radiating cover, the LED substrate, the lens portion, and the panel portion so as to extend on the same extension line, and the heat radiating cover, the LED substrate, And a snap pin for fastening the panel unit in a lump.

A first punching step of forming a linear punching portion by providing a silk-printed metal substrate; placing the positive and negative electrodes of the LED element on both sides of the linear punching portion and performing brazing treatment on the positive and negative electrodes; A second punching step of forming an arc-shaped punching portion between the LED elements in parallel with the linear punching portion; And attaching an insulating tape to the back surface of the metal substrate.

As described above, according to the present invention, various effects including the following can be expected. However, the present invention does not necessarily achieve the following effects.

The LED lamp according to the present invention maximizes the heat dissipation effect and improves the operational reliability, and is easy to assemble, thereby ensuring productivity, durability and product competitiveness. In addition, the space structure is excellent because of its compact structure.

Further, it is effective for preventing the glare of light, easy to change the light distribution, and excellent in the light condensing ability, so that the operating performance of the illumination can be improved.

In addition, it can be attached and detached easily to the ceiling or the wall surface, and maintenance for maintenance and management is easy. In addition, the panel part can be formed of the same material as the ceiling finishing material, and can have characteristics of inferiority, heat insulation, dimensional stability, harmlessness, nonflammability, lightweightness and workability.

In addition, the substrate on which the LED element is mounted can be replaced by a metal plate other than a printed circuit board (PCB), thereby improving durability and heat radiation.

1 is a perspective view of an LED lamp according to an embodiment of the present invention;
Fig. 2 is an exploded perspective view of Fig. 1; Fig.
Fig. 3 is a longitudinal sectional view of Fig. 1 according to the first embodiment; Fig.
Fig. 4 is a longitudinal sectional view of Fig. 1 according to the second embodiment; Fig.
Fig. 5 is a rear view of Fig. 1; Fig.
6 is a front view of an LED substrate using a copper metal substrate;
Fig. 7 is a perspective view showing the reflector of Fig. 1; Fig.
FIG. 8 is an exploded perspective view of FIG. 7; FIG.
Fig. 9 is a flowchart showing a manufacturing method for the LED substrate of Fig. 6

Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view of an LED lamp according to an embodiment of the present invention, FIG. 2 is an exploded perspective view of FIG. 1, FIG. 3 is a longitudinal sectional view of FIG. 1 according to the first embodiment, Fig. 5 is a rear view of Fig. 1. Fig.

1 to 5, an LED lamp unit includes a heat radiation cover 10, a power supply unit 20, an LED substrate 30, a panel unit 40, a lens unit 50, and a reflector 60 .

LED luminaires are installed on the ceiling or wall. To this end, an opening may be formed in the ceiling or the wall surface so that the LED lamp may be embedded. A rigid metal bracket or the like can be further provided around the opening to assist in fixing the LED lamp to the fixed position. On the other hand, the LED luminaire can be installed suspended from the ceiling or wall

First, the heat dissipation cover 10 has a function of emitting heat radiated from the LED element 32 that provides light to the outside. In this case, the heat dissipation is to prevent the light efficiency of the LED substrate 30 from being lowered and at the same time to shorten the lifetime. The size of the heat dissipation cover 10 may vary depending on the power consumed.

Therefore, the heat radiating cover 10 is formed of a material having excellent thermal conductivity. For example, a metal material such as copper or aluminum, or an alloy material containing the same.

The heat dissipation cover 10 has the shape of a rectangular parallelepiped, a column, a column or the like, the inside of which is an empty space as a whole. The heat dissipation cover 10 according to one embodiment is made of a rectangular parallelepiped in the shape of a rectangular plate when considering the LED element 32 disposed in the LED substrate 30. [ At this time, the height is significantly shorter than the lengths of the width and the length. On the other hand, one side formed by the transverse side and the longitudinal side is opened. As a result, the LED substrate 30 and the like can be accommodated in the inner space of the heat radiation cover 10 through the openings.

At this time, the height of the heat radiating cover 10 is formed to a minimum length in which the LED substrate 30 can be housed in the internal space. As a result, the LED luminaire can have a compact size and space utilization can be improved. However, the shape of the heat dissipation cover 10 can be changed more appropriately depending on the installation position.

A plurality of heat dissipation fins 12 made of copper are formed on the outer surface of the heat dissipation cover 10. As a result, the heat radiation area of the heat radiation cover 10 is further increased, so that the heat exchange with ambient air is facilitated, and as a result, the heat can be released quickly to the outside.

The heat radiating fins 12 are generally in the form of a plate protruding upward perpendicularly to the heat radiating cover 10 and may be arranged in a certain direction in a certain direction on the outer surface of the heat radiating cover 10, . The heat radiating fins 12 may be formed of the same material as the heat radiating cover 10 and formed integrally with the heat radiating cover 10. Therefore, the heat radiating effect of the heat radiating cover 10 is maximized, and the operational reliability of the LED luminaire can be further improved.

A wire (not shown) capable of fixing the LED lamp to a ceiling, a wall surface, or the like may be connected to the heat dissipation cover 10. That is, it is possible to install the LED lamps so as to be spaced apart from the ceiling or the surface of the wall by using wires. This is based on the height of the installation point. That is, the LED luminaire may be installed in the air. On the other hand, such a wire can be connected not only to the heat radiating cover 10 but also to the panel portion 40.

Next, the power supply unit 20 converts an AC current, for example, an AC voltage of 220 V into a DC voltage of a predetermined size and supplies it to the LED substrate 30. The power supply unit 20 according to one embodiment is disposed vertically outwardly from the upper surface of the heat radiation cover 10. [

At this time, the power supply unit 20 is disposed at a position spaced apart from the upper surface of the heat dissipation cover 10 by a predetermined distance, that is, at a position where a step is formed. For this purpose, a structure including a seating surface, 10). At this time, the power supply unit 20 can be firmly attached to the heat-resistant tape having the predetermined thickness on the seating surface.

This is to minimize the influence of 1) the structural reason due to the heat dissipation fin 12 and 2) the heat dissipation from the heat dissipation cover 10. As a result, the power supply unit 20 can stably supply power to the LED lamp.

Next, the LED substrate 30 includes a printed circuit board (PCB) and a plurality of LED elements 32 mounted thereon. In each of the LED elements 32, positive and negative electrodes are formed facing each other. At this time, the LED element 32 can be mounted on the printed circuit board by a method such as soldering.

On the other hand, the LED substrate 30 is coupled to the heat radiation cover 10 such that the back surface of the LED substrate 30 is in close contact with the inner surface of the upper surface of the heat radiation cover 10. As a result, the light emitting portion of the LED element 32 faces the opening of the heat radiation cover 10.

6 is a front view of the LED substrate 30 using a copper metal substrate. Referring to FIG. 6, the LED substrate 30 may be formed of a metal material. Among them, a copper metal substrate is preferred because of its excellent electrical and thermal conductivity.

The copper metal substrate is repeatedly provided with a perforation pattern having a predetermined shape. Specifically, the perforation pattern is formed by a linear punching section 34 formed to cross between the positive and negative electrodes of the LED element 32 to be mounted, and a rectilinear punching section 34 formed symmetrically on both sides with reference to the linear punching section 34. [ And a punching portion 36. At this time, the straight and arc-shaped punching portions 34 and 36 are formed as a result of the copper metal substrate being cut off by the press punching operation.

The linear punching portion 34 is for electrically insulating the positive and negative electrodes of the LED element 32 and the arc-shaped punching portion 36 is formed by laminating the adjacent LED element 32, So that deformation and cracks do not occur.

Separately, leaving the metal plate between the adjacent arcuate punching portions 36 is for the purpose of further distributing the heat generated from the LED element 32. Further, the copper metal substrate can be further punched so that the linear punching portions 34 are connected to each other.

Further, the back surface of the copper metal substrate is covered with insulating tape so that the copper metal substrate is insulated while preventing the copper metal substrate from being separated by the straight and arc-shaped punching portions 34 and 36.

On the other hand, a dustproof member (not shown) may be interposed between the heat dissipation cover 10 and the LED substrate 30. Specifically, the anti-vibration member may be provided at an inner upper surface corner portion of the heat radiation cover 10 to provide an accurate coupling position to the LED substrate 30. [

Such an anti-vibration member is generally formed into a ring shape having an elastic material and can provide an elastic force to the side surface of the LED substrate 30 which is in contact with the anti-vibration member. As a result, the anti-vibration member can further attach a fixing force to the LED substrate 30.

Further, a heat radiation film (not shown) and a heat radiation cream (not shown) may be further interposed between the heat radiation cover 10 and the LED substrate 30. At this time, the heat radiation film is entirely attached to the heat radiation cover 10 to which the LED substrate 30 is coupled. As a result, the bonding strength of the LED substrate 30 stacked thereon to the heat radiation cover 10 can be further increased.

Further, the heat radiating film has a shock absorbing capability, and it is possible to prevent the LED substrate 30 from being warped. Further, the heat-radiating film can provide electrical insulation to the LED substrate 30 as an insulator. As a result, the heat dissipation efficiency of the LED luminaire is further improved and the operation reliability is increased.

Unlike radiating film, radiating cream differs from liquid film in that it is used for the same purpose and has a similar effect. The heat radiation cream is applied to the heat dissipation cover 10 as a whole, and then the LED substrate 30 is bonded thereto.

Next, the panel portion 40 closes the heat radiation cover 10 while covering the opening of the heat radiation cover 10. For this, a ring-shaped receiving groove (not shown) is formed on the upper surface of the panel portion 40 to receive the side surface surrounding the opening of the heat radiation cover 10, respectively.

In addition, the panel portion 40 is formed with a plurality of reflection holes 42 vertically penetrating the upper and lower surfaces thereof. The light generated from the LED element 32 can be diffused into the external space through reflection of the inner surface of the reflection hole 42. [

The reflection hole 42 may be formed in one of a cylinder and a truncated cone shape. However, in the case of the truncated cone shape, the vertical position formed in the panel unit 40 may vary depending on whether the object is the diffusion of light or light condensation. The cross-section of the truncated cone can be polygonal, circular or the like. However, the reflection hole 42 according to an embodiment of the present invention is formed in the panel part 40 such that the cross section of the reflection hole 42 is gradually widened in the direction of light propagation.

On the other hand, the surface of the reflection hole 42 is smoothly processed to be advantageous for reflection of light. In particular, the surface may be plated with silver, chrome, white reflector, etc. after surface processing. As a result, a discoloration phenomenon caused by exposure to light for a long time can be prevented, durability is improved, and the reflectivity can be increased. The reflection holes 42 are arranged at a predetermined interval in the panel unit 40.

The panel part (40) has a shape in which the opening of the heat radiation cover (10) is enlarged proportionally. For example, if the opening is rectangular, the panel portion 40 has a more enlarged rectangular shape of a resemblance. This is because the LED luminaire can be installed on the ceiling or on the wall by the rim of the panel unit 40.

In addition, a metal fixing ring (not shown) may be formed on the rim of the panel unit 40. Corresponding to this, a fixing ring or the like to be engaged with the fixing ring may be provided on the ceiling or the wall surface. As a result, the LED luminaire can be installed more stably on the ceiling or on the wall.

The panel part 40 is formed of any one of gypsum board, wood, PVC, iron, ceramics and aluminum. These materials are mainly used for ceiling finishes. Accordingly, the panel part 40 may have properties of inhaling property, heat insulating property, dimensional stability, harmless property, nonflammable property, lightweight property and constructability. As a result, it can be bonded to the ceiling or the wall surface to be installed without any irregularity.

A color film (not shown) covering the opening of the reflection hole 42 may be attached to the lower surface of the panel part 40. The color film can adjust the color or strength of the original light of the LED element 32 and block the outer opening of the reflection hole 42 to prevent foreign matter from flowing through the reflection hole 42. In addition, a specific pattern may be engraved on the color film.

Next, the lens portion 50 is disposed between the LED substrate 30 and the panel portion 40 so as to more efficiently condense or distribute the light. Specifically, the lens portion 50 is disposed such that the lens 54 convexly formed on one side is inserted into the reflection hole 42 of the panel portion 40.

Here, the lens portion 50 according to the first embodiment is a flexible lens film having a size larger than the opening area of the heat radiation cover 10. [ At this time, the lens film includes a plurality of lenses 54 which are convexly formed on the flat film at predetermined intervals. The lens film is coupled to the heat radiation cover 10 in a state where it is disposed on the upper surface of the panel unit 40.

At this time, the rim portion of the lens film is bent so as to cover the inner surface of the heat radiation cover 10. In particular, the lens film is disposed on the panel portion 40 such that all the inner surfaces of the heat radiation cover 10 can be covered at least partly. As a result, gaps and the like that may exist due to manufacturing errors can be removed between the panel portion 40 and the heat dissipation cover 10. As a result, it is possible to prevent foreign matter from entering, and to prevent light from leaking through a passage other than the reflection hole 42.

Further, the lens portion 50 according to the second embodiment has a flexible lens film shape. Further, the lens film includes a plurality of clearance lenses 55 vertically arranged at regular intervals on the flat film. At this time, the clearance lens 55 is made of transparent silicone or the like, and one side of the clearance lens 55 is convex or concave so that light can be diffused or condensed.

The lens unit 50 is coupled to the heat radiation cover 10 in a state where the lens unit 55 is disposed on the upper surface of the panel unit 40 so as to be inserted into the reflection hole 42. Here, the reflection hole 42 has a cylindrical shape. At this time, the end portion of the clearance lens 55 protrudes to the outside of the panel portion 40.

That is, the length of the clearance lens 55 is formed to be longer than at least the length of the reflection hole 42. As a result, the light emitted from the LED element 32 can be further diffused at the end of the protruded clearance lens 55. That is, the illumination range of the lens portion 50 can be further increased.

At this time, the lens film can cover the inner surface of the heat radiation cover 10 by bending the rim portion as described above. In particular, the lens film is disposed on the panel portion 40 such that all the inner surfaces of the heat radiation cover 10 can be covered at least partly. As a result, gaps and the like that may exist due to manufacturing errors can be removed between the panel portion 40 and the heat dissipation cover 10. As a result, it is possible to prevent foreign matter from entering, and to prevent light from leaking through a passage other than the reflection hole 42.

Alternatively, the lens section 50 may be a spherical lens that is individually disposed in the reflection hole 42.

Fig. 7 is a perspective view showing the reflector 60 of Fig. 1, and Fig. 8 is a cutaway perspective view of Fig. Referring to FIGS. 7 and 8, the LED lamp may include a reflector 60, which is fitted into the reflection hole 42, respectively. The reflector 60 has a hollow truncated cone shape corresponding to the shape of the truncated cone when the reflection hole 42 described above is formed. Specifically, the reflector 60 has a diameter larger than that of the upper opening surface.

On the other hand, the reflector 60 may be formed with a cross-shaped partition wall 62 disposed perpendicularly to the lower opening surface. The partition wall 62 can partially cover the central portion of the light emitting portion of the LED element 32 that is visually exposed through the lower opening surface, thereby preventing glare caused by light emission.

A lens groove 64 is formed in the vicinity of the upper crossing point of the partition wall 62 so as to be concave toward the lower opening surface. The lens groove 64 prevents the lens portion 50 inserted through the upper opening face of the reflector 60 from being caught by the partition wall 62 and not being disposed correctly.

On the other hand, the reflector 60 can be inclined obliquely to the reflection hole 42. As a result, the illumination direction of the LED lamp can be adjusted.

The LED lamp according to an embodiment of the present invention can be fastened together using snap pins 85. At least one fixing hole 83 may be formed on the heat radiating cover 10, the LED substrate 30, the lens unit 50, and the panel unit 40, respectively. At this time, the fixing hole 83 serves as a guide when each component is disposed.

This is because each component can be arranged so that the corresponding fixing holes 83 communicate with each other. As a result, each of the components can be fixed in position and can be prevented from shaking in the horizontal direction.

That is, the LED lamp can be easily assembled even if the power tool is not used, by using the snap pin 85 inserted through the fixing hole 83 after sequentially arranging the respective components. As a result, the assembly accuracy with respect to the LED luminaire is improved, and more precisely when the LED luminaire is fixed to the ceiling or the wall surface. In addition, the manufacturing cost can be reduced due to the improvement of the productivity. Alternatively, however, the LED lamp may be assembled by fastening members such as screws.

Hereinafter, a method of manufacturing an LED substrate used in an LED lamp according to an embodiment of the present invention will be described. 9 is a flowchart showing a manufacturing method for the LED substrate of FIG. 9, a metal substrate having a perforation pattern of a predetermined shape can be manufactured through a first drilling step s10, a mounting step s20, a second drilling step s30, and an attaching step s40 .

The first drilling step (s10) begins by providing a metal substrate on which the LED element 32 is mounted. Here, the metal substrate is subjected to silk printing in advance. On the other hand, the metal substrate is preferably a copper metal substrate, for example. Then, the linear punching portion 34 is repeatedly formed on the metal substrate.

Next, the mounting step s20 is a step of arranging the positive and negative electrodes of the LED element 32 on both sides of the linear punching portion 34 and performing soldering processing on the respective portions.

The second punching step s30 is a step of forming the arc-shaped punching portion 34 side by side with the linear punching portion 34 between the LED elements 32. [ The straight and arc-shaped punching portions 34 and 36 are formed as a result of cutting the corresponding portion of the metal substrate by the punching operation.

The attaching step s40 is a step of attaching an insulating tape to the back surface of the metal substrate. As described above, this prevents the metal substrate from being separated by the straight and arc-shaped punching portions 34 and 36 while allowing the metal substrate to be insulated. Meanwhile, the manufacturing method according to one embodiment may further include a third punching step of connecting the linear punching portions 34 to each other between the second punching step s30 and the attaching step s40.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention.

10: heat radiating cover 12: heat radiating pin
20: power supply unit 30: LED substrate
32: LED element 34: straight punching part
36: arc-shaped punching unit 40:
42: reflection hole 50: lens part
54: Lens 55: Clearance lens
60: reflector 62: partition wall
64: Lens groove 83: Fixing hole
85: Snap pin

Claims (17)

A heat dissipation cover having one surface opened and a space portion formed therein;
A power supply unit disposed outside the heat radiating cover at predetermined intervals;
An LED substrate accommodated in the space portion and closely coupled to the heat radiation cover;
A panel part covering the opening and having a plurality of reflection holes formed in a predetermined pattern; And
And a lens portion in which a lens is inserted and arranged in the reflection hole.
The method according to claim 1,
And a heat dissipation fin made of copper material is formed on an outer surface of the heat dissipation cover.
The method according to claim 1,
Wherein the power supply unit is attached and arranged by a heat-resistant tape having a predetermined thickness.
The method according to claim 1,
And an anti-vibration member provided at an inner upper surface edge of the heat radiation cover.
The method according to claim 1,
And a heat radiating film interposed between the heat radiating cover and the LED substrate, and a heat radiating cream.
The method according to claim 1,
Wherein the LED substrate is one of a printed circuit board and a copper metal substrate,
The copper metal substrate is provided with a perforation pattern,
Wherein the perforation pattern includes a straight punching portion formed across the space between the positive and negative electrodes of the LED element; And an arc-shaped punching portion symmetrically formed on both sides of the linear punching portion.
The method according to claim 1,
Wherein the reflection hole is formed in one of a cylinder and a truncated cone shape, and the surface of the reflection hole is silver plated.
The method according to claim 1,
Wherein the reflection hole is in the form of a truncated cone, and the reflector is fitted into the reflection hole,
Wherein the reflector has an inner hollow truncated cone shape and the lower opening surface has a larger diameter than the upper opening surface.
9. The method of claim 8,
The reflector
A cross-shaped partition wall vertically disposed on the lower opening surface; And
And a lens groove formed concavely in the vicinity of an upper intersection of the partition toward the lower opening surface.
The method according to claim 1,
And a color film covering the opening of the reflection hole is attached to the lower surface of the panel part. The method according to claim 1,
Wherein the panel portion has a resemblance shape in which the opening is proportionally enlarged,
And a fixing ring is formed on an edge of the panel part.
The method according to claim 1,
Wherein the panel part is formed of one of gypsum board, wood, PVC, iron, and aluminum.
The method according to claim 1,
Wherein the lens portion is a lens film having a size larger than an area of the opening,
Wherein the lens film is disposed on the panel part so that all the inner surfaces of the heat radiation cover are partially covered.
The method according to claim 1,
Wherein the lens portion is a lens film,
Wherein the lens is a clearance lens vertically arranged at a predetermined interval on the lens film,
Wherein the clearance lens is formed such that an end portion of the clearance lens protrudes outside the panel portion.
The method according to claim 1,
And a wire connected to at least one of the heat radiating cover and the panel portion.
The method according to claim 1,
At least one fixing hole is formed on each of the heat radiating cover, the LED substrate, the lens portion, and the panel portion,
And a snap pin inserted into the fixing hole to integrally fasten the heat radiating cover, the LED substrate, the lens portion, and the panel portion.
A first punching step of forming a linear punching portion by providing a silk-printed metal substrate;
A mounting step of disposing positive and negative electrodes of LED elements on both sides of the linear punching part and performing soldering treatment on the positive and negative electrodes;
A second punching step of forming an arc-shaped punching portion between the LED elements in parallel with the linear punching portion; And
And attaching an insulating tape to the back surface of the metal substrate.
KR1020150142403A 2015-10-12 2015-10-12 Led lighting apparatus KR101800387B1 (en)

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JP2009129809A (en) * 2007-11-27 2009-06-11 Toshiba Lighting & Technology Corp Lighting system
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