KR20170014224A - The compositions using conductive film - Google Patents

Abstract

The present invention relates to a composition for conductive films, a conductive film, a method for producing the conductive film, and a use thereof. More specifically, provided is a composition which enables the production of a conductive film in an economical way and ensures reduction in the number of processes as well as improved visibility. Also, provided are a conductive film, a method for producing the conductive film, and a use thereof.

Description

TECHNICAL FIELD The present invention relates to a composition for a conductive film,

The present application relates to a composition for a conductive film, a conductive film, a method for producing the conductive film, and uses thereof.

A touch screen panel (TSP) is an input device of an operating system that allows a user to easily input data by simply touching the screen (screen) with a hand or an object. The touch screen panel (TSP) (Resistive), and capacitive (Capacitive).

Among them, Resistive and Capacitive are the most widely used methods. Resistive method is to detect when a potential difference occurs at a pressed point when touching with a finger or a pen. It is a principle and it is called a decompression type.

In addition, the electrostatic capacity type uses the electrostatic capacity in the human body to sense and change the direction of the current.

An indium-tin oxide (ITO) film commonly used in the structure of the resistive film type and capacitive touch screen panel is formed by depositing a transparent conductive film made of indium tin compound, which is a metal conductive material, And a transparent electrode (electric circuit, pattern) is formed on the base substrate.

Particularly, in the capacitance type, visibility of a transparent electrode (electric circuit, pattern) becomes a problem. In order to improve the visibility, an optical control layer is formed on a lower surface of a conductive layer such as an ITO layer to minimize the reflectance of a film surface that has been etched (patterning) and a surface that is not etched .

Further, in the conductive film, in addition to the optical control layer, a layer such as a transparent undercoating layer is formed under the conductive layer to improve the adhesion and transmittance between the conductive layer and the base layer. The undercoat layer can be formed by wet coating or vacuum stuttering. However, since the steps for forming each layer need to be performed separately, the manufacturing process is complicated and the cost is high.

In addition, despite the above-mentioned efforts to improve the visibility, there is still a problem that the ITO layer may be pressed on the patterned substrate portion during the heat treatment process after the patterning of the ITO layer, thereby lowering the visibility.

Korean Patent Publication No. 2010-0134692

The present invention relates to a composition for a conductive film which is capable of producing a conductive film having improved visibility due to the bending phenomenon of a conductive film, economical efficiency due to reduction in the number of steps, improved resistance to crystallization of the conductive layer, Film and a method for producing the same.

The present application also provides a touch panel including a conductive film.

The present application is conceived to solve the above-mentioned problems, A second polymerizable compound having a lower surface energy than the first polymerizable compound; And a composition for a conductive film containing an antioxidant.

In one example, the surface energy difference between the first polymerizable compound and the second polymerizable compound may be at least 1 mN / m.

In one example, the antioxidant may include any one or more selected from the group consisting of hindered amine-based, phenol-based, thioester-based, and phosphite-based organic materials.

The composition for a conductive film of the present application may further contain inorganic particles.

The present application also discloses a film comprising a substrate film; A first polymerizable compound formed on one surface of the substrate film; A first resin layer which is a polymer of a composition comprising a second polymerizable compound having a smaller surface energy than the first polymerizable compound and an antioxidant; And a second resin layer formed on an opposite surface of the base film on which the first resin layer is formed.

In one example, the first resin layer may include an A region including a polymerization unit of the first polymerizable compound and a B region including a polymerization unit of the second polymerizable compound formed on the A region .

In one example, the A region of the first resin layer may further include inorganic particles.

In one example, the substrate film may be one selected from the group consisting of a chemical treatment, a corona discharge treatment, a mechanical treatment, an ultraviolet (UV) treatment, an active plasma treatment and a glow discharge treatment.

The conductive film of the present application may further include a conductive layer on the first resin layer to form a concave curved surface structure in the direction of the conductive layer.

The present application also relates to a process for preparing a film comprising a first polymerizable compound on a substrate film; Coating a composition comprising a second polymerizable compound having a surface energy lower than that of the first polymerizable compound and an antioxidant, and curing the first polymerizable compound to form a first resin layer.

The present application also relates to a touch panel including a conductive film.

The present application can provide a composition for a conductive film which can prevent a visibility problem due to a bending phenomenon that may be caused by heat treatment, a conductive film formed therefrom, a method for producing a conductive film, and a touch panel including the conductive film .

The present application also relates to a method for manufacturing a conductive film, a conductive film, a conductive film, and a conductive film which are economical and reduce the number of processes by forming the first hard coat layer and the undercoat layer by a single coating process It is possible to provide a touch panel.

Further, the present application is directed to a composition for a conductive film which can further promote crystallization of a conductive layer and which has a low resistance value of the conductive layer, a conductive film, a manufacturing method of the conductive film, Can be provided.

1 is a schematic diagram of a conductive film of the present application.

Hereinafter, the present application will be described in more detail by way of examples, but is merely an example limited to the gist of the present application. It will be understood by those skilled in the art that this application is not limited to the process conditions set forth in the following examples, but may be optionally selected within the scope of the conditions necessary to accomplish the object of the present application Do.

The present application relates to a composition for a conductive film.

The composition for a conductive film of the present application may contain, for example, a polymerizable compound capable of forming a phase separation structure after polymerization.

Conventional conductive films form an undercoat layer and a hard coat layer between the conductive layer and the base film in order to improve the visibility. The hard coat layer and the undercoat layer may be formed by forming a hard coat layer on a base film by a wet coating method such as gravure coating, micro gravure coating, roll coating, bar coating or dip coating, , For example, a method of forming an undercoat layer by a method such as sputtering. The process for forming the undercoat layer and the hard coat layer included in the conductive film as described above includes both wet and dry coating processes, which complicates the process, requires a large amount of processing restrictions, and requires a high cost in terms of cost .

Accordingly, the present application realizes a phase separation structure including a polymerizable compound having a predetermined surface energy difference and capable of phase separation after polymerization, thereby forming a hard coating layer and an undercoat layer by a single coating process, An economically excellent composition for a conductive film can be provided.

In addition, the composition for a conductive film of the present application can contain a predetermined amount of an antioxidant to overcome the problem of delayed crystallization of the conductive layer due to uncured compounds and various additives, and reduce the resistance value of the conductive layer .

That is, the present application may include a different polymerizable compound capable of realizing a phase separation structure in the composition for a conductive film. Further, the different polymerizable compounds may have different surface energies.

Specifically, the composition for a conductive film of the present application comprises a first polymerizable compound; A second polymerizable compound and an antioxidant. The second polymerizable compound has a smaller surface energy than the first polymerizable compound. Further, the first polymerizable compound and the second polymerizable compound can realize a phase separation structure after polymerization.

The term " polymerizable compound " in this application means a compound capable of forming a polymer by radical or ion polymerization by light, for example, UV light or heat.

The first polymerizable compound and the second polymerizable compound contained in the composition for a conductive film of the present application are polymerized by light irradiation, for example, by UV light, phase separated after polymerization and formed into a conductive film .

In one example, when the first polymerizable compound and the second polymerizable compound are polymerized, a first resin layer including a region A and a region B, which will be described later, is phase-separated with a predetermined thickness .

The term " phase separated and formed in each region " as used herein means a state in which polymers formed by polymerizing respective compounds have different physical properties and phase separated to form respective regions, for example, Of the first layer. Each of the layers formed by phase separation is a layer formed by substantially one resin and may be positioned or arranged on a layer formed by substantially different resins.

The above-mentioned " layer formed by substantially one resin " may mean that one kind of resin is continuously present in one layer without forming a sea-island structure. The "sea-island structure" means that the phase-separated resin is partially distributed in the whole resin mixture. In addition, " substantially formed " means that only one resin exists in one layer, or one resin is rich, for example, one resin accounts for 90% or more, 91% % Or more, 93% or more, 94% or more, or 95% or more.

Specifically, the A region and the B region mean regions having different physical properties contained in the first resin layer which is a polymer of the first polymerizable compound and the second polymerizable compound. For example, the first polymerizable compound The region mainly containing the polymerization unit of the compound is referred to as A region, and the region mainly including the polymerization unit of the second polymerizable compound is referred to as B region. The phrase " mainly contains a predetermined compound " as used herein means that the compound containing only one polymerizable compound is contained in the A region, for example, 10% or less, 9% or less, 8% Or less, 7% or less, 6% or less, or 5% or less. The above-mentioned term "polymerized unit of a predetermined compound" may mean a state in which the above-mentioned predetermined compound is polymerized in the main chain or side chain of a polymer formed by polymerizing a predetermined compound.

The physical properties of the respective compounds must be different in order to phase-separate the first polymerizable compound and the second polymerizable compound to form their respective regions after polymerization.

Specifically, the first polymerizable compound and the second polymerizable compound must have different surface energy differences from each other.

In one example, the conductive film of the present application may include a first polymerizable compound and a second polymerizable compound having a lower surface energy than the first polymerizable compound. The second polymerizable compound may have a surface energy difference with respect to the first polymerizable compound to such a degree that the second polymerizable compound can form a vertical phase separation structure with the first polymerizable compound after polymerization.

Specifically, the surface energy difference between the first polymerizable compound and the second polymerizable compound may be 1 mN / m or more. The surface energy of the polymerizable compound may be calculated from the surface energy of the layer comprising the polymer formed by polymerizing the polymerizable compound.

Within the range of the surface energy difference as described above, the first polymerizable compound and the second polymerizable compound can be phase separated after polymerization to form their respective regions, for example, A region and B region that are vertically phase separated.

In another example, the surface energy difference between the first polymerizable compound and the second polymerizable compound is at least 1.5 mN / m, at least 2.0 mN / m, at least 3.0 mN / m, at least 4.0 mN / m, at least 5.0 mN / m or 6.0 mN / m or more. The upper limit value of the surface energy difference between the first polymerizable compound and the second polymerizable compound is not particularly limited, but may be, for example, 50 mN / m or less, 45 mN / m or 40 mN / m or less. When the difference in surface energy between the first polymerizable compound and the second polymerizable compound is less than 0.1 mN / m, it is impossible to form a layer in which each region is formed due to a vertical phase separation due to a small surface energy difference, If the difference exceeds 50 mN / m, no intermixing phenomenon occurs between the respective compounds, but it may affect the overall durability of the film.

The first polymerizable compound and the second polymerizable compound of the present application may be different from each other in physical properties other than the above-described difference in surface energy, which may affect the phase separation structure, for example, melt viscosity and the like.

The first polymerizable compound contained in the composition for a conductive film of the present application satisfies the above-described difference in surface energy from the second polymerizable compound, for example, to form the A region of the first resin layer of the conductive film Suitable known materials can be used without limitation.

In one example, the first polymerizable compound may be a radically polymerizable compound.

The radically polymerizable compound may be, for example, a monofunctional or polyfunctional (meth) acrylate compound. The term " monofunctional or polyfunctional (meth) acrylate compound " means a (meth) acrylate monomer, an oligomer or an oligomer thereof containing one or more polymerizable functional groups such as acryloyl group or methacryloyl group Can mean mixtures. In addition, the above "(meth) acrylate" may mean acrylate or methacrylate.

In one example, the monofunctional (meth) acrylate compound may be an alkyl (meth) acrylate.

Specifically, the alkyl (meth) acrylate may be an alkyl (meth) acrylate having an alkyl group having 1 to 20 carbon atoms, examples of which include methyl (meth) acrylate, ethyl (meth) (Meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, t- (Meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, (Meth) acrylate, decyl (meth) acrylate, dodecyl (meth) acrylate, tridecyl (meth) acrylate, Acrylic Although the agent or the like can be illustrated, without being limited thereto.

Examples of the polyfunctional (meth) acrylate compound include 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, neopentyl glycol di (meth) , Neopentylglycol adipate di (meth) acrylate, hydroxyl puivalic acid neopentyl glycol di (meth) acrylate, dicyclopentanyl (meth) acrylate, ) Di (meth) acrylate, caprolactone modified dicyclopentenyl di (meth) acrylate, ethylene oxide modified di (meth) acrylate, di (meth) acryloxyethyl isocyanurate, allyl Acrylate, trimethylolpropane dimethacrylate, cyclohexyl di (meth) acrylate, tricyclodecane dimethanol (meth) acrylate, dimethylol dicyclopentanedi (meth) acrylate, ethylene oxide modified hexahydrophthalic acid di Di (meth) acrylate, neopentyl glycol-modified trimethylpropane di (meth) acrylate, adamantane di (meth) acrylate or 9,9-bis [4- Bifunctional (meth) acrylates such as acryloyloxyethoxy) phenyl] fluorine and the like; (Meth) acrylates such as trimethylolpropane tri (meth) acrylate, dipentaerythritol tri (meth) acrylate, propionic acid modified dipentaerythritol tri (meth) acrylate, pentaerythritol tri Trifunctional (meth) acrylates such as modified trimethylolpropane tri (meth) acrylate, trifunctional urethane (meth) acrylate or tris (meth) acryloxyethylisocyanurate; Tetrafunctional (meth) acrylates such as diglycerin tetra (meth) acrylate or pentaerythritol tetra (meth) acrylate; Pentafunctional (meth) acrylate such as propionic acid-modified dipentaerythritol penta (meth) acrylate; Caprolactone-modified dipentaerythritol hexa (meth) acrylate or urethane (meth) acrylate (e.g., a reaction product of an isocyanate monomer or trimethylolpropane tri (meth) acrylate) (Meth) acrylate and the like can be used.

Examples of the polyfunctional (meth) acrylate include urethane (meth) acrylate, epoxy (meth) acrylate, polyester (meth) acrylate or polyether Methacrylate) can also be used.

In the present application, one kind or more than two types of the first kind of polymerizable compounds may be selected in consideration of the difference in physical properties between the first and second polymerizable compounds.

The second polymerizable compound contained in the composition for a conductive film of the present application satisfies the above-described difference in surface energy between the first polymerizable compound and the second polymerizable compound, for example, a known method suitable for forming the B region of the first resin layer of the conductive film May be used without limitation.

In one example, the second polymerizable compound may be a radically polymerizable compound or an ionically polymerizable compound.

Specifically, the second polymerizable compound is a fluorine compound containing a radically polymerizable functional group, for example, a (meth) acryloyl group or a (meth) acryloyloxy group; Or a siloxane compound containing said functional group; Lt; / RTI > The term "(meth) acryloyl group" means an acryloyl group or a methacryloyl group, and the term "(meth) acryloyloxy group" may mean an acryloyloxy group or a methacryloyloxy group.

The fluorine compound may be, for example, any fluorine (meth) acrylate compound selected from the group consisting of the following formulas (1) to (5), but is not limited thereto.

[Chemical Formula 1]

(2)

(3)

[Chemical Formula 4]

[Chemical Formula 5]

In the general formulas (1) to (5), R ¹ is hydrogen or an alkyl group, and a to f are an arbitrary number, for example, a positive integer.

The term "alkyl group" in the present application may mean an alkyl group having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms or 1 to 4 carbon atoms unless otherwise specified. The alkyl group may be linear, branched or cyclic. Examples of the alkyl group include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a sec- A straight chain or branched chain alkyl group such as a hexyl group, an n-heptyl group or an n-octyl group, or a cycloalkyl group such as a cyclobutyl group, a cyclopentyl group, a cyclohexyl group or a cycloheptyl group. In addition, the alkyl group may be optionally substituted with one or more substituents.

In one example, a in the above formula (1) may be an integer of 0 to 7, and b may be an integer of 1 to 3.

In one example, c in Formula 2 may be an integer of 1 to 10.

In one example, d in formula (3) may be an integer of 1 to 11.

In one example, e in Formula 4 may be an integer of 1 to 5.

In one example, f in formula (5) may be an integer of 4 to 10.

The siloxane compound may include, for example, a polymerization unit represented by the following formula (6), but is not limited thereto.

[Chemical Formula 6]

Wherein R ² is hydrogen or an alkyl group, R ³ is a substituent represented by the following general formula (7)

(7)

In the formula (7), R ⁴ represents an alkylene group, R ⁵ and R ⁶ each independently represent an alkyl group, and n represents an arbitrary number, for example, a positive integer.

The siloxane compound may include, for example, a polymerization unit represented by the following general formula (6) and a polymerization unit represented by the following general formula (8), but is not limited thereto.

[Chemical Formula 8]

In the formula (8), R ⁷ represents hydrogen or an alkyl group, and R ⁸ represents an alkyl group, an aryl group or an alicyclic group.

The term "alkylene group" in the present application may mean an alkylene group having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms, or 1 to 4 carbon atoms unless otherwise specified. The alkylene group may be linear, branched or cyclic. The alkylene group may optionally be substituted with one or more substituents.

The term "aryl group" in the present application is a carbon-based aromatic group having 6 to 25 carbon atoms, 6 to 21 carbon atoms, 6 to 18 carbon atoms, or 6 to 12 carbon atoms unless otherwise specified, Naphthalene, and the like. The term "aromatic" also includes a "heteroaryl group ", defined as an aromatic group having at least one heteroatom incorporated within a ring of aromatic groups. Examples of heteroatoms include, but are not limited to, nitrogen, oxygen, sulfur, and phosphorus. The aryl group may be substituted or unsubstituted.

The term " alicyclic ring group " in the present application means an aliphatic carbon-based ring composed of three or more carbon atoms. Examples of alicyclic groups include, but are not limited to, cyclopropyl, cyclobutyl, cyclopentyl or cyclohexyl.

Furthermore, the siloxane compound may include a radically polymerizable functional group such as a vinyl group, in addition to the compound containing the (meth) acryloyl group or the (meth) acryloyloxy group described above. Specific examples of the siloxane compound containing a radically polymerizable functional group such as a vinyl group are known and can be used without limitation in the present application as far as they have a light transmittance and a refractive index range enough to form an undercoat layer.

When the second polymerizable compound is an ionic polymerizable compound, the ionic polymerizable compound may be a siloxane compound containing a cationic polymerizable functional group such as epoxide, cyclic ether, sulfide, acetal or lactone. The siloxane compound as the ionic polymerizable compound may mean a compound which does not contain a functional group such as a radically polymerizable functional group, for example, a (meth) acryloyl group, a (meth) acryloyloxy group or a vinyl group.

The composition for a conductive film of the present application may contain the first polymerizable compound and the second polymerizable compound in such a range as to be able to form their respective regions after polymerization.

In one example, the composition for a conductive film of the present application may comprise 100 parts by weight of the first polymerizable compound and 10 parts by weight to 100 parts by weight of the second polymerizable compound.

In another example, the composition for a conductive film of the present application may contain 30 to 95 parts by weight of the first polymerizable compound and 3 to 50 parts by weight of the second polymerizable compound, or conversely, 3 to 50 parts by weight of the first polymerizable compound And 30 to 95 parts by weight of the second polymerizable compound. The term " parts by weight " in this application means the weight ratios among the components unless otherwise specified.

When the first polymerizable compound and the second polymerizable compound are contained in the composition for a conductive film in the above-described ratio, when the composition is polymerized, the first polymerizable compound and the second polymerizable compound are phase-separated and, for example, A resin layer can be formed.

In one example, when the composition for a conductive film of the present application is polymerized by a method described later, a first resin layer may be formed. The first resin layer may include an A region and a B region.

The composition for a conductive film of the present application includes an antioxidant.

In the composition for a conductive film of the present application, the antioxidant is contained in one region of a first resin layer, for example, a polymer of a first polymerizable compound and a second polymerizable compound, specifically a polymerized unit of a second polymerizable compound The crystallization of the conductive layer can be promoted and the resistance can be reduced.

In one example, the antioxidant contained in the composition for a conductive film of the present application may be any one or more selected from hindered amine type, phenol type, thioester type and phosphite type organic materials.

Specifically, the hindered amine-based organic material may have a partial structure represented by the following formula (9).

[Chemical Formula 9]

In the general formula (9), R ⁹ to R ¹² are each independently an alkyl group, and R ¹³ is hydrogen or a linear or branched alkyl group or cycloalkyl group substituted or unsubstituted with a hydroxy group.

Unless otherwise specified, the term "cycloalkyl group" in the present application may mean a cyclic alkyl group having 5 to 30 carbon atoms, 5 to 20 carbon atoms, 5 to 16 carbon atoms, 5 to 12 carbon atoms, or 5 to 8 carbon atoms . The cycloalkyl group may optionally be substituted with one or more substituents.

The hindered amine-based organic material includes a phase and a partial structure of formula (9), for example, Naugard 445, Super Q, A, PS30 Or a known hindered amine antioxidant such as GENOX? EP may be used.

In a specific example, the phenolic organic compound may be a compound represented by the following general formula (10) or (11).

[Chemical formula 10]

In Formula 10, R ¹⁴ may be an alkyl group.

(11)

이고, R¹⁶은

이며, 여기서 n은 1 내지 4의 정수이고, R¹⁷은

이다.In the formula (11), R < ¹⁵ >

, R < ¹⁶ >

, Wherein n is an integer from 1 to 4, and R < ¹⁷ >

to be.

More specifically, the phenol organic material may be, for example, triethylene glycol-bis [3- (3-tert-butyl-5-methyl-4-hydroxy) phenolpropionate], 1,6-hexanediol- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], 2,4-bis- (n-octylthio) -6- Tri-tert-butyl-4-hydroxyphenyl) propionate], 2,4-bis (tert-butylanilino) -1,3,5-triazine and pentaerythrityl tetrakis - (n-octylthio) -6- (4-hydroxy-3,5-di-tert-butyl anilino) -1,3,5-triazine, pentaerythrityl tetrakis [3- Di-tert-butyl-4-hydroxyphenyl) propionate] 2,2-thio-diethylenebis [3- (3,5- Di-tert-butyl-4-hydroxyphenyl) propionate, N, N'-hexamethylenebis (3,5- Hydroxy-hydrocinnamamide), 3,5-di-tert-butyl-4-hyde Benzylphosphonate diethyl ester, 1,3,5-trimethyl-2,4,6-tris (3,5-di-tert-butyl-4-hydroxybenzyl) benzene 1,6-bis [3 (3,5-di-tert-butyl-4-hydroxyphenyl) propionamido] hexane, 1,6-bis [3- Amido] propane or tetrakis [methylene (3,5-di-tert-butyl-4-hydroxyhydrocinnamate)] methane and the like can be exemplified and commercially available such as SONGNOX® 1010, SONGNOX® 1076, SONGNOX ? 1077, SONGNOX® 1135, SONGNOX® 2450, SONGNOX® 3135, SONGNOX® 1035, SONGNOX® 1024, SONGNOX® 1290, SONGNOX® 2590, SONGNOX® 1098, SONGNOX® 4150, SONGNOX® 4425, SONGNOX® 2246, SONGNOX® 1330 , SONGNOX (R) 1790 or SONGNOX (R) 1520, and the like.

In a specific example, the thioester-based organic material may be a compound represented by the following formula (12) or (13).

[Chemical Formula 12]

[Chemical Formula 13]

In the general formulas (12) and (13), R ¹⁸ and R ¹⁹ are each independently an alkyl group or an aryl group.

The term " aryl group " in the present application may mean a monovalent residue derived from a compound or derivative containing a benzene ring or a structure in which two or more benzene rings are condensed or bonded, unless otherwise specified. The aryl group may be, for example, an aryl group having 6 to 25 carbon atoms, 6 to 21 carbon atoms, 6 to 18 carbon atoms, or 6 to 12 carbon atoms. The aryl group may be optionally substituted with one or more substituents. For example, the aryl group may be substituted with a substituent such as a halogen, an alkyl group or an aryloxy group such as a hydroxyl group, chlorine or fluorine.

More specific examples of the thioester-based organic material include, for example, tetrakis [methane-3- (laurylthio) propionate] methane, distearyl thiodipropionate or dilauryl thiodipropionate For example, SONGNOX® DSTDP, SONGNOX® DLTDP, SONGNOX® DTDTP or SONGNOX® 4129, which are commercially available.

The phosphite-based organic material may be a compound represented by the following formula (14).

[Chemical Formula 14]

In Formula (6), R ²⁰ and R ²¹ are each independently an alkyl group or an aryl group.

Specific phosphite-based organic materials include, for example, bis (2,6-di-tert-butyl-4-methylphenyl) pentaerythritol-di-phosphite or bis (2,4- Pentaerythritol-di-phosphite, and the like, commercially available such as SONGNOX® 1680, SONGNOX® 6260, SONGNOX® 6180, SONGNOX® 6280, SONGNOX® TPP, SONGNOX® TDP, SONGNOX® DPDP, SONGNOX ® EHDPP or SONGNOX® DHOP may be exemplified.

The antioxidant may be contained in a region formed by polymerization of the composition for a conductive film, for example, a region B containing a polymerization unit of the second polymerizable compound.

The antioxidant can be included in the composition for the conductive film in such an amount as to reduce unreacted radicals and improve the surface hardening degree to reduce the resistance of the conductive layer.

In one example, the antioxidant may be included in the composition for a conductive film in the range of 0.01 to 5 parts by weight.

The antioxidant may be appropriately treated so as to be contained in any region of the layer formed by polymerization in the composition for a conductive film as described above, for example, in the region B of the first resin layer.

The composition for a conductive film of the present application may further contain inorganic particles.

The inorganic particles contained in the composition for a conductive film of the present application are contained in the A region of the first resin layer formed by polymerization of the first polymerizable compound to control the desired refractive index and to give appropriate rigidity to the A region of the first resin layer . ≪ / RTI >

In one example, the inorganic particles may be particles comprising ZnO, TiO _2, CeO _2, SnO _2, ZrO _2, MgO or Ta ₂ O _5. The size of the inorganic particles may be, for example, in the range of 5 to 100 nm.

In another example, the inorganic particles may have a surface treated appropriately so as to have properties similar to those of the above-mentioned first polymerizable compound. Specifically, the inorganic particles may be one whose surface has been coated with any one of the above-mentioned first polymerizable compounds.

The content of the inorganic particles may be appropriately included within a range that does not impair the purpose of the inorganic particles described above. For example, the content of the inorganic particles may be 40 wt% or more, 50 wt% or more, 60 wt% % Of the total weight of the conductive film.

The composition for a conductive film of the present application contains an initiator for the polymerization of the first polymerizable compound and the second polymerizable compound. The initiator may be, for example, a radical photoinitiator or a cationic photoinitiator.

More specifically, when both the first polymerizable compound and the second polymerizable compound are capable of radical polymerization, the radical photoinitiator can be added singly. On the other hand, when at least one of the two compounds is ionically polymerizable, it may further include a cationic photoinitiator.

In one example, as the radical photoinitiator, benzoin, hydroxy ketone, amino ketone or phosphine oxide photoinitiators may be used. Specific examples of the radical photoinitiator include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin isobutyl ether, acetophenone, dimethylaminoacetophenone, 2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1- hydroxycyclohexyl phenyl ketone Propane-1-one, 4- (2-hydroxyethoxy) phenyl-2- (hydroxy-2- propyl) Ketone, benzophenone, p-phenylbenzophenone, 4,4'-diethylaminobenzophenone, dichlorobenzophenone, 2-methyl anthraquinone, 2-ethyl anthraquinone, 2- Quinone, 2-methylthioxanthone, 2-ethylthioxanthone, 2-chlorothioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, benzyldimethylketal, acetophenone dimethylketal, p - dimethylaminone (2-hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl] propanone] or 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide But is not limited thereto.

In one example, the cationic photoinitiator may be, but is not limited to, an aromatic diazonium salt photoinitiator, an aromatic halonium salt photoinitiator, or an aromatic sulfonium salt photoinitiator.

The photoinitiator may be contained in, for example, 0.05 to 5 parts by weight of the composition for a conductive film, but the present invention is not limited thereto. The amount of the photoinitiator may be within the range necessary for the polymerization of the first polymerizable compound and the second polymerizable compound Lt; / RTI >

The composition for a conductive film of the present application may further contain known additives such as a surfactant, a plasticizer, a surface lubricant, a leveling agent, a corrosion inhibitor, a light stabilizer, an ultraviolet absorber, a polymerization inhibitor or a silane coupling agent in addition to the above- May be further included. The content of the components may be added in an appropriate amount within a range that does not impair the physical properties of the conductive film, and may be included in the range of 0.01 to 2 parts by weight based on 100 parts by weight of the composition for a conductive film.

The present application also relates to a conductive film comprising a layer formed from the above composition for a conductive film.

The conductive film of the present application can overcome the problem of lowering the visibility due to the bending phenomenon that may occur in the heat treatment process of the conductive film and reduce the number of processes by forming a layer separated from the single coating process of the above- And the resistance of the conductive layer may be decreased due to the addition of the antioxidant.

In one example, the present application is directed to a film comprising a substrate film; A first polymerizable compound formed on one surface of the substrate film; A first resin layer which is a polymer of a composition comprising a second polymerizable compound having a smaller surface energy than the first polymerizable compound and an antioxidant; And a second resin layer formed on an opposite surface of the base film on which the first resin layer is formed.

That is, in the conductive film according to the present application, the first resin layer and the second resin layer are formed on both sides of the base film, and the thickness of the first resin layer and the second resin layer and the content of the inorganic particles are controlled, The problem of the pattern visibility of the conductive film can ultimately be improved by keeping the coefficient of thermal expansion below a predetermined range or by setting the bending direction of the conductive film due to the heat treatment process in the direction of the conductive layer.

In addition, the conductive film of the present application can be formed by a single coating process of a composition including the above-described first and second polymerizable compounds in place of the hard coating layer and the undercoating layer forming process which are conventionally formed on the base film, By forming a layer capable of serving as an undercoat layer, it is possible to reduce the number of process steps and achieve economical efficiency.

Furthermore, the antioxidant can be included in one region of the first resin layer, for example, in the region B, thereby facilitating the crystallization of the conductive layer in accordance with the heat treatment process, and ultimately lowering the resistance value of the conductive layer.

The conductive film of the present application includes a base film.

In one example, the base film may be a transparent film, and a known one suitable for a conductive film having transparency and strength in an appropriate range may be employed.

Specifically, the base film may be made of polyolefin such as polyethylene or polypropylene; Polyesters such as polyethylene terephthalate and polyethylene naphthalate; Polyamides such as 6-nylon or 6,6-nylon; Polycarbonate; Polyethersulfone; Or a norbornene resin can be used, but the present invention is not limited thereto. These base films may be used alone or in combination of two or more. The base film may also be in the form of a single film or a laminated film.

The base film of the present application may also be one whose surface has been modified. The surface modification is for imparting polarity. The composition for a conductive film is applied to a base film, and then a phase separation structure is formed when a first resin layer including regions A and B is formed by phase separation It may be to make it more clear.

In one example, the substrate film may be a surface modified by a known treatment method such as a chemical treatment, a corona discharge treatment, a mechanical treatment, an ultraviolet (UV) treatment, an active plasma treatment or a glow discharge treatment.

The base film may contain known additives such as an antistatic agent, an ultraviolet absorber, an infrared absorber, a plasticizer, a lubricant, a colorant, an antioxidant or a flame retardant.

The thickness of the base film may be set to a suitable thickness range in consideration of transparency, the purpose of minimizing the occurrence of thinning and the occurrence of wrinkles due to tension during processing, and the like. In one example, the substrate film may have a thickness ranging from 10 占 퐉 to 80 占 퐉, or from 20 占 퐉 to 50 占 퐉, but is not limited thereto.

The conductive film of the present application comprises a first resin layer. The first resin layer may be, for example, a polymer of a composition comprising the first polymerizable compound, the second polymerizable compound and the antioxidant described above.

More specifically, when the composition for a conductive film comprising the first polymerizable compound, the second polymerizable compound, and the antioxidant and the above-mentioned additives is coated on the base film, Due to the difference in physical properties such as the surface energy of the compound, and the like.

Due to the phase separation phenomenon as described above, the first resin layer is composed of the A region including the polymerization unit of the first polymerizable compound and the B region including the polymerization unit of the second polymerizable compound formed on the A region The A region and the B region may be included in the first resin layer in a state in which their regions are vertically separated from each other, for example, as shown in FIG.

In one example, the A region includes polymerized units of the first polymerizable compound and may not substantially contain the second polymerizable compound.

The phrase " substantially not included " means that the second polymerizable compound is contained in an amount of 10 wt% or less, 9 wt% or less, 8 wt% or less, 7 wt% or less, By weight or less, 6% by weight or less, and 5% by weight or less.

The A region may further include, for example, inorganic particles. That is, the A region can serve as a hard coating layer which is formed to impart appropriate rigidity to the conductive film and to reduce the refractive index difference with the base film.

In one example, the ratio of the inorganic particles in the A region may be at least 60% by weight. The A region of the first resin layer within the above-mentioned weight range can provide a conductive film having desired refractive index and rigidity and ultimately improved pattern visibility. The content of the inorganic particles may be, for example, a value calculated using a thermogravimetric analyzer (TGA).

In another example, the inorganic particles may be contained in the A region of the first resin layer in a range of 70 wt% or more, 80 wt% or more, or 85 wt% or more. The upper limit value of the inorganic particle content range is not particularly limited, but may be, for example, 99 wt% or less, 95 wt% or less, or 90 wt% or less.

The A region of the first resin layer can exhibit a refractive index similar to that of the base film by including the inorganic particles in the same range as described above.

In one example, the absolute value of the difference between the refractive index (based on a wavelength of 550 nm) of the A region in the first resin layer and the refractive index (based on a wavelength of 550 nm) of the base film may be 0.3 or less. The desired optical properties of the conductive film can be achieved within the refractive index difference as described above. In another example, the absolute value of the difference between the refractive index (based on a wavelength of 550 nm) of the A region in the first resin layer and the refractive index (based on a wavelength of 550 nm) of the base film may be 0.2 or less or 0.1 or less.

Specifically, the A region of the first resin layer may have a refractive index in a range of 1.5 to 1.8 as measured at a wavelength of 550 nm. In another example, the A region of the first resin layer may have a refractive index, measured at a wavelength of 550 nm, in the range of 1.5 to 1.7 or 1.6 to 1.7.

The thickness of the A region of the first resin layer may be, for example, in the range of 0.3 mu m to 1.3 mu m. The thickness of the A region of the first resin layer can control the coefficient of thermal expansion of the conductive film. If the thickness of the first resin layer is too small, the coefficient of thermal expansion may be low to cause pattern pressing. If the thickness is excessively thick, It is not compatible with thinning, and cracks may occur due to a subsequent heat treatment process, so that an appropriate thickness should be set within the above numerical range.

The first resin layer may include a B region. The B region includes a polymerization unit of the second polymerizable compound and may not substantially contain the first polymerizable compound.

The B region of the first resin layer is located between the conductive layer of the conductive film and the base film, and has a predetermined refractive index, and may reduce the reflectance of the conductive film.

The B region of the first resin layer may have a refractive index of, for example, within a range of 1.4 to 1.7 with respect to a wavelength of 550 nm, but the present invention is not limited thereto. The range may vary depending on the refractive index of the A region in the conductive layer and the first resin layer .

The B region of the first resin layer may also contain an antioxidant. That is, the B region can facilitate the crystallization of the conductive layer formed on the B region of the first resin layer, and ultimately the resistance value of the conductive layer can be lowered.

The antioxidant may be subjected to appropriate surface treatment so as to be included in the B region of the first resin layer. In one example, the antioxidant may be surface-treated with a compound that forms the B region of the first resin layer, specifically, the second polymerizable compound. As described above, the antioxidant imparted with appropriate physical properties to be contained in the region B of the first resin layer may not be substantially contained in the region A of the first resin layer.

The conductive film of the present application comprises a second resin layer.

The second resin layer of the present application has a difference in a predetermined thickness range and a difference in thermal expansion coefficient from, for example, the first resin layer, thereby imparting overall rigidity to the conductive film, To prevent the conductive film from curving in the direction of the surface of the conductive film.

In one example, the ratio (T1 / T2) of the thickness (T1) of the A region and the thickness (T2) of the second resin layer in the first resin layer may be in the range of 0.75 to 1.30. It is possible to improve the pressing phenomenon of the pattern portion of the conductive film within such a thickness ratio range. In another example, the ratio T1 / T2 may be in the range of 0.85 to 1.20 or 0.90 to 1.10, and preferably the low heat of the conductive film when the ratio T1 / T2 is in the range of 0.90 to 1.10 The pressing force of the pattern can be minimized due to the expansion coefficient.

The thickness of the second resin layer may be appropriately set in a range that satisfies the thickness ratio (T1 / T2), and may be in the range of, for example, 0.8 mu m to 1.7 mu m or 0.9 mu m to 1.7 mu m .

The second resin layer may be, for example, a coating layer formed by polymerization of a radically polymerizable compound. The second resin layer may contain a compound capable of forming the A region of the first resin layer, for example, a polymerization unit of a monofunctional or polyfunctional (meth) acrylate compound.

As described above, the first resin layer and the second resin layer have appropriate rigidity and can play a role of lowering the thermal expansion coefficient of the conductive film.

In one example, the conductive film of the present application may have a thermal expansion coefficient of 15 ppm / DEG C or less. In another example, the conductive film may have a thermal expansion coefficient of 14 ppm / ° C or less, 13 ppm / ° C or less, 12 ppm / ° C or less, or 11 ppm / ° C or less. The lower limit of the lower limit is not particularly limited. For example, the lower limit is 1 ppm / ° C or higher, 2 ppm / ° C or higher, 3 ppm / Or 5 ppm / [deg.] C or higher. The coefficient of thermal expansion can be calculated, for example, by using a thermo mechanical analyzer (TMA) at a rate of 10 占 폚 / min at a temperature range of 25 占 폚 to 150 占 폚, and calculating an average thermal expansion coefficient as a coefficient of linear thermal expansion Lt; / RTI >

The conductive film of the present application is formed by forming the first resin layer and the second resin layer on both surfaces of the base film as described above to maintain the thermal expansion coefficient at 15 ppm / The visibility problem caused by the phenomenon can be overcome.

The conductive film of the present application may further include a conductive layer on the first resin layer. The fact that the conductive layer is included in the first resin layer means not only the case where the conductive layer is in direct contact with the first resin layer but also the case where the conductive layer is included in a state in which an arbitrary layer is further present in the first resin layer .

 The conductive layer may be a structure including a pattern portion and a non-pattern portion through, for example, an etching process.

In one example, the conductive film of the present application includes a conductive layer 100, an A region 201 and a B region 202 including a pattern portion 101 and a non-pattern portion 102, A base film 300, and a second hard coat layer 400. The first hard coat layer 400 includes a first hard coat layer 400,

The material of the conductive layer is not particularly limited and may be, for example, indium tin oxide (ITO) containing gold, silver, platinum, palladium, copper, titanium oxide, cadmium oxide, copper iodide, tin, A metal oxide of at least one metal selected from the group consisting of tin oxide, fluorinated tin oxide (FTO) and zinc oxide; Carbon nanotubes; Metal nanowires formed of a material such as silver or copper; Or a conductive polymer such as a polythiophene-based polymer or a polyaniline-based polymer including poly (styrenesulfonate) (poly (styrenesulfonate)).

The conductive layer may have a refractive index, for example, at a wavelength of 550 nm of 1.9 to 2.1.

The conductive layer may be formed to have a thickness in the range of 0.01 to 0.022 mu m. When the thickness of the conductive layer is less than 0.01 mu m, the conductivity is deteriorated. When the thickness exceeds 0.022 mu m, the transparency may be lowered.

In one example, the conductive film of the present application can form a curved surface structure concave toward the conductive layer. In addition, the curvature radius of the curved surface structure may be in the range of 1 mm to 1,000 mm.

The present application also relates to a method for producing a conductive film.

That is, the present application relates to a process for producing a film comprising a first polymerizable compound on a substrate film, Coating a composition comprising a second polymerizable compound having a surface energy lower than that of the first polymerizable compound and an antioxidant, and curing the first polymerizable compound to form a first resin layer.

In the present application, a composition capable of achieving a phase separation structure is coated on a base film and then cured to form a first resin layer including two regions having different physical properties, for example, regions A and B, Thereby providing an economical method for producing a conductive film.

In addition, the present application discloses that by incorporating an antioxidant in any one of the layers formed by embodying the phase-separated structure, for example, in the region B of the first resin layer, crystallization of the conductive layer It is possible to eliminate a factor that lowers the speed, and ultimately the resistance value of the conductive layer can be lowered.

In one example, the method for producing a conductive film according to the present application includes a step of coating a composition of a polymerizable compound having different physical properties on a base film, for example, a composition of a first polymerizable compound and a second polymerizable compound, . ≪ / RTI > When the composition is coated, the first polymerizable compound and the second polymerizable compound can be phase-separated to form their respective regions due to differences in physical properties, for example, differences in physical properties such as surface energy or solubility parameter , The antioxidant may be contained in any one of a region mainly containing the first polymerizable compound or a region mainly containing the second polymerizable compound, for example, a region mainly containing the second polymerizable compound . The specific types and physical properties of the first polymerizable compound, the second polymerizable compound and the antioxidant are the same as those mentioned above in the composition for a conductive film.

The method of coating the composition on the base film is not particularly limited and a method such as gravure coating, microgravure coating, slot die coating, spin coating, spray coating, roll coating, bar coating or dip coating may be used But is not limited thereto.

In the method for producing a conductive film according to the present application, the base film may be subjected to a predetermined pretreatment before the composition is coated on the base film. When the preprocessing for the surface modification, for example, the surface modification, is carried out on the base film, the polarity of the base film can be improved, and the phase separation phenomenon depending on the composition comprising the first polymerizable compound and the second polymerizable compound Can be more pronounced.

In one example, the method for producing a conductive film according to the present application is a method for producing a conductive film according to any one of (1) to (4), wherein the base film is formed by a chemical treatment, a corona discharge treatment, a mechanical treatment, an ultraviolet (UV) treatment, an active plasma treatment, And then performing a treatment to modify the surface of the base film.

The composition coated on the base film may further contain inorganic particles and an initiator, in addition to the first polymerizable compound, the second polymerizable compound and the antioxidant described above. The kind and content of the inorganic particles and the initiator are the same as those mentioned in the composition for a conductive film.

In addition, the composition coated on the base film may further comprise a solvent. The solvent contained in the composition may be, for example, water, an organic solvent, or a mixture thereof.

The organic solvent may be, for example, an alcohol solvent, a halogen-containing hydrocarbon solvent, a ketone solvent, a cellosolve solvent or an amide solvent.

More specifically, the alcohol solvent is methanol, ethanol, isopropyl alcohol, n-butanol or diacetone alcohol, and the halogen-containing hydrocarbon solvent is chloroform, dichloromethane or ethylene dichloride. The ketone solvent is acetaldehyde, acetone, Ketone or methyl isobutyl ketone, and the cellosolve solvent may be methyl cellosolve or isopropyl cellosolve, and the amide solvent may be dimethyl formamide, formamide or acetamide.

When the composition comprising the first polymerizable compound, the second polymerizable compound and the antioxidant is coated on the base film, the layer separated in the thickness direction is formed due to the physical properties of each compound, for example, A first resin layer including an A region and a B region is formed on a base film, and the antioxidant may be included in, for example, a B region.

The method of manufacturing a conductive film according to the present application may further include the step of forming a second resin layer on a surface opposite to a surface of the base film on which the first resin layer is formed.

The second resin layer has a predetermined thickness range and a difference in thermal expansion coefficient from the first resin layer and may be configured to improve the visibility deterioration due to the bending phenomenon of the conductive film which may occur during the heat treatment. Therefore, the material for forming the second resin layer may include a material forming the first resin layer, for example, a first polymerizable compound and inorganic particles and other additives. The method of forming the second resin layer may include, for example, coating and curing a composition containing the first polymerizable compound or the like on the surface of a substrate film on which the first resin layer is not formed.

The physical properties of the first resin layer and the second resin layer formed on both surfaces of the base film are the same as those mentioned above for the conductive film.

When the first resin layer and the second resin layer are formed on the base film as described above, the conductive film may have a thermal expansion coefficient of 15 ppm / ° C or lower, The bending phenomenon of the conductive film that can be generated is minimized, and ultimately, the visibility problem can be solved.

The method for manufacturing a conductive film according to the present application may further include a step of forming a conductive layer on the first resin layer and then subjecting the conductive layer to heat treatment.

The method for forming the conductive layer may include, for example, a step of depositing the above-described conductive layer forming material by a method such as sputtering, but is not limited thereto. Methods for forming a conductive layer are known in the art and can be used without limitation in the present application.

The step of heat-treating the conductive film on which the conductive layer is formed is not particularly limited. For example, the conductive layer may be crystallized, or the conductive layer may be patterned and then subjected to additional heat treatment to improve the durability of the film. . ≪ / RTI >

In one example, the heat treatment process may be performed at a temperature of 100 占 폚 to 200 占 폚 for a time of 10 minutes to 100 minutes.

When the heat treatment process is performed as described above, the conductive film of the present application may have a concave structure in the direction of the conductive layer. For example, the conductive film may have a concave structure in the direction of the conductive layer within a range of a radius of curvature of 1 mm to 1,000 mm. In such a structure, the visibility of the conductive film can be improved.

The present application also relates to a touch panel including a conductive film. The conductive film of the present application may be useful as an upper substrate and / or a lower substrate of a touch panel, particularly a resistive touch panel. When the upper panel is pressed with a finger or a pen, the conductive film of the resistive film type is bent and the conductive layer of the upper substrate and the lower substrate are brought into contact with each other So that it can be a structure for detecting the position.

Since the conductive film according to the present application is improved in visibility and includes a small number of process water, a touch panel having excellent transparency and being manufactured at an economical cost can be realized.

The touch panel may be mounted on a display device such as an LCD, a PDP, an LED, an OLED or an E-paper, but the present invention is not limited thereto.

Hereinafter, the conductive film according to the present application will be described in more detail with reference to Examples and Comparative Examples. However, the following Examples and Comparative Examples are merely examples according to the present application and do not limit the technical idea of the present application. It will be apparent to those of ordinary skill in the art.

1. Measurement of surface energy

Based on the Owens-Wendt-Rabel-Kaelble method, the surface energy was measured using a Drop Shape Analyzer (DSA100 from KRUSS). Specifically, a homopolymer of the first polymerizable compound or the second photopolymerizable compound according to Examples and Comparative Examples was dissolved in methyl ethyl ketone solvent in an amount of 15% by weight, (bar coating). Then, the coated LCD glass was dried in an oven at 100 DEG C for 1 minute, and UV cured. After curing, the average value of the contact angle was determined by dropping the diiodomethane and the deionized water to the coated surface 10 times, respectively, and the surface energy was obtained by substituting the numerical values into the Owens-Wendt-Rabel-Kaelble method.

2. Curvature radius measurement experiment

When the conductive film subjected to the predetermined heat treatment was cut into a plane of 10 cm x 10 cm, the maximum value (H ₁ ) of the distance at which each edge or one side is spaced from the plane and the length (S ₁ ) And the radius of curvature (R) was obtained by the following formula (2).

[Formula 2]

R = H ₁ + R x cos (S ₁ / 2R)

3. Measurement of thermal expansion coefficient of conductive film

The average thermal expansion coefficient measured by cooling and heating the conductive film at a rate of 10 占 폚 / min in a temperature range of 25 占 폚 to 150 占 폚 using a TMA (thermo mechanical analyzer) was calculated as a coefficient of linear thermal expansion.

4. The  Resistance measurement

A conductive layer is formed on the first resin layer using ITO, and after heat treatment for one hour at a temperature condition of 130 캜 for crystallization of the conductive layer and the resistance value of the conductive layer before the heat treatment process for crystallization, (Ω / □) is measured by a 4-probe measurement method (Loresta EP MCP-T360).

[ Example  One]

1st  The composition (A1) for forming a resin layer

Pentaerythritol tetraacrylate (PETA) (first polymerizable compound) having a surface energy of about 47.6 mN / m, acrylate siloxane (KR513) having a surface energy of about 42.8 mN / m (Irgacure 184), inorganic particles (ZrO ₂ ) and antioxidant (Songwon DHOP) were mixed in a weight ratio of 40: 5: 3: 60: 0.5, and propylene glycol monomethyl ether acetate Propylene glycol monomethyl ether acetate, PGMEA) was added to prepare a composition (A1) for forming the first resin layer.

Second  Preparation of Composition (A2) for Resin Layer Formation

Dipentaerythritol hexaacrylate (DPHA) and initiator (Irgacure 184) were mixed in a weight ratio of 100: 3, and methyl isobutyl ketone (MIBK) was added as a solvent to form a second resin layer (A2) was prepared.

Preparation of conductive film

The first resin layer-forming composition A1 was coated on one side of a PET base film (UH-13 PET, refractive index: about 1.65) having a thickness of 50 탆 on both sides and subjected to a mold releasing treatment and irradiated with ultraviolet rays to form a vertically phase- (UH-13 PET) having a refractive index of about 1.65 and an inorganic particle content of about 65%) and a B region (thickness of about 30 nm, refractive index of about 1.46 to 1.54) ) Was coated on the surface on which the first resin layer was not formed and irradiated with ultraviolet rays to form a second resin layer having a thickness of about 1.3 탆. After the ITO conductive layer is patterned by depositing ITO on the first resin layer by a vacuum sputtering method, the second resin layer / the base film / the first resin layer (A region / B region) / the conductive layer To prepare a conductive film. The physical properties and results of the conductive film of Example 1 are shown in Table 1 below.

[ Example  2]

(Shinetsu: X-40-2670) having a surface energy of about 40.0 mN / m and a cationic initiator (Irgacure 250) as the second polymerizable compound, and the first polymerizable compound: the second polymerizable compound: (A3) for forming a first resin layer containing a radical initiator: a cationic initiator: an inorganic particle: an antioxidant in a weight ratio of 40: 5: 3: 0.15: 60: 0.5 was used. To prepare a conductive film. The physical properties of each layer of the conductive film thus produced are shown in Table 1.

[ Example  3]

A first resin layer (A) and a second resin layer (B) are formed by vertically separating the first resin layer forming composition (A1) on the plasma surface treated surface by performing a plasma surface treatment on the base film, A conductive film was prepared in the same manner as in Example 1, except that the second resin layer was formed on the opposite side. The physical properties of each layer of the conductive film thus produced are shown in Table 1.

[ Example  4]

(A3) is coated on the plasma-treated surface of the base film to form a first resin layer including the vertically-separated regions A and B, A conductive film was produced in the same manner as in Example 2, except that the second resin layer was formed on the opposite surface. The physical properties of each layer of the conductive film thus produced are shown in Table 1.

[ Comparative Example  One]

Wherein the second polymerizable compound comprises dipentaerythritol hexaacrylate (DPHA) having a surface energy of about 48.4 mN / m, wherein the first polymerizable compound: the second polymerizable compound: the radical initiator: Particles were mixed at a weight ratio of 40: 5: 3: 60, respectively, to prepare a composition (B1) for forming a first resin layer. Thereafter, when the first resin layer-forming composition (B1) is coated on one side of a PET base film (UH-13 PET, refractive index of about 1.65) A layer mainly containing a polymerizable compound is formed on a layer mainly containing a first polymerizable compound and a mixed layer showing a locally deodorizing structure is formed so that a desired conductive film can not be produced.

[ Comparative Example  2]

A conductive film was prepared in the same manner as in Example 1, except that an antioxidant was not included. The physical properties of the conductive film thus produced are shown in Table 1.

Example 1 Example 2 Example 3 Example 4 Comparative Example 1 Comparative Example 2 The first resin layer A region Surface energy (mN / m) 47.6 47.6 47.6 47.6 - 47.6 Inorganic particle content 65% 65% 65% 65% - 65% Thickness (㎛) 0.5 0.5 0.5 0.5 - 0.5 B region Surface energy (mN / m) 42.8 40.0 42.8 40.0 - 42.8 Thickness (mm) 30 30 30 30 - 30 The second resin layer Thickness (㎛) 1.3 1.3 1.3 1.3 1.3 1.3 Resistance value of conductive layer before and after heat treatment (Ω / □) Before heat treatment process 435 440 438 442 - 550 After heat treatment at 130 占 폚 for 1 hour 130 135 131 135 - 192

100: conductive layer
101:
102: Non-patterned portion
200: first resin layer
201: area A
202: area B
300: substrate film
400; The second resin layer

Claims (22)

A first polymerizable compound;
A second polymerizable compound having a lower surface energy than the first polymerizable compound; And
A composition for a conductive film comprising an antioxidant. The method according to claim 1,
Wherein the surface energy difference between the first polymerizable compound and the second polymerizable compound is at least 1 mN / m. The method according to claim 1,
A composition for a conductive film further comprising inorganic particles. The method according to claim 1,
Wherein the first polymerizable compound is a monofunctional or polyfunctional (meth) acrylate compound. The method according to claim 1,
And the second polymerizable compound is a radical polymerizable compound or an ionic polymerizable compound. The method according to claim 1,
30 to 95 parts by weight of the first polymerizable compound and 3 to 50 parts by weight of the second polymerizable compound. The method according to claim 1,
Wherein the antioxidant is contained in an amount of 0.01 to 5 parts by weight. The method according to claim 1,
Wherein the antioxidant comprises at least one selected from the group consisting of hindered amine-based, phenol-based, thioester-based, and phosphite-based organic materials. A base film;
A first resin layer formed on one surface of the base film and being a polymer of the composition of claim 1; And
And a second resin layer formed on an opposite surface of the base film on which the first resin layer is formed. 10. The method of claim 9,
Wherein the surface energy difference between the first polymerizable compound and the second polymerizable compound is 1 mN / m or more. 10. The method of claim 9,
Wherein the first resin layer comprises an A region including a polymerization unit of the first polymerizable compound and a B region including a polymerization unit of the second polymerizable compound formed on the A region. 12. The method of claim 11,
And the A region of the first resin layer further comprises inorganic particles. 13. The method of claim 12,
And the ratio of the inorganic particles in the A region is 60% by weight or more. 10. The method of claim 9,
Wherein the base film is one of a chemical treatment, a corona discharge treatment, a mechanical treatment, an ultraviolet (UV) treatment, an active plasma treatment and a glow discharge treatment. 10. The method of claim 9,
A conductive film further comprising a conductive layer on the first resin layer and forming a concave curved surface structure in the direction of the conductive layer. 16. The method of claim 15,
Wherein the curvature radius of the curved surface structure is in the range of 1 mm to 1,000 mm. A method for producing a conductive film, comprising: coating a composition of claim 1 on a base film and curing the composition to form a first resin layer. 18. The method of claim 17,
Wherein the first resin layer comprises an A region including a polymerization unit of the first polymerizable compound and a B region including a polymerization unit of a second polymerizable compound formed on the A region. 18. The method of claim 17,
Further comprising the step of modifying the surface of the base film by performing any one treatment selected from the group consisting of chemical treatment, corona discharge treatment, mechanical treatment, ultraviolet (UV) treatment, active plasma treatment and glow discharge treatment on the substrate film A method for producing a conductive film. 18. The method of claim 17,
And forming a second resin layer on a surface opposite to the surface of the base film on which the first resin layer is formed. 18. The method of claim 17,
Forming a conductive layer on the first resin layer, and then subjecting the conductive layer to heat treatment. A touch panel comprising the conductive film of claim 9.

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