KR20160108019A - Jig module for thin film deposition and thin film deposition apparatus including the same - Google Patents

Jig module for thin film deposition and thin film deposition apparatus including the same Download PDF

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Publication number
KR20160108019A
KR20160108019A KR1020150031775A KR20150031775A KR20160108019A KR 20160108019 A KR20160108019 A KR 20160108019A KR 1020150031775 A KR1020150031775 A KR 1020150031775A KR 20150031775 A KR20150031775 A KR 20150031775A KR 20160108019 A KR20160108019 A KR 20160108019A
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KR
South Korea
Prior art keywords
substrate
thin film
film deposition
jig
base
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KR1020150031775A
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Korean (ko)
Inventor
김진의
김동욱
Original Assignee
주식회사 레이언스
(주)바텍이우홀딩스
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Priority to KR1020150031775A priority Critical patent/KR20160108019A/en
Publication of KR20160108019A publication Critical patent/KR20160108019A/en

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16—Measuring radiation intensity
    • G01T1/24—Measuring radiation intensity with semiconductor detectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The present invention relates to a boat, which is opposed to a substrate, on which a thin film deposition material is placed; A jig including a bottom of the substrate and a side wall portion of the substrate side portion, the jig including an opening for accommodating the substrate and exposing the bottom of the substrate, and a storage portion for supporting the substrate edge; And a buffer material disposed between the substrate and the substrate.

Description

[0001] The present invention relates to a thin film deposition jig module and a thin film deposition apparatus including the thin film deposition jig module,

The present invention relates to a thin film deposition jig module, and more particularly, to a thin film deposition jig module and a thin film deposition apparatus including the thin film deposition jig module, which can improve a phenomenon that a thin film deposited when a substrate is removed from a jig is peeled off from the substrate .

A thin film deposition apparatus is used to form a thin film to produce an X-ray detector used for X-ray imaging.

FIG. 1 is a cross-sectional view schematically illustrating a conventional thin film deposition jig, and FIG. 2 is a view showing a state in which a thin film is peeled from a substrate in a process of removing a substrate from a jig of a conventional thin film deposition equipment.

Referring to FIG. 1, the thin film deposition jig 30 is placed in a thin film deposition apparatus for depositing a thin film by a vacuum deposition method, that is, an evaporation method, and receives and supports a substrate S on which a thin film is deposited.

The jig 30 includes a storage section 31 for storing a substrate S during a deposition process and an opening 33 for exposing the lower surface of the substrate S is formed in the storage section 31.

The substrate S is held in close contact with the upper surface 35 of the storage portion 31. In this state, the deposition process is performed to deposit the deposition material on the exposed surface of the substrate S through the opening 33 do. Then, the substrate S is removed from the jig 30 when the deposition process is completed.

The deposition material is deposited not only on the substrate S exposed through the opening 33 but also on the side surfaces and the bottom surfaces of the inside of the accommodating portion 31 exposed to the periphery of the substrate S. [

At this time, if the thickness of the deposited thin film 60 is as thin as several tens nm, there is no problem that the thin film 60 deposited on the substrate S is peeled off in the process of removing the substrate S.

However, as shown in FIG. 2, in the case of a photoconductive layer having a thickness of several um to several hundreds of um, the thin film 60 deposited in the process of removing the substrate S may be peeled off.

That is, the thick film is continuously formed along the exposed surface of the substrate S and the surrounding portion 31 of the substrate S, and is strongly adhered to the exposed surface of the surrounding containing portion 31. [ Accordingly, in the process of removing the substrate S from the jig 30, a problem that the thin film 60 is peeled off from the substrate S occurs.

SUMMARY OF THE INVENTION The present invention has a problem in that it is possible to improve a phenomenon in which a thin film deposited when a substrate is removed from a jig is peeled off from the substrate.

In order to achieve the above-mentioned object, the present invention provides a method of manufacturing a thin film deposition apparatus, comprising: a boat facing a substrate, on which a thin film deposition material is placed; A jig including a bottom of the substrate and a side wall portion of the substrate side portion, the jig including an opening for accommodating the substrate and exposing the bottom of the substrate, and a storage portion for supporting the substrate edge; And a buffer material disposed between the substrate and the substrate.

Here, the upper surface of the base portion includes a flat surface on which the buffer material is located; And between the flat surface and the opening, an inclined surface inclined downward.

The cushioning material may comprise graphite.

In accordance with another aspect of the present invention, there is provided a jig module for thin film deposition, comprising: a substrate accommodating a substrate on which a thin film is deposited; an opening for exposing a lower portion of the substrate; A side wall portion of the jig; And a cushioning material placed between the base and the substrate.

According to the present invention, a cushioning material having a certain thickness is formed between the substrate and the accommodating portion, thereby forming a stepped structure in which the cushioning material is recessed outwardly under the substrate. In addition, the upper surface of the inner end portion of the base portion, which is the bottom portion of the lower portion of the substrate, is formed as an inclined surface.

Such a structural feature makes it possible to prevent the thin film from being continuously deposited along the substrate and the base during the deposition process. Therefore, even if the substrate is removed from the jig, it is possible to improve the phenomenon that the thin film is peeled off from the substrate as in the conventional case.

1 is a cross-sectional view schematically showing a conventional thin film vapor deposition jig.
BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a thin film deposition apparatus,
3 is a cross-sectional view schematically illustrating a thin film deposition apparatus according to an embodiment of the present invention.
4 is an enlarged view of a portion "A" of Fig. 3; Fig.
5 is a view illustrating a process of removing a substrate from a jig of a thin film deposition apparatus according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 3 is a cross-sectional view schematically showing a thin film deposition apparatus according to an embodiment of the present invention, FIG. 4 is an enlarged view of a portion "A" of FIG. 3, FIG. 2 is a view illustrating a process of removing a substrate from a jig of a deposition apparatus. FIG.

Referring to FIGS. 3 and 4, the thin film deposition apparatus 100 for depositing a thin film by a vacuum deposition method, that is, an evaporation method, can be used for depositing a thick film such as a photoconductive layer of an X-ray detector. .

In the thin film deposition apparatus 100, a boat 120 on which a thin film deposition material is placed and a jig 130 for supporting and storing at least one substrate S on a boat 120 are disposed do. In the embodiment of the present invention, a case where a plurality of substrates S are accommodated in the jig 130 will be described as an example.

In this case, the jig 130 includes a storage part 131 for supporting and housing the edges of the plurality of substrates S during the deposition process. On the other hand, the jig 130 can operate to rotate about the center axis during the deposition process, so that a uniform thin film can be deposited on the substrate S.

The housing part 131 may include a base part 131a located under the substrate S and a side wall part 131b which is bent in an upward direction from the outside of the base part 131a and faces the side surface of the substrate S . That is, the storage portion 131 includes a base portion 131a under the substrate S and a side wall portion 131b on the side of the substrate s. An opening 133 exposing the lower surface of the substrate S is formed in the base portion 131a. Here, the thickness t1 of the base portion 131a may be approximately 3 mm to 5 mm, but is not limited thereto.

On the other hand, the buffer material 140 is placed on the upper surface 135 of the base portion 131a opposite to the edge of the substrate S. Then, the substrate S is placed on the buffer material 140.

The buffer material 140 is preferably made of a material having elasticity and substantially free from thermal deformation at a high temperature required in thin film deposition. For example, graphite may be used, but the present invention is not limited thereto.

The substrate S is separated from the upper surface 135 of the base portion 131 by the thickness t2 of the buffer material 140 by the buffer material 140. [ At this time, the thickness t2 of the buffer material 140 may be approximately 0.5 mm to 1 mm, but is not limited thereto.

The cushioning material 140 is disposed so as to be spaced apart from the inner end of the base 131a defining the opening 133, that is, the inner side 137 by a predetermined distance d. At this time, the distance d between the cushioning material 140 and the inner side surface 137 may be approximately 1 mm to 3 mm, but is not limited thereto.

The cushioning material 140 and the receiving portion 131 or the base portion 131a under the substrate S form a stepped shape in which the cushioning material 140 is recessed in the outer direction of the base portion 131a.

By such a stepped shape, as shown in FIG. 5, the deposition material is prevented from being continuously deposited along the substrate and the base portion (S 131a) during the deposition process. That is, since the empty space is formed between the inner end of the base 131a and the substrate S, the thin film 160 is formed between the inner end of the base 131a and the substrate S .

Therefore, even when the substrate S is removed from the jig 130, the phenomenon that the thin film 160 is peeled off from the substrate S can be improved.

On the other hand, the upper surface 135 of the base portion 131a has a flat surface 135a substantially parallel to the substrate S surface, a flat surface 135a and an opening 133 (i.e., And the inclined surface 135b, which is inclined downward, between the side surfaces (the side surfaces 137). At this time, the buffer material 140 is configured to be disposed on the flat surface 135a.

Here, the inclined surface 135b may have an inclination angle? Of approximately 10 to 35 degrees with respect to the flat surface 135a, but the present invention is not limited thereto.

When the inclined surface 135b inclined downward is formed at the end of the base 131a, the thickness of the end of the base 131a is reduced, (S) is increased.

Accordingly, the deposition material can be more effectively prevented from being continuously deposited along the substrate and the base portion (S, 131a) during the deposition process.

As described above, according to the embodiment of the present invention, a cushioning material having a certain thickness is formed between the substrate and the accommodating portion, thereby forming a stepped structure in which the cushioning material is recessed outwardly under the substrate. In addition, the upper surface of the inner end portion of the base portion, which is the bottom portion of the lower portion of the substrate, is formed as an inclined surface.

Such a structural feature makes it possible to prevent the thin film from being continuously deposited along the substrate and the base during the deposition process. Therefore, even if the substrate is removed from the jig, it is possible to improve the phenomenon that the thin film is peeled off from the substrate as in the conventional case.

The embodiment of the present invention described above is an example of the present invention, and variations are possible within the spirit of the present invention. Accordingly, the invention includes modifications of the invention within the scope of the appended claims and equivalents thereof.

100: thin film deposition equipment 120: boat
130: jig 131:
131a: base portion 131b:
133: aperture 135: upper surface
135a: flat surface 135b: inclined surface
137: inner side 140: cushioning material
160: Thin film
S: substrate

Claims (4)

A boat facing the substrate and on which the thin film deposition material is placed;
A jig including a bottom of the substrate and a side wall portion of the substrate side portion, the jig including an opening for accommodating the substrate and exposing the bottom of the substrate, and a storage portion for supporting the substrate edge;
A cushioning material placed between the base and the substrate
Wherein the thin film deposition apparatus comprises:
The method according to claim 1,
The upper surface of the base portion
A flat surface on which the buffer material is located;
Between the flat surface and the opening, an inclined surface inclined downward
Thin Film Deposition Equipment.
The method according to claim 1,
The cushioning material comprises graphite
Thin Film Deposition Equipment.
As a thin film vapor deposition jig module,
A jig containing a substrate on which a thin film is deposited, an opening exposing a lower portion of the substrate, and a receiving portion for supporting the lower edge of the substrate, the jig including a bottom portion of the substrate below and a side wall portion of the substrate side portion;
A cushioning material placed between the base and the substrate
And a thin film evaporation jig module.
KR1020150031775A 2015-03-06 2015-03-06 Jig module for thin film deposition and thin film deposition apparatus including the same KR20160108019A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150031775A KR20160108019A (en) 2015-03-06 2015-03-06 Jig module for thin film deposition and thin film deposition apparatus including the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150031775A KR20160108019A (en) 2015-03-06 2015-03-06 Jig module for thin film deposition and thin film deposition apparatus including the same

Publications (1)

Publication Number Publication Date
KR20160108019A true KR20160108019A (en) 2016-09-19

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KR1020150031775A KR20160108019A (en) 2015-03-06 2015-03-06 Jig module for thin film deposition and thin film deposition apparatus including the same

Country Status (1)

Country Link
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