KR20160114426A - Method of manufacturing transfer film for transparent window - Google Patents

Method of manufacturing transfer film for transparent window Download PDF

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Publication number
KR20160114426A
KR20160114426A KR1020150040917A KR20150040917A KR20160114426A KR 20160114426 A KR20160114426 A KR 20160114426A KR 1020150040917 A KR1020150040917 A KR 1020150040917A KR 20150040917 A KR20150040917 A KR 20150040917A KR 20160114426 A KR20160114426 A KR 20160114426A
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KR
South Korea
Prior art keywords
mold
layer
molding
pattern
material layer
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Application number
KR1020150040917A
Other languages
Korean (ko)
Inventor
박정문
Original Assignee
박정문
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Publication date
Application filed by 박정문 filed Critical 박정문
Priority to KR1020150040917A priority Critical patent/KR20160114426A/en
Publication of KR20160114426A publication Critical patent/KR20160114426A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/262Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used recording or marking of inorganic surfaces or materials, e.g. glass, metal, or ceramics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00Inking and printing with a printer's forme
    • B41M1/12Stencil printing; Silk-screen printing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/12Transfer pictures or the like, e.g. decalcomanias
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/382Contact thermal transfer or sublimation processes

Abstract

A method of manufacturing a transfer film for transferring an ink pattern to a transparent window for a display device is disclosed. A method of manufacturing a transfer film includes sequentially forming an ink pattern layer and a molding material layer on a release fabric; Forming the molding material layer as a molding pattern layer by UV molding; And forming an adhesive layer on the molding pattern layer.

Description

TECHNICAL FIELD [0001] The present invention relates to a transparent transfer film for transparent window,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a transfer film, and more particularly, to a method of manufacturing a transfer film for transferring an ink pattern to a transparent window for a display device.

In a display device such as a cellular phone, a tablet PC, and a monitor, a transparent window for protecting a liquid crystal screen and the like is provided outside the display device. In general, It is printed. For example, the ink pattern along the edge portion of the transparent window may be printed with a predetermined color such as black, white, or the like. Conventionally, a method of directly printing an ink pattern on a transparent window for a display device has been widely used. Recently, a method using a transfer film on which an ink pattern has been formed is getting popular.

An embodiment of the present invention provides a method of manufacturing a transfer film for transferring an ink pattern to a transparent window for a display device.

In one aspect of the present invention,

Sequentially forming an ink pattern layer and a molding material layer on the deformed circle;

Forming the molding material layer as a molding pattern layer by UV molding; And

And forming a pressure-sensitive adhesive layer on the molding pattern layer.

The ink pattern layer and the molding material layer may be formed by screen printing. And a step of depositing the molding pattern layer and the adhesive layer.

The step of forming the molding pattern layer by the UV molding includes: a step of bringing a mold including a mold substrate and a mold pattern into close contact with the molding material layer; And forming the molding pattern layer by irradiating UV onto the molding material layer to cure the molding material layer.

An alignment mark may be formed on the release mold and the mold substrate, respectively. The mold pattern may be in close contact with the molding material layer, and a pattern corresponding to the pattern of the mold pattern may be formed on one surface of the molding material layer.

The method may further include a step of bringing the mold pattern into close contact with the molding material layer, and then removing bubbles generated between the mold pattern and the molding pattern layer. The UV may be irradiated to the molding material layer through the mold.

The step of forming the molding pattern layer by the UV molding may include the steps of: adhering the mold material layer to a mold including a mold substrate and a mold pattern; And forming the molding pattern layer by irradiating UV onto the molding material layer to cure the molding material layer.

The method may further include a step of bringing the molding material layer into close contact with the mold pattern, and then removing bubbles generated between the molding material layer and the mold pattern. The UV may be irradiated to the molding material layer through the mold.

According to the embodiment of the present invention, the molding material layer on which the UV molding process is performed is not applied to the entire surface of the release mold but is formed only in a desired area on the release mold using screen printing, So that the manufacturing process of the transfer film can be simplified. In addition, the molding process can be performed more accurately by forming the alignment marks on the mold release mold and the mold substrate respectively and aligning the mold release mold and the mold substrate using the alignment camera. Further, after the molding pattern layer is formed, the adhesive layer can be also printed on only the desired area by screen printing.

Figs. 1 to 3 show a step of transferring a transfer film to a transparent window.
4 is a flow chart schematically showing a method of manufacturing a transfer film according to an exemplary embodiment of the present invention.
5A to 11B are views illustrating a method of manufacturing a transfer film according to an exemplary embodiment of the present invention.
12A to 16B are views illustrating a method of manufacturing a transfer film according to another exemplary embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments illustrated below are not intended to limit the scope of the invention, but rather are provided to illustrate the invention to those skilled in the art. In the drawings, like reference numerals refer to like elements, and the size and thickness of each element may be exaggerated for clarity of explanation. Further, when it is described that a certain material layer is present on a substrate or another layer, the material layer may be present directly on the substrate or another layer, and there may be another third layer in between. In the following embodiments, the materials constituting each component are illustrative, and other materials may be used.

FIGS. 1 to 3 show a process of transferring the transfer film 100 onto the transparent window W. FIG.

FIG. 1 shows a state in which a transfer film 100 is attached to a transparent window W, and FIG. 2 shows a cross section of FIG.

1 and 2, the transparent window W can be used, for example, in a mobile device such as a mobile phone or a tablet PC, or a display device such as a monitor. As the transparent window W used in such a display device, for example, a glass substrate, a sapphire substrate, a plastic substrate, or the like can be used. In addition, substrates of various materials can be used.

And is provided on the transfer film 100 below the transparent window W. The transfer film 100 includes a release fabric 110 and an ink pattern layer 120, a molding pattern layer 130 and an evaporation layer 130 sequentially formed on the upper surface of the release fabric 110 a deposition layer 140, and an adhesive layer 150. Here, as the release fabric 110, a flexible plastic substrate may be used. For example, a PET (Polyethylene Terephthalate) substrate may be used as the release fabric 110, but this is merely exemplary and various other materials may be used. The upper surface of the release fabric 110 may be subjected to release treatment and coating so as to be easily separated from the ink pattern layer 120 after the transfer process.

The ink pattern layer 120 is formed on the upper surface of the release fabric 110 in a predetermined shape. For example, the ink pattern layer 120 may be formed along the edge of the release fabric, but it is not limited thereto and may be formed in various other forms. In addition, the ink pattern layer 120 may have various colors such as black, white, and the like.

On the upper surface of the ink pattern layer 120, a molding pattern layer 130 is formed. Such a molding pattern layer can be formed by a UV molding process including a molding process and a UV curing process as described later. A pattern 130a of a predetermined shape may be formed on the upper surface of the molding pattern layer 130 so as to feel an aesthetic feeling. For example, a hairline pattern may be formed on the upper surface of the molding pattern layer 130. However, the present invention is not limited thereto, and various patterns may be formed on the upper surface of the molding pattern layer 130.

The deposition layer 140 may be further formed on the upper surface of the molding pattern layer 130. Here, the deposition layer 140 serves to express high-quality texture due to deposition or to display various colors such as blue and yellow. The adhesive layer 150 may be formed on the upper surface of the deposition layer 140. The adhesive layer 150 may enhance the adhesion of the transfer film 100 to the transparent window W. The transfer process is completed when the transfer film 100 is attached to the lower surface of the transparent window W in the state shown in FIGS. 1 and 2 and then the release material 110 is removed from the ink pattern layer 120.

Fig. 3 shows a state in which the transfer process is completed in the transparent window W. Fig. 3, an adhesive layer 150, a deposition layer 140, a molding pattern layer 130, and an ink pattern layer 120 are sequentially formed on the lower surface of the transparent window W.

Hereinafter, a method of manufacturing the above-described transfer film 100 will be described. 4 is a flow chart schematically showing a method of manufacturing a transfer film according to an exemplary embodiment of the present invention.

Referring to FIG. 4, first, a release fabric is prepared, and then an ink pattern layer is formed on the release fabric 210 (210). Next, a molding material layer is formed on the ink pattern layer (220). Then, the molding material layer is formed as a molding pattern layer by UV molding (230). A deposition layer is formed 240 on the molding pattern layer thus formed, and an adhesive layer 250 is formed on the deposition layer 250, thereby completing the transfer film 260.

Hereinafter, a method of manufacturing the above-described transfer film will be described in more detail.

5A to 11B are views illustrating a method of manufacturing a transfer film according to an exemplary embodiment of the present invention.

5A is a perspective view showing a state in which an ink pattern layer 320 and a molding material layer 330 'are sequentially formed on a release fabric 310. 5B is a sectional view taken along a line I-I 'in FIG. 5A, and FIG. 5C is a sectional view taken along a line II-II' in FIG. 5A.

Referring to FIGS. 5A to 5C, the release fabric 310 is first prepared. As the release fabric 310, a flexible plastic substrate may be used. For example, a PET (Polyethylene Terephthalate) substrate may be used as the release fabric 310, but this is merely exemplary and a substrate of various materials may be used.

At least one alignment mark 311 may be formed on the release mold 310 so that the molding process described below may be performed at a more accurate position. The alignment mark 311 may be located, for example, on the outer edge of the release fabric 310, but is not limited thereto. On the other hand, the top surface of the release fabric 310 may be subjected to a release process and a coating process so as to be easily separated from the ink pattern layer 320 formed thereon after the transfer process.

The ink pattern layer 320 is formed on the upper surface of the release fabric 310. The ink pattern layer 320 may be formed in a predetermined shape on the upper surface of the release material 310 by, for example, screen printing. 5A illustrates an example in which the ink pattern layer 320 is formed in a rectangular shape along the outer edge of the release fabric 310. In addition, the ink pattern layer 320 may be formed in various shapes according to a desired design . In addition, the ink pattern layer 320 may be formed to have various colors such as black, white, and the like.

Next, a molding material layer 330 'is formed on the upper surface of the ink pattern layer 320. Here, the molding material layer 330 'may be formed in a shape corresponding to the ink pattern layer 320. The molding material layer 330 'may be formed on the upper surface of the ink pattern layer 320 by, for example, screen printing, as in the ink pattern layer 320. The molding material layer 330 'is formed of a molding pattern layer 330 through an UV molding process, that is, a molding process and a UV curing process, as described later. Accordingly, in this embodiment, the molding material layer 330 'may be made of a material that has a constant viscosity to enable a molding process, and can be cured by UV irradiation to enable a UV curing process.

6A is a perspective view illustrating a mold 500 for performing a molding process on the molding material layer 330 '. 6B is a cross-sectional view taken along line III-III 'of FIG. 6A, and FIG. 6C is a cross-sectional view taken along line IV-IV' of FIG. 6A.

6A to 6C, a mold 500 for performing a molding process is prepared. Here, the mold 500 is a soft material, and may include a mold substrate 510 and a mold pattern 520 formed on the mold substrate 510. In addition, the mold substrate 510 and the mold pattern 520 may include a material that is transparent to UV for the UV curing process described below. In addition, at least one alignment mark 511 may be formed on the mold substrate 510 corresponding to the alignment mark 311 of the release fabric 310 as described above. The alignment mark 511 may be formed on the outer periphery of the mold substrate, for example, but is not limited thereto.

The mold pattern 520 may have a shape corresponding to the molding material layer 330 'formed on the mold release fabric 310 described above. In addition, the surface of the mold pattern 520 may be formed with a concavo-convex structure in a predetermined pattern capable of feeling a sense of beauty. For example, a hairline pattern may be formed on the surface of the mold pattern 520. However, the present invention is not limited thereto, and various patterns can be formed.

7A and 7B are cross-sectional views illustrating a molding process in which the mold 500 is closely contacted with the release fabric 310 having the ink pattern layer 320 and the molding material layer 330 '. Figs. 7A and 7B are cross-sectional views corresponding to Figs. 5B and 5C or Figs. 6B and 6C. The same applies to the following drawings.

7A and 7B, a mold 500 is placed on an upper portion of a mold release surface 310 on which an ink pattern layer 320 and a mold material layer 330 'are formed. Then, Layer 330 '. To this end, an elevating module 610 is provided on the upper part of the mold 500 so as to move the mold 500 up and down. An alignment camera 620 may further be provided on one side of the mold 500 to perform an alignment process for more accurately aligning the mold 310 and the mold 500.

The alignment mark 311 formed on the release fabric 310 is aligned with the alignment mark 511 formed on the mold substrate 510 through the alignment camera 620 and then the lift module 610 The mold 500 is lowered to bring the mold 500 into close contact with the molding material layer 330 'formed on the release mold 310. In this molding process, the mold pattern 520 can be closely contacted while applying a constant pressure to the molding material layer 330 'formed on the release fabric 310. Since the mold material layer 330 'includes a material having a predetermined viscosity as described above, the surface of the mold material layer 330' closely contacting the mold pattern 320 (in FIGS. 7A and 7B, A pattern corresponding to the pattern 520a formed on the mold pattern 520 may be formed. For example, a hairline pattern or the like may be formed on the surface of the molding material layer 330 '.

8A and 8B show a state in which the mold pattern 520 and the molding material layer 330 'are formed in a state in which the mold 500 is in close contact with the release fabric 310 having the ink pattern layer 320 and the molding material layer 330' As shown in FIG.

7A and 7B, when the mold 500 is brought into close contact with the release material 310 having the ink pattern layer 320 and the molding material layer 330 'formed thereon, Bubbles may be generated between the material layer 330 'and the mold pattern 520. 8A and 8B, a pressure roller 710 is provided on the upper surface of the mold 500, specifically, the mold substrate 510, and then the pressure roller 710 The bubbles generated between the mold pattern 520 and the molding material layer 330 'may be removed by moving the mold pattern 510 along the upper surface of the mold substrate 510 while applying pressure to the mold pattern 520.

FIGS. 9A and 9B are cross-sectional views showing a state in which a UV curing process is performed on the molding material layer 330 'after the molding process.

9A and 9B, a mold 500 is closely adhered to an original material 310 having an ink pattern layer 320 and a molding material layer 330 ' UV is applied to the molding material layer 330 '. As described above, since the mold 500 includes a material that is permeable to UV, the UV irradiation device is provided on the upper side of the mold 500 and irradiates the molding material layer 330 'through the mold 500 . In the case where the release fabric 310 and the ink pattern layer 320 are made of a material having transparency to UV, UV is applied to the molding material layer 330 'through the release fabric 310 and the ink pattern layer 320 It is also possible to be investigated. The mold material layer 330 ', which has undergone the molding process by the UV irradiation, is cured and changed into the molding pattern layer 330. That is, since the mold material layer 330 'includes a material that is cured by UV irradiation, when the mold material layer 330' is irradiated with UV through the mold 500, the mold pattern layer 330 is cured, As shown in FIG. After this UV irradiation process is performed, the mold 500 is removed from the molding pattern layer 330.

10A is a perspective view showing a state in which a molding pattern layer 330 is formed on a mold release end 310. FIG. FIG. 10B is a cross-sectional view taken along the line V-V 'of FIG. 10A, and FIG. 10C is a cross-sectional view taken along line VI-VI' of FIG. 10A.

10A to 10C, an ink pattern layer 320 is formed on a mold releasing layer 310, and a molding pattern layer 330 is formed on the ink pattern layer 320. Here, the molding pattern layer 330 may be formed by performing an UV molding process, that is, a molding process and a UV curing process, on the molding material layer 330 'as described above. A pattern 330a corresponding to the pattern 520a of the mold pattern 520, for example, a hairline pattern or the like is formed on the surface of the molding pattern layer 330 (upper surfaces in FIGS. 10A to 10C) .

FIGS. 11A and 11B are cross-sectional views illustrating a state in which a deposition layer 340 and an adhesive layer 350 are sequentially formed on a molding pattern layer 330. FIG.

11A and 11B, a UV patterning process is performed to form a molding pattern layer 330 and a deposition layer 340 and an adhesive layer 350 are sequentially formed on the upper surface of the molding pattern layer 330 . Here, the vapor deposition layer 340 may enhance the texture of the vapor deposition, or may display a variety of colors such as blue and yellow. The deposition layer 340 may be formed on the upper surface of the molding pattern layer 330. However, the present invention is not limited thereto, and the deposition layer 340 may be formed by depositing an uneven material 310 on which the molding pattern layer 330 is formed, and then removing unnecessary portions.

The adhesive layer 350 can serve to strengthen the adhesion of the transfer film (100 in Fig. 1) to the transparent window (W in Fig. 1). The adhesive layer 350 may be formed on the upper surface of the deposition layer 340 by screen printing after the deposition layer 340 is formed. However, it is not necessarily limited thereto,

As described above, according to the present embodiment, the molding material layer 330 'on which the UV molding process is performed is not applied to the entire surface of the release mold 310, It is not necessary to perform a post-process for removing unnecessary portions, so that the manufacturing process of the transfer film can be simplified. The alignment marks 311 and 511 are formed on the mold 310 and the mold substrate 510 and the mold 310 and the mold substrate 510 are aligned with each other using the alignment camera 620, Can be performed more accurately. Also, after the molding pattern layer 330 is formed, the deposition layer 340 may be formed thereon, and the adhesive layer 350 may be printed only on a desired area using screen printing.

12A to 16B are views illustrating a method of manufacturing a transfer film according to another exemplary embodiment of the present invention.

In this embodiment, the ink pattern layer 320 and the molding material layer 330 'are sequentially formed on the release fabric 310 as shown in FIGS. 5A to 5C, and as shown in FIGS. 6A to 6C The process of preparing the mold 500 including the mold substrate 510 and the mold pattern 520 is the same.

12A and 12B are cross-sectional views illustrating a molding process in which the mold release layer 310 on which the ink pattern layer 320 and the molding material layer 330 'are formed is closely contacted to the mold 500.

12A and 12B, the release material 310 on which the ink pattern layer 320 and the molding material layer 330 'are formed is placed on the upper side of the mold 500 and then the release material 310 is molded Material layer 330 '. To this end, a lift module 610 is provided on the upper portion of the release fabric 310 to move the release fabric 310 up and down. An alignment camera 620 may be further provided on one side of the release fabric 310 to perform an alignment process for more accurately aligning the release fabric 310 and the mold 500.

The alignment mark 311 formed on the release fabric 310 is aligned with the alignment mark 511 formed on the mold substrate 510 via the alignment camera 620. Then, The mold material layer 330 'formed on the release mold 310 is brought into close contact with the mold 500 by lowering the mold 310. In this molding process, the molding material layer 330 'formed on the release fabric 310 may be closely attached to the mold pattern 520 while being subjected to a constant pressure by the mold pattern 520. The pattern 520a of the mold pattern 520 is formed on the surface of the molding material layer 330 'which is in close contact with the mold pattern 520, A pattern corresponding to the pattern can be formed.

13A and 13B illustrate the mold pattern 520 and the molding material layer 330 'in a state in which the mold release layer 310 having the ink pattern layer 320 and the mold material layer 330' As shown in FIG.

12A and 12B, when the mold release layer 310 on which the ink pattern layer 320 and the mold material layer 330 'are formed is brought into close contact with the mold 500, Bubbles may be generated between the material layer 330 'and the mold pattern 520. 13A and 13B, a pressure roller 710 is provided on the upper surface of the release fabric 310, and then pressure is applied to the pressure roller 710 while applying pressure to the pressure roller 710. As a result, The bubbles generated between the mold pattern 520 and the molding material layer 330 'may be removed by moving the mold 310 along the upper surface thereof.

FIGS. 14A and 14B are cross-sectional views showing a state in which the UV curing process is performed on the molding material layer 330 'after the molding process.

14A and 14B, an UV irradiator (not shown) is used in a state in which an anisotropic material 310 having an ink pattern layer 320 and a molding material layer 330 ' UV is applied to the molding material layer 330 '. As described above, since the mold 500 includes a material that is permeable to UV, the UV irradiator is provided below the mold 500 and irradiates the molding material layer 330 'through the mold 500 . In the case where the release fabric 310 and the ink pattern layer 320 are made of a material having transparency to UV, UV is applied to the molding material layer 330 'through the release fabric 310 and the ink pattern layer 320 It is also possible to be investigated. The mold material layer 330 ', which has undergone the molding process by the UV irradiation, is cured and changed into the molding pattern layer 330. That is, since the molding material layer 330 'includes a material that is cured by UV irradiation, when the UV material is irradiated to the molding material layer 330' through the mold 500, the molding material layer 330 ' As shown in FIG. After this UV irradiation process is performed, the mold 500 is removed from the molding pattern layer 330.

FIGS. 15A and 15B are cross-sectional views showing a state where a molding pattern layer 330 is formed on the modified tail 310. FIG.

Referring to FIGS. 15A and 15B, an ink pattern layer 320 is formed on a release fabric 310, and a molding pattern layer 330 is formed on the ink pattern layer 320. Here, the molding pattern layer 330 may be formed by performing an UV molding process, that is, a molding process and a UV curing process, on the molding material layer 330 'as described above. Accordingly, the pattern 330a corresponding to the pattern 520a of the mold pattern 520 may be formed on the surface of the molding pattern layer 330 (in FIGS. 15A and 15B).

16A and 16B are cross-sectional views showing a state in which a deposition layer 340 and an adhesive layer 350 are sequentially formed on a molding pattern layer 330. FIG.

16A and 16B, an UV molding process is performed to form a molding pattern layer 330, and then a deposition layer 340 and an adhesive layer 350 are sequentially formed on the lower surface of the molding pattern layer 330 . Here, the vapor deposition layer 340 may serve to enhance the high-quality texture of the vapor deposition layer 340 or to display various colors such as blue and yellow. The deposition layer 340 may be formed on the upper surface of the molding pattern layer 330. However, the present invention is not limited thereto. The deposition layer 340 may be formed by depositing an evaporation material on the release material 310 on which the molding pattern layer 330 is formed, and then removing unnecessary portions.

The adhesive layer 350 can serve to strengthen the adhesion of the transfer film (100 in Fig. 1) to the transparent window (W in Fig. 1). The adhesive layer 350 may be formed on the lower surface of the deposition layer 340, but is not limited thereto.

While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the invention as defined by the appended claims.

100 .. Transfer Film
110,310 .. Release fabric
120,320 .. Print pattern layer
130,330 .. Molding pattern layer
130a, 330a, 520a.
330 '.. Molding material layer
140.
150 .. adhesive layer
311 .. Align Mark
500 .. Mold
510 .. mold substrate
520 .. Mold Pattern
610 .. Lift module
620 .. Alignment camera
710 .. Pressure roller
W .. Transparent window

Claims (11)

Sequentially forming an ink pattern layer and a molding material layer on the release fabric;
Forming the molding material layer as a molding pattern layer by UV molding; And
And forming an adhesive layer on the molding pattern layer.
The method according to claim 1,
Wherein the ink pattern layer and the molding material layer are formed by screen printing.
The method according to claim 1,
And depositing a deposition layer between the molding pattern layer and the adhesive layer.
The method according to claim 1,
Wherein forming the molding pattern layer by UV molding comprises:
A step of bringing a mold including a mold substrate and a mold pattern into close contact with the molding material layer; And
And forming the molding pattern layer by irradiating the molding material layer with UV light to cure the molding pattern layer.
5. The method of claim 4,
Wherein the release mold and the mold substrate each have an alignment mark formed thereon.
5. The method of claim 4,
Wherein the mold pattern is in close contact with the molding material layer, and a pattern corresponding to the pattern of the mold pattern is formed on a closely adhered surface of the molding material layer.
The method according to claim 6,
Further comprising the step of bringing the mold pattern into close contact with the molding material layer and removing bubbles generated between the mold pattern and the molding pattern layer.
5. The method of claim 4,
And the UV is irradiated to the molding material layer through the mold.
The method according to claim 1,
Wherein forming the molding pattern layer by UV molding comprises:
Adhering the molding material layer to a mold including a mold substrate and a mold pattern; And
And forming the molding pattern layer by irradiating the molding material layer with UV light to cure the molding pattern layer.
10. The method of claim 9,
Further comprising the step of bringing the molding material layer into close contact with the mold pattern, and then removing bubbles generated between the molding material layer and the mold pattern.
11. The method of claim 10,
And the UV is irradiated to the molding material layer through the mold.
KR1020150040917A 2015-03-24 2015-03-24 Method of manufacturing transfer film for transparent window KR20160114426A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022182001A1 (en) * 2021-02-23 2022-09-01 삼성전자 주식회사 Cover having multi-layer film laminated thereon, electronic device comprising same, and method for manufacturing multi-layer film

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022182001A1 (en) * 2021-02-23 2022-09-01 삼성전자 주식회사 Cover having multi-layer film laminated thereon, electronic device comprising same, and method for manufacturing multi-layer film

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