KR20170001373A - LED floodlight for high ceilings - Google Patents

LED floodlight for high ceilings Download PDF

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Publication number
KR20170001373A
KR20170001373A KR1020150091276A KR20150091276A KR20170001373A KR 20170001373 A KR20170001373 A KR 20170001373A KR 1020150091276 A KR1020150091276 A KR 1020150091276A KR 20150091276 A KR20150091276 A KR 20150091276A KR 20170001373 A KR20170001373 A KR 20170001373A
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KR
South Korea
Prior art keywords
housing
pcb assembly
led
heat sink
circuit part
Prior art date
Application number
KR1020150091276A
Other languages
Korean (ko)
Other versions
KR101692887B1 (en
Inventor
백태인
Original Assignee
주식회사 국민조명
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Application filed by 주식회사 국민조명 filed Critical 주식회사 국민조명
Priority to KR1020150091276A priority Critical patent/KR101692887B1/en
Publication of KR20170001373A publication Critical patent/KR20170001373A/en
Application granted granted Critical
Publication of KR101692887B1 publication Critical patent/KR101692887B1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/02—Wall, ceiling, or floor bases; Fixing pendants or arms to the bases
    • F21V21/03—Ceiling bases, e.g. ceiling roses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0035—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • Y02B20/34—

Abstract

The present invention relates to a ghost light emitting diode (LED) floodlight and the like. The disclosed ghost light LED light source includes a housing in which a space portion is formed inwardly through an opened lower portion and a flange portion is formed on an outer periphery of the lower portion, And a surge protection circuit part connected to the housing, the surge protection circuit part being mounted on a chip on board type, and a chip on board type SMPS circuit part being radially formed on the outside of the surge protection circuit part, And a plurality of light emitting diodes (LEDs) are mounted on the outside of the SMPS circuit portion in a radial manner with the surge protection circuit portion as a center. The LED assembly is coupled to a flange portion of the housing to diffuse light emitted from the LEDs A plurality of heat sinks mounted on the upper portion of the housing, And a cover plate coupled to an upper surface of the heat sink.
According to the present invention, it is possible to improve the structure of the heat dissipating device, maximize the heat dissipation efficiency, and ensure the insulation and electrical stability of the LED device, thereby doubling the durability and light efficiency of the LED light.

Description

LED floodlight for high ceilings

BACKGROUND OF THE INVENTION 1. Field of the Invention [0002] The present invention relates to an LED light for ghost lamps installed in a warehouse or a factory having a high ceiling height and collecting light in a predetermined direction.

Generally, a floodlight is installed indoors or outdoors, and irradiates light of a necessary brightness to a specific site indoors or outdoors.

Such a floodlight is mainly made of a high-intensity discharge lamp, and the surface on which the light is projected is made of glass or acrylic having a high transmittance. The floodlight is installed at an optimal position for enhancing the lighting effect, And is irradiated in a desired direction.

There are lamps such as metal halide lamps, sodium halide lamps, halogen lamps, etc., which have a large consumption of electric power, short service life, long time required for lighting, and time and cost for maintenance And has the disadvantage of polluting the environment.

Accordingly, LEDs consuming less power in recent years and having a semi-permanent lifetime characteristic in terms of energy saving are widely used for improvement of illumination and energy saving.

However, in the case of floodlighting using conventional LEDs, there is a problem that the capacity of the LED is increased due to a large illumination range, the weight of the luminaire becomes heavy, the volume becomes large, and a large amount of heat is generated.

Although the prior art documents below disclose technologies related to LED floodlighting and the like, the following prior art documents also fail to solve the above-mentioned problems.

Korean Patent Publication No. 10-2013-0044280 (May 02, 2013)

DISCLOSURE Technical Problem The present invention has been devised to overcome the problems of the prior art described above and provides an insulation structure and a heat dissipation structure that are effective for an LED floodlight and the like, and also provides a light efficiency such as an LED floodlight through a chip onboard type surge protection circuit and an SMPS circuit. And an object of the present invention is to provide an illuminated floodlight for ghost towns that can improve productivity and productivity.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not intended to limit the invention to the precise form disclosed. It can be understood.

According to a preferred embodiment of the present invention, there is provided an air conditioner comprising: a housing having a space formed inwardly through an opened lower portion and a flange formed on an outer periphery of a lower portion; an insulating plate coupled to an upper inner surface of the housing; And a surge protection circuit part is mounted on the chip onboard type in the center part and a chip on board type SMPS circuit part is mounted on the outer side of the surge protection circuit part in a radial manner. A plurality of heat sinks mounted on an upper portion of the housing, a plurality of heat sinks formed on the upper surface of the housing, As shown in Fig.

More preferably, the insulating plate can be fastened to the upper inner surface of the housing via a plurality of insulating screws together with the PCB assembly.

More preferably, the heat sink is formed in a cylindrical shape having a predetermined length, and a fastening groove is formed in the bottom surface, and a fastening screw passing through the PCB assembly, the insulating plate, and the upper inner surface of the housing is fastened to the fastening groove.

More preferably, the PCB assembly is formed with an insulating fastener having a diameter larger than that of the head so as not to come into contact with the head of the fastening screw.

More preferably, one of the heat sinks is disposed at a center portion of the upper portion of the housing so as to correspond to the surge protection circuit portion of the PCB assembly, and a plurality of heat sinks are arranged in a radial pattern around the central portion of the upper portion of the housing to correspond to the SMPS circuit portion and the LED element of the PCB assembly .

More preferably, the plurality of heat sinks are configured to be spaced apart from each other such that the heat radiation path is formed.

More preferably, a fixing member is provided at the center of the upper surface of the cover plate, and the lower end of the fixing member is coupled to the upper surface of the heat sink passing through the cover plate and located at the central portion of the upper portion of the housing.

More preferably, the reflector is coupled to the flange portion of the housing so that the center portion of the reflector passes through the flange portion of the housing so that the light from the LED element can be gathered and irradiated downward.

More preferably, the heat sink is formed with a boss penetrating the upper and lower surfaces of the heat sink. The outer circumference of the boss is radially extended around the boss, and a wing is formed in which a part of the end is divided into a plurality of parts. .

The present invention improves the efficiency of manufacture and maintenance by improving the insulation and heat dissipating assembly structures such as high power LED floodlighting by individually tightening them, maximizing the structural improvement of the heat dissipation device installed in high output floodlighting and maximizing heat dissipation efficiency, It is possible to secure insulation and electrical stability of an LED element using a relatively high voltage and to ensure long-term durability and light efficiency such as LED floodlighting.

In addition, since the effect of the present invention described above is expected to be exerted by the composition of the contents regardless of whether or not the inventor perceives it, the effect described above is only some effects according to the contents described, Should not be recognized.

Further, the effect of the present invention should be grasped further by the entire description of the specification, and even if it is not stated in an explicit sentence, a person having ordinary skill in the art to which the written description belongs, It should be seen as an effect described in this specification.

1 is a perspective view illustrating an LED flood light according to an embodiment of the present invention.
2 is an exploded perspective view illustrating the structure of an LED light source according to an exemplary embodiment of the present invention.
3 is a bottom perspective view of an LED floodlight and the like according to an embodiment of the present invention.
4A is an assembled cross-sectional view of an LED light source according to an exemplary embodiment of the present invention.
FIG. 4B is a cross-sectional view showing a substantial part of an LED light projection or the like according to an embodiment of the present invention. FIG.
5 is a plan view illustrating a heat sink installation state of an LED light projection or the like according to an embodiment of the present invention,
6 is a circuit diagram of an LED floodlight including a surge protection circuit part, an SMPS circuit part, and an LED device according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

It is to be understood that the same is by way of illustration and example only and is not to be taken by way of limitation, the scope of the present invention being indicated by the appended claims rather than by the foregoing description.

In addition, the sizes and shapes of the components shown in the drawings may be exaggerated for clarity and convenience of explanation, and the terms defined specifically in consideration of the structure and operation of the contents described may vary depending on the intention or custom of the user or the operator And the definitions of these terms should be based on the contents throughout this specification.

An important component of the ghost light LED floodlight according to the present invention includes a housing having a lower portion thereof opened and a space portion formed therein, an insulating plate coupled to an upper inner surface of the housing, A PCB assembly coupled to the upper surface of the housing, a diffusion plate coupled to the lower edge of the housing, a heat sink mounted on the upper portion of the housing, and a cover plate mounted on the upper surface of the heat sink. Hereinafter, the components will be described in detail with reference to the accompanying drawings.

First of all,

As shown in FIGS. 1 and 2, an insulating plate 200 and a PCB assembly 300 to be described later are accommodated therein. A diffusion plate 400, which will be described later, is fixed to the lower portion. A heat sink 600, Respectively.

Referring to FIGS. 2 and 4A, the housing 100 is formed with a space portion 110 having a predetermined depth therein while being opened only in a lower portion thereof, .

The flange portion 120 is formed by bending the end portion of the lower portion of the housing 100 which is lower than the outer circumference of the flange portion 120. The flange portion 120 is provided with a fastening hole Unrepresented) is formed.

Although the housing 100 according to the present invention is illustrated as a circular shape through the illustrated drawings, the shape of the housing 100 need not be limited to a circular shape. The housing 100 may have various shapes according to a user's selection, The shapes of the insulating plate 200, the PCB assembly 300, and the diffusion plate 400, which will be described later, are determined according to the shape of the housing 100 according to the shape of the housing 100 .

The material of the housing 100 may be a metal having an excellent thermal conductivity, and may be formed through one or more heat dissipation holes (not shown) on the outer circumferential surface for dissipating heat as required.

In the insulating plate 200,

And is coupled to the upper inner surface of the housing 100 together with the PCB assembly 300 to be described later to serve as insulation and heat conduction between the PCB assembly 300 and the housing 100.

The insulating plate 200 is preferably made of a resin-based insulating material having excellent heat conductivity and insulating property so that the PCB assembly 300 and the housing 100 are not energized in order to cut heat generated in the PCB assembly 300 into the housing 100 Do.

As shown in FIG. 2, the insulating plate 200 may be in the shape of a disc corresponding to the housing 100 as it is coupled to the upper inner surface of the housing 100, regardless of the shape of the housing 100 But may be modified into various shapes other than circular shapes.

4A, the insulating plate 200 is fastened to the upper inner surface of the housing 100 through a plurality of fastening screws 210. At this time, the head 211 of the fastening screw 210 faces downward, The opposite end formed is passed through the upper portion of the housing 100 and then engaged with the heat sink 600 described later.

The PCB assembly 300 includes a PCB 300,

A surge protection circuit unit 310 for protecting a voltage and a current inputted through a power supply from damage, a SMPS circuit unit 320 as a power supply device using a switching circuit, a plurality of LED devices 330 Is a printed circuit board.

2 and 3, the PCB assembly 300 is coupled to the upper inner surface of the housing 100 together with the insulating plate 200 described above, and is connected to the insulating plate 200 and the housing 100 to correspond to the insulating plate 200 and the housing 100. [ And may be modified into various shapes other than the circular shape regardless of the shape of the insulating plate 200 and the housing 100. [

3, when the surge protection circuit unit 310, the SMPS circuit unit 320, and the LED device 330 are mounted on the PCB assembly 300, as shown in FIG. 3, A chip on board type SMPS circuit part 320 is radially mounted on the outside of the surge protection circuit part 310 and the surge protection circuit part 310 A plurality of LED elements 330 are mounted on the outside of the SMPS circuit part 320 in a radial manner.

4A and 4B, the PCB assembly 300 is coupled to the upper inner surface of the housing 100 together with the insulating plate 200 described above. At this time, the PCB assembly 300 and the metal housing 100, An insulating screw 350 is used as a fastening means for fastening the PCB assembly 300 to the insulating plate 200 and the housing 100 so that the insulating plate 200 and the housing 100 can be insulated from each other. .

When the PCB assembly 300 and the insulating plate 200 are connected to each other through the insulating screw 350 in the insulation between the PCB assembly 300 and the housing 100, The PCB assembly 300 and the housing 100 can be energized by the fastening screw 210 when the head 211 of the fastening screw 210 contacts the PCB assembly 300.

Therefore, the PCB assembly 300 is provided with the head 211 of the fastening screw 210 at a position corresponding to the head 211 of the fastening screw 210, for the heat insulation between the PCB assembly 300 and the housing 100 It is preferable that an insulative fastening hole 340 having a larger diameter than the head 211 of the fastening screw 210 is formed so as to penetrate therethrough.

In order to prevent the power supply to the PCB assembly 300 and the housing 100 by the fastening screw 210, it is possible to prevent the connection between the inner circumferential surface of the insulating fastening hole 340 and the outer circumferential surface of the head 211 of the fastening screw 210 A ring-shaped insulating member (not shown in the figure) may be further provided.

The diffuser plate (400)

And diffuses the light emitted from the LED element 330 mounted on the PCB assembly 300 along the surface to make the color and brightness appear uniform.

2, the diffusion plate 400 is coupled to the lower flange portion 120 of the housing 100 described above and has a shape corresponding to that of the lower flange portion 120 of the housing 100 .

The flange 120 of the housing 100 may be further provided with a reflector 500 for adjusting the light distribution of the LED device 330 diffused through the diffuser plate 400.

The reflector 500 may be formed as a hole through which the center portion passes, and the outer periphery may be inclined downwardly at a predetermined angle. A reflective member or a reflective coating layer Can be formed.

The reflector 500 may be fastened to the flange portion 120 of the housing 100 through a fastening means such as a screw together with the diffuser plate 400. In another embodiment, the outer periphery of the flange portion 120 of the housing 100 And the reflector 500 may be detachably attached to the flange portion 120 of the housing 100 through a screw fastening method by forming a male screw portion and a female screw portion with a predetermined inner width around the upper portion of the reflector 500.

The heat sink 600,

And is installed on the upper portion of the housing 100 as shown in FIG. 1 to cool the heat generated from the PCB assembly 300 installed in the housing 100.

A preferred embodiment of the heat sink 600 will be described with reference to FIG. 2. The heat sink 600 is formed in a cylindrical shape having a predetermined length in the up-and-down direction so as to improve heat radiation efficiency, A blade 620 is formed along the outer circumference of the boss 610 so as to be radially centered on the boss 610. The blade 620 is perpendicular to the longitudinal direction of the boss 610. [

As shown in FIG. 5, the wing 620 may be divided into two or more portions, and the distal end portion of the wing 620 may be divided again to form a coupling groove 621, And is fastened to a fastening screw 210 passing through the upper portion of the housing 100 described above.

3 and 5, at least one heat sink 600 is installed on the upper portion of the housing 100. The heat sink 600 preferably corresponds to the surge protection circuit portion 310 in which most heat is generated in the PCB assembly 300 One heat sink 600 is installed at the center of the upper portion of the housing 100 and the SMPS circuit portion 320 radially disposed on the PCB assembly 300 and the central heat sink 600 A plurality of heat sinks 600 may be installed radially.

5, the heat sink 600 disposed at the center and the heat sink 600 disposed radially outwardly are spaced apart from each other to be spaced apart from each other to be spaced apart from each other. Accordingly, the heat sink 600 is mounted on the housing 100 through the PCB assembly 300, Heat can be dissipated through the space between the heat sink 600 as well as the heat sink 600.

Although the heat sink 600 is formed in the form of a cylinder through the illustrated drawings, the shape of the heat sink 600 need not be determined to be any one, and can be modified into various shapes according to the installation space and design specifications.

5, a heat sink 600 is disposed at the upper center of the housing 100, and the heat sink 600 is mounted on the upper portion of the housing 100, Five heat sinks 600 may be radially arranged around the heat sink 600, but the number, arrangement, and spacing of the heat sinks 600 may be modified in various forms as needed.

In addition, the length of the heat sink 600 needs to be set to a sufficient length to allow heat radiation efficiency in consideration of the degree of heat generated in the PCB assembly 300 and transmitted to the upper portion of the housing 100.

The cover plate (700)

1 and 2, a plurality of heat sinks 600 are fixedly coupled to the upper surface of the plurality of heat sinks 600, and a power supply (Not shown) is connected to the PCB assembly 300 for connection to the PCB assembly 300.

A fixing member 710 is preferably provided at the center of the cover plate 700 and a lower end of the fixing member 710 penetrates through the cover plate 700 and is positioned at the center of the upper portion of the housing 100 The fixing member 710 can be used to fix the LED light or the like to the ceiling or the like every month.

The assembling process of the ghost lamp for the ghost lamp constructed as described above will be described with reference to FIGS. 2, 4A and 4B.

The insulating plate 200 and the PCB assembly 300 are inserted into the space 110 from the lower side of the housing 100 with the PCB assembly 300 in contact with the insulating plate 200, The PCB assembly 300 is brought into contact with the upper inner surface of the housing 100 and then the PCB assembly 300 and the insulating plate 200 are fastened to the upper portion of the housing 100 using the insulating screws 350.

At this time, the center of the insulated fastening hole 340 formed in the PCB assembly 300 and the center of the screw hole (not shown in the figure) formed in the insulating plate 200 and the center of the fastening hole .

A heat sink 600 is installed on the upper portion of the housing 100 so that the fastening screw 210 is screwed into the screw hole of the insulating fastener 340 of the PCB assembly 300 and the housing 100, The insulating plate 200 and the heat sink 600 are fixed to the upper and lower sides of the housing 100 through the fastening screws 210 by fastening the fastening holes of the heat sink 600 through the fastening holes of the heat sink 600, The fastening screws 210 and the PCB assembly 300 are spaced apart from each other through the insulator 340 so that the PCB assembly 300 and the housing 100 are prevented from being electrically energized.

After the plurality of heat sinks 600 are fixed to the upper portion of the housing 100 through the fastening screws 210 as described above, the cover plate 700 is installed on the upper surface of the heat sink 600, The heat sink 600 can be stably fixed to the upper portion of the housing 100 without flowing through the heat sink 600 by penetrating the heat sink 600 and connecting the heat sink 600 to the boss 610 of the heat sink 600.

The lower flange portion 120 of the housing 100 to which the heat sink 600 is coupled is joined to the lower flange portion 120 of the housing 100 by using a fastening member (not shown) while the outer periphery of the diffusion plate 400 is in contact with each other.

The reflector 500 may be further provided on the lower flange portion 120 of the housing 100 and may be fixed together using a fastening member that fixes the diffuser plate 400.

As described above, according to the present invention, the chip on board type surge protection circuit unit 310, the SMPS circuit unit 320 and the LED device 330 are mounted on the PCB assembly 300, and the PCB assembly 300 and the housing 100 are mounted on the insulating plate The heat generated in the PCB assembly 300 can be effectively dissipated through the insulating plate 200 and the heat sink 600, thereby improving the performance of light projection and the like, And an LED light for high-grade steel, which is capable of doubling the light intensity of the LED.

Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. Therefore, the scope of the disclosed contents should not be limited to the described embodiments, but should be defined by the equivalents of the claims, as well as the following claims.

100: housing 110:
120: flange portion 200: insulating plate
210: fastening screw 211: head
300: PCB assembly 310: Surge protection circuit
320: SMPS circuit part 330: LED device
340: insulated fastening hole 350: insulated screw
400: diffuser plate 500: reflector plate
600: heat sink 610: boss
620: wing 621: fastening groove
700: cover plate 710: fixing member

Claims (9)

A housing in which a space is formed inward through an opened lower portion and a flange is formed on an outer periphery of the lower portion;
An insulating plate connected to the upper inner surface of the housing so as to be connected thereto;
And a chip on board type SMPS circuit part is radially mounted on the outer side of the surge protection circuit part, and the surge protection circuit part is connected to the insulation board, A PCB assembly in which a plurality of LED elements are radially mounted on the outside of the SMPS circuit part with a protective circuit part as a center;
A diffusion plate coupled to the flange of the housing to diffuse light emitted from the LED device to the outside;
A plurality of heat sinks installed on the upper portion of the housing; And
A cover plate coupled to the upper surfaces of the plurality of heat sinks;
And a light emitting diode (LED). The method according to claim 1,
Wherein the insulating plate is fastened to the upper inner surface of the housing through a plurality of insulating screws together with the PCB assembly. The method according to claim 1,
The heat sink
And is formed in a cylindrical shape having a predetermined length, and a coupling groove is formed in the bottom surface,
And a fastening screw passing through the upper surface of the PCB assembly, the insulating plate, and the housing is fastened to the fastening groove. The method of claim 3,
Wherein the PCB assembly is formed with an insulating fastener having a larger diameter than the head so as not to contact the head of the fastening screw. The method according to claim 1,
The heat sink
One of which is provided at a central portion of the upper portion of the housing so as to correspond to the surge protection circuit portion of the PCB assembly,
Wherein a plurality of LEDs are arranged radially around a center portion of the upper portion of the housing so as to correspond to the SMPS circuit portion and the LED element of the PCB assembly. 6. The method of claim 5,
Wherein the plurality of heat sinks are installed so as to be spaced apart from each other at a predetermined distance so as to form a heat dissipation path. 6. The method of claim 5,
Wherein a fixing member is provided at the center of the upper surface of the cover plate and a lower end of the fixing member is coupled to the upper surface of the heat sink through the cover plate and located at the central portion of the upper portion of the housing. . The method according to claim 1,
And a reflector having a center portion penetrated is further coupled to the flange portion of the housing so that the light of the LED element can gather and be irradiated downward. The method of claim 3,
The heat sink
A boss penetrating the upper and lower surfaces of the boss is formed at the center of the boss, a wing extending radially around the boss and dividing a part of the end into a plurality of bosses is formed on an outer periphery of the boss, Which is characterized in that it is a high-intensity light source.
KR1020150091276A 2015-06-26 2015-06-26 LED floodlight for high ceilings KR101692887B1 (en)

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Application Number Priority Date Filing Date Title
KR1020150091276A KR101692887B1 (en) 2015-06-26 2015-06-26 LED floodlight for high ceilings

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Application Number Priority Date Filing Date Title
KR1020150091276A KR101692887B1 (en) 2015-06-26 2015-06-26 LED floodlight for high ceilings

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KR101692887B1 KR101692887B1 (en) 2017-02-03

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100925527B1 (en) * 2009-04-07 2009-11-06 지엘레페주식회사 Heat spreader piece, heat spreader for led lamp and tube type led lamp having the same
KR20130044280A (en) 2013-04-12 2013-05-02 (주)우영 Flood light
JP2014086416A (en) * 2013-09-03 2014-05-12 Mitsubishi Electric Corp Lighting system
KR101391584B1 (en) * 2013-03-19 2014-05-27 주식회사 남영전구 Led flood lighting

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100925527B1 (en) * 2009-04-07 2009-11-06 지엘레페주식회사 Heat spreader piece, heat spreader for led lamp and tube type led lamp having the same
KR101391584B1 (en) * 2013-03-19 2014-05-27 주식회사 남영전구 Led flood lighting
KR20130044280A (en) 2013-04-12 2013-05-02 (주)우영 Flood light
JP2014086416A (en) * 2013-09-03 2014-05-12 Mitsubishi Electric Corp Lighting system

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