KR20160127295A - Conductive Structure Body Having Conductive Darkening Layer, and Manufacturing Apparatus and Method thereof - Google Patents

Conductive Structure Body Having Conductive Darkening Layer, and Manufacturing Apparatus and Method thereof Download PDF

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KR20160127295A
KR20160127295A KR1020150058321A KR20150058321A KR20160127295A KR 20160127295 A KR20160127295 A KR 20160127295A KR 1020150058321 A KR1020150058321 A KR 1020150058321A KR 20150058321 A KR20150058321 A KR 20150058321A KR 20160127295 A KR20160127295 A KR 20160127295A
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layer
conductive
conductive structure
substrate
darkening
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KR1020150058321A
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Korean (ko)
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정좌진
이정현
이상일
권이태
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주식회사 아텍
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Publication of KR20160127295A publication Critical patent/KR20160127295A/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention discloses a conductive structure having a conductive dark coloring layer, an apparatus for manufacturing the same, and a manufacturing method thereof.
A conductive structure according to an embodiment of the present invention includes a substrate; And a darkening layer formed directly on the substrate, wherein the darkening layer has conductivity.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a conductive structure having a conductive dark coloring layer,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive structure provided with a conductive dark coloring layer, and an apparatus and a method for manufacturing the conductive structure.

More particularly, the present invention relates to a method of forming a non-conductive dark coloring layer for use in a conventional conductive structure applicable to, for example, a touch screen panel (TSP), using a linear cathode sputtering method or a rotary cathode sputtering method, By directly depositing the dark coloration layer, the dark coloration layer formed becomes conductive, and the dark color layer itself can be used as an electrode by implementing a fine electrode pattern on the dark coloration layer, and accordingly, the conductivity, which must be essentially used in the conductive structure of the prior art The use of a pattern layer is unnecessary, and a thin conductive structure can be realized, manufacturing process and manufacturing cost of the conductive structure are reduced, and the reflectance and brightness are low even when the conductive layer is not used or used. Visibility of metallic fine patterns formed on a dark colored layer or a conductive pattern layer And a conductive darkening layer in which the defects that may occur during bonding between the conductive structure and the flexible printed circuit board (FPCB) are remarkably reduced and the yield of the final product is remarkably improved, and a conductive structure And a manufacturing method thereof.

Generally, the touch screen panel can be classified as follows according to the signal detection method. That is, a resistive type in which a position depressed by a pressure in a state where a direct current voltage is applied is sensed through a change in a current or a voltage value, and a resistive type in which a capacitance coupling is used in a state in which an alternating voltage is applied There is a capacitive type and an electromagnetic type in which a selected position is sensed as a change in voltage while a magnetic field is applied.

The term " display device " refers to a television or a computer monitor, and includes a display element for forming an image and a case for supporting the display element. Examples of such a display device include a plasma display panel (PDP), a liquid crystal display (LCD), an electrophoretic display, a cathode ray tube (CRT), and an OLED display. An RGB pixel pattern and an additional optical filter may be provided.

Meanwhile, as the spread of smart phones, tablet PCs, IPTVs, and the like is accelerated with respect to display devices, there is a growing need for a touch function in which a human hand becomes a direct input device without a separate input device such as a keyboard or a remote control. In addition, there is a demand for a multi-touch function capable of not only a specific point recognition but also writing.

Most of the touch screen panels (TSP) commercialized so far are based on transparent conductive ITO thin films, but when applied to a large area touch screen panel, the relatively high sheet resistance of the ITO transparent electrode itself (at least 150 / squre, ELECRYSTA manufactured by Nittodenko) It is necessary to introduce an additional compensation chip to overcome the problem.

In order to solve the above-mentioned problems, a technique for replacing a transparent ITO thin film used in a touch screen panel (TSP) with a metal fine pattern has been extensively studied. In particular, a metal thin film having high electrical conductivity In the case of using Ag, Mo / Al / Mo, MoTi / Cu, etc., when the microelectrode pattern of a specific shape is to be implemented, the pattern is visually recognized in human eyes due to high reflectivity, It has been found that glare may occur due to high reflectivity and haze value.

As one of the measures for solving the above-mentioned problems, the applicant filed with Korean Patent Application No. 10-2012-0020136 under the name of the invention of the conductive structure and its manufacturing method on February 28, 2012 by Kubumo et al. Korean Patent Laid-Open No. 10-2012-0100758, which is published in the same date, includes a darkening pattern layer containing AlOxNy (x and y mean the ratio of the number of atoms of each of O and N to one atom of Al) And the conductive structure can prevent the reflection by the conductive pattern layer without affecting the conductivity of the conductive pattern and can improve the hiding property of the conductive pattern layer by improving the absorbance, Thereby achieving the advantage of being able to develop a display panel with improved visibility.

More specifically, Figs. 1A to 1C show first to third embodiments of the conductive structure according to the above-described prior art.

1A to 1C, a structure of a conductive structure according to the related art includes a substrate 100, a darkening pattern layer 110, a structure of the conductive pattern layer 120 (in FIG. 1A), a substrate 100, The structure 100 of the conductive pattern layer 120 / the darkening pattern layer 110 (the case of FIG. 1B), the darkening pattern layer 110 / the conductive pattern layer 120 / the darkening pattern layer 130 ) (See FIG. 1C).

The above-described conductive structure according to the prior art has the advantage that the conventional transparent ITO thin film can replace the metal fine pattern, but the following problems still occur.

First, when the structure of the conductive structure has the structure of the substrate 100 / the darkening pattern layer 110 / the conductive pattern layer 120 as shown in FIG. 1A, the conductive pattern layer 120 is directly exposed to the user And the effect of the darkening pattern layer 110 for improving the visibility is remarkably reduced.

1B and 1C, the structure of the substrate 100 / conductive pattern layer 120 / darkening pattern layer 110 or the structure 100 of substrate 100 / darkening pattern layer 110 / conductive pattern layer 110 The darkening pattern layer 110 or the darkening pattern layer 130 may be located on the conductive pattern layer 120 to provide improved visibility to the user However, in this case, since the matting pattern layer 110 or the matting pattern layer 130 itself does not have conductivity, the following problems arise.

More specifically, FIG. 1D and FIG. 1E are cross-sectional views and top views schematically illustrating the problem of the prior art conductive structure shown in FIGS. 1B and 1C bonded to a flexible printed circuit board (FPCB) to be.

1D and 1E, in the conductive structure according to the related art, one side surface of the darkening pattern layer 110 or the darkening pattern layer 130 located on the upper side is connected to one side of the flexible printed circuit board (FPCB) 140 Should be bonded. A plurality of conductive balls 142 existing in one side of the flexible printed circuit board 140 are formed in the darkened pattern layer 110 Or the conductive pattern layer 120 located under the darkening pattern layer 130, so that the upper part of one side of the flexible printed circuit board 140 should be pressed. In this case, in order for the plurality of conductive balls 142 to be connected to the conductive pattern layer 120 through the matted pattern layer 110 or the matted pattern layer 130, The upper pressing force must be controlled very precisely. However, there arises a problem that precise control of such pressing force is not practically easy, and thus connection failure between the plurality of conductive balls 142 and the conductive pattern layer 120 may occur.

Even if the upper pressing force of one side of the flexible printed circuit board 140 is precisely controlled, the dark coloring pattern layer 110 or the dark coloring pattern layer 130 and the conductive pattern layer 120 A crack or the like may occur in the bonding portion 144 (in particular, the one end face of the conductive pattern layer 120), and thus a defect in the final product may occur The possibility increases significantly.

In addition, in the prior art, the conductive pattern layer 120 must be formed on the substrate 100 in order to manufacture the conductive structure, thereby not only the thickness of the conductive pattern layer becomes thick, but also the manufacturing process and manufacturing cost of the conductive structure There arises a problem of increase.

All the problems that may occur in the above-described conventional conductive structure arise from the fact that the darkening pattern layer 110 or the darkening pattern layer 130 does not have conductivity. Therefore, a new method for solving the above- Is required.

Korean Patent Laid-Open No. 10-2012-0100758

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems of the prior art, and it is an object of the present invention to provide a non-conductive dark coloring layer for use in a conventional conductive structure applicable to a touch screen panel (TSP), for example, a linear cathode sputtering method or a rotary cathode sputtering method The electrochromic layer is directly deposited on the substrate by using the electrodeposited electrochromic layer and the electrochromic layer is deposited directly on the electroconductive substrate using the electrochromic layer. It is possible to realize a thin-walled conductive structure as well as to reduce the manufacturing process and manufacturing cost of the conductive structure. In addition, when the conductive layer is not used, The reflectance and the brightness are low, so that the dark coloration layer or the conductive pattern layer The conductivity of the formed metal pattern is remarkably improved and the defects that may occur in the bonding between the conductive structure and the flexible printed circuit board (FPCB) are significantly reduced, and the yield of the final product is remarkably improved. And a manufacturing apparatus and a manufacturing method thereof.

A conductive structure according to a first aspect of the present invention includes: a substrate; And a darkening layer formed directly on the substrate, wherein the darkening layer has conductivity.

A conductive structure according to a second aspect of the present invention includes: a substrate; A conductive layer formed on the substrate; And a matting layer formed on the conductive layer, wherein the matting layer has conductivity.

An apparatus for manufacturing a conductive structure according to a third aspect of the present invention includes: a chamber; A rotatable negative electrode provided inside the chamber and having a metallic target wound on the outside and a fixed magnetic member provided on the inside; A power supply connected to the metal target and supplying a negative voltage; A gas nozzle spaced apart from the rotatable cathode and provided in the chamber, for supplying a plasma and a reaction gas; And a substrate provided to move linearly within the chamber at a location opposite the fixed magnetic member, wherein a darkening layer is deposited directly on the substrate or deposited on a conductive layer formed on the substrate, Is characterized by having conductivity.

A method of manufacturing a conductive structure according to a fourth aspect of the present invention comprises the steps of: a) simultaneously supplying a plasma forming gas and a reactive gas into a chamber using a gas nozzle; b) applying a negative voltage to the rotatable cathode provided in the chamber by a power supply to form a plasma by the plasma forming gas; And c) depositing a charged particle generated by collision of the plasma with a metal target wound on the outside of the rotatable cathode on a linearly moving substrate in the chamber to directly form a darkening layer on the substrate Wherein the darkening layer has conductivity.

A method for manufacturing a conductive structure according to a fifth aspect of the present invention comprises the steps of: a) supplying a plasma-forming gas into a chamber using a gas nozzle; b) applying a negative voltage to the rotatable cathode provided in the chamber by a power supply to form a plasma by the plasma forming gas; c) forming a conductive layer on the substrate by depositing a metal charge carrier generated by collision of the plasma with a metal target wound on the outside of the rotatable cathode on a linearly moving substrate in the chamber; And d) a second plasma generated by simultaneously supplying a gas for forming the plasma (P) and a reactive gas into the chamber using the gas nozzle and colliding with the metal target, And depositing the conductive layer on the conductive layer formed on the substrate to form a matted layer, wherein the matted layer has conductivity.

The following advantages are achieved by using the conductive structure having the conductive dark coloring layer according to the present invention, and the manufacturing method thereof.

1. The deposited darkening layer has conductivity.

2. The dark colored layer itself can be used as an electrode by implementing a microelectrode pattern in the dark colored layer.

3. It is not only unnecessary to use a conductive pattern layer, which should be used in the prior art conductive structure, but also enables the implementation of a thin-walled conductive structure.

4. Manufacturing process and manufacturing cost of the conductive structure are reduced.

5. Not only when the conductive layer is not used but also when it is used, the reflectivity and the brightness are low, and the visibility of the metal fine pattern formed on the colored layer or the conductive pattern layer is remarkably improved.

6. Defects that may occur during bonding between the conductive structure and the flexible printed circuit board (FPCB) are significantly reduced.

7. The yield of the final product is significantly improved.

Further advantages of the present invention can be clearly understood from the following description with reference to the accompanying drawings, in which like or similar reference numerals denote like elements.

Figs. 1A to 1C show first to third embodiments of the conductive structure according to the prior art described above.
Figs. 1D and 1E are a cross-sectional view and a top view schematically showing the problems when the prior art conductive structure shown in Figs. 1B and 1C is bonded to a flexible printed circuit board (FPCB), respectively.
2A is a schematic view illustrating an apparatus for manufacturing a conductive structure having a conductive dark coloring layer according to an embodiment of the present invention.
FIG. 2B is a schematic view of a rotating anode used in an apparatus for manufacturing a conductive structure having a conductive dark coloring layer according to an embodiment of the present invention shown in FIG. 2A. Referring to FIG.
FIG. 2C is a schematic view of a conductive structure manufactured by an apparatus for manufacturing a conductive structure according to an embodiment of the present invention shown in FIG. 2A. FIG.
FIG. 2D is a schematic view of a linear cathode used in an apparatus for manufacturing a conductive structure having a conductive dark coloring layer according to an embodiment of the present invention shown in FIG. 2A. Referring to FIG.
FIG. 2E is a chart showing the sheet resistance, reflectivity, chrominance, and darkening degree of the darkening layer obtained under specific conditions according to an embodiment of the present invention, according to the deposition thickness.
FIG. 2f is a chart comparing the characteristics of AlOxNy included in the darkening layer obtained by one embodiment of the present invention and AlOxNy contained in the darkening layer according to the prior art.
FIGS. 2G and 2H are graphs showing refractive indexes and absorption coefficients, respectively, of optical characteristics of a dark coloration layer obtained according to an embodiment of the present invention and a dark coloration layer according to the prior art.
Figures 2i and 2j show depth profile analysis data by a secondary ion mass spectrometer (SIMS) for a conductive structure obtained according to one embodiment of the present invention and a conductive structure according to the prior art, respectively .
2K is a cross-sectional view schematically showing a case where the conductive structure according to an embodiment of the present invention is bonded to a flexible printed circuit board (FPCB).
3A is a flowchart showing a method of manufacturing a conductive structure according to the first embodiment of the present invention.
3B is a flowchart showing a method of manufacturing a conductive structure according to a second embodiment of the present invention.

In the case of a conductive structure according to the prior art, the inventors have mainly deposited an oxide film or a nitride film to form a darkened pattern layer (hereinafter referred to as a "darkened layer") in order to lower the reflectance and the brightness, All of these oxide films or nitride films were deposited as a dielectric, confirming that the maturing layer of the prior art forms a nonconductive layer without electrical conductivity. Accordingly, in order to bond the dark coloring layer having no conductivity to the flexible printed circuit board (FPCB) so that the conductive ball penetrates the dark coloring layer and penetrates into the conductive pattern layer (hereinafter referred to as "conductive layer"), the bonding pressure As a result, it was confirmed that the occurrence of defects in the final product remarkably increased due to cracks or the like occurring in the bonding portion (in particular, the conductive layer).

In addition, it has been confirmed that the dark coloring layer constituting the conductive structure according to the prior art has high dielectric properties, high reflectivity and lightness, and does not have a color black color, resulting in low consumer satisfaction in terms of visibility of the final product.

SUMMARY OF THE INVENTION The present inventors have completed the present invention in consideration of the fact that a dark coloring layer constituting a conductive structure itself must be formed to have conductivity in order to solve the problems of the prior art described above.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described with reference to embodiments and drawings of the present invention.

FIG. 2A is a schematic view illustrating an apparatus for manufacturing a conductive structure having a conductive dark coloring layer according to an embodiment of the present invention. FIG. 2B is a cross-sectional view of a conductive dark coloring layer according to an embodiment of the present invention shown in FIG. FIG. 2C is a cross-sectional view schematically illustrating a structure of a conductive structure having a conductive dark coloring layer according to an embodiment of the present invention shown in FIG. 2A. Referring to FIG. And schematically showing the manufactured conductive structure.

Referring to FIGS. 2A to 2C, an apparatus 201 for manufacturing a conductive structure having a conductive dark coloring layer according to an embodiment of the present invention includes a chamber 250; A rotatable cathode 260 provided inside the chamber 250 and having a metal target 264 wound therearound and a fixed magnet element 262 provided therein; A power supply 280 connected to the metal target 264 and supplying a negative voltage; A gas nozzle 270 which is provided in the chamber 250 and spaced apart from the rotatable cathode 260 and supplies a gas for forming plasma (P) and a reactive gas; And a substrate 200 provided to move linearly within the chamber 250 at a location opposite the stationary magnetic member 262, wherein a darkening layer 210 (see top view of FIG. 2C) ) Or deposited on a conductive layer 220 (see bottom of FIG. 2C) formed on the substrate 200, and the matted layer 210 is electrically conductive.

In the apparatus 201 for manufacturing a conductive structure having a conductive coloring layer according to an embodiment of the present invention, a gas for forming a plasma (P) and a reactive gas are simultaneously supplied from a gas nozzle 270. Thereafter, a negative voltage is applied to the rotatable cathode 260 by the power supply unit 280. [ In this case, it is desirable to keep the chamber 250 in a grounded state, but it should be noted that it may be connected to a separate power source, for example, to apply a positive voltage. The power supply 280 for applying a negative voltage to the rotatable cathode 260 is preferably 2 to 10 Kw, more preferably 4 to 8 Kw, most preferably 5 to 7 Kw, But is not limited to.

When a negative voltage is applied to the rotatable cathode 260, a potential difference is generated between the chamber 250 and the rotatable cathode 260, and by the gas for forming plasma (P) supplied into the chamber 250, Thereby forming a plasma (P). At this time, the plasma P formed is concentrated on the outside of the rotating negative electrode 260 where the stationary magnetic member 262 is located by the stationary magnetic member 262 (see FIG. 2B). In one embodiment of the present invention, for example, Ar is used as a gas for forming plasma (P), and a mixed gas composed of, for example, O 2 + N 2 (O 2 : N 2 = 85: 15) Or O 2 and N 2 gases may be used, but are not limited thereto.

Thereafter, the plasma P formed in the chamber 250 collides with the metal target 264 wound on the outside of the rotatable cathode 260. In this case, a variety of metals including Fe, Co, Ti, V, Cu, Au, Al, or Ag may be used as the metal used for the metal target 264. In an embodiment of the present invention, ), And therefore the metal target 264 will hereinafter be referred to as an Al target 264 for convenience of explanation.

As described above, the plasma P in the chamber 250 collides with the Al target 264 wound on the outer side of the rotatable cathode 260, and the Al charge transfer member, the oxygen charge transfer member, the nitrogen charge transfer member , And aluminum oxide (AlO and AlO 2 ) charge carriers are deposited on the substrate 200 that moves linearly in the chamber 250 to form a darkening layer 210 (see the upper part of FIG. 2C). In this case, the linear movement speed of the base material 200 is preferably 0.05 to 0.3 m / min, but is not limited thereto.

The darkening layer 210 is directly deposited on the substrate 200 and the darkening layer 210 is formed of the conductive coloring layer 210 so that the darkening layer 1210 can be formed in the same manner as the darkening layer 210. [ And the darkening layer 210 itself can be used as an electrode. Accordingly, not only the use of the conductive pattern layer 120, which is to be used in the prior art conductive structure, but also the thin conductive structure can be realized.

More specifically, in one embodiment of the present invention, the colored layer 210 formed on the substrate 200 may be etched with a known aluminum etchant to pattern the fine patterned electrode on the colored layer 210. For this, an apparatus 201 for fabricating a conductive structure having a conductive dark coloring layer according to an embodiment of the present invention may pattern the fine patterned electrode on the dark coloring layer 210 by etching the dark coloring layer 210 (Not shown) may be additionally provided.

In addition, in the embodiment of the present invention, since it is not necessary to form the conductive pattern layer 120 as in the prior art between the substrate 200 and the maturing layer 210, manufacturing process and manufacturing cost of the conductive structure are reduced.

Alternatively, in an apparatus 201 for manufacturing a conductive structure having a conductive dark coloring layer according to an embodiment of the present invention, a conductive layer 220 (corresponding to the conductive pattern layer 120 of the prior art) (See the lower part of FIG. 2C) may be formed first, and then the matting layer 210 may be formed on the conductive layer 220. To this end, only the gas for forming plasma (P) such as argon (Ar) is supplied from the gas nozzle 270 first. Thereafter, when a negative voltage is applied to the rotatable cathode 260 by the power supply unit 280, the plasma P is formed by the plasma (P) forming gas supplied in the chamber 250, The plasma P collides with the Al target 264 wound on the outside of the rotatable cathode 260. As a result, Al carriers (metal charge carriers) that are generated are deposited on the substrate 200 that moves linearly in the chamber 250 to form the conductive layer 220 (see the bottom view of FIG. 2C).

Thereafter, a gas for forming the plasma (P) and a reactive gas are simultaneously supplied from the gas nozzle 270, and then a negative voltage is applied to the rotatable cathode 260 by the power supply unit 280. As a result, the secondary plasma generated in the chamber 250 collides with the Al target 264 wound around the outer circumference of the rotatable cathode 260, and the Al charged particle, the oxygen charged particle, the nitrogen charged particle, And a darkening layer 210 is formed on the conductive layer 220 deposited on the substrate 200 in which the charged particles such as aluminum oxide (AlO and AlO 2 ) charge carriers move linearly in the chamber 250 2C).

FIG. 2D is a schematic view of a linear cathode used in an apparatus for manufacturing a conductive structure having a conductive dark coloring layer according to an embodiment of the present invention shown in FIG. 2A. Referring to FIG.

2A and 2B, in an apparatus 201 for manufacturing a conductive structure having a conductive dark coloring layer according to an embodiment of the present invention shown in FIG. 2A, Instead of a rotating negative electrode 260 as shown in FIG. 5A, a fixed magnetic member 262; And an Al target 264 fixedly mounted on one surface (the lower surface in the embodiment of FIG. 2D) of the fixed magnetic member 262 are used. In this case, the power supply 280 is connected to the Al target 264 to supply a negative voltage to the Al target 264.

In the maturing layer 210 produced by the manufacturing apparatus 201 according to an embodiment of the present invention and the conductive structure including the maturing layer 210, the conductivity of the matting layer 210 is applied by the power supply device 280 Has a close relationship with the intensity of the power and the linear moving speed of the substrate 200.

More specifically, FIG. 2E is a chart showing the sheet resistance, reflectivity, chrominance, and degree of darkening of the darkening layer obtained under specific conditions according to an embodiment of the present invention by the deposition thickness.

Referring to FIG. 2E, with reference to FIGS. 2A to 2D, in an embodiment of the present invention, the power of the power supply 280 used is 6.0 Kw, and the gas for forming plasma P supplied from the gas nozzle 270 And a mixed gas composed of O 2 + N 2 (O 2 : N 2 = 85: 15) and O 2 gas were used as the reaction gas, respectively, and the flow rate of Ar gas was 200 sccm (Standard Cubic Centimeter per Minute) 5 sccm and 20 sccm were used. Under these conditions, the thickness, the sheet resistance, the reflectivity, the color difference, and the degree of darkening of the darkening layer deposited on the substrate 200 while changing the linear moving speed of the substrate 200 to 0.3, 0.2, 0.1 and 0.05 m / Were measured.

Referring to FIG. 2E, when the linear velocity of the substrate 200 is 0.3, 0.2, 0.1, and 0.05 m / min, the thickness of the darkening layer is 122, 235, 532 and 1,087 nm, respectively, The reflectivities at wavelengths of 450 nm, 550 nm, and 650 nm, respectively, were 8.07, 5.91, 4.58, and 3.66%, respectively. , The reflectance at wavelength 450 nm was 10.91, 6.31, 5.17 and 4.03%, respectively, and the reflectivities at wavelength 650 nm were 15.85, 6.26, 5.68 and 4.46%, respectively. The luminosity values (L *) were 39.86, 30.04, 27.21, and 23.00, respectively.

From the above-mentioned data, it can be seen that the darkening layer prepared according to an embodiment of the present invention has a lower sheet resistance and a higher conductivity as the thickness of the darkening layer is thicker, and the degree of darkening increases as the brightness value (L * , And the degree of darkening is realized from dark brown to black.

Meanwhile, the dark coloring layer produced according to one embodiment of the present invention according to the above-described data is formed such that the thickness of the dark coloring layer is 1,087 nm when the linear movement speed of the substrate 200 is 0.05 m / min. In this connection, in the prior art, it is described that the thickness of the matted pattern layer 110 corresponding to the matted layer 210 is preferably 10 nm or more and 400 nm or less, and considering the etching property, if the thickness is less than 10 nm Process control may not be easy, and if it exceeds 400 nm, it may be disadvantageous in terms of production speed. However, in the prior art, since the thickness of the conductive pattern layer 120 formed on the substrate 110 is 0.01 (i.e., 10 nm) or more and 10 (10,000 nm) or less, considering the thickness of the conductive pattern layer 120, It will be appreciated that the overall thickness of the conductive structure fabricated in accordance with one embodiment of the invention may be much thinner than the overall thickness of the prior art conductive structure.

2f is a graph comparing the characteristics of AlOxNy included in the conductive layer obtained by one embodiment of the present invention and AlOxNy contained in the darkening layer formed on the conductive layer and the conductive layer according to the prior art and the darkening layer formed thereon . That is, the embodiment of the present invention used in Fig. 2F is different from the prior art in that a darkening layer is formed on a conductive layer for comparison with a conductive structure having a conductive layer (conductive pattern layer) and a darkening layer formed on top of the conductive layer Conductive structures were used. It should be noted that in the table of FIG. 2F, since the same substrate (PET film) is used as the substrate constituting the conductive structure in both the embodiment of the present invention and the prior art, the data relating to the substrate is omitted.

Referring to FIG. 2F, the thicknesses of the conductive layers according to the present invention and the prior art are all equal to 100 nm, the thicknesses of AlOxNy constituting the matting layer are 122 and 75 nm, the sheet resistances are respectively 0.5 / square and, (L *) were 28.29 and 39.68, respectively. The degree of darkening was visually observed as black and blue black.

As can be seen from the chart of FIG. 2f, although the conductive structure in which the darkening layer is formed on the conductive layer is used in the embodiment of the present invention, the reflectivity, brightness value, and darkening degree of the AlOxNy Of AlOxNy according to the present invention is superior to that of AlOxNy of the prior art. Especially, in the sheet resistance term, AlOxNy of the present invention has a constant resistance value and has conductivity, whereas AlOxNy of the conventional art shows a value and does not have conductivity.

FIGS. 2G and 2H are graphs showing refractive indexes and absorption coefficients, respectively, of optical characteristics of a dark coloration layer obtained according to an embodiment of the present invention and a dark coloration layer according to the prior art.

Referring to Figures 2g and 2h, the refractive index and absorption coefficient of the maturing layer obtained by one embodiment of the present invention in the same wavelength range (390 to 750 nm) are in the range of approximately 1.25 to 1.55 and approximately 0.57 to 0.73, respectively, The refractive index and absorption coefficient of the darkening layer according to the technique ranges from approximately 1.80 to 2.30 and approximately 0.53 to 0.69, respectively.

As can be seen from the charts of FIG. 2G and FIG. 2H, the darkened layer of the present invention has a higher refractive index and lower reflectance than the prior art darkened layer, so that the function as a darkened layer is remarkably excellent.

Figures 2i and 2j show depth profile analysis data by a secondary ion mass spectrometer (SIMS) for a conductive structure obtained according to one embodiment of the present invention and a conductive structure according to the prior art, respectively .

Referring to FIGS. 2I and 2J, the conductive structure obtained according to an embodiment of the present invention is formed by directly depositing a darkening layer 210 having conductivity on a substrate 200, It can be seen that the conductive pattern layer 120 is formed on the conductive pattern layer 100 and the achromatic pattern layer 110 is formed on the conductive pattern layer 120.

In the conductive structure obtained by the embodiment of the present invention, the charge components of Al, O, AlO, and AlO 2 are detected in a substantially uniform and regular ratio along the depth of the matted layer 210, It can be seen that in the conductive structure according to the related art, the charge components of Al, O, AlO, and AlO 2 are detected at an irregular and irregular rate along the depth of the darkened pattern layer 110.

From the above-mentioned results, it can be seen that the oxide film is deposited as a dielectric, as the charge donor component of AlO and AlO 2 is detected in a nonuniform and irregular ratio, especially in the prior art, so that the darkening pattern layer 110 of the prior art has electric conductivity However, in the conductive structure obtained by the embodiment of the present invention, since the charged particle components of AlO and AlO 2 are detected at a uniform and regular ratio, such an oxide film is not deposited as a dielectric. The maturing layer 210 according to the example is considered to have electrical conductivity.

2K is a cross-sectional view schematically showing a case where the conductive structure according to an embodiment of the present invention is bonded to a flexible printed circuit board (FPCB).

Referring to FIG. 2K, a conductive structure according to an embodiment of the present invention includes a conductive layer 210 formed directly on a substrate 200 (see the upper part of FIG. 2K) Since the darkening layer 210 is formed by depositing the coloring layer 210 on the conductive coloring layer 210 and the conductive coloring layer 210 having the conductivity, The plurality of conductive balls 242 existing in one side of the flexible printed circuit board 240 are directly connected to the darkening layer 210 because the darkening layer 210 has conductivity when bonded to one side of the circuit board 240 It is possible. Therefore, the upper pressing force on one side of the flexible printed circuit board 240 does not need to be precisely controlled as compared with the prior art, and the magnitude of the upper pressing force is also significantly lower than in the prior art.

In addition, since the plurality of conductive balls 142 in the flexible printed circuit board 240 do not have to penetrate through the maturing layer 210, the possibility that a crack or the like may occur in the bonding portion 244, The possibility of occurrence of defects is remarkably reduced.

3A is a flowchart showing a method of manufacturing a conductive structure according to the first embodiment of the present invention.

Referring to FIG. 3A, a method 300 for fabricating a conductive structure according to a first embodiment of the present invention includes the steps of: a) using a gas nozzle 270 to form a plasma (P) Simultaneously supplying (310) gas into the chamber (250); b) forming a plasma (P) by a gas for forming plasma (P) by applying a negative voltage to a rotatable cathode (260) provided in the chamber (250) by a power supply unit ); And c) a charged particle generated by collision of the plasma (P) with a metal target (264) wound on the outside of the rotatable cathode (260) is applied to a substrate (200) linearly moving in the chamber (330) directly depositing a matting layer (210) on the substrate (200), wherein the matting layer (210) has conductivity.

The method 300 of fabricating a conductive structure according to the first embodiment of the present invention may further include the step of d) patterning the fine pattern electrodes on the dark coloring layer 210 by etching the dark coloring layer 210 can do.

3B is a flowchart showing a method of manufacturing a conductive structure according to a second embodiment of the present invention.

Referring to FIG. 3B, a method 300 of fabricating a conductive structure according to a second embodiment of the present invention includes the steps of: a) using a gas nozzle 270 to apply a gas for forming a plasma (P) (310) < / RTI > b) forming a plasma (P) by a gas for forming plasma (P) by applying a negative voltage to a rotatable cathode (260) provided in the chamber (250) by a power supply unit ); c) a metal charge particle generated by collision of the plasma P with a metal target 264 wound on the outside of the rotatable cathode 260 is applied to a substrate 200 linearly moving in the chamber 250 (330) a conductive layer (220) on the substrate (200); And d) a second plasma generated by simultaneously supplying the gas for forming the plasma (P) and a reactive gas into the chamber using the gas nozzle, collides with the metal target 264, Depositing on the conductive layer (220) formed on the substrate (200) linearly moving within the substrate (250) to form a matting layer (210), wherein the matting layer (210) .

The method 300 for fabricating a conductive structure according to the second embodiment of the present invention may further comprise the steps of: c1) etching the conductive layer 220 between steps c) and d) And patterning the fine pattern electrode.

In the method 300 for manufacturing a conductive structure according to the first and second embodiments of the present invention, the maturation layer 210 may be directly bonded to a flexible printed circuit board (FPCB).

In the method 300 for manufacturing a conductive structure according to the first and second embodiments of the present invention, the gas for forming the plasma (P) is Ar, the reaction gas is a mixture of O 2 + N 2 Gas or O 2 and N 2 gases.

In the method 300 for fabricating a conductive structure according to the first and second embodiments of the present invention, the metal target 264 is an Al target 264, and the charged particles are an Al-charged particle, A charge transfer member, a nitrogen charge transfer member, and an aluminum oxide charge transfer member.

Also, in the method 300 for manufacturing a conductive structure according to the first and second embodiments of the present invention, the power used by the power supply device 280 is 2 to 10 Kw, The speed may be between 0.05 and 0.3 m / min.

As described above, the conductive structure having the conductive dark coloring layer of the present invention, and the manufacturing apparatus and the manufacturing method of the conductive coloring layer according to the present invention can be used as follows: 1) the quenched dark coloring layer 210 has conductivity; 2) 3) it is possible to realize a thin-walled conductive structure as well as the use of a conductive pattern layer which is essentially used in a conventional conductive structure. (4) the manufacturing process and manufacturing cost of the conductive structure are reduced; (5) when the conductive layer is not used or used, the metal layer formed on the maturing layer 210 or the conductive layer 220 The visibility of the fine pattern is remarkably improved, 6) the defects that may occur in bonding between the conductive structure and the flexible printed circuit board (FPCB) are remarkably reduced, and 7) An advantage that the yield of the final product is remarkably improved is achieved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to be illustrative, of illustration, and not limitative of the invention, as various changes may be made therein without departing from the scope of the invention. It is not. Accordingly, the scope of the present invention should not be limited by the above-described exemplary embodiments, but should be determined only in accordance with the following claims and their equivalents.

100, 200: substrate 110, 130: darkening pattern layer 120: conductive pattern layer
140,240: flexible printed circuit board 142,242: conductive ball
144, 244: bonding section 201: conductive structure manufacturing apparatus
210: darkening layer 220: conductive layer 250: chamber
260: rotatable / linear cathode 262: stationary magnetic member 264: metal target
270: Gas nozzle 280: Power supply

Claims (17)

In the conductive structure,
materials; And
The darkening layer formed directly on the substrate
≪ / RTI >
The darkening layer has conductivity
Conductive structure. In the conductive structure,
materials;
A conductive layer formed on the substrate; And
The darkening layer formed on the conductive layer
≪ / RTI >
The darkening layer has conductivity
Conductive structure. 3. The method according to claim 1 or 2,
Wherein the darkening layer has a range of 122 to 1,087 nm. 3. The method according to claim 1 or 2,
Wherein a dark electrode pattern is formed on the dark coloring layer so that the dark coloring layer itself is used as an electrode. 3. The method according to claim 1 or 2,
Wherein one end side of the matted layer is directly bonded to one side of the flexible printed circuit board. An apparatus for manufacturing a conductive structure having a conductive dark color layer,
chamber;
A rotatable negative electrode provided inside the chamber and having a metallic target wound on the outside and a fixed magnetic member provided on the inside;
A power supply connected to the metal target and supplying a negative voltage;
A gas nozzle spaced apart from the rotatable cathode and provided in the chamber, for supplying a plasma and a reaction gas; And
Wherein the fixed magnetic member comprises a plurality of layers of magnetic material,
, ≪ / RTI &
A dark coloration layer is deposited directly on the substrate or deposited on a conductive layer formed on the substrate,
The darkening layer has conductivity
An apparatus for manufacturing a conductive structure having a conductive dark color layer. The method according to claim 6,
Wherein the rotatable negative electrode comprises: a fixed magnetic member; And the metal target fixedly mounted on one surface of the stationary magnetic member. The method according to claim 6,
The apparatus for manufacturing a conductive structure having the conductive matting layer may further include an etching apparatus for etching the matting layer to pattern the fine patterned electrode on the matting layer when the matting layer is directly deposited on the substrate Wherein the conductive coloring layer is formed of a conductive coloring layer. 9. The method according to any one of claims 6 to 8,
Wherein the electric power supply has an electric power of 2 to 10 Kw and a linear movement speed of the substrate is 0.05 to 0.3 m / min. 9. The method according to any one of claims 6 to 8,
Wherein the metal target is an Al target. A method of manufacturing a conductive structure,
a) simultaneously supplying a plasma forming gas and a reaction gas into a chamber using a gas nozzle;
b) applying a negative voltage to the rotatable cathode provided in the chamber by a power supply to form a plasma by the plasma forming gas; And
c) depositing a charged particle generated by collision of the plasma with a metal target wound on the outside of the rotatable cathode on a linearly moving substrate in the chamber to directly form a darkening layer on the substrate
, ≪ / RTI &
When the darkening layer has conductivity
A method of manufacturing a conductive structure. 12. The method of claim 11,
The method of fabricating a conductive structure may further include: d) etching the dark coloring layer to pattern the fine patterned electrode on the dark coloring layer. A method of manufacturing a conductive structure,
a) supplying a plasma forming gas into the chamber using a gas nozzle;
b) applying a negative voltage to the rotatable cathode provided in the chamber by a power supply to form a plasma by the plasma forming gas;
c) forming a conductive layer on the substrate by depositing a metal charge carrier generated by collision of the plasma with a metal target wound on the outside of the rotatable cathode on a linearly moving substrate in the chamber; And
d) moving a charged particle generated by collision of a secondary plasma formed by simultaneously supplying a gas for forming the plasma (P) and a reaction gas into the chamber using the gas nozzle, linearly moves in the chamber Depositing the conductive layer on the substrate to form a darkening layer
, ≪ / RTI &
When the darkening layer has conductivity
A method of manufacturing a conductive structure. 14. The method of claim 13,
Wherein the method of fabricating the conductive structure further comprises: c1) etching the conductive layer between the step c) and the step d) to pattern the fine pattern electrode on the conductive layer. 15. The method according to any one of claims 11 to 14,
Wherein the matting layer is directly bondable to a flexible printed circuit board. 15. The method according to any one of claims 11 to 14,
Wherein the plasma forming gas is Ar and the reactive gas is a mixed gas composed of O 2 + N 2 or O 2 and N 2 gas. 15. The method according to any one of claims 11 to 14,
Wherein the metal target is an Al target,
The charged particles include Al charge carriers, oxygen charge carriers, nitrogen charge carriers, and aluminum oxide charge carriers
A method of manufacturing a conductive structure.
KR1020150058321A 2015-04-24 2015-04-24 Conductive Structure Body Having Conductive Darkening Layer, and Manufacturing Apparatus and Method thereof KR20160127295A (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120100758A (en) 2011-03-04 2012-09-12 주식회사 엘지화학 Conductive structure body and method for preparing the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120100758A (en) 2011-03-04 2012-09-12 주식회사 엘지화학 Conductive structure body and method for preparing the same

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