KR20160135667A - Metal oxide composition, cured film thereof, and member with cured film attached thereto - Google Patents

Metal oxide composition, cured film thereof, and member with cured film attached thereto Download PDF

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KR20160135667A
KR20160135667A KR1020160060028A KR20160060028A KR20160135667A KR 20160135667 A KR20160135667 A KR 20160135667A KR 1020160060028 A KR1020160060028 A KR 1020160060028A KR 20160060028 A KR20160060028 A KR 20160060028A KR 20160135667 A KR20160135667 A KR 20160135667A
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metal oxide
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cured film
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미츠히토 이토
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토요잉크Sc홀딩스주식회사
도요잉크주식회사
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Abstract

The present invention relates to a metal oxide composition comprising: a compound (A) containing a compound (A1) having at least 6 acryloyl groups displayed as chemical formula (1), a metal oxide (B) and a solvent. According to the present invention, a metal oxide composition, a cured film thereof and a member with the cured film attached thereto capable of forming a film containing a metal oxide while having excellent physical properties such as high refractivity, hard-coating properties and transparency, and having temporal stability are able to be provided. In chemical formula (1), R1 represents a specific tetravalent organic residue; and R2 and R3 represent a specific monovalent organic residue.

Description

금속산화물 조성물, 그의 경화막, 및 그의 경화막이 부착된 부재{METAL OXIDE COMPOSITION, CURED FILM THEREOF, AND MEMBER WITH CURED FILM ATTACHED THERETO}FIELD OF THE INVENTION [0001] The present invention relates to a metal oxide composition, a cured film thereof, and a member to which the cured film is adhered,

본 발명은, 하드코트성을 가진 금속산화물 조성물, 그의 경화막, 및 그의 경화막이 부착된 부재에 관한 것이다.
The present invention relates to a metal oxide composition having hard coat properties, a cured film thereof, and a member to which the cured film is adhered.

종래, 정보통신기기의 성능확보와 안전대책의 면에서, 기기의 표면에, 금속산화물 조성물을 이용하여, 내찰상성(耐擦傷性), 밀착성, 고굴절률성 등을 갖는 하드코트성 도막이나, 대전방지성 도막을 형성하는 것이 행해지고 있다.Conventionally, in view of securing the performance of information communication equipment and safety measures, a hardcoat-based coating film having scratch resistance, abrasion resistance, high refractive index and the like by using a metal oxide composition on the surface of the device, Thereby forming an anticorrosive coating film.

최근, 정보통신기기의 발달과 범용화는 놀랍게도, 하드코트성 도막, 대전방지성 도막 등의 진보된 성능향상 및 생산성의 향상이 요구되고 있으며, 광경화성 재료를 이용한 다양한 제안이 이루어지고 있다.
In recent years, development and commercialization of information communication devices have surprisingly been required to improve the performance and productivity of a hard coat film and an antistatic film, and various proposals have been made using photocurable materials.

예를 들어, 이하와 같은 기술제안을 들 수 있다(특허문헌 1~3 참조). 특허문헌 1에서는, 안티몬도프 산화주석과 자외선경화성이 있는 실란커플링제를, 유기용제 중에서, 볼밀을 이용하여 혼합하고, 도전성 도료용의 분산체를 제작하는 방법이 개시되어 있다. 나아가 특허문헌 2에서는, 도전성 산화물 미분말을 이분산성 저비점용제와 난분산성 고비점용제의 혼합용제 중에 분산시켜, 도전성 도료를 제작하는 방법이 개시되어 있다. 또한 특허문헌 3에서는, 무기산화물과 중합성 불포화 이중결합을 갖는 화합물을, 유기용제 중에 분산시켜, 금속산화물 조성물을 제작하는 방법이 개시되어 있다.
For example, the following technical proposals can be cited (see Patent Documents 1 to 3). Patent Document 1 discloses a method of producing a dispersion for electrically conductive paint by mixing a antimony doped tin oxide and a silane coupling agent having an ultraviolet curable property in an organic solvent using a ball mill. Further, Patent Document 2 discloses a method for producing a conductive paint by dispersing a conductive oxide fine powder in a mixed solvent of a dysprosium low boiling point solvent and an oily dispersion high boiling point agent. Patent Document 3 discloses a method of preparing a metal oxide composition by dispersing a compound having an inorganic oxide and a polymerizable unsaturated double bond in an organic solvent.

일본특허공개 H06-264009호 공보Japanese Patent Application Laid-Open No. H06-264009 일본특허공개 2001-131485호 공보Japanese Patent Application Laid-Open No. 2001-131485 WO2007/138946호 공보WO2007 / 138946

그러나, 특허문헌 1이나 특허문헌 2에서는, 고굴절률성, 하드코트성, 대전방지성, 내광성 등에 있어서 양호한 물성을 겸비한 금속산화물 조성물을 제작하는 것이 가능해져도, 유기용제 등 소수성이 높은 매체에 대하여, 평균 1차 입자경이 수백nm 이하인, 미립의 금속산화물을, 안정적으로, 1차 입자 레벨로 분산 및 안정화시킬 수는 없으므로, 도막의 투명성이나 광경화성 도료의 경시(經時)안정성 등의 관점에서 문제를 일으키기 쉽다.However, in Patent Documents 1 and 2, even if it is possible to produce a metal oxide composition having good physical properties such as high refractive index, hard coat property, antistatic property, light resistance, and the like, , It is impossible to stably disperse and stabilize the fine metal oxide having an average primary particle diameter of several hundred nanometers or less at a primary particle level. Therefore, from the viewpoints of transparency of the coating film and stability of the photo- It is easy to cause problems.

또한 특허문헌 3에 기재된 기술에서는, 평균 1차 입자경이 수백nm 이하인, 미립의 금속산화물을, 안정적으로, 1차 입자 레벨로 분산 및 안정화시키기 위해서는, 사용하는 중합성 불포화 이중결합을 갖는 화합물의 사용량이 많아지므로, 금속산화물의 비율을 높일 수 없는 것이 과제였다.In the technique described in Patent Document 3, in order to stably disperse and stabilize the fine metal oxide having an average primary particle size of several hundred nm or less at the primary particle level, the amount of the polymerizable unsaturated double bond- The problem is that the ratio of metal oxides can not be increased.

따라서, 본 발명은, 금속산화물을 함유하면서, 하드코트성, 투명성에 있어서 우수한 물성을 겸비한 도막을 형성가능한 금속산화물 조성물, 이를 이용한 경화막, 및 그의 경화막이 부착된 부재를 제공하는 것을 목적으로 한다.
Accordingly, an object of the present invention is to provide a metal oxide composition capable of forming a coating film having a good hard coat property and transparency while containing a metal oxide, a cured film using the same, and a member to which the cured film is attached .

본 발명의 일태양은,According to an aspect of the present invention,

아크릴로일기를 6개 이상 갖는 화합물(A)과, 금속산화물(B)과, 용제를 함유하고,(A) having at least 6 acryloyl groups, a metal oxide (B), and a solvent,

상기 화합물(A)이,The compound (A)

펜타에리스리톨트리아크릴레이트 및 디펜타에리스리톨펜타아크릴레이트로부터 선택되는 1종 또는 2종의 화합물(x2), 그리고, 1,2,4,5-벤젠테트라카르본산이무수물, 3,3',4,4'-비페닐테트라카르본산이무수물, 9,9-비스(3,4-디카르복시페닐)플루오렌이산무수물, 및 1,2,3,4-부탄테트라카르본산이무수물로 이루어진 군으로부터 선택되는 1종 또는 2종 이상의 화합물(x1)을 반응시켜 이루어지는, 카르복실기를 갖는 화합물(X)과,Pentaerythritol triacrylate and dipentaerythritol pentaacrylate, and at least one compound selected from the group consisting of 1,2,4,5-benzene tetracarboxylic acid dianhydride, 3,3 ', 4,4'- Selected from the group consisting of 4'-biphenyltetracarboxylic acid dianhydride, 9,9-bis (3,4-dicarboxyphenyl) fluorene dianhydride, and 1,2,3,4-butanetetracarboxylic dianhydride A compound (X) having a carboxyl group, which is obtained by reacting one or more compounds (x1)

비페닐글리시딜에테르Biphenyl glycidyl ether

를 반응시켜 이루어지는 화합물을 포함하는, 금속산화물 조성물에 관한 것이다.
To a metal oxide composition.

본 발명의 다른 일태양은, 아크릴로일기를 6개 이상 갖는 화합물(A)과, 금속산화물(B)과, 용제를 함유하고,Another aspect of the present invention is a process for producing a photosensitive resin composition comprising a compound (A) having at least 6 acryloyl groups, a metal oxide (B)

상기 화합물(A)이, 하기 일반식(1)로 표시되는 아크릴로일기를 6개 이상 갖는 화합물(A1)을 포함하는, 금속산화물 조성물에 관한 것이다.The present invention relates to a metal oxide composition, wherein the compound (A) comprises a compound (A1) having at least 6 acryloyl groups represented by the following general formula (1).

일반식(1)In general formula (1)

[화학식 1][Chemical Formula 1]

Figure pat00001
Figure pat00001

(일반식(1) 중, R1은, 하기 어느 하나의 4가의 유기잔기를 나타낸다.(In the general formula (1), R 1 represents any one of the tetravalent organic moieties shown below.

[화학식 2](2)

Figure pat00002
Figure pat00002

일반식(1) 중, R2는, 하기 어느 하나의 1가의 유기잔기를 나타낸다.In the general formula (1), R 2 represents any one of the following monovalent organic residue.

[화학식 3](3)

Figure pat00003
Figure pat00003

일반식(1) 중, R3은, 하기의 1가의 유기잔기를 나타낸다.)In the general formula (1), R 3 represents the following monovalent organic residue.)

[화학식 4][Chemical Formula 4]

Figure pat00004

Figure pat00004

본 발명의 추가적인 일태양은, R1이, 방향환을 포함하는 유기잔기인, 상기의 금속산화물 조성물에 관한 것이다.
A further aspect of the present invention relates to the above metal oxide composition, wherein R < 1 > is an organic moiety comprising an aromatic ring.

본 발명의 추가적인 일태양은, 방향환이, 비페닐환인, 상기의 금속산화물 조성물에 관한 것이다.
A further aspect of the present invention relates to the above metal oxide composition, wherein the aromatic ring is a biphenyl ring.

본 발명의 추가적인 일태양은, 금속산화물(B)이, 티타늄, 아연, 지르코늄, 인듐, 주석, 알루미늄, 규소 및 인으로 이루어지는 군으로부터 선택되는 적어도 1종의 원소를 함유하는, 상기의 금속산화물 조성물에 관한 것이다.
A further embodiment of the present invention is a metal oxide composition comprising the metal oxide (B) containing at least one element selected from the group consisting of titanium, zinc, zirconium, indium, tin, aluminum, .

본 발명의 추가적인 일태양은, 금속산화물(B)의 D50입자경이, 0.005~0.200μm인, 상기의 금속산화물 조성물에 관한 것이다.
A further embodiment of the present invention relates to the above metal oxide composition, wherein the D50 particle diameter of the metal oxide (B) is 0.005 to 0.200 m.

본 발명의 다른 일태양은, 상기의 금속산화물 조성물을 경화시켜 이루어지는 경화막에 관한 것이다.
Another aspect of the present invention relates to a cured film obtained by curing the metal oxide composition.

본 발명의 다른 일태양은, 기재의 적어도 일부에, 상기의 경화막이 마련되어 이루어지는, 경화막이 부착된 부재에 관한 것이다.
Another aspect of the present invention relates to a member to which a cured film is attached, wherein the cured film is provided on at least a part of the base.

본 발명에 의해, 금속산화물을 함유하면서, 하드코트성, 투명성에 있어서 우수한 물성을 겸비한 도막을 형성가능한 금속산화물 조성물, 이를 이용한 경화막, 및 그의 경화막이 부착된 부재를 제공할 수 있다.
According to the present invention, it is possible to provide a metal oxide composition containing a metal oxide and capable of forming a coating film having excellent hard coat properties and transparency, a cured film using the metal oxide composition, and a member to which the cured film is adhered.

이하에 본 발명의 실시형태를 설명한다. 또한, 이하에 설명하는 실시형태는 본 발명의 실시형태의 예이며, 본 발명은 이하의 실시형태로 제한되는 것은 아니다.Hereinafter, embodiments of the present invention will be described. The embodiments described below are examples of the present invention, and the present invention is not limited to the following embodiments.

본 발명에 따른 금속산화물 조성물은, 하기 일반식(1)로 표시되는 화합물(A1)을 함유하는 화합물(A)과, 금속산화물(B)과, 용제를 함유한다. 금속산화물 조성물은, 2종류 이상의 금속산화물(B), 2종류 이상의 화합물(A), 및 2종류 이상의 용제를 각각 포함할 수도 있다.
The metal oxide composition according to the present invention contains a compound (A) containing a compound (A1) represented by the following general formula (1), a metal oxide (B) and a solvent. The metal oxide composition may contain two or more metal oxides (B), two or more kinds of compounds (A), and two or more kinds of solvents, respectively.

일반식(1):In general formula (1):

[화학식 1][Chemical Formula 1]

Figure pat00005
Figure pat00005

(일반식(1) 중, R1은, 하기 어느 하나의 4가의 유기잔기를 나타낸다.
(In the general formula (1), R 1 represents any one of the tetravalent organic moieties shown below.

[화학식 2](2)

Figure pat00006

Figure pat00006

일반식(1) 중, R2는, 각각 독립적으로, 하기 어느 하나의 1가의 유기잔기를 나타낸다.In the general formula (1), R 2 independently represents any one of the following monovalent organic residues.

[화학식 3](3)

Figure pat00007

Figure pat00007

일반식(1) 중, R3은, 각각 독립적으로, 하기의 1가의 유기잔기를 나타낸다.)In the general formula (1), R 3 independently represents a monovalent organic residue shown below.)

[화학식 4][Chemical Formula 4]

Figure pat00008

Figure pat00008

화합물(A)은 주로 상기 화합물(A1)을 포함하지만, 화합물(A1)에 덧붙여, 후술하는 바와 같이, 화합물(A1) 등의 고분자량체 등을 포함할 수 있다. 이 화합물(A)은, 금속산화물에 대하여 높은 분산성과 광경화성을 갖고 있다. 이 화합물(A)이 금속산화물(B)의 분산성을 높이고, 또한 광경화성을 높임으로써, 본 발명의 금속산화물 조성물은, 경화성이 우수하고, 하드코트성, 투명성이 우수한 경화막 및 그의 경화막이 부착된 부재를 형성하는 것이 가능하다. 따라서, 특히 플라스틱 광학부품, 광디스크, 반사방지막, 터치패널, 필름형 액정소자에 호적하게 사용할 수 있는 것 외에, 각종 플라스틱 적층체의 하드코트제로도 호적하게 사용할 수 있다.The compound (A) mainly includes the compound (A1), but in addition to the compound (A1), as described later, the compound (A) may include a high molecular weight compound such as the compound (A1). This compound (A) has high dispersibility and photo-curability against metal oxides. By increasing the dispersibility of the metal oxide (B) and increasing the photo-curability of the metal oxide (A), the metal oxide composition of the present invention is excellent in hardenability, hard coat property and transparency, It is possible to form an attached member. Therefore, it can be used suitably for plastic optical parts, optical disk, antireflection film, touch panel, film type liquid crystal device, and also as hard coat agent for various plastic laminate.

이 금속산화물 조성물은, 굴절률이 높은 경화막을 형성할 수 있고, 이것을 굴절률이 동일한 정도의 기재에 도포한 경우, 얻어진 적층체는 반사간섭호(干涉縞)가 발생하지 않아, 광학용도로 호적하게 이용된다. 나아가, 금속산화물을 포함한 경화물의 굴절률을 높게 제어가능한 점에서, 광반도체소자 봉지재로도 호적하다.
This metal oxide composition can form a cured film having a high refractive index. When the metal oxide composition is applied to a substrate having the same refractive index, the obtained laminate does not generate reflection interference fringes and is used for optical applications do. Furthermore, since the refractive index of the cured product containing the metal oxide can be controlled to a high level, it is also suitable as an optical semiconductor element encapsulant.

상기 일반식(1)에 있어서, R1은 4가의 유기잔기로서, 페닐골격, 비페닐골격, 플루오렌골격, 또는 부틸렌기를 포함한다. 이들 중에서는, 방향환을 포함하는 유기잔기인, 페닐골격, 비페닐골격, 또는 플루오렌골격인 것이 보다 바람직하다.
In the above general formula (1), R 1 is a tetravalent organic residue and includes a phenyl skeleton, a biphenyl skeleton, a fluorene skeleton, or a butylene group. Among them, a phenyl skeleton, a biphenyl skeleton, or a fluorene skeleton, which is an organic residue including an aromatic ring, is more preferable.

또한, 화합물(A)이 함유하는 화합물(A1)은, 예를 들어, 하기 일반식(2)로 표시되는 테트라카르본산의 이무수물(x1)과, 펜타에리스리톨트리아크릴레이트 및 디펜타에리스리톨펜타아크릴레이트로부터 선택되는 1종 또는 2종의 화합물(x2)을 반응시켜 이루어지는 카르복실기를 갖는 화합물(X)과, 비페닐글리시딜에테르를 반응시킴으로써 얻어지는 화합물이면 된다. 여기서, 광경화성과 하드코트성의 관점에서, 상기 화합물(x2)이 펜타에리스리톨트리아크릴레이트 및/또는 디펜타에리스리톨펜타아크릴레이트인 것이 바람직하다.
The compound (A1) contained in the compound (A) can be obtained, for example, by reacting the dianhydride (x1) of the tetracarboxylic acid represented by the following formula (2) with pentaerythritol triacrylate and dipentaerythritol pentaacrylate (X) having a carboxyl group formed by reacting one or two compounds (x2) selected from the group consisting of a hydroxyl group and a hydroxyl group, and biphenyl glycidyl ether. From the viewpoints of photocurability and hard coatability, it is preferable that the compound (x2) is pentaerythritol triacrylate and / or dipentaerythritol pentaacrylate.

일반식(2)In general formula (2)

[화학식 5][Chemical Formula 5]

Figure pat00009

Figure pat00009

상기 일반식(2)로 표시되는 테트라카르본산이무수물(x1)로는, 1,2,4,5-벤젠테트라카르본산이무수물, 비페닐골격을 갖는 3,3',4,4'-비페닐테트라카르본산이무수물, 플루오렌골격을 갖는 9,9-비스(3,4-디카르복시페닐)플루오렌이산무수물(9,9-bis(3,4-dicarboxyphenyl)fluorene dianhydride), 혹은, 9,9-비스[4-(3,4-디카르복시페녹시)페닐]플루오렌이산무수물(9,9-bis[4-(3,4-dicarboxyphenoxy)phenyl]fluorene dianhydride), 1,2,3,4-부탄테트라카르본산이무수물 등을 들 수 있다.Examples of the tetracarboxylic acid dianhydride (x1) represented by the general formula (2) include 1,2,4,5-benzenetetracarboxylic acid dianhydride, 3,3 ', 4,4'- 9,9-bis (3,4-dicarboxyphenyl) fluorene dianhydride having 9,9-bis (3,4-dicarboxyphenyl) fluorene dianhydride having an anhydride of phenyltetracarboxylic acid and fluorene skeleton, or 9,9- Bis [4- (3,4-dicarboxyphenoxy) phenyl] fluorene dianhydride, 9, , 4-butanetetracarboxylic acid dianhydride, and the like.

일반식(2) 중, R1로는, 일반식(1)에 있어서 정의되는 것이 바람직하다.
In the general formula (2), R 1 is preferably as defined in the general formula (1).

이들 테트라카르본산이무수물 중, 3,3',4,4'-비페닐테트라카르본산이무수물은, 비페닐골격을 갖는 것이며, 비페닐골격을 화합물(A)의 분자 내에 효율 좋게 도입할 수 있고, 나아가 경화막의 하드코트성과 금속산화물의 양호한 분산성을 겸비할 수 있으므로, 특히 바람직하다.
Among these tetracarboxylic acid dianhydrides, the 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride has a biphenyl skeleton, and the biphenyl skeleton can be efficiently introduced into the molecule of the compound (A) And further it is possible to combine the hard coat property of the cured film and the good dispersibility of the metal oxide.

화합물(x2)인 펜타에리스리톨트리아크릴레이트, 및, 디펜타에리스리톨펜타아크릴레이트의 구체적인 시판품으로는, VISCOAT #300(Osaka Organic Chemical Industry Ltd.제), KAYARAD PET30(Nippon Kayaku Co.,Ltd.제), PETIA(Daicel-UCB Company, Ltd.제), ARONIX M305(Toagosei Company, Limited제), NK Ester A-TMM-3LMN(Shin-Nakamura Chemical Co.,Ltd.제), LIGHTACRYLATE PE-3A(Kyoeisha Chemical Co., Ltd.제), SR-444(Sartomer , Inc.제), LIGHTACRYLATE DPE-6A(Kyoeisha Chemical Co., Ltd.제), KAYARAD DPHA(Nippon Kayaku Co.,Ltd.제), ARONIX M402(Toagosei Company, Limited제) 등을 들 수 있다.
Specific examples of commercial products of pentaerythritol triacrylate and dipentaerythritol pentaacrylate which are compounds (x2) include VISCOAT # 300 (manufactured by Osaka Organic Chemical Industry Ltd.) and KAYARAD PET30 (manufactured by Nippon Kayaku Co., Ltd.) , PETIA (manufactured by Daicel-UCB Company, Ltd.), ARONIX M305 (manufactured by Toagosei Company, Limited), NK Ester A-TMM-3LMN (manufactured by Shin- Nakamura Chemical Co., Ltd.), LIGHTACRYLATE PE- (Manufactured by Sartomer, Inc.), LIGHTACRYLATE DPE-6A (manufactured by Kyoeisha Chemical Co., Ltd.), KAYARAD DPHA (manufactured by Nippon Kayaku Co., Ltd.), ARONIX M402 Manufactured by Toagosei Company, Limited).

금속산화물 조성물에 있어서의 금속산화물(B)과 화합물(A)의 배합은 특별히 제한되지 않으나, 화합물(A1)의 함유량은, 금속산화물(B) 100질량부에 대하여 9질량부 이상 45질량부 이하인 것이 바람직하다. 화합물(A1)이 9질량부 이상이면 성막성의 관점에서 바람직하고, 45질량부 이하이면 하드코트성 등의 관점에서 바람직하다. 화합물(A1)의 함유량은, 금속산화물(B) 100질량부에 대하여, 12질량부 이상인 것이 보다 바람직하고, 14질량부 이상인 것이 더욱 바람직하고, 또한, 32질량부 이하인 것이 보다 바람직하고, 27질량부 이하인 것이 더욱 바람직하다. 또한, 화합물(A1)의 함유량은, 화합물(A)의 전체질량 중, 85질량% 이상인 것이 바람직하고, 90질량% 이상인 것이 보다 바람직하고, 95질량% 이상인 것이 더욱 바람직하다.
The content of the compound (A1) is not less than 9 parts by mass and not more than 45 parts by mass based on 100 parts by mass of the metal oxide (B), although the compounding of the metal oxide (B) . When the amount of the compound (A1) is 9 parts by mass or more, it is preferable from the viewpoint of film forming property, and when it is 45 parts by mass or less, it is preferable from the viewpoint of hard coatability and the like. The content of the compound (A1) is more preferably 12 parts by mass or more, more preferably 14 parts by mass or more, further preferably 32 parts by mass or less, and more preferably 27 parts by mass or more per 100 parts by mass of the metal oxide (B) Or less. The content of the compound (A1) is preferably 85% by mass or more, more preferably 90% by mass or more, and even more preferably 95% by mass or more, in the total mass of the compound (A).

여기서, 간편하게는, 금속산화물(B)과 「화합물(A)을 포함하는 반응물」의 배합비를, 금속산화물(B)과 화합물(A1)의 배합의 지표로 할 수도 있다. 이는, 화합물(x2)의 시판품은, 일반적으로, 각각 부성분으로서 하이드록실기를 2개 갖는 펜타에리스리톨디아크릴레이트, 디펜타에리스리톨테트라아크릴레이트를 5~15질량% 정도 함유한다. 이에 따라 화합물(A1)을 얻는 반응에 있어서는 화합물(A1) 외에, 부성분 유래의 반응물, 화합물(A1) 등이 고분자량화한 수지 등도 동시에 생성되고, 화합물(A1)만을 산출하는 것이 번잡해지는 경우가 있기 때문이다. 화합물(A)을 포함하는 반응물은, 금속산화물(B) 100질량부에 대하여, 10질량부 이상 50질량부 이하인 것이 바람직하고, 10질량부 이상 35질량부 이하인 것이 보다 바람직하고, 15질량부 이상 30질량부 이하인 것이 더욱 바람직하다. 10질량부 이상인 경우, 유기성분량이 적은 것에 의한 성막성의 열화를 억제하는 관점에서, 보다 바람직하다. 화합물(A)을 포함하는 반응물의 함유량은, 후기의 실시예에 기재된 방법으로 측정 할 수 있다.
Here, simply, the compounding ratio of the metal oxide (B) and the "reactant containing the compound (A)" may be used as an index of the compounding of the metal oxide (B) and the compound (A1). This is because commercially available products of the compound (x2) generally contain about 5 to 15 mass% of pentaerythritol diacrylate and dipentaerythritol tetraacrylate each having two hydroxyl groups as subcomponents. Thus, in the reaction for obtaining the compound (A1), a reaction product derived from the subcomponent, a resin obtained by high-molecular weight compound (A1), etc., are simultaneously produced in addition to the compound (A1) It is because. The amount of the reactant containing the compound (A) is preferably 10 parts by mass or more and 50 parts by mass or less, more preferably 10 parts by mass or more and 35 parts by mass or less, and still more preferably 15 parts by mass or more with respect to 100 parts by mass of the metal oxide (B) More preferably 30 parts by mass or less. When the amount is 10 parts by mass or more, it is more preferable from the viewpoint of suppressing the deterioration of the film formability due to the small organic content. The content of the reactant containing the compound (A) can be measured by the method described in the later Examples.

상기 테트라카르본산이무수물(x1)과, 화합물(x2)의 반응은, 테트라카르본산이무수물이 갖는 2개의 카르본산무수물기와, 화합물(x2)이 갖는 하이드록실기의 반응이며, 그 자체가 해당 분야에 있어서 잘 알려져 있다. 예를 들어, 테트라카르본산이무수물(x1)과, 화합물(x2)을, 시클로헥사논과 같은 유기용매 중, 1,8-디아자비시클로[5.4.0]-7-운데센과 같은 촉매의 존재하, 50~120℃의 온도에서 반응시킬 수 있다. 이 경우, 반응계에, 메틸하이드로퀴논(2-METHYLHYDROQUINONE)과 같은 중합금지제를 첨가할 수 있다. 각 성분의 비율은 특별히 한정되지 않지만, 예를 들면, (x1):(x2)(몰비) = 1:1.4 ~ 1:4.0, 바람직하게는 1:1.6 ~ 1:3.0, 보다 바람직하게는 1:1.8 ~ 1:2.6, 더욱 바람직하게는 1:1.9 ~ 1:2.4의 범위로 할 수 있다. 여기서, (x2)의 몰량은 (x2)에서 하이드록실기를 복수 갖는 부성분의 몰량도 포함하는 것으로 한다.
The reaction of the tetracarboxylic acid dianhydride (x1) with the compound (x2) is a reaction between the two carboxylic anhydride groups of the tetracarboxylic acid anhydride and the hydroxyl group of the compound (x2) Are well known in the art. For example, the tetracarboxylic acid dianhydride (x1) and the compound (x2) are reacted in the presence of a catalyst such as 1,8-diazabicyclo [5.4.0] -7-undecene in an organic solvent such as cyclohexanone , And 50 to 120 ° C. In this case, a polymerization inhibitor such as methylhydroquinone (2-METHYLHYDROQUINONE) may be added to the reaction system. For example, the ratio of (x1) :( x2) (molar ratio) = 1: 1.4 to 1: 4.0, preferably 1: 1.6 to 1: 3.0, more preferably 1: 1.8 to 1: 2.6, and more preferably from 1: 1.9 to 1: 2.4. Here, it is assumed that the molar amount of (x2) also includes the molar amount of the subcomponent having a plurality of hydroxyl groups in (x2).

상기 반응 후, 반응생성물인 카르복실기를 갖는 화합물(X)을 포함하는 반응물에, 이를 정제하지 않고, 비페닐글리시딜에테르인 하기 일반식(3)으로 표시되는 화합물을 반응시킬 수 있다.After the above reaction, a compound represented by the following general formula (3), which is a biphenyl glycidyl ether, can be reacted to a reaction product containing a compound (X) having a carboxyl group as a reaction product without purification thereof.

일반식(3)In general formula (3)

[화학식 6][Chemical Formula 6]

Figure pat00010

Figure pat00010

화합물(X)과 일반식(3)으로 표시되는 비페닐글리시딜에테르의 반응은, 화합물(X)이 갖는 카르복실기와, 비페닐글리시딜에테르가 갖는 에폭시기의 반응이며, 그 자체가 해당 분야에 있어서 잘 알려져 있다. 예를 들어, 이 반응은, 디메틸벤질아민 등과 같은 아민촉매의 존재하, 50~120℃의 온도에서 행할 수 있다. 각 성분의 비율은 특별히 한정되지 않지만, 예를 들면, 상기 서술한 (x1):비페닐글리시딜에테르(몰비) = 1:1.4 ~ 1:5.0, 바람직하게는 1:1.6 ~ 1:4.0, 보다 바람직하게는 1:1.8 ~ 1:3.0의 범위로 할 수 있다.
The reaction of the compound (X) and the biphenyl glycidyl ether represented by the general formula (3) is a reaction between the carboxyl group of the compound (X) and the epoxy group of the biphenyl glycidyl ether, Lt; / RTI > For example, this reaction can be carried out at a temperature of 50 to 120 ° C in the presence of an amine catalyst such as dimethylbenzylamine or the like. For example, the above-mentioned (x1): biphenyl glycidyl ether (molar ratio) is 1: 1.4 to 1: 5.0, preferably 1: 1.6 to 1: 4.0, And more preferably in the range of 1: 1.8 to 1: 3.0.

이들 반응은, 무용매로 행할 수도 있고, 혹은 반응에 대하여 불활성인 용매 중에서 행할 수도 있다. 이러한 용매로는, 예를 들어, n-헥산, 벤젠 또는 톨루엔 등의 탄화수소계 용매; 아세톤, 메틸에틸케톤 또는 메틸이소부틸케톤 등의 케톤계 용매; 아세트산에틸 또는 아세트산부틸 등의 에스테르계 용매; 디에틸에테르, 테트라하이드로퓨란 또는 디옥산 등의 에테르계 용매; 디클로로메탄, 클로로포름, 사염화탄소, 1,2-디클로로에탄 또는 퍼클렌 등의 할로겐계 용매; 아세토니트릴, N,N-디메틸포름아미드, N,N-디메틸아세트아미드, N,N-디메틸이미다졸리디논 등의 극성 용매 등을 들 수 있다. 이들 용매는, 2종류 이상을 병용해도 무방하다.These reactions may be carried out in the absence of a solvent or in a solvent inert to the reaction. Such a solvent includes, for example, hydrocarbon solvents such as n-hexane, benzene or toluene; Ketone solvents such as acetone, methyl ethyl ketone or methyl isobutyl ketone; Ester solvents such as ethyl acetate or butyl acetate; Ether solvents such as diethyl ether, tetrahydrofuran or dioxane; Halogen-based solvents such as dichloromethane, chloroform, carbon tetrachloride, 1,2-dichloroethane or perchlorethylene; And polar solvents such as acetonitrile, N, N-dimethylformamide, N, N-dimethylacetamide and N, N-dimethylimidazolidinone. These solvents may be used in combination of two or more.

또한, 상기 서술한 반응에 의해 화합물(A)을 얻는 경우, 「화합물(A)을 포함하는 반응물」이란, 화합물(x1)과 화합물(x2)의 반응생성물인 화합물(X)을 포함하는 반응물과, 일반식(3)으로 표시되는 화합물의 반응의 반응생성물의 고형분 중의 반응물(미반응 성분 및 반응에 관여하지 않는 성분을 제외함)을 의미한다. 일 실시예에서, "화합물(A)을 포함하는 반응물"의 85질량% 이상, 보다 바람직하게는 90질량% 이상, 더욱 바람직하게는 95질량% 이상이 화합물(A)이 되도록 반응하는 것이 바람직하다.
When the compound (A) is obtained by the above-mentioned reaction, the "reactant containing the compound (A)" means a reactant containing the compound (X) which is the reaction product of the compound (x1) and the compound , And the reaction product of the compound represented by the general formula (3) in the solid content (excluding unreacted components and components not involved in the reaction). In one embodiment, the reaction is preferably carried out so that 85% by mass or more, more preferably 90% by mass or more, further preferably 95% by mass or more of the "reactant containing the compound (A)" is the compound (A) .

본 실시형태에 있어서, 화합물(A)의 아크릴로일기는 6개 이상이다. 본 발명에 있어서, 아크릴로일기의 개수가 6개 미만인 화합물을 병용할 수 있으나, 화합물(A)을 포함함으로써, 얻어지는 경화막의 경도가 보다 양호한 것이 된다.
In the present embodiment, the number of acryloyl groups of the compound (A) is 6 or more. In the present invention, a compound having less than 6 acryloyl groups can be used in combination. However, when the compound (A) is included, the hardness of the resulting cured film becomes better.

이어서, 금속산화물(B)에 대하여 설명한다. 금속산화물은, D50입자경(분산 후 입자경)이 0.005~0.200μm인 것이 바람직하다. 금속산화물의 D50입자경(체적기준)은, 예를 들어, 동적 광산란법을 이용한 Nikkiso Co., Ltd.제 「NANOTRAC UPA」 등을 이용하여 측정할 수 있다.Next, the metal oxide (B) will be described. The metal oxide preferably has a D50 particle size (particle diameter after dispersion) of 0.005 to 0.200 m. The D50 particle size (volume basis) of the metal oxide can be measured using, for example, "NANOTRAC UPA" manufactured by Nikkiso Co., Ltd. using a dynamic light scattering method.

D50입자경이 너무 작은 경우, 미립자끼리의 응집력이 매우 큰 점에서, 투명성이 높은 1차 입자 레벨의 분산성이 저하되는 경향이 있으므로, 1차 입자 레벨의 분산성 향상의 관점에서는, D50입자경이 0.005μm 이상인 것이 바람직하다. 한편, D50입자경이 너무 큰 경우, 입자경이 큰 점에서 가시광 등의 광에 대하여 산란이 발생하기 쉽고, 경화막에서 흐림이 발생하는 경향이 있으므로, 경화막의 흐림을 보다 억제하는 관점에서는, D50입자경이 0.200μm 이하인 것이 바람직하다. D50입자경은, 0.015μm 이상인 것이 보다 바람직하고, 0.025μm 이상인 것이 더욱 바람직하고, 또한, 0.170μm 이하인 것이 보다 바람직하고, 0.150μm 미만인 것이 더욱 바람직하고, 0.120μm 이하인 것이 특히 바람직하다.
When the D50 particle size is too small, the cohesive force between the fine particles is very large. From the viewpoint of improving the dispersibility at the primary particle level, the D50 particle size is 0.005 μm or more. On the other hand, when the D50 particle size is too large, scattering tends to occur in light such as visible light in the point that the particle diameter is large, and fogging tends to occur in the cured film. From the viewpoint of further suppressing the fogging of the cured film, And is preferably 0.200 m or less. The D50 particle size is more preferably 0.015 mu m or more, more preferably 0.025 mu m or more, further preferably 0.170 mu m or less, further preferably 0.150 mu m or less, particularly preferably 0.120 mu m or less.

금속산화물(B)로는, 티타늄, 아연, 지르코늄, 안티몬, 인듐, 주석, 알루미늄, 규소, 인 및 불소로 이루어지는 군으로부터 선택되는 적어도 1종의 원소를 함유하는 것이 바람직하다. 특히, 티타늄, 아연, 지르코늄, 인듐, 주석, 알루미늄, 규소 및 인 중 어느 1종 또는 2종 이상의 원소를 함유하는 금속산화물이, 보다 바람직하다.The metal oxide (B) preferably contains at least one element selected from the group consisting of titanium, zinc, zirconium, antimony, indium, tin, aluminum, silicon, phosphorus and fluorine. Particularly, metal oxides containing at least one element selected from the group consisting of titanium, zinc, zirconium, indium, tin, aluminum, silicon and phosphorus are more preferable.

구체적으로는, 오산화안티몬, 안티몬도프산화주석(ATO), 주석도프산화인듐(ITO), 불소도프산화주석(FTO), 인도프산화주석(PTO), 안티몬산아연(AZO), 인듐도프산화아연(IZO), 산화주석, ATO피복산화티탄, 알루미늄도프산화아연, 산화티탄, 산화아연, 산화지르코늄, 산화규소, 산화알루미늄 등을 들 수 있다. 이들 금속산화물은 표면을 유기물 혹은 무기물로 처리해도 무방하다. 또한 이들 금속산화물은, 2종류 이상을 병용해도 무방하다.
Specific examples thereof include antimony pentoxide, antimony doped tin oxide (ATO), tin doped indium oxide (ITO), fluorine doped tin oxide (FTO), indium tin oxide (PTO), zinc antimonide (AZO) (IZO), tin oxide, ATO-coated titanium oxide, aluminum-doped zinc oxide, titanium oxide, zinc oxide, zirconium oxide, silicon oxide and aluminum oxide. These metal oxides may be treated with an organic or inorganic material. These metal oxides may be used in combination of two or more.

금속산화물의 시판품으로는,As a commercially available metal oxide,

Nissan Chemical Industries, Limited제: Sun Epoch EFR-6N, Sun Epoch EFR-6NP(오산화안티몬),Manufactured by Nissan Chemical Industries, Limited; Sun Epoch EFR-6N; Sun Epoch EFR-6NP (antimony pentoxide);

Ishihara Sangyo Kaisha, Ltd.제: SN-100P(ATO), FS-10P(ATO), SN-102P(ATO), FS-12P(ATO), ET-300W(ATO피복산화티탄), TTO-55(A)(산화티탄), TTO-55(B)(산화티탄), TTO-55(C)(산화티탄), TTO-55(D)(산화티탄), TTO-55(S)(산화티탄), TTO-55(N)(산화티탄), TTO-51(A)(산화티탄), TTO-51(C)(산화티탄), TTO-S-1(산화티탄), TTO-S-2(산화티탄), TTO-S-3(산화티탄), TTO-S-4(산화티탄), TTO-F-1(철함유 산화티탄), TTO-F-2(철함유 산화티탄), TTO-F-3(철함유 산화티탄), TTO-F-11(철함유 산화티탄), ST-01(산화티탄), ST-21(산화티탄), ST-30L(산화티탄), ST-31(산화티탄),(ATO), FS-10P (ATO), SN-102P (ATO), FS-12P (ATO), ET-300W (ATO coated titanium oxide), TTO-55 (manufactured by Ishihara Sangyo Kaisha, Ltd.) (A) (titanium oxide), TTO-55 (B) (titanium oxide), TTO-55 (C) (titanium oxide), TTO-55 (D) (Titanium oxide), TTO-51 (A) (titanium oxide), TTO-51 (C) (titanium oxide), TTO-S-1 (Titanium oxide), TTO-S-3 (titanium oxide), TTO-S-4 (titanium oxide), TTO-F- F-3 (iron-containing titanium oxide), TTO-F-11 (iron-containing titanium oxide), ST-01 (titanium oxide), ST-21 (titanium oxide) Titanium oxide),

Mitsubishi Materials Corporation제: T-1(ITO), S-1200(산화주석), EP SP-2(인도프산화주석),S-1200 (tin oxide), EP SP-2 (indium tin oxide), T-1 (ITO)

Mitsui Mining & Smelting Co., Ltd.제: Pastolan(ITO, ATO),Mitsui Mining & Smelting Co., Ltd. Pastolan (ITO, ATO),

C.I.Kasei Co.,Ltd.제: Nanotek ITO, Nanotek SnO2, Nanotek TiO2, Nanotek SiO2, Nanotek Al2O3, Nanotek ZnO,Nanotek ITO, Nanotek SnO 2, Nanotek TiO 2, Nanotek SiO 2, Nanotek Al 2 O 3, Nanotek ZnO,

Catalysts & Chemicals Industries Co.,Ltd.제: TL-20(ATO), TL-30(ATO), TL-30S(PTO), TL-120(ITO), TL-130(ITO),Catalysts & Chemicals Industries Co., Ltd .; TL-20 (ATO), TL-30 (ATO), TL-30S (PTO)

HakusuiTech Co., Ltd.제: PazetCK(알루미늄도프산화아연),Made by HakusuiTech Co., Ltd.: PazetCK (aluminum-doped zinc oxide),

Sakai Chemical Industry Co.,Ltd.제: FINEX-25(산화아연), FINEX-25LP(산화아연), FINEX-50(산화아연), FINEX-50LP(산화아연), FINEX-75(산화아연), NANOFINE-50A(산화아연), NANOFINE-50SD(산화아연), EZ-1(산화아연), STR-60C(산화티탄), STR-60C-LP(산화티탄), STR-100C(산화티탄), STR-100C-LP(산화티탄), STR-100A-LP(산화티탄), STR-100W(산화티탄),FINEX-25 (zinc oxide), FINEX-25LP (zinc oxide), FINEX-50 (zinc oxide), FINEX-50LP (zinc oxide) STR-60C-LP (titanium oxide), STR-100C (titanium oxide), NANOFINE-50A (zinc oxide), NANOFINE-50SD (zinc oxide), EZ- STR-100C-LP (titanium oxide), STR-100A-LP (titanium oxide), STR-100W

Sumitomo Osaka Cement Company, Limited제: OZC-3YC(산화지르코늄), OZC-3YD(산화지르코늄), OZC-3YFA(산화지르코늄), OZC-8YC(산화지르코늄), OZC-0S100(산화지르코늄),OZC-3YC (zirconium oxide), OZC-3YFA (zirconium oxide), OZC-8YC (zirconium oxide), OZC-0S100 (zirconium oxide), Sumitomo Osaka Cement Company,

Nihondenko Co.,Ltd제: PCS(산화지르코늄), PCS-60(산화지르코늄), PCS-90(산화지르코늄), T-01(산화지르코늄),(Zirconium oxide), PCS-60 (zirconium oxide), PCS-90 (zirconium oxide), T-01 (zirconium oxide)

Taica Corporation제: MT-100S(산화티탄), MT-100HD(산화티탄), MT-100SA(산화티탄), MT-500HD(산화티탄), MT-500SA(산화티탄), MT-600SA(산화티탄), MT-700HD(산화티탄), MZ-303S(산화아연), MZY-303S(산화아연), MZ-303M(산화아연), MZ-505S(산화아연), MZY-505S(산화아연), MZ-505M(산화아연),MT-100SA (titanium oxide), MT-100HD (titanium oxide), MT-100SA (titanium oxide), MT-500HD MZ-303S (zinc oxide), MZ-303S (zinc oxide), MZ-505S (zinc oxide), MZY-505S (zinc oxide) MZ-505M (zinc oxide),

Nippon Aerosil Co., Ltd.제: Aluminium Oxide C(산화알루미늄), AEROSIL130(산화규소), AEROSIL200(산화규소), AEROSIL200V(산화규소), AEROSIL200CF(산화규소), AEROSIL200FA(산화규소), AEROSIL300(산화규소), AEROSIL300CF(산화규소), AEROSIL380(산화규소), AEROSILR972(산화규소), AEROSILR974(산화규소), AEROSILR976(산화규소), AEROSILR202(산화규소), AEROSILR805(산화규소), AEROSILR812(산화규소), AEROSILR812S(산화규소), AEROSILMOX50(산화규소), AEROSILTT600(산화규소), AEROSILMOX80(산화규소/산화알루미늄), AEROSILMOX170(산화규소/산화알루미늄), AEROSILCOX84(산화규소/산화알루미늄),AEROSIL200 (oxidized silicon), AEROSIL200 (oxidized silicon), AEROSIL200V (silicon oxide), AEROSIL200CF (silicon oxide), AEROSIL200FA (silicon oxide), AEROSIL300 (oxidized silicon) (Silicon oxide), AEROSIL300CF (silicon oxide), AEROSIL380 (silicon oxide), AEROSILR972 (silicon oxide), AEROSILR974 (silicon oxide), AEROSILR976 (silicon oxide), AEROSILR202 , AEROSILMOX50 (silicon oxide), AEROSILMOX50 (silicon oxide), AEROSILMOX80 (silicon oxide / aluminum oxide), AEROSILMOX170 (silicon oxide / aluminum oxide), AEROSILCOX84 (silicon oxide / aluminum oxide)

등을 들 수 있다.
And the like.

금속산화물(B)의 함유량은 특별히 한정되지 않으나, 금속산화물 조성물의 전체질량의 5질량% 이상 50질량% 이하인 것이 바람직하다. 금속산화물(B)의 함유량이 5질량% 이상이면 하드코트성 등의 관점에서 보다 바람직하고, 50질량% 이하이면 금속산화물의 분산성 등의 관점에서 보다 바람직하다. 금속산화물(B)의 함유량은 특별히 한정되지 않으나, 금속산화물 조성물의 전체질량의 7질량% 이상인 것이 보다 바람직하고, 10질량% 이상인 것이 더욱 바람직하고, 또한, 40질량% 이하인 것이 보다 바람직하고, 35질량% 이하인 것이 더욱 바람직하다.
The content of the metal oxide (B) is not particularly limited, but is preferably 5% by mass or more and 50% by mass or less based on the total mass of the metal oxide composition. When the content of the metal oxide (B) is 5 mass% or more, it is more preferable from the viewpoint of hard coatability or the like, and when it is 50 mass% or less, the dispersibility of the metal oxide is more preferable. The content of the metal oxide (B) is not particularly limited, but is more preferably 7% by mass or more, more preferably 10% by mass or more, further preferably 40% by mass or less, By mass or less.

본 발명의 실시형태에 따르면, 미립의 금속산화물(B)을, 안정적으로, 1차 입자 레벨로 분산시킬 수 있다. 미립의 금속산화물(B)로는, 평균입자경이 100nm 이하, 바람직하게는 70nm 이하, 보다 바람직하게는 50nm 이하인 것을 들 수 있다. 또한, 분산입자경이나 경화막의 특성을 호적한 범위로 유지할 수 있는 것이면, 평균입자경이 100nm를 초과하는 금속산화물(B)을 이용할 수도 있다.
According to the embodiment of the present invention, the fine metal oxide (B) can be stably dispersed at the primary particle level. The particulate metal oxide (B) has an average particle size of 100 nm or less, preferably 70 nm or less, and more preferably 50 nm or less. Further, the metal oxide (B) having an average particle size exceeding 100 nm may be used as long as the dispersion particle diameter and the properties of the cured film can be kept within a favorable range.

용제를 첨가하는 경우는, 용제를 휘발시킨 후에 경화처리를 행하는 것이 바람직하다. 용제로는, 특별히 제한되는 것이 아니고, 해당 분야에서 알려진 다양한 유기용제를 이용할 수 있다. 구체적으로는 예를 들어, 시클로헥사논, 메틸이소부틸케톤, 메틸에틸케톤, 아세톤, 아세틸아세톤, 톨루엔, 자일렌, n-부탄올, 이소부탄올, tert-부탄올, n-프로판올, 이소프로판올, 에탄올, 메탄올, 3-메톡시-1-부탄올, 3-메톡시-2-부탄올, 에틸렌글리콜모노메틸에테르, 에틸렌글리콜모노n-부틸에테르, 2-에톡시에탄올, 1-메톡시-2-프로판올, 디아세톤알코올, 유산에틸, 유산부틸, 프로필렌글리콜모노메틸에테르, 에틸렌글리콜모노부틸에테르아세테이트, 프로필렌글리콜모노메틸에테르아세테이트, 2-에톡시에틸아세테이트, 부틸아세테이트, 이소아밀아세테이트, 아디프산디메틸, 숙신산디메틸, 글루타르산디메틸, 테트라하이드로퓨란, 메틸피롤리돈 등을 들 수 있다. 이들 유기용제는, 2종류 이상을 병용해도 무방하다.
In the case of adding a solvent, it is preferable to perform the curing treatment after volatilizing the solvent. The solvent is not particularly limited and various organic solvents known in the art can be used. Specific examples thereof include alcohols such as cyclohexanone, methyl isobutyl ketone, methyl ethyl ketone, acetone, acetylacetone, toluene, xylene, n-butanol, isobutanol, tert-butanol, n-propanol, isopropanol, , 3-methoxy-1-butanol, 3-methoxy-2-butanol, ethylene glycol monomethyl ether, ethylene glycol mono n-butyl ether, 2-ethoxy ethanol, Propyleneglycol monobutylether acetate, propyleneglycol monomethylether acetate, 2-ethoxyethyl acetate, butyl acetate, isoamyl acetate, dimethyl adipate, dimethyl succinate, propyleneglycol monomethyl ether, Dimethyl glutarate, tetrahydrofuran, methyl pyrrolidone and the like. These organic solvents may be used in combination of two or more.

그 중에서도, 수산기함유 용제는, 친수성이 높은 입자표면물성을 갖는 금속산화물에 대하여 젖음성이 좋은 점에서, 용제조성 중에 함유됨으로써, 금속산화물의 분산성 및 그 도료(금속산화물 조성물)의 경시안정성의 향상에 있어서 매우 효과적이며, 또한 도공(塗工)공정의 레벨링성도 향상되는 점에서 바람직하다. 전체용제조성 중의 수산기함유 용제함유량은, 10~100질량%인 것이 바람직하다. 구체적으로는, 수산기함유 용제로는, n-부탄올, 이소부탄올, tert-부탄올, n-프로판올, 이소프로판올, 에탄올, 메탄올, 3-메톡시-1-부탄올, 3-메톡시-2-부탄올, 에틸렌글리콜모노메틸에테르, 에틸렌글리콜모노n-부틸에테르, 2-에톡시에탄올, 1-메톡시-2-프로판올, 디아세톤알코올, 유산에틸, 유산부틸, 프로필렌글리콜모노메틸에테르 등을 들 수 있다. 특히, 3-메톡시-1-부탄올, 프로필렌글리콜모노메틸에테르, 에틸렌글리콜모노메틸에테르, 에틸렌글리콜모노n-부틸에테르는, 금속산화물의 분산성과 분산안정성이 보다 양호해지는 점에서 바람직하다.
Among them, the hydroxyl group-containing solvent is contained in the solvent composition in that it has good wettability with respect to the metal oxide having a high hydrophilicity and a surface property of the particles, and therefore the dispersion stability of the metal oxide and the stability And it is also preferable that the leveling property of the coating process is also improved. The content of the hydroxyl group-containing solvent in the total solvent composition is preferably 10 to 100% by mass. Specific examples of the hydroxyl group-containing solvent include n-butanol, isobutanol, tert-butanol, n-propanol, isopropanol, ethanol, methanol, 3-methoxy-1-butanol, 3- 2-propanol, diacetone alcohol, ethyl lactate, butyl lactate, propylene glycol monomethyl ether and the like can be given as examples of the solvent. Particularly, 3-methoxy-1-butanol, propylene glycol monomethyl ether, ethylene glycol monomethyl ether, and ethylene glycol mono-n-butyl ether are preferable from the viewpoint of better dispersibility and dispersion stability of the metal oxide.

용제의 함유량은 특별히 한정되지 않으나, 금속산화물 조성물의 전체질량의 30질량% 이상인 것이 바람직하고, 또한, 95질량% 이하인 것이 바람직하다. 용제의 함유량이 상기 범위내이면, 도공성 등의 관점에서 보다 바람직하다. 용제의 함유량은 금속산화물 조성물의 전체질량의 35질량% 이상인 것이 보다 바람직하고, 40질량% 이상인 것이 더욱 바람직하고, 또한, 90질량% 이하인 것이 보다 바람직하고, 85질량% 이하인 것이 더욱 바람직하다. 여기서, 상기 용제의 함유량은, 화합물(A)을 함유하는 수지바니시로서 용제를 함유하는 반응생성물을 사용하는 경우는, 반응생성물 중의 용제도 포함한 값이다.
The content of the solvent is not particularly limited, but is preferably 30 mass% or more, more preferably 95 mass% or less, of the total mass of the metal oxide composition. If the content of the solvent is within the above range, it is more preferable from the viewpoint of coatability and the like. The content of the solvent is more preferably 35 mass% or more of the total mass of the metal oxide composition, more preferably 40 mass% or more, further preferably 90 mass% or less, further preferably 85 mass% or less. Here, the content of the solvent is a value including the solvent in the reaction product when the reaction product containing the solvent is used as the resin varnish containing the compound (A).

본 발명의 금속산화물 조성물은, 화합물(A)과 금속산화물 분말을 단지 혼합하여 조제만 해도, 충분히 목적으로 하는 효과가 얻어진다. 단, 니더, 롤, 아트리토, 수퍼밀, 건식분쇄처리기 등에 의해 기계적으로 혼합하거나, 금속산화물 분말과 유기용제 등에 의한 서스펜션계에 화합물(A)을 포함하는 용액을 첨가하고, 금속산화물 표면에 화합물(A)을 침착시키는 등의 긴밀한 혼합계로 행하면, 더욱 양호한 결과를 얻을 수 있다.
In the metal oxide composition of the present invention, even if the compound (A) and the metal oxide powder are simply mixed and prepared, a desired effect can be sufficiently obtained. Alternatively, a solution containing the compound (A) may be added to the suspension system using a metal oxide powder, an organic solvent or the like mechanically by a kneader, a roll, an atrito, a super mill or a dry mill, (A) is deposited on the surface of the substrate, a more favorable result can be obtained.

이 금속산화물 조성물은, 금속산화물 분말이 균일하게 분산된 금속산화물 분산체인 것이 바람직하다. 금속산화물 분산체는, 화합물(A)을 이용하고, 금속산화물(B)을, 유기용제 존재하에서 분산시킴으로써, 바람직하게 제조할 수 있다.The metal oxide composition is preferably a metal oxide dispersion in which the metal oxide powder is uniformly dispersed. The metal oxide dispersion can be preferably produced by using the compound (A) and dispersing the metal oxide (B) in the presence of an organic solvent.

분산의 정도로는, 동적 광산란법을 이용한 Nikkiso Co., Ltd.제 「NANOTRAC UPA」로 측정한 경우, 분산입경D50은 200nm 미만이 바람직하고, 보다 바람직하게는 150nm 미만이다.
When measured by "NANOTRAC UPA" manufactured by Nikkiso Co., Ltd. using the dynamic light scattering method, the dispersion particle diameter D50 is preferably less than 200 nm, and more preferably less than 150 nm.

유기용제 등의 비수계 비히클 중으로의 화합물(A), 금속산화물(B), 또는 금속산화물 조성물의, 분산, 용해, 및 이들의 혼합 등에는, 페인트컨디셔너(Red Devil사제), 볼밀, 샌드밀(Shinmaru Enterprises Corporation제 「DYNO-MILL」 등), 아트리토, 펄밀(Nippon Eirich Co., Ltd.제 「DCP밀」 등), 코볼밀, 호모믹서, 호모디나이저(M Technique Co., Ltd.제 「Clearmix」 등), 습식 제트밀(Genus Limited제 「Genus PY」, Nanomizer Inc.제 「Nanomizer」), 미소 비즈밀(Kotobuki Industries Co., Ltd.제 「Super Appecks Mill」, 「Ultra Appecks Mill」) 등의 분산기를 사용할 수 있다. 분산기에 매체를 사용하는 경우에는, 유리비즈, 지르코니아비즈, 알루미나비즈, 자성비즈, 스티렌비즈 등을 이용하는 것이 바람직하다. 분산에 관해서는, 2종류 이상의 분산기, 또는 크기가 상이한 2종류 이상의 매체를 각각 이용하고, 이들을 단계적으로 사용하여 분산을 행해도 무방하다.
(Manufactured by Red Devil), a ball mill, a sand mill (manufactured by Red Devil Co., Ltd.), and the like can be used for dispersing, dissolving, and mixing the compound (A), the metal oxide (B), or the metal oxide composition into a non- (Manufactured by Nippon Eirich Co., Ltd., "DCP Mill", etc.), a cob ball mill, a homomixer, and a homomixer manufactured by M Technique Co., Ltd. , "Super Appecks Mill", "Ultra Appecks Mill" (trade name, manufactured by Kotobuki Industries Co., Ltd.), " ) May be used. When a medium is used for the dispersing machine, it is preferable to use glass beads, zirconia beads, alumina beads, magnetic beads, styrene beads or the like. As for the dispersion, two or more types of dispersion machines or two or more kinds of media of different sizes may be used respectively, and the dispersion may be performed by using them in a stepwise manner.

본 발명의 금속산화물 조성물은, 적어도 화합물(A)과, 금속산화물(B)과, 용제를 함유하는 것이며, 추가로 다양한 첨가제를, 본 발명의 목적이나 효과를 손상시키지 않는 범위에 있어서 포함할 수 있다. 구체적으로는, 광중합개시제, 광경화성 화합물, 중합금지제, 광증감제, 레벨링제, 계면활성제, 항균제, 안티블로킹제, 가소제, 자외선흡수제, 적외선흡수제, 산화방지제, 실란커플링제, 도전성 폴리머, 도전성 계면활성제, 무기충전제, 안료, 염료 등을 들 수 있다.
The metal oxide composition of the present invention contains at least a compound (A), a metal oxide (B) and a solvent, and may further contain various additives in a range that does not impair the objects and effects of the present invention have. Specifically, there may be mentioned a photopolymerization initiator, a photocurable compound, a polymerization inhibitor, a photosensitizer, a leveling agent, a surfactant, an antibacterial agent, an antiblocking agent, a plasticizer, an ultraviolet absorber, an infrared absorber, an antioxidant, a silane coupling agent, Surfactants, inorganic fillers, pigments, dyes, and the like.

화합물(A), 금속산화물(B), 및 용제 이외의 성분을 포함하는 금속산화물 조성물의 제조방법으로는, 특별히 제한되지 않고, 몇 가지 방법을 들 수 있다. 구체적으로는, 처음에 화합물(A) 및 금속산화물(B)을 유기용제 중에서 혼합분산하고, 안정된 금속산화물 분산체를 얻은 후, 다른 다양한 첨가제를 첨가 및 조제하여 제조하는 방법; 처음부터, 화합물(A), 금속산화물(B), 유기용제 및 기타 첨가제의 전부가 혼합된 상태로, 분산하고 제조하는 방법; 등을 들 수 있다.
The method for producing the metal oxide composition including the compound (A), the metal oxide (B), and the components other than the solvent is not particularly limited and several methods can be used. Concretely, there are a method in which the compound (A) and the metal oxide (B) are mixed and dispersed in an organic solvent to obtain a stable metal oxide dispersion, and then various other additives are added and prepared; A method of dispersing and preparing all of the compound (A), the metal oxide (B), the organic solvent and other additives in a mixed state from the beginning; And the like.

본 발명의 금속산화물 조성물은, 추가로, 광중합개시제를 포함할 수 있다.The metal oxide composition of the present invention may further include a photopolymerization initiator.

광중합개시제로는, 광여기(光勵起)에 의해 화합물(A)의 아크릴기의 비닐중합을 개시할 수 있는 기능을 갖는 것이면 특별히 한정은 없고, 예를 들어 모노카르보닐 화합물, 디카르보닐 화합물, 아세토페논 화합물, 벤조인에테르 화합물, 아실포스핀옥사이드 화합물, 아미노카르보닐 화합물 등을 사용할 수 있다.
The photopolymerization initiator is not particularly limited as long as it has a function capable of initiating vinyl polymerization of the acrylic group of the compound (A) by photoexcitation, and examples thereof include monocarbonyl compounds, dicarbonyl compounds , Acetophenone compounds, benzoin ether compounds, acylphosphine oxide compounds, aminocarbonyl compounds, and the like.

구체적으로는, 모노카르보닐 화합물로는, 벤조페논, 4-메틸-벤조페논, 2,4,6-트리메틸벤조페논, 메틸-o-벤조일벤조에이트, 4-페닐벤조페논, 4-(4-메틸페닐티오)페닐-에탄온, 3,3'-디메틸-4-메톡시벤조페논, 4-(1,3-아크릴로일-1,3,3'-디메틸-4-메톡시벤조페논, 4-(1,3-아크릴로일-1,4,7,10,13-펜타옥소트리데실)벤조페논, 3,3',4,4'-테트라(t-부틸퍼옥시카르보닐)벤조페논, 4-벤조일-N,N,N-트리메틸-1-프로판아민염산염, 4-벤조일-N,N-디메틸-N-2-(1-옥소-2-프로페닐옥시에틸)메타암모늄옥살산염, 2-/4-이소-프로필티옥산톤, 2,4-디에틸티옥산톤, 2,4-디클로로티옥산톤, 1-클로로-4-프로폭시티옥산톤, 2-하이드록시-3-(3,4-디메틸-9-옥소-9H티옥산톤-2-일옥시)-N,N,N-트리메틸-1-프로판아민염산염, 벤조일메틸렌-3-메틸나프토(1,2-d)티아졸린 등을 들 수 있다.
Specific examples of the monocarbonyl compound include benzophenone, 4-methyl-benzophenone, 2,4,6-trimethylbenzophenone, methyl-o-benzoylbenzoate, 4- Methoxybenzophenone, 4- (1,3-acryloyl-1,3,3'-dimethyl-4-methoxybenzophenone, 4,3'-dimethyl- - (1,3-acryloyl-1,4,7,10,13-pentaoxotridecyl) benzophenone, 3,3 ', 4,4'-tetra (t- butylperoxycarbonyl) benzophenone N, N-dimethyl-N-2- (1-oxo-2-propenyloxyethyl) methaammonium oxalate, 4-benzoyl- Propyl thioxanthone, 2,4-dichloro thioxanthone, 1-chloro-4-propoxythioxanthone, 2-hydroxy-3- N, N, N-trimethyl-1-propanamine hydrochloride, benzoylmethylene-3-methylnaphtho (1,2-d ) Thiazoline, and the like.

디카르보닐 화합물로는, 1,2,2-트리메틸-비시클로[2.1.1]헵탄-2,3-디온, 벤자일(benzil、별명:ジベンゾイル), 2-에틸안트라퀴논, 9,10-페난트렌퀴논, 메틸-α-옥소벤젠아세테이트, 4-페닐벤자일(4-phenyl-benzil) 등을 들 수 있다.Examples of the dicarbonyl compound include 1,2,2-trimethyl-bicyclo [2.1.1] heptane-2,3-dione, benzyl (dibenzoyl) Phenanthrenequinone, methyl- alpha -oxobenzene acetate, 4-phenyl-benzyl, and the like.

아세토페논 화합물로는, 2-하이드록시-2-메틸-1-페닐프로판-1-온, 1-(4-이소프로필페닐)-2-하이드록시-2-메틸-1-페닐프로판-1-온, 1-(4-이소프로필페닐)-2-하이드록시-디-2-메틸-1-페닐프로판-1-온, 1-하이드록시-시클로헥실페닐케톤, 2-하이드록시-2-메틸-1-스티릴프로판-1-온중합물, 디에톡시아세토페논, 디부톡시아세토페논, 2,2-디메톡시-1,2-디페닐에탄-1-온, 2,2-디에톡시-1,2-디페닐에탄-1-온, 2-메틸-1-[4-(메틸티오)페닐]-2-모르폴리노프로판-1-온, 2-벤질-2-디메틸아미노-1-(4-모르폴리노페닐)부탄-1-온, 1-페닐-1,2-프로판디온-2-(o-에톡시카르보닐)옥심, 3,6-비스(2-메틸-2-모르폴리노-프로파노일)-9-부틸카르바졸 등을 들 수 있다.
Examples of the acetophenone compound include 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1- (4-isopropylphenyl) -2- Methyl-1-phenylpropan-1-one, 1-hydroxy-cyclohexyl phenyl ketone, 2-hydroxy-2-methyl -1-styrylpropane-1-one polymer, diethoxyacetophenone, dibutoxyacetophenone, 2,2-dimethoxy-1,2-diphenylethan-1-one, 2,2-diethoxy- 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropane-1-one, -Morpholinophenyl) butan-1-one, 1-phenyl-1,2-propanedione-2- (o-ethoxycarbonyl) oxime, 3,6- -Propanoyl) -9-butylcarbazole, and the like.

벤조인에테르 화합물로는, 벤조인, 벤조인메틸에테르, 벤조인에틸에테르, 벤조인이소프로필에테르, 벤조인이소부틸에테르, 벤조인노말부틸에테르 등을 들 수 있다.Examples of the benzoin ether compound include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and benzoin normal butyl ether.

아실포스핀옥사이드 화합물로는, 2,4,6-트리메틸벤조일디페닐포스핀옥사이드, 4-n-프로필페닐-디(2,6-디클로로벤조일)포스핀옥사이드 등을 들 수 있다.
Examples of the acylphosphine oxide compound include 2,4,6-trimethylbenzoyldiphenylphosphine oxide and 4-n-propylphenyl-di (2,6-dichlorobenzoyl) phosphine oxide.

아미노카르보닐 화합물로는, 메틸-4-(디메톡시아미노)벤조에이트, 에틸-4-(디메틸아미노)벤조에이트, 2-n-부톡시에틸-4-(디메틸아미노)벤조에이트, 이소아밀-4-(디메틸아미노)벤조에이트, 2-(디메틸아미노)에틸벤조에이트, 4,4'-비스-4-디메틸아미노벤조페논, 4,4'-비스-4-디에틸아미노벤조페논, 2,5'-비스(4-디에틸아미노벤잘)시클로펜타논 등을 들 수 있다.Examples of aminocarbonyl compounds include methyl-4- (dimethoxyamino) benzoate, ethyl-4- (dimethylamino) benzoate, 2-n-butoxyethyl- 4- (dimethylamino) benzoate, 4, 4-dimethylaminobenzophenone, 4,4'-bis-4-diethylaminobenzophenone, 2, 4-dimethylamino benzoate, 5'-bis (4-diethylaminobenzal) cyclopentanone, and the like.

광중합개시제의 시판품으로는 Ciba Specialty Chemicals, Inc제 IRGACURE 184, 651, 500, 907, 127, 369, 784, 2959, BASF Japan Ltd.제 Lucirin TPO, DKSH Japan K.K.제 Esakyuawan 등을 들 수 있다.
Commercially available photopolymerization initiators include IRGACURE 184, 651, 500, 907, 127, 369, 784 and 2959 of Ciba Specialty Chemicals, Inc., Lucirin TPO of BASF Japan Ltd., and Esakyuawan of DKSH Japan KK.

광중합개시제는, 상기 화합물로 한정되지 않고, 자외선에 의해 중합을 개시시키는 능력이 있으면, 어떠한 것이어도 상관없다. 이들 광중합개시제는, 1종류로 이용되는 것 외에, 2종류 이상을 혼합하여 이용할 수도 있다.The photopolymerization initiator is not limited to the above compound, and any photopolymerization initiator may be used as long as it has the ability to initiate polymerization by ultraviolet rays. These photopolymerization initiators may be used singly or in combination of two or more.

광중합개시제의 사용량에 관해서는, 특별히 제한은 되지 않으나, 화합물(A)을 포함하는 광경화성 화합물의 전량(화합물(A) 이외의 광경화성 화합물을 포함하는 경우는, 화합물(A)과 화합물(A) 이외의 광경화성 화합물의 합계량) 100질량부에 대하여 1~20질량부의 범위내에서 사용하는 것이 바람직하다.The amount of the photopolymerization initiator to be used is not particularly limited, but the total amount of the photocurable compound containing the compound (A) (when the photopolymerizable compound other than the compound (A) ) Is preferably in the range of 1 to 20 parts by mass based on 100 parts by mass of the photo-curable compound.

증감제로서, 해당 기술분야에서 알려진 다양한 유기아민 등을 첨가할 수도 있다.As the sensitizer, various organic amines and the like known in the technical field may be added.

나아가, 상기 라디칼중합용 개시제 외에, 양이온중합용 개시제를 병용할 수도 있다.
Further, in addition to the radical polymerization initiator, a cation polymerization initiator may be used in combination.

금속산화물 조성물은, 화합물(A) 외에, 기타 바인더수지나, 화합물(A) 이외의 광경화성 화합물을 포함할 수도 있다.In addition to the compound (A), the metal oxide composition may contain other binder resins or photo-curable compounds other than the compound (A).

바인더수지로는, 예를 들어, 폴리우레탄수지, 폴리우레아수지, 폴리우레탄우레아수지, 폴리에스테르수지(화합물(A)을 제외함), 폴리에테르수지, 폴리카보네이트수지, 에폭시수지, 아미노수지, 스티렌수지, 아크릴수지, 멜라민수지, 폴리아미드수지, 페놀수지, 비닐수지 등을 들 수 있다. 이들 수지는, 1종류로 이용해도, 2종류 이상을 혼합하여 이용해도 된다. 바인더수지는, 금속산화물 조성물의 고형분(용제 이외의 성분. 이하, 동일함.)의 전량을 기준(100질량부)으로 하여, 20질량부 이하의 범위내에서 사용하는 것이 바람직하다.
Examples of the binder resin include a polyurethane resin, a polyurea resin, a polyurethaneurea resin, a polyester resin (excluding the compound (A)), a polyether resin, a polycarbonate resin, an epoxy resin, A resin, an acrylic resin, a melamine resin, a polyamide resin, a phenol resin, and a vinyl resin. These resins may be used singly or in combination of two or more kinds. The binder resin is preferably used within a range of not more than 20 parts by mass based on the total amount of solid components (components other than the solvent, hereinafter the same) of the metal oxide composition as a reference (100 parts by mass).

광경화성 화합물로는, 예를 들어, (메타)아크릴계 화합물, 지방족 비닐화합물, 알킬비닐에테르 화합물, α-올레핀 화합물, 비닐 화합물, 에티닐 화합물 등의 중합성 불포화 이중결합기를 갖는 화합물을 이용할 수 있다. 이들 중합성 불포화 이중결합기를 갖는 화합물은, 추가로 수산기, 알콕시기, 카르복실기, 아미드기, 실라놀기 등의 관능기를 가질 수도 있다. 이 광경화성 화합물은, 금속산화물 조성물의 고형분의 전량을 기준(100질량부)으로, 50질량부 미만의 범위내, 특히 5~40질량부의 범위내에서 사용하는 것이 바람직하다.
As the photo-curing compound, for example, a compound having a polymerizable unsaturated double bond group such as a (meth) acrylic compound, an aliphatic vinyl compound, an alkyl vinyl ether compound, an -olefin compound, a vinyl compound or an ethynyl compound can be used . The compound having a polymerizable unsaturated double bond group may further have a functional group such as a hydroxyl group, an alkoxy group, a carboxyl group, an amide group, and a silanol group. The photocurable compound is preferably used in a range of less than 50 parts by mass, particularly in a range of 5 to 40 parts by mass based on the entire solid content of the metal oxide composition (100 parts by mass).

(메트)아크릴계 화합물로는, 벤질(메트)아크릴레이트, 알킬계 (메트)아크릴레이트, 알킬렌글리콜계 (메트)아크릴레이트, 카르복실기와 중합성 불포화 이중결합을 갖는 화합물, 수산기를 갖는 (메트)아크릴계 화합물, 질소함유 (메트)아크릴계 화합물 등이 있다. 또한, 단관능 화합물, 다관능 화합물(화합물(A)를 제외함)을 적당히 사용할 수 있다. 광경화성, 도막의 하드코트성의 점에서는, 다관능인 것이 바람직하다.
Examples of the (meth) acrylic compound include benzyl (meth) acrylate, alkyl (meth) acrylate, alkylene glycol (meth) acrylate, compounds having a carboxyl group and a polymerizable unsaturated double bond, An acrylic compound, and a nitrogen-containing (meth) acrylic compound. Further, a monofunctional compound or a multifunctional compound (excluding the compound (A)) can be suitably used. In view of photocurability and hard coatability of the coating film, it is preferable that the film is polyfunctional.

단관능의 (메트)아크릴계 화합물로서 구체적으로는, 알킬계 (메트)아크릴레이트로는, 메틸(메트)아크릴레이트, 에틸(메트)아크릴레이트, 프로필(메트)아크릴레이트, 부틸(메트)아크릴레이트, 펜틸(메트)아크릴레이트, 2-에틸헥실(메트)아크릴레이트, 헵틸(메트)아크릴레이트, 헥실(메트)아크릴레이트, 옥틸(메트)아크릴레이트, 노닐(메트)아크릴레이트, 데실(메트)아크릴레이트, 운데실(메트)아크릴레이트, 도데실(메트)아크릴레이트, 트리데실(메트)아크릴레이트, 테트라데실(메트)아크릴레이트, 펜타데실(메트)아크릴레이트, 헥사데실(메트)아크릴레이트, 헵타데실(메트)아크릴레이트, 옥타데실(메트)아크릴레이트, 노나데실(메트)아크릴레이트, 이코실(메트)아크릴레이트, 헨이코실(메트)아크릴레이트, 도코실(메트)아크릴레이트 등의 탄소수 1~22의 알킬(메트)아크릴레이트를 들 수 있다. 극성의 조정을 목적으로 하는 경우에는, 탄소수 2~10, 더욱 바람직하게는 탄소수 2~8의 알킬기를 갖는 알킬기함유 (메트)아크릴레이트를 이용하는 것이 바람직하다. 또한, 레벨링성의 조절 등을 목적으로 하는 경우에는, 탄소수 6 이상의 알킬기를 갖는 알킬(메트)아크릴레이트를 이용하는 것이 바람직하다.
Specific examples of the monofunctional (meth) acrylic compound include alkyl (meth) acrylates such as methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (Meth) acrylate, octyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, (Meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, tridecyl (meth) acrylate, tetradecyl (meth) acrylate, pentadecyl (Meth) acrylate, octadecyl (meth) acrylate, octadecyl (meth) acrylate, nonadecyl (meth) acrylate, icosyl Alkyl of 1 to 22 carbon atoms (Meth) acrylate. When it is intended to adjust the polarity, it is preferable to use an alkyl group-containing (meth) acrylate having an alkyl group having 2 to 10 carbon atoms, more preferably 2 to 8 carbon atoms. Further, when it is intended to control the leveling property or the like, it is preferable to use an alkyl (meth) acrylate having an alkyl group having 6 or more carbon atoms.

알킬렌글리콜계 (메트)아크릴레이트로는, 디에틸렌글리콜모노(메트)아크릴레이트, 트리에틸렌글리콜모노(메트)아크릴레이트, 테트라에틸렌글리콜모노(메트)아크릴레이트, 헥사에틸렌글리콜모노(메트)아크릴레이트, 폴리에틸렌글리콜모노(메트)아크릴레이트, 디프로필렌글리콜모노(메트)아크릴레이트, 트리프로필렌글리콜모노(메트)아크릴레이트, 테트라프로필렌글리콜모노(메트)아크릴레이트, 폴리테트라메틸렌글리콜(메트)아크릴레이트 등의, 말단에 수산기를 갖고 폴리옥시알킬렌쇄를 갖는 모노(메트)아크릴레이트; 메톡시에틸렌글리콜(메트)아크릴레이트, 메톡시디에틸렌글리콜(메트)아크릴레이트, 메톡시트리에틸렌글리콜(메트)아크릴레이트, 메톡시테트라에틸렌글리콜(메트)아크릴레이트, 에톡시테트라에틸렌글리콜(메트)아크릴레이트, 프로폭시테트라에틸렌글리콜(메트)아크릴레이트, n-부톡시테트라에틸렌글리콜(메트)아크릴레이트, n-펜타옥시테트라에틸렌글리콜(메트)아크릴레이트, 트리프로필렌글리콜(메트)아크릴레이트, 테트라프로필렌글리콜(메트)아크릴레이트, 메톡시트리프로필렌글리콜(메트)아크릴레이트, 메톡시테트라프로필렌글리콜(메트)아크릴레이트, 에톡시테트라프로필렌글리콜(메트)아크릴레이트, 프로폭시테트라프로필렌글리콜(메트)아크릴레이트, n-부톡시테트라프로필렌글리콜(메트)아크릴레이트, n-펜타옥시테트라프로필렌글리콜(메트)아크릴레이트, 메톡시폴리테트라메틸렌글리콜(메트)아크릴레이트, 메톡시폴리에틸렌글리콜(메트)아크릴레이트, 에톡시폴리에틸렌글리콜(메트)아크릴레이트 등의, 말단에 알콕시기를 갖고 폴리옥시알킬렌쇄를 갖는 모노(메트)아크릴레이트; 페녹시디에틸렌글리콜(메트)아크릴레이트, 페녹시에틸렌글리콜(메트)아크릴레이트, 페녹시트리에틸렌글리콜(메트)아크릴레이트, 페녹시테트라에틸렌글리콜(메트)아크릴레이트, 페녹시헥사에틸렌글리콜(메트)아크릴레이트, 페녹시폴리에틸렌글리콜(메트)아크릴레이트, 페녹시테트라프로필렌에틸렌글리콜(메트)아크릴레이트 등의, 말단에 페녹시 또는 아릴옥시기를 갖는 폴리옥시알킬렌계 (메트)아크릴레이트를 들 수 있다.
Examples of the alkylene glycol (meth) acrylate include diethylene glycol mono (meth) acrylate, triethylene glycol mono (meth) acrylate, tetraethylene glycol mono (meth) acrylate, hexaethylene glycol mono (Meth) acrylate, dipropylene glycol mono (meth) acrylate, tripropylene glycol mono (meth) acrylate, tetrapropylene glycol mono (meth) acrylate, polytetramethylene glycol Mono (meth) acrylate having a hydroxyl group at the terminal and having a polyoxyalkylene chain; (Meth) acrylates such as methoxyethylene glycol (meth) acrylate, methoxyethylene glycol (meth) acrylate, methoxy triethylene glycol (meth) acrylate, methoxy tetraethylene glycol (Meth) acrylate, propoxytetraethylene glycol (meth) acrylate, n-butoxytetraethylene glycol (meth) acrylate, n-pentoxy tetraethylene glycol (Meth) acrylate, methoxytripropylene glycol (meth) acrylate, methoxy tetrapropylene glycol (meth) acrylate, ethoxytetrapropylene glycol (meth) acrylate, propoxy tetrapropylene glycol N-butoxytetrapropylene glycol (meth) acrylate, n-pentoxytetrapropylene glycol ( (Meth) acrylate, methoxypolyethylene glycol (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, ethoxypolyethylene glycol (meth) acrylate and the like having an alkoxy group at the terminal and having a polyoxyalkylene chain Mono (meth) acrylate; (Meth) acrylate, phenoxyethylene glycol (meth) acrylate, phenoxyethylene glycol (meth) acrylate, phenoxyethylene glycol (meth) acrylate, phenoxy triethylene glycol (Meth) acrylate having a phenoxy or aryloxy group at the terminal, such as phenoxypolyethylene glycol (meth) acrylate, phenoxy tetrapropylene ethylene glycol (meth) acrylate and the like.

카르복실기 및 중합성 불포화 이중결합을 갖는 화합물로는, 말레산, 푸마르산, 이타콘산, 시트라콘산, 또는, 이들의 알킬 혹은 알케닐모노에스테르, 프탈산β-(메트)아크릴로옥시에틸모노에스테르, 이소프탈산β-(메트)아크릴로옥시에틸모노에스테르, 숙신산β-(메트)아크릴로옥시에틸모노에스테르, 아크릴산, 메타크릴산, 크로톤산, 계피산 등을 들 수 있다.
Examples of the compound having a carboxyl group and a polymerizable unsaturated double bond include maleic acid, fumaric acid, itaconic acid, citraconic acid or alkyl or alkenyl monoesters thereof, phthalic acid? - (meth) acryloxyethyl monoester, Phthalic acid? - (meth) acryloxyethyl monoester, succinic acid? - (meth) acryloxyethyl monoester, acrylic acid, methacrylic acid, crotonic acid and cinnamic acid.

수산기함유 (메트)아크릴계 화합물로는, 2-하이드록시에틸(메트)아크릴레이트, 2-하이드록시프로필(메트)아크릴레이트, 4-하이드록시부틸(메트)아크릴레이트, 글리세롤모노(메트)아크릴레이트, 4-하이드록시비닐벤젠, 2-하이드록시-3-페녹시프로필(메트)아크릴레이트 등을 들 수 있다.
Examples of the hydroxyl group-containing (meth) acrylic compound include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, glycerol mono , 4-hydroxyvinylbenzene, 2-hydroxy-3-phenoxypropyl (meth) acrylate, and the like.

질소함유 (메트)아크릴계 화합물로는, (메트)아크릴아미드, N-메틸올(메트)아크릴아미드, N-메톡시메틸-(메트)아크릴아미드, N-에톡시메틸-(메트)아크릴아미드, N-프로폭시메틸-(메트)아크릴아미드, N-부톡시메틸-(메트)아크릴아미드, N-펜톡시메틸-(메트)아크릴아미드 등의 모노알킬올(메트)아크릴아미드, N,N-디(메틸올)아크릴아미드, N-메틸올-N-메톡시메틸(메트)아크릴아미드, N-에톡시메틸-N-메톡시메틸메타아크릴아미드, N,N-디(에톡시메틸)아크릴아미드, N-에톡시메틸-N-프로폭시메틸메타아크릴아미드, N,N-디(프로폭시메틸)아크릴아미드, N-부톡시메틸-N-(프로폭시메틸)메타아크릴아미드, N,N-디(부톡시메틸)아크릴아미드, N-부톡시메틸-N-(메톡시메틸)메타아크릴아미드, N,N-디(펜톡시메틸)아크릴아미드, N-메톡시메틸-N-(펜톡시메틸)메타아크릴아미드 등의 디알킬올(메트)아크릴아미드 등의 아크릴아미드계 불포화 화합물; 디메틸아미노에틸(메트)아크릴레이트, 디에틸아미노에틸(메트)아크릴레이트, 메틸에틸아미노에틸(메트)아크릴레이트, 디메틸아미노스티렌, 디에틸아미노스티렌 등의 디알킬아미노기를 갖는 불포화 화합물; 및, 대이온으로서 Cl-, Br-, I- 등의 할로겐이온 또는 QSO3 -(Q: 탄소수 1~12의 알킬기)을 갖는 디알킬아미노기함유 불포화 화합물의 4급 암모늄염 등이 있다.
Examples of the nitrogen-containing (meth) acrylic compound include (meth) acrylamide, N-methylol (meth) acrylamide, N- methoxymethyl- (meth) acrylamide, N- ethoxymethyl- (meth) (Meth) acrylamides such as N-propoxymethyl- (meth) acrylamide, N-butoxymethyl- (meth) acrylamide and N-pentoxymethyl- (meth) (Meth) acrylamide, N, N-di (ethoxymethyl) acrylamide, N, N-di Amide, N-ethoxymethyl-N-propoxymethylmethacrylamide, N, N-di (propoxymethyl) acrylamide, N-butoxymethyl- N- (propoxymethyl) methacrylamide, N, N (Methoxymethyl) methacrylamide, N, N-di (pentoxymethyl) acrylamide, N-methoxymethyl-N- Methoxymethyl) methacrylamide. Acrylamide-based unsaturated compounds such as alkylol (meth) acrylamide; Unsaturated compounds having dialkylamino groups such as dimethylaminoethyl (meth) acrylate, diethylaminoethyl (meth) acrylate, methylethylaminoethyl (meth) acrylate, dimethylaminostyrene and diethylaminostyrene; And a quaternary ammonium salt of a dialkylamino group-containing unsaturated compound having a halogen ion such as Cl - , Br - , I - or QSO 3 - (Q: an alkyl group having 1 to 12 carbon atoms) as a counter ion.

기타 불포화 화합물로는, 퍼플루오로메틸메틸(메트)아크릴레이트, 퍼플루오로에틸메틸(메트)아크릴레이트, 2-퍼플루오로부틸에틸(메트)아크릴레이트, 2-퍼플루오로헥실에틸(메트)아크릴레이트, 2-퍼플루오로옥틸에틸(메트)아크릴레이트, 2-퍼플루오로이소노닐에틸(메트)아크릴레이트, 2-퍼플루오로노닐에틸(메트)아크릴레이트, 2-퍼플루오로데실에틸(메트)아크릴레이트, 퍼플루오로프로필프로필(메트)아크릴레이트, 퍼플루오로옥틸프로필(메트)아크릴레이트, 퍼플루오로옥틸아밀(메트)아크릴레이트, 퍼플루오로옥틸운데실(메트)아크릴레이트 등의, 탄소수 1~20의 퍼플루오로알킬기를 갖는 퍼플루오로알킬알킬(메트)아크릴레이트류를 들 수 있다.
Examples of the other unsaturated compound include perfluoromethyl (meth) acrylate, perfluoroethylmethyl (meth) acrylate, 2-perfluorobutylethyl (meth) acrylate, 2-perfluorohexylethyl Acrylate, 2-perfluorooctylethyl (meth) acrylate, 2-perfluorooctanoylethyl (meth) acrylate, 2-perfluorononylethyl Perfluorooctyl amyl (meth) acrylate, perfluorooctyl undecyl (meth) acrylate, perfluorooctyl (meth) acrylate, perfluorooctyl (meth) And perfluoroalkylalkyl (meth) acrylates having a perfluoroalkyl group having 1 to 20 carbon atoms, such as a perfluoroalkyl (meth) acrylate.

또한, 퍼플루오로부틸에틸렌, 퍼플루오로헥실에틸렌, 퍼플루오로옥틸에틸렌, 퍼플루오로데실에틸렌 등의 퍼플루오로알킬, 알킬렌류 등의 퍼플루오로알킬기함유 비닐모노머; 비닐클로르실란, 비닐트리스(β-메톡시에톡시)실란, 비닐트리에톡시실란, γ-(메트)아크릴로옥시프로필트리메톡시실란 등의 알콕시실릴기함유 비닐 화합물 및 그 유도체; 글리시딜아크릴레이트, 3,4-에폭시시클로헥실아크릴레이트 등의 글리시딜기함유 아크릴레이트를 들 수 있다.
Also, perfluoroalkyl group-containing vinyl monomers such as perfluoroalkyls such as perfluorobutyl ethylene, perfluorohexyl ethylene, perfluorooctyl ethylene and perfluorodecyl ethylene, and alkylenes; Alkoxysilyl group-containing vinyl compounds such as vinylchlorosilane, vinyltris (? -Methoxyethoxy) silane, vinyltriethoxysilane and? - (meth) acryloxypropyltrimethoxysilane, and derivatives thereof; Glycidyl group-containing acrylates such as glycidyl acrylate and 3,4-epoxycyclohexyl acrylate.

지방족 비닐 화합물로는, 아세트산비닐, 부티르산비닐, 크로톤산비닐, 카프르산비닐, 라우르산비닐, 클로르아세트산비닐, 올레산비닐, 스테아르산비닐 등을 들 수 있다.Examples of the aliphatic vinyl compound include vinyl acetate, vinyl butyrate, vinyl crotonate, vinyl caprate, vinyl laurate, vinyl chloroacetate, vinyl oleate and vinyl stearate.

알킬비닐에테르 화합물로는, 부틸비닐에테르, 에틸비닐에테르 등을 들 수 있다.
Examples of the alkyl vinyl ether compound include butyl vinyl ether and ethyl vinyl ether.

α-올레핀 화합물로는, 1-헥센, 1-옥텐, 1-데센, 1-도데센, 1-테트라데센, 1-헥사데센 등을 들 수 있다.Examples of the? -olefin compound include 1-hexene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene and 1-hexadecene.

비닐 화합물로는, 알릴아세트산, 알릴알코올, 알릴벤젠, 시안화알릴 등의 알릴 화합물, 시안화비닐, 비닐시클로헥산, 비닐메틸케톤, 스티렌, α-메틸스티렌, 2-메틸스티렌, 클로로스티렌 등을 들 수 있다.Examples of the vinyl compound include allyl compounds such as allylacetic acid, allyl alcohol, allylbenzene, and allyl cyanide; vinyl compounds such as vinylcyclohexane, vinylmethylketone, styrene,? -Methylstyrene, 2-methylstyrene, have.

에티닐 화합물로는, 아세틸렌, 에티닐벤젠, 에티닐톨루엔, 1-에티닐-1-시클로헥산올 등을 들 수 있다.Examples of the ethynyl compound include acetylene, ethynylbenzene, ethynyltoluene, 1-ethynyl-1-cyclohexanol and the like.

이들은, 1종류로 이용할 수도 있고, 2종류 이상을 혼합하여 이용할 수도 있다.
These may be used singly or in combination of two or more.

이들 중에서도, 화합물(A) 이외의 광경화성 화합물로는, 도막강도, 내찰상성의 관점에서, 적어도 3개의 관능기를 갖는 폴리우레탄폴리(메트)아크릴레이트, 폴리에폭시폴리(메트)아크릴레이트 등의 폴리(메트)아크릴레이트류, 분자내에 3개 이상의 아크릴로일기를 갖는 다관능의 아크릴레이트류를 호적하게 사용할 수 있다.Among them, photo-curable compounds other than the compound (A) are preferably a polyurethane poly (meth) acrylate having at least three functional groups and a poly (meth) acrylate such as polyepoxy poly (meth) acrylate in view of film strength and scratch resistance. (Meth) acrylates, and polyfunctional acrylates having three or more acryloyl groups in the molecule can be suitably used.

폴리에폭시폴리(메트)아크릴레이트는, 에폭시수지의 에폭시기를 (메트)아크릴산으로 에스테르화하여, 관능기를 (메트)아크릴로일기로 한 것이며, 비스페놀A형 에폭시수지에 대한 (메트)아크릴산부가물, 노볼락형 에폭시수지에 대한 (메트)아크릴산부가물 등이 있다.
The polyepoxy poly (meth) acrylate is obtained by esterifying an epoxy group of an epoxy resin with (meth) acrylic acid to give a (meth) acryloyl group as the functional group. The (meth) acrylic acid adduct, (Meth) acrylic acid adduct to novolak type epoxy resin, and the like.

폴리우레탄폴리(메트)아크릴레이트는, 예를 들어, 디이소시아네이트와 수산기를 갖는 (메트)아크릴레이트류를 반응시켜 얻어지는 것, 폴리올과 폴리이소시아네이트를 이소시아네이트기 과잉의 조건하에 반응시켜 이루어지는 이소시아네이트기함유 우레탄프리폴리머를, 수산기를 갖는 (메트)아크릴레이트류와 반응시켜 얻어지는 것이 있다. 혹은, 폴리올과 폴리이소시아네이트를 수산기 과잉의 조건하에 반응시켜 이루어지는 수산기함유 우레탄프리폴리머를, 이소시아네이트기를 갖는 (메트)아크릴레이트류와 반응시켜 얻을 수도 있다.
The polyurethane poly (meth) acrylate can be obtained, for example, by reacting a diisocyanate with a (meth) acrylate having a hydroxyl group, an isocyanate group-containing urethane obtained by reacting a polyol and a polyisocyanate under an isocyanate group- (Meth) acrylates having a hydroxyl group. Alternatively, it may be obtained by reacting a hydroxyl group-containing urethane prepolymer obtained by reacting a polyol and a polyisocyanate under an excess of hydroxyl group, with a (meth) acrylate having an isocyanate group.

폴리올로는, 에틸렌글리콜, 프로필렌글리콜, 디에틸렌글리콜, 디프로필렌글리콜, 부틸렌글리콜, 1,6-헥산디올, 3-메틸-1,5-펜탄글리콜, 네오펜틸글리콜, 헥산트리올, 트리메틸올프로판, 폴리테트라메틸렌글리콜, 아디프산과 에틸렌글리콜의 축중합물 등을 들 수 있다.
Examples of the polyol include ethylene glycol, propylene glycol, diethylene glycol, dipropylene glycol, butylene glycol, 1,6-hexanediol, 3-methyl-1,5-pentanediol, neopentyl glycol, hexanetriol, Propane, polytetramethylene glycol, and a condensation polymer of adipic acid and ethylene glycol.

폴리이소시아네이트로는, 톨릴렌디이소시아네이트, 이소포론디이소시아네이트, 헥사메틸렌디이소시아네이트 등을 들 수 있다.Examples of the polyisocyanate include tolylene diisocyanate, isophorone diisocyanate, and hexamethylene diisocyanate.

수산기를 갖는 (메트)아크릴레이트류로는, 2-하이드록시에틸(메트)아크릴레이트,2-하이드록시프로필(메트)아크릴레이트, 4-하이드록시부틸(메트)아크릴레이트, 펜타에리스리톨트리(메트)아크릴레이트, 디펜타에리스리톨펜타(메트)아크릴레이트, 디트리메틸올프로판테트라(메트)아크릴레이트 등을 들 수 있다.Examples of the (meth) acrylates having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, pentaerythritol tri ) Acrylate, dipentaerythritol penta (meth) acrylate, and ditrimethylol propane tetra (meth) acrylate.

이소시아네이트기를 갖는 (메트)아크릴레이트류로는, 2-(메트)아크릴로일옥시에틸이소시아네이트, (메트)아크릴로일이소시아네이트 등을 들 수 있다.
Examples of the (meth) acrylates having an isocyanate group include 2- (meth) acryloyloxyethyl isocyanate and (meth) acryloyl isocyanate.

광경화성 화합물의 시판품으로는, 이하의 것을 예시할 수 있다.As a commercially available product of the photo-curing compound, the following can be exemplified.

Toagosei Company, Limited제: ARONIX M-400, ARONIX M-402, ARONIX M-408, ARONIX M-450, ARONIX M-7100, ARONIX M-8030, ARONIX M-8060,ARONIX M-8060, ARONIX M-8060, ARONIX M-450, ARONIX M-7100, ARONIX M-8030, ARONIX M-

Osaka Organic Chemical Industry Ltd.제: VISCOAT#400, Osaka Organic Chemical Industry Ltd., VISCOAT # 400,

화약 Sartomer, Inc.제: SR-295,Gunpowder Sartomer, Inc., SR-295,

Daicel-UCB Company, Ltd.제: DPHA, Ebecryl 220, Ebecryl 1290K, Ebecryl 5129, Ebecryl 2220, Ebecryl 6602,Manufactured by Daicel-UCB Company, Ltd. DPHA, Ebecryl 220, Ebecryl 1290K, Ebecryl 5129, Ebecryl 2220, Ebecryl 6602,

Shin-Nakamura Chemical Co.,Ltd.제: NK Ester A-TMMT, NK Ester A-BPEF, NK Olygo EA-1020, NK Olygo EMA-1020, NK Olygo EA-6310, NK Olygo EA-6320, NK Olygo EA-6340, NK Olygo MA-6, NK Olygo U-4HA, NK Olygo U-6HA, NK Olygo U-324A,Shin-Nakamura Chemical Co., Ltd .: NK Ester A-TMMT, NK Ester A-BPEF, NK Olygo EA-1020, NK Olygo EA-6310, NK Olygo EA- -6340, NK Olygo MA-6, NK Olygoi-4HA, NK Olygoi-6HA, NK Olygoi-324A,

BASF Japan Ltd.제: Laromer EA81,Manufactured by BASF Japan Ltd., Laromer EA81,

San Nopco Limited제: Photomer 3016,Manufactured by San Nopco Limited: Photomer 3016,

Arakawa Chemical Industries, Ltd.제: Beam Set 371, Beam Set 575, Beam Set 577, Beam Set 700, Beam Set 710;Beam Set 371, Beam Set 575, Beam Set 577, Beam Set 700, Beam Set 710 manufactured by Arakawa Chemical Industries, Ltd.;

Negami Chemical Industrial Co., Ltd 제: Art Resin UN-3320HA, Art Resin UN-3320HB, Art Resin UN-3320HC, Art Resin UN-3320HS, Art Resin UN-9000H, Art Resin UN-901T, Art Resin HDP, Art Resin HDP-3, Art Resin H61,Art Resin UN-3320H, Art Resin UN-3320HC, Art Resin UN-3320HC, Art Resin UN-3320HS, Art Resin UN-9000H, Art Resin UN-901T, Art Resin HDP, Art Resin HDP-3, Art Resin H61,

The Nippon Synthetic Chemical Industry Co.,Ltd.제: Shiko UV-7600B, Shiko UV-7610B, Shiko UV-7620EA, Shiko UV-7630B, Shiko UV-1400B, Shiko UV-1700B, Shiko UV-6300B,Shiko UV-7600B, Shiko UV-7600B, Shiko UV-7600B, Shiko UV-7600B, Shiko UV-1400B, Shiko UV-

Kyoeisha Chemical Co., Ltd.제: LIGHTACRYLATE PE-4A, LIGHTACRYLATE DPE-6A, UA-306H, UA-306T, UA-306I,LIGHTACRYLATE PE-4A, LIGHTACRYLATE DPE-6A, UA-306H, UA-306T, UA-306I,

Nippon Kayaku Co.,Ltd.제: KAYARAD DPHA, KAYARAD DPHA2C, KAYARAD DPHA-40H, KAYARAD D-310, KAYARAD D-330,KAYARAD DPHA2C, KAYARAD DPHA-40H, KAYARAD D-310, KAYARAD D-330, KAYARAD DPHA, Nippon Kayaku Co.,

Osaka Gas Chemicals Co., Ltd.제: OGSOL EA-2000, OGSOL EA-3000, OGSOL GA-5000.
Osaka Gas Chemicals Co., Ltd., OGSOL EA-2000, OGSOL EA-3000, OGSOL GA-5000.

이어서, 경화막과 그의 경화막이 부착된 부재에 관하여 설명한다.Next, the cured film and the member to which the cured film is attached will be described.

경화막은, 본 발명의 금속산화물 조성물을 경화하여 이루어진 막이다. 그 제조방법은, 예를 들어, 금속산화물 조성물을 임의의 기재에 도포하는 것, 및 활성 에너지선을 조사하여, 기재 상의 금속산화물 조성물을 경화시키는 것을 포함할 수 있다.The cured film is a film formed by curing the metal oxide composition of the present invention. The preparation method can include, for example, applying a metal oxide composition to an arbitrary substrate, and irradiating an active energy ray to cure the metal oxide composition on the substrate.

보다 구체적으로는, 이 금속산화물 조성물을 임의의 기재 상에, 건조 후의 막두께가 바람직하게는 0.03~30μm, 보다 바람직하게는 0.03~20μm가 되도록 도공 후, 경화처리함으로써 형성할 수 있다.
More specifically, the metal oxide composition may be coated on an arbitrary substrate so that the film thickness after drying is preferably 0.03 to 30 탆, more preferably 0.03 to 20 탆, and then cured.

형성시에 있어서, 경화막은, 기재에 직접 도공될 수도 있고, 경화막과 기재 사이에 1층 이상의 하층이 존재할 수도 있다.In forming, the cured film may be applied directly to the substrate, and there may be one or more underlying layers between the cured film and the substrate.

이 기재로는, 금속, 세라믹스, 유리, 플라스틱, 목재, 슬레이트, 종이 등을 들 수 있으나, 특별히 제한되는 것은 아니다. 구체적인 플라스틱의 종류로는, 폴리에스테르, 폴리올레핀, 폴리카보네이트, 폴리스티렌, 폴리메틸메타크릴레이트, 트리아세틸셀룰로오스수지, ABS수지, AS수지, 폴리아미드, 에폭시수지, 멜라민수지 등을 들 수 있다. 또한 기재의 형상으로는 필름시트, 판상패널, 렌즈형상, 디스크형상, 화이버상인 것을 들 수 있으나, 특별히 제한되는 것은 아니다.Examples of the substrate include metal, ceramics, glass, plastic, wood, slate, paper, and the like, but are not particularly limited. Specific examples of the plastic include polyester, polyolefin, polycarbonate, polystyrene, polymethyl methacrylate, triacetylcellulose resin, ABS resin, AS resin, polyamide, epoxy resin and melamine resin. The substrate may be in the form of a film sheet, a plate-like panel, a lens, a disk, or a fiber, but is not particularly limited.

기재는, 필요에 따라, 일부 또는 전부에, 표면처리나 기능층(점착층 또는 정보기록층 등)이 형성될 수도 있다.
A surface treatment or a functional layer (an adhesive layer or an information recording layer or the like) may be formed on a part or whole of the substrate, if necessary.

도공방법으로는, 해당 기술분야에서 알려진 다양한 방법을 이용할 수 있고, 예를 들어 로드(ロッド) 또는 와이어바 등을 이용한 방법이나, 마이크로그라비아, 그라비아, 다이, 커튼, 립, 슬롯 또는 스핀 등의 각종 코팅방법을 이용할 수 있다.As the coating method, various methods known in the art can be used. For example, a method using a rod or a wire bar, or a method using a micro gravure, a gravure, a die, a curtain, a lip, Coating method can be used.

경화처리는, 해당 기술분야에서 알려진 다양한 기술을 이용하여, 예를 들어, 자외선, 전자선, 파장 400~500nm의 가시광선 등의 활성 에너지선을 조사함으로써 행할 수 있다. 자외선 및 파장 400~500nm의 가시광선의 선원(광원)에는, 예를 들어 고압수은램프, 초고압수은램프, 메탈할라이드램프, 갈륨램프, 크세논램프, 카본아크램프 등을 사용할 수 있다. 전자선원에는, 열전자방사총, 전해방사총 등을 사용할 수 있다.
The curing treatment can be performed by irradiating active energy rays such as ultraviolet rays, electron beams, and visible rays having a wavelength of 400 to 500 nm, using various techniques known in the art. For example, a high-pressure mercury lamp, a high-pressure mercury lamp, a metal halide lamp, a gallium lamp, a xenon lamp, a carbon arc lamp, and the like can be used as a source of ultraviolet rays and visible light having a wavelength of 400 to 500 nm. The electron source may be a thermionic emission gun, an electrolytic radiation gun, or the like.

조사하는 활성 에너지선량은, 5~2000mJ/cm2의 범위내인 것이 바람직하고, 더 나아가서는 공정상 관리하기 쉬운 점에서, 50~1000mJ/cm2의 범위내인 것이 바람직하다.The active energy dose to be irradiated is preferably within the range of 5 to 2000 mJ / cm 2 , and more preferably within the range of 50 to 1000 mJ / cm 2 from the viewpoint of easy management in the process.

이들 활성 에너지선 조사에, 적외선, 원적외선, 열풍, 고주파가열 등에 의한 열처리를 병용할 수 있다.
These active energy rays can be used in combination with heat treatment by infrared rays, far-infrared rays, hot winds, high frequency heating or the like.

경화막은, 기재에 금속산화물 조성물을 도공하고, 자연 또는 강제건조시킨 후에 경화처리를 행하여 형성할 수도 있고, 도공하여 경화처리를 행한 후에 자연 또는 강제건조시킬 수도 있으나, 자연 또는 강제건조시킨 후에 경화처리를 행하는 편이 보다 바람직하다.The cured film may be formed by coating a substrate with a metal oxide composition and then performing a hardening treatment after natural or forced drying or may be natural or forced drying after coating and hardening, Is more preferable.

특히, 전자선으로 경화시키는 경우에는, 물에 의한 경화저해 또는 유기용제의 잔류에 의한 도막의 강도저하를 방지하기 위하여, 자연 또는 강제건조시킨 후에 경화처리를 행하는 편이 보다 바람직하다.Particularly, in the case of curing with an electron beam, it is more preferable to carry out curing treatment after natural or forced drying in order to prevent hardening by water or decrease of strength of the coating film due to residual organic solvent.

경화처리의 타이밍은, 도공과 동시여도 되고, 도공 후여도 된다.
The timing of the curing treatment may be simultaneous with the coating or after the coating.

얻어지는 경화막은, 하드코트성, 투명성, 고굴절률성이 우수하므로, 광학재료로서 호적하게 이용할 수 있다. 따라서, 경화막은, 적층체로서, 음극선관, 플랫디스플레이패널(액정디스플레이, 플라즈마디스플레이, 일렉트로크로믹디스플레이, 발광다이오드디스플레이 등) 등의 각종 표시장치의 전면판 혹은 이들 입력장치로도 이용할 수 있다.The cured film obtained is excellent in hard coat property, transparency and high refractive index, and thus can be suitably used as an optical material. Therefore, the cured film can also be used as a front panel of various display devices such as a cathode ray tube, a flat display panel (liquid crystal display, plasma display, electrochromic display, light emitting diode display, etc.) or these input devices as a laminate.

그 외에, 이 경화막은, 광학용 렌즈, 안경용 렌즈, 광기록디스크(컴팩트디스크, DVD디스크, 블루레이디스크 등), 라이트케이스 등에 널리 이용할 수 있다.In addition, the cured film can be widely used for an optical lens, a lens for a spectacle lens, an optical recording disk (compact disk, DVD disk, Blu-ray disk, etc.), a light case and the like.

경화막의 표면저항값은, 1×1012Ω/□ 이하인 것이 바람직하다.The surface resistance value of the cured film is preferably 1 x 10 12 ? /? Or less.

경화막의 두께는, 0.03μm 이상이 바람직하고, 0.1~30μm인 것이 보다 바람직하고, 20μm 이하가 더욱 바람직하다.The thickness of the cured film is preferably 0.03 m or more, more preferably 0.1 to 30 m, and further preferably 20 m or less.

나아가, 경화막의 굴절률은, 1.4~2.0의 범위인 것이 바람직하고, 1.5~1.9의 범위인 것이 보다 바람직하다.
Furthermore, the refractive index of the cured film is preferably in the range of 1.4 to 2.0, and more preferably in the range of 1.5 to 1.9.

본 발명의 경화막이 부착된 부재는, 경화막과 기재를 포함하는 것이다. 기재로는, 상기 예시의 것을 임의로 사용할 수 있고, 특히, 플라스틱기재인 것이 바람직하다. 기재의 형상은, 필름형상, 렌즈형상, 또는 디스크형상인 것이 바람직하다.The member to which the cured film of the present invention is attached includes a cured film and a substrate. As the substrate, any of the above examples may be used, and in particular, a plastic substrate is preferred. The shape of the substrate is preferably a film shape, a lens shape, or a disk shape.

이 경화막이 부착된 부재는, 이들에 더하여, 굴절률이 상이한 막, 점착층 또는 정보기록층 등을 1층 이상 포함하는 것이 바람직하다.
It is preferable that the member to which the cured film is attached includes at least one film having a different refractive index, a pressure-sensitive adhesive layer, or an information recording layer.

경화막이 부착된 부재는, 예를 들어, 하기 (I)~(IX) 등의 층구성으로 할 수 있다.The member to which the cured film is attached may have a layer structure such as the following (I) to (IX).

(I) 기재/(M)/경화막(I) substrate / (M) / curing membrane

(II) 기재/경화막/(M)(II) substrate / cured film / (M)

(III) 기재/(M)/경화막/(M)(III) substrate / (M) / cured film / (M)

(IV) (M)/기재/경화막(IV) (M) / substrate / curing membrane

(V) (M)/기재/(M)/경화막(V) (M) / base material / (M) / curing film

(VI) (M)/기재/경화막/(M)(VI) (M) / substrate / cured film / (M)

(VII) (M)/기재/(M)/경화막/(M)(VII) (M) / base material / (M) / cured film / (M)

(VIII) (M)/경화막/기재/경화막(VIII) (M) / cured film / substrate / cured film

(IX) 경화막/(M)/기재/경화막(IX) cured film / (M) / substrate / cured film

단, (M)은 굴절률이 상이한 막, 점착층, 또는 정보기록층 중 어느 1층 또는 2층 이상, 바람직하게는 어느 1층을 포함한다.
Note that (M) includes any one or two or more layers, preferably any one layer, of a film having a different refractive index, a pressure-sensitive adhesive layer, or an information recording layer.

굴절률이 상이한 막 또는 정보기록층은, 본 발명의 경화물이 갖는 기능 이외의 기능을 갖는 것이다. 그 형성방법은 특별히 한정되지 않고, 공지의 방법으로 형성된다. 예를 들어 증착, 스퍼터 등의 드라이코팅법, 로드(ロッド), 와이어바를 이용한 방법이나, 마이크로그라비아, 그라비아, 다이, 커튼, 립, 슬롯, 스핀 등의 웨트코팅방법을 이용할 수 있다. 이용하는 재료도 한정은 없고, 필요에 따라, 정보기록기능, 방현기능, 뉴튼링방지기능, 점착기능, 특정파장의 차단, 밀착향상, 색조보정 등의 기능의 1종류 이상을 적층체에 부여할 수 있는 임의의 재료를 이용할 수 있다.
The film or information recording layer having a different refractive index has a function other than that of the cured product of the present invention. The forming method is not particularly limited and is formed by a known method. Wet coating methods such as a dry coating method such as vapor deposition and sputtering, a method using a rod or a wire bar, and a wet coating method such as a micro gravure, a gravure, a die, a curtain, a lip, a slot and a spin can be used. The material to be used is not limited, and if necessary, one or more kinds of functions such as information recording function, antiglare function, Newton ring function, adhesive function, blocking of specific wavelength, adhesion improvement, Can be used.

정보기록층으로는, 레이저광 등에 의해 어떠한 화학적 변화를 발생시키고, 그 변화에 의해 정보를 기록하는 것이면 되고, 재료는 특별히 한정되지 않는다. 예를 들어 유기계의 재료로는, 폴리메틴색소, 나프탈로시아닌계, 프탈로시아닌계, 스쿠아릴륨계, 안트라퀴논계, 크산텐계, 트리페닐메탄계 금속착체 화합물을 들 수 있고, 상기의 염료를 1종 또는 2종 이상의 조합으로 이용할 수 있다. 무기계의 기록층으로는, Te, Ge, Se, In, Sb, Sn, Zn, Au, Al, Cu, Pt 등의 금속, 반금속을 1종 또는 2종 이상의 조합으로 이용할 수 있다. 정보기록층은 적층체 등이어도 되고, 광화학변화의 태양은 상변화, 버블, 구멍이 뚫린 타입 중 어느 것이어도 된다. 나아가 Fe, Tb, Co를 주체로 한 광자기 기록층일 수도 있고, 스피로피란, 풀기드(フルギド)계의 포토크로믹재료일 수도 있다.
The information recording layer is not particularly limited as long as it can generate any chemical change by laser light or the like and record information by the change. Examples of organic materials include polymethine dyes, naphthalocyanine dyes, phthalocyanine dyes, squarylium dyes, anthraquinone dyes, xanthenes dyes, and triphenylmethane dyes. Two or more kinds of them can be used in combination. As the inorganic recording layer, metals such as Te, Ge, Se, In, Sb, Sn, Zn, Au, Al, Cu and Pt and semimetals may be used singly or in combination. The information recording layer may be a laminate or the like, and the mode of photochemical change may be any of a phase change, a bubble, and a hole type. Further, it may be a magneto-optical recording layer mainly composed of Fe, Tb and Co, or a photochromic material based on spiropyran or a free-radical.

고굴절률의 경화막은, 반사방지의 관점에서, 표층에 저굴절률의 피복경화막을 마련하고, 반사방지기능을 부여한 경화막이 부착된 부재로서 이용하는 것도 바람직하다. 즉, 필름 등의 기재 상에 경화막을 형성하고, 추가로 그 표층에, 바람직하게는 피복경화막을 형성하여 얻어지는 경화막이 부착된 부재를, 반사방지막으로서 이용하는 것이 바람직하다.From the viewpoint of preventing reflection, it is also preferable that a cured film of high refractive index is used as a member provided with a cured film having a low refractive index and provided with an antireflection function. That is, it is preferable to use a member having a cured film formed by forming a cured film on a substrate such as a film and further forming a coated cured film on the surface layer, as the antireflection film.

반사간섭호가 문제가 되는 경화막이 부착된 부재에 있어서는, 본 발명의 금속산화물 조성물 중의 금속산화물의 배합량을 조정하고, 그의 경화막과 기재의 굴절률의 차가, 또는, 경화막과 기재의 사이에 임의의 층이 존재하는 경우는 경화막과 경화막이 접하는 하층과의 굴절률의 차가, ±0.02 이내가 되도록 하는 것이 바람직하다.
It is preferable that the amount of the metal oxide in the metal oxide composition of the present invention is adjusted so that the difference in refractive index between the cured film and the substrate or between the cured film and the substrate It is preferable that the refractive index difference between the cured film and the lower layer in contact with the cured film is within ± 0.02.

본 발명의 금속산화물 조성물은, 금속산화물의 종류나 첨가량을 제어함으로써, 고굴절률의 경화물인 경화막을 제조하는 것이 가능하다. 이에 따라, 광반도체소자의 광취출효율을 향상시키기 위하여, 경화막의 굴절률을 광반도체소자측으로부터 최외층을 향하여 순차 작게 하는 것이 요구되는 광반도체소자 봉지재로서, 바람직하게 이용할 수 있다.The metal oxide composition of the present invention can produce a cured film as a cured product of high refractive index by controlling the kind and amount of the metal oxide to be added. As a result, it is preferable to use the optical semiconductor element encapsulant which is required to gradually decrease the refractive index of the cured film from the optical semiconductor element side toward the outermost layer in order to improve the light extraction efficiency of the optical semiconductor element.

광반도체소자로는, 질화갈륨(GaN: 굴절률 2.5), 갈륨인(GaP: 굴절률 2.9), 갈륨비소(GaAs: 굴절률 3.5) 등을 들 수 있고, 매우 굴절률이 높은 소재이다. 이에 따라, 광반도체소자 봉지재가 되는 경화물의 굴절률은, 광취출효율을 높이는 관점에서, 1.5 이상인 것이 바람직하고, 보다 바람직하게는 1.5~2.1, 더욱 바람직하게는 1.7~2.1이다.
Examples of the optical semiconductor element include gallium nitride (GaN: refractive index 2.5), gallium phosphor (GaP: refractive index 2.9), gallium arsenide (GaAs: refractive index 3.5) Accordingly, the refractive index of the cured product that becomes the optical semiconductor element encapsulant is preferably 1.5 or more, more preferably 1.5 to 2.1, and further preferably 1.7 to 2.1, from the viewpoint of increasing the light extraction efficiency.

경화물의 최적의 굴절률을 달성하는 방법으로는, 금속산화물로서 산화티탄(굴절률 2.5~2.7), 산화지르코늄(굴절률 2.4), 산화아연(굴절률 1.95) 등을 사용하는 것이 바람직하다. 또한, 분산제에도 고굴절률성이 요구되는 점에서, 방향족 골격을 가진 화합물(A)을 사용하는 것이 바람직하다.
As a method for achieving the optimum refractive index of the cured product, it is preferable to use titanium oxide (refractive index: 2.5 to 2.7), zirconium oxide (refractive index: 2.4), zinc oxide (refractive index: 1.95) Further, it is preferable to use the compound (A) having an aromatic skeleton because a high refractive index is required for the dispersing agent.

본 발명은 이하의 사항에 관한 것이기도 하다.The present invention also relates to the following matters.

〔1〕 아크릴로일기를 6개 이상 갖는 화합물(A)과, 금속산화물(B)과, 용제를 함유하고,[1] A photosensitive resin composition comprising a compound (A) having at least 6 acryloyl groups, a metal oxide (B)

상기 화합물(A)이,The compound (A)

펜타에리스리톨트리아크릴레이트 및 디펜타에리스리톨펜타아크릴레이트로부터 선택되는 1종 또는 2종의 화합물(x2), 그리고, 1,2,4,5-벤젠테트라카르본산이무수물, 3,3',4,4'-비페닐테트라카르본산이무수물, 9,9-비스(3,4-디카르복시페닐)플루오렌이산무수물, 및, 1,2,3,4-부탄테트라카르본산이무수물로부터 선택되는 화합물(x1)을 반응시켜 이루어지는, 카르복실기를 갖는 화합물(X)과,Pentaerythritol triacrylate and dipentaerythritol pentaacrylate, and at least one compound selected from the group consisting of 1,2,4,5-benzene tetracarboxylic acid dianhydride, 3,3 ', 4,4'- Biphenyltetracarboxylic acid dianhydride, 4'-biphenyltetracarboxylic acid dianhydride, 9,9-bis (3,4-dicarboxyphenyl) fluorene dianhydride, and 1,2,3,4- (X) having a carboxyl group, which is obtained by reacting a compound (X1)

비페닐글리시딜에테르Biphenyl glycidyl ether

를 반응시켜 이루어지는 화합물을 포함하는, 금속산화물 조성물.And reacting the metal oxide with the metal oxide.

〔2〕 아크릴로일기를 6개 이상 갖는 화합물(A)과, 금속산화물(B)과, 용제를 함유하고,[2] A photosensitive composition comprising a compound (A) having at least 6 acryloyl groups, a metal oxide (B) and a solvent,

상기 화합물(A)이, 하기 일반식(1)로 표시되는 아크릴로일기를 6개 이상 갖는 화합물(A1)을 포함하는, 금속산화물 조성물.Wherein the compound (A) comprises a compound (A1) having at least 6 acryloyl groups represented by the following general formula (1).

일반식(1)In general formula (1)

[화학식 1][Chemical Formula 1]

Figure pat00011
Figure pat00011

(일반식(1) 중, R1은, 하기 어느 하나의 4가의 유기잔기를 나타낸다.(In the general formula (1), R 1 represents any one of the tetravalent organic moieties shown below.

[화학식 2](2)

Figure pat00012
Figure pat00012

일반식(1) 중, R2은, 하기 어느 하나의 1가의 유기잔기를 나타낸다.In the general formula (1), R 2 represents any one of the following monovalent organic residues.

[화학식 3](3)

Figure pat00013
Figure pat00013

일반식(1) 중, R3은, 하기의 1가의 유기잔기를 나타낸다.)In the general formula (1), R 3 represents the following monovalent organic residue.)

[화학식 4][Chemical Formula 4]

Figure pat00014
Figure pat00014

〔3〕 R1이, 방향환을 포함하는 유기잔기인, 상기 〔1〕 또는 〔2〕에 기재된 금속산화물 조성물.[3] The metal oxide composition according to [1] or [2], wherein R 1 is an organic residue containing an aromatic ring.

〔4〕 방향환이, 비페닐환인, 상기 〔3〕에 기재된 금속산화물 조성물.[4] The metal oxide composition according to [3], wherein the aromatic ring is a biphenyl ring.

〔5〕 금속산화물(B)이, 티타늄, 아연, 지르코늄, 인듐, 주석, 알루미늄, 규소 및 인으로 이루어진 군으로부터 선택되는 적어도 1종의 원소를 함유하는, 상기 〔1〕~〔4〕 중 어느 하나에 기재된 금속산화물 조성물.[5] The method according to any one of [1] to [4], wherein the metal oxide (B) contains at least one element selected from the group consisting of titanium, zinc, zirconium, indium, tin, aluminum, 0.0 > 1, < / RTI >

〔6〕 금속산화물(B)의 D50입자경이, 0.005~0.200μm인, 상기 〔1〕~〔5〕 중 어느 하나에 기재된 금속산화물 조성물.[6] The metal oxide composition according to any one of [1] to [5], wherein the D50 particle size of the metal oxide (B) is 0.005 to 0.200 μm.

〔7〕 상기 〔1〕~〔6〕 중 어느 하나에 기재된 금속산화물 조성물을 경화시켜 이루어진 경화막.[7] A cured film obtained by curing the metal oxide composition according to any one of [1] to [6].

〔8〕 기재의 적어도 일부에, 상기 〔7〕에 기재된 경화막이 마련되어 이루어진, 경화막이 부착된 부재.
[8] A member to which a cured film is attached, wherein the cured film described in [7] is provided on at least a part of the base.

본 발명은, 2015년 5월 18일 출원된 일본특허출원번호 2015-100973호의 주제에 관련한 것으로, 그 전체 개시내용을 참조에 의해 본 명세서에 편입한다.
The present invention relates to the subject matter of Japanese Patent Application No. 2015-100973, filed on May 18, 2015, the entire disclosure of which is incorporated herein by reference.

[실시예]
[Example]

이하, 제조예, 실시예에 기초하여 본 발명을 더욱 상세히 설명한다. 제조예, 실시예 중, 부 및 %는, 질량부 및 질량%를 각각 나타낸다.Hereinafter, the present invention will be described in more detail based on Preparation Examples and Examples. In Production Examples and Examples, "parts" and "%" represent "mass parts" and "mass%", respectively.

사용한 약품은, 이하와 같다.The drugs used are as follows.

<카르본산무수물>&Lt; Carboxylic anhydride >

3,3',4,4'-비페닐테트라카르본산이무수물(Mitsubishi Chemical Corporation제, 상품명: BPDA)3,3 ', 4,4'-biphenyltetracarboxylic acid dianhydride (manufactured by Mitsubishi Chemical Corporation, trade name: BPDA)

9,9-비스(3,4-디카르복시페닐)플루오렌이산무수물(JFE Chemical Corporation제, 상품명: BPAF)(3,4-dicarboxyphenyl) fluorene dianhydride (manufactured by JFE Chemical Corporation, trade name: BPAF)

1,2,3,4-부탄테트라카르본산이무수물(New Japan Chemical Co., Ltd.제, 상품명: RIKACID BT-100)1,2,3,4-butanetetracarboxylic acid anhydride (manufactured by New Japan Chemical Co., Ltd., trade name: RIKACID BT-100)

1,2,4,5-벤젠테트라카르본산이무수물(Daicel Corporation제, 상품명: 피로멜리트산이무수물, PMDA)1,2,4,5-benzenetetracarboxylic acid dianhydride (manufactured by Daicel Corporation, trade name: pyromellitic dianhydride, PMDA)

무수프탈산(Wako Pure Chemical Industries, Ltd.제)Phthalic anhydride (manufactured by Wako Pure Chemical Industries, Ltd.)

<화합물(x2)>&Lt; Compound (x2) >

펜타에리스리톨트리아크릴레이트(1)(Nippon Kayaku Co.,Ltd.제, 상품명: KAYARAD PET-30, 부생성물로서 펜타에리스리톨테트라아크릴레이트도 포함함)Pentaerythritol triacrylate (1) (trade name: KAYARAD PET-30 manufactured by Nippon Kayaku Co., Ltd., pentaerythritol tetraacrylate as a by-product)

펜타에리스리톨트리아크릴레이트(2)(Shin-Nakamura Chemical Co.,Ltd.제, 상품명: A-TMM-3LM-N(트리에스테르 57%), 부생성물로서 펜타에리스리톨테트라아크릴레이트도 포함함)Pentaerythritol triacrylate (2) (trade name: A-TMM-3LM-N (trisester 57%) manufactured by Shin-Nakamura Chemical Co., Ltd., and pentaerythritol tetraacrylate as a by-

디펜타에리스리톨펜타아크릴레이트(DPPA)(Shin-Nakamura Chemical Co.,Ltd.제, 상품명: A-9570W, 부생성물로서 디펜타에리스리톨헥사아크릴레이트도 포함함)Dipentaerythritol pentaacrylate (DPPA) (trade name: A-9570W, manufactured by Shin-Nakamura Chemical Co., Ltd., dipentaerythritol hexaacrylate as a by-product)

<아크릴레이트 화합물><Acrylate Compound>

2-하이드록시에틸아크릴레이트(Nippon Shokubai Co., Ltd.제, HEA)2-hydroxyethyl acrylate (manufactured by Nippon Shokubai Co., Ltd., HEA)

<중합금지제><Polymerization inhibitor>

메틸하이드로퀴논(Wako Pure Chemical Industries, Ltd.제)Methyl hydroquinone (manufactured by Wako Pure Chemical Industries, Ltd.)

<촉매><Catalyst>

1,8-디아자비시클로[5.4.0]-7-운데센(Tokyo Chemical Industry Co., Ltd.제)1,8-diazabicyclo [5.4.0] -7-undecene (manufactured by Tokyo Chemical Industry Co., Ltd.)

디메틸벤질아민(Wako Pure Chemical Industries, Ltd.제)Dimethylbenzylamine (manufactured by Wako Pure Chemical Industries, Ltd.)

<에폭시기함화합물>&Lt; Epoxy flame retardant compound &

글리시딜메타크릴레이트(메타크릴글리시딜에테르)(The Dow Chemical Company제, GMA)Glycidyl methacrylate (methacryloglycidyl ether) (GMA manufactured by The Dow Chemical Company)

4-하이드록시부틸아크릴레이트글리시딜에테르(Nippon Kasei Chemical Co.,Ltd제, 상품명: 4하이드록시부틸아크릴레이트글리시딜에테르)4-hydroxybutyl acrylate glycidyl ether (manufactured by Nippon Kasei Chemical Co., Ltd., trade name: 4 hydroxybutyl acrylate glycidyl ether)

비페닐글리시딜에테르(2-페닐페닐글리시딜에테르)(Sanko Co.,Ltd.제, 상품명: OPP―G)
Biphenyl glycidyl ether (2-phenylphenyl glycidyl ether) (trade name: OPP-G, manufactured by Sanko Co., Ltd.)

(제조예)(Production example)

(합성예 1: 분산제(1))(Synthesis Example 1: Dispersant (1))

교반기, 환류냉각관, 드라이에어도입관, 온도계를 구비한 4구 플라스크에 3,3',4,4'-비페닐테트라카르본산이무수물 80.0부, 수산기가 122mgKOH/g의 펜타에리스리톨트리아크릴레이트(1) 250.0부, 메틸하이드로퀴논 0.24부, 시클로헥사논 217.8부를 투입하고, 60℃까지 승온하였다. 이어서 촉매로서 1,8-디아자비시클로[5.4.0]-7-운데센 1.65부를 첨가하고, 90℃에서 8시간 교반하였다. 반응물의 IR측정으로 산무수물기의 피크, 즉, 1780cm-1 및 1850cm-1 부근의 피크가 삭감되어 있는 것을 확인한 후, 냉각하고, 반응을 정지시켰다. 이 시점에서 반응물의 산가를 관용의 방법인 JIS K0070(1992년)에 의한 적정법에 따라 측정한 결과, 94mgKOH/g였다.A four-necked flask equipped with a stirrer, a reflux condenser, a dry air introducing tube and a thermometer was charged with 80.0 parts of 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride and 122.0 parts by weight of pentaerythritol triacrylate having a hydroxyl value of 122 mgKOH / g 250.0 parts of the compound (1), 0.24 parts of methylhydroquinone and 217.8 parts of cyclohexanone, and the mixture was heated to 60 占 폚. Subsequently, 1.65 parts of 1,8-diazabicyclo [5.4.0] -7-undecene was added as a catalyst, followed by stirring at 90 占 폚 for 8 hours. After confirming that the peak of the acid anhydride group, that is, the peak near 1780 cm -1 and 1850 cm -1 , was cut by the IR measurement of the reactant, the reaction was stopped by cooling. At this point, the acid value of the reactant was measured according to the titration method according to JIS K0070 (1992), which is a generic method, and found to be 94 mgKOH / g.

계속해서, 이 용액 중에 비페닐글리시딜에테르 140.0부, 시클로헥사논 91.0부를 첨가하고, 이어서 촉매로서 디메틸벤질아민 2.65부를 첨가하고, 100℃에서 6시간 교반하여, 반응시켰다. 반응을 계속하면서 정기적으로 반응물의 산가를 측정하여, 산가가 5.0mgKOH/g 이하가 되었을 때, 실온까지 냉각하여 반응을 정지시켰다. 얻어진 수지바니시는 담황색 투명하고, 고형분 60%, 또한 최종적인 산가는 3.0mgKOH/g인 것으로부터, 얻어진 수지바니시의 반응물 고형분 중의 화합물(A)을 포함하는 반응물은 79%이다.Subsequently, 140.0 parts of biphenyl glycidyl ether and 91.0 parts of cyclohexanone were added to this solution. Then, 2.65 parts of dimethylbenzylamine was added as a catalyst, and the mixture was reacted at 100 DEG C for 6 hours with stirring. The acid value of the reaction product was periodically measured while continuing the reaction. When the acid value became 5.0 mgKOH / g or less, the reaction was stopped by cooling to room temperature. The obtained resin varnish is light yellow transparent, has a solid content of 60%, and a final acid value of 3.0 mgKOH / g. Therefore, the reactant including the compound (A) in the solid content of the resin varnish obtained is 79%.

또한, 본 명세서에서, 화합물(A)을 포함하는 반응물이란, 상기 서술한 화합물(A1) 외에, 화합물(x2)에 있어서 수산기를 복수 포함하는 부생성물에서 유래하는 고분자량 반응물을 포함하는 반응물을 나타낸다. 화합물(A)을 포함하는 반응물의 비율은, 상기와 같이, 수지바니시의 최종 산가로부터 산출할 수 있다. 나머지는, 반응에 이용한 화합물(x2)에 있어서 수산기를 갖지 않는 화합물이나 미반응원료를 나타낸다. 표 1 중에서는 화합물(A)을 포함하는 반응물을 「반응물」이라 약기하였다. 이하의 합성예 2~5에 있어서도 동일하다.
In the present specification, the reactant containing the compound (A) refers to a reactant containing a high molecular weight reactant derived from a by-product containing a plurality of hydroxyl groups in the compound (x2) in addition to the above-mentioned compound (A1) . The proportion of the reactants containing the compound (A) can be calculated from the final acid value of the resin varnish as described above. The remainder represents a compound having no hydroxyl group or an unreacted raw material in the compound (x2) used in the reaction. In Table 1, the reactant containing the compound (A) is abbreviated as &quot; reactant &quot;. The same applies to the following Synthesis Examples 2 to 5.

(합성예 2: 분산제(2))(Synthesis Example 2: Dispersant (2))

교반기, 환류냉각관, 드라이에어도입관, 온도계를 구비한 4구 플라스크에 1,2,3,4-부탄테트라카르본산이무수물 80.0부, 수산기가 113mgKOH/g의 펜타에리스리톨트리아크릴레이트(2) 402.0부, 메틸하이드로퀴논 0.33부, 시클로헥사논 318.0부를 투입하고, 60℃까지 승온하였다. 이어서 촉매로서 1,8-디아자비시클로[5.4.0]-7-운데센 2.41부를 첨가하고, 90℃에서 8시간 교반하였다. 반응물의 IR측정으로 산무수물기의 피크, 즉, 1780cm-1 및 1850cm-1 부근의 피크가 삭감되어 있는 것을 확인한 후, 냉각하고, 반응을 정지시켰다. 이 시점에서 반응물의 산가를 관용의 방법으로 측정한 결과, 95mgKOH/g였다.To a four-necked flask equipped with a stirrer, a reflux condenser, a dry air introducing tube, and a thermometer was charged 80.0 parts of 1,2,3,4-butanetetracarboxylic dianhydride and 100.0 parts by weight of pentaerythritol triacrylate (2) having a hydroxyl value of 113 mgKOH / , 0.33 part of methylhydroquinone and 318.0 parts of cyclohexanone were charged and the temperature was raised to 60 占 폚. Then 2.41 parts of 1,8-diazabicyclo [5.4.0] -7-undecene was added as a catalyst, and the mixture was stirred at 90 占 폚 for 8 hours. After confirming that the peak of the acid anhydride group, that is, the peak near 1780 cm -1 and 1850 cm -1 , was cut by the IR measurement of the reactant, the reaction was stopped by cooling. At this point, the acid value of the reactant was measured by a conventional method and found to be 95 mgKOH / g.

계속해서, 이 용액 중에, 비페닐글리시딜에테르 182.9부, 시클로헥사논 118.0부를 첨가하고, 이어서 촉매로서, 디메틸벤질아민 3.88부를 첨가하고, 100℃에서 6시간 교반하였다. 반응을 계속하면서 정기적으로 반응물의 산가를 측정하여, 산가가 5.0mgKOH/g 이하가 되었을 때, 실온까지 냉각하여 반응을 정지시켰다. 얻어진 수지바니시는 담황색 투명하고, 고형분 60%, 최종적인 산가는 3.0mgKOH/g인 것으로부터, 얻어진 반응물 고형분 중의 화합물(A)을 포함하는 반응물은 73%이다.
Then, 182.9 parts of biphenyl glycidyl ether and 118.0 parts of cyclohexanone were added to this solution. Then, 3.88 parts of dimethylbenzylamine was added as a catalyst, and the mixture was stirred at 100 占 폚 for 6 hours. The acid value of the reaction product was periodically measured while continuing the reaction. When the acid value became 5.0 mgKOH / g or less, the reaction was stopped by cooling to room temperature. The resulting resin varnish was light yellow transparent, and had a solid content of 60% and a final acid value of 3.0 mgKOH / g. Therefore, the reactant containing the compound (A) in the resulting solid of reaction product was 73%.

(합성예 3: 분산제(3))(Synthesis Example 3: Dispersant (3))

교반기, 환류냉각관, 드라이에어도입관, 온도계를 구비한 4구 플라스크에 1,2,4,5-벤젠테트라카르본산이무수물 80.0부, 수산기가 113mgKOH/g의 펜타에리스리톨트리아크릴레이트(2) 364.9부, 메틸하이드로퀴논 0.31부, 시클로헥사논 294.1부를 투입하고, 60℃까지 승온하였다. 이어서 촉매로서 1,8-디아자비시클로[5.4.0]-7-운데센 2.22부를 첨가하고, 90℃에서 8시간 교반하였다. 반응물의 IR측정으로 산무수물기의 피크, 즉, 1780cm-1 및 1850cm-1 부근의 피크가 삭감되어 있는 것을 확인한 후, 냉각하고, 반응을 정지시켰다. 이 시점에서 반응물의 산가를 관용의 방법으로 측정한 결과, 93mgKOH/g였다.In a four-necked flask equipped with a stirrer, a reflux condenser, a dry air introducing tube, and a thermometer, 80.0 parts of 1,2,4,5-benzene tetracarboxylic dianhydride and 100.0 parts by weight of pentaerythritol triacrylate (2) having a hydroxyl value of 113 mgKOH / , 0.31 part of methylhydroquinone and 294.1 parts of cyclohexanone were charged, and the temperature was raised to 60 占 폚. Then, 2.22 parts of 1,8-diazabicyclo [5.4.0] -7-undecene was added as a catalyst, and the mixture was stirred at 90 占 폚 for 8 hours. After confirming that the peak of the acid anhydride group, that is, the peak near 1780 cm -1 and 1850 cm -1 , was cut by the IR measurement of the reactant, the reaction was stopped by cooling. At this point, the acid value of the reactant was measured by a conventional method and found to be 93 mgKOH / g.

계속해서, 이 용액 중에, 비페닐글리시딜에테르 166.0부, 시클로헥사논 107.1부를 첨가하고, 이어서 촉매로서, 디메틸벤질아민 3.58부를 첨가하고, 100℃에서 6시간 교반하고, 반응을 계속하면서 정기적으로 반응물의 산가를 측정하여, 산가가 5.0mgKOH/g 이하가 되었을 때, 실온까지 냉각하여 반응을 정지시켰다. 얻어진 수지바니시는 담황색 투명하고, 고형분 60%, 최종적인 산가는 3.0mgKOH/g인 것으로부터, 얻어진 반응물 고형분 중의 화합물(A)을 포함하는 반응물은 74%이다.
Subsequently, 166.0 parts of biphenyl glycidyl ether and 107.1 parts of cyclohexanone were added to this solution, followed by addition of 3.58 parts of dimethylbenzylamine as a catalyst. The mixture was stirred at 100 DEG C for 6 hours, and the reaction was carried out periodically The acid value of the reaction product was measured. When the acid value became 5.0 mgKOH / g or less, the reaction was stopped by cooling to room temperature. The resulting resin varnish was light yellow transparent, having a solid content of 60% and a final acid value of 3.0 mgKOH / g, and thus the reactant containing the compound (A) in the solid content of the obtained reaction product was 74%.

(합성예 4: 분산제(4))(Synthesis Example 4: Dispersant (4))

교반기, 환류냉각관, 드라이에어도입관, 온도계를 구비한 4구 플라스크에 3,3',4,4'-비페닐테트라카르본산이무수물 80.0부, 수산기가 85mgKOH/g의 디펜타에리스리톨펜타아크릴레이트 359.0부, 메틸하이드로퀴논 0.29부, 시클로헥사논 290.1부를 투입하고, 60℃까지 승온하였다. 이어서 촉매로서 1,8-디아자비시클로[5.4.0]-7-운데센 2.19부를 첨가하고, 90℃에서 8시간 교반하였다. 반응물의 IR측정으로 산무수물기의 피크, 즉, 1780cm-1 및 1850cm-1 부근의 피크가 삭감되어 있는 것을 확인한 후, 냉각하고, 반응을 정지시켰다. 이 시점에서 반응물의 산가를 관용의 방법으로 측정한 결과, 74mgKOH/g였다. 그 후, 비페닐글리시딜에테르 123.1부, 시클로헥사논 78.5부를 첨가하고, 이어서 촉매로서, 디메틸벤질아민 3.53부를 첨가하고, 100℃에서 6시간 교반하고, 반응을 계속하면서 정기적으로 반응물의 산가를 측정하여, 산가가 5.0mgKOH/g 이하가 되었을 때, 실온까지 냉각하여 반응을 정지시켰다. 얻어진 수지바니시는 담황색 투명하고, 고형분 60%, 최종적인 산가는 3.0mgKOH/g인 것으로부터, 얻어진 수지바니시의 고형분 중의 화합물(A)을 포함하는 반응물은 83%이다.
A four-necked flask equipped with a stirrer, a reflux condenser, a dry air introducing tube and a thermometer was charged with 80.0 parts of 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride and 85.0 parts of dipentaerythritol pentaacrylate having a hydroxyl value of 85 mgKOH / g 359.0 parts of methyl methacrylate, 0.29 parts of methylhydroquinone and 290.1 parts of cyclohexanone, and the temperature was raised to 60 占 폚. Then 2.19 parts of 1,8-diazabicyclo [5.4.0] -7-undecene was added as a catalyst, followed by stirring at 90 占 폚 for 8 hours. After confirming that the peak of the acid anhydride group, that is, the peak near 1780 cm -1 and 1850 cm -1 , was cut by the IR measurement of the reactant, the reaction was stopped by cooling. At this point, the acid value of the reactant was measured by a conventional method and found to be 74 mgKOH / g. Thereafter, 123.1 parts of biphenyl glycidyl ether and 78.5 parts of cyclohexanone were added. Then, 3.53 parts of dimethylbenzylamine was added as a catalyst, and the mixture was stirred at 100 ° C for 6 hours. While continuing the reaction, the acid value of the reaction product When the acid value became 5.0 mgKOH / g or less, the reaction was stopped by cooling to room temperature. The resultant resin varnish is light yellow transparent, has a solid content of 60% and a final acid value of 3.0 mgKOH / g. Therefore, the reactant containing the compound (A) in the solid content of the obtained resin varnish is 83%.

(합성예 5: 분산제(5))(Synthesis Example 5: Dispersant (5))

교반기, 환류냉각관, 드라이에어도입관, 온도계를 구비한 4구 플라스크에 9,9-비스(3,4-디카르복시페닐)플루오렌이산무수물 80.0부, 수산기가 122mgKOH/g의 펜타에리스리톨트리아크릴레이트(1) 160.2부, 메틸하이드로퀴논 0.16부, 시클로헥사논 158.8부를 투입하고, 60℃까지 승온하였다. 이어서 촉매로서 1,8-디아자비시클로[5.4.0]-7-운데센 1.20부를 첨가하고, 90℃에서 8시간 교반하였다. 반응물의 IR측정으로 산무수물기의 피크, 즉, 1780cm-1 및 1850cm-1 부근의 피크가 삭감되어 있는 것을 확인한 후, 냉각하고, 반응을 정지시켰다. 이 시점에서 반응물의 산가를 관용의 방법으로 측정한 결과, 82mgKOH/g였다.A four-necked flask equipped with a stirrer, a reflux condenser, a dry air introducing tube and a thermometer was charged with 80.0 parts of 9,9-bis (3,4-dicarboxyphenyl) fluorene dianhydride and 95.0 parts of pentaerythritol triacrylate having a hydroxyl value of 122 mgKOH / g 160.2 parts of RATE (1), 0.16 parts of methylhydroquinone and 158.8 parts of cyclohexanone, and the temperature was raised to 60 占 폚. Then 1.20 parts of 1,8-diazabicyclo [5.4.0] -7-undecene was added as a catalyst, followed by stirring at 90 占 폚 for 8 hours. After confirming that the peak of the acid anhydride group, that is, the peak near 1780 cm -1 and 1850 cm -1 , was cut by the IR measurement of the reactant, the reaction was stopped by cooling. At this point, the acid value of the reactant was determined by a conventional method and found to be 82 mgKOH / g.

그 후, 비페닐글리시딜에테르 79.0부, 시클로헥사논 50.7부를 첨가하고, 이어서 촉매로서, 디메틸벤질아민 1.93부를 첨가하고, 100℃에서 6시간 교반하고, 반응을 계속하면서 정기적으로 반응물의 산가를 측정하여, 산가가 5.0mgKOH/g 이하가 되었을 때, 실온까지 냉각하여 반응을 정지시켰다. 얻어진 수지바니시는 담황색 투명하고, 고형분 60%, 최종적인 산가는 3.0mgKOH/g인 것으로부터, 얻어진 수지바니시의 고형분 중의 화합물(A)을 포함하는 반응물은 79%이다.
Thereafter, 79.0 parts of biphenyl glycidyl ether and 50.7 parts of cyclohexanone were added. Then, 1.93 parts of dimethylbenzylamine was added as a catalyst, and the mixture was stirred at 100 ° C for 6 hours. While continuing the reaction, the acid value of the reaction product When the acid value became 5.0 mgKOH / g or less, the reaction was stopped by cooling to room temperature. The obtained resin varnish is light yellow transparent, has a solid content of 60%, and a final acid value of 3.0 mgKOH / g. Therefore, the reactant containing the compound (A) in the solid content of the resin varnish obtained is 79%.

(합성예 6: 분산제(6))(Synthesis Example 6: Dispersant (6))

교반기, 환류냉각관, 드라이에어도입관, 온도계를 구비한 4구 플라스크에 3,3',4,4'-비페닐테트라카르본산이무수물 80.0부, 수산기가 122mgKOH/g의 펜타에리스리톨트리아크릴레이트(1) 250.0부, 메틸하이드로퀴논 0.24부, 시클로헥사논 217.8부를 투입하고, 60℃까지 승온하였다. 이어서 촉매로서 1,8-디아자비시클로[5.4.0]-7-운데센 1.65부를 첨가하고, 90℃에서 8시간 교반하였다. 반응물의 IR측정으로 산무수물기의 피크, 즉, 1780cm-1 및 1850cm-1 부근의 피크가 삭감되어 있는 것을 확인한 후, 냉각하고, 반응을 정지시켰다. 이 시점에서 반응물의 산가를 관용의 방법으로 측정한 결과, 94mgKOH/g였다.A four-necked flask equipped with a stirrer, a reflux condenser, a dry air introducing tube and a thermometer was charged with 80.0 parts of 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride and 122.0 parts by weight of pentaerythritol triacrylate having a hydroxyl value of 122 mgKOH / g 250.0 parts of the compound (1), 0.24 parts of methylhydroquinone and 217.8 parts of cyclohexanone, and the mixture was heated to 60 占 폚. Subsequently, 1.65 parts of 1,8-diazabicyclo [5.4.0] -7-undecene was added as a catalyst, followed by stirring at 90 占 폚 for 8 hours. After confirming that the peak of the acid anhydride group, that is, the peak near 1780 cm -1 and 1850 cm -1 , was cut by the IR measurement of the reactant, the reaction was stopped by cooling. At this point, the acid value of the reactant was measured by a conventional method and found to be 94 mgKOH / g.

그 후, 글리시딜메타크릴레이트 78.3부, 시클로헥사논 54.0부를 첨가하고, 이어서 촉매로서, 디메틸벤질아민 2.65부를 첨가하고, 100℃에서 6시간 교반하고, 반응을 계속하면서 정기적으로 반응물의 산가를 측정하여, 산가가 5.0mgKOH/g 이하가 되었을 때, 실온까지 냉각하여 반응을 정지시켰다. 얻어진 수지바니시는 담황색 투명하고, 고형분 60%, 최종적인 산가는 3.0mgKOH/g인 것으로부터, 얻어진 수지바니시의 고형분 중의 반응물은 76%이다. 또한, 반응물은 화합물(A)을 포함하지 않는다. 이하의 합성예 7~17에 있어서도 동일하다.
Thereafter, 78.3 parts of glycidyl methacrylate and 54.0 parts of cyclohexanone were added. Then, 2.65 parts of dimethylbenzylamine was added as a catalyst, and the mixture was stirred at 100 ° C for 6 hours. While continuing the reaction, the acid value of the reaction product When the acid value became 5.0 mgKOH / g or less, the reaction was stopped by cooling to room temperature. The obtained resin varnish was light yellow transparent, had a solid content of 60%, and a final acid value of 3.0 mgKOH / g, so that the reactivity in the solid content of the obtained resin varnish was 76%. In addition, the reactant does not contain the compound (A). The same is applied to the following Synthesis Examples 7 to 17.

(합성예 7: 분산제(7))(Synthesis Example 7: Dispersant (7))

교반기, 환류냉각관, 드라이에어도입관, 온도계를 구비한 4구 플라스크에 1,2,3,4-부탄테트라카르본산이무수물 80.0부, 수산기가 113mgKOH/g의 펜타에리스리톨트리아크릴레이트(2) 402.0부, 메틸하이드로퀴논 0.34부, 시클로헥사논 203.8부를 투입하고, 60℃까지 승온하였다. 이어서 촉매로서 1,8-디아자비시클로[5.4.0]-7-운데센 1.75부를 첨가하고, 90℃에서 8시간 교반하였다. 반응물의 IR측정으로 산무수물기의 피크, 즉, 1780cm-1 및 1850cm-1 부근의 피크가 삭감되어 있는 것을 확인한 후, 냉각하고, 반응을 정지시켰다. 이 시점에서 반응물의 산가를 관용의 방법으로 측정한 결과, 95mgKOH/g였다.To a four-necked flask equipped with a stirrer, a reflux condenser, a dry air introducing tube, and a thermometer was charged 80.0 parts of 1,2,3,4-butanetetracarboxylic dianhydride and 100.0 parts by weight of pentaerythritol triacrylate (2) having a hydroxyl value of 113 mgKOH / , 0.34 parts of methylhydroquinone and 203.8 parts of cyclohexanone, and the temperature was raised to 60 占 폚. Then 1.75 parts of 1,8-diazabicyclo [5.4.0] -7-undecene was added as a catalyst, followed by stirring at 90 占 폚 for 8 hours. After confirming that the peak of the acid anhydride group, that is, the peak near 1780 cm -1 and 1850 cm -1 , was cut by the IR measurement of the reactant, the reaction was stopped by cooling. At this point, the acid value of the reactant was measured by a conventional method and found to be 95 mgKOH / g.

그 후, 글리시딜메타크릴레이트 116.4부, 시클로헥사논 188.5부를 첨가하고, 이어서 촉매로서, 디메틸벤질아민 3.88부를 첨가하고, 100℃에서 6시간 교반하고, 반응을 계속하면서 정기적으로 반응물의 산가를 측정하여, 산가가 5.0mgKOH/g 이하가 되었을 때, 실온까지 냉각하여 반응을 정지시켰다. 얻어진 수지바니시는 담황색 투명하고, 고형분 60%, 최종적인 산가는 3.0mgKOH/g인 것으로부터, 얻어진 수지바니시의 고형분 중의 반응물은 71%이다.
Thereafter, 116.4 parts of glycidyl methacrylate and 188.5 parts of cyclohexanone were added. Then, 3.88 parts of dimethylbenzylamine was added as a catalyst, and the mixture was stirred at 100 ° C for 6 hours. While continuing the reaction, the acid value of the reaction product When the acid value became 5.0 mgKOH / g or less, the reaction was stopped by cooling to room temperature. The obtained resin varnish was light yellow transparent, had a solid content of 60% and a final acid value of 3.0 mgKOH / g, and thus the reactivity in the solid content of the obtained resin varnish was 71%.

(합성예 8: 분산제(8))(Synthesis Example 8: Dispersant (8))

교반기, 환류냉각관, 드라이에어도입관, 온도계를 구비한 4구 플라스크에 무수프탈산 80.0부, 수산기가 113mgKOH/g의 펜타에리스리톨트리아크릴레이트(2) 268.7부, 메틸하이드로퀴논 0.25부, 시클로헥사논 230.4부를 투입하고, 60℃까지 승온하였다. 이어서 촉매로서 1,8-디아자비시클로[5.4.0]-7-운데센 1.74부를 첨가하고, 90℃에서 8시간 교반하였다. 반응물의 IR측정으로 산무수물기의 피크, 즉, 1780cm-1 및 1850cm-1 부근의 피크가 삭감되어 있는 것을 확인한 후, 냉각하고, 반응을 정지시켰다. 이 시점에서 반응물의 산가를 관용의 방법으로 측정한 결과, 88mgKOH/g였다.A four-necked flask equipped with a stirrer, a reflux condenser, a dry air introducing tube and a thermometer was charged with 80.0 parts of phthalic anhydride, 268.7 parts of pentaerythritol triacrylate (2) having a hydroxyl value of 113 mgKOH / g, 0.25 parts of methylhydroquinone, And the temperature was raised to 60 占 폚. Then 1.74 parts of 1,8-diazabicyclo [5.4.0] -7-undecene was added as a catalyst, and the mixture was stirred at 90 占 폚 for 8 hours. After confirming that the peak of the acid anhydride group, that is, the peak near 1780 cm -1 and 1850 cm -1 , was cut by the IR measurement of the reactant, the reaction was stopped by cooling. At this point, the acid value of the reactant was measured by a conventional method and found to be 88 mgKOH / g.

그 후, 비페닐글리시딜에테르 122.2부, 시클로헥사논 78.7부를 첨가하고, 이어서 촉매로서, 디메틸벤질아민 2.81부를 첨가하고, 100℃에서 6시간 교반하고, 반응을 계속하면서 정기적으로 반응물의 산가를 측정하여, 산가가 5.0mgKOH/g 이하가 되었을 때, 실온까지 냉각하여 반응을 정지시켰다. 얻어진 수지바니시는 담황색 투명하고, 고형분 60%, 최종적인 산가는 3.0mgKOH/g인 것으로부터, 얻어진 수지바니시의 고형분 중의 반응물은 75%이다.
Thereafter, 122.2 parts of biphenyl glycidyl ether and 78.7 parts of cyclohexanone were added. Then, 2.81 parts of dimethylbenzylamine was added as a catalyst, and the mixture was stirred at 100 ° C for 6 hours. While continuing the reaction, the acid value of the reaction product When the acid value became 5.0 mgKOH / g or less, the reaction was stopped by cooling to room temperature. The resultant resin varnish is light yellow transparent, has a solid content of 60% and a final acid value of 3.0 mgKOH / g, so that the reactivity in the solid content of the obtained resin varnish is 75%.

(합성예 9: 분산제(9))(Synthesis Example 9: Dispersant (9))

교반기, 환류냉각관, 드라이에어도입관, 온도계를 구비한 4구 플라스크에 무수프탈산 80.0부, 수산기가 113mgKOH/g의 펜타에리스리톨트리아크릴레이트(2) 268.7부, 메틸하이드로퀴논 0.25부, 시클로헥사논 230.4부를 투입하고, 60℃까지 승온하였다. 이어서 촉매로서 1,8-디아자비시클로[5.4.0]-7-운데센 1.74부를 첨가하고, 90℃에서 8시간 교반하였다. 반응물의 IR측정으로 산무수물기의 피크, 즉, 1780cm-1 및 1850cm-1 부근의 피크가 삭감되어 있는 것을 확인한 후, 냉각하고, 반응을 정지시켰다. 이 시점에서 반응물의 산가를 관용의 방법으로 측정한 결과, 88mgKOH/g였다.A four-necked flask equipped with a stirrer, a reflux condenser, a dry air introducing tube and a thermometer was charged with 80.0 parts of phthalic anhydride, 268.7 parts of pentaerythritol triacrylate (2) having a hydroxyl value of 113 mgKOH / g, 0.25 parts of methylhydroquinone, And the temperature was raised to 60 占 폚. Then 1.74 parts of 1,8-diazabicyclo [5.4.0] -7-undecene was added as a catalyst, and the mixture was stirred at 90 占 폚 for 8 hours. After confirming that the peak of the acid anhydride group, that is, the peak near 1780 cm -1 and 1850 cm -1 , was cut by the IR measurement of the reactant, the reaction was stopped by cooling. At this point, the acid value of the reactant was measured by a conventional method and found to be 88 mgKOH / g.

그 후, 글리시딜메타크릴레이트 77.8부, 시클로헥사논 49.1부를 첨가하고, 이어서 촉매로서, 디메틸벤질아민 2.80부를 첨가하고, 100℃에서 6시간 교반하고, 반응을 계속하면서 정기적으로 반응물의 산가를 측정하여, 산가가 5.0mgKOH/g 이하가 되었을 때, 실온까지 냉각하여 반응을 정지시켰다. 얻어진 수지바니시는 담황색 투명하고, 고형분 60%, 최종적인 산가는 3.0mgKOH/g인 것으로부터, 얻어진 수지바니시의 고형분 중의 반응물은 72%이다.
Thereafter, 77.8 parts of glycidyl methacrylate and 49.1 parts of cyclohexanone were added. Then, 2.80 parts of dimethylbenzylamine was added as a catalyst, and the mixture was stirred at 100 ° C for 6 hours. While continuing the reaction, the acid value of the reaction product When the acid value became 5.0 mgKOH / g or less, the reaction was stopped by cooling to room temperature. The resulting resin varnish was light yellow transparent, having a solid content of 60% and a final acid value of 3.0 mgKOH / g, so that the reactivity in the solid content of the obtained resin varnish was 72%.

(합성예 10: 분산제(10))(Synthesis Example 10: Dispersant (10))

교반기, 환류냉각관, 드라이에어도입관, 온도계를 구비한 4구 플라스크에 1,2,4,5-벤젠테트라카르본산이무수물 80.0부, 수산기가 113mgKOH/g의 펜타에리스리톨트리아크릴레이트(2) 364.9부, 메틸하이드로퀴논 0.31부, 시클로헥사논 293.9부를 투입하고, 60℃까지 승온하였다. 이어서 촉매로서 1,8-디아자비시클로[5.4.0]-7-운데센 2.22부를 첨가하고, 90℃에서 8시간 교반하였다. 반응물의 IR측정으로 산무수물기의 피크, 즉, 1780cm-1 및 1850cm-1 부근의 피크가 삭감되어 있는 것을 확인한 후, 냉각하고, 반응을 정지시켰다. 이 시점에서 반응물의 산가를 관용의 방법으로 측정한 결과, 93mgKOH/g였다.In a four-necked flask equipped with a stirrer, a reflux condenser, a dry air introducing tube, and a thermometer, 80.0 parts of 1,2,4,5-benzene tetracarboxylic dianhydride and 100.0 parts by weight of pentaerythritol triacrylate (2) having a hydroxyl value of 113 mgKOH / , 0.31 part of methylhydroquinone and 293.9 parts of cyclohexanone, and the temperature was raised to 60 占 폚. Then, 2.22 parts of 1,8-diazabicyclo [5.4.0] -7-undecene was added as a catalyst, and the mixture was stirred at 90 占 폚 for 8 hours. After confirming that the peak of the acid anhydride group, that is, the peak near 1780 cm -1 and 1850 cm -1 , was cut by the IR measurement of the reactant, the reaction was stopped by cooling. At this point, the acid value of the reactant was measured by a conventional method and found to be 93 mgKOH / g.

그 후, 글리시딜메타크릴레이트 105.6부, 시클로헥사논 66.9부를 첨가하고, 이어서 촉매로서, 디메틸벤질아민 3.58부를 첨가하고, 100℃에서 6시간 교반하고, 반응을 계속하면서 정기적으로 반응물의 산가를 측정하여, 산가가 5.0mgKOH/g 이하가 되었을 때, 실온까지 냉각하여 반응을 정지시켰다. 얻어진 수지바니시는 담황색 투명하고, 고형분 60%, 최종적인 산가는 3.0mgKOH/g인 것으로부터, 얻어진 수지바니시의 고형분 중의 반응물은 71%이다.
Thereafter, 105.6 parts of glycidyl methacrylate and 66.9 parts of cyclohexanone were added. Then, 3.58 parts of dimethylbenzylamine was added as a catalyst, and the mixture was stirred at 100 ° C for 6 hours. While continuing the reaction, the acid value of the reaction product When the acid value became 5.0 mgKOH / g or less, the reaction was stopped by cooling to room temperature. The obtained resin varnish was light yellow transparent, had a solid content of 60% and a final acid value of 3.0 mgKOH / g, and thus the reactivity in the solid content of the obtained resin varnish was 71%.

(합성예 11: 분산제(11))(Synthesis Example 11: Dispersant (11))

교반기, 환류냉각관, 드라이에어도입관, 온도계를 구비한 4구 플라스크에 9,9-비스(3,4-디카르복시페닐)플루오렌이산무수물 80.0부, 수산기가 122mgKOH/g의 펜타에리스리톨트리아크릴레이트(1) 160.2부, 메틸하이드로퀴논 0.16부, 시클로헥사논 158.8부를 투입하고, 60℃까지 승온하였다. 이어서 촉매로서 1,8-디아자비시클로[5.4.0]-7-운데센 1.20부를 첨가하고, 90℃에서 8시간 교반하였다. 반응물의 IR측정으로 산무수물기의 피크, 즉, 1780cm-1 및 1850cm-1 부근의 피크가 삭감되어 있는 것을 확인한 후, 냉각하고, 반응을 정지시켰다. 이 시점에서 반응물의 산가를 관용의 방법으로 측정한 결과, 82mgKOH/g였다.A four-necked flask equipped with a stirrer, a reflux condenser, a dry air introducing tube and a thermometer was charged with 80.0 parts of 9,9-bis (3,4-dicarboxyphenyl) fluorene dianhydride and 95.0 parts of pentaerythritol triacrylate having a hydroxyl value of 122 mgKOH / g 160.2 parts of RATE (1), 0.16 parts of methylhydroquinone and 158.8 parts of cyclohexanone, and the temperature was raised to 60 占 폚. Then 1.20 parts of 1,8-diazabicyclo [5.4.0] -7-undecene was added as a catalyst, followed by stirring at 90 占 폚 for 8 hours. After confirming that the peak of the acid anhydride group, that is, the peak near 1780 cm -1 and 1850 cm -1 , was cut by the IR measurement of the reactant, the reaction was stopped by cooling. At this point, the acid value of the reactant was determined by a conventional method and found to be 82 mgKOH / g.

그 후, 글리시딜메타크릴레이트 50.3부, 시클로헥사논 31.6부를 첨가하고, 이어서 촉매로서, 디메틸벤질아민 1.94부를 첨가하고, 100℃에서 6시간 교반하고, 반응을 계속하면서 정기적으로 반응물의 산가를 측정하여, 산가가 5.0mgKOH/g 이하가 되었을 때, 실온까지 냉각하여 반응을 정지시켰다. 얻어진 수지바니시는 담황색 투명하고, 고형분 60%, 최종적인 산가는 3.0mgKOH/g인 것으로부터, 얻어진 수지바니시의 고형분 중의 반응물은 75%이다.
Thereafter, 50.3 parts of glycidyl methacrylate and 31.6 parts of cyclohexanone were added. Then, 1.94 parts of dimethylbenzylamine was added as a catalyst, and the mixture was stirred at 100 ° C for 6 hours. While continuing the reaction, the acid value of the reaction product When the acid value became 5.0 mgKOH / g or less, the reaction was stopped by cooling to room temperature. The resultant resin varnish is light yellow transparent, has a solid content of 60% and a final acid value of 3.0 mgKOH / g, so that the reactivity in the solid content of the obtained resin varnish is 75%.

(합성예 12: 분산제(12))(Synthesis Example 12: Dispersant (12))

교반기, 환류냉각관, 드라이에어도입관, 온도계를 구비한 4구 플라스크에 3,3',4,4'-비페닐테트라카르본산이무수물 80.0부, 수산기가 85mgKOH/g의 디펜타에리스리톨펜타아크릴레이트 359.0부, 메틸하이드로퀴논 0.29부, 시클로헥사논 290.1부를 투입하고, 60℃까지 승온하였다. 이어서 촉매로서 1,8-디아자비시클로[5.4.0]-7-운데센 2.19부를 첨가하고, 90℃에서 8시간 교반하였다. 반응물의 IR측정으로 산무수물기의 피크, 즉, 1780cm-1 및 1850cm-1 부근의 피크가 삭감되어 있는 것을 확인한 후, 냉각하고, 반응을 정지시켰다. 이 시점에서 반응물의 산가를 관용의 방법으로 측정한 결과, 74mgKOH/g였다. 그 후, 글리시딜메타크릴레이트 78.3부, 시클로헥사논 48.7부를 첨가하고, 이어서 촉매로서, 디메틸벤질아민 3.53부를 첨가하고, 100℃에서 6시간 교반하고, 반응을 계속하면서 정기적으로 반응물의 산가를 측정하여, 산가가 5.0mgKOH/g 이하가 되었을 때, 실온까지 냉각하여 반응을 정지시켰다. 얻어진 수지바니시는 담황색 투명하고, 고형분 60%, 최종적인 산가는 3.0mgKOH/g인 것으로부터, 얻어진 수지바니시의 고형분 중의 반응물은 69%이다.
A four-necked flask equipped with a stirrer, a reflux condenser, a dry air introducing tube and a thermometer was charged with 80.0 parts of 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride and 85.0 parts of dipentaerythritol pentaacrylate having a hydroxyl value of 85 mgKOH / g 359.0 parts of methyl methacrylate, 0.29 parts of methylhydroquinone and 290.1 parts of cyclohexanone, and the temperature was raised to 60 占 폚. Then 2.19 parts of 1,8-diazabicyclo [5.4.0] -7-undecene was added as a catalyst, followed by stirring at 90 占 폚 for 8 hours. After confirming that the peak of the acid anhydride group, that is, the peak near 1780 cm -1 and 1850 cm -1 , was cut by the IR measurement of the reactant, the reaction was stopped by cooling. At this point, the acid value of the reactant was measured by a conventional method and found to be 74 mgKOH / g. Thereafter, 78.3 parts of glycidyl methacrylate and 48.7 parts of cyclohexanone were added. Then, 3.53 parts of dimethylbenzylamine was added as a catalyst, and the mixture was stirred at 100 ° C for 6 hours. While continuing the reaction, the acid value of the reaction product When the acid value became 5.0 mgKOH / g or less, the reaction was stopped by cooling to room temperature. The resulting resin varnish was light yellow transparent, had a solid content of 60% and a final acid value of 3.0 mgKOH / g, and thus the reactivity in the solid content of the obtained resin varnish was 69%.

(합성예 13: 분산제(13))(Synthesis Example 13: Dispersant (13))

교반기, 환류냉각관, 드라이에어도입관, 온도계를 구비한 4구 플라스크에 3,3',4,4'-비페닐테트라카르본산이무수물 80.0부, 수산기가 483mgKOH/g의 2-하이드록시에틸아크릴레이트 63.1부, 메틸하이드로퀴논 0.11부, 시클로헥사논 94.6부를 투입하고, 60℃까지 승온하였다. 이어서 촉매로서 1,8-디아자비시클로[5.4.0]-7-운데센 0.72부를 첨가하고, 90℃에서 8시간 교반하였다. 반응물의 IR측정으로 산무수물기의 피크, 즉, 1780cm-1 및 1850cm-1 부근의 피크가 삭감되어 있는 것을 확인한 후, 냉각하고, 반응을 정지시켰다. 이 시점에서 반응물의 산가를 관용의 방법으로 측정한 결과, 215mgKOH/g였다. 그 후, 글리시딜메타크릴레이트 78.3부, 시클로헥사논 51.1부를 첨가하고, 이어서 촉매로서, 디메틸벤질아민 1.15부를 첨가하고, 100℃에서 6시간 교반하고, 반응을 계속하면서 정기적으로 반응물의 산가를 측정하여, 산가가 5.0mgKOH/g 이하가 되었을 때, 실온까지 냉각하여 반응을 정지시켰다. 얻어진 수지바니시는 담황색 투명하고, 고형분 60%, 최종적인 산가는 3.0mgKOH/g인 것으로부터, 얻어진 수지바니시의 고형분 중의 반응물은 87%이다.
In a four-necked flask equipped with a stirrer, a reflux condenser, a dry air introducing tube, and a thermometer, 80.0 parts of 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, 2-hydroxyethyl 63.1 parts of acrylate, 0.11 part of methylhydroquinone and 94.6 parts of cyclohexanone, and the temperature was raised to 60 占 폚. Then, 0.72 part of 1,8-diazabicyclo [5.4.0] -7-undecene was added as a catalyst, followed by stirring at 90 占 폚 for 8 hours. After confirming that the peak of the acid anhydride group, that is, the peak near 1780 cm -1 and 1850 cm -1 , was cut by the IR measurement of the reactant, the reaction was stopped by cooling. At this point, the acid value of the reactant was measured by a conventional method and found to be 215 mgKOH / g. Thereafter, 78.3 parts of glycidyl methacrylate and 51.1 parts of cyclohexanone were added. Then, 1.15 parts of dimethylbenzylamine was added as a catalyst, and the mixture was stirred at 100 ° C for 6 hours. While continuing the reaction, the acid value of the reaction product When the acid value became 5.0 mgKOH / g or less, the reaction was stopped by cooling to room temperature. The resultant resin varnish was light yellow transparent, had a solid content of 60% and a final acid value of 3.0 mgKOH / g, so that the reactivity in the solid content of the obtained resin varnish was 87%.

(합성예 14: 분산제(14))(Synthesis Example 14: Dispersant (14))

교반기, 환류냉각관, 드라이에어도입관, 온도계를 구비한 4구 플라스크에 1,2,3,4-부탄테트라카르본산이무수물 80.0부, 수산기가 85mgKOH/g의 디펜타에리스리톨펜타아크릴레이트 533.3부, 메틸하이드로퀴논 0.37부, 시클로헥사논 405.5부를 투입하고, 60℃까지 승온하였다. 이어서 촉매로서 1,8-디아자비시클로[5.4.0]-7-운데센 3.07부를 첨가하고, 90℃에서 8시간 교반하였다. 반응물의 IR측정으로 산무수물기의 피크, 즉, 1780cm-1 및 1850cm-1 부근의 피크가 삭감되어 있는 것을 확인한 후, 냉각하고, 반응을 정지시켰다. 이 시점에서 반응물의 산가를 관용의 방법으로 측정한 결과, 75mgKOH/g였다. 그 후, 글리시딜메타크릴레이트 116.4부, 시클로헥사논 72.6부를 첨가하고, 이어서 촉매로서, 디메틸벤질아민 4.93부를 첨가하고, 100℃에서 6시간 교반하고, 반응을 계속하면서 정기적으로 반응물의 산가를 측정하여, 산가가 5.0mgKOH/g 이하가 되었을 때, 실온까지 냉각하여 반응을 정지시켰다. 얻어진 수지바니시는 담황색 투명하고, 고형분 60%, 최종적인 산가는 3.0mgKOH/g인 것으로부터, 얻어진 수지바니시의 고형분 중의 반응물은 68%이다.
A four-necked flask equipped with a stirrer, a reflux condenser, a dry air introducing tube and a thermometer was charged with 80.0 parts of 1,2,3,4-butanetetracarboxylic dianhydride and 533.3 parts of dipentaerythritol pentaacrylate having a hydroxyl value of 85 mgKOH / g 0.37 parts of methylhydroquinone, and 405.5 parts of cyclohexanone were charged, and the temperature was raised to 60 占 폚. Then, 3.07 parts of 1,8-diazabicyclo [5.4.0] -7-undecene was added as a catalyst, and the mixture was stirred at 90 ° C for 8 hours. After confirming that the peak of the acid anhydride group, that is, the peak near 1780 cm -1 and 1850 cm -1 , was cut by the IR measurement of the reactant, the reaction was stopped by cooling. At this point, the acid value of the reactant was measured by a conventional method and found to be 75 mgKOH / g. Thereafter, 116.4 parts of glycidyl methacrylate and 72.6 parts of cyclohexanone were added, and then 4.93 parts of dimethylbenzylamine was added as a catalyst. The mixture was stirred at 100 DEG C for 6 hours, and the acid value of the reaction product was measured periodically When the acid value became 5.0 mgKOH / g or less, the reaction was stopped by cooling to room temperature. The resultant resin varnish was light yellow transparent, had a solid content of 60% and a final acid value of 3.0 mgKOH / g, so that the reactivity in the solid content of the obtained resin varnish was 68%.

(합성예 15: 분산제(15))(Synthesis Example 15: Dispersant (15))

교반기, 환류냉각관, 드라이에어도입관, 온도계를 구비한 4구 플라스크에 1,2,3,4-부탄테트라카르본산이무수물 80.0부, 수산기가 483mgKOH/g의 2-하이드록시에틸아크릴레이트 93.7부, 메틸하이드로퀴논 0.15부, 시클로헥사논 114.8부를 투입하고, 60℃까지 승온하였다. 이어서 촉매로서 1,8-디아자비시클로[5.4.0]-7-운데센 0.87부를 첨가하고, 90℃에서 8시간 교반하였다. 반응물의 IR측정으로 산무수물기의 피크, 즉, 1780cm-1 및 1850cm-1 부근의 피크가 삭감되어 있는 것을 확인한 후, 냉각하고, 반응을 정지시켰다. 이 시점에서 반응물의 산가를 관용의 방법으로 측정한 결과, 264mgKOH/g였다. 그 후, 글리시딜메타크릴레이트 116.4부, 시클로헥사논 76.2부를 첨가하고, 이어서 촉매로서, 디메틸벤질아민 1.4부를 첨가하고, 100℃에서 6시간 교반하고, 반응을 계속하면서 정기적으로 반응물의 산가를 측정하여, 산가가 5.0mgKOH/g 이하가 되었을 때, 실온까지 냉각하여 반응을 정지시켰다. 얻어진 수지바니시는 담황색 투명하고, 고형분 60%, 최종적인 산가는 3.0mgKOH/g인 것으로부터, 얻어진 수지바니시의 고형분 중의 반응물은 86%이다.
A four-necked flask equipped with a stirrer, a reflux condenser, a dry air introducing tube and a thermometer was charged with 80.0 parts of 1,2,3,4-butanetetracarboxylic dianhydride and 2 parts of 2-hydroxyethyl acrylate 93.7 having a hydroxyl value of 483 mgKOH / g , 0.15 part of methylhydroquinone and 114.8 parts of cyclohexanone were charged, and the temperature was raised to 60 占 폚. Then, 0.87 parts of 1,8-diazabicyclo [5.4.0] -7-undecene was added as a catalyst, and the mixture was stirred at 90 ° C for 8 hours. After confirming that the peak of the acid anhydride group, that is, the peak near 1780 cm -1 and 1850 cm -1 , was cut by the IR measurement of the reactant, the reaction was stopped by cooling. At this point, the acid value of the reactant was measured by a conventional method and found to be 264 mgKOH / g. Thereafter, 116.4 parts of glycidyl methacrylate and 76.2 parts of cyclohexanone were added. Then, 1.4 parts of dimethylbenzylamine was added as a catalyst, and the mixture was stirred at 100 ° C for 6 hours. While continuing the reaction, the acid value of the reaction product When the acid value became 5.0 mgKOH / g or less, the reaction was stopped by cooling to room temperature. The resulting resin varnish was light yellow transparent, had a solid content of 60% and a final acid value of 3.0 mgKOH / g, and thus the reactivity in the solid content of the obtained resin varnish was 86%.

(합성예 16: 분산제(16))(Synthesis Example 16: Dispersant (16))

교반기, 환류냉각관, 드라이에어도입관, 온도계를 구비한 4구 플라스크에 3,3',4,4'-비페닐테트라카르본산이무수물 80.0부, 수산기가 483mgKOH/g의 2-하이드록시에틸아크릴레이트 63.1부, 메틸하이드로퀴논 0.11부, 시클로헥사논 94.6부를 투입하고, 60℃까지 승온하였다. 이어서 촉매로서 1,8-디아자비시클로[5.4.0]-7-운데센 0.72부를 첨가하고, 90℃에서 8시간 교반하였다. 반응물의 IR측정으로 산무수물기의 피크, 즉, 1780cm-1 및 1850cm-1 부근의 피크가 삭감되어 있는 것을 확인한 후, 냉각하고, 반응을 정지시켰다. 이 시점에서 반응물의 산가를 관용의 방법으로 측정한 결과, 215mgKOH/g였다. 그 후, 비페닐글리시딜에테르 123.1부, 시클로헥사논 80.9부를 첨가하고, 이어서 촉매로서, 디메틸벤질아민 1.15부를 첨가하고, 100℃에서 6시간 교반하고, 반응을 계속하면서 정기적으로 반응물의 산가를 측정하여, 산가가 5.0mgKOH/g 이하가 되었을 때, 실온까지 냉각하여 반응을 정지시켰다. 얻어진 수지바니시는 담황색 투명하고, 고형분 60%, 최종적인 산가는 3.0mgKOH/g인 것으로부터, 얻어진 수지바니시의 고형분 중의 반응물은 89%이다.
In a four-necked flask equipped with a stirrer, a reflux condenser, a dry air introducing tube, and a thermometer, 80.0 parts of 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, 2-hydroxyethyl 63.1 parts of acrylate, 0.11 part of methylhydroquinone and 94.6 parts of cyclohexanone, and the temperature was raised to 60 占 폚. Then, 0.72 part of 1,8-diazabicyclo [5.4.0] -7-undecene was added as a catalyst, followed by stirring at 90 占 폚 for 8 hours. After confirming that the peak of the acid anhydride group, that is, the peak near 1780 cm -1 and 1850 cm -1 , was cut by the IR measurement of the reactant, the reaction was stopped by cooling. At this point, the acid value of the reactant was measured by a conventional method and found to be 215 mgKOH / g. Thereafter, 123.1 parts of biphenyl glycidyl ether and 80.9 parts of cyclohexanone were added. Then, 1.15 parts of dimethylbenzylamine was added as a catalyst, and the mixture was stirred at 100 DEG C for 6 hours. While continuing the reaction, the acid value of the reaction product When the acid value became 5.0 mgKOH / g or less, the reaction was stopped by cooling to room temperature. The resin varnish thus obtained was light yellow transparent, having a solid content of 60% and a final acid value of 3.0 mgKOH / g, so that the reactivity in the solid content of the obtained resin varnish was 89%.

(합성예 17: 분산제(17))(Synthesis Example 17: Dispersant (17))

교반기, 환류냉각관, 드라이에어도입관, 온도계를 구비한 4구 플라스크에 3,3',4,4'-비페닐테트라카르본산이무수물 80.0부, 수산기가 483mgKOH/g의 2-하이드록시에틸아크릴레이트 63.1부, 메틸하이드로퀴논 0.11부, 시클로헥사논 94.6부를 투입하고, 60℃까지 승온하였다. 이어서 촉매로서 1,8-디아자비시클로[5.4.0]-7-운데센 0.72부를 첨가하고, 90℃에서 8시간 교반하였다. 반응물의 IR측정으로 산무수물기의 피크, 즉, 1780cm-1 및 1850cm-1 부근의 피크가 삭감되어 있는 것을 확인한 후, 냉각하고, 반응을 정지시켰다. 이 시점에서 반응물의 산가를 관용의 방법으로 측정한 결과, 215mgKOH/g였다. 그 후, 4-하이드록시부틸아크릴레이트글리시딜에테르 108.8부, 시클로헥사논 71.4부를 첨가하고, 이어서 촉매로서, 디메틸벤질아민 1.15부를 첨가하고, 100℃에서 6시간 교반하고, 반응을 계속하면서 정기적으로 반응물의 산가를 측정하여, 산가가 5.0mgKOH/g 이하가 되었을 때, 실온까지 냉각하여 반응을 정지시켰다. 얻어진 수지바니시는 담황색 투명하고, 고형분 60%, 최종적인 산가는 3.0mgKOH/g인 것으로부터, 얻어진 수지바니시의 고형분 중의 반응물은 89%이다.
In a four-necked flask equipped with a stirrer, a reflux condenser, a dry air introducing tube, and a thermometer, 80.0 parts of 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, 2-hydroxyethyl 63.1 parts of acrylate, 0.11 part of methylhydroquinone and 94.6 parts of cyclohexanone, and the temperature was raised to 60 占 폚. Then, 0.72 part of 1,8-diazabicyclo [5.4.0] -7-undecene was added as a catalyst, followed by stirring at 90 占 폚 for 8 hours. After confirming that the peak of the acid anhydride group, that is, the peak near 1780 cm -1 and 1850 cm -1 , was cut by the IR measurement of the reactant, the reaction was stopped by cooling. At this point, the acid value of the reactant was measured by a conventional method and found to be 215 mgKOH / g. Thereafter, 108.8 parts of 4-hydroxybutyl acrylate glycidyl ether and 71.4 parts of cyclohexanone were added. Then, 1.15 parts of dimethylbenzylamine was added as a catalyst, and the mixture was stirred at 100 ° C for 6 hours. While continuing the reaction, , The acid value of the reaction product was measured. When the acid value became 5.0 mgKOH / g or less, the reaction was stopped by cooling to room temperature. The resin varnish thus obtained was light yellow transparent, having a solid content of 60% and a final acid value of 3.0 mgKOH / g, so that the reactivity in the solid content of the obtained resin varnish was 89%.

표 1에 합성의 정리를 나타낸다.Table 1 summarizes the synthesis.

표 1에 합성예에서 얻어진 반응물의 개요를 나타낸다.
Table 1 shows the outline of the reactants obtained in Synthesis Examples.

[표 1][Table 1]

Figure pat00015

Figure pat00015

(금속산화물 페이스트의 작성)(Preparation of Metal Oxide Paste)

상기 제조예에 의해 제작한 각 화합물(A)을 함유하는 수지바니시를 이용하고, 표 2에 부수를 나타낸 배합에 의해 금속산화물(B)의 분산을 행하여, 금속산화물 분산페이스트를 제작한다(표 2 중, 금속산화물 100중량부에 대한 반응물의 비율은 고형분량을 나타낸다.). 분산방법은, 전분산(지르코니아비즈(0.5mm)를 매체로서 이용하고, 페인트쉐이커로 1시간 분산)과, 본 분산(지르코니아비즈(0.1mm)를 매체로서 이용하고, Kotobuki Industries Co., Ltd.제 분산기 UAM-015로 분산)의 2단계로 행하였다.
A metal oxide dispersion paste was prepared by dispersing the metal oxide (B) by using the resin varnish containing the compound (A) prepared in the above Production Example and by adding the components shown in Table 2 together (see Table 2 , The ratio of the reactants to 100 parts by weight of the metal oxide indicates the solid content). The dispersion was carried out in the same manner as in Kotobuki Industries Co., Ltd. using zirconia beads (0.1 mm) as a medium, and the total dispersion (zirconia beads (0.5 mm) as a medium and dispersing with a paint shaker for 1 hour). Dispersed in a disperser UAM-015).

[표 2][Table 2]

Figure pat00016
Figure pat00016

Figure pat00017

Figure pat00017

표 2에 있어서,In Table 2,

ZrO2: Nihondenko Co.,Ltd제 「PCS-60」(평균 1차 입자경: 20nm)ZrO 2 : "PCS-60" (average primary particle size: 20 nm) manufactured by Nihondenko Co.,

TiO2: Taica Corporation제 「MT-05」(평균 1차 입자경: 10nm)TiO 2 : "MT-05" (average primary particle diameter: 10 nm) manufactured by Taica Corporation,

Sb2O5: Nissan Chemical Industries, Limited제 「Sun Epoch EFR-6N」(평균 1차 입자경: 20nm)Sb 2 O 5 : "Sun Epoch EFR-6N" (average primary particle diameter: 20 nm) manufactured by Nissan Chemical Industries, Limited,

ATO: Ishihara Sangyo Kaisha, Ltd.제 「SN-100P」(평균 1차 입자경: 20nm)ATO: SN-100P (average primary particle diameter: 20 nm) manufactured by Ishihara Sangyo Kaisha, Ltd.

ITO: C.I.Kasei Co.,Ltd.제 「Nanotek ITO」(평균 1차 입자경: 30nm)ITO: &quot; Nanotek ITO &quot; (average primary particle diameter: 30 nm) manufactured by CI Kasei Co.,

PTO: Mitsubishi Materials Corporation제 「EP SP-2」(평균 1차 입자경: 15nm)PTO: "EP SP-2" (average primary particle diameter: 15 nm) manufactured by Mitsubishi Materials Corporation,

ZnO: Sakai Chemical Industry Co.,Ltd.제 「FINEX-50」(평균 1차 입자경: 20nm)ZnO: FINEX-50 (average primary particle diameter: 20 nm) manufactured by Sakai Chemical Industry Co.,

SiO2: Nippon Aerosil Co., Ltd.제 「AEROSIL50」(평균 1차 입자경: 50nm)SiO 2 : "AEROSIL 50" (average primary particle size: 50 nm) manufactured by Nippon Aerosil Co.,

Al2O5: Nippon Aerosil Co., Ltd.제 「Aluminium Oxide C」(평균 1차 입자경: 13nm)Al 2 O 5 : "Aluminum Oxide C" (average primary particle diameter: 13 nm) manufactured by Nippon Aerosil Co., Ltd.

MEK: 메틸에틸케톤MEK: methyl ethyl ketone

메톡시부탄올: 3-메톡시-1-부탄올
Methoxybutanol: 3-methoxy-1-butanol

(평가방법)(Assessment Methods)

(1) 분산성(1) Dispersibility

<분산 직후의 상태><State immediately after dispersion>

얻어진 금속산화물 분산페이스트의 상태를 육안으로 관찰하였다.The state of the obtained metal oxide dispersion paste was visually observed.

A: 유동성이 있다.A: There is liquidity.

B: 고화되어 있으나, 세차게 흔들면 유동성을 확인할 수 있다.B: It is solidified, but fluidity can be confirmed by gently shaking it.

C: 고화되어 있다.
C: It is solidified.

<D50입자경><D50 particle size>

얻어진 금속산화물 페이스트의 D50입자경은, Nikkiso Co., Ltd.제 「NANOTRAC UPA」를 이용하여 측정하였다. 실용적으로는 200nm 이하인 것이 바람직하다.
The D50 particle diameter of the obtained metal oxide paste was measured using "NANOTRAC UPA" manufactured by Nikkiso Co., Ltd. Practically, it is preferably 200 nm or less.

<도료화 및 경화막 평가: 실시예 1~19, 비교예 1~12>&Lt; Painting and cured film evaluation: Examples 1 to 19, Comparative Examples 1 to 12 >

상기에서 조제한 금속산화물 페이스트를 이용하여, 표 3에 부수를 나타낸 조성의 금속산화물 조성물을 조제하였다. 얻어진 금속산화물 조성물을, 100μm 두께의 이접착처리 PET필름(Toyobo Co., Ltd.제 「Cosmo Shine A-4100」)에, 바코터로, 건조 후의 막두께가 3μm가 되도록 도공한 후, 고압수은램프로 400mJ/cm2의 자외선을 조사하고, 경화막(하드코트층)을 형성하였다. 얻어진 경화막에 대하여, 하기의 방법으로 내찰상성, 연필경도, 투명성(헤이즈)을 평가하였다. 그 결과를 표 3에 나타낸다.
Using the metal oxide paste prepared above, a metal oxide composition having the composition shown in Table 3 was prepared. The resulting metal oxide composition was coated on this adhesive-treated PET film ("Cosmo Shine A-4100" manufactured by Toyobo Co., Ltd.) with a thickness of 3 μm by a bar coater to a thickness of 3 μm, And irradiated with ultraviolet rays of 400 mJ / cm 2 by a lamp to form a cured film (hard coat layer). The scratch resistance, pencil hardness and transparency (haze) of the obtained cured film were evaluated by the following methods. The results are shown in Table 3.

[표 3][Table 3]

Figure pat00018

Figure pat00018

표 3에 있어서,In Table 3,

광중합개시제: Ciba Specialty Chemicals, Inc제 「IRGACURE184」Photopolymerization initiator: "IRGACURE 184" manufactured by Ciba Specialty Chemicals, Inc.

용제: PGME(프로필렌글리콜모노메틸에테르)Solvent: PGME (propylene glycol monomethyl ether)

*1: 금속산화물 페이스트가 분산불량이었으므로 미측정
* 1: Since the metal oxide paste was poorly dispersed,

(평가방법)(Assessment Methods)

(1) 투명성(Haze값)(1) Transparency (Haze value)

얻어진 도공물에 있어서의 탁도(Haze값)를, Haze미터를 이용하여 측정하였다. 실용적으로는, 탁도는 1.0% 이하인 것이 바람직하다.
The haze value in the obtained coating material was measured using a haze meter. Practically, the turbidity is preferably 1.0% or less.

(2) 연필경도(2) Pencil hardness

JIS-K5600에 준거하여, 연필경도시험기(HEIDON사제 ScratchingTester HEIDON-14)를 이용하고, 연필 심의 경도를 다양하게 바꾸어, 하중 750g으로 5회 시험을 하였다. 5회 중, 1회도 흠집이 생기지 않았거나, 혹은 1회만 흠집이 생겼을 때의 심의 경도를, 그의 경화막의 연필경도로 하였다. 실용적인 요구물성을 고려하여, 경화막의 연필경도가,In accordance with JIS-K5600, the pencil hardness tester (ScratchingTester HEIDON-14 manufactured by HEIDON Co., Ltd.) was used, and the hardness of the pencil core was varied in various ways. The hardness of the core when no scratches occurred or only one time of scratches occurred in 5 times was defined as the pencil hardness of the cured film. Considering practical requirements, the pencil hardness of the cured film is preferably in the range of,

2H 이상: A2H or more: A

1H 이상: B1H or more: B

1H보다 낮음: DLess than 1H: D

로 판정하였다.
Respectively.

(3) 내찰상성(3) Scratch resistance

도공물을 학진(學振)시험기에 세트하고, 스틸울의 No.0000을 이용하여, 하중 250g으로 10회 학진시켰다. 취출한 도공물에 대하여, 흠집이 생긴 정도를 이하의 5단계의 육안평가에 따라서 판단하였다. 수치가 클수록, 경화막의 내찰상성이 양호한 것을 나타낸다.The pottery was set in a gauge tester, and the sample was graded 10 times at a load of 250 g using No.0000 steel wool. The degree of occurrence of scratches was determined according to the following five-stage visual evaluation. The larger the value, the better the scratch resistance of the cured film.

5: 흠집이 전혀 없다5: No scratches

4: 약간 흠집이 생겨 있다4: There is some scratches.

3: 흠집은 생겨 있으나, 기재는 보이지 않는다3: Scratches are formed, but no substrate is seen.

2: 흠집이 생겨, 일부 경화막이 벗겨져 있다2: Scratches were formed, and some of the cured films were peeled off.

1: 경화막이 벗겨져, 기재가 노출된 상태
1: Cured film peeled off, substrate exposed

표 3의 결과로부터, 실시예 1~16의 경화성 조성물을 이용한 경화막이 부착된 부재는, 투명성·연필경도·내찰상성이 균형있게 우수한 것이 판명되었다. 따라서, 이들 경화도막이 부착된 부재는, 디스플레이, 터치패널, 건재 등의 하드코트성과 투명성이 필요시되는 용도에 호적하게 이용할 수 있다.
From the results shown in Table 3, it was found that the members to which the cured films were applied using the curable compositions of Examples 1 to 16 were excellent in balance of transparency, pencil hardness and scratch resistance. Therefore, the member to which the cured coating film is adhered can be suitably used for applications requiring hard coatability and transparency such as a display, a touch panel, and a building material.

이에 반해, 수지구조가 상이한 분산제를 사용한 금속산화물 페이스트(17) 및 금속산화물 페이스트(20)~(23)는 금속산화물 페이스트의 제작을 할 수 없고, 비교예 1 및 비교예 4~7은 경화막이 부착된 부재의 평가를 할 수 없었다.
On the contrary, the metal oxide paste 17 and the metal oxide pastes 20 to 23 using the dispersing agent having a different resin structure can not produce a metal oxide paste. In Comparative Example 1 and Comparative Examples 4 and 7, Evaluation of the attached member was not possible.

수지구조가 상이한 분산제를 사용한 금속산화물 페이스트의 비교예 2 및 비교예 3, 비교예 9의 경화성 조성물을 이용한 경화막이 부착된 부재는, 투명성이 부족하였다.
The metal oxide paste using the dispersing agent having a different resin structure and the cured film of Comparative Example 2 and Comparative Example 3 and Comparative Example 9 with a cured film had insufficient transparency.

수지구조가 상이한 분산제를 사용한 금속산화물 페이스트의 비교예 8 및 비교예 10~12의 경화성 조성물을 이용한 경화막이 부착된 부재는, 투명성 및 연필경도, 내찰상성이 모두 부족하였다.
The member having the cured film using the curable composition of Comparative Example 8 and Comparative Examples 10 to 12 of the metal oxide paste using the dispersing agent having a different resin structure had insufficient transparency, pencil hardness and scratch resistance.

본 발명에 따른 금속산화물 조성물은, 광학필름부재에 호적하게 사용할 수 있을 뿐만 아니라, 다양한 플라스틱 성형품, 카메라의 최표면부의 렌즈, 안경의 렌즈, 건축물이나 차량 등의 창유리 및 다양한 인쇄물의 각각의 표면에 동일한 기능을 부여하기 위해서도 이용할 수 있다.The metal oxide composition according to the present invention can be used not only for optical film members, but also for various plastic molded articles, lenses on the outermost surface of a camera, lens for glasses, window glass for buildings and vehicles, It can also be used to give the same function.

Claims (8)

아크릴로일기를 6개 이상 갖는 화합물(A)과, 금속산화물(B)과, 용제를 함유하고,
상기 화합물(A)이,
펜타에리스리톨트리아크릴레이트 및 디펜타에리스리톨펜타아크릴레이트로부터 선택되는 1종 또는 2종의 화합물(x2), 그리고, 1,2,4,5-벤젠테트라카르본산이무수물, 3,3',4,4'-비페닐테트라카르본산이무수물, 9,9-비스(3,4-디카르복시페닐)플루오렌이산무수물, 및, 1,2,3,4-부탄테트라카르본산이무수물로 이루어진 군으로부터 선택되는 1종 또는 2종 이상의 화합물(x1)을 반응시켜 이루어지는, 카르복실기를 갖는 화합물(X)과,
비페닐글리시딜에테르
를 반응시켜 이루어지는 화합물을 포함하는, 금속산화물 조성물.
(A) having at least 6 acryloyl groups, a metal oxide (B), and a solvent,
The compound (A)
Pentaerythritol triacrylate and dipentaerythritol pentaacrylate, and at least one compound selected from the group consisting of 1,2,4,5-benzene tetracarboxylic acid dianhydride, 3,3 ', 4,4'- (3,4-dicarboxyphenyl) fluorene dianhydride, and 1,2,3,4-butanetetracarboxylic acid dianhydride, from the group consisting of 4'-biphenyltetracarboxylic acid dianhydride, 9,9- A compound (X) having a carboxyl group, which is obtained by reacting one or more compounds (x1)
Biphenyl glycidyl ether
And reacting the metal oxide with the metal oxide.
아크릴로일기를 6개 이상 갖는 화합물(A)과, 금속산화물(B)과, 용제를 함유하고,
상기 화합물(A)이, 하기 일반식(1)로 표시되는 아크릴로일기를 6개 이상 갖는 화합물(A1)을 포함하는, 금속산화물 조성물.
일반식(1)
[화학식 1]
Figure pat00019

(일반식(1) 중, R1은, 하기 어느 하나의 4가의 유기잔기를 나타낸다.
[화학식 2]
Figure pat00020

일반식(1) 중, R2는, 하기 어느 하나의 1가의 유기잔기를 나타낸다.
[화학식 3]
Figure pat00021

일반식(1) 중, R3은, 하기의 1가의 유기잔기를 나타낸다.)
[화학식 4]
Figure pat00022

(A) having at least 6 acryloyl groups, a metal oxide (B), and a solvent,
Wherein the compound (A) comprises a compound (A1) having at least 6 acryloyl groups represented by the following general formula (1).
In general formula (1)
[Chemical Formula 1]
Figure pat00019

(In the general formula (1), R 1 represents any one of the tetravalent organic moieties shown below.
(2)
Figure pat00020

In the general formula (1), R 2 represents any one of the following monovalent organic residue.
(3)
Figure pat00021

In the general formula (1), R 3 represents the following monovalent organic residue.)
[Chemical Formula 4]
Figure pat00022

제1항 또는 제2항에 있어서,
R1이, 방향환을 포함하는 유기잔기인, 금속산화물 조성물.
3. The method according to claim 1 or 2,
Wherein R &lt; 1 &gt; is an organic moiety comprising an aromatic ring.
제3항에 있어서,
방향환이, 비페닐환인, 금속산화물 조성물.
The method of claim 3,
Wherein the aromatic ring is a biphenyl ring.
제1항 내지 제4항 중 어느 한 항에 있어서,
금속산화물(B)이, 티타늄, 아연, 지르코늄, 인듐, 주석, 알루미늄, 규소 및 인으로 이루어지는 군으로부터 선택되는 적어도 1종의 원소를 함유하는, 금속산화물 조성물.
5. The method according to any one of claims 1 to 4,
Wherein the metal oxide (B) contains at least one element selected from the group consisting of titanium, zinc, zirconium, indium, tin, aluminum, silicon and phosphorus.
제1항 내지 제5항 중 어느 한 항에 있어서,
금속산화물(B)의 D50입자경이, 0.005~0.200μm인, 금속산화물 조성물.
6. The method according to any one of claims 1 to 5,
Wherein the metal oxide (B) has a D50 particle diameter of 0.005 to 0.200 m.
제1항 내지 제6항 중 어느 한 항에 기재된 금속산화물 조성물을 경화시켜 이루어지는 경화막.
A cured film obtained by curing the metal oxide composition according to any one of claims 1 to 6.
기재의 적어도 일부에, 제7항에 기재된 경화막이 마련되어 이루어지는, 경화막이 부착된 부재.A member to which a cured film is attached, wherein the cured film according to claim 7 is provided on at least a part of the base.
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