KR20160093522A

KR20160093522A - Input device

Info

Publication number: KR20160093522A
Application number: KR1020150139132A
Authority: KR
Inventors: 스구루 와다; 도루 사와다; 준지 하시다; 아츠시 마츠다; 요시후미 마스모토; 도루 다카하시; 미노루 사토
Original assignee: 알프스 덴키 가부시키가이샤
Priority date: 2015-01-29
Filing date: 2015-10-02
Publication date: 2016-08-08
Also published as: JP6543754B2; KR101737699B1; JP2018206422A; JP2016146153A; JP6404762B2

Abstract

An objective of the present invention is to provide an input device capable of enlarging an area of a display region (input region) by reducing a wire area from an edge part of a substrate, preventing unnecessary sensitivity of a wire layer and an electrode layer, and excellently maintaining display quality. In order to accomplish the objective of the present invention, a plurality of first electrode layers (21) are connected with each other by a connection part (22) and continuously formed in a Y direction, and second electrode layers 31 are mutually independently formed and arranged in an X direction. Second wire layers (35a to 35d) are formed integrally with each other on the second electrode layer (31). Each second wire layer passes through a wire passage (32) formed through the second electrode layer (31A) to extend in the Y direction. Since the distance between the second wire layer and the first electrode layer (21) can be maintained, the second wire layer and the first electrode layer (21) can be prevented from having the unnecessary sensitivity.

Description

Input device {INPUT DEVICE}

The present invention relates to an input device in which a plurality of light-transmitting first electrode layers and second electrode layers are formed on the same surface of a transparent substrate.

An input device for detecting electrostatic capacitance is formed in a portable electronic device or the like, and the input device is disposed in front of a display panel such as a color liquid crystal panel.

The input device has a plurality of transparent electrode layers formed on a transparent substrate, and the electrode layer has a first electrode layer connected to the first direction and a second electrode layer connected to the second direction. When drive power is applied to one of the electrode layers of the first electrode layer and the second electrode layer, the detection output is obtained from the other electrode layer, and it is possible to detect at which point of the input device the finger or the like is approaching.

In this type of input device, both the first electrode layer and the second electrode layer are formed on the same surface of one substrate, so that the number of substrates can be reduced to be thin.

In this input device, it is necessary to form a first wiring layer (lead layer) connected to the first electrode layer and a second wiring layer (lead layer) connected to the second electrode layer on the surface of the substrate, but the first electrode layer The first wiring layer is wound around the edge of the substrate in the first direction and the second wiring layer is wound around the edge of the substrate in the second direction, . If a wiring region is formed at two mutually orthogonal sides of the substrate, this wiring region becomes a dead region which does not function as a detection region. Further, when the input device is mounted on the front panel, it is necessary to cover the wiring area with the decorative layer, and there is a problem that the display area of the display panel is narrowed by the amount of forming the decorative layer.

In the touch screen panel disclosed in Patent Document 1, a second sensing electrode continuing in the Y direction and a second connection pattern for connecting the second sensing electrodes in the Y direction are integrally formed, and on both sides of the second connection pattern, X And the first sensing electrodes are arranged independently of each other. Further, the drive pattern passes between the first sensing electrode and the second sensing electrode and extends continuously in the Y direction. The second connection pattern and the drive pattern are covered with an insulating layer, and the first detection electrodes adjacent to each other in the X direction are connected to each other by the first connection pattern formed on the insulating layer.

The touch screen panel includes a driving wiring connected to the second sensing electrode and a driving wiring connected to the first sensing electrode via the driving pattern by passing the driving pattern under the first connection pattern to the Y direction To the marginal portion facing toward the front end.

In the touch panel described in Patent Document 2, a plurality of first electrodes arranged in the X direction and a first conductor connecting the first electrodes are integrally formed on the surface of the substrate. Openings are formed in the respective first electrodes, and second electrodes are formed independently of each other in the openings. An insulating layer is formed on the first electrode, a second conductor is formed on the insulating layer, and the second electrode layers adjacent to each other in the Y direction by the second conductor are connected.

On the surface of the substrate, conductive segments extending in the Y direction are formed, and each of the conductive segments is connected to the first conductive line. At the intersection of the first conductive line and the conductive segment which should not be connected, The insulating layer is formed, and the conductive segments are connected to each other via the third conductive line formed on the insulating layer.

In this touch panel, since the conductive segment connected to the first electrode conducting in the X direction extends in the Y direction, the lead wire connected to the first electrode and the lead wire connected to the second electrode are arranged in the Y direction It can be wound only on the edge portion of the coil.

Japanese Laid-Open Patent Publication No. 2012-150782 Japanese Laid-Open Patent Publication No. 2013-143131

In the touch screen panel described in Patent Document 1, the driving pattern that conducts to the first sensing electrode passes through a position close to the side of the second sensing electrode. Therefore, electrostatic capacitance is formed between the drive pattern and the second sensing electrode, and the area where the drive pattern and the second sensing electrode face each other becomes the sensitivity region. When a finger or the like is approached, a detection output is generated between the drive pattern and the second sensing electrode, and this output is detected with respect to the original detection output for detecting the change in capacitance of the first and second sensitivity electrodes They are overlapped as noise.

In the touch panel described in Patent Document 2, the conductive segment conducting to the first electrode functions as a wiring layer (lead layer) extending in the Y direction. Since the conductive segment is separated from the second electrode located in the opening, The electrostatic coupling between the conductive segment and the second electrode is weakened and the problem that the area which should not have inherent sensitivity as described in Patent Document 1 becomes a sensitivity region is hard to occur.

However, in the touch panel disclosed in Patent Document 2, since the conductive segment extending in the Y direction passes between the first electrodes adjacent in the X direction, the first electrode adjacent to the X direction is allowed to pass through the conductive segment It is necessary to separate and arrange them, and it becomes difficult to arrange the electrodes densely.

In addition, since the complicated structure in which the second electrode is disposed in the opening portion formed in the first electrode is adopted, the number of the second conductive wires connecting the second electrodes to each other is made to be two . Therefore, when the number of electrodes is increased, the number of the second conductive lines and the number of the insulating blocks formed below the second conductive lines increase, and when a display panel formed behind is displayed, many second conductive lines and insulating blocks are easily visible, And the display quality is easily deteriorated.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described conventional problems, and it is an object of the present invention to provide a display device capable of enlarging an area of a display area (input area) by reducing a wiring area at an edge part of a substrate, And an object of the present invention is to provide an input device capable of suppressing the display quality and also maintaining a good display quality.

The present invention provides a light-transmissible substrate, wherein a first electrode layer and a second electrode layer formed of a light-transmitting conductive material are formed on a transparent substrate, a plurality of the first electrode layers are arranged in a first direction, In the second direction,

Wherein a connection portion for connecting one of the first electrode layer and the second electrode layer is integrally formed by the light transmissive conductive material, a first insulation layer and a first bridge connection layer are formed on the connection portion, The other electrode layer is electrically connected to each other by the first bridge connection layer,

The wiring layer extending in the first direction is formed in the second electrode layer and the wiring layer passing through the wiring passage is conducted to the other second electrode layer,

A second electrode layer and a second bridge connection layer are formed on the continuous portion of the wiring layer and the second electrode layer and the second electrode layer are separated from each other by the wiring passage, , And the other layer is made conductive by the second bridge connection layer.

In the input device of the present invention, since the wiring layer that conducts to the second electrode layer passes through the wiring path formed in the second electrode layer, the electrostatic coupling between the wiring layer and the first electrode layer can be weakened and the wiring layer and the first electrode layer It is possible to prevent an undesired sensitivity region from being formed in the pixel region.

Moreover, since the wiring layer passes through the inside of the second electrode layer, there is no need to form a passageway outside the second electrode layer for drawing out the wiring layer in the first direction. Therefore, the arrangement pitch of the second electrode layer and the like can be appropriately set regardless of the presence of the wiring layer.

In the present invention, it is preferable that an opening is formed in the region of the second electrode layer where the wiring passage is not formed. It is preferable that an opening is formed in the region of the first electrode layer.

In the above invention, it is possible to prevent a large difference in the area of the electrode layer between the second electrode layer having the wiring passage and the other electrode layer having no wiring passage, and it becomes easy to make the sensitivity in each electrode layer constant.

The input device of the present invention can be configured such that a plurality of the wiring layers pass through the wiring passage and each of the wiring layers conducts to the different second electrode layer.

Alternatively, a plurality of the wiring paths may be formed in the second electrode layer, and the wiring layer may pass through each of the wiring paths, so that each of the wiring layers is electrically connected to the different second electrode layers.

In the input device of the present invention, it is preferable that the wiring passage is formed at a central portion that bisects the second electrode layer in the second direction.

In the above configuration, the distance between each of the first electrode layers located on both sides of the second electrode layer and the wiring layer can be evenly divided.

In the input device of the present invention, the first insulating layer and the second insulating layer are formed by the same process using the same material, and the first bridge connecting layer and the second bridge connecting layer are formed by the same process As shown in Fig.

For example, in the input device of the present invention, the first electrode layer and the second electrode layer are rectangular, and the corner portions of the square face in the first direction and the second direction.

In the input device of the present invention, the wiring layer passes through a region facing the first electrode layer, and a protective layer formed of a conductive material is formed between the first electrode layer and the wiring layer at this position .

In this case, it is preferable that the protective layer is formed of the same transparent conductive material as the first electrode layer.

It is also possible that the protective connection layer connecting the protective layers arranged at intervals in the first direction passes through the wiring passage.

The protective layer may be formed continuously with the second electrode layer.

In the input device of the present invention, since the wiring layer that conducts to the second electrode layer passes through the wiring passage formed in the second electrode layer, the wiring layer and the first electrode layer can be disposed apart from each other, It becomes difficult to form an unnecessary sensitivity area in the detection area, and the detection accuracy can be enhanced.

Moreover, since the wiring layer passes through the inside of the second electrode layer, there is no need to form a passageway outside the second electrode layer for drawing out the wiring layer in the first direction. Therefore, the second electrode layer can be easily arranged regardless of the presence of the wiring layer, and for example, the arrangement pitch of the second electrode layer can be appropriately set.

Further, by forming the protective layer between the first electrode layer and the wiring layer, the electrostatic capacity between the first electrode layer and the wiring layer can be reduced, and the detection noise can be reduced.

1 is an exploded perspective view of a touch panel using an input device according to an embodiment of the present invention.
2 is a plan view showing the arrangement of electrodes of the input device according to the first embodiment of the present invention.
3 is an enlarged cross-sectional view of the input device shown in Fig. 2 cut along the line III-III.
Fig. 4 is an enlarged cross-sectional view of the input device shown in Fig. 2 taken along the line I-IV in Fig.
5 is a partial plan view showing the arrangement of electrodes of the input device according to the second embodiment of the present invention.
6 is a partial plan view showing the arrangement of electrodes of the input device according to the third embodiment of the present invention.
7 is an enlarged plan view of a second electrode layer showing a modification of the present invention.
8 is a plan view showing an electrode layer and a protective layer of an input device according to a fourth embodiment of the present invention.
9 is a partial plan view showing a modification of the protective layer of the input device of the fourth embodiment.
10 is a partial plan view showing an electrode layer and a protective layer of an input device according to a fifth embodiment of the present invention.
11 is a partially enlarged plan view showing an electrode layer and a protective layer of an input device according to a sixth embodiment of the present invention.
12 is a partially enlarged plan view showing an electrode layer and a protective layer of an input device according to a seventh embodiment of the present invention.
Fig. 13 is a diagram showing the difference in electrostatic capacitance between the wiring layer and the first electrode layer in the embodiment having the protection layer (the seventh embodiment) and the embodiment having no protection layer. Fig.

The touch panel 1 is shown in Fig. The touch panel 1 is composed of a front panel 2 and an input device 10 of the present invention positioned below the front panel 2.

The surface panel 2 forms a part of a case of various electronic devices such as a portable telephone, a navigation device, a game device, and a communication device. The surface panel 2 is made of translucent synthetic resin material such as acrylic or glass or the like, and can be seen from the outside of the surface panel 2 through the inside of the device.

The input device (10) has a transparent substrate (11). The substrate 11 is a resin sheet such as PET (polyethylene terephthalate). The surface panel 2 and the input device 10 are bonded via OCA (transparent adhesive adhesive).

In the input device 10, the Y direction is the first direction and the X direction is the second direction. 1 and 2, in the input device 10, a wiring region H is formed only on one edge portion 10y side in the first direction (Y direction) The detection area S is a detection area. A display panel 5 such as a color liquid crystal panel is housed in the case of the electronic apparatus and the display screen of the display panel 5 is displayed on the surface panel 2 and the detection area S of the input device 10 It is possible to see from outside through. Therefore, the detection area S is also the display area.

2, the input device 10 is shown in a posture in which the wiring region H faces upward. The input device 10 does not include the wiring region H in the edge portion 10x facing in the second direction (X direction), so that the detection region (display region) It is possible to extend to a position extremely close to the edge portion 10x of the substrate 10, and dead space for wiring can be eliminated.

A first electrode row 20 extending in a first direction (Y direction) and a second electrode row 20 extending in a second direction (X direction) are formed on a common surface of the substrate 11, (30) is formed.

In the first electrode row 20, a plurality of first electrode layers 21 and a first electrode layer 21 in which a connecting portion 22 for connecting (connecting) the first electrode layer 21 in the Y direction are integrally formed, Three rows of y1, y2, and y3 are formed in the input device 20, and this number is selected according to the area of the input device 10. [

The first electrode layer 21 is square (or diamond-like), the corner portions of the square face in the X direction and the Y direction, and the connecting portion 22 connects the corner portions of the first electrode layer 21 adjacent to the Y direction .

The second electrode lines 30 are regularly arranged at equal pitches in the X direction along the four columns of x1, x2, x3 and x4 and arranged in the Y direction along the respective columns of ya, yb, yc and yd And are regularly arranged at even pitches. The number of columns in the X and Y directions is selected according to the area of the input device 10. [ The second electrode layer 31 is square (or diamond-shaped), and each corner portion is oriented in the X direction and the Y direction. The sizes of the respective sides of the square of the first electrode layer 21 and the second electrode layer 31 coincide with each other.

The second electrode layer 31 is provided with a wiring passage 32 at the center thereof and the second electrode layer in which the wiring passage 32 is formed is denoted by 31A, Electrode layer 31 and the two-electrode layer 31.

In the second electrode layer 31A, the wiring passage 32 extends linearly in the Y direction. The wiring passage 32 is formed at the central portion in the X direction so that the second electrode layer 31A can be evenly divided in the X direction. The second electrode layer 31A is divided into two group electrode layers 33 and 33 by the wiring passage 32. [

The first electrode layer 21, the connecting portion 22, and the second electrode layers 31 and 31A are formed of the same transparent conductive material. The light-transmitting conductive material is formed of an ITO (indium tin oxide) layer, a metal nanowire layer typified by silver nano wire, a thin metal layer formed of a mesh, or a conductive polymer layer.

3 shows a cross-sectional view of the lamination structure of the intersections of the first electrode row 20 of the y1 row and the second electrode row 30 of the x2 row.

A first transparent insulating layer 41 covering the connection portion 22 of the first electrode array 20 is formed at the intersection portion and a first bridge connection layer 42 is formed on the first insulating layer 41, Respectively. The second electrode layer 31 adjacent to both sides in the X direction of the connection portion 22 is connected and conducted by the first bridge connection layer 42. [ The insulating layer 41 and the first bridge connection layer 42 are formed at all intersections of the first electrode row 20 and the second electrode row 30 and the second electrode layer 31) 31A are connected in the X direction. Similarly, in the x2, x3, and x4 columns, the second electrode layer 31 (31A) is connected in the X direction.

The transparent first insulating layer 41 is made of novolac resin or novolak resin and acrylic resin. The first bridge connection layer 42 is formed by laminating a conductive metal material such as Au (gold), an Au alloy, a CuNi alloy (copper-nickel alloy) and Ni (nickel) on the base layer of the ITO layer of amorpus , And more preferably a protective layer of an ITO layer of amorphous.

When the first electrode layer 21, the connecting portion 22 and the second electrode layer 31 are formed of ITO, they are formed of crystalline ITO to form the first electrode layer 21, the connecting portion 22, It is possible to selectively etch the crystalline ITO constituting the first insulating layer 31 and the amorphous ITO constituting the first insulating layer 32.

A connecting portion connecting the second electrode layers 31 and 31A adjacent to each other in the X direction is formed integrally with the second electrode layer at the intersection of the first electrode row 20 and the second electrode row 30 , And a plurality of second electrode layers 31 (31A) may be continuously formed in the X direction. In this case, the first electrode layers 21 independent from each other are disposed on both sides in the Y direction with the connecting portion interposed therebetween, and the first insulating layer 41 (31A) is formed on the connecting portion connecting the second electrode layers 31 And the first bridge connection layer 42 are formed and the first electrode layers 21 adjacent to each other in the Y direction are connected to each other by the first bridge connection layer 42. [

2, a first wiring layer 25a formed integrally with the first electrode layer 21 in the y1 row and a first wiring layer 25b formed in the wiring region H formed at one end in the Y direction of the substrate 11, the first wiring layers 25b and 25c formed integrally with each of the first electrode layers 21 in the row y3 are formed. Second wiring layers 35a, 35b, 35c, and 35d are formed in the wiring region H so as to be electrically connected to the second electrode lines 30, respectively.

The first wiring layers 25a 25b and 25c and the second wiring layers 35a 35b 35c and 35d are wound in the wiring region H and are conducted to a connector portion formed in the wiring region H.

As shown in Fig. 2, the second wiring layer 35a is formed integrally with the second electrode layer 31 located at the intersection of the x1 column and the ya column.

The second wiring layer 35b is formed integrally with the second electrode layer 31 located at the intersection of the x2 column and the yb column. The second wiring layer 35b passes through the inside of the wiring passage 32 formed in the second electrode layer 31A located at the intersection of the x1 column and the yb column and linearly extends in the Y direction to reach the wiring region H .

The second wiring layer 35c is formed integrally with the second electrode layer 31 located at the intersection of the x3 column and the yc column. The second wiring layer 35c includes a wiring passage 32 formed in the second electrode layer 31A located at the intersection of the x2 and yc columns and a wiring passage 32 formed in the second electrode layer 31A located at the intersection of the x1 and yc columns. And extends linearly in the Y direction through the inside of the wiring region 32 to reach the wiring region H. [

The second wiring layer 35d is formed integrally with the second electrode layer 31 located at the intersection of the x4 column and the yd column. The second wiring layer 35d has a wiring path 32 formed in the second electrode layer 31A located at the intersection of the x3 and yd columns and a wiring path 32 formed in the second electrode layer 31A located at the intersection of the x2 and yd columns. And the wiring passage 32 formed in the electrode layer 31A located at the intersection of the x1 column and the yd column and extends linearly in the Y direction to reach the wiring region H. [

The second wiring layer 35a is electrically connected to each of the second electrode layers 31 and 31A constituting the second electrode column 30 located in the x1 column and the second wiring layers 35b and 35c and 35d are electrically connected to x2 and each of the second electrode layers 31 and 31A constituting the second electrode column 30 located in the x3 and x4 columns.

The second wiring layers 35a, 35b, 35c and 35d are all formed integrally with the second electrode layer 31 by the light-transmitting conductive material constituting the second electrode layer 31. [

Fig. 4 shows the cross-sectional structure of the second electrode layer 31A located at the intersection of the x3 column and the yd column.

The second electrode layer 31A is divided into the division electrode layers 33 and 33 by the wiring passage 32. [ A second insulating layer 43 is formed on the wiring path 32 and the second wiring layer 35d and a second bridge connection layer 44 is formed thereon. The segment electrode layers 33 and 33 divided by the wiring path 32 are connected by the second bridge connection layer 44 so that the second electrode layer 31A can function as one electrode layer as a whole .

This is the same in all of the second electrode layers 31A formed at different places.

The second insulating layer 43 shown in Fig. 4 is formed by the same process with the same material as the first insulating layer 32 shown in Fig. The second bridge connection layer 44 shown in Fig. 4 is formed by the same process with the same material as the first bridge connection layer 42 shown in Fig.

The manufacturing process of the input device 10 uses a material on which a transparent conductive material such as ITO is formed on the surface of the substrate 11 and the conductive material is etched to form the first electrode row 20 and the second electrode row 30 The first wiring layers 25a, 25b and 25c and the second wiring layers 35a, 35b, 35c and 35d are formed.

Thereafter, a novolac resin and a resin layer of an acrylic resin are formed on the substrate 11, and the first insulating layer 41 and the second insulating layer 43 are simultaneously patterned by a photolithography process. Further, a laminate for a bridge connection layer is formed, and the first bridge connection layer 42 and the second bridge connection layer 44 are simultaneously formed by an etching process.

In the input device 10 shown in Fig. 2, a display image of the display panel 5 can be seen from the outside through the input device 10 and the surface panel 2. Fig. The input device 10 can be operated by dangling the finger on the surface panel 2 while viewing this display.

In this input device 10, an electrostatic capacitance is formed between the first electrode row 20 and the second electrode row 30. A pulse-like driving power is sequentially applied to one of the first electrode row 20 and the second electrode row 30 to detect the detection current flowing in the other electrode row when the driving power is applied. When the finger approaches, a capacitance is formed between the finger and the electrode layer, so that the detection current changes. By detecting the change of the detection current, it is possible to detect at which point of the surface panel 2 the finger is approaching.

Since the second electrode layer 31A is provided with the wiring passage 32 penetrating in the Y direction, the area thereof is substantially smaller than that of the electrode layer without the wiring passage 32, There is a concern. 2, an opening 31b is formed in the second electrode layer 31 in which the wiring passage 32 is not formed, so that the second electrode layer 31A having the wiring passage 32 and the wiring And the second electrode layer 31 having no passageway 32 does not have much difference in area.

The opening 21b is also formed in the first electrode layer 21 so that the difference in area between the first electrode layer 21 and the second electrode layer 31A is not greatly different.

The second wiring layers 35a, 35b, 35c, and 35d of the input device 10 extend in the Y direction through the wiring passages 32 formed in the second electrode layer 31A. Since the second wiring layers 35b, 35c and 35d are located between the branch electrode layers 33 and 33 of the second electrode layer 31A on both sides in the X direction, the second wiring layers 35b, 35c and 35d, The area where the one-electrode layer 21 is adjacent to the first electrode layer 21 can be reduced, and the electrostatic coupling between the second wiring layers 35b, 35c, and 35d and the first electrode layer 21 can be reduced. Therefore, it is possible to suppress the extra portions of the winding portions of the second wiring layers 35b, 35c, and 35d from having extra sensitivity, and to prevent the original sensing, which is detected between the first electrode row 20 and the second electrode row 30 Noise is hardly superimposed on the output, and the detection precision can be improved.

Moreover, since the second wiring layers 35b, 35c, and 35d pass through the inside of the second electrode layer 31A, it is not necessary to form a passage for passing the second wiring layer between adjacent electrode layers. Therefore, the arrangement of each of the electrode layers 21 and 31 is not restricted by the winding of the second wiring layer. For example, the electrode layers 21 and 31 can be arranged close to each other, Lt; / RTI >

5 is a partial plan view showing the arrangement structure of the electrodes of the input device 110 according to the second embodiment of the present invention. 5, the same constituent parts as those of the first embodiment shown in Fig. 2 are denoted by the same reference numerals, and detailed description thereof is omitted.

In the input device 110 shown in Fig. 5, the second wiring layer 35a is formed integrally with the second electrode layer 31A located at the intersection of the x1 column and the ya column. A wiring line 32 is formed in the second electrode layer 31A and a second wiring layer 35b passing through the wiring line 32 is connected to the second electrode layer 31 As shown in Fig.

the wiring path 32 formed in the second electrode layer 31A located at the intersection of the x1 column and the yb column and the wiring path 32 formed in the second electrode layer 31A located at the intersection of the x2 column and the yb column, The wiring layers 35c and 35d pass through. One of the second wiring layers 35c is formed integrally with the second electrode layer 31A located at the intersection of the x3 column and the yb column. The other second wiring layer 35d passes through the inside of the wiring passage 32 of the second electrode layer 31A located at the intersection of the x3 row and the yb column and is electrically connected to the second electrode layer 31 located at the intersection of the x4 row and the yb row, As shown in Fig.

the second electrode layer 31A located at the intersection of the x1 column and the yb column and the second electrode layer 31A located at the intersection of the x2 column and the yb column are formed in the wiring passage 32 and the second wiring layers 35c and 35d are formed in two The second insulating layer 43 and the second bridge connection layer 44 for connecting the left and right segment electrode layers 33 and 33 are arranged to extend between the two second wiring layers 35c and 35d Respectively.

The input device 10 of the first embodiment shown in Fig. 2 has the second electrode layer 31 (31A), since only one second wiring layer passes through the wiring passage 32 formed in the second electrode layer 31A. For example, the number of arrays in the X direction and the number of arrays in the Y direction are not the same. 5, since two or more second wiring layers pass through the wiring passages 32 of the second electrode layer 31A, the second electrode layers 31 (31A) It is possible to configure the number of arrays in the Y direction to be larger than that in the X direction.

6 is a partial plan view showing the arrangement structure of the electrodes of the input device 210 according to the third embodiment of the present invention. Hereinafter, only differences from the input device 110 of the second embodiment shown in Fig. 5 will be described.

The input device 210 shown in Fig. 6 includes a second electrode layer 31A located at the intersection of the x1 and yb columns and two wiring passages 32 and 32 at the second electrode layer 31A located at the intersection of the x2 and yb columns Are separately formed. The second wiring layer 35c passes through the inside of the one wiring passage 32 and the second wiring layer 35d passes through the inside of the other wiring passage 32. [

In the second electrode layer 31A, since the two wiring paths 32 are formed, the electrode layer is divided into the three divided electrode layers 33, 33, and 33. In each of the wiring paths 32, a second insulating layer 43 and a second bridge connection layer 44 are formed to cover the second wiring layer.

The second electrode layer 31A located at the intersection of the x2 column and the yb column has the second insulating layer 43 and the second bridge connection layer 44 covering one wiring path 32 and the other wiring path 32 and the second bridge connection layer 44 are formed at a distance in the Y direction. This makes it easy to prevent the phenomenon that the two sets of the second insulating layer 43 and the second bridge connection layer 44 arranged close to each other appear as if they are integral with each other.

Fig. 7 shows a modification of the present invention.

The second electrode layer 31A is shown in Fig. In the second electrode layer 31A, the group electrode layers 33 and 33, which are divided in the X direction, are connected by a connecting portion 37. [ The group electrode layers 33 and 33 and the connecting portion 37 are integrally formed of the same conductive material. The wiring paths 32 and 32 are formed by being divided in the Y direction with the connection portion 37 therebetween. The second wiring layers 35e and 35e are disposed in the wiring paths 32 and 32 and are separated with the connection portion 37 therebetween.

In this structure, the second insulating layer 45 and the second bridge connection layer 46, which cover the connection portion 37, are formed to extend in the Y direction, and the second bridge connection layer 46 is formed The second wiring layers 35e and 35e are connected to each other and rendered conductive.

Fig. 8 shows an input device 310 according to the fourth embodiment of the present invention.

In the input device 10 of the first embodiment shown in Fig. 2, the second wiring layer 35d extending in the Y direction from the second electrode layer 31 located at the intersection of the x4 and yd columns is formed of xa, xb, xc and xd of the first electrode layer 21, the first electrode layer 21 and the second electrode layer 21 are opposed to each other. The second wiring layer 35c faces the respective corner portions of the first electrode layer 21 located on both sides in the X direction when passing through the respective columns of xa, xb, and xc. The second wiring layer 35b faces each corner of the first electrode layer 21 located on both sides thereof when passing through each column of xa and xb. The second wiring layer 35a faces the corner of the first electrode layer 21 when passing through the row of xa.

Therefore, a capacitance is formed between the two layers at the portions where the corner portions of the second wiring layers 35a, 35b, 35c, and 35d and the first electrode layer 21 face each other. 35b of the second wiring layer 35a is opposed to the corner of the first electrode layer 21, which increases in the order of the second wiring layers 35c, 35d,. The portion where the corner portions of one second wiring layer and one first electrode layer 21 face each other is a short length and the electrostatic capacitance is not so large at that portion. However, the second electrode layer 21, the cumulative value of the electrostatic capacitance becomes large, and the detection noise may increase slightly.

Therefore, in the input device 310 of the fourth embodiment shown in Fig. 8, the intersection of each column of ya, yb, yc and yd and the intersection of xa column, the intersection of each column of yb, yc and yd and the column of xb, A protective layer 51 is formed between the second wiring layers 35a, 35b, 25c, and 25d and the first electrode layer 21 at the intersections of the columns and the columns xd and the intersections of the columns yd and xd.

The protective layer 51 is formed of the same transparent conductive material as that of the first electrode layer 21 and the second electrode layer 31. Although the shape of the protective layer 51 is not particularly limited, in the embodiment shown in Fig. 8, the second wiring layers 35a, 35b, 35c, and 35d As shown in Fig.

Each of the plurality of protection layers 51 is independent of each other and is not connected to any of the first electrode layer 21, the second electrode layer 31 and the second wiring layers 35a, 35b, 35c, and 35d, have. By forming the protective layer 51, the electrostatic capacitance between the second wiring layers 35a, 35b, 35c, and 35d and the first electrode layer 21 can be reduced.

Fig. 9 shows a modification of the protective layer formed in the input device 310 of the fourth embodiment.

The protective layer 55 shown in Fig. 9 has a linear portion 55a interposed between the second wiring layer 35c and the first electrode layer 21 and a linear portion 55b interposed between the two sides of the first electrode layer 21 in the X direction And an inclined portion 55b extending obliquely with respect to both the Y direction and the Y direction. Since the portion of the first electrode layer 21 opposed to the second wiring layer 35c is surrounded by the protective layer 55 in this modified example, the electrostatic charge between the first electrode layer 21 and the second wiring layer 35c The capacity can be further reduced.

Fig. 10 shows an input device 410 according to the fifth embodiment of the present invention.

In the fifth embodiment, the protective layer 52 located between the second wiring layer 35c and the first electrode layer 21 is formed continuously with the second electrode layer 31 or 31A located closest to the second wiring layer 35c have. In this embodiment, since the potential of the protection layer 52 is always the same as that of the second electrode layer 31 or 31A close thereto, it is possible to prevent the protection layer 52 from being charged individually, The effect of lowering the electrostatic capacity between the second wiring layer and the first electrode layer 21 can be enhanced.

11 shows an input device 510 according to the sixth embodiment of the present invention. 11, only the second electrode layers 31 and 31A and the second wiring layer 35c located in the row yc are taken out and enlarged.

In the sixth embodiment, the protective layers 53 disposed between the second wiring layer 35c and the first electrode layer 21 are connected to each other by the protective connection layer 54. [ The protective connection layer 54 passes through the wiring path 32 together with the second wiring layer 35c. The second insulating layer 43 and the second bridge connection layer 44 are formed so as to cover both the second wiring layer 35c and the protective connection layer 54. [

In the sixth embodiment, since the plurality of protection layers 53 can be set to the same potential, it is possible to avoid that the plurality of protection layers 53 are individually charged so that the protection layers 53 have different potentials from each other , The effect of lowering the electrostatic capacity can be enhanced.

12 shows an input device 610 according to a seventh embodiment of the present invention.

The input device 610 of the seventh embodiment is similar to the input device 110 of the second embodiment shown in Fig. 5 except that the intersection of the x1 and yb columns and the second electrode layer 31A The second wiring layer passes through two wiring layers 35c and 35d. Likewise, yc columns, yd columns, ye columns, ... There is a portion where the second wiring layer passes through the second electrode layer 31A.

This input device 610 has an opening 21b formed in the first electrode layer 21 and an opening 31b formed in the second electrode layer 31 in the same manner as the input device 10 of the first embodiment shown in Fig. Is formed. Then, xa, xb, xc, ... And y, yb, yc, ... The protection layer 51 is formed at each of the two intersections of the columns of the first wiring layer and the second wiring layer, The protective layer 51 is formed independently of the first electrode layer 21 and the second electrode layers 31 and 31A.

In the embodiment shown in Fig. 12, xa, xb, xc, ... Two second wiring layers pass between the first electrode layers 21 adjacent to each other in the X direction. By forming the protective layer 51 between the two wiring layers and the first electrode layer 21, The electrostatic capacity between the second wiring layers 35a, 35b, 35c, ... and the first electrode layer 21 can be reduced.

Fig. 13 shows the simulation results showing the effect of the protective layer 51. Fig.

This simulation compares the input device 610 of the seventh embodiment having the protective layer 51 shown in Fig. 12 with the input device 110 of the second embodiment having no protective layer shown in Fig. 5 . Fig. 13A shows the result of the input device 610 having the protective layer 51 and Fig. 13B shows the result of the input device 110 having no protective layer 51. Fig.

In the simulation, the width of one side of each of the first electrode layer 21 and the second electrode layer 31 is 3 mm, the width of the second wiring layers 35a, 35b, ... is 45 mu m, The distance delta in the X direction between the edge portions of the second wiring layer and the first electrode layer 21 when the layer 51 was not formed was set to 30 mu m. The distance is the same in all portions of the opposing portions of the second wiring layer and the first electrode layer 21. The protective layer 51 has a width dimension in the X direction of 500 mu m and a length dimension in the Y direction of 1.2 mm. The openings 21b and 31b were 3 mm x 0.18 mm.

In the simulation shown in Fig. 13, the first electrode lines 20 are arranged in 12 columns from y1 to y12, and the second electrode columns 30 are arranged in 21 columns from x1 to x21.

In the detection operation using this input device, the first electrode row 20 is set to y1, y2, y3, ... Are selected in this order as drive electrodes, and drive voltages are sequentially applied. During the period in which the first electrode row 20 of y1 is selected as the driving electrode, the second electrode row 30 is set to x1, x2, x3, ... And x1, x2, x3, ..., The output of which is detected in this order. Next, during a period in which the first electrode row 20 of y2 is selected as the driving electrode, the second electrode row 30 is set to x1, x2, x3, ... And the output is detected as a detection electrode. This is y3, y4, y5, ... The position where the finger approaches the surface panel 2 can be detected on the X-Y coordinate.

In the simulation shown in Fig. 13, during the period in which the first electrode row 20 of y1 is selected as the driving electrode, the second electrode row 30 is set to x1, x2, x3, x4, ... X1, x2, x3, x4, ... The capacitance between the second electrode column 30 selected in order of the first column and the electrode column 20 of the column y1 was obtained. Next, during a period in which the first electrode row 20 of y2 is selected as the driving electrode, x1, x2, x3, x4, ... And the electrostatic capacity between the selected second electrode column 30 and the electrode column 20 in the y1 row were sequentially selected. Let y3, y4, y5, ... , y12, and so on.

13 (A) and 13 (B), the abscissa indicates the number of rows x1, x2, x3, ... of the second electrode column 30 sequentially selected as the detection electrodes. , x21, and the vertical axis represents y1, y2, y3, ... , the first electrode column 20 of each column of y12, and x1, x2, x3, ... , and the capacitance (unit: pF) between the second column of electrodes 30 in each column of x21.

As shown in Fig. 13 (A), in the simulation result of forming the protective layer 51, the first electrode column 20 of the row y12 is used as the driving electrode and the second electrode column 30 of the column X21 is used as the detection electrode , The capacitance between both electrode columns became the maximum value (CA), and CA = 0.88 pF. On the other hand, as shown in Fig. 13 (B), in the simulation result in which the protective layer 51 is not formed, the first electrode column 20 of the y12 column is used as the driving electrode, The electrostatic capacity between the two electrode columns became the maximum value CB, and CB = 1.07 pF.

By forming the protective layer 51, the maximum value of the accumulated capacitance between the second wiring layer and the first electrode layer 21 can be improved by about 18%.

1: Touch panel
2: Surface panel
5: Display panel
10: Input device
11: substrate
20: first electrode column
21: first electrode layer
21b: opening
22: Connection
25a, 25b, and 25c:
30: Second electrode column
31, 31A: a second electrode layer
31b: opening
32: wiring passage
33:
35a, 35b, 35c, and 35d:
37: Connection
41: first insulating layer
42: first bridge connection layer
43: second insulating layer
44: second bridge connection layer
51, 52, 53, 55: protective layer
54: Protective connection layer
110, 210, 310, 410, 510, 610: input device
H: wiring area

Claims

A first electrode layer and a second electrode layer formed of a light-transmitting conductive material are formed on a transparent substrate, a plurality of the first electrode layers are arranged in a first direction, and a plurality of the second electrode layers are arranged in a second direction In the input device,
Wherein a connection portion for connecting one of the first electrode layer and the second electrode layer is integrally formed by the light transmissive conductive material, a first insulation layer and a first bridge connection layer are formed on the connection portion, The other electrode layer is electrically connected to each other by the first bridge connection layer,
The wiring layer extending in the first direction is formed in the second electrode layer and the wiring layer passing through the wiring passage is conducted to the other second electrode layer,
A second electrode layer and a second bridge connection layer are formed on the continuous portion of the wiring layer and the second electrode layer and the second electrode layer are separated from each other by the wiring passage, And the other layer is made conductive by the second bridge connection layer.

The method according to claim 1,
And an opening is formed in the region of the second electrode layer where the wiring passage is not formed.

3. The method according to claim 1 or 2,
And an opening is formed in the region of the first electrode layer.

3. The method according to claim 1 or 2,
Wherein a plurality of the wiring layers pass through the wiring passage and each of the wiring layers conducts to the second electrode layer different from each other.

3. The method according to claim 1 or 2,
Wherein a plurality of the wiring paths are formed in the second electrode layer and the wiring layer passes through each of the wiring paths so that each of the wiring layers is conducted to the different second electrode layer.

3. The method according to claim 1 or 2,
Wherein the wiring passage is formed in a central portion that bisects the second electrode layer in the second direction.

3. The method according to claim 1 or 2,
Wherein the first insulating layer and the second insulating layer are formed by the same process using the same material and the first bridge connecting layer and the second bridge connecting layer are formed by the same process using the same material, .

3. The method according to claim 1 or 2,
Wherein the first electrode layer and the second electrode layer are rectangular and the corner portions of the square are oriented in the first direction and the second direction.

3. The method according to claim 1 or 2,
Wherein the wiring layer passes through a region facing the first electrode layer and a protective layer formed of a conductive material is formed between the first electrode layer and the wiring layer at this position.

10. The method of claim 9,
Wherein the protective layer is formed of the same transparent conductive material as the first electrode layer.

10. The method of claim 9,
Wherein a protective connection layer connecting the protective layers arranged at intervals in the first direction passes through the wiring passage.

11. The method of claim 10,
Wherein a protective connection layer connecting the protective layers arranged at intervals in the first direction passes through the wiring passage.

10. The method of claim 9,
And the protective layer is formed continuously with the second electrode layer.

11. The method of claim 10,
And the protective layer is formed continuously with the second electrode layer.