KR20170009056A - Light emitting device package and display device - Google Patents

Abstract

An embodiment of the present invention relates to a light emitting device package and a display device. The light emitting device package according to the embodiment of the present invention includes a body, at least one or more light emitting devices mounted on the body, and a recognition compensation layer which is located on the body and has a black color. The recognition compensation layer is arranged on at least one of the upper side and outer sides of the body. Accordingly, the present invention can improve a color recognition rate.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a light emitting device package,

An embodiment relates to a light emitting device package and a display device.

Light Emitting Device is a pn junction diode whose electrical energy is converted into light energy. It can be produced from compound semiconductor such as group III and group V on the periodic table and by controlling the composition ratio of compound semiconductor, It is possible.

GaN-based light emitting devices (LEDs) are used in various applications such as color LED display devices, LED traffic signals, and white LEDs. In recent years, the luminous efficiency of a high efficiency white LED is superior to the efficiency of a conventional fluorescent lamp, and is expected to replace a fluorescent lamp in a general illumination field.

Typical display display devices display various images or images using a plurality of light emitting device packages each having a light emitting device mounted thereon.

However, since the conventional display device uses a plurality of light emitting device packages, the recognition rate of an image or an image to be displayed may be lowered due to the structure of the light emitting device package having a body using a white color molding resin. In particular, a conventional display device can cause a contrast deterioration due to a white color body in a bright image or an image display. In addition, since the conventional display device mixes the white color and the yellow color by the white color body and the yellow fluorescent material in the non-display period of the image or the image, the display period and the non- .

Embodiments provide a light emitting device package and a display device capable of improving the color recognition rate.

The embodiment provides a display device capable of improving the recognition rate of an image or an image.

Embodiments provide a display device capable of improving image quality or appearance quality.

A light emitting material package according to an embodiment includes a body 220, 320a, 320b, 420, 520, 620, 720; At least one light emitting device 100 mounted on the body; And a recognition compensation layer (250, 350, 450, 550, 650 750) positioned on the body and having a black color, wherein the recognition compensation layer is disposed on at least one of an upper surface and an outer surface of the body .

The display device according to the embodiment may include the light emitting device package.

In the embodiment, since the black color recognition layer is disposed on the body or the molding part to provide the light emitting device package of black color as a whole, the contrast can be improved and the color recognition rate of the light emitted from the light emitting device can be improved.

In addition, in the embodiment, since the black color is maintained in the non-display period in which the light emitting element is not driven by the light emitting device package of the black color as a whole, the deterioration of the image quality and the appearance quality due to repetition of the display period and the non- .

1 is a view showing a display device according to an embodiment.
2 is a cross-sectional view illustrating a light emitting device package according to the first embodiment.
3 is a cross-sectional view illustrating a light emitting device according to an embodiment.
4 is a cross-sectional view illustrating a light emitting device package according to the second embodiment.
5 is a cross-sectional view illustrating a light emitting device package according to a third embodiment.
6 is a cross-sectional view illustrating a light emitting device package according to a fourth embodiment.
7 is a cross-sectional view illustrating a light emitting device package according to a fifth embodiment.
8 is a cross-sectional view illustrating a light emitting device package according to a sixth embodiment.
9 is a cross-sectional view illustrating a light emitting device package according to a seventh embodiment.
10 is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment.

Hereinafter, a light emitting device and a light emitting device package according to embodiments will be described in detail with reference to the accompanying drawings. In the description of the embodiments, it is to be understood that each layer (film), region, pattern or structure may be formed "on" or "under" a substrate, each layer The terms " on "and " under " include both being formed" directly "or" indirectly " Also, the criteria for top, bottom, or bottom of each layer will be described with reference to the drawings.

FIG. 1 is a view illustrating a display device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view illustrating a light emitting device package according to a first embodiment. FIG. 3 is a cross-sectional view illustrating a light emitting device according to an embodiment.

1 to 3, the display device 10 according to the embodiment includes a plurality of light emitting device packages 200.

For example, the display device 10 may display an image or an image. However, the display device 10 may be applied to a backlight unit, a lighting unit, a pointing device, a lamp, a streetlight, a vehicle lighting device, But is not limited thereto.

In the display device 10 of the embodiment, a display device such as an electric signboard is described as an example.

In the display device 10, a plurality of light emitting device packages 200 may be arranged adjacently in the horizontal and vertical directions.

The plurality of light emitting device packages 200 may include a light emitting device 100, a body 220, and a recognition compensation layer 250.

The light emitting device 100 may emit visible light, but the present invention is not limited thereto. For example, the light emitting device 100 may emit UV-C wavelengths, that is, ultraviolet wavelengths in the range of 100 nm to 280 nm, or may emit infrared wavelengths.

The light emitting device 100 may include a light emitting structure 110 including a first conductive semiconductor layer 112, an active layer 114, and a second conductive semiconductor layer 116.

The first conductive semiconductor layer 112 may be formed of a semiconductor compound, for example, a compound semiconductor such as Group II-IV and Group III-V, and may be doped with a first conductive dopant. When the first conductive semiconductor layer 112 is an n-type semiconductor layer, it may include Si, Ge, Sn, Se, and Te as an n-type dopant, but the present invention is not limited thereto. The first conductive semiconductor layer 112 may include a light extracting pattern 119 for improving light extraction efficiency.

The active layer 114 may be formed of at least one of a single quantum well structure, a multi quantum well (MQW) structure, a quantum-wire structure, or a quantum dot structure.

The active layer 114 may be made of a compound semiconductor. The active layer 114 may be formed of at least one of Group II-IV and Group III-V compound semiconductors. The active layer 114 may include a quantum well layer and a quantum barrier layer. When the active layer 114 is implemented as a multiple quantum well structure, the quantum well layer and the quantum barrier layer may be alternately arranged.

The second conductive semiconductor layer 116 may be formed of a semiconductor compound, for example, a compound semiconductor such as Group II-IV and Group III-V, and may be doped with a second conductive dopant. When the second conductive semiconductor layer 116 is a p-type semiconductor layer, the second conductive dopant may include Mg, Zn, Ca, Sr, and Ba as p-type dopants.

Although the first conductive semiconductor layer 112 is an n-type semiconductor layer and the second conductive semiconductor layer 116 is a p-type semiconductor layer, the first conductive semiconductor layer 112 may be a p- And the second conductivity type semiconductor layer 116 may be formed of an n-type semiconductor layer, but the present invention is not limited thereto. An n-type semiconductor layer (not shown) having a polarity opposite to that of the second conductivity type may be formed on the second conductivity type semiconductor layer 116, for example. Accordingly, the light emitting structure 110 may have any one of an n-p junction structure, a p-n junction structure, an n-p-n junction structure, and a p-n-p junction structure.

The light emitting device 100 may include a first electrode 150 disposed on the light emitting structure 110 and a second electrode 170 disposed on the lower portion of the light emitting structure 110.

The second electrode 170 may include a contact layer 165, a reflective layer 167, and a bonding layer 169.

The contact layer 165 may be formed by laminating a single metal, a metal alloy, a metal oxide, or the like so as to efficiently perform carrier injection.

The reflective layer 167 may be positioned on the contact layer 165.

A bonding layer 169 may be formed under the reflective layer 167.

A supporting member 173 is formed below the bonding layer 169, and the supporting member 173 may be formed of a conductive member.

In addition, the light emitting device 100 of the embodiment may include the current blocking layer 161 and the channel layer 163 under the light emitting structure 110. [

Although the light emitting device 100 is described as a vertical type in which the first and second electrodes 150 and 170 are located on the upper and lower sides of the light emitting structure 110, the present invention is not limited thereto. That is, the light emitting device may be a horizontal type in which all of the electrodes are disposed on one surface of the light emitting structure.

The body 220 may include a conductive substrate such as silicon (Si), a resin material such as polyphthalamide (PPA), polycyclohexylene terephthalate (PCT), a ceramic substrate, Substrate or the like. The body 220 includes a cavity 221 in a region where the light emitting device 100 is mounted. The cavity 221 may have a groove structure having an open upper surface with respect to a central region of the body 220. The body 220 may include an upper surface 224 extending from the cavity 221. Here, the light emitting device 100 may be mounted on the bottom surface of the cavity 221.

Although not shown in the figure, the cavity 220 of the body 220 may include a lead frame (not shown) electrically connected to the light emitting device 100.

The light emitting device package 200 of the embodiment may include a molding part 230 disposed in the cavity 221. The molding part 230 may include a phosphor. The molding part 230 may be positioned on the light emitting device 100. That is, the molding part 230 may cover the light emitting device 100. The upper surface of the molding part 230 may be located on the same plane as the upper surface of the body 220, but the present invention is not limited thereto.

The recognition compensation layer 250 may include black color pigments, but is not limited thereto. The recognition compensation layer 250 may be positioned on the body 220. The recognition compensation layer 250 may be in direct contact with the upper surface 224 of the body 220. The recognition compensation layer 250 may be positioned on the molding part 230. The recognition compensation layer 250 may be in direct contact with the upper surface of the molding part 230. The recognition compensation layer 250 includes a function of improving the contrast reduction caused by the bright white color body 220. That is, since the recognition compensation layer 250 is disposed on the body 220 to provide the light emitting device package 200 of the black color as a whole, the contrast degradation due to the bright color body 220 is reduced, It is possible to improve the color recognition rate of the light emitted from the light source.

The recognition compensation layer 250 may be formed of one of polyphthalamide (PPA), polycyclohexylenedimethylene terephthalate (PCT), silicone (Si), and epoxy molding compound (EMC) having a black color. The recognition compensation layer 250 is formed on the body 220 and the molding part 230 by one of trancer molding, dispensing molding, compression molding and screen printing. As shown in FIG.

The recognition compensation layer 250 may include a first area a1 in direct contact with the molding part 230 and a second area a2 in direct contact with the top surface 224 of the body 220 have.

The first region a1 can control the pigment density or the thickness of the black color of the recognition compensation sheet 250 to have a high transmittance as a region through which the light emitted from the light emitting device 100 passes. For example, the thickness of the first region a1 may be 1 占 퐉 to 100 占 퐉. The transmittance of the first region a1 may be 50% or more. For example, the pigment density of the black color can be adjusted so that the transmittance of the first region (a1) is 50% to 90%. If the thickness of the first area a1 is less than 1 mu m, the white color of the body 220 may be exposed from the recognition compensation layer 250, thereby lowering the recognition rate of color. If the thickness of the first region a1 is more than 100 mu m, the recognition rate of color due to a decrease in transmittance of light emitted from the light emitting device 100 may be reduced.

The thickness of the second region a2 may be the same as the thickness of the first region a1, but is not limited thereto. For example, the thicknesses of the first and second regions a1 and a2 may be different from each other, and the thickness of the first region a1 may be thinner than the thickness of the second region a2.

The display device 10 according to the first embodiment provides the light emitting device package 200 of black color as a whole by the black color recognition layer 250 disposed on the body 220 and the molding part 230 The contrast can be improved and the color recognition rate of the light emitted from the light emitting element 100 can be improved.

The display device 10 of the embodiment maintains the black color in the non-display period in which the light-emitting device 100 is not driven by the light-emitting device package 200 of the black color as a whole, It is possible to improve image quality and deterioration in appearance quality.

4 is a cross-sectional view illustrating a light emitting device package according to the second embodiment.

As shown in FIG. 4, the second embodiment includes first and second light emitting device packages 300a and 300b. The second embodiment may include a recognition compensation layer 350.

Each of the first and second light emitting device packages 300a and 300b may include a light emitting device 100 and a molding part 230. The light emitting device 100 and the molding part 230 may adopt the technical features of the first embodiment of FIGS.

The first light emitting device package 300a may include a first body 320a. The first body 320a includes a first cavity 321a on which the light emitting device 100 is mounted and the first body 320a may include inclined first outer surfaces 325a. The width of the first outer side surfaces 325a may become narrower toward the upper portion of the first body 320a. The first outer side surfaces 325a may be connected to the cavity 321a. That is, the upper ends of the first outer side surfaces 325a may be connected to the cavity 321a.

The second light emitting device package 300b may include a second body 320b. The second body 320b may include a second cavity 321b on which the light emitting device 100 is mounted and the second body 320b may include inclined second outer surfaces 325b. The width of the second outer side surfaces 325b may become narrower toward the upper portion of the second body 320b. The second outer side surfaces 325b may be connected to the cavity 321b. That is, the upper ends of the second outer side surfaces 325b may be connected to the cavity 321b.

The recognition compensation layer 350 may include a first area a1 disposed on the molding part 230. [ The first area a1 may employ the technical features of the first embodiment.

The recognition compensation layer 350 may include a second region a2 disposed between the first and second bodies 320a and 320b. The second region a2 of the recognition compensation layer 350 may be in direct contact with the first outer surfaces 325a of the first body 320a and the second outer surface 322a of the second body 320b may be in direct contact with the first outer surfaces 325a of the first body 320a, 325b. ≪ / RTI >

The material and manufacturing method of the recognition compensation layer 350 may adopt the technical features of the first embodiment of FIG.

The height of the second area a2 of the recognition compensation layer 350 may be equal to the height of the first and second bodies 320a and 320b, but is not limited thereto.

The second embodiment differs from the first embodiment in that the recognition compensation layer 350 of the first area a1 covering the molding part 230 of the first and second light emitting device packages 300a and 300b and the first and second bodies 320a, The first and second light emitting device packages 300a and 300b of black color are provided entirely by the recognition compensation layer 350 of the second region a2 between the light emitting devices 100 and 320b, The color recognition rate of the emitted light can be improved.

5 is a cross-sectional view illustrating a light emitting device package according to a third embodiment.

5, the light emitting device package 400 according to the third embodiment may include a body 420, a molding part 230, a light emitting device 100, and a recognition compensation layer 450.

The body 420 may include a cavity 421 in which the light emitting device 100 is mounted. The cavity 421 may include a bottom surface 422 on which the light emitting device 100 is mounted and an inclined inner surface 423 connected to the bottom surface 422. The body 420 may include inclined outer surfaces 425. The width of the outer surfaces 425 may become narrower toward the upper portion of the body 420. The outer surfaces 425 may be connected to the cavity 421. That is, the upper end of the outer side surfaces 425 may be connected to the cavity 421.

The recognition compensation layer 450 may be disposed on the body 420. The recognition compensation layer 450 is disposed on the cavity 421 and the outer surfaces 425 of the body 420 and may be in direct contact therewith. That is, the recognition compensation layer 450 may be disposed on the outer surfaces 425 of the body 420 and may be disposed on the bottom surface 422 and the inner surface 423 of the cavity 421 . The molding part 230 may be disposed on the cavity 421. The molding part 230 may be disposed on the recognition compensation layer 450 disposed on the cavity 421.

The recognition compensation layer 450 formed on the bottom surface 422 of the cavity 421 may expose a pad region electrically connected to the lead frame (not shown) of the light emitting device 100 and the body 420 .

The light emitting device 100 and the molding part 230 may adopt the technical features of the light emitting device package of the first embodiment of FIG.

The material and manufacturing method of the recognition compensation layer 450 may adopt the technical features of the first embodiment of FIG.

The third embodiment provides a black color light emitting device package 400 as a whole by the recognition compensation layer 450 disposed on the body 420 so that the contrast is improved and the color recognition rate of the light emitted from the light emitting device 100 Can be improved.

6 is a cross-sectional view illustrating a light emitting device package according to a fourth embodiment.

6, the light emitting device package 500 according to the fourth embodiment may include a body 520, a molding part 230, a light emitting device 100, and a recognition compensation layer 550.

The body 520 may include a cavity 521 in which the light emitting device 100 is mounted. The cavity 521 may include a bottom surface 522 on which the light emitting device 100 is mounted and an inner surface 523 connected to the bottom surface 522. The body 520 may include a top surface 524 located at the edge of the cavity 521. The upper surface 524 may be connected to the cavity 521. The body 520 may include outer surfaces 525 having a predetermined width. The outer surfaces 525 may be connected to the upper surface 524 of the body 520. That is, the upper end of the outer side surfaces 525 may be connected to the cavity 524 of the body 520.

The recognition compensation layer 550 includes a first region a1 disposed on the molding portion 230 and a second region a2 positioned on the upper surface 524 and the outer surfaces 525 of the body 520. [ (a2). The first area a1 may be in direct contact with the molding part 230. [ The second region a2 may be in direct contact with the upper surface 524 and the outer surfaces 525 of the body 520.

The first area a1 may employ the technical features of the first embodiment of Fig.

The light emitting device 100 and the molding part 230 may adopt the technical features of the light emitting device package of the first embodiment shown in FIGS.

The material and manufacturing method of the recognition compensation layer 550 may employ the technical features of the first embodiment of FIG.

The fourth embodiment is a method of manufacturing a light emitting device package 500 of a black color as a whole by the upper surface 524 and the outer surface 525 of the body 520 and the recognition compensation layer 550 disposed on the molding part 230. [ The contrast can be improved and the color recognition rate of the light emitted from the light emitting device 100 can be improved.

7 is a cross-sectional view illustrating a light emitting device package according to a fifth embodiment.

7, the light emitting device package 600 according to the fifth embodiment includes the first to third light emitting devices 100a to 100c, the body 620, the molding unit 230, and the recognition compensation layer 650 ).

The first through third light emitting devices 100a through 100c may emit light of different wavelengths. For example, the first to third light emitting devices 100a to 100c may include red, green, and blue light emitting devices, but the present invention is not limited thereto. Each of the first through third light emitting devices 100a through 100c may employ the technical features of the first embodiment shown in Figs. 2 and 3.

The body 620 includes a cavity 621 and the cavity 621 is connected to the bottom surface 622 on which the first to third light emitting devices 100a to 100c are mounted and the bottom surface 622 And may include an inclined inner surface 623. The body 620 may include outer surfaces 625 having a constant width. The outer surfaces 625 may be connected to the cavity 621. That is, the upper end of the outer surfaces 625 may be connected to the cavity 621.

The recognition compensation layer 650 formed on the bottom surface 622 of the cavity 621 is electrically connected to the lead frame (not shown) of the body 620 through the first to third light emitting devices 100a to 100c The pad area can be exposed.

The recognition compensation layer 650 may be disposed on the bottom surface 622 and the inner surface 623 of the cavity 621. The molding part 230 may be disposed on the cavity 621. That is, the molding part 230 may be disposed on the recognition compensation layer 650 disposed on the cavity 621.

The molding part 230 may adopt the technical features of the first embodiment of FIG.

The material and manufacturing method of the recognition compensation layer 650 may adopt the technical features of the first embodiment of FIG.

The fifth embodiment provides a black color light emitting device package 600 as a whole by the recognition compensation layer 650 disposed in the cavity 621 of the body 620 so that the contrast is improved and light emitted from the light emitting element 100 The color recognition rate of light can be improved.

8 is a cross-sectional view illustrating a light emitting device package according to a sixth embodiment.

8, the light emitting device package 700 according to the sixth embodiment may include first through third light emitting devices 100a through 100c, a body 720, and a recognition compensation layer 750 .

The first through third light emitting devices 100a through 100c may employ the technical features of the fifth embodiment shown in FIG.

The body 720 may include a flat upper surface 724 and a lower surface 726. That is, the body 720 may have a constant thickness and include a top surface 724 and a bottom surface 726 extending in parallel. Although not shown in the figure, the body 720 may include a lead frame (not shown) electrically connected to the first through third light emitting devices 100a through 100c.

The recognition compensation layer 750 may be disposed on the flat upper surface 724. The recognition compensation layer 750 may expose a pad region electrically connected to the lead frame (not shown) of the light emitting device 100 and the body 720.

The material and manufacturing method of the recognition compensation layer 750 may adopt the technical features of the first embodiment of FIG.

The sixth embodiment provides the entirely black color light emitting device package 700 by the recognition compensation layer 750 disposed on the flat top surface 724 of the body 720, The color recognition rate of the emitted light can be improved.

9 is a cross-sectional view illustrating a light emitting device package according to a seventh embodiment.

9, the light emitting device package 800 according to the sixth embodiment includes first through third light emitting devices 100a through 100c, a body 720, a molding part 830, and a recognition compensation layer 850 ).

The first through third light emitting devices 100a through 100c and the body 720 may adopt the technical features of the sixth embodiment of FIG.

The molding portion 830 may be disposed on a flat upper surface 724 of the body 720. The molding part 830 may be formed in a square pillar shape, but is not limited thereto. That is, the molding part 830 may be arranged on the upper surface 724 of the body 720 in various shapes. For example, the molding part 830 may be a semicircle, a hemisphere, or the like.

The recognition compensation layer 850 may be disposed on the molding portion 830. The recognition compensation layer 850 may cover the entire molding portion 830 exposed to the outside, but is not limited thereto. That is, the recognition compensation layer 850 may be disposed on the upper surface excluding the side surfaces of the molding portion 830.

The material and manufacturing method of the recognition compensation layer 850 may employ the technical features of the first embodiment of FIG.

The seventh embodiment provides the light emitting device package 800 of black color as a whole by the recognition compensation layer 850 disposed on the molding part 830 so that the contrast is improved and the color of the light emitted from the light emitting element 100 The recognition rate can be improved.

10 is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment.

10, the lighting apparatus according to the embodiment includes a cover 2100, a light source module 2200, a heat discharger 2400, a power supply unit 2600, an inner case 2700, and a socket 2800 . Further, the illumination device according to the embodiment may further include at least one of the member 2300 and the holder 2500. The light source module 2200 may include a light emitting device package according to an embodiment.

For example, the cover 2100 may have a shape of a bulb or a hemisphere, and may be provided in a shape in which the hollow is hollow and a part is opened. The cover 2100 may be optically coupled to the light source module 2200. For example, the cover 2100 may diffuse, scatter, or excite light provided from the light source module 2200. The cover 2100 may be a kind of optical member. The cover 2100 may be coupled to the heat discharging body 2400. The cover 2100 may have an engaging portion that engages with the heat discharging body 2400.

The inner surface of the cover 2100 may be coated with a milky white paint. Milky white paints may contain a diffusing agent to diffuse light. The surface roughness of the inner surface of the cover 2100 may be larger than the surface roughness of the outer surface of the cover 2100. This is for sufficiently diffusing and diffusing the light from the light source module 2200 and emitting it to the outside.

The cover 2100 may be made of glass, plastic, polypropylene (PP), polyethylene (PE), polycarbonate (PC), or the like. Here, polycarbonate is excellent in light resistance, heat resistance and strength. The cover 2100 may be transparent so that the light source module 2200 is visible from the outside, and may be opaque. The cover 2100 may be formed by blow molding.

The light source module 2200 may be disposed on one side of the heat discharging body 2400. Accordingly, heat from the light source module 2200 is conducted to the heat discharger 2400. The light source module 2200 may include a light source unit 2210, a connection plate 2230, and a connector 2250. The light source module 2200 may employ at least one of the light emitting device packages of the first to seventh embodiments.

The member 2300 is disposed on the upper surface of the heat discharging body 2400 and has guide grooves 2310 through which the plurality of light source portions 2210 and the connector 2250 are inserted. The guide groove 2310 corresponds to the substrate of the light source unit 2210 and the connector 2250.

The surface of the member 2300 may be coated or coated with a light reflecting material. For example, the surface of the member 2300 may be coated or coated with a white paint. The member 2300 reflects the light reflected by the inner surface of the cover 2100 toward the cover 2100 in the direction toward the light source module 2200. Therefore, the light efficiency of the illumination device according to the embodiment can be improved.

The member 2300 may be made of an insulating material, for example. The connection plate 2230 of the light source module 2200 may include an electrically conductive material. Therefore, electrical contact can be made between the heat discharging body 2400 and the connecting plate 2230. The member 2300 may be formed of an insulating material to prevent an electrical short circuit between the connection plate 2230 and the heat discharging body 2400. The heat discharger 2400 receives heat from the light source module 2200 and heat from the power supply unit 2600 to dissipate heat.

The holder 2500 blocks the receiving groove 2719 of the insulating portion 2710 of the inner case 2700. Therefore, the power supply unit 2600 housed in the insulating portion 2710 of the inner case 2700 is sealed. The holder 2500 has a guide protrusion 2510. The guide protrusion 2510 has a hole through which the protrusion 2610 of the power supply unit 2600 passes.

The power supply unit 2600 processes or converts an electrical signal provided from the outside and provides the electrical signal to the light source module 2200. The power supply unit 2600 is housed in the receiving groove 2719 of the inner case 2700 and is sealed inside the inner case 2700 by the holder 2500. The power supply unit 2600 may include a protrusion 2610, a guide 2630, a base 2650, and an extension 2670.

The guide portion 2630 has a shape protruding outward from one side of the base 2650. The guide portion 2630 may be inserted into the holder 2500. A plurality of components may be disposed on one side of the base 2650. The plurality of components include, for example, a DC converter for converting AC power supplied from an external power source into DC power, a driving chip for controlling driving of the light source module 2200, an ESD (ElectroStatic discharge) protective device, and the like, but the present invention is not limited thereto.

The extension portion 2670 has a shape protruding outward from the other side of the base 2650. The extension portion 2670 is inserted into the connection portion 2750 of the inner case 2700 and receives an external electrical signal. For example, the extension portion 2670 may be provided to be equal to or smaller than the width of the connection portion 2750 of the inner case 2700. One end of each of the positive wire and the negative wire is electrically connected to the extension portion 2670 and the other end of the positive wire and the negative wire are electrically connected to the socket 2800 .

The features, structures, effects and the like described in the embodiments are included in at least one embodiment and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects and the like illustrated in the embodiments can be combined and modified by other persons skilled in the art to which the embodiments belong. Accordingly, the contents of such combinations and modifications should be construed as being included in the scope of the embodiments.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention. It can be seen that the modification and application of branches are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof.

220, 320a, 320b, 420, 520, 620, 720:
230, and 830:
250, 350, 450, 550, 650 750: recognition compensation layer

Claims (15)

Body;
At least one light emitting element mounted on the body; And
And a recognition compensation layer located on the body and having a black color,
Wherein the recognition compensation layer is disposed on at least one of an upper surface and an outer surface of the body. The method according to claim 1,
Wherein the recognition compensation layer has a thickness of 1 占 퐉 to 100 占 퐉. The method according to claim 1,
The light emitting device package of claim 1, further comprising a molding part located on the light emitting device, wherein the molding part comprises a phosphor. The method of claim 3,
And the recognition compensation layer extends to an upper surface of the molding part. The method of claim 3,
Wherein the recognition compensation layer comprises a first region located on the upper surface of the molding portion and a second region located on the upper surface of the body and extending from the first region and wherein the first and second regions have the same thickness A light emitting device package. The method of claim 3,
Wherein the recognition compensation layer comprises a first region located on the upper surface of the molding section and a second region located on the upper surface of the body and extending from the first region and wherein the first and second regions have different thicknesses A light emitting device package. The method of claim 3,
Wherein the recognition compensation layer comprises a first region located on the upper surface of the molding section and a second region located on the upper surface of the body and extending from the first region, A thinner light emitting device package. The method of claim 3,
Wherein the body includes a cavity, outer sides of the body have a constant width,
Wherein the recognition compensation layer is disposed on the outer surfaces, the upper surface of the body, and the molding part. The method according to claim 1,
Wherein the body includes a cavity, the outer side surfaces of the body are connected to the cavity by narrowing the width toward the upper direction,
And the recognition compensation layer is disposed on the outer side surfaces and the cavity. The method of claim 3,
The body including a cavity,
The outer side surfaces of the body have a width that becomes narrower toward the upper side, outer side surfaces of the body are connected to the cavity,
Wherein the molding portion is disposed in the cavity,
And the recognition compensation layer is disposed between the cavity and the molding part. 11. The method of claim 10,
Wherein the cavity includes a bottom surface and an inner surface, and the recognition compensation layer extends to an inner surface of the cavity. 11. The method of claim 10,
Wherein the cavity includes a bottom surface and an inner surface, and the recognition compensation layer extends to a bottom surface of the cavity. The method of claim 3,
The body including a cavity,
The outer surfaces of the body have a constant width, the outer surfaces of the body are connected to the cavity,
Wherein the molding portion is disposed in the cavity,
And the recognition compensation layer is disposed between the cavity and the molding part. The method according to claim 1,
Wherein the body further comprises a molding part on an upper surface of the body, the upper surface and the lower surface being flat, and the recognition compensation layer covering the molding part. A display device comprising at least one light emitting device package according to any one of claims 1 to 14.

Images