KR101738254B1

KR101738254B1 - Input device

Info

Publication number: KR101738254B1
Application number: KR1020150127641A
Authority: KR
Inventors: 스구루 와다; 미노루 사토; 도루 사와다; 마사요시 다케우치; 준지 하시다; 도루 다카하시
Original assignee: 알프스 덴키 가부시키가이샤
Priority date: 2015-01-29
Filing date: 2015-09-09
Publication date: 2017-05-19
Also published as: KR20160093519A; CN205028276U; JP6396815B2; JP2016139358A

Abstract

[PROBLEMS] To reduce the wiring area at the edge of the substrate to enlarge the area of the display area (input area), and to suppress the phenomenon of unnecessary sensitivity being formed between the wiring layer and the electrode layer, Thereby providing an input device that can be maintained well.
A first electrode layer (21) is connected in the Y direction and a second electrode layer (31) is formed in an adjacent space part (23) of the first electrode layer (21). The second wiring layers 35a and 35b continuing in the Y direction and the guard layers 36a and 36b on both sides thereof are formed in the thermal gap portion 24a between the adjacent first electrode rows 20 in the X direction . An intermediate layer 37a is formed in the second wiring layer 35a and the intermediate layer 37a is connected to the adjacent second electrode layer 31 via the bridge connection layers 42a and 42b.

Description

Input device {INPUT DEVICE}

The present invention relates to an input device in which a plurality of transparent electrode layers are formed on a transparent substrate.

In a portable electronic device or the like, an input device for detecting capacitance is formed, and this input device is disposed in front of a display panel such as a color liquid crystal panel in a superimposed manner.

The input device has a plurality of transparent electrode layers formed on a transparent substrate, and the electrode layer has a first electrode layer connected in the first direction and a second electrode layer connected in the second direction. When drive power is applied to one of the first electrode layer and the second electrode layer, a detection output is obtained from the other electrode layer, and it is possible to detect at which point of the input device the finger or the like is approaching.

In this type of input device, both the first electrode layer and the second electrode layer are formed on the same surface of one substrate, so that the number of substrates can be reduced to be thin.

In this input device, it is necessary to form a first wiring layer (lead layer) connected to the first electrode layer and a second wiring layer (lead layer) connected to the second electrode layer on the surface of the substrate. And the second electrode layer is connected in the second direction. Therefore, the first wiring layer is routed around the edge of the substrate in the first direction, and the second wiring layer is routed around the edge of the substrate in the second direction . If a wiring region is formed at two mutually orthogonal sides of the substrate, this wiring region becomes a dead region which does not function as a detection region. In addition, when the input device is mounted on the front panel, it is necessary to cover the wiring area with the decorative layer, and the display area of the display panel is narrowed by the amount of forming the decorative layer.

In the touch screen panel disclosed in Patent Document 1, a second sensing electrode continuing in the Y direction and a second connection pattern for connecting the second sensing electrodes in the Y direction are integrally formed, and on both sides of the second connection pattern, X And the first sensing electrodes arranged in a direction are independently formed from each other. In addition, the driving pattern passes between the first sensing electrode and the second sensing electrode and continuously extends in the Y direction. The second connection pattern and the driving pattern are covered with an insulating layer, and the first sensing electrodes adjacent to each other in the X direction are connected to each other by a first connection pattern formed on the insulating layer.

In this touch screen panel, a driving wiring connected to the second sensing electrode and a driving wiring connected to the first sensing electrode through the driving pattern pass through the lower side of the first connection pattern, It can be pulled only from the edge of the facing.

In the touch panel disclosed in Patent Document 2, a plurality of first electrodes arranged in the X direction and a first conductor connecting the first electrodes are integrally formed on the surface of the substrate. Openings are formed in the respective first electrodes, and second electrodes are formed independently in the openings. An insulating layer is formed on the first electrode, a second conductive line is formed on the insulating layer, and the second electrode layers neighboring in the Y direction are connected by the second conductive line.

On the surface of the substrate, a conductive segment extending in the Y direction is formed, and each of the conductive segments is connected to the first conductive line. At the intersection of the first conductive line and the conductive segment that should not be connected, An insulating layer is formed, and the conductive segments are connected to each other through a third conductive line formed on the insulating layer.

In this touch panel, since the conductive segment connected to the first electrode electrically conducting in the X direction extends in the Y direction, the lead wire connected to the first electrode and the lead wire connected to the second electrode are arranged in the Y direction It is possible to circulate only the edge portion of the sheet.

Japanese Laid-Open Patent Publication No. 2012-150782 Japanese Laid-Open Patent Publication No. 2013-143131

In the touch screen panel described in Patent Document 1, the driving pattern that is conducted to the first sensing electrode passes through a position close to the side of the second sensing electrode. Therefore, a capacitance is formed between the drive pattern and the second sensing electrode, and the opposite region of the drive pattern and the second sensing electrode becomes the sensitivity region. When a finger or the like is approached, a detection output is generated between the drive pattern and the second sensing electrode, and this output is detected as a detection noise with respect to the original detection output for detecting a change in capacitance of the first sensing electrode and the second sensing electrode Overlapping.

In the touch panel described in Patent Document 2, since the conductive segments that are electrically connected to any one of the first electrodes extend in the Y direction with the other first electrode riding over them, the conductive segments that are conducted to the first electrode are relatively And the problem that the area which should not have original sensitivity as described in Patent Document 1 becomes a sensitivity area does not occur well.

However, in the touch panel described in Patent Document 2, since the second electrode is disposed in the opening formed in the first electrode, the number of the second conductors connecting the second electrodes to each other is set to be one It is necessary to form two points with respect to the electrode. Therefore, when the number of electrodes is increased, the number of the second conductors and the number of the insulating blocks formed below the second conductors increase, and a large number of the second conductors and the insulating block become visible when the display panel formed behind is displayed, The display quality is easily deteriorated.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described conventional problems, and it is an object of the present invention to provide a display device capable of enlarging an area of a display area (input area) by reducing a wiring area at an edge part of a substrate, And an object of the present invention is to provide an input device capable of suppressing the display quality and also maintaining a good display quality.

The present invention provides a light-transmissible substrate, wherein a first electrode layer and a second electrode layer formed of a light-transmitting conductive material are formed on a transparent substrate, a plurality of the first electrode layers are arranged in a first direction to form a first electrode column, And an electrode layer is arranged in a second direction intersecting with the first direction and the second electrode row is formed,

Wherein a connection portion for connecting one of the electrode layers of the first electrode layer and the second electrode layer is formed integrally with the transmissive conductive material at the intersection of the first electrode row and the second electrode row, Layer and the first bridge connection layer are overlapped with each other, and the other electrode layers are electrically connected to each other by the first bridge connection layer,

Wherein the first electrode array is disposed with the thermal gap portion in the second direction and the wiring layer and the guard layer located on the side of the wiring layer extend in the first direction in the thermal gap portion, And is electrically connected to the two-electrode layer.

In the input device of the present invention, it is easy to form the electrode layer and the wiring layer on the surface of the substrate by forming the wiring layer and the guard layer connected to the second electrode layer in the thermal gap portion of the first electrode row. Further, by disposing the guard layer on the side of the wiring layer, an unnecessary sensitivity region can be prevented from being formed between the wiring layer and the first electrode layer.

The input device of the present invention is characterized in that the wiring layer and the guard layer are formed of the same transparent conductive material as the first electrode layer and the second electrode layer and the second insulating layer and the second bridge connection layer are formed on the guard layer And the second electrode layer and the wiring layer are connected by the second bridge connection layer.

For example, the guard layer is formed on both sides of the wiring layer, and the second insulating layer and the second bridge connection layer are formed on each of the guard layers on both sides.

In the input device of the present invention, it is preferable that an intermediate layer integral with the wiring layer is formed in the thermal gap portion, and the second electrode layer is connected to the intermediate layer via the second bridge connection layer.

As described above, by forming the wiring layer and the guard layer on the same surface with the same conductive material as the first and second electrode layers, it is not necessary to separately form the wiring layer and the guard layer. Further, since the second bridge connection layer can be formed only in a part mainly covering the guard layer, the formation site and the formation area of the insulating layer and the bridge connection layer can be made small, and the display quality is not impaired.

The present invention is characterized in that the intermediate layer and the second electrode layer adjacent to one side of the intermediate layer are further connected to the second bridge connection layer formed on one of the guard layers, Wherein the second electrode layer is connected to the second bridge connection layer formed on the other guard layer and the two second bridge connection layers connected to the same intermediate layer are spaced apart in the first direction .

In the above configuration, since the second bridge connection layer can be disposed in the first direction, the second bridge connection layer can not be seen more clearly.

The input device of the present invention is characterized in that the first insulating layer and the second insulating layer are formed of the same material in the same process and the first bridge connection layer and the second bridge connection layer are formed by the same process As shown in FIG.

The input device of the present invention is characterized in that the second electrode layer is formed continuously across the inside of the thermal gaps,

The wiring layer is connected to the second electrode layer in the thermal gap portion,

A third insulating layer covering the second electrode layer may be formed, and the guard layer may be formed on the third insulating layer.

In this case also, the first insulating layer and the third insulating layer are formed by the same process using the same material, and the first bridge connecting layer, the wiring layer and the guard layer are formed by the same process using the same material can do.

The input device of the present invention can form a wiring region connected to the first electrode layer and a wiring layer connected to the second electrode layer only in the first direction so that it is necessary to form the wiring region in the edge portion of the substrate in the second direction It disappears.

In addition, since the wiring layer and the guard layer connected to the second electrode layer are formed in the space between the first electrode row and the first electrode row, a sensitivity region can be prevented from being formed between the wiring layer and the first electrode layer. In addition, the size and number of the insulating layer and the bridge connecting layer can be reduced, and the display quality is not hindered.

1 is an exploded perspective view of a touch panel using an input device according to an embodiment of the present invention;
2 is a plan view of an input device according to a first embodiment of the present invention;
3 is an enlarged plan view of an arrow III portion of the input device shown in Fig.
4 is an enlarged cross-sectional view taken along the line IV-IV in Fig. 3;
Fig. 5 is an enlarged plan view of the arrow V portion of the input device shown in Fig. 2; Fig.
FIG. 6 is an enlarged cross-sectional view taken along the line VI-VI in FIG. 5; FIG.
Fig. 7 is an enlarged plan view of an arrow VII portion of the input device shown in Fig. 2; Fig.
8 is an enlarged cross-sectional view taken along line VIII-VIII in FIG. 7; FIG.
9 is a partially enlarged plan view of an input device according to a second embodiment of the present invention;
10 is a partially enlarged plan view of an input device according to a third embodiment of the present invention;
11 is an enlarged cross-sectional view taken along line XI-XI of the input device shown in Fig. 10;

Fig. 1 shows the touch panel 1. Fig. The touch panel 1 is composed of a front panel 2 and an input device 10 of the first embodiment of the present invention located thereunder.

The surface panel 2 forms a part of a case of various electronic devices such as a portable telephone, a navigation device, a game device, and a communication device.

The surface panel 2 is formed of a translucent synthetic resin material such as acrylic or glass or the like and has a rectangular display portion 3 and an edible portion 4 surrounding the display portion 3. The display section 3 is capable of viewing the inside of the apparatus from the outside of the front panel 2. The edible portion 4 is colored in various colors, such as a printed layer formed on the inner surface of the synthetic resin material or glass, or a colored sheet superposed thereon, so that it can not be seen through the inside of the apparatus.

The input device 10 has a translucent substrate 11. The substrate 11 is a resin sheet such as PET (polyethylene terephthalate), a resin panel, or a glass substrate. The surface panel 2 and the input device 10 are bonded via OCA (transparent adhesive material layer). A display panel 5 such as a color liquid crystal panel is housed in a case of the electronic apparatus. The display screen of the display panel 5 is disposed so as to face the display portion 3 of the surface panel 2. [

2 to 8 show an input apparatus 10 according to the first embodiment of the present invention. In the drawings, the Y direction is the first direction and the X direction is the second direction.

As shown in Fig. 2, in the input device 10, the wiring region H is formed in only one edge portion in the first direction, and the wiring region is not formed in the edge portions of the other three sides. Therefore, the width dimension in the X direction of the edible portion 4 of the surface panel 2 shown in Fig. 1 can be made small, and the area of the display portion 3 can be relatively widened.

A first electrode row 20 extending in a first direction (Y direction) and a second electrode row 30 extending in a second direction (X direction) are formed on the surface of the substrate 11.

The first electrode column 20 is formed integrally with a plurality of first electrode layers 21 and a connecting portion 22 connecting and connecting (connecting) the first electrode layer 21 in the Y direction. The first electrode row 20 is formed in four rows of y1, y2, y3, and y4, and this number is selected according to the area of the input device 10. [

The first electrode layer 21 has a rectangular shape and the connecting portion 22 connects the central portions of the first electrode layers 21 adjacent to each other in the Y direction in the X direction. Adjacent first and second electrode layers 21 and 23 adjacent to each other in the Y direction are formed on both sides of the connecting portion 22 in the X direction in each first electrode row 20, Respectively. Thermal gap portions 24a, 24b and 24c are formed between the first electrode row 20 and the first electrode row 20 neighboring in the X direction. The thermal gap portions 24a, 24b, and 24c are formed continuously in the first direction (Y direction).

The second electrode row 30 is formed in six rows of x1 to x6, and this number is selected in accordance with the area of the input device 10. [

Each of the second electrode columns 30 is composed of a plurality of independent second electrode layers 31. The second electrode layer 31 has a shape elongated in the X direction and is oriented in the X direction in the longitudinal direction. The second electrode layer 31 is formed so as to pass through the inside of the adjacent space portion 23 formed between the adjacent first electrode layers 21 in the Y direction.

The first electrode layer 21, the connection portion 22, and the second electrode layer 31 are formed of the same light-transmitting conductive material. The light-transmitting conductive material is formed of a conductive nanowire layer formed of an ITO (indium tin oxide) layer, silver nanowire, or carbon nanowire, a thin metal layer formed of a mesh, or a conductive polymer layer.

2, one of the intersections of the first electrode row 20 and the second electrode row 30 has an arrow mark III, and details of the intersection of the arrow mark III in FIGS. 3 and 4 are shown. At the intersection portion, a first light-transmitting insulating layer 32 covering the connection portion 22 of the first electrode column 20 is formed. A first bridge connection layer 33 is formed on the first insulation layer 32. The second electrode connection layers 33 adjacent to each other in the X direction are connected to each other and conducted .

The light-transmitting first insulating layer 32 is composed of novolac resin or novolac resin and acrylic resin. The first bridge connection layer 33 is formed by laminating a conductive metal material such as Au (gold), Au alloy, CuNi alloy (copper-nickel alloy) or Ni (nickel) on the base layer of the ITO layer of amorphous, More preferably a protective layer of an ITO layer of amorphous.

When the first electrode layer 21, the connecting portion 22 and the second electrode layer 31 are formed of ITO, they are formed of crystalline ITO, so that the first electrode layer 21, the connecting portion 22, The electrode layer 31 and the first insulating layer 32 can be selectively etched.

The second electrode layer 31 (31A) has a connecting portion and is continuously formed in the X direction at the intersection of the first electrode row 20 and the second electrode row 30. The first electrode layer 21, The first insulation layer 41 and the first bridge connection layer 42 are formed on the connection portions connecting the second electrode layers 31 (31A) The first electrode layers 21 adjacent to each other in the Y direction by the first electrode layer 42 may be connected.

2, a first wiring layer 25a formed integrally with the first electrode layer 21 in the y1 row and a second wiring layer 25b formed in the wiring region H formed at one end in the Y direction of the substrate 11 are formed, First wiring layers 25b, 25c, and 25d formed integrally with each of the first electrode layers 21 in the row are formed.

Second wiring layers 35a, 35b, 35c, 35d, 35e, and 35f are formed in the wiring region H to be electrically connected to the second electrode lines 30, respectively.

The second wiring layers 35a and 35b extend in the Y direction in the thermal gap portion 24a between the first electrode row 20 of the y1 row and the first electrode row 20 of the y2 row. The second wiring layer 35a is connected to the second electrode column 30 in the x1 column and the second wiring layer 35b is connected to the second electrode column 30 in the x2 column. The second wiring layers 35c and 35d extend in the Y direction in the thermal gap portion 24b between the first electrode row 20 of the y2 row and the first electrode row 20 of the y3 row. The second wiring layer 35c is connected to the second electrode column 30 of x3 rows and the second wiring layer 35d is connected to the second electrode column 30 of x4 rows. The second wiring layers 35e and 35f extend in the Y direction in the thermal gap portion 24c between the first electrode row 20 of the y3 row and the first electrode row 20 of the y4 row. The second wiring layer 35e is connected to the second electrode column 30 of x5 rows and the second wiring layer 35f is connected to the second electrode column 30 of x6 rows.

The input device 10 shown in Fig. 2 is provided on the inner surface of the front panel 2. Fig. The display image of the display panel 5 can be seen from the outside through the input device 10 and the display unit 3. [ The input device 10 can be operated by touching the display portion 3 with a finger while viewing this display.

In this input device 10, an electrostatic capacitance is formed between the first electrode row 20 and the second electrode row 30. A pulse-like driving power is sequentially applied to one electrode row of the first electrode row 20 or the second electrode row 30 and a detection current flowing through the other electrode row is detected when the driving power is applied. When the finger approaches, a capacitance is formed between the finger and the electrode layer, so that the detection current changes. By detecting the change in the detection current, it is possible to detect at which point of the display unit 3 the finger is approaching.

The main circuit structures of the wiring layers 35a to 35f are different from each other in the following embodiments.

5 is an enlarged plan view of a portion indicated by an arrow V in Fig. 2 in the input device 10 of the first embodiment.

The second wiring layers 35a and 35b are formed in the thermal gap portion 24a between the first electrode row 20 of the y1 row and the first electrode row 20 of the y2 row, The guard layers 36a and 36b are formed with the wiring layers 35a and 35b interposed therebetween in the X direction. The second wiring layers 35a and 35b and the guard layers 36a and 36b extend continuously in the Y direction in parallel with each other.

The second wiring layers 35a and 35b and the guard layers 36a and 36b are formed of the same transparent conductive material as the first electrode layer 21 and the connecting portion 22 and the second electrode layer 31. [

As shown in Fig. 5, an intermediate layer 37a is formed at the intersection of the thermal gap portion 24a and the adjacent space portion 23 in the x1 row. The intermediate layer 37a is formed integrally with the second wiring layer 35a. The second wiring layer 35b extends further in the Y direction beyond the adjacent space portion 23 in the x1 row and is integrally connected to the second electrode layer 31 in the x2 row.

The second insulating layer 41a covering the guard layer 36a and the second insulating layer 35b covering the guard layer 36a are formed at the intersection of the thermal gap portion 24a and the adjacent space portion 23 in the x1 row as shown in the cross- A second insulation layer 41b is formed to cover the guard layer 36b and a second bridge connection layer 42a is formed on the second insulation layer 41a and a second bridge connection layer 42b is formed on the second insulation layer 41b. A bridge connection layer 42b is formed. The intermediate layer 37a and the second electrode layer 31 in the y1 row adjacent to the intermediate layer 37a are connected and conducted by the second bridge connection layer 42a and the intermediate layer 37a and the second electrode layer 31b are connected by the second bridge connection layer 42b, And the second electrode layer 31 of y2 row adjacent thereto is connected and conducted.

The structure of the intersection between the thermal gap portion 24b and the second electrode layer 31 in the x3 row and the intersection between the thermal gap portion 24c and the second electrode layer 31 in the x5 row is also shown in Figs. .

The arrow VII in FIG. 2 shows the structure of FIG. 7 and FIG. 8 as an intersection of the thermal gap portion 24b and the adjacent space portion 23 in the x2 row.

Here, the thermal gap portion 24b between the first electrode row 20 of the y2 row and the first electrode row 20 of the y3 row is formed so that the second wiring layers 35c and 35d and the guard layers 36a and 36b continuously It is passing. Here, the insulating layer 43 covering the second wiring layers 35c and 35d and the guard layers 36a and 36b is formed, and the third bridge connection layer 44 is formed thereon. The third bridge connection layer The second electrode layers 31 adjacent to each other in the X direction are connected to each other and conducted.

The second insulating layers 41a and 41b shown in Figs. 5 and 6 and the insulating layer 43 shown in Figs. 7 and 8 are made of the same material as the first insulating layer 32 shown in Figs. 3 and 4 Are formed by the same process. The second bridge connection layers 42a and 42b shown in Figs. 5 and 6 and the third bridge connection layer 44 shown in Figs. 7 and 8 are formed by the first bridge connection layer 33 shown in Figs. 3 and 4, Are formed by the same process with the same material as that of FIG.

The manufacturing process of the input device 10 uses a material having a transparent conductive material such as ITO formed on the surface of the substrate 11 and uses the first electrode column 20, the second electrode column 30, the first wiring layer 25a The second wiring layers 35a to 35f, the intermediate layer 37a and the guard layers 36a and 36b are formed by an etching process or the like.

Thereafter, a novolac resin and a resin layer of an acrylic resin are formed on the substrate 11 and the first insulating layer 32 and the second insulating layers 41a and 41b and the insulating layer 43 are formed by photolithography, Are simultaneously patterned. A laminate for a bridge connection layer is formed and the first bridge connection layer 33 and the second bridge connection layers 42a and 42b and the third bridge connection layer 44 are simultaneously formed by an etching process.

The input device 10 according to the first embodiment is characterized in that the second wiring layers 35a to 35f and the guard layers 36a and 36b and the first electrode row 20 and the second electrode row 30 are formed on the substrate 11, The step is reduced as a whole. Therefore, the light-transmitting insulating layer and the bridge connecting layer are formed at the intersections of the first electrode row 20 and the second electrode row 30 shown in Fig. 3 and the points covering the guard layers 36a and 36b shown in Fig. 5 As shown in Fig. 7, it may be formed only in a region covering the second wiring layer and the guard layer. Therefore, the number of the insulating layers and the bridge connecting layers can be reduced, and the area of each of the insulating layers and the bridge connecting layer can be made small, so that the insulating layer and the bridge connecting layer can not be seen easily, The quality can be improved.

The second wiring layers 35a to 35f pass through the thermal gap portions 24a, 24b and 24c between the neighboring first electrode columns 20. The left and right sides of the second wiring layer are covered with the guard layers 36a and 36b The second interconnection layers 35a to 35f and the first electrode layer 21 are formed in the thermal gap portions 24a, 24b, and 24c by setting the guard layers 36a and 36b at the ground potential, It is possible to prevent the sensitivity region from being formed between the electrodes.

Further, the guard layers 36a and 36b may be set to predetermined potentials other than the ground potential. In this case, parasitic capacitance between the second wiring layers 35a to 35f and the first electrode layer 21 can be reduced by the presence of the guard layers 36a and 36b, and the second wiring layers 35a to 35f ) And the first electrode layer 21 can be reduced.

The second wiring layers 35a to 35f and the guard layers 36a and 36b are linearly arranged in the Y direction so as to pass through the thermal gap portions 24a, 24b, and 24c between the adjacent first electrode rows 20 in the X direction It is possible to simplify the arrangement structure of each layer and to make it easier to manufacture.

9 shows a second embodiment of the input device 10 of the present invention and shows the structure of the intersection of the column gap portion 24a and the adjacent space portion 23 in the x1 column. Configurations other than the intersections are the same as those of the input device 10 of the first embodiment shown in Figs.

9, the intermediate layer 37b integral with the second wiring layer 35a is formed in a slightly wider area.

A second insulation layer 41a and a second bridge connection layer 42a are formed between the intermediate layer 37b and the second electrode layer 31 on the right side of the city. The intermediate layer 37b and the second electrode layer 31, a second insulating layer 41b and a second bridge connection layer 42b are formed.

The second insulating layer 41a and the second bridge connection layer 42a and the second insulating layer 41b and the second bridge connection layer 42b are shifted in the Y direction and spaced apart in the Y direction Respectively.

The second insulating layers 41a and 41b and the second bridge connection layers 42a and 42b are separated in the Y direction at the intersection of the thermal gap portion 24a and the adjacent space portion 23 in the second embodiment It is possible to prevent the insulating layers 41a and 41b and the bridge connection layers 42a and 42b from being seen as being continuously integrated in the X direction so that the display light is applied from the back portion The second insulation layers 41a and 41b and the second bridge connection layers 42a and 42b are not conspicuous.

10 and 11 show a third embodiment of the input device 10 of the present invention and show the structure of the intersection of the thermal gap portion 24a and the adjacent space portion 23 in the x1 row.

In the input device 10 of the third embodiment, the second electrode layer 31 formed of ITO or the like is formed so as to traverse the thermal gap portion 24a without being disconnected at the intersection. The second wiring layers 35a and 35b and the guard layers 36a and 36b are formed by the same process with the same material as the first bridge connection layer 33 shown in Figs.

At the intersection portion, the second wiring layer 35a is superimposed on the second electrode layer 31, and the second wiring layer 35a and the second electrode layer 31 are connected and conducted. In addition, third insulating layers 51a and 51b are formed on the second electrode layer 31 in the X direction. The guard layer 36a passes over the third insulating layer 51a on the right side and the second wiring layer 35b and the guard layer 36b pass over the left third insulating layer 51b.

The third insulating layer 51a on the right side and the third insulating layer 51b on the left side may be formed continuously. However, when the display light is applied from the back portion to the display panel 5, .

Since the second wiring layers 35a to 35f and the guard layers 36a and 36b are formed on the same plane as the first electrode row 20 and the second electrode row 30 in the third embodiment, The number of the insulating layer and the bridge connecting layer can be reduced, and the area of the insulating layer and the bridge connecting layer can be reduced. Since the second wiring layers 35a to 35f and the guard layers 36a and 36b extend linearly in the Y direction in the thermal gap portions 24a to 24c, It is possible to simplify the configuration.

1: Touch panel
2: Surface panel
3:
4: Edible portion
5: Display panel
10: Input device
11: substrate
20: first electrode column
21: first electrode layer
22: Connection
23:
24a, 24b, 24c:
25a to 25d: first wiring layer
30: Second electrode column
32: first insulating layer
33: first bridge connection layer
35a to 35f: a second wiring layer
36a, 36b: guard layer
37a and 37b:
41a, 41b: a second insulating layer
42a, 42b: a second bridge connection layer
43: Insulating layer
44: third bridge connection layer
51a, 51b: a third insulating layer

Claims

A first electrode layer and a second electrode layer formed of a light-transmitting conductive material are formed on a transparent substrate, a plurality of the first electrode layers are arranged in a first direction to form a first electrode column, The second electrode row being arranged in a second direction intersecting the first electrode row and the second electrode row,
Wherein a connection portion for connecting one of the electrode layers of the first electrode layer and the second electrode layer is formed integrally with the transmissive conductive material at the intersection of the first electrode row and the second electrode row, Layer and the first bridge connection layer are overlapped with each other, and the other electrode layers are electrically connected to each other by the first bridge connection layer,
Wherein the first electrode array is disposed with the thermal gap portion in the second direction and the wiring layer and the guard layer located on the side of the wiring layer extend in the first direction in the thermal gap portion, 2-electrode layer,
Wherein the guard layer is disposed between the first electrode row and the wiring layer.

The method according to claim 1,
The wiring layer and the guard layer are formed of the same transparent conductive material as the first electrode layer and the second electrode layer, the second insulating layer and the second bridge connection layer are formed on the guard layer, and the second bridge connection Wherein the second electrode layer and the wiring layer are connected by a layer.

3. The method of claim 2,
Wherein the guard layer is formed on both sides of the wiring layer and the second insulating layer and the second bridge connection layer are formed on each of the guard layers on both sides.

The method of claim 3,
Wherein an intermediate layer integral with the wiring layer is formed in the thermal gap portion and the second electrode layer is connected to the intermediate layer via the second bridge connection layer.

5. The method of claim 4,
The intermediate layer and the second electrode layer adjacent to one side of the intermediate layer are connected to the second bridge connection layer formed on one of the guard layers, and the intermediate layer and the second electrode layer adjacent to the other of the intermediate layer, And the second bridge connection layer formed on the other guard layer,
And the two second bridge connection layers connected to the same middle layer are spaced apart in the first direction.

6. The method according to any one of claims 2 to 5,
Wherein the first insulating layer and the second insulating layer are formed of the same material by the same process, and the first bridge connecting layer and the second bridge connecting layer are formed by the same process using the same material.

The method according to claim 1,
The second electrode layer is continuously formed across the inside of the thermal gaps,
The wiring layer is connected to the second electrode layer in the thermal gap portion,
A third insulating layer covering the second electrode layer is formed, and the guard layer is formed on the third insulating layer.

8. The method of claim 7,
Wherein the first insulating layer and the third insulating layer are formed of the same material by the same process and the first bridge connecting layer and the wiring layer and the guard layer are formed by the same process using the same material.

A first electrode layer and a second electrode layer formed of a light-transmitting conductive material are formed on a transparent substrate, a plurality of the first electrode layers are arranged in a first direction to form a first electrode column, The second electrode row being arranged in a second direction intersecting the first electrode row and the second electrode row,
Wherein a connection portion for connecting one of the electrode layers of the first electrode layer and the second electrode layer is formed integrally with the transmissive conductive material at the intersection of the first electrode row and the second electrode row, Layer and the first bridge connection layer are overlapped with each other, and the other electrode layers are electrically connected to each other by the first bridge connection layer,
Wherein the first electrode array is disposed with the thermal gap portion in the second direction and the wiring layer and the guard layer located on the side of the wiring layer extend in the first direction in the thermal gap portion, 2-electrode layer,
The wiring layer and the guard layer are formed of the same transparent conductive material as the first electrode layer and the second electrode layer, the second insulating layer and the second bridge connection layer are formed on the guard layer, and the second bridge connection Wherein the second electrode layer and the wiring layer are connected by a layer.

10. The method of claim 9,
Wherein the guard layer is formed on both sides of the wiring layer and the second insulating layer and the second bridge connection layer are formed on each of the guard layers on both sides.

11. The method of claim 10,
Wherein an intermediate layer integral with the wiring layer is formed in the thermal gap portion and the second electrode layer is connected to the intermediate layer via the second bridge connection layer.

12. The method of claim 11,
The intermediate layer and the second electrode layer adjacent to one side of the intermediate layer are connected to the second bridge connection layer formed on one of the guard layers, and the intermediate layer and the second electrode layer adjacent to the other of the intermediate layer, And the second bridge connection layer formed on the other guard layer,
And the two second bridge connection layers connected to the same middle layer are spaced apart in the first direction.

13. The method according to any one of claims 9 to 12,
Wherein the first insulating layer and the second insulating layer are formed of the same material by the same process, and the first bridge connecting layer and the second bridge connecting layer are formed by the same process using the same material.