KR20160108303A - Film formation device and film formation method - Google Patents

Abstract

The length of the arrangement width of the nozzles 4 of the inkjet head 3 is made equal to or longer than the maximum length in the width direction of the film formation surface 2A of the substrate 2 when the substrate 2 is relatively moved, The adhesion of the discharged film liquid 6 in order to restrain the film liquid 6 from sticking from the outer peripheral end portion 2b of the substrate 2 toward the back surface 2c during the period until the relative movement of the film liquid 6 is completed The number of nozzles 4 for discharging the film liquid 6 in the plurality of nozzles 4 is variably controlled so as to stop at the boundary between the film formation surface 2A and the outer peripheral edge 2c of the substrate 2. [

Description

TECHNICAL FIELD [0001] The present invention relates to a film formation apparatus and a film formation method,

TECHNICAL FIELD The present invention relates to a technique for forming a film on a semiconductor wafer, a glass substrate, a resin substrate, or the like.

17, a film liquid L is dropped at the center of a substrate (wafer) W and a wafer W is dropped thereon as a typical method for forming a film on an original substrate such as a semiconductor wafer, Is rotated in the direction of an arrow A0 to spin-extend the film liquid L by centrifugal force.

In this spin coating method, since a large amount of the film liquid L is scattered in the direction indicated by the arrow A1 in FIG. 17, 70% to 90% of the film liquid L is discarded on the outer peripheral side of the wafer W. Therefore, in the work for obtaining a predetermined film thickness on the surface of the wafer W, a large overflow area B1 for the film liquid L is formed, and the use efficiency (residual film liquid) becomes 10% to 30% Lt; / RTI >

In this spin coating method, as shown in Figs. 18A and 18B, an air current as indicated by an arrow A2 is generated in accordance with the rotation of the wafer W in the direction of arrow A0, so that the film thickness is uneven Which may cause uneven application of the film. 19A, when there are projections M of electrodes or parts on the surface of the wafer W, nonuniform coating N1 of the film originating from the projections M may occur, There may occur a problem that bubbles N2 are generated on the outer peripheral side of the convex portion M as shown in Fig.

20, the film liquid L conveyed toward the outer peripheral side of the wafer W by the centrifugal force is transferred from the outer peripheral edge Wb of the wafer W to the back surface Wc side It brings about a situation to reach. 21, the film liquid L adhered to the outer peripheral edge Wb and the back surface Wc of the wafer W by a method called a back rinse (BL) and an edge rinse (EL) using a cleaning liquid, There is a need to rinse the laundry, which is troublesome and troublesome for cleaning, and is also disadvantageous in terms of cost.

In order to cope with such a problem, as a method not according to the spin coating method in the paragraph [0007] of Patent Document 1, the resist liquid is supplied from the discharge hole of the nozzle formed above the wafer, the nozzle is reciprocated in the X- And the wafer is intermittently transferred in the Y direction. It is also described that portions other than the circuit forming area of the wafer are covered with a mask in order to prevent the resist liquid from adhering to the outer peripheral edge (peripheral edge) or backside of the wafer.

In the paragraph [0027] of Patent Document 2, there is provided a pair of liquid receiving members for receiving the coating liquid falling from the nozzle to prevent the supply of the coating liquid to the outer edge region of the wafer, It is described that the liquid receiving members are adjusted such that the X direction interval is variable and the tip end portions of the pair of liquid containing members are located slightly inside the outer edge of the wafer irrespective of the position of the wafer in the Y direction.

In the paragraphs [0050] and [12] of Patent Document 2, a plurality of discharge ports are arranged in a line over a length corresponding to the diameter of the wafer in the coating liquid nozzle, and from the one end side of the wafer And the scanning application of the coating liquid is performed. In this case as well, a pair of liquid containing members for receiving the coating liquid falling from the plurality of discharge ports and preventing the supply of the coating liquid to the outer edge region of the wafer is provided.

Japanese Patent Application Laid-Open No. 2001-237179 International Publication WO2005 / 034228A1

However, in the configurations disclosed in the above-mentioned Patent Documents 1 and 2, a mask or a liquid containing member is required in order to prevent the film liquid dropped from the nozzle (discharge port) from reaching the rear surface from the outer peripheral end of the wafer, The structure becomes complicated. Further, even if a mask or a liquid containing member is provided, since these members can not withstand long-term use, there arises a problem of durability.

In addition to the film liquid falling from the front end face (inner circumferential end face) of the mask or the liquid containing member and falling from the nozzle (discharge port) due to the film liquid falling off, a film liquid falling around the required position of the wafer exists. When such a situation occurs, it becomes difficult to drop the film liquid to the precise required position, so that an error may occur in a region where the film is actually formed on the wafer, and the uniformity of the film thickness obtained on the wafer is impaired.

In addition, a request may be made to form a film similar to the above for a substrate constituting each plate such as a rectangle or a polygon. In such a case, there is a problem of how to cope with the above-mentioned problem.

SUMMARY OF THE INVENTION In view of the above circumstances, it is an object of the present invention to easily prevent the film liquid discharged onto the substrate from reaching the rear surface from the outer peripheral edge of the substrate, accurately discharging the film liquid to a desired position on the substrate, And to provide a film forming apparatus and a film forming method capable of correcting a film thickness obtained on a substrate.

A first aspect of the invention developed to solve the above problems is to provide an ink jet recording head in which a plurality of nozzles for discharging a film liquid are arranged to face a discharge surface of an ink jet head arranged in a width direction and a film formation surface of a substrate onto which a film liquid is discharged from the nozzle, The film liquid is discharged from the nozzle onto the film-formed surface of the substrate while the head and the substrate are relatively moved in the non-rotating state in a direction perpendicular to the width direction, The length of the arrangement width of the nozzles of the substrate is set to be not less than the maximum length in the width direction of the film formation surface of the substrate when the substrate is relatively moved and until the relative movement of the both is completed, The adhesion of the discharged film liquid is controlled so as to prevent adhesion of the discharged film liquid from the end portion toward the back surface side And the number of nozzles for discharging the film liquid in the plurality of nozzles is variably controlled so as to stop at the boundary between the film forming surface and the outer peripheral end of the substrate.

According to such a configuration, the number of nozzles for discharging the film liquid can be variably controlled while the inkjet head and the substrate relatively move regardless of the shape or posture of the substrate, The adhesion of the film liquid at the boundary between the forming surface and the outer circumferential end is stopped to avoid the problem that the film liquid reaches the outer circumferential end and the back surface. Therefore, a mask or a liquid containing member is unnecessary as in the prior art, so that the structure of the apparatus around the substrate is simplified. In addition, the film liquid can be accurately discharged at the required position because the film liquid does not fall off from the mask or the liquid containing member And the accuracy of the film thickness on the substrate can be ensured. In this case, in order to variably control the number of nozzles for discharging the film liquid, BMP data determined from the relative movement position of the inkjet head and the substrate and the position of the film formation surface on the substrate are created, and based on the BMP data, A plurality of nozzles may be controlled.

In the above configuration, it is preferable that the form when the substrate moves relative to the inkjet head is not a rectangular substrate composed of two sides parallel to the relative movement direction and two sides orthogonal to the relative movement direction Do.

In this case, if the number of nozzles for ejecting the film liquid is determined in advance in the case where the substrate becomes the rectangular shape, whether or not the film liquid is to be ejected from all of the nozzles, that is, whether the number of nozzles for ejecting the film liquid is zero It is only necessary to perform variable control of whether the number is constant or not. On the other hand, when the substrate is not a rectangular shape as described above, it is necessary to finely change the number of nozzles for discharging the film liquid to a non-rectangular area protruding from the rectangular area. You can respond exactly to the same request.

Examples of such a substrate include a substrate constituting a disk-shaped substrate and a substrate constituting each plate-shaped substrate such as a rectangular, triangular or other polygonal shape. Further, in the case of a substrate constituting a rectangular plate-shaped plate, it is advantageous when the substrate is inclined with respect to the relative moving direction.

In the above configuration, it is preferable that the film thickness after drying of the film liquid discharged toward the film-formed surface of the substrate is controllable so that the lower limit value is 300 nm and the upper limit value is 30 占 퐉 or more.

In this way, a very thin film having a thickness of about 300 nm and a very thick film having a thickness of 30 μm or more can be accurately formed on the substrate. In the case of forming a very thick film having a thickness of 20 mu m or more or 30 mu m or more, it is carried out by applying it in an overlapping manner without limit to the number of times. The upper limit value in this case is, for example, 100 mu m.

In the above configuration, the discharge amount of the film liquid that is discharged toward the film-formed surface of the substrate and becomes a usable film after drying can be 95% to 100% (preferably 100%) of the total discharge amount.

In this way, an ink jet type apparatus such as an ink jet printer, that is, an ink jet head, is effectively used, and the waste of the film liquid can be reduced as much as possible.

In the above configuration, with respect to a rectangular region having two sides that are in contact with a corner portion on the outer peripheral edge of the substrate and parallel to the relative movement direction and two sides perpendicular to the direction, Ejecting the film liquid from a predetermined number of nozzles and controlling the film liquid to be discharged from a different number of nozzles in accordance with the star of the relative movement position with respect to a non-rectangular area protruding from the rectangular area of the film- desirable.

This simplifies the control of the nozzle with respect to the rectangular area of the substrate, so that the control of the nozzles with respect to the entire substrate is also effectively simplified.

In this case, it is preferable that the non-rectangular area is divided into a plurality of partial areas in the relative movement direction, and the discharge amount of the film liquid from the individual nozzles is variably controlled according to the plurality of partial areas.

In this case, since the control is performed with the partial area as one unit, the control accuracy can be ensured while avoiding the complicated control.

In the above configuration, it is preferable that the ink jet head is a parallel ink jet head in which a plurality of individual ink jet heads are arranged in a zigzag pattern with respect to the width direction.

This makes it possible to cope with the enlargement of the substrate, so that it can be widely used from a substrate having a small size to a substrate having a large size.

In the above configuration, the discharge amount of the film liquid gradually increases toward the inner circumferential side in the stripe-shaped region connected to the inner circumferential side of the boundary between the film forming surface of the substrate and the outer circumferential end, and in the region connected from the stripe- It is preferable to control the discharge amount so as to be equal to the maximum discharge amount of the film liquid.

In this case, when the film liquid is formed with a uniform discharge amount on the film formation surface of the substrate, that is, when the liquid surface height of the film liquid is uniform over the entire film formation surface of the substrate, The film thickness gradually increases as the stripe-shaped region shifted to the outer circumferential side. Therefore, by controlling the discharge amount of the film liquid to gradually increase as it moves from the streak-like region to the inner periphery at the time of discharging the film liquid, a uniform film thickness can be obtained on the substrate after drying.

In this case, it is preferable to divide the stripe-shaped region into a plurality of partial stripe-shaped regions from the inner circumferential side to the outer circumferential side, and variably control the amount of the film-liquid discharged from the individual nozzles along the plurality of partial stripe-

By doing so, since the control is performed with the partial stripe pattern area as one unit, the control accuracy can be ensured while avoiding the complicated control.

In the above arrangement, by controlling the ejection and non-ejection of the film liquid relative to the plurality of nozzles at the time of relative movement, it is possible to create a plurality of closed regions where the film is formed on the film formation surface and a region where the film is not formed, It is possible to form a plurality of closed regions and a region where the film is formed on the film formation surface by controlling the discharge and non-discharge of the film liquid with respect to the plurality of nozzles in the relative movement.

According to such a configuration, it is possible to form a state of film formation which was impossible in the conventional spin coating method or the method using a nozzle, and is particularly effective when the substrate forms a disk-like shape.

A second aspect of the present invention, which is provided to solve the above-described problems, is to provide an ink jet recording head which opposes a discharge surface of an ink jet head in which a plurality of nozzles for discharging a film liquid are arranged in a width direction, A film forming apparatus configured to eject the film liquid from the nozzle onto a film formation surface of the substrate while moving the head and the substrate in a non-rotating state relative to each other in a direction perpendicular to the width direction, The shape of the ink jet head relative to the ink jet head is not a rectangular substrate composed of two sides parallel to the relative movement direction and two sides orthogonal to this direction, The maximum width in the width direction of the film formation surface of the substrate when the substrate moves relatively In this manner, the number of nozzles for discharging the film liquid in the plurality of nozzles is variably controlled until the relative movement of the both is completed.

According to such a configuration, substantially the same operational effects as those of the first invention described above can be obtained. In this case, however, the relationship between the film-formed surface on the substrate and the outer peripheral end of the substrate is not subject to the strict restrictions as in the first invention described above.

A third aspect of the invention developed to solve the above problems is to provide an inkjet recording apparatus in which a discharge surface of an inkjet head in which a plurality of nozzles for discharging a film liquid are arranged in the width direction is opposed to a film formation surface of a substrate on which a film liquid is discharged from the nozzles, There is provided a film forming apparatus configured to discharge the film liquid from the nozzle onto a film formation surface of the substrate while relatively moving the head and the substrate in a non-rotating state and in a direction perpendicular to the width direction, The discharge amount of the film liquid gradually increases toward the inner circumferential side in the stripe-shaped area connected from the outer peripheral end to the inner peripheral side of the film-formed surface, and in the region connected from the stripe-shaped area to the inner peripheral side, Lt; / RTI >

According to such a configuration, the following operational effects can be obtained. That is, when the film liquid is formed with a uniform discharge amount on the film formation surface of the substrate, that is, when the liquid surface height of the film liquid is uniform over the entire film formation surface of the substrate, As the stripe-shaped area connected to the inner circumferential side shifts to the outer circumferential side, the film thickness gradually increases. Therefore, by controlling the discharge amount of the film liquid to gradually increase as it moves from the streak-like region to the inner periphery at the time of discharging the film liquid, a uniform film thickness can be obtained on the substrate after drying.

In the above configuration, the substrate may be a semiconductor wafer, a glass substrate, or a resin substrate.

In order to solve the above-described problems, a fourth aspect of the present invention is to provide a method for manufacturing an inkjet head, comprising: ejecting a plurality of nozzles for ejecting a liquid film in opposition to a jetting surface of an inkjet head, A film forming method for discharging the film liquid from a nozzle onto a film-formed surface of a substrate while relatively moving the head and the substrate in a non-rotating state and in a direction perpendicular to the width direction, the method comprising: The length of the arrangement width of the nozzles is set to be equal to or longer than a maximum length in the width direction of the film formation surface of the substrate when the substrate is relatively moved and until the relative movement of the both is completed, In order to suppress the adhesion of the discharged film liquid to the back side of the substrate To stop in the forming surface and the boundary between the outer peripheral edge portion, characterized by variably controlling the number of nozzles for discharging the makaek in the plurality of nozzles.

According to this method, substantially the same operational effect as that of the first invention described above can be obtained.

In order to solve the above-mentioned problems, a fifth invention is to provide an ink jet recording head in which a plurality of nozzles for discharging a film liquid are arranged to face each other in the width direction of a discharge surface of the ink jet head, And the film liquid is discharged from the nozzle onto the film-formed surface of the substrate while moving the substrate relatively in a direction perpendicular to the width direction in a non-rotating state, the film forming method comprising: The shape of the ink jet head relative to the ink jet head is not a rectangular substrate composed of two sides parallel to the relative movement direction and two sides perpendicular to the direction of the ink jet head, The maximum length in the width direction of the film formation surface of the substrate when the substrate moves relatively The number of nozzles for discharging the film liquid in the plurality of nozzles is variably controlled until the relative movement of the both is completed.

According to such a method, substantially the same operational effect as that of the second invention described above can be obtained.

In order to solve the above-mentioned problems, a sixth aspect of the present invention is to provide an ink jet recording head comprising a plurality of nozzles for ejecting a film liquid, wherein the plurality of nozzles face the film- The film liquid is ejected from the nozzle onto the film-formed surface of the substrate while the head and the substrate are relatively moved in the non-rotated state in a direction perpendicular to the width direction, the method comprising: The discharge amount of the film liquid gradually increases toward the inner circumferential side in the stripe-shaped region connected from the outer peripheral end to the inner peripheral side of the film-formed surface, and in the region connected from the stripe-shaped region to the inner peripheral side, the discharge amount equal to the maximum discharge amount of the film- Lt; / RTI >

According to such a method, substantially the same operational effects as those of the third invention described above can be obtained.

(Effects of the Invention)

As described above, according to the present invention, it is possible to easily prevent the film liquid discharged onto the substrate from reaching the back surface from the outer peripheral edge of the substrate, and to accurately discharge the film liquid at a required position on the substrate, The film thickness can be corrected.

1 is a perspective view showing a schematic structure of a film forming apparatus according to a first embodiment of the present invention.
2 is a schematic view showing an example of the arrangement state of the nozzles on the lower surface of the inkjet head which is a component of the film forming apparatus according to the first embodiment of the present invention.
3A is a schematic front view showing a first example of a film liquid discharging method of a nozzle which is a component of a film forming apparatus according to the first embodiment of the present invention.
Fig. 3B is a schematic front view showing a second example of a film liquid discharging method of a nozzle which is a component of the film forming apparatus according to the first embodiment of the present invention. Fig.
3C is a schematic front view showing a third example of a film liquid discharging method of a nozzle which is a component of the film forming apparatus according to the first embodiment of the present invention.
4 is a schematic plan view for explaining a first example of a film liquid discharge state on a film formation surface on a substrate according to the first embodiment of the present invention.
5A is a schematic plan view for explaining a problem of a film liquid discharge state with respect to a part of a film formation surface on a substrate according to the first embodiment of the present invention.
5B is a cross-sectional view taken along line FF of Fig. 5A.
6A is a schematic plan view for explaining a discharge state of a film liquid on a part of a film formation surface on a substrate according to the first embodiment of the present invention.
6B is a cross-sectional view taken along line GG of FIG. 6A.
7A is an enlarged vertical sectional view showing a problem of the outer peripheral portion immediately after the film is formed on the substrate according to the first embodiment of the present invention.
Fig. 7B is an enlarged longitudinal sectional view showing the problem of the outer peripheral portion after drying after the film is formed on the substrate according to the first embodiment of the present invention. Fig.
8A is an enlarged longitudinal sectional view showing a portion on the outer peripheral side immediately after a film is formed on a substrate according to the first embodiment of the present invention.
Fig. 8B is an enlarged longitudinal sectional view showing the outer peripheral portion after drying after the film is formed on the substrate according to the first embodiment of the present invention. Fig.
9 is a schematic plan view for explaining a second example of a film liquid discharge state on a film formation surface on a substrate according to the first embodiment of the present invention.
10 is a partially enlarged schematic plan view for explaining a second example of a film liquid discharge state with respect to a film formation surface on a substrate according to the first embodiment of the present invention.
11 is a partially enlarged schematic plan view for explaining a discharge state of a film liquid on a film-formed surface on a substrate according to a second embodiment of the present invention.
12 is a partially enlarged schematic plan view for explaining a discharge state of a film liquid on a film formation surface on a substrate according to a third embodiment of the present invention.
13 is a schematic longitudinal side view showing a state of formation of a film on a substrate according to a fourth embodiment of the present invention.
Fig. 14 is a schematic longitudinal side view showing the state of formation of a film on a substrate according to a fifth embodiment of the present invention. Fig.
15A is a schematic plan view showing a first example of a film formation state on a substrate according to the sixth embodiment of the present invention.
Fig. 15B is a schematic plan view showing a second example of the film formation state on the substrate according to the sixth embodiment of the present invention. Fig.
16A is a schematic plan view showing a first example of a film-formed state on a substrate according to a seventh embodiment of the present invention.
16B is a schematic plan view showing a second example of a film-formed state on a substrate according to the seventh embodiment of the present invention.
17 is a schematic perspective view for explaining a conventional problem.
18A is a schematic plan view for explaining a conventional problem.
18B is a schematic front view for explaining a conventional problem.
19A is a schematic plan view for explaining a conventional problem.
19B is a schematic front view for explaining a conventional problem.
20 is a schematic front elevation view for explaining a conventional problem.
FIG. 21 is a schematic longitudinal elevation view for explaining a conventional problem; FIG.

Hereinafter, a film forming apparatus and a film forming method according to an embodiment of the present invention will be described with reference to the drawings.

First, a film forming apparatus and a film forming method according to the first embodiment of the present invention will be described. As shown in Fig. 1, the film forming apparatus 1 includes a substrate 2 made of a semiconductor wafer, which is transported in the direction of arrow A, and a feed-type inkjet head 3 is provided above the transport path. Is fixedly installed. The ink jet head 3 is a side-by-side ink jet head in which a plurality of (five in the illustrated example) individual ink jet heads 3a are arranged in a zigzag manner in the width direction B perpendicular to the carrying direction A. A plurality of nozzles 4 are arranged at the same nozzle pitch 4P in the width direction B on the lower surface (discharge surface) of each individual ink jet head 3a in the ink jet head 3. [ Accordingly, a large number of nozzles 4 are arranged in the ink jet head 3 at a uniform nozzle pitch 4P in the width direction B as a whole. Data indicating the positions of all the nozzles 4 are stored in the memory means 5 of the ink-jet head 3.

The discharge of the film liquid onto the surface of the substrate 2 is determined depending on the position of the substrate 2 in the carrying direction A and the position of the film forming surface 2A on the surface of the substrate 2 BMP data (bitmap data) is stored in the storage means 5. [ This BMP data is used to determine the number of nozzles 4 for discharging the film liquid to each nozzle 4 of the inkjet head 3, the amount of the film liquid to be discharged from each nozzle 4, Can be specified. Therefore, the ejection pitch of the film liquid of each nozzle 4 can be arbitrarily designated. The substrate 2 is conveyed at a speed of 2 mm / sec to 100 mm / sec, preferably 10 mm / sec to 50 mm / sec, The discharge frequency of the film liquid, the discharge frequency, the arrangement state of the nozzles 4, and the like.

The application state of the film liquid on the film formation surface 2A of the substrate 2 per unit area is changed from all the nozzles 4 of the inkjet head 3 to the film liquid 6) (in the case of a 100% discharge state), in the relationship between the nozzle pitch 4P and the discharge pitch Ap in the transport direction, all of the film liquid 6 Lines) overlap without gaps.

Fig. 2 shows an example of the arrangement of the nozzles 4 on the lower surface of the inkjet head 3. As shown in Fig. Two line-type inkjet nozzles 3b are attached in parallel on the lower surface of each individual inkjet head 3a of the inkjet head 3. [ The positions of the nozzles 4 of one line-type inkjet nozzle 3b and the positions of the nozzles 4 of the other line-type inkjet nozzle 3b are the same as the nozzle pitch 4P ) By half a pitch. Therefore, the actual arrangement pitch of the nozzles as a whole of the ink-jet head 3 is half the nozzle pitch 4P of the individual line-type ink-jet nozzles 3b. The number of the line-type inkjet nozzles 3b, the arrangement of the nozzles 4, and the like are not limited to these.

Here, the discharge method of the film liquid discharged from the inkjet head 3 will be described. 3A shows a case in which, when the ejection data corresponding to one nozzle 4 is turned ON once on the BMP data of the image data in a manner called binary mode, only one drop of the film liquid 6 of the predetermined ejection amount is ejected Mode. Fig. 3B shows a case where a number 1 to 7 (3 in this example) is added to the ejection data corresponding to one nozzle 4 on the BMP data of the image data in a manner called multi-drop mode, And the film liquid 6 of the predetermined discharge amount is discharged continuously in three droplets only by ON. 3C shows a state in which the liquid amount 6 of the discharged amount is inputted only by turning ON once by inputting the data of the discharge amount into the discharge data corresponding to one nozzle 4 on the BMP data of the image data in a manner called DPN mode And discharging mode. The present invention can adopt any of these schemes, but in this embodiment, the binary mode scheme shown in Fig. 3A is employed. The reason is that the binary mode method does not require complicated electric control as compared with the other two methods.

4 illustrates a mode in which the film liquid 6 is ejected from the inkjet head 3 onto the film formation surface 2A on the surface of the substrate 2. [ Since the film formation surface 2A of the substrate 2 is circular, the contour thereof does not coincide with the conveying direction A and also does not coincide with the width direction B, and the width direction alignment of the nozzles of the inkjet head 3 The length is longer than the maximum width in the width direction of the film formation surface 2A of the substrate 2 (the diameter D1 of the film formation surface 2A). The entire circular area as the film formation surface 2A is divided into three rectangular areas 20 existing in the center of the width direction B and in contact with the circular contour at the center, two left and right partial circular areas 21, And six upper and lower partial circular regions 22. In this case, the number of the nozzles 4 for discharging the film liquid in the inkjet head 3 is constant regardless of the moving position of the moving direction A in the three rectangular areas 20. Specifically, The film liquid is ejected from the nozzles 4 (all the nozzles 4 in this embodiment) by a certain number of them by the three individual ink jet heads 3a. In contrast, in the eight partial circular areas 21 and 22, the number of nozzles 4 for discharging the film liquid in the inkjet head 3 changes in accordance with the star of the moving position in the carrying direction A. As a result, the discharge state of the film liquid follows the circular contour, and as a result, the film liquid is discharged so as to have an accurate circular shape in the entire area of the circular film-forming surface 2A. The above control is performed by the control means 7 (see Fig. 1) on the basis of the BMP data or the like stored in the storage means 5.

In this case, of the eight partial circular areas 21 and 22, the two left and right partial circular areas 21 are divided into a plurality of areas (a to l in the illustrated example) with respect to the carrying direction A And the discharge amount of the film liquid from the individual nozzles 4 is changed in accordance with the stars of these areas. The upper and lower four partial regions 22 except for the upper and lower central regions in the width direction B are divided into a plurality of regions 6 to 6 in the conveying direction A, The discharge amount of the film liquid from the individual nozzles 4 is changed according to the star of the area of the nozzle. The upper and lower partial circular regions 22 in the center of the width direction B are also divided into a plurality of regions in the carrying direction A and the regions The discharge amount of the film liquid may be changed, but such a process may not be performed. The above control is performed by the control means 7 on the basis of the BMP data or the like stored in the storage means 5.

Here, when the number of the nozzles 4 for discharging the film liquid is changed as the characteristic of the inkjet head 3, it is known that the film thickness immediately after discharge becomes uneven. This phenomenon is called a crosstalk phenomenon. Specifically, when the number of the nozzles 4 for discharging the film liquid is small, the discharge amount of the film liquid from the individual nozzles 4 is increased, and when the number of the nozzles 4 for discharging the film liquid is large, The discharge amount of the film liquid from the discharge port 4 is reduced. Therefore, if only the number of the nozzles 4 for discharging the film liquid is changed to eight (or six) of the partial circular regions 21 and 22 described above, the film thickness immediately after the discharge becomes uneven. Concretely, as the partial circular region 21 shown in Fig. 5A moves from the central portion to the both ends in the vertical direction, the number of the nozzles 4 for gradually discharging the film liquid decreases. Therefore, as shown in FIG. 5B, the film 8 immediately after being discharged onto the film formation surface 2A of the surface of the substrate 2 has a thin film thickness at the center in the vertical direction and gradually increases in film thickness It becomes thick. Therefore, in this embodiment, as shown in Fig. 6A (i.e., as shown in Fig. 4), the partial circular area 21 is divided into a plurality of (for example, 12) 1, the discharge amount of the film liquid from the individual nozzles 4 is increased in the regions f and g at the central portion in the up-and-down direction, and the discharge amount is reduced as the region is shifted to the regions at both ends. As a result, as shown in FIG. 6B, the film 8 immediately after being discharged onto the film formation surface 2A of the surface of the substrate 2 has a uniform film thickness over the entire upper and lower regions a to l. In order to uniformize the film thickness in this way, the discharge amount of the film liquid from the individual nozzles 4 with respect to the above-mentioned 12 regions is measured in advance by the weight scale and stored in the memory means 5. Based on this stored data, It is preferable that the control means 7 automatically corrects the discharge amount of the film liquid in the circular area 21 to be uniform. By doing the same for the other partial circular regions 21 and 22, the film thickness immediately after the discharge is uniform over the entire region of the circular film-forming surface 2A. The above control is performed by the control means 7 on the basis of the BMP data or the like stored in the storage means 5.

Fig. 7A shows the coating state of the film 8 on the substrate 2, which has a uniform film thickness immediately after discharge. This application state prevents the film liquid from adhering from the curved outer peripheral edge 2b of the substrate 2 toward the back side 2c so that the boundary between the curved peripheral edge 2b and the flat film- 2d, the adhesion of the film 8 (film liquid) is stopped. The outer peripheral edge 8b of the film 8 is located at or near the boundary 2d between the curved outer peripheral edge 2b of the substrate 2 and the planar film formation surface 2A. When the outer circumferential end of the substrate 2 is curved and does not protrude to the outer circumferential side as shown in the drawing, a portion which can be regarded as the outer circumferential end of the substrate 2 and a boundary between the planar film- (8b) of the film (8). The outer periphery end portion 8b of the film 8 does not reach the back side portion 2e of the outer peripheral edge portion 2b of the substrate 2 when the viewpoint is changed.

When the membrane 8 is dried under such a condition, as shown in Fig. 7B, only the narrow stripe-shaped region 23 existing on the inner peripheral side from the outer peripheral end 8b of the dried film 8A rises, And the region on the center side thereof is relatively thin and uniform. This phenomenon is commonly referred to as a coffee ring phenomenon. 8A, the stripe-shaped area 23 on the inner peripheral side of the outer peripheral end 8b of the film 8 immediately after the discharge is gradually shifted from the inner peripheral side to the outer peripheral side, The film liquid is discharged from the predetermined nozzle 4 so that the film thickness becomes thin. In this case, the surface (upper surface) 8c of the film 8 in the stripe-shaped region 23 immediately after discharging of the film liquid is inclined downward from the inner periphery to the outer periphery and curved slightly slightly have. Then, when the film 8 is dried from such a state, the film thickness becomes uniform over the entire area from the outer peripheral end 8Ab of the film 8A to the center as shown in Fig. 8B. Specific control for this is performed as follows.

Namely, as shown in Fig. 9, a plurality of (12 in the illustrated example) sector regions 24 are divided in an equiangularly circumferential direction with respect to the circular film formation surface 2A on the substrate 2, The striped area 23 on the outer periphery is divided into a plurality of partial circular arc areas (a to f) in the radial direction. Then, the discharge amount of the film liquid from the nozzle 4 is corrected for each of the six partial arc regions (a to f) with respect to each of the 12 sector regions 24, and as a result, 8A are made uniform in thickness. In order to ensure the ease of control and accuracy, it is preferable to divide the entire circumference of the stripe-shaped region 23 in the circumferential direction without correcting the discharge amount of the film liquid from the nozzle 4, The correction data individually corrected for one sector region 24 is stored in the storage means 5. [ 10, the notch portion 2B has a plurality of (six in the illustrated example) V-shaped regions 2 in the radial direction as one partitioning portion as shown in Fig. 10, (a to f), and the discharge amount is corrected for these V-shaped regions (a to f) in the same manner as described above, a uniform film thickness can be obtained after drying even for the notched portion 2B. Further, even when an orientation flat having a shape other than the notch portion 2B is formed, the same operation is performed on this orientation flat. The above control is performed by the control means 7 on the basis of the BMP data or the like stored in the storage means 5.

11 is a schematic plan view of a film forming apparatus 1 according to a second embodiment of the present invention in which a film liquid 6 is supplied from the inkjet head 3 to the film formation surface 2A on the surface of the substrate 2. [ As shown in Fig. The film forming apparatus 1 according to the second embodiment is largely different from that according to the first embodiment in that the substrate 2 is a rectangular glass substrate or a resin substrate, And is inclined with respect to the body. 11, the contour of the substrate 2 does not coincide with the transport direction A and does not coincide with the width direction B, and the arrangement length of the nozzles in the width direction of the inkjet head 3 is shorter than that of the substrate 2 is longer than the maximum width L1 in the width direction of the film formation surface 2A. In this case, the entire rectangular area as the film formation surface 2A is divided into three rectangular areas 25 existing at the center of the width direction B and in contact with the rectangular contour of the corner part, two right and left non- , And upper and lower non-rectangular areas 27, respectively. In each of the three rectangular areas 25, the number of the nozzles 4 for discharging the film liquid in the inkjet head 3 is constant regardless of the moving position of the moving direction A, and specifically, The film liquid is ejected from the nozzles 4 (all the nozzles 4 in this embodiment) by a certain number of them by the three individual inkjet heads 3a. On the other hand, in the eight non-rectangular areas 26 and 27, the number of the nozzles 4 for discharging the film liquid in the ink jet head 3 changes in accordance with the star of the moving position in the carrying direction A. As a result, the discharge state of the film liquid follows the rectangular contour of the oblique posture, and as a result, the film liquid is discharged to the entire area of the rectangular film-forming surface 2A in the oblique posture. The above control is performed by the control means 7 on the basis of the BMP data or the like stored in the storage means 5. In this case, the two left and right non-rectangular areas 26 are divided into a plurality of (four in the illustrated example) areas a to d with respect to the carrying direction A, The discharge amount of the film liquid from the nozzles 4 of the film 4 changes. The upper and lower eight non-rectangular areas 27 are divided into a plurality of areas (a to f) (a to e in some cases, six to six in the illustrated example) with respect to the carrying direction A And the discharge amount of the film liquid from the individual nozzles 4 is changed in accordance with the stars of the regions. In addition, control for making uniform the film thickness of the film 8 immediately after the discharge onto the substrate 2 is performed is substantially the same as that described above with reference to Figs. 6A and 6B , And the control for making the film thickness variation of the film 8A uniform after drying is substantially the same as that described above with reference to Figs. 8A and 8B. The relationship between the outer peripheral edge 2b of the substrate 2 and the formation positions of the films 8 and 8A is substantially the same as that described above with reference to Figs.

12 is a schematic plan view of a film forming apparatus 1 according to a third embodiment of the present invention. The film forming apparatus 1 includes a film forming surface 2A on the surface of a substrate 2, a film liquid 6 from the inkjet head 3, As shown in Fig. The film forming apparatus 1 according to the third embodiment is largely different from that according to the second embodiment in that a substrate 2 made of a rectangular glass substrate or a resin substrate is arranged in the transport direction A, In the non-inclined posture. The lengthwise arrangement length of the nozzles of the inkjet head 3 is longer than the maximum length L2 in the width direction of the film formation surface 2A of the substrate 2 (the length of one side of the film formation surface 2A). The change in the number of the nozzles 4 for discharging the film liquid in the inkjet head 3 with respect to the film formation surface 2A on the substrate 2 can be prevented by passing through the lower side of the rectangular film formation surface 2A And the case of changing from a certain number to 0 when passing through the upper side of the film formation surface 2A. However, in such a case, strict control is required on the positional relationship between the outer peripheral edge 2b of the substrate 2 and the film formation surface 2A. In this embodiment, three rectangular areas 28 at the center of the width direction B are divided by three individual ink jet heads 3 into a predetermined number of nozzles 4 (in this embodiment, All the nozzles 4). On the other hand, in the two left and right partial rectangular regions 29, the film liquid is ejected from a smaller number of the nozzles 4 than the predetermined number. Therefore, in these two rectangular regions 29, the amount of the film liquid discharged from the individual nozzles 4 is smaller than the three rectangular regions 28 in the central portion. In addition, the control for making the film thickness non-uniformity of the film 8A after drying substantially equal to the control described with reference to Figs. 8A and 8B is performed. The relationship between the outer peripheral edge 2b of the substrate 2 and the formation positions of the films 8 and 8A is substantially the same as that described above with reference to Figs.

Fig. 13 illustrates a film forming apparatus 1 according to a fourth embodiment of the present invention. The film forming apparatus 1 according to the fourth embodiment is different from the film forming apparatus 1 according to the first, second and third embodiments described above in that a rectangular or oblique posture When the plurality of convex portions 9 such as an electrode film or a part are present on the film formation surface 2A of the non-inclined posture, the amount of the film liquid to be discharged from the required nozzle 4 of the inkjet head 3 is electrically variable And the film thickness of the film 8A after drying is made uniform. In this case, bubbles and the like do not occur. The other controls are substantially the same as the respective cases of the first, second, and third embodiments described above.

Fig. 14 illustrates a film forming apparatus 1 according to a fifth embodiment of the present invention. The film forming apparatus 1 according to the fifth embodiment differs from that according to the first, second, and third embodiments described above in that a rectangular or oblique posture The amount of the film liquid discharged from the required nozzle 4 of the inkjet head 3 is set to be an electrical value of the amount of ejection of the ink from the nozzles 4 of the inkjet head 3 when a plurality of convex portions 9 such as electrode films or parts are present on the rectangular film- (Upper surface) of the film 8A after drying is made flat. Also in this case, bubbles and the like do not occur. The other controls are substantially the same as the respective cases of the first, second, and third embodiments described above.

15A and 15B illustrate a film forming apparatus 1 according to a sixth embodiment of the present invention. The point that the film forming apparatus 1 according to the sixth embodiment is different from those according to the first, second and third embodiments described above is that the film forming apparatus 1 according to the sixth embodiment differs from the film forming apparatus 1 according to the first, A plurality of closed regions 10 and a film are formed on the film-forming surface 2A of the circular shape and the rectangular film-forming surface 2A of a rectangular oblique or oblique orientation with a rectangular oblique orientation as seen from the plane (11). ≪ / RTI > The other controls are substantially the same as the respective cases of the first, second, and third embodiments described above. 7, 8, and 9 may be applied not only to the outer peripheral end of the film formation surface 2A but also to the peripheral edge of each of the closed regions 10. [

16A and 16B illustrate a film forming apparatus 1 according to a seventh embodiment of the present invention. The point that the film forming apparatus 1 according to the seventh embodiment is different from that according to the first, second, and third embodiments is that the film forming apparatus 1 on the circular substrate 2 On a film formation surface 2A of a circular shape and a rectangular film formation surface 2A of a rectangular or non-inclined posture in an oblique posture on a rectangular substrate 2 when viewed in plan view, a plurality of closed regions (11) and a region (10) in which a film is not formed. The other controls are substantially the same as the respective cases of the first, second, and third embodiments described above. 7, 8, and 9 may be applied to the peripheral edge portions of the respective closed regions 11, as shown in Fig.

In the above embodiment, the film thickness of the film 8A after drying formed on the substrate 2 can be set to a lower limit value of 300 nm and an upper limit value of 30 m or more, for example, 50 m.

In the case where the film 8A is formed by using the film forming apparatus 1 according to the above embodiment, 95% or more of the total discharge amount of the film liquid actually discharged from the inkjet head 3 is used for the formation of the film 8A Respectively. Therefore, the wasted film liquid was less than 5% of the total discharge amount. In this case, the wasted film liquid means a small amount of film liquid from the inside of the nozzle 4 and the surface of the nozzle 4 after cleaning the surface of the nozzle 4 before forming the film 8A, Is a total sum of the membrane liquids that have been subjected to short-circuiting (discarding) in a small amount in order to sort out the liquid. Therefore, when the film 8A is actually formed on the film formation surface 2A of the substrate 2, 100% or approximately 100% of the total ejection amount of the film liquid ejected from the inkjet head 3 is ejected from the film 8A .

The outer peripheral end portions 8b and 8Ab of the films 8 and 8A are arranged at the boundary 2d between the outer peripheral end portion 2b of the substrate 2 and the film formation surface 2A which forms a plane The outer peripheral end portions 8b and 8Ab of the films 8 and 8A may be located on the inner peripheral side or the outer peripheral side of the boundary 2d. Therefore, the configuration shown in Fig. 9 may be either on the inner side or on the outer side of the state shown in Fig.

In the above embodiment, five individual inkjet heads 3 are used, but the number of the individual inkjet heads 3 is not limited. For example, only one individual inkjet head 3 may be used.

Although the present invention is applied to the case where the film liquid 6 is discharged from all the nozzles 4 of the inkjet head 3 (in the case of a 100% discharge state) in the above embodiment, 70% to 95% To 95%.

The film liquid 6 used in the above embodiments is not particularly limited as long as it forms a functional film such as a photosensitive insulating film, a non-photosensitive insulating film, a resist film, a UV film, or the like.

In the above embodiment, the formation of the film 8A is completed while the substrate 2 is moved once in the carrying direction A. However, during the movement of the substrate 2 twice or more (including reciprocating movement) The film formation surface 2A of the substrate 2 may be divided into a plurality of regions as required and the film formation surface 2A of the substrate 2 may be divided into a plurality of regions, 8A may be formed.

In the above embodiment, the substrate 2 is moved and the inkjet head 3 is fixed. In contrast to this, the inkjet head 3 may be moved and the substrate 2 may be fixedly installed, or alternatively, 2, and 3 may be moved.

1: film forming apparatus 2: substrate
2A: film-forming surface of the substrate 2b: outer peripheral edge of the substrate
2c: back side of substrate 3: ink jet head
3a: individual ink jet head 4: nozzle
5: memory means 6:
7: control means 8: film (film immediately after discharge)
8A: film (film after drying) 9: convex portion

Claims (21)

Wherein a plurality of nozzles for ejecting the film liquid are arranged in the width direction so as to oppose the ejection face of the inkjet head and the film formation face of the substrate from which the film liquid is ejected from the nozzle so as to face the inkjet head and the substrate in the non- And the film liquid is discharged from the nozzle onto the film-formed surface of the substrate while relatively moving in a direction perpendicular to the width direction,
Wherein the length of the arrangement width of the nozzles of the ink jet head is set to be equal to or longer than a maximum length in the width direction of the film formation surface of the substrate when the substrate is relatively moved and until the relative movement of the both is completed, A nozzle for discharging the film liquid in the plurality of nozzles so as to stop the deposition of the discharged film liquid at the boundary between the film forming surface and the outer peripheral end of the substrate in order to suppress adhesion of the discharged film liquid from the outer peripheral end to the back surface side of the substrate Wherein the number of the nozzles is controlled to be variable. The method according to claim 1,
Wherein the form when the substrate is relatively moved with respect to the inkjet head is not a form of a rectangular substrate consisting of two sides parallel to the relative movement direction and two sides orthogonal to the relative movement direction. . 3. The method of claim 2,
Wherein the substrate is in the form of a disk. 3. The method of claim 2,
Wherein the substrate is in the form of a plate. 5. The method according to any one of claims 1 to 4,
Wherein the film thickness after drying of the film liquid discharged toward the film formation surface of the substrate is controllable so that the lower limit value is 300 nm and the upper limit value is 30 占 퐉 or more. 6. The method according to any one of claims 1 to 5,
Wherein a discharge amount of the film liquid discharged toward the film-formed surface of the substrate and used as a usable film after drying is 95% to 100% of the total discharge amount. 7. The method according to any one of claims 2 to 6,
A rectangular region having two sides adjoining a corner portion on the outer peripheral edge of the substrate and parallel to the relative movement direction and two edges orthogonal to the two directions is provided with a predetermined number of nozzles And controls to discharge the film liquid from a different number of nozzles in accordance with the star of the relative movement position for a non-rectangular area protruding from the rectangular area of the film formation surface of the substrate Device. 8. The method according to any one of claims 2 to 7,
Wherein the non-rectangular region is divided into a plurality of partial regions in the relative movement direction, and the amount of the film liquid discharged from the individual nozzles is variably controlled in accordance with the plurality of partial regions. 9. The method according to any one of claims 1 to 8,
Wherein the ink jet head is a parallel ink jet head in which a plurality of individual ink jet heads are arranged in a staggered arrangement with respect to the width direction. 10. The method according to any one of claims 1 to 9,
The discharge amount of the film liquid gradually increases toward the inner circumferential side in the stripe-shaped region connected to the inner circumferential side of the boundary between the film forming surface of the substrate and the outer circumferential end portion, and in the region connected from the stripe- So as to achieve the same discharge amount. 11. The method of claim 10,
Characterized in that said stripe pattern region is divided into a plurality of partial stripe pattern regions from the inner periphery side to the outer periphery side and the amount of film liquid discharged from each nozzle is variably controlled in accordance with the plurality of partial stripe pattern regions, . 12. The method according to any one of claims 1 to 11,
Wherein a plurality of closed regions in which the film is formed on the film formation surface and a region in which the film is not formed are formed by controlling the discharge and non-discharge of the film liquid with respect to the plurality of nozzles during the relative movement. 12. The method according to any one of claims 1 to 11,
Wherein a plurality of closed regions and a region in which a film is formed are formed on the film formation surface by controlling the ejection and non-ejection of the film liquid relative to the plurality of nozzles during the relative movement. Wherein a plurality of nozzles for ejecting the film liquid are arranged in the width direction so as to oppose the ejection face of the inkjet head and the film formation face of the substrate from which the film liquid is ejected from the nozzle so as to face the inkjet head and the substrate in the non- And the film liquid is discharged from the nozzle onto the film-formed surface of the substrate while relatively moving in a direction perpendicular to the width direction,
The form when the substrate is relatively moved with respect to the inkjet head is not a form of a rectangular substrate consisting of two sides parallel to each other in the relative moving direction and two sides orthogonal to this direction,
The length of the arrangement width of the nozzles of the inkjet head is set to be equal to or longer than a maximum length in the width direction of the film formation surface of the substrate when the substrate is relatively moved and until the relative movement of the nozzles is completed, And controls the number of nozzles for discharging the film liquid in the film forming apparatus. Wherein a plurality of nozzles for ejecting the film liquid are arranged in the width direction so as to oppose the ejection face of the inkjet head and the film formation face of the substrate from which the film liquid is ejected from the nozzle so as to face the inkjet head and the substrate in the non- And the film liquid is discharged from the nozzle onto the film-formed surface of the substrate while relatively moving in a direction perpendicular to the width direction,
The discharge amount of the film liquid gradually increases toward the inner circumferential side in the stripe-shaped region connected from the outer peripheral end to the inner peripheral side of the film-formed surface of the substrate, and in the region connected from the stripe-shaped region to the inner peripheral side, And a control unit for controlling the film forming apparatus. 16. A method according to any one of claims 1 to 3 and 5 to 15,
Wherein the substrate is a semiconductor wafer. 16. The method according to any one of claims 1 to 15,
Wherein the substrate is a glass substrate. 16. The method according to any one of claims 1 to 15,
Wherein the substrate is a resin substrate. Wherein a plurality of nozzles for ejecting the film liquid are arranged in the width direction so as to oppose the ejection face of the inkjet head and the film formation face of the substrate from which the film liquid is ejected from the nozzle so as to face the inkjet head and the substrate in the non- A film forming method of discharging the film liquid from the nozzle onto a film formation surface of the substrate while relatively moving the film liquid in a direction perpendicular to the width direction,
Wherein the length of the arrangement width of the nozzles of the ink jet head is set to be equal to or longer than a maximum length in the width direction of the film formation surface of the substrate when the substrate is relatively moved and until the relative movement of the both is completed, A nozzle for discharging the film liquid in the plurality of nozzles so as to stop the deposition of the discharged film liquid at the boundary between the film forming surface and the outer peripheral end of the substrate in order to suppress adhesion of the discharged film liquid from the outer peripheral end to the back surface side of the substrate And the number of films is controlled variably. Wherein a plurality of nozzles for ejecting the film liquid are arranged in the width direction so as to oppose the ejection face of the inkjet head and the film formation face of the substrate from which the film liquid is ejected from the nozzle so as to face the inkjet head and the substrate in the non- And the film liquid is discharged from the nozzle onto the film-formed surface of the substrate while relatively moving in a direction perpendicular to the width direction,
The shape when the substrate is moved relative to the inkjet head is not a rectangle formed by two sides parallel to the relative movement direction and two sides orthogonal to this direction,
Wherein a length of an arrangement width of the nozzles of the inkjet head is set to be equal to or longer than a maximum length in a width direction of a film formation surface of the substrate when the substrate relatively moves, And the number of nozzles for discharging the film liquid in the step (b) is variably controlled. Wherein a plurality of nozzles for ejecting the film liquid are arranged in the width direction so as to oppose the ejection face of the inkjet head and the film formation face of the substrate from which the film liquid is ejected from the nozzle so as to face the inkjet head and the substrate in the non- And the film liquid is discharged from the nozzle onto the film-formed surface of the substrate while relatively moving in a direction perpendicular to the width direction,
The discharge amount of the film liquid gradually increases toward the inner circumferential side in the stripe-shaped region connected from the outer peripheral end to the inner periphery of the film-formed surface of the substrate, and in the region connected from the stripe-shaped region to the inner circumferential side, The film forming method comprising:

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