KR20170019323A

KR20170019323A - Resin molding apparatus and resin molding method and molding die

Info

Publication number: KR20170019323A
Application number: KR1020160100797A
Authority: KR
Inventors: 가츠나리 모모이; 다카시 다무라
Original assignee: 토와 가부시기가이샤
Priority date: 2015-08-11
Filing date: 2016-08-08
Publication date: 2017-02-21
Also published as: TW201714724A; TWI613059B; CN106426710A; JP2017035832A; JP6430342B2; CN106426710B; KR101813391B1

Abstract

The object of the present invention is to perform sealing with a resin while preventing a release film from being wrinkled or loosened. According to the present invention: a lower die comprises a peripheral surface member and a bottom member; a ring-shaped outer circumferential adhesion groove is formed along the outer circumference of the peripheral surface member; a plurality of main concave units are formed on the inner side of the outer circumferential adhesion groove; an assembly main member having a main adhesion groove is inserted and mounted in the plurality of the main concave units; and the cross-section of the main adhesion groove is formed to have a wide opening and a V-shape. A release film is adhered to the main adhesion groove while the release film is adhered to the inner surface of the outer circumferential adhesion groove, thereby applying uniform tension to the release film. While the release film is adhered to the inner surface of the plurality of the main adhesion grooves, the release film is adhered along the molding surface of a cavity. Thus, wrinkling and loosening of the release film can be prevented.

Description

RESIN MOLDING APPARATUS AND RESIN MOLDING METHOD AND MOLDING DIE [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding apparatus, a resin molding method, and a molding die used when a chip-type electronic device (hereinafter referred to as " chip "

Conventionally, a chip mounted on a circuit board (hereinafter referred to as " substrate " as appropriate) is resin-sealed with a cured resin by using a resin molding technique. The chip includes a semiconductor chip such as a transistor, an integrated circuit (IC), or a light emitting diode (LED). As the circuit board, there can be mentioned a lead frame, a printed circuit board (PCB), a ceramics substrate, and the like. Examples of the resin molding technique include a transfer molding method, a compression molding method (compression molding method), and an injection molding method (injection molding method). In recent years, there is an increasing need for resin encapsulation using a compression molding method due to the tendency of circuit boards becoming larger and thinner, and furthermore, lamination of circuit boards by three-dimensional mounting.

The resin sealing by the compression molding method is carried out as follows. In the resin molding apparatus, first, a release film is coated on the lower mold. The mold release film is adsorbed on the upper surface of the peripheral surface member (frame member) constituting the lower mold and the mold surface of the cavity. Next, a resin material made of a thermosetting resin is supplied to the cavity. The resin material is heated and melted to produce a fluid resin. Next, the upper mold and the lower mold are combined to immerse the chip mounted on the substrate in the fluid resin. A predetermined resin pressure is applied to the fluid resin by the bottom member, and the fluid resin is cured to form a cured resin. As a result, the chip mounted on the substrate is resin-sealed with the cured resin.

When the releasing film is coated on the lower mold and adsorbed, an appropriate tensile force (tension, tension) is applied to the releasing film to prevent wrinkles or relaxation. However, depending on the depth of the cavity or the flexibility of the release film, wrinkles or loosening may occur in the release film and may not completely adhere to the mold surface of the lower mold. When resin sealing is performed in a state where the release film is wrinkled, the wrinkles are transferred to the resin-sealed molded article. When the wrinkles are transferred to the molded article, it may be difficult to release the molded article. Further, there is a fear that the quality of the molded product may be defective. Therefore, it is important to optimize the shape and depth of the adsorption grooves for adsorbing the release film so as not to cause wrinkles or looseness in correspondence with the depth of the cavity, the flexibility of the release film, and the like.

The present invention relates to a small-size resin-sealing-type mold which does not cause wrinkles or looseness in the release film, and which has a good yield of a molded article, and which is characterized in that the following are provided: " a lower mold having a film suction hole disposed on a joint surface provided around the opened cavity, A pressing member having a pressing surface which is composed of a releasing film which adsorbs and holds an edge at the film suction hole and which is opposed to the joining face of the lower metal mold and which presses the outer peripheral edge of the releasing film against the joining face of the lower metal mold, And a ring-shaped protruding portion that is one step higher than the bonding surface is provided between the cavity and the bonding surface "(see, for example, paragraph [0006] of Patent Document 1, FIG. 4, 15).

Patent Document 1: JP-A-2015-82607

However, according to the resin-sealing mold disclosed in Patent Document 1, the following problems arise. If the release film to be used is made of a material having some degree of softness, tension can be applied to the release film by the annular protrusion, thereby preventing occurrence of wrinkles and relaxation. When the release film is made of a material having a certain degree of hardness, there is a fear that a gap is generated between the release film and the cavity due to the presence of the annular protrusion, and the release film can not be brought into close contact with the cavity.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a resin molding apparatus, a resin molding method, and a molding die capable of resin sealing without causing wrinkles or relaxation in the release film.

In order to solve the above problems, a resin molding apparatus according to the present invention comprises:

A mold having at least a first mold and a second mold opposite to the first mold, a cavity provided on a top surface of at least one of the first mold and the second mold, And a mold releasing mechanism for releasably engaging the molding die, wherein a functional film is adsorbed along a mold surface of the cavity, and a fluid resin, which is generated from the resin material and exists in the cavity, A resin molding apparatus for use in manufacturing a molded article comprising a cured resin formed by curing in a state where a mold is coupled,

An annular outer peripheral suction groove formed on a top surface of an outer peripheral portion of the cavity,

A plurality of outer circumferential through passages extending through the one outer circumferential suction groove,

A plurality of main necks provided on an inner side of the outer peripheral suction groove so as to surround the cavity on a top surface of the outer peripheral portion,

A plurality of main members to be fitted and detached with respect to each of the plurality of main necks,

A plurality of main adsorption grooves formed on top surfaces of the plurality of main members,

A plurality of main passages respectively penetrating the one die through each of the plurality of main adsorption grooves,

An opening formed in a mold surface of the cavity,

And a through-hole for cavity passing through the one opening,

And,

The functional film is adsorbed on the inner surface of the outer circumferential absorption groove through the outer circumferential absorption grooves and the plurality of outer circumferential through passages,

Through the plurality of main adsorption grooves and the plurality of main passages, the functional film is adsorbed on the inner surface of the plurality of main adsorption grooves,

Through the opening and the through passage for the cavity, the functional film is adsorbed along the mold surface of the cavity

.

In the resin molding apparatus according to the present invention,

A plurality of sub concave portions provided between the plurality of main neck portions on a top surface of the outer peripheral portion,

A plurality of auxiliary members to be fitted and detached relative to each of the plurality of auxiliary recess portions,

A plurality of negative adsorption grooves respectively formed on the top surfaces of the plurality of subsidiary members,

And a plurality of auxiliary pipe passages respectively connected to the plurality of negative adsorption grooves and penetrating the one die,

And,

The functional film is adsorbed on the inner surface of the plurality of negative adsorption grooves through the plurality of negative adsorption grooves and the plurality of secondary passages,

.

In the resin molding apparatus according to the present invention,

The plurality of negative adsorption grooves have a line segment shape or a curved line shape when viewed in a plan view.

.

In the resin molding apparatus according to the present invention,

The plane shape of the cavity is rectangular,

Wherein the plurality of main adsorption grooves are formed in parallel with a first side of the cavity and a second side adjacent to the first side,

.

In the resin molding apparatus according to the present invention,

In the functional film, the elements of the functional surface contacting the fluid resin are transferred to the surface of the cured resin,

.

In the resin molding apparatus according to the present invention,

The invention has at least one of the following inventive particulars:

.

The plurality of main adsorption grooves have a sectional shape in which the sides of the plurality of main passage are narrowed.

The plurality of secondary adsorption grooves have a sectional shape in which the side of the plurality of secondary passages is narrowed.

In the resin molding apparatus according to the present invention,

The invention has at least one of the following inventive particulars:

.

The plurality of main adsorption grooves have an inclination that is different between an inner side surface near the cavity and an inner surface farther from the cavity.

The plurality of vacuum adsorption grooves have a slope in which an inner surface on the side close to the cavity and an inner surface on the side far from the cavity have different slopes.

In the resin molding apparatus according to the present invention,

At least in the plurality of main body portions, a plate-like member having a hole is disposed between the opposite surface of the top surface of the plurality of main members and the plurality of main body portions to communicate the main suction groove and the hole, The position of the top surface of the main member in the height direction is adjusted,

.

In the resin molding apparatus according to the present invention,

The functional film has a rectangular or circular shape or an elongated strip shape.

.

In the resin molding apparatus according to the present invention,

A material supply module for supplying at least the functional film to the cavity,

At least one molding module having at least the mold and the coupling mechanism,

And,

The one forming module can be attached to or detached from the material supplying module,

Said one molding module can be attached and detached with respect to another molding module,

.

In order to solve the above problems, a resin molding method according to the present invention comprises:

A step of supplying a functional film to a cavity provided on a top face of at least one of molds having at least a first mold and a second mold opposite to the first mold, A step of supplying a resin material to the cavity; a step of forming a cured resin by curing the fluid resin generated in the resin material and present in the cavity in a state where the mold is coupled; A step of opening the mold, and a step of taking out a molded article containing the cured resin,

Wherein the step of adsorbing the functional film comprises the steps of:

.

An annular outer circumferential suction groove formed on a top surface of an outer circumferential portion composed of an outer portion of the cavity; and a plurality of outer circumferential through passages continuing to the outer circumferential suction groove and passing through the one die.

A step of preparing a plurality of main parts provided on the inner side of the outer peripheral suction groove so as to surround the cavity on the top surface of the outer peripheral part and a plurality of main parts to be fitted and detached with respect to each of the plurality of main parts.

A step of preparing a plurality of main adsorption grooves respectively formed on the top surfaces of the plurality of main members.

A step of preparing a plurality of main passages respectively passing through the one die through the plurality of main adsorption grooves respectively.

A step of preparing an opening formed in the mold surface of the cavity and a cavity-penetrating path leading to the opening and passing through one mold;

The step of softening the functional film by heating the functional film supplied to the top surface of the one mold.

The step of adsorbing the functional film on the inner surface of the outer circumferential absorption groove by using the annular outer circumferential absorption grooves and the plurality of outer circumferential penetration passages.

The step of adsorbing the functional film on the inner surface of the plurality of main adsorption grooves using the plurality of main adsorption grooves and the plurality of main passage.

The step of adsorbing the functional film on the mold surface of the cavity using the opening and the passage for cavity.

The process of joining the mold.

In the resin molding method according to the present invention,

Wherein the step of adsorbing the functional film further comprises the following step:

.

A step of preparing a plurality of sub-recesses provided between the plurality of main necks on the top surface of the outer peripheral portion; and a plurality of sub-materials sandwiching the sub-recesses so as to be detachable with respect to each of the plurality of sub-recesses.

A step of preparing a plurality of vacuum adsorption grooves respectively formed on the top surfaces of the plurality of subsidiary members.

A step of preparing a plurality of auxiliary pipe passages which respectively communicate with the plurality of negative adsorption grooves and pass through one die respectively.

A step of adsorbing the functional film on the inner surface of the plurality of adhering grooves by using the plurality of adhering grooves and the plurality of adhering channels.

In the resin molding method according to the present invention,

.

In the resin molding method according to the present invention,

The plane shape of the cavity is rectangular,

.

In the resin molding method according to the present invention,

In the step of forming the cured resin, an element of the functional surface in contact with the fluid resin in the functional film is transferred to the surface of the cured resin,

.

In the resin molding method according to the present invention,

The invention has at least one of the following inventive particulars:

.

In the resin molding method according to the present invention,

The invention has at least one of the following inventive particulars:

.

The plurality of vacuum adsorption grooves have a slope that is different between an inner surface on a side close to the cavity and an inner surface farther from the cavity.

In the resin molding method according to the present invention,

At least in the plurality of main body portions, a plate-like member having a hole is disposed between the opposite surface of the top surface of the plurality of main members and the plurality of main body portions to communicate the main suction groove and the hole, And a step of adjusting the position of the top surface of the main member in the height direction,

.

In the resin molding method according to the present invention,

.

In the resin molding method according to the present invention,

Preparing a material supply module for supplying at least the functional film to the cavity;

Preparing at least one molding module having at least the molding die and the die coupling mechanism

/ RTI >

The molding module can be detachably attached to the material supply module,

The one molding module can be attached and detached with respect to another molding module.

.

In order to solve the above problems, the mold according to the present invention comprises:

A first type for adsorbing a functional film using at least an outer adsorption groove and a main adsorption groove, and a second type facing the first type, wherein at least one of the first type and the second type A functional film is adsorbed along a mold surface of the cavity, and a fluid resin, which is generated from the resin material and is present in the cavity, is adhered to the mold, Which is used for producing a molded article comprising a cured resin formed by curing the composition,

An opening formed in a mold surface of the cavity,

And a through-hole for cavity passing through the one opening,

And,

The functional film is adsorbed on the inner surface of the outer suction groove through the outer suction groove and the plurality of outer peripheral through passages,

.

In the molding die according to the present invention,

And,

.

According to the present invention, an annular outer circumferential suction groove is formed on the top face of the outer peripheral portion formed of the outer portion of the cavity, and a plurality of main recess portions are provided on the inner side of the outer peripheral suction groove so as to surround the cavity. The main body is fitted so as to be detachable from the main body part, and the main suction groove is formed on the top face of the main body. The functional film is adsorbed on the inner surfaces of the plurality of main adsorption grooves formed inside the annular outer adsorption grooves in a state where the functional film is adsorbed on the inner surface of the annular outer adsorption grooves. The functional film is adsorbed along the mold surface of the cavity in a state in which the functional film is adsorbed to the inner surface of the plurality of main adsorption grooves. Uniform tensile force is applied to the functional film, so that generation of wrinkles and relaxation in the functional film is suppressed.

Fig. 1 (a) is a front view showing a configuration of a molding module in a resin molding apparatus according to Embodiment 1 of the present invention, and Fig. 1 (b) is a schematic partial sectional view showing a molding die in a molding module.
Fig. 2 (a) is a plan view showing the configuration of a lower mold used in the resin molding apparatus according to Embodiment 1 of the present invention, and Fig. 2 (b) is a sectional view taken along the line AA in Fig.
Fig. 3 (a) is a plan view showing the configuration of a lower mold used in the resin molding apparatus according to Embodiment 2 of the present invention, and Fig. 3 (b) is a sectional view taken along the line BB of Fig.
4 (a) to 4 (c) are plan views respectively showing corner grooves formed in the corner portion in the lower mold shown in Fig. 3;
Fig. 5 is a schematic partial cross-sectional view showing a state where the resin molding method according to the third embodiment of the present invention is opened; Fig. 5 (b) is a sectional view showing a state where the substrate is mounted on the upper mold, Sectional view showing a state in which the release film is adsorbed to the adsorption groove.
Fig. 6 is a schematic partial sectional view showing a state in which a release film is adsorbed to an inner circumferential groove in a resin molding method according to Embodiment 3 of the present invention, Fig. 6 (b) Fig.
Fig. 7 is a schematic partial cross-sectional view showing a state in which a granule resin is fed to a cavity in a resin molding method according to Embodiment 3 of the present invention, and Fig. 7 (b) Fig.
(A) is a schematic partial sectional view showing a state in which a cured resin is produced by raising and pressing the bottom member, (b) is a schematic sectional view showing a state in which the release film Sectional view showing a state in which the molded article is taken out.
9 is a plan view showing an outline of a resin molding apparatus according to Embodiment 4 of the present invention.

As shown in Fig. 2, the lower die 11 is constituted by a peripheral member 9 and a bottom member 10. The outer peripheral suction groove 16 is formed along the outer periphery of the peripheral member 9. [ The release film 15 covered with the lower mold 11 is sucked into the outer suction groove 16 to fix the release film 15 to the lower mold 11. [ A plurality of main body portions (18) are formed inside the outer peripheral suction grooves (16). A main body member (21) for assembly having a main suction groove (20) is mounted on a plurality of main body parts (18). The cross section of the main adsorption groove 20 is formed such that the opening has a wide V-shape. The release film 15 is adsorbed in the main adsorption groove 20 in a state in which the release film 15 is adsorbed on the inner surface of the annular outer suction groove 16. As a result, a uniform tension is applied to the release film 15. The release film 15 is adsorbed along the mold surface of the cavity 13 in a state in which the release film 15 is adsorbed on the inner surfaces of the plurality of main adsorption grooves 20. [ Therefore, it is possible to prevent the release film 15 from being wrinkled or loosened. The main adsorption groove 20 having a sectional shape and depth corresponding to the characteristics of the release film 15 can be applied by replacing the main member 21 on which the main adsorption groove 20 is formed.

(Example 1)

The configuration of the molding module 2 included in the resin molding apparatus 1 according to the first embodiment of the present invention will be described with reference to Fig. All drawings in the present application are schematically illustrated by being omitted or exaggerated appropriately in order to facilitate understanding. The same constituent elements are denoted by the same reference numerals and the description thereof is appropriately omitted.

As shown in Fig. 1 (a), in the resin molding apparatus 1, the molding module 2 has a lower base 3. Four tie bars 4, which are support members, are fixed to the four corners of the lower base 3. An upper base 5 facing the lower base 3 is fixed to an upper portion of four tie bars 4 extending toward the upper side. Between the lower base 3 and the upper base 5, the lift bar 6 facing each of the lower base 3 and the upper base 5 is sandwiched by the four tie bars 4. On the upper side of the lower base 3, a type engaging mechanism 7 is fixed. Type coupling mechanism 7 is a mechanism for moving the lifting and lowering unit 6 up and down in order to engage and open. The lifting and lowering plate 6 is raised or lowered by the type engaging mechanism 7.

The upper die (8) is fixed to the lower surface of the upper base (5). Immediately below the upper die 8, a frame-like peripheral member 9 facing the upper die 8 is provided. The upper surface of the circumferential surface member 9 is opposed to the lower surface of the upper mold 8. At the center of the circumferential surface member 9, a rectangular through-hole is formed when viewed in plan view. A bottom surface member 10 having a rectangular planar shape is fitted to the through hole of the circumferential surface member 9. In the through hole of the circumferential surface member 9, the bottom surface member 10 can move relative to the circumferential surface member 9. The circumferential surface member 9 and the bottom surface member are collectively driven up and down by the type-joining mechanism 7 (specifically, the elevating and lowering plate 6).

The circumferential surface member 9 and the bottom surface member 10 constitute a lower mold 11 together. The upper mold 8 and the lower mold 11 constitute a pair of molding dies 12 (hereinafter simply referred to as " molding dies 12 "). The upper mold 8 and the lower mold 11 are provided with a heater (not shown).

As shown in Fig. 1 (b), on the upper surface of the lower mold 11, a cavity 13 formed of a space to which a resin material is supplied is formed. The cavity 13 has a rectangular planar shape with long sides and short sides. The portion surrounding the cavity 13 is referred to as " cavity side ", and the portion constituting the bottom of the cavity 13 is referred to as " inner bottom of cavity ". The side surface of the cavity 13 is constituted by the inner circumferential surface of the circumferential surface member 9. The inner bottom surface of the cavity 13 is constituted by the top surface (upper surface in the figure) of the bottom surface member 10. The cavity 13 is a space surrounded by the inner circumferential surface of the circumferential surface member 9 and the steep surface of the bottom surface member 10.

As shown in Fig. 1 (a), a bottom surface member 10 and a plurality of elastic members (coil springs, disc springs, etc.) 14 are fixed to the upper surface of the lifting and lowering table 6. A circumferential surface member (9) is disposed on the plurality of elastic members (14). The lower mold 11 (the peripheral face member 9 and the bottom face member 10) is raised and lowered by the lifting and lowering plate 6 being lifted and lowered by the lifting and lowering mechanism 7. A plurality of elastic members (not shown) may be provided between the bottom member 10 and the lifting and lowering unit 6. [

2, the structure of the lower die 11 used in the resin molding apparatus 1 according to the first embodiment of the present invention will be described. The lower die 11 is constituted by a peripheral surface member 9 and a bottom surface member 10. And the bottom surface member 10 is fitted into the through hole of the circumferential surface member 9. The space surrounded by the inner circumferential surface of the circumferential surface member 9 and the inner bottom surface of the bottom surface member 10 becomes the cavity 13. [ A release film 15, which is a kind of a functional film, is supplied to the upper side of the lower mold 11, and the lower mold 11 is covered with the release film 15. The functional surface FS made of the surface in contact with the fluid resin in the release film 15 has low adhesion to the cured resin molded in the cavity 13. The release film 15 is heated by a heater (not shown), so that the release film 15 is softened and stretched. In other words, the properties such as flexibility and stretchability of the release film 15 change by being heated.

As the release film 15, a resin material having properties such as heat resistance, releasability, flexibility, and elongation is used. For example, PTFE, ETFE, PET, FEP, polypropylene, polystyrene, polyvinylidene chloride and the like are used depending on the use. The characteristics of the release film 15 vary depending on the material. As the release film 15, either a release film cut into a rectangular shape or an elongated strip-shaped (roll-shaped) release film supplied continuously from the film supply reel to the film take-up reel is used.

2 (a), the outer circumferential absorption groove 16 having an annular planar shape closed in plan view so as to surround the cavity 13 along the outer periphery of the peripheral member 9, . The outer peripheral suction groove 16 is a suction groove for holding the release film 15 on the upper surface (top surface) of the peripheral surface member 9 by suction. The outer peripheral suction grooves 16 having an annular planar shape may be continuous or may be interrupted at one point or at a plurality of points.

The outer peripheral suction groove 16 has a predetermined width, a predetermined depth, and a predetermined cross-sectional shape. In Fig. 2, for example, the inner side surface of the outer peripheral suction groove 16 is formed to be vertical. A plurality of outer circumferential through passages (17) for adsorbing and fixing the release film (15) are formed in the outer circumferential absorption grooves (16) at regular intervals. The outer circumferential passage 17 passes through the circumferential surface member 9 from the surface of the outer circumferential suction groove 16.

As shown in Fig. 2 (b), in the peripheral member 9, a plurality of divided main body portions 18 are formed inside the outer peripheral suction groove 16. A plurality of main passages (19) penetrating the circumferential surface member (9) are formed from the bottom surface of the plurality of main neck portions (18). A plurality of main body portions (18) are fitted with main body members (21) for assembly each having a main suction groove (20). Each main adsorption groove 20 is an adsorption groove for adsorbing the release film 15 adsorbed to the outer adsorption groove 16 and applying a tensile force to the release film 15.

A plurality of main adsorption furnaces 22 for passing the main member 21 from the surface of the main adsorption groove 20 and adsorbing the release film 15 to apply the tension are arranged at regular intervals . The plurality of main adsorption paths 22 communicate with the respective main passage 19 formed in the peripheral surface member 9 in a state in which the main members 21 are mounted on the respective main body portions 18. The inner diameter of the main passage 19 formed in the peripheral member 9 is formed to be larger than the inner diameter of the main adsorption furnace 22 formed in the main member 21. [ In the circumferential surface member 9, a suction passage is formed from the surface of the main adsorption groove 20 via the main adsorption path 22 and the main path 19. In other words, each main adsorption furnace 22 formed in the main member 21 communicates with each of the main passages 19 formed in the peripheral member 9, .

The main adsorption grooves 20 are previously formed in the main member 21 for assembly. Each of the main members 21 is fitted and attached to a plurality of main neck portions 18 formed in the peripheral surface member 9 to thereby constitute an aggregate of the main suction grooves 20 surrounding the periphery of the cavity 13. [ The number of the main body portions 18 divided in the circumferential surface member 9 (in other words, the number of the main members 21 for assembly or the number of the main adsorption grooves 20) The characteristics of the release film 15, and the like.

For example, in the peripheral member 9, a main body portion 18 for long displacement is formed in parallel adjacent to the long side of the cavity 13. The long neck 18 is shown as two opposed main necks 18 extending in the vertical direction in Fig. 2 (a). A long main part 21 for long displacement is mounted on the main part 18 of these long sides. A main adsorption groove 20 along a long side direction is previously formed in the main member 21 for a long time. Likewise, a main body portion 18 for a short side is formed parallel to the short side of the cavity 13. The main body portion 18 for short-side use is shown as two facing main body portions 18 extending in the left-right direction in Fig. 2 (a). A short-length main member 21 is mounted on the short-neck portion 18 for short-circuiting. A main adsorption groove 20 along a short side direction is previously formed in the main member 21 for short change.

The main adsorption grooves 20 have a predetermined width, a predetermined depth and a predetermined cross-sectional shape. In Fig. 2, the cross section of the main adsorption groove 20 is formed in a V-shape so that the inner side faces thereof are inclined. By forming the opening of the main adsorption groove 20 broadly, the release film 15 can be stably adsorbed in the main adsorption groove 20. Regarding the inner surface of the main adsorption groove 20, at least one of the inner surfaces may be inclined. The main adsorption groove 20 may be directly connected to the main passage 19 to form the shape of the main adsorption groove 20. In this case, it is not necessary to provide the main adsorption furnace 22. The mode in which the main adsorption groove 20 and the main passage 19 communicate with each other includes an embodiment in which the main adsorption groove 20 and the main passage 19 are in direct communication with each other and the mode in which the main adsorption groove 20 and the main passage 19 And the mode of communicating through the main adsorption furnace 22 are included.

As shown in Fig. 2 (b), the bottom surface member 10 is fitted into the through hole 23 of the peripheral surface member 9. A small clearance is formed between the inner circumferential surface of the circumferential surface member 9 and the side surface of the bottom surface member 10. By forming this clearance, the bottom member 10 can be moved up and down in the through hole 23 of the peripheral member 9. [ The bottom member 10 is provided with a plurality of cavity passages 24 for adsorbing the release film 15 along the mold surface of the cavity 13. [ A plurality of through passages 24 for the cavities are formed from the side face of the bottom face member 10 toward the bottom face. The plurality of cavity passages (24) form openings (A) on side surfaces of the bottom member (10). The cavity 13 communicates with the outer space of the lower mold 11 via the opening A and the cavity through passageway 24 leading to the opening A. [ In Fig. 2, a plurality of through passages 24 for cavities are formed in the bottom surface member 10. The present invention is not limited to this, and a plurality of through-passages for cavities 24 may be formed in the peripheral member 9. [

The process of adsorbing the release film 15 on the mold surface of the lower mold 11 will be described. First, the vicinity of the outer peripheral portion of the release film 15, which has started to be softened by heating, is adsorbed on the inner side surface of the outer peripheral suction groove 16. Next, the release film 15, which is adsorbed in the vicinity of the outer circumferential portion and subsequently softened and expanded, is adsorbed on the inner side of the main adsorption groove 20 from the inner side than the vicinity of the outer circumferential portion. Next, the vicinity of the central portion of the mold release film 15, which is adsorbed in the vicinity of the outer circumferential portion and around the outer circumferential portion and subsequently softened and expanded, is adsorbed to the mold surface of the cavity 13 by the opening A. The release film 15 is adsorbed on the mold surface of the cavity 13 by the above steps.

Hereinafter, the resin sealing is performed by the next step. First, the resin material is supplied to the cavity 13 (more precisely, in the space surrounded by the release film 15 adsorbed to the cavity surface of the cavity 13). Next, the upper mold 8 and the lower mold 11 are joined after the resin material is heated and melted to produce a molten resin (fluid resin). As a result, the chip mounted on the substrate previously adsorbed on the lower surface of the upper die 8 is immersed in the molten resin. Next, the molten resin is cured to produce a cured resin. Next, the upper mold 8 and the lower mold 11 are opened to take out the molded article having the substrate, the chip and the cured resin.

First, the cross section of the main adsorption groove 20 is formed in a V-shape so that the width of the opening of the main adsorption groove 20 is widened. As a result, the release film 15 is formed in the main adsorption groove 20 It can be stably adsorbed to the inner surface. This makes it possible to apply a uniform tension to the release film 15, thereby preventing the release film 15 from being wrinkled or loosened.

Second, each main adsorption groove 20 is formed in each main member 21, and each main member 21 is mounted on the peripheral member 9 as one constituent unit. The cross-sectional shape and depth of the main adsorption grooves 20 can be changed by replacing the respective main members 21. Therefore, it is possible to optimize the cross-sectional shape and depth of the main adsorption groove 20 in accordance with the characteristics of the release film 15, for example, flexibility, stretchability, etc. of the release film 15. [ If the release film 15 is made of a soft material, a deep main adsorption groove 20 can be applied. If the release film 15 is a rigid material, the shallow main adsorption grooves 20 can be applied. The main adsorption grooves 20 corresponding to the release films 15 having various characteristics can be applied by replacing the main members 21 on which the main adsorption grooves 20 are formed. Therefore, since it is not necessary to produce a new circumferential surface member 9 corresponding to the characteristics of the release film 15, the lower mold 11 can be efficiently used. In addition, the cost of manufacturing the lower die 11 can be reduced.

The term " mold surface of the cavity 13 " means a surface constituting the cavity 13, which is a space in which the fluid resin exists, and is not limited to the mold surface of the mold 12. The term " the mold surface of the cavity 13 " includes a surface where the gap between the members constituting the mold 12 is in contact with the cavity 13 as a space.

In this embodiment, the depth of the main body portion 18 and the height of the main member 21 are set to the same size so that the upper surface of the main member for assembly 21 and the upper surface of the peripheral member 9 are aligned. The depth of the main body portion 18 is made larger than the height of the main member 21 so that the upper surface of the main member 21 can be made lower than the upper surface of the peripheral member 9. [ A thin member having a through hole corresponding to the main passage 19 may be disposed as a spacer between the inner bottom surface of the main body portion 18 and the lower surface of the main member 21. [ Thus, the height position of the upper surface of the main member 21 and the upper surface of the peripheral member 9 can be adjusted. By making the upper surface of the main member 21 lower than the upper surface of the peripheral member 9, the release film 15 can be more stably attracted to the main adsorption groove 20. Therefore, a more uniform tension can be applied to the release film 15.

In the present embodiment, a plurality of main body portions 18 are formed on the peripheral surface member 9, and the main body members 21 for assembly are mounted on the respective main body portions 18, respectively. The present invention is not limited thereto and a plurality of through holes may be formed in the peripheral surface member 9 instead of the plurality of main body portions 18 so that the main body members 21 for assembling can be fitted to the respective through holes. In this case, it is not necessary to form a plurality of main passages 19 in the circumferential surface member 9, and a plurality of main adsorption paths 22 formed in the main adsorption grooves 20 are formed in the circumferential surface member 9 As shown in Fig.

(Example 2)

3, the structure of the lower die 11 used in the resin molding apparatus 1 according to the second embodiment of the present invention will be described. The lower mold 11 shown in Fig. 2 is different from the lower mold 11 shown in Fig. 2 in that a corner groove (negative suction groove) is additionally formed in addition to the main adsorption groove 20. The other constitution is the same as that of the lower die 11 shown in Fig. 2, and a description thereof will be omitted.

As shown in Fig. 3 (a), the circumferential surface member 9 is provided at its four corners with a concave portion 25, which is a concave portion for the corners (corners) of the cavity 13, respectively. The sub-concave portion 25 is fitted with an assembling member 27 having corner grooves (sub-absorption grooves) 26, respectively. In Fig. 3, a corner groove 26 having a linear shape is formed in advance in the abutting member 27, which is a member for a corner. The corner groove 26 is a suction groove for applying tension to the release film 15. The corner groove 26 has a predetermined plane shape, a predetermined width, a predetermined depth, and a predetermined cross-sectional shape. Like the main adsorption grooves 20, the corner grooves 26 are formed in a V-shape so that the inner side faces are inclined. In the corner groove 26, one or a plurality of suction holes (auxiliary passage) 28 for sucking the release film 15 to apply the tension is formed. The suction hole (auxiliary passage) 28 formed in the corner groove 26 communicates with each of the main passage 19 formed in the peripheral member 9 and serves as a suction passage in the peripheral member 9 Function. By forming the corner grooves 26 in addition to the main adsorption grooves 20, it is possible to prevent the release film 15 from adhering to the release film 15 in the vicinity of the four sides of the cavity 13 in the release film 15, A more uniform tensile force can be applied. Therefore, it is possible to further prevent the release film 15 from being wrinkled or loosened.

According to this embodiment, a plurality of main adsorption grooves 20 and a plurality of corner grooves 26 are formed in the peripheral surface member 9 to apply tension to the release film 15. [ This makes it possible to prevent the release film 15 from being wrinkled or loosened. The corner groove 26 can change the plane shape, sectional shape, depth, and the like of the corner groove 26 by replacing the corner member 27 for the corner, as in the case of the main adsorption groove 20. Therefore, the planar shape, sectional shape, depth, etc. of the corner groove 26 can be optimized in accordance with the flexibility, stretchability, and the like of the release film 15. If the release film 15 is made of a soft material, a deep corner groove 26 can be applied. If the release film 15 is a rigid material, the shallow corner groove 26 can be applied. The corner grooves 26 corresponding to the various release films 15 can be applied by replacing the respective subsidiary members 27 in which the corner grooves 26 are formed. Therefore, it is not necessary to fabricate a new circumferential surface member 9 corresponding to the characteristics of the release film 15, so that the lower mold 11 can be efficiently used. In addition, the cost of manufacturing the lower die 11 can be reduced.

4 (a) to 4 (c) show the planar shapes of the corner grooves 26 formed in the peripheral surface member 9, respectively. Fig. 4 (a) shows a straight line segment type corner groove 26 shown in Fig. The corner grooves 26 are formed in a V-shape so that the inner side faces are inclined. As shown in Fig. 3, the linear corner grooves 26 have an inclination of 45 degrees with respect to the long side and the short side of the cavity 13. The linear corner grooves 26 are formed at the four corners of the circumferential surface member 9 such that the vertical bisector thereof faces the corners (corners) of the cavity 13. In the corner groove 26, one or a plurality of suction holes 28 are formed. By forming the corner grooves 26 in the peripheral surface member 9, a uniform tension can be applied to the release film 15 along the direction perpendicular to the corner grooves 26 passing through the corners of the cavity 13 . Means that the vertical bisector of the rectangle corner groove 26 is directed to the corner of the cavity 13 includes a case where the vertical bisector is directed in the vicinity of the corner of the cavity 13. [

4 (b), the arc-shaped corner groove 29 is formed so that the center of the circle including the arc is located on the corner side of the cavity 13, and also the center of the circle and a circle In the vicinity of the corner or the corner of the cavity 13, as shown in Fig. The corner groove 29 is formed in a V-shape so that its inner side surface is inclined. In the corner groove 29, one or a plurality of suction holes 30 are formed. The release film 15 passes through the corners of the cavity 13 and is directed along the direction toward the midpoint of each corner groove 29 due to the positional relationship between the arc-shaped corner groove 29 and the corner of the cavity 13, A uniform tension can be applied.

4C shows a state in which a plurality of arc-shaped corner grooves 31 and 32 are formed such that the corner groove 31 is farther from the corner of the cavity 13 and the corner groove 32 is near the corner. Respectively. The corner grooves 31 and 32 are formed in such a manner that the center of the circle including these arcs is positioned on the corner side of the cavity 13 and the line connecting the center of these arcs with the center of the circle including these arcs, And passes near the corners or corners of the substrate 13. The corner grooves 31 and 32 are formed in a V-shape so that the inner surfaces of the corner grooves 31 and 32 are inclined. One or a plurality of suction holes 33 are formed in the corner grooves 31, 32, respectively. The direction passing through each corner of the cavity 13 and toward the middle point of each of the corner grooves 31 and 32 is defined as the center of the cavity 13 due to the positional relationship between the plurality of arcuate corner grooves 31 and 32 and the corner of the cavity 13 Therefore, even more uniform tension can be applied to the release film 15. Each of the suction holes 28, 30 and 33 shown in Figs. 4A to 4C is connected to each of the main passage 19 formed in the circumferential surface member 9 shown in Fig. 3 , And functions as a suction passage in the peripheral member (9).

(Example 3)

With reference to Figs. 5 to 8, a step of resin-sealing the substrate in the resin molding method according to the third embodiment of the present invention will be described. As the lower die 11, a lower die 11 having a corner groove 26 shown in Fig. 3 is used. The upper mold 8 and the lower mold 11 are first opened as shown in Fig. 5 (a). The upper die 8 is provided with a substrate mounting portion 34 for mounting a substrate thereon. Next, the substrate 36 on which the semiconductor chip 35 is mounted is transported to a predetermined position between the upper die 8 and the lower die 11 by using a substrate transport mechanism (not shown). Next, the substrate 36 is lifted and the substrate 36 is fixed to the substrate mounting portion 34 provided on the upper die 8 by suction or clamping. The substrate 36 is fixed to the lower surface of the upper die 8 such that the main surface on which the semiconductor chip 35 is mounted faces downward.

The main adsorption passage 22 and the main passage 19 formed in the main adsorption groove 20 and the main passage 19 formed in the corner groove 26 formed in the outer adsorption groove 16 The suction passage 28 and the main passage 19 (see FIG. 3B), the through hole 23 and the cavity passage 24 formed in the bottom member 10 are respectively connected to the suction pipe 37, For example, a vacuum pump 38 as a suction mechanism. An opening / closing valve (not shown) is provided in each of the three lines of suction pipe 37. As the suction mechanism, a decompression tank connected to the vacuum pump may be used.

Next, as shown in Fig. 5 (b), the release film 15 is supplied to the lower die 11 using a release film supply mechanism (not shown). As the release film 15, either a release film previously cut into a rectangular shape or an elongated strip-shaped release film is used. 5 (b) shows a case where the release film 15 cut into a rectangular shape is supplied to the lower die 11. Fig.

Next, an opening / closing valve (not shown) provided in a suction pipe 37a for connecting the vacuum pump 38 to each of the outer peripheral through passages 17 formed in the outer suction groove 16 in the peripheral member 9 ). As a result, the release film 15 is adsorbed on the inner surface of the outer circumferential absorption groove 16. The release film 15 coated on the lower die 11 is drawn into the outer peripheral suction groove 16 of the lower die 11 and the outer peripheral portion of the release film 15 is suctioned along the inner surface of the outer peripheral suction groove 16. As a result, the release film 15 is fixed to the upper surface of the lower die 11.

Next, as shown in Fig. 6 (a), each main adsorption passage 22 formed in the main adsorption groove 20 is connected to each of the main adsorption passages 22 formed in the circumferential surface member 9 via respective main passage 19, Closing valve (not shown) provided in the suction pipe 37b connecting the suction holes 28 (see FIG. 3 (b)) formed in the corner grooves 26 and the vacuum pump 38 are opened . Thus, the release film 15 is adsorbed on the inner surface of the main adsorption groove 20 and the inner surface of the corner groove 26. The cross section of the main adsorption groove 20 and the cross section of the corner groove 26 have a wide opening and are formed in a V-shape. As a result, the release film 15 can be stably attracted to the inner surface of each main adsorption groove 20 and the inner surface of the corner groove 26. As a result, a uniform tensile force is applied to the release film 15, thereby preventing the release film 15 from being wrinkled or loosened. Since the corner grooves 26 are formed in addition to the main adsorption grooves 20, a more uniform tensile force can be applied to the release film 15.

Next, as shown in Fig. 6 (b), a suction pipe 37c for connecting the through-hole 23 and the cavity passage 24 formed in the bottom member 10 with the vacuum pump 38, Closing valve (not shown) provided in the main body is opened. Thus, the release film 15 is adsorbed along the mold surface of the cavity 13. The gap formed between the inner circumferential surface of the circumferential surface member 9 and the side surface of the bottom surface member 10 in the through hole 23 and the through passageway 24 for the cavity formed in the bottom surface member 10, 15 are adsorbed along the mold surface of the cavity 13. The mold releasing film 15 is subjected to a uniform tension by the main adsorption grooves 20 and the corner grooves 26 and therefore the mold release film 15 is deformed in accordance with the shape of the cavity 13, As shown in Fig.

Next, as shown in Fig. 7A, a predetermined amount of the resin material 39 is supplied to the cavity 13 provided in the lower mold 11 by using a resin material supply mechanism (not shown). As the resin material 39, a resin such as a granule type, a powder type, a particle type, a paste type, a jelly type, or a liquid type resin at room temperature can be used. In this embodiment, a case where a granular resin (granular resin) is used as the resin material 39 will be described. 7 and 8, the illustration of the suction pipe 37 and the vacuum pump 38 is omitted.

Next, as shown in Fig. 7 (b), the granular resin 39 is heated by the heating means (not shown) provided in the upper mold 8 and the lower mold 11. [ And the granular resin 39 is melted by heating to produce the fluid resin 40. [ When the liquid type resin is supplied to the cavity 13 as the resin material 39, the liquid type resin itself corresponds to the liquid resin 40. Next, the lifting and lowering plate 6 is lifted by using the type-fitting mechanism 7 (see Fig. 1 (a)). By raising the lifting and lowering member 6, the peripheral member 9 and the bottom member 10 constituting the lower die 11 rise simultaneously. The upper surface of the circumferential surface member 9 is brought into contact with the peripheral edge of the main surface (lower surface in the figure) of the substrate 36 so that the substrate 36 is clamped. Thus, the upper die 8 and the lower die 11 are coupled. Therefore, the cavity 13 is sealed by the upper mold 8 and the lower mold 11. [ In this state, the semiconductor chip 35 is immersed in the fluid resin 40.

In the process of engaging the upper mold 8 and the lower mold 11, it is preferable to suck the inside of the cavity 13 by using a vacuum exhaust mechanism (not shown) to reduce the pressure. The air remaining in the cavity 13 and the bubbles contained in the fluid resin 40 can be discharged to the outside of the mold 12 (the upper mold 8 and the lower mold 11).

Next, as shown in Fig. 8 (a), the lifting and lowering plate 6 is further lifted by using the type-fitting mechanism 7 (see Fig. 1 (a)). The upper surface of the circumferential surface member 9 is already in close contact with the lower surface of the upper mold 8 so that only the bottom surface member 10 ascends at the through hole 23 of the circumferential surface member 9. [ In this state, the bottom member 10 pressurizes the fluid resin 40 at a predetermined pressure. And the fluid resin 40 is cured by pressing at a predetermined temperature for a predetermined time to form a cured resin 41. [ The main surface (bottom surface in the figure) of the semiconductor chip 35 and the substrate 36 mounted on the substrate 36 in the cavity 13 is resin-sealed with the cured resin 41. [

8 (b), after the molded article 42 having the substrate 36, the semiconductor chip 35, and the cured resin 41 is formed, the mold engaging mechanism 7 (also shown in Fig. 8 1 (a)) is used to lower the lower die 11. In this state, the upper die 8 and the lower die 11 are opened. Next, after the resin-sealed molded article 42 is released from the suction or clamp, the molded article 42 is taken out of the upper mold 8. The taken-out molded product 42 is accommodated in a substrate storage portion by a substrate transport mechanism (not shown). The release film 15 taken out from the lower mold 11 is discarded. The resin sealing is completed by the above steps.

Next, the molded product 42 in which the semiconductor chip 35 is resin-sealed by the cured resin 41 is disassembled as a unit corresponding to the final product. For example, one semiconductor chip 35 is included in the region. By the steps up to this point, the individualized electronic parts as final products are completed.

According to the present embodiment, firstly, the release film 15 is fixed to the upper surface of the lower die 11 along the outer peripheral suction groove 16. Next, a uniform tension is applied to the release film 15 by adsorbing the release film 15 to the main adsorption groove 20 and the corner groove 26. Next, the release film 15 is sucked to the mold surface of the cavity 13 through the gap in the through hole 23 and the cavity through-passageway 24 formed in the bottom surface member 10. Thereby, the release film 15 can be brought into close contact with the mold surface of the cavity 13 without causing wrinkles or loosening on the release film 15.

Second, by changing the main member 21 in which the main adsorption grooves 20 are formed and the subsidiary member 27 in which the corner grooves 26 are formed, the cross-sectional shapes and depths of the main adsorption grooves 20 and the corner grooves 26 Can be changed. Therefore, the cross-sectional shapes and depths of the main adsorption grooves 20 and the corner grooves 26 can be optimized in accordance with flexibility, stretchability and the like of the release film 15.

(Example 4)

A resin molding apparatus 1 according to a fourth embodiment of the present invention will be described with reference to Fig. 9 includes a substrate supply / storage module 43, three molding modules 44A, 44B, and 44C, and a material supply module 45 as constituent elements, respectively . The substrate supply and storage module 43 as a component, the forming modules 44A, 44B and 44C and the material supply module 45 can be detached from each other and exchanged with each other . For example, in a state in which the substrate supply / storage module 43 and the molding module 44A are mounted, the molding module 44B is mounted on the molding module 44A and the material supply module 45 is mounted on the molding module 44B Can be mounted.

The substrate supply / storage module 43 is provided with a pre-sealing substrate supply portion 47 for supplying the pre-sealing substrate 46, a post-sealing substrate storage portion 49 for storing the post-sealing substrate 48, A substrate arranging portion 50 for transferring the substrate 48 after the sealing and a substrate transporting mechanism 51 for transporting the substrate 48 before sealing and the substrate 46 after sealing are provided. The substrate placement section 50 moves in the Y direction within the substrate supply / storage module 43. The substrate transport mechanism 51 moves in the X direction and the Y direction within the substrate supply / storage module 43 and the respective molding modules 44A, 44B, and 44C. The predetermined position S1 is a position where the substrate transport mechanism 51 waits in a state in which it does not operate.

Each molding module 44A, 44B, 44C is provided with a molding module 2, respectively. The forming module 2 is provided with a lower mold 11 which can be elevated and an upper mold 8 (see Fig. 1) arranged so as to face the lower mold 11. Each molding module 2 has a mold engaging mechanism 7 (circular portion indicated by two-dot chain line) for engaging and releasing the upper mold 8 and the lower mold 11. [ The cavity 13 to which the release film 15 and the resin material 39 (see Fig. The lower mold 11 and the upper mold 8 may move relative to each other and be coupled and opened.

The material supply module 45 is provided with an XY table 52 and a release film supply mechanism 53 for supplying a release film 15 (see FIG. 2 (b)) on the XY table 52, A resin material feeding mechanism 55 for feeding the resin material 39 into the resin material receiving mechanism 54 and a resin material feeding mechanism 55 for feeding the resin material 39 to the mold release film 15 and the resin A material conveying mechanism 56 for conveying the material receiving mechanism 54 is provided. The X-Y table 52 moves in the X direction and the Y direction in the material supply module 45. The material transport mechanism 56 moves in the X direction and the Y direction within the material supply module 45 and the respective molding modules 44A, 44B and 44C. The predetermined position T1 is a position to wait while the X-Y table 52 is not operating. The predetermined position M1 is a position where the material transport mechanism 56 waits in a state in which it does not operate.

Referring to Fig. 9, a resin sealing process using the resin molding apparatus 1 will be described. First, in the substrate supply / storage module 43, the pre-sealing substrate 46 is sent from the pre-sealing substrate supply part 47 to the substrate arrangement part 50. [ Next, the substrate transport mechanism 51 is moved in the -Y direction from the predetermined position S1 to receive the substrate 46 before being sealed from the substrate arrangement section 50. Then, The substrate transport mechanism 51 is returned to the predetermined position S1. Next, the substrate transport mechanism 51 is moved in the + X direction to the predetermined position P1 of the forming module 44B, for example. Next, in the forming module 44B, the substrate transport mechanism 51 is moved in the -Y direction to stop at the predetermined position C1 on the lower die 11. Then, Next, the substrate conveying mechanism 51 is raised to fix the unsealed substrate 46 to the upper die 8 (see Fig. 5 (b)). The substrate transport mechanism 51 is returned to the predetermined position S1 of the substrate supply / storage module 43. [

Next, in the material supply module 45, the release film 15 disposed on the XY table 52 is cut from the release film supply mechanism 53 to a predetermined size. Next, the material transport mechanism 56 is moved in the -Y direction from the predetermined position M1, and the release film 15 is received from the XY table 52. The material transport mechanism 56 is returned to the predetermined position M1. Next, the material transport mechanism 56 is moved in the -X direction to the predetermined position P1 of the forming module 44B. Next, in the forming module 44B, the material conveying mechanism 56 is moved in the -Y direction to stop at the predetermined position C1 on the lower die 11. Next, the material transport mechanism 56 is lowered to dispose the release film 15 on the lower die 11 (see Fig. 5 (b)). The material transport mechanism 56 is returned to the predetermined position M1 of the material supply module 45. [

Next, the XY table 52 is moved in the -Y direction from the predetermined position T1, and the XY table 52 is stopped at a predetermined position below the resin material receiving mechanism 54. Then, A resin material receiving mechanism 54 is disposed on the X-Y table 52. The X-Y table 52 on which the resin material receiving mechanism 54 is disposed is moved in the + X direction to stop the resin material receiving mechanism 54 at a predetermined position below the resin material feeding mechanism 55. [ A predetermined amount of the resin material 39 (refer to FIG. 7A) is supplied from the resin material feeding mechanism 55 to the resin material receiving mechanism 54 by moving the XY table 52 in the X direction and the Y direction do. The XY table 52 on which the resin material receiving mechanism 54 is disposed is returned to the predetermined position T1.

Next, the material conveying mechanism 56 is moved in the -Y direction from the predetermined position M1, and the resin material receiving mechanism 54 disposed above the X-Y table 52 is received. The material transport mechanism 56 is returned to the predetermined position M1. Next, the material transport mechanism 56 is moved in the -X direction to the predetermined position P1 of the forming module 44B. Next, in the forming module 44B, the material conveying mechanism 56 is moved in the -Y direction to stop at the predetermined position C1 on the lower die 11. The material conveying mechanism 56 is lowered to supply the resin material 39 to the cavity 13 (see Fig. 7 (a)). The material transport mechanism 56 is returned to the predetermined position M1.

Next, in the forming module 2, the lower die 11 is lifted by the die engaging mechanism 7 to engage the upper die 8 and the lower die 11 (see Fig. 7 (b)). After the predetermined time has elapsed, the upper mold 8 and the lower mold 11 are opened (see Fig. 8 (b)). Next, the substrate transport mechanism 51 is moved from the predetermined position S1 of the substrate supply / storage module 43 to the predetermined position C1 on the lower die 11 to receive the substrate 48 after sealing. Next, the substrate transfer mechanism 51 is moved to transfer the substrate 48 after sealing with the substrate arrangement part 50. After sealing from the substrate arrangement part 50, the substrate 48 is sealed after being sealed in the substrate storage part 49. At this stage, resin sealing is completed.

In the present embodiment, three molding modules 44A, 44B, and 44C are mounted side by side in the X direction between the substrate supply / storage module 43 and the material supply module 45. [ The substrate supply / storage module 43 and the material supply module 45 may be formed as one module, and one molding module 44A may be mounted side by side in the X direction. Thus, the molding modules 44A, 44B, ... can be increased or decreased. Therefore, the configuration of the resin molding apparatus 1 can be optimized in correspondence with the production form and the production amount, so that the productivity can be improved.

In the present embodiment, the release film feeding mechanism 53 for feeding the release film 15 is provided in the material supply module 45. [ The release film feeding mechanism 53 for supplying the release film 15 can be provided as a release film supply module instead of the material supply module 45. [ In this case, a release film supply module is mounted between the molding module 44C and the material supply module 45. [ In this way, the resin molding apparatus 1 can be constructed merely by adding a release film supply module to a conventional apparatus.

In the present embodiment, the release film 15 and the resin material 39 are separately transported to the cavity 13 separately by using the material transport mechanism 56. The resin material accommodating mechanism 54 may be disposed on the release film 15 and the resin material 39 may be directly accommodated on the release film 15 in the material supply module 45 have. In this case, the release film 15 and the resin material 39 can be collectively conveyed to the cavity 13 by using the material conveying mechanism 56.

In each of the above-described embodiments, the resin molding apparatus and the resin molding method used when resin sealing the semiconductor chip have been described. The object to be resin-sealed may be a semiconductor chip such as an IC chip, a transistor chip, or an LED chip. The object to be resin-sealed may be a passive element chip such as a capacitor or an inductor, or a chip group in which a semiconductor chip and a passive element chip are mixed. Objects to be resin-sealed may include sensors, oscillators, actuators, and the like. The present invention can be applied when one or a plurality of chips mounted on a substrate such as a lead frame, a printed substrate, and a ceramic substrate is resin-sealed with a cured resin. Therefore, the present invention can also be applied to manufacturing a multi-chip package, a multi-chip module, a hybrid IC, and the like. The electronic parts manufactured in each embodiment include a high frequency signal module, a power control module, a device control module, an LED package, and the like.

In the description so far, an example of resin sealing the semiconductor chip 35 mounted on the substrate 36 has been described (see Figs. 5 to 8). The substrate 36 includes a printed substrate, a ceramic substrate, a lead frame, a semiconductor wafer, and the like. The shape of the substrate 36 may be a rectangle having a long side and a short side shown in Fig. 2 (a), or a square. The shape of the substrate 36 may be substantially circular, such as a semiconductor wafer having a notch, an orientation flat, or the like.

2 (a) shows two main neck portions 18 formed along a long side and two main neck portions 18 formed along a short side, corresponding to a rectangular substrate 36 having long sides and short sides, . It is not limited to this, and one L-shaped concave portion and one inverted L-shaped concave portion corresponding to the long side and the short side adjacent thereto may be formed. In this case, one L-shaped recess (formed on the lower left side of FIG. 2A) and one inverted L-shaped recess (formed on the right side of FIG. 2A) . The main body portion 18 shown in Fig. 2 (a) may be further divided.

Two semicircular concave portions surrounding the cavity may be formed corresponding to the substrate having a substantially circular shape. Three arc-shaped concave portions formed by dividing the circle surrounding the cavity may be formed. Four circular concave portions formed by dividing the circle surrounding the cavity may be formed.

The present invention is also applied to a resin molding apparatus or a resin molding method for molding a general resin molded article. In other words, the present invention is not limited to the case where a chip is sealed with a resin, but also applies to an optical product such as a lens, an optical module, a light guide plate, and other resin molded articles (resin articles) manufactured by resin molding technology. In other words, the present invention is also applied to the case of producing a resin molded article. The present invention is particularly effective when a demand for quality of a resin product to be produced (for example, appearance quality such as wrinkles of functional films, presence or absence of damage due to relaxation, surface smoothness, etc.) is strict.

In each of the examples, a resin material made of a thermosetting resin was used. For example, an epoxy resin, a silicone resin, or the like can be used. A resin material made of a thermoplastic resin may be used.

An example has been described in which the cavity 13 is formed in the lower mold 11 having the peripheral member 9 and the bottom member 10 as the molding die 12 to which the present invention is applied. The present invention is not limited to this, and the cavity 13 may be formed in the lower mold integrally constituted. In addition, the cavity 13 may be formed in the upper die 8, and the cavity 13 may be formed in both the upper die 8 and the lower die 11. An intermediate mold may be provided between the upper mold 8 and the lower mold 11. [ The mold surface of the intermediate mold may constitute the mold surface of the cavity 13.

As the forming die 12, the upper die 8 and the lower die 11 are opposed to each other along the vertical direction. The upper mold 8 and the lower mold 11 may be a molding die 12 facing in the horizontal direction. The upper die 8 and the lower die 11 may be a molding die 12 facing not only in the vertical direction but also in the horizontal direction.

As a resin molding method to which the present invention is applied, compression molding has been described. The resin molding method is not limited to compression molding, and injection molding and transfer molding can be employed. In the case of employing transfer molding, a configuration in which a gate (injection port of a fluid resin) is provided on the inner bottom surface of the cavity can be employed.

The release film 15 is formed on the mold surface of the lower mold 11 by using the outer suction groove 16, the main suction groove 20 and the opening A (using the corner grooves 26 depending on the embodiment) . The opening A may be formed at any portion of the mold surface constituting the cavity 13. The opening A is formed so that the release film 15 is softened and expanded by heating and the release film 15 which is softened and expanded is brought into close contact with the mold surface constituting the cavity 13 to be adsorbed.

After the cured resin 41 is formed and the mold 12 is opened, the outer suction groove 16, the main suction groove 20 and the opening A are sequentially used (in addition, (Compressed air or the like) may be sprayed on the release film 15 in the mold surface of the lower mold 11. [ As a result, the release film 15 can be reliably removed from the mold surface of the lower die 11. Two piping systems of a suction system and a spray system are connected to the piping system on the cavity side that continues to the outer suction suction groove 16, the main suction groove 20, and the opening A. If necessary, any of the piping systems of the two systems may be connected to the piping system on the cavity side using a switching valve.

As the functional film, the release film 15 has been described as an example. As shown in Fig. 8 (b), the release film 15 has a function of easily releasing the cured resin 41 from the mold surface side of the cavity 13. As the functional film other than the release film 15, a transfer film can be mentioned. The transfer film has a function of transferring an element of a functional surface made of a surface contacting the fluid resin to the surface of the cured resin. The elements of the functional surface of the transfer film are firstly formed on the functional surface. The shape includes the shape corresponding to the mirror surface, the shape of the irregularities corresponding to the checkered pattern, the shape of the irregularities corresponding to the microlens array, the shape of the irregularities corresponding to the Fresnel lens, and the like. The second element of the functional surface of the transfer film is a layer, a film or the like formed on the functional surface. The layer, film, and the like include a layer including a figure and a shape, a conductive layer, a metal foil, and the like.

The present invention is not limited to the above-described embodiments, and can be suitably combined, changed or selected as necessary within the scope of the present invention.

1: resin molding device 2: molding module
3: lower base 4: tie bar
5: upper base 6:
7: type coupling device 8: upper mold (type 1, type 2)
9: circumferential surface member 10: bottom surface member
11: Lower type (Type 2, Type 1, Type 1)
12: Molding mold 13: Cavity
14: elastic body 15: release film (functional film)
16: outer peripheral suction groove 17: outer peripheral through-
18: chuo neck 19: main passage
20: main adsorption groove 21: main component
22: main adsorption furnace 23: through-hole
24: through passage for cavity 25:
26, 29, 31, 32: corner grooves (negative adsorption grooves) 27:
28, 30, 33: suction holes (auxiliary passage) 34:
35: semiconductor chip 36: substrate
37, 37a, 37b, 38c: suction pipe 38: vacuum pump
39: Resin material 40: Fluid resin
41: Cured resin 42: Molded product
43: substrate supply / storage module 44A, 44B, 44C:
45: material supply module 46: pre-sealing substrate
47: Pre-sealing substrate supply part 48: After sealing,
49: substrate holding portion after sealing 50: substrate placing portion
51: substrate transport mechanism 52: XY table
53: release film feeding mechanism 54: resin material receiving mechanism
55: resin material feeding mechanism 56: material conveying mechanism
A: opening
C1, M1, P1, S1, T1: predetermined position FS: function surface

Claims

A mold having at least a first mold and a second mold opposite to the first mold, a cavity provided on a top surface of at least one of the first mold and the second mold, And a mold releasing mechanism for releasably engaging the molding die, wherein a functional film is adsorbed along a mold surface of the cavity, and a fluid resin, which is generated from the resin material and is present in the cavity, A resin molding apparatus for use in manufacturing a molded article comprising a cured resin formed by curing in a state where a mold is coupled,
An annular outer peripheral suction groove formed on a top surface of an outer peripheral portion of the cavity,
A plurality of outer circumferential through passages extending through the one outer circumferential suction groove,
A plurality of main necks provided on an inner side of the outer peripheral suction groove so as to surround the cavity on a top surface of the outer peripheral portion,
A plurality of main members to be fitted and detached with respect to each of the plurality of main necks,
A plurality of main adsorption grooves formed on top surfaces of the plurality of main members,
A plurality of main passages respectively penetrating the one die through each of the plurality of main adsorption grooves,
An opening formed in a mold surface of the cavity,
And a through-hole for cavity passing through the one opening,
And,
The functional film is adsorbed on the inner surface of the outer suction groove through the outer suction groove and the plurality of outer peripheral through passages,
Through the plurality of main adsorption grooves and the plurality of main passages, the functional film is adsorbed on the inner surface of the plurality of main adsorption grooves,
Wherein the functional film is adsorbed along the mold surface of the cavity through the opening and the through passage for the cavity.

The method according to claim 1,
A plurality of sub concave portions provided between the plurality of main neck portions on a top surface of the outer peripheral portion,
A plurality of auxiliary members to be fitted and detached relative to each of the plurality of auxiliary recess portions,
A plurality of negative adsorption grooves respectively formed on the top surfaces of the plurality of subsidiary members,
And a plurality of auxiliary pipe passages respectively connected to the plurality of negative adsorption grooves and penetrating the one die,
And,
Wherein the functional film is adsorbed to the inner surface of the plurality of negative adsorption grooves through the plurality of negative adsorption grooves and the plurality of secondary passages.

3. The method of claim 2,
Wherein the plurality of vacuum adsorption grooves have a line segment shape or a curved line shape when viewed from a plane.

3. The method according to claim 1 or 2,
The plane shape of the cavity is rectangular,
Wherein the plurality of main adsorption grooves are formed in parallel with a first side of the cavity and a second side adjacent to the first side, respectively.

3. The method according to claim 1 or 2,
Wherein an element of the functional surface contacting the fluid resin in the functional film is transferred onto the surface of the cured resin.

3. The method of claim 2,
And the following aspects of the invention.
(6-1) The plurality of main adsorption grooves have a sectional shape in which the sides of the plurality of main passage are narrowed.
(6-2) The plurality of negative adsorption grooves have a cross-sectional shape in which the side of the plurality of secondary passage is narrowed.

3. The method of claim 2,
And the following aspects of the invention.
(7-1) The plurality of main adsorption grooves have a slope in which an inner surface on a side close to the cavity is different from an inner surface on a side far from the cavity.
(7-2) The plurality of vacuum adsorption grooves have a slope in which an inner surface on a side close to the cavity is different from an inner surface on a side far from the cavity.

3. The method according to claim 1 or 2,
At least in the plurality of main body portions, a plate-like member having a hole is disposed between the opposite surface of the top surface of the plurality of main members and the plurality of main body portions to communicate the main suction groove and the hole, And the position of the top surface of the main member in the height direction is adjusted.

3. The method according to claim 1 or 2,
Wherein the functional film has a rectangular or circular shape or an elongated strip shape.

3. The method according to claim 1 or 2,
A material supply module for supplying at least the functional film to the cavity,
At least one molding module having at least the mold and the mold-
And,
The one forming module can be attached to or detached from the material supplying module,
And the one molding module can be attached to and detached from the other molding module.

A step of supplying a functional film to a cavity provided on a top surface of at least one of molds having at least a first mold and a molding mold having a second mold facing the first mold, A step of supplying a resin material to the cavity; and a step of forming a cured resin by curing the fluidic resin generated in the resin material and present in the cavity by a mold coupling mechanism in a state where the mold is coupled A step of opening the mold, and a step of taking out a molded article containing the cured resin,
Wherein the step of adsorbing the functional film comprises the following step.
(11-1) A process for preparing an annular outer circumferential suction groove formed on a top surface of an outer circumferential portion composed of an outer portion of the cavity, and a plurality of outer circumferential through passages continuing to the outer circumferential suction groove and passing through the one die.
(11-2) a plurality of main neck portions provided on the inner side of the outer peripheral suction grooves so as to surround the cavities on the top surface of the outer peripheral portion, and a plurality of main parts .
(11-3) A step of preparing a plurality of main adsorption grooves respectively formed on top surfaces of the plurality of main members.
(11-4) A step of preparing a plurality of main passages respectively penetrating the one die through the plurality of main adsorption grooves respectively.
(11-5) A step of preparing an opening formed in a mold surface of the cavity, and a cavity penetrating path continuing to the opening and passing through the one mold.
(11-6) A step of softening the functional film by heating the functional film supplied to the top surface of the one mold.
(11-7) The step of adsorbing the functional film on the inner surface of the outer circumferential absorption groove by using the annular outer circumferential absorption grooves and the plurality of outer circumferential penetration passages.
(11-8) The step of adsorbing the functional film on the inner surface of the plurality of main adsorption grooves using the plurality of main adsorption grooves and the plurality of main passage.
(11-9) A step of adsorbing the functional film on a mold surface of the cavity using the opening and the passage for cavity.
(11-10) A process for joining the forming die.

12. The method of claim 11,
Wherein the step of adsorbing the functional film further comprises the following step.
(12-1) a plurality of sub-recesses provided between the plurality of main necks on the top surface of the outer periphery, and a plurality of sub-materials sandwiching the sub-recesses so as to be detachable with respect to each of the plurality of sub-recesses Process.
(12-2) preparing a plurality of vacuum adsorption grooves respectively formed on top surfaces of the plurality of subsidiary members.
(12-3) A step of preparing a plurality of auxiliary pipe passages which respectively communicate with the plurality of vacuum suction grooves and pass through the one die.
(12-4) The step of adsorbing the functional film on the inner surface of the plurality of adherent grooves using the plurality of adherent grooves and the plurality of adduct passages.

13. The method of claim 12,
Wherein the plurality of vacuum adsorption grooves have a line segment shape or a curved line shape when viewed in a plan view.

13. The method according to claim 11 or 12,
The plane shape of the cavity is rectangular,
Wherein the plurality of main adsorption grooves are formed in parallel with a first side of the cavity and a second side adjacent to the first side, respectively.

13. The method according to claim 11 or 12,
Wherein in the step of forming the cured resin, an element of the functional surface in contact with the fluid resin in the functional film is transferred to the surface of the cured resin.

13. The method of claim 12,
And at least one of the following aspects of the invention.
(16-1) The plurality of main adsorption grooves have a cross-sectional shape in which the sides of the plurality of main passage are narrowed.
(16-2) The plurality of vacuum adsorption grooves have a cross-sectional shape in which the side of the plurality of secondary pipe passages is narrowed.

13. The method of claim 12,
And at least one of the following aspects of the invention.
(17-1) The plurality of main adsorption grooves have a slope in which an inner surface on a side close to the cavity and an inner surface on a side far from the cavity have different slopes.
(17-2) The plurality of vacuum adsorption grooves have a slope in which an inner surface on a side close to the cavity and an inner surface on a side far from the cavity have different slopes.

13. The method according to claim 11 or 12,
At least in the plurality of main body portions, a plate-like member having a hole is disposed between the opposite surface of the top surface of the plurality of main members and the plurality of main body portions to communicate the main suction groove and the hole, And adjusting a position in a height direction of a top surface of the main member.

13. The method according to claim 11 or 12,
Wherein the functional film has a rectangular or circular shape or an elongated strip shape.

13. The method according to claim 11 or 12,
Preparing a material supply module for supplying at least the functional film to the cavity;
Preparing at least one molding module having at least the molding die and the die coupling mechanism
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The molding module can be detachably attached to the material supply module,
And the one molding module can be attached to and detached from the other molding module.

A molding die comprising a first mold for adsorbing a functional film using at least an outer adsorption groove and a main adsorption groove, and a second mold facing the first mold, wherein at least one of the first mold and the second mold And a cavity in which a functional material is adsorbed along a mold surface of the cavity, and a fluid resin, which is generated from the resin material and is present in the cavity, In a mold for use in producing a molded article comprising a cured resin formed by curing in a bonded state,
An annular outer peripheral suction groove formed on a top surface of an outer peripheral portion of the cavity,
A plurality of outer circumferential through passages extending through the one outer circumferential suction groove,
A plurality of main necks provided on an inner side of the outer peripheral suction groove so as to surround the cavity on a top surface of the outer peripheral portion,
A plurality of main members to be fitted and detached with respect to each of the plurality of main necks,
A plurality of main adsorption grooves formed on top surfaces of the plurality of main members,
A plurality of main passages respectively penetrating the one die through each of the plurality of main adsorption grooves,
An opening formed in a mold surface of the cavity,
And a through-hole for cavity passing through the one opening,
And,
The functional film is adsorbed on the inner surface of the outer suction groove through the outer suction groove and the plurality of outer peripheral through passages,
Through the plurality of main adsorption grooves and the plurality of main passages, the functional film is adsorbed on the inner surface of the plurality of main adsorption grooves,
And the functional film is adsorbed along the mold surface of the cavity through the opening and the through passage for the cavity.

22. The method of claim 21,
A plurality of sub concave portions provided between the plurality of main neck portions on a top surface of the outer peripheral portion,
A plurality of auxiliary members to be fitted and detached relative to each of the plurality of auxiliary recess portions,
A plurality of negative adsorption grooves respectively formed on the top surfaces of the plurality of auxiliary members,
And a plurality of auxiliary pipe passages respectively connected to the plurality of negative adsorption grooves and penetrating the one die,
And,
And the functional film is adsorbed to the inner surface of the plurality of negative adsorption grooves through the plurality of adsorption grooves and the plurality of the auxiliary passage.