KR101427344B1

KR101427344B1 - Printing method for forming pattern

Info

Publication number: KR101427344B1
Application number: KR1020130057555A
Authority: KR
Inventors: 이형만
Original assignee: 전자부품연구원
Priority date: 2013-05-22
Filing date: 2013-05-22
Publication date: 2014-08-06

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for forming a print pattern, and more particularly to a method for manufacturing an electronic device by applying a technique for producing a multi-resolution pattern.
To this end, the printing pattern forming method of the present invention includes the steps of rotating a part of a printing roll forming a printing pattern in a solution tank in which ink is stored so that ink is coded on the printing pattern, A step of forming a mask on an upper portion of a region in which a fine print pattern having a relatively small line width is to be formed in a print pattern coded on the print film so that ink is coded on a print film supplied between the press rolls rotating in close contact with the print roll; Drying the print pattern, and forming a fine pattern in a region where the fine print pattern is to be formed using the laser patterning apparatus.

Description

[0001] PRINTING METHOD FOR FORMING PATTERN [0002]

The present invention relates to a printing pattern forming method, and more particularly, to a method of manufacturing an electronic device by applying a technique of producing a multi-resolution pattern.

Electronic device fabrication technology using printing process is the most mass production technology, and it is utilized in various application industries. Roll-to-roll printing electronic technology is developing into the cutting-edge IT industry by combining traditional printing process technology. Currently, it is a field where technology competes constantly for improvement of resolution and mass production.

A typical example of a printing process using an existing roll process is a gravure printing process. The gravure printing process is advantageous in productivity because the roll conveying speed is faster than the screen printing method. The gravure printing technique is a technique for forming a mask pattern by exposure-etching a photoresist applied to a metal roll, and then forming a negative pattern by an etching method to form a fine pattern of 30 mu m level. In this case, in order to form a fine pattern on the metal roll as described above, various steps are performed, and the gravure printing roll manufactured in this way can not be changed, and a high cost is required in the production.

A problem to be solved by the present invention is to propose a printing process capable of reducing the manufacturing cost of a printing roll by improving the productivity.

Another problem to be solved by the present invention is to propose a printing fixation capable of realizing fine patterning of less than 10 탆 which is the limit in existing gravure printing processes.

Another problem to be solved by the present invention is to propose a method for reducing the processing time for forming a print pattern.

To this end, the printing pattern forming method of the present invention includes the steps of rotating a part of a printing roll forming a printing pattern in a solution tank in which ink is stored so that ink is coded on the printing pattern, A step of forming a mask on an upper portion of a region in which a fine print pattern having a relatively small line width is to be formed in a print pattern coded on the print film so that ink is coded on a print film supplied between the press rolls rotating in close contact with the print roll; Drying the print pattern, and forming a fine pattern in a region where the fine print pattern is to be formed using the laser patterning apparatus.

To this end, the printing pattern forming method of the present invention includes the steps of rotating a part of a printing roll forming a printing pattern in a solution tank in which ink is stored so that ink is coded on the printing pattern, Forming a fine print pattern having a relatively thin line width in a print pattern coded on the print film by using a laser patterning device, so that ink is coded on a print film supplied between the press rolls rotating in close contact with the print roll; And drying the print pattern after forming a mask on an upper portion of the area where the micro print pattern is to be formed.

The method of manufacturing an electronic device using a printing process according to the present invention is different from the conventional method in that a pattern roll of an attaching method using a silicone mold or a pattern film is manufactured and a printing process is performed by transferring the pattern roll to a solution, .

Further, in manufacturing a fine pattern, the laser patterning process is limited to a region requiring a fine pattern, thereby minimizing the process time, which is a disadvantage of the laser process, and thereby improving the mass productivity, thereby reducing the manufacturing cost of the electronic device . In addition, fine patterning of 10 탆 or less, which can be ensured only by an existing gravure printing process, can be realized.

1 is a flowchart illustrating a printing process according to an embodiment of the present invention.
2 is a view illustrating a configuration for performing a printing process according to an embodiment of the present invention.
FIG. 3 is another diagram showing a configuration for performing a printing process according to an embodiment of the present invention.
4 is another view showing a configuration for forming a print pattern on a print film according to an embodiment of the present invention.
FIG. 5 illustrates a process of forming a print pattern using a substrate having an imprinting pattern layer according to an embodiment of the present invention. Referring to FIG.
Fig. 6 shows an electronic device according to the printing method proposed by the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The foregoing and further aspects of the present invention will become more apparent from the following detailed description of preferred embodiments with reference to the accompanying drawings. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

1 is a flowchart illustrating a printing process according to an embodiment of the present invention. Hereinafter, a printing process according to an embodiment of the present invention will be described in detail with reference to FIG.

Step S100 is a print film transfer step. Hereinafter, a configuration for performing the printing process will be described.

2 is a view illustrating a configuration for performing a printing process according to an embodiment of the present invention. Hereinafter, a configuration for performing a printing process according to an embodiment of the present invention will be described with reference to FIG.

According to Fig. 2, the configuration for performing the printing process includes a solution tank, a solution, a blade, a pressure roll, a printing film, and a printing roll. Of course, other configurations other than the above-described configuration may be included in the configuration for performing the printing process.

The printing film 5 used for the printing process is one of PET, PI, PC, PMMA, paper, and vinyl, and carries out a printing film transfer step to form a printing pattern.

Step S102 is a printing roll rotating step. The printing roll may be constituted by a contact transfer method in which a gravure roll, a silicon pattern mold, a film pattern mold or the like is applied as shown in Fig. When a printing area having a resolution of 50 to 100 mu m or more is required to perform fine patterning, it is preferable to apply a contact transfer type roll such as a silicon pattern mold or the like. When a region pattern having a resolution of 15 to 50 mu m is required, It is preferable to apply a printing roll. When the laser patterning proposed in the present invention is applied to a printing area by applying a gravure printing roll, it is possible to realize a fine resolution of 15-50um or less which can not be realized by a conventional gravure printing process, , The process speed can be improved.

In addition, when a gravure printing roll is not used, a cost for producing a separate printing roll does not occur, and economical advantages can be secured. After forming a low resolution pattern area with a relatively inexpensive silicon pattern mold, By performing the patterning process, fine patterning can be manufactured at an economical mass production rate.

The solution (2) contained in the solution tank (1) may be a variety of solutions such as metal ink, metal nanowire, oxide ink, and polymer ink, which are used for printing electrons. The solution 2 in contact with the printing roll 7 is filled in the printing pattern 8 which is intensely patterned by the blade 3 to form the printing pattern 6 on the printing film 5 . It is preferable to apply the gravure printing roll to the printing roll 7 and the printing pattern 8, but it is preferable to apply the gravure printing roll to various mold materials such as a silicon mold, a release film or a silicon pattern- A print pattern can be formed. The printed pattern 8 can be formed by winding the formed print pattern on the printing roll 7. [ Thereafter, the present invention forms the printing pattern 6 on the printing film 5 after coating the solution with an equal amount by the blade 3 as described above.

Step S104 is a drying and printing pattern formation step. After the printing pattern 6 is formed on the printing film 5, a drying process is performed to fix the solution to the printing film 5. The drying method is most preferably an infrared drying method, and one of various drying methods such as hot air drying and UV drying can be selected as needed. Since the printing solution is mostly composed of a solvent-containing material, when the drying method using an infrared dryer is used, the printing solution is fixed on the printing film and the printing pattern is formed while the solvent is volatilized. The drying process is not performed on all the print films according to the present invention, but the dry process is not performed on the print film to form a fine print pattern using a laser. That is, a mask is formed on the top of a print film to be used for laser to form a fine print pattern.

That is, as shown in FIG. 3, it can be seen that the mask 14 is formed on the top of the print film to form the fine print pattern, and the print pattern is dried using the heat source 16.

Step S106 is a print film transfer step. That is, the printing solution adhered to the printing film is subjected to the printing film transfer step to perform laser patterning. So that the print film on which the print pattern is formed by the transfer roll is transferred to the step capable of performing the alignment for laser patterning.

4 is a view illustrating a printing process according to an embodiment of the present invention. 4, the structure in which the printing process is performed includes the transfer roll 11, the printing films 13 and 15, and the laser patterning device 17. [ The printing film 13 is a printing film on which the drying process is not performed, and the printing film 15 is a film on which the drying process is performed.

Step S108 is a positioning step. It is necessary to align the positions of the laser patterning area and the sample before performing the laser patterning process proposed in the present invention. Position alignment is performed using an alignment marker. The alignment marker recognizes some specific positions of the patterns printed in steps 100 through 104 as a vision and sets the apparatus to be synchronized with the position of the laser patterning area so that the alignment process can be performed smoothly. The pre-alignment process of the equipment is a process of configuring the alignment marker position to match the laser patterning position. By arranging the alignment marker position to be the same as the laser patterning position in advance through the equipment, only the alignment of the alignment can be performed at the actual process step, and the laser patterning process can be performed immediately.

Step S110 is a laser wavelength and power selection step. Prior to performing the laser patterning process, set values of process variables such as laser wavelength, power, laser scan rate, pulse repetition rate, pulse width, etc. for laser patterning are selected. The setting value may vary depending on the material properties of the printing solution. Also, the setting value may be differently applied depending on the material characteristics of the printing film. Based on the absorption spectrum of the material, the laser wavelength and the power are selected on the basis of various factors, and various laser patterning process parameters are controlled by various purposes.

Step S112 is a fine pattern formation step. In the multi-resolution pattern fabrication step, the fine pattern formation step is performed by the laser patterning device. The laser patterning process is performed on the print film having the relatively large resolution pattern in steps 100 to 104 to complete the fine pattern formation process.

Pattern formation using a laser is a direct pattern formation method using a digital interface technique, unlike an indirect method in which a pattern is formed using a duplicated printing roll in a gravure process. That is, the gravure process is a method in which a new print roll must be continuously formed for forming a new pattern, and the laser patterning process has an advantage in that a new pattern can be formed by replacing only digital data on a computer in order to form a new pattern. Laser patterning is advantageous in that a fine line width pattern having a resolution of 5-15 μm or less can be produced according to the selection of an optical system to be used.

In the laser patterning process for forming a multi-resolution pattern proposed in the present invention, laser patterning such as galvano scanner mirror laser patterning and motor driven laser patterning can be applied. In the laser patterning process of the present invention, a solution printing process having a resolution of 50-100um or more corresponding to the area printing is performed in a previous stage, and then laser patterning is performed in a local region requiring fine patterning of 50-100um or less. Process. The laser patterning process may be performed by stopping the transfer of the film while the laser patterning is performed in a predetermined region in a step & repeat mode, and transferring the film after forming the pattern. In this case, it is preferable to apply the galvano scanner mirror laser patterning method. Alternatively, laser patterning may be performed by a roll-to-roll method by setting the transport speed of the film at a uniform speed and scanning the laser only with respect to the transport vertical axis of the film. In this case, it is more preferable to apply the motor-driven laser patterning method. In addition, various pattern implementation methods using laser can be applied.

The drying and area pattern forming step and the fine pattern forming step of FIG. 1 described above can be performed in the reverse order. That is, after a fine pattern is formed by using a laser, a region that does not require formation of a fine pattern can be dried by using a mask.

The print area forming process may be applied using an imprinting technique.

FIG. 5 illustrates a process of forming a print pattern using a substrate having an imprinting pattern layer according to an embodiment of the present invention. Referring to FIG. Hereinafter, a process of forming a print pattern using a substrate having an imprinting pattern layer according to an embodiment of the present invention will be described in detail with reference to FIG.

A radiation heating source (heat source) 16 is applied to the substrate 12 on which the imprinting pattern layer 41 is formed to heat the remaining region except the portion where the mask 14 is formed to perform the printing area sintering process. Thereafter, the mask 14 is removed and a laser patterning sintering process is performed to form a laser-sintered or dried pattern 42 of the imprinting pattern, and the entire process can be completed have. Other application methods are the same as described above.

Fig. 6 shows an electronic device according to the printing method proposed by the present invention. A printing process having a relatively large pattern area uses a contact transfer method using a soft silicone mold including gravure printing. An outer line 31 of a printing area of 50-100um or more is formed through the contact transfer method. The masking region 32 is then formed by applying a mask to sinter or dry the other areas except for areas to be laser patterned or sintered or dried. By irradiating the radiant heat source, the portion outside the masking region is sintered or dried. The mask is removed and then a process is performed with local fine patterning sintering or drying 33 using a laser to form a fine pattern area of 50-100 um or less. Then, the solution residual print pattern area 34 is washed and dried to complete the entire process.

Another example is to form an outline line of a printing area of 15-50um or more through a gravure printing process and form a fine pattern area of 15-50um or less by using a laser. In this way, the present invention can be applied to a product manufacturing process requiring fine patterning based on a printing process in various industries such as a touch panel, a TFT-LCD, an OLED, a flexible electronic device, and a photovoltaic.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the scope of the present invention .

1: solution tank 2: solution
3: Blade 4: Print film
7: printing roll

Claims

A part of the printing roll forming the printing pattern is placed in a solution tank in which the ink is stored
So as to coat the printing pattern with ink;
So that the ink coated on the print pattern is coated on the print film supplied between the press rolls rotating in close contact with the print roll;
Forming a mask on an upper portion of a region where a laser print pattern is to be formed on a print pattern coated on the print film, and drying the print pattern; And
And forming a laser pattern on a region where the laser print pattern is to be formed using a laser patterning device.

The printing pattern forming method according to claim 1, wherein the drying step is performed by one of hot air drying, infrared drying, and ultraviolet drying.

The printing pattern forming method according to claim 2, wherein after the drying step, an alignment step of aligning the position of the laser patterning device according to the position of the ink coated on the printing film is performed.

The method according to claim 1, wherein the ink is one of a metal ink, a metal nanowire, an oxide ink, and a polymer ink.

The method of claim 1, wherein forming the laser pattern comprises:
Wherein at least one of a wavelength, a power, a scan speed, a pulse repetition rate, and a pulse width of a laser emitted from the laser patterning apparatus is changed according to the ink.

Rotating a part of the printing roll forming the printing pattern inside the solution tank in which the ink is stored so that ink is coated on the printing pattern;
So that the ink coated on the print pattern is coated on the print film supplied between the press rolls rotating in close contact with the print roll;
Forming a laser pattern on a print pattern coated on the print film using a laser patterning device; And
And drying the print pattern after forming a mask on an upper portion of the region where the laser pattern is formed.