KR20170013962A - Sputtering apparatus where vacuum state of a process chamber is kept and method of operating the same - Google Patents

Abstract

Disclosed are a sputtering apparatus wherein a vacuum state of a process chamber is kept and a method of operating the same when changing a film to a new film or discharging a film which is deposited to the outside. The sputtering apparatus comprises: a process chamber to perform a deposition process of an object to be deposited; a loading chamber to load the object to be deposited; and a valve. Moreover, a space is formed in a portion of a chamber connection portion between the process chamber and the loading chamber, and the object to be deposited is transferred to the space. When loading the object to be deposited in the loading chamber, the valve shields the space to keep a vacuum state of the process chamber.

Description

TECHNICAL FIELD [0001] The present invention relates to a sputtering apparatus capable of maintaining a vacuum state and a method of operating the sputtering apparatus.

The present invention relates to a sputtering apparatus and a method of operating the same.

A sputtering apparatus is an apparatus for depositing a predetermined film on a film or the like, and a deposition process is performed in the process chamber. However, when the new film for deposition is loaded after the deposition process is completed, or when the film with the film is taken out to the outside, the vacuum of the process chamber is destroyed. Therefore, it takes a considerable time to bring the process chamber back to a vacuum state in order to deposit a film on a new film, which lowers the deposition efficiency.

Korean Registered Patent No. 659085 (registered on December 21, 2006)

The present invention provides a sputtering apparatus for maintaining a vacuum state of a process chamber when replacing with a new film or taking out a deposited film to the outside, and a method of operating the sputtering apparatus.

According to an aspect of the present invention, there is provided a sputtering apparatus including: a processing chamber for performing a deposition process of a deposition target; A loading chamber for loading the deposition object; And a valve. Here, a space is formed in a part of a chamber connection part between the process chamber and the loading chamber, and the deposition object is transferred to the space. When the deposition object is loaded into the loading chamber, the valve shields the space, Thereby maintaining the vacuum of the process chamber.

According to another aspect of the present invention, there is provided a sputtering apparatus including: a processing chamber for performing a deposition process of a deposition target; A loading chamber for loading the deposition object; And a cover. Here, a space is formed in a part of the chamber connecting portion between the process chamber and the loading chamber, and the evaporation object is transferred to the space. When the evaporation object is loaded into the loading chamber, the cover moves upward or downward And the space is shielded to maintain the vacuum state of the process chamber.

According to another aspect of the present invention, there is provided a sputtering apparatus including: a processing chamber for performing a deposition process of a deposition target; An output chamber for carrying out a deposition object on which a film is deposited by the process chamber; And a valve. Here, a space is formed in a part of the chamber connecting portion between the process chamber and the output chamber, and an evaporation object on which the film is deposited is transferred to the space. When the evaporation object on which the film is formed is taken out to the outside of the output chamber, Shields the space to maintain the vacuum in the process chamber.

According to another aspect of the present invention, there is provided a sputtering apparatus including: a processing chamber for performing a deposition process of a deposition target; An output chamber for carrying out a deposition object on which a film is deposited by the process chamber; And a cover. Here, a space is formed in a part of a chamber connecting portion between the process chamber and the output chamber, and an evaporation object having the film formed thereon is transferred. When the evaporation object formed with the film is taken out to the outside of the output chamber, And moves up or down to shield the space to maintain the vacuum of the process chamber.

A method of operating a sputtering apparatus according to an embodiment of the present invention includes depositing a film on a film in a process chamber; After the deposition of the film is completed, shielding at least one of a first space of the first chamber connection between the process chamber and the loading chamber and a second space of the second chamber connection between the process chamber and the output chamber, Maintaining a state; And shielding the space and then transporting the film with the film formed outside the output chamber or loading a new film into the loading chamber.

In the sputtering apparatus and the deposition method thereof, after the deposition process is completed, the space of the chamber connecting portion is shielded by the valve, and then the film formed with the film is taken out to the outside or a new film is loaded so that the vacuum state of the process chamber can be maintained have. Therefore, the deposition efficiency can be improved.

1 is a schematic view showing a concept of a sputtering apparatus according to an embodiment of the present invention.
2 is a view showing a structure of a stuffer apparatus for loading or unloading a deposition object according to an embodiment of the present invention.
FIG. 3 is a flowchart illustrating an operation of the sputtering apparatus according to an embodiment of the present invention.
4 and 5 are views schematically showing an actual configuration of a sputtering apparatus according to an embodiment of the present invention.
6 is a view showing a coupling structure according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The present invention relates to a sputtering apparatus, and more particularly, to a sputtering apparatus capable of maintaining a vacuum state of a process chamber when an object to be vaporized, for example, a film is replaced with a new film or a film formed thereon is taken out of the output chamber after completion of vapor deposition, We propose an operation method.

In the conventional sputtering apparatus, the vacuum state of the process chamber is broken when a new film is loaded after the deposition process is completed, or when the film on which the film is formed is taken out. In this case, it took a considerable time to re-vacuum the process chamber for the deposition process, which resulted in a reduction in the deposition efficiency.

Accordingly, the present invention proposes a sputtering apparatus and a method of operating the sputtering apparatus that can maintain a vacuum state of a process chamber even when a new film is loaded after the completion of the deposition process or when a film having the film is taken out to the outside.

Hereinafter, various embodiments of a sputtering apparatus and an operation method thereof according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic view showing a concept of a sputtering apparatus according to an embodiment of the present invention.

Referring to FIG. 1, the sputtering apparatus of this embodiment may include a process chamber 100, a loading chamber 102, and an output chamber 104.

The process chamber 100 includes a deposition target 110, for example, a chamber for depositing a specific film on a film, and a target for deposition, etc., not shown, is contained therein. Hereinafter, for convenience of explanation, it is assumed that the deposition target 110 is a film.

The loading chamber 102 is a chamber in which the film 110 is loaded and provides the film 110 to the process chamber 100. The loading rollers 106 and the conveying rollers 112 are disposed inside .

The winding roller 106 is wound with a film 110 to be subjected to a deposition process.

The transfer roller 112 serves to transfer the film provided from the winding roller 110 to the process chamber 100. Of course, the film may be transported directly from the take-up roller 106 to the process chamber 100 without the transport roller 112.

According to one embodiment, a space 130 may be formed in a portion of the chamber connection between the loading chamber 102 and the process chamber 100 and the film 110 transferred from the transfer roller 112 may be transferred to a process chamber 130, respectively. That is, in the deposition process, the film 110 moved from the transport roller 112 enters the process chamber 100, and in this case, the cover 120 is opened to allow the film 110 to enter the process chamber 100 And the valve including the valve 130 keeps the space 130 open.

On the other hand, if the film 110 is to be replaced with another film after the deposition process is completed, the cover 120 of the valve shields the space 130, Can maintain a vacuum and the user can open the loading chamber 102 and replace the film 110 with a new film. In this case, the loading chamber 102 is broken in a vacuum state. That is, the user may use the lid 120 to replace the film 110 in the loading chamber 102 with another film while maintaining the vacuum of the process chamber 100.

When the film 110 is taken out of the output chamber 104 after the deposition process is completed in the process chamber 100, an operation similar to the above can be performed. That is, during the deposition process, the lid 122 remains open in the chamber connection 132 between the process chamber 100 and the output chamber 104, while the output chamber 104 is closed after the deposition process is completed, The cover 122 may shield the space 132 to keep the process chamber 100 in a vacuum state when the film 110 in the chamber 110 is taken out of the output chamber 104. [ Of course, the vacuum state of the output chamber 104 is destroyed.

In summary, the sputtering apparatus of this embodiment can be used to load a new film into the loading chamber 102 after the deposition process is completed, or to remove the film 110 of the output chamber 104 from the cover 120 or 122 ) Shields the space 130 or 132 of the chamber connection to maintain the vacuum of the process chamber 100. As a result, the deposition process time can be reduced, and thus the deposition efficiency can be improved.

FIG. 2 is a view showing a structure of a stuffer apparatus for loading or unloading an object to be deposited according to an embodiment of the present invention. FIG. 3 is a flow chart showing the operation of the sputtering apparatus according to an embodiment of the present invention. to be.

Referring to FIGS. 2 and 3, the film 110 to be subjected to the deposition process is loaded into the loading chamber 102 (S300). According to one embodiment, the winding roller 106 can be loaded into the loading chamber 102 while the film 110 is wound on the winding roller 106.

The space 130 of the chamber connection between the process chamber 100 and the loading chamber 102 is then opened so that the film 110 wound on the winding roller 106 is drawn into the process chamber 100. That is, the cover 120 does not shield the space 120.

Subsequently, the inside of the loading chamber 102, the process chamber 100, and the output chamber 104 are formed in a vacuum state (S302).

Then, a deposition process is performed in the process chamber 100 to deposit a specific film on the film 110 (S304).

Subsequently, when the film 110 having the film formed is taken out of the output chamber 104 and the new film is loaded into the loading chamber 102 after the completion of the deposition process, The chamber 120 is lowered to shield the space 130 of the chamber connection between the loading chamber 102 and the process chamber 100 and the lid 122 to lower the chamber 130 between the process chamber 100 and the output chamber 104, And shields the space 132 of the connection portion (S306). At this time, the loading chamber 102, the process chamber 100, and the output chamber 104 are kept in a vacuum state.

According to an embodiment, when the space 130 or 132 is shielded by the cover 120 or 122, the tension of the film 110 may be weakly controlled to minimize the damage of the film 110 due to the shielding of the cover 120 have.

Then, while maintaining the vacuum of the process chamber 100, the user may open the loading chamber 102 and load a new film (S308). At this time, since the loading chamber 102 is opened, the vacuum state of the loading chamber 102 is destroyed. Concretely, the film wound on the take-up roller 106 is cut, the take-up roller 106 is recovered, the new film is wound on the take-up rollers into the loading chamber 102, and the existing film and the new film are connected .

Further, in a state in which the vacuum of the process chamber 100 is maintained, the user can open the output chamber 104 and take out the take-up roller 108 to the outside. At this time, since the output chamber 104 is opened, the vacuum state of the output chamber 104 is destroyed.

In summary, the sputtering apparatus of the present invention can maintain the process chamber 100 in a vacuum state when the film is replaced or unloaded using the valve covers 120 and 122.

FIGS. 4 and 5 are views schematically showing an actual configuration of a sputtering apparatus according to an embodiment of the present invention, and FIG. 6 is a view illustrating a coupling structure according to an embodiment of the present invention. However, since operations in the process chamber and the output chamber are similar to those in the process chamber and the loading chamber, only the process chamber and the loading chamber are illustrated and the related operation will be described for the convenience of explanation.

Referring to FIG. 4, a lower block 402 and an upper block 408 may be formed in the chamber connection 400 between the loading chamber 102 and the process chamber 100. For example, the lower block 402 may be coupled to the chamber connection 400 in an inward direction of the loading chamber 102.

According to one embodiment, one side of the lower block 402 is formed in an oblique direction, and a portion of the oblique direction faces the cover 120 of the valve. That is, when the lid 120 descends, the bottom surface of the lid 120 comes into contact with a part of the surface of the lower block 402.

The valve may include a cover 120 and an elastic body 602 on the lower block 402.

The cover 120 is formed in an oblique direction and is coupled to the shaft 404. As a result, as the shaft 404 moves up and down, the lid 120 moves up and down.

Specifically, during the deposition process, the shaft 404 is positioned in the upper direction as shown in FIG. 4, with the result that the lid 120 is also positioned in the upper direction so that the lid 120 is separated from the lower block 402 do. As a result, the lid 120 does not shield the space 130 of the chamber connection portion 400.

On the other hand, when the new film is loaded or the film after the deposition process is taken out, the shaft 404 is lowered so that the cover 120 contacts the lower block 402 as shown in Fig. As a result, the lid 120 shields the space 130 of the chamber connection 400 and maintains the vacuum of the process chamber 100. At this time, the film 110 is introduced into the process chamber 100 through the space 130 between the lid 120 and the lower block 402.

In this case, in order to prevent damage to the film 110, the bottom surface of the lid 120 is formed to be convex (600) with the elastic body, and an elastic body 602 may be formed. As a result, even if the lid 120 is brought into contact with the lower block 402 while the film 110 is inserted, the damage of the film 110 can be minimized and the vacuum state of the process chamber 100 can be stably maintained have.

Further, in order to minimize the damage of the film 110, a protective guide made of a plastic material may be attached to the edge of the cover 120.

According to one embodiment, the lid 120 may be stably coupled to the shaft 404 through the support 414 and may be coupled to at least one side of the lid 120 such that movement of the lid 120 is limited A pin 416 may be formed. Here, the bush of the guide pin 416 is attached to the lower block 402, and the guide pin 416 can move up and down without detaching from the bush.

According to one embodiment, the shaft 404 can be moved up and down under the control of the pneumatic cylinder 406 while being coupled to the pneumatic cylinder 406. At this time, the pneumatic cylinder 406 may be fixedly coupled to the upper block 408 coupled to the chamber connection part 400.

When the shaft 404 descends, the end of the shaft 404 may pass through a hole formed in the lower block 402 as shown in Fig.

According to one embodiment, a hole may be formed in the upper end 410 of the loading chamber 102 and a shaft 404 may be arranged through the hole. At this time, a sealing member 412 may be formed to maintain the airtightness of the loading chamber 102.

In summary, the sputtering apparatus of the present invention can maintain the vacuum state of the process chamber 100 by opening and closing a valve including a lid 120 formed in an oblique direction and an elastic body 602 formed on an upper surface of the lower block . Preferably, the lid 120 of the valve is controlled to move up and down to open and close the space 130 of the chamber connection part 400.

Although not described above, the construction and operation of the process chamber 100 and the output chamber 104 are similar to the construction and operation of the process chamber 100 and the loading chamber 102.

It will be apparent to those skilled in the art that various modifications, additions and substitutions are possible, without departing from the spirit and scope of the invention as defined by the appended claims. Should be regarded as belonging to the following claims.

100: process chamber 102: loading chamber
104: output chamber 106, 108: take-up roller
110: Film 112, 114: Feed roller
120, 122: cover 130, 132: space
400: chamber connection part 402:
404: shaft 406: pneumatic cylinder
408: upper block 414: support
416: guide portion

Claims (3)

A process chamber for performing a deposition process of an object to be deposited;
A loading chamber for loading the deposition object; And
Comprising a valve,
Wherein a space is formed in a part of a chamber connecting portion between the process chamber and the loading chamber, the deposition object is transferred to the space, and when the deposition object is loaded into the loading chamber, the valve shields the space, Lt; RTI ID = 0.0 > vacuum,
Wherein the valve comprises:
A cover coupled to the shaft in an oblique direction; And
And an elastic body formed on one surface of the lower block coupled to the chamber connection part in an oblique direction,
The deposition object is a film,
The cover in the oblique direction is brought into contact with the elastic body formed on one surface of the lower block in the oblique direction by the descent of the shaft when the space is shielded,
Wherein when the film is positioned between the cover and the elastic body and the cover covers the space, the tension of the film is adjusted to be weaker than the tension of the film during the deposition process. A process chamber for performing a deposition process of an object to be deposited;
An output chamber for carrying out a deposition object on which a film is deposited by the process chamber; And
Comprising a valve,
Wherein a space is formed in a part of a chamber connecting portion between the process chamber and the output chamber, and an evaporation object on which the film is deposited is transferred to the space, and when the evaporation object on which the film is formed is taken out to the outside of the output chamber, Shielding the space to maintain the vacuum of the process chamber,
Wherein the valve comprises:
A cover coupled to the shaft in an oblique direction; And
And an elastic body formed on one surface of the lower block coupled to the chamber connection part in an oblique direction,
The deposition object is a film,
The cover in the oblique direction is brought into contact with the elastic body formed on one surface of the lower block in the oblique direction by the descent of the shaft when the space is shielded,
Wherein when the film is positioned between the cover and the elastic body and the cover covers the space, the tension of the film is adjusted to be weaker than the tension of the film during the deposition process. Depositing a film on the film in a process chamber;
After the deposition of the film is completed, shielding at least one of a first space of the first chamber connection between the process chamber and the loading chamber and a second space of the second chamber connection between the process chamber and the output chamber, Maintaining a state; And
Shielding the space and then transporting the formed film to the outside of the output chamber or loading a new film into the loading chamber,
The first lid is lowered to block the first space and the second lid descends to block the second space to maintain the vacuum state of the process chamber,
Wherein the first cover is coupled to the first shaft in an oblique direction, a first elastic body is formed on one surface of the first lower block coupled to the first chamber connection portion in an oblique direction,
The second lid is coupled to the second shaft in a diagonal direction. A second elastic body is formed on one surface of the second lower block coupled to the second chamber connection portion,
The deposition object is a film,
When the first space or the second space is shielded, the first cover or the second cover in the oblique direction is moved in the oblique direction by the descent of the first shaft or the second shaft, The first elastic body or the second elastic body formed on one side of the first elastic body,
Characterized in that when the film is positioned between the first cover and the first elastic body and the first cover shields the first space, the tension of the film is adjusted to be weaker than the tension of the film during the deposition process Of the stuffer device.

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