KR20150142222A - Conductive structure body and method for manufacturing the same - Google Patents

Abstract

The present application relates to a conductive structure, and a manufacturing method thereof. According to an embodiment of the present application, the manufacturing method of the conductive structure comprises the following steps: forming a first layer including a nickel-based alloy on a substrate; forming a metal layer on the first layer; and forming a first layer pattern and a metal layer pattern by performing a parallel laser patterning process on the first layer and the metal layer.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a conductive structure,

The present application relates to a conductive structure and a method of manufacturing the same.

Generally, the touch screen panel can be classified as follows according to the signal detection method. That is, a resistive type in which a position depressed by a pressure in a state where a direct current voltage is applied is sensed through a change in a current or a voltage value, and a resistive type in which a capacitance coupling is used in a state in which an alternating voltage is applied There is a capacitive type and an electromagnetic type in which a selected position is sensed as a change in voltage while a magnetic field is applied.

Recently, as the need for a large area touch screen panel has increased, it has been necessary to develop a technology capable of realizing a large touch screen panel having excellent visibility while reducing electrode resistance.

Korean Patent Publication No. 10-2011-0054369

There is a need in the art to develop a technique for improving the performance of the various types of touch screen panels.

In one embodiment of the present application,

Forming a first layer comprising a nickel-based alloy on a substrate,

Forming a metal layer on the first layer, and

Forming a first layer pattern and a metal layer pattern by performing a parallel laser patterning process of the first layer and the metal layer

The present invention also provides a method of manufacturing a conductive structure.

Further, another embodiment of the present application provides a conductive structure produced by the method for manufacturing the conductive structure.

Still another embodiment of the present application provides a touch screen panel comprising the conductive structure.

The conductive structure according to one embodiment of the present application can be formed by using a parallel laser patterning process in a patterning process of a metal layer, a first layer, or the like, by using a mask, laser power, transmission of a substrate to various wavelengths, , The complex structure can be simplified and patterned more quickly than the conventional in-line laser patterning process, and single or multi-layer metal and transparent elements can be patterned.

In addition, the conductive structure according to one embodiment of the present application can realize good edge roughness of each pattern by using a parallel laser patterning process in the patterning process of the metal layer, the first layer, And there is a characteristic that the processing time can be saved.

Further, by using the conductive structure according to one embodiment of the present invention, a narrow bezel having improved durability can be introduced, and a touch screen panel including the narrow bezel can be developed.

1 and 2 are schematic views showing a laminated structure of a conductive structure according to an embodiment of the present application.
3 schematically shows a method of manufacturing a conductive structure according to an embodiment of the present application.
4 is a diagram schematically illustrating the transmittance of a conductive structure according to one embodiment of the present application.
FIGS. 5 to 12 schematically show pattern shapes of a conductive structure according to one embodiment of the present application. FIG.
DESCRIPTION OF THE REFERENCE NUMERALS
100: substrate
200: metal layer
220: Second layer
300: 1st layer

The present application will be described in more detail below.

In this specification, the term " display device " refers to a television, a computer monitor, or the like, and includes a display element for forming an image and a case for supporting the display element.

Examples of the display device include a plasma display panel (PDP), a liquid crystal display (LCD), an electrophoretic display, a cathode ray tube (CRT), and an OLED display . The display element may be provided with an RGB pixel pattern for image implementation and an additional optical filter.

Meanwhile, as the spread of smart phones, tablet PCs, IPTVs, and the like is accelerated in connection with display devices, there is a growing need for a touch function in which a human hand becomes a direct input device without a separate input device such as a keyboard or a remote control. In addition, there is a demand for a multi-touch function capable of not only a specific point recognition but also writing.

Most commercial touch screen panels (TSPs) are based on transparent conductive ITO thin films, but when applied to a large area touch screen panel, the relatively high sheet resistance of the ITO transparent electrode itself (at least 150 Ω / □, Nitto the speed of the touch recognition is slowed due to the RC delay caused by the ELECRYSTA manufactured by Denko Co., Ltd., and an additional compensation chip is required to overcome this problem.

The present inventors have studied a technique for replacing the transparent ITO thin film with a metal fine pattern. The present inventors have found that when a metal thin film having a high electrical conductivity is used as an electrode of a touch screen panel and a microelectrode pattern of a specific shape is to be realized, It has been found out that there is a problem that it is perceived by the eyes and that glare may occur due to high reflectance and haze value against external light. In addition, it has been found out that there are many cases where an expensive target value is involved in the manufacturing process or that the process is complicated in many cases.

In addition, when a metal fine line is used as a transparent electrode, the most problematic point is the reflection color. Because of the inherent luster of the metal, visibility problems such as sparkling due to external light sources can occur, so that additional layers can be formed on the metal surface to reduce reflectivity.

In addition, ITO transparent electrodes are mainly used in manufacturing touch screen panels. Typically, an ITO transparent electrode is used for a screen portion of a touch screen panel, and a metal such as Ag or Cu having a relatively small resistance is used for a wiring portion. Recently, a demand for a narrow bezel There is an increasing demand for ITO metal deposited films.

Conventionally, a photolithography process, a wet etching process, or the like has been used for patterning the ITO metal deposited film. However, in the wet etching process, it is difficult to realize the pattern by the added metal (Ni, Cr, Mo, etc.) in order to improve the corrosion resistance, and even if the pattern is implemented, It is difficult to obtain good edge roughness.

Thus, the present application aims to provide a method of manufacturing a conductive structure capable of realizing good edge roughness, relatively simple process, and increased production speed, and a conductive structure manufactured therefrom.

A method of manufacturing a conductive structure according to an embodiment of the present application includes the steps of forming a first layer including a nickel-based alloy on a substrate, forming a metal layer on the first layer, And a metal layer is subjected to a parallel laser patterning process to form a first layer pattern and a metal layer pattern.

Further, in the present application, it may further include forming a transparent conductive layer on the substrate before the step of forming the first layer.

Further, in the present application, after the step of forming the metal layer, a step of forming a second layer containing a nickel-based alloy on the metal layer may be further included.

That is, not only the first layer pattern and the metal layer pattern but also the transparent conductive layer pattern and the second layer pattern can be formed by the parallel laser patterning process.

In the present application, the parallel laser patterning process can have no influence on chemical reactivity, can realize good edge roughness according to the condition adjustment, and is relatively simple in process compared with the conventional wet etching process, There is a feature that can increase the process speed.

At present, most of the patterning processes using lasers are in series. However, such a series type laser patterning process may take a longer time than the parallel laser patterning process, and may adversely affect the substrate, the metal layer, and the like, which is not preferable.

In the present application, by using a parallel laser patterning process in forming the transparent conductive layer pattern, the metal layer pattern, the first layer pattern, and the second layer pattern, a complex structure can be simply and rapidly patterned And a single layer or multilayer metal or transparent element can be patterned.

The parallel laser patterning process may be performed by irradiating a pulsed laser beam on the opposite surface of the substrate on which the first layer is formed. The process of irradiating the laser beam can use a method known in the art, and more specific process conditions are described in the following embodiments.

In the present application, the transparent conductive layer may include at least one selected from the group consisting of indium oxide, zinc oxide, indium tin oxide, indium zinc oxide, and transparent conductive polymer, but is not limited thereto.

The thickness of the transparent conductive layer may be 15 to 20 nm according to the material for the transparent conductive layer, but is not limited thereto.

The transparent conductive layer may be formed using a deposition process or a printing process on a substrate using the above-described material for a transparent conductive layer. The substrate is not particularly limited, and materials known in the art can be used. For example, glass, a plastic substrate, a plastic film, and the like can be used, but the present invention is not limited thereto.

In the present application, the metal layer can be formed using a method known in the art. For example, evaporation, sputtering, wet coating, evaporation, electrolytic plating, electroless plating, or the like.

The metal layer may include at least one selected from the group consisting of copper, aluminum, silver, neodymium, molybdenum, nickel, chromium, titanium, palladium and alloys thereof. In particular, the metal layer may include copper or silver, oxides thereof, nitrides thereof, and the like, but is not limited thereto.

Further, the metal layer may be formed by a printing method. When the metal layer is formed by a printing method, an ink or a paste containing a metal may be used. In addition to the metal, the paste may further include a binder resin, a solvent, a glass frit, and the like.

Although the thickness of the metal layer is not particularly limited, it is preferable that the metal layer has a thickness of 0.01 to 30 占 퐉 in terms of the conductivity of the metal layer and the economical efficiency of the pattern forming process.

The first or second layer comprising the nickel-based alloy may be formed using methods known in the art. For example, evaporation, sputtering, wet coating, evaporation, electrolytic plating, electroless plating, or the like.

The nickel-based alloy may be an alloy including at least one element selected from the group consisting of nickel, Fe, Co, Ti, V, Al, Au, Cu, Ag, Ni, Mo and Cr. no. In particular, the nickel-based alloy may be Ni-Mo, Ni-Cr, Ni-Cr-Mo, Ni-Fe-Cr or Ni-Cr-Si.

When the nickel-based alloy is Ni-Mo, the content of Mo is 10 to 40% by weight based on the total weight of Ni-Mo, and the content of Ni may be in the range of the remaining amount, but is not limited thereto. When the nickel-based alloy is Ni-Cr, the content of Cr is 10 to 40% by weight based on the total weight of Ni-Cr, and the content of Ni may be in the range of the remaining amount, but is not limited thereto. When the nickel-based alloy is Ni-Cr-Mo, the contents of Cr and Mo are each independently 5 to 30% by weight based on the total weight of Ni-Cr-Mo, and the content of Ni is in the range of the remaining amount But is not limited thereto. When the nickel-based alloy is Ni-Fe-Cr, the content of Fe may be 20 to 40 wt% based on the total weight of Ni-Fe-Cr, and the content of Cr may be 10 to 30 wt% , The content of Ni may be in the range of the remaining amount, but is not limited thereto. When the nickel-based alloy is Ni-Cr-Si, the content of Cr may be 10 to 30% by weight, the content of Si may be 1 to 10% by weight based on the total weight of Ni-Cr-Si, May be in the range of the remaining amount, but is not limited thereto.

The first layer or the second layer containing the nickel-based alloy may be formed by a printing method. In the case where the first layer or the second layer containing the nickel-based alloy is formed by a printing method, an ink or paste containing a nickel-based alloy may be used. In addition to the nickel-based alloy, the paste may contain a binder resin, Glass frit, and the like.

The thickness of the first layer or the second layer including the nickel-based alloy may be 10 to 100 nm, but is not limited thereto.

The first layer and the second layer may include the same material or may include materials that are different from each other.

In this application, the transparent conductive layer pattern, the metal layer pattern, and the first layer pattern can be formed by independently performing the laser patterning process in parallel on the transparent conductive layer, the metal layer, the first layer and the second layer. That is, the transparent conductive layer pattern, the metal layer pattern, and the first layer pattern may be formed by simultaneously performing the laser patterning process on the transparent conductive layer, the metal layer, the first layer, and the second layer, , And the first layer may be individually subjected to a parallel laser patterning process to form a transparent conductive layer pattern, a metal layer pattern, a first layer pattern, and a second layer pattern.

The line width of the metal layer pattern may be more than 0 but 50 탆 or less, more than 0 and 30 탆 or less, but is not limited thereto. The first layer pattern or the second layer pattern may have the same pattern as the metal layer pattern. However, it is not necessary that the scale of the first layer pattern or the second layer pattern is completely equal to the metal layer pattern, and when the line width of the first layer pattern or the second layer pattern is narrower or wider than the line width of the metal layer pattern Are also included in the scope of the present application. Specifically, the line width of the first layer pattern or the second layer pattern may be 80 to 120% of the line width of the metal layer pattern. Alternatively, the area of the first layer pattern or the second layer pattern may be 80 to 120% of the area of the metal layer pattern. More specifically, the shape of the first layer pattern or the second layer pattern is preferably a pattern shape having a line width equal to or larger than the line width of the metal layer pattern.

Further, another embodiment of the present application provides a conductive structure produced by the method for manufacturing the conductive structure.

Examples of the conductive structure according to one embodiment of the present application are illustrated in Figs. 1 and 2. Fig. FIGS. 1 and 2 are for illustrating the stacking sequence of the transparent conductive layer, the metal layer and the first layer, and the transparent conductive layer, the metal layer, and the first layer are actually used for a transparent electrode such as a touch screen panel, But may be in the form of a pattern.

Referring to FIG. 1, a first layer 300 is disposed on a substrate 100, and the metal layer 200 is disposed on the first layer 300.

2, a first layer 300 is disposed on a substrate 100, the metal layer 200 is disposed on the first layer 300, and the second layer 300 220) are arranged in the same manner as in the first embodiment.

In the present application, the first layer or the second layer including the nickel-based alloy may serve as an oxidation preventing layer, a corrosion preventing layer, or the like.

In one embodiment of the present application, the conductive structure may have a sheet resistance of 1 Ω / □ or more and 300 Ω / □ or less, specifically 1 Ω / □ or more and 100 Ω / □ or less, more specifically 1 Ω / □ Or more and 50 Ω / □ or less, and more specifically, 1 Ω / □ or more and 20 Ω / □ or less.

If the sheet resistance of the conductive structure is 1 Ω / □ or more and 300 Ω / □ or less, it is possible to replace the conventional ITO transparent electrode. In the case where the sheet resistance of the conductive structure is 1 Ω / □ or more and 100 Ω / □ or less, or 1 Ω / □ or more and 50 Ω / □ or less, especially 1 Ω / □ or more and 20 Ω / □ or less, Since the surface resistance is considerably low, the RC delay is shortened when the signal is applied, and the speed of the recognition of the touch can be remarkably improved. Thus, it is easy to apply the large-sized touch screen of 10 inches or more.

One embodiment of the present application provides a touch screen panel comprising the conductive structure. For example, in a capacitive touch screen panel, another conductive structure in one embodiment of the present application can be used as a touch sensitive electrode substrate. In particular, the conductive structure is more preferably applied to a wiring portion such as a bezel electrode in a touch screen panel, but the present invention is not limited thereto.

The touch screen panel according to one embodiment of the present application may further include an additional structure in addition to the above-described conductive structure. In this case, the two structures may be arranged in the same direction, or the two structures may be arranged in directions opposite to each other. When two or more structures are included, an insulating layer may be provided therebetween. At this time, the insulating layer may be further given the function of the adhesive layer.

A touch screen panel according to one embodiment of the present application includes a lower substrate; An upper substrate; And an electrode layer provided on at least one side of a surface of the lower substrate contacting the upper substrate and a surface of the upper substrate contacting the lower substrate. The electrode layers can perform X-axis position detection and Y-axis position detection functions, respectively.

An electrode layer provided on a surface of the lower substrate and an upper substrate of the lower substrate; And one or both of the upper substrate and the electrode layer provided on the surface in contact with the lower substrate of the upper substrate may be a conductive structure according to one embodiment of the presently filed application.

When an electrode layer is formed on one surface of both the upper substrate and the lower substrate to form a two-layer electrode layer, an insulating layer or a spacer is interposed between the lower substrate and the upper substrate so as to maintain a constant interval between the electrode layers and prevent connection. . The insulating layer may include a pressure-sensitive adhesive or a UV or thermosetting resin. The touch screen panel may further include a ground portion connected to the pattern of the conductive layer in the conductive structure. For example, the ground portion may be formed at the edge portion of the surface of the substrate on which the pattern of the conductive layer is formed. In addition, at least one of an antireflection film, a polarizing film, and an inner fingerprint film may be provided on at least one side of the laminate including the conductive structure. But may further include other types of functional films other than the above-described functional films according to design specifications. The touch screen panel may be applied to a display device such as an OLED display panel, a liquid crystal display (LCD), a cathode ray tube (CRT), and a plasma display panel (PDP).

Hereinafter, the present invention will be described in more detail with reference to Examples, Comparative Examples and Experimental Examples. However, the following Examples, Comparative Examples and Experimental Examples are provided for illustrating the present invention, and thus the scope of the present invention is not limited thereto.

< Example >

< Experimental Example  1 to 3>

A first layer including Ni-Cr, Ni-Mo or Ni-Cr-Mo is formed as a nickel-based alloy on a glass substrate, and a parallel laser patterning process is performed on the first layer to form a first layer pattern .

A Nd: YAG laser was used for the parallel laser patterning process, and more specific conditions are as follows.

1) Wavelength (?): 355 nm

2) Pulse E _max : 280 mJ

3) w (ns): 6

4) Beam size: 9mm

5) Repetition rate: 10Hz

The shape of the pattern measured in the reflection mode of the first layer including the Ni-Cr prepared above is shown in FIG. 5, and the pattern measured in the transmission mode is shown in FIG.

The shape of the pattern measured in the reflection mode of the first layer including the Ni-Mo produced above is shown in FIG. 7, and the pattern measured in the transmission mode is shown in FIG.

The shape of the pattern measured in the reflective mode of the Ni-Cr-Mo-containing first layer is shown in Fig. 9, and the pattern measured in the transmissive mode is shown in Fig.

< Experimental Example  4>

Cu was deposited on the Ni-Cr-containing first layer to form a conductive structure.

The shape of the pattern measured in the reflection mode of the conductive structure is shown in FIG. 11, and the shape of the pattern measured in the transmission mode is shown in FIG.

The permeability of the conductive structure according to one embodiment of the present application is schematically shown in Fig.

The conductive structure according to one embodiment of the present application can be formed by using a parallel laser patterning process in a patterning process of a metal layer, a first layer, or the like, by using a mask, laser power, transmission of a substrate to various wavelengths, , The complex structure can be simplified and patterned more quickly than the conventional in-line laser patterning process, and single or multi-layer metal and transparent elements can be patterned.

In addition, the conductive structure according to one embodiment of the present application can realize good edge roughness of each pattern by using a parallel laser patterning process in the patterning process of the metal layer, the first layer, And there is a characteristic that the processing time can be saved.

Further, by using the conductive structure according to one embodiment of the present invention, a narrow bezel having improved durability can be introduced, and a touch screen panel including the narrow bezel can be developed.

Claims (14)

Forming a first layer comprising a nickel-based alloy on a substrate,
Forming a metal layer on the first layer, and
Forming a first layer pattern and a metal layer pattern by performing a parallel laser patterning process of the first layer and the metal layer
&Lt; / RTI &gt; The method of claim 1, further comprising forming a transparent conductive layer on the substrate prior to forming the first layer. The method of claim 1, further comprising forming a second layer comprising a nickel-based alloy on the metal layer after the step of forming the metal layer. The method according to claim 1, wherein the parallel laser patterning step comprises:
And irradiating a pulsed laser beam on the opposite surface of the substrate with the first layer formed thereon. The nickel-based alloy according to claim 1, wherein the nickel-based alloy is an alloy containing at least one element selected from the group consisting of nickel, Fe, Co, Ti, V, Al, Au, Cu, Ag, Ni, Of the conductive structure. The method of manufacturing a conductive structure according to claim 1, wherein the nickel-based alloy is Ni-Mo, Ni-Cr, Ni-Cr-Mo, Ni-Fe-Cr, or Ni-Cr-Si. The conductive structure according to claim 1, wherein the metal layer comprises at least one selected from the group consisting of copper, aluminum, silver, neodymium, molybdenum, nickel, chromium, titanium, palladium and alloys thereof. Way. [3] The method of claim 2, wherein the transparent conductive layer comprises at least one selected from the group consisting of indium oxide, zinc oxide, indium tin oxide, indium zinc oxide, and transparent conductive polymer. The method according to claim 2, wherein the transparent conductive layer has a thickness of 15 to 20 nm. The method according to claim 1, wherein the metal layer has a thickness of 0.01 to 30 μm. [4] The method of claim 3, wherein the thickness of the first layer or the second layer is 10 to 100 nm. A conductive structure produced by the method of manufacturing an electrically conductive structure according to any one of claims 1 to 11. 13. The conductive structure according to claim 12, wherein the sheet resistance of the conductive structure is not less than 1 [Omega] / square and not more than 300 [Omega] / square. A touch screen panel comprising the conductive structure of claim 12.

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