KR20160091519A - Substrate desorption apparatus and method for manufacturing display device using threrof - Google Patents

Abstract

Provided is a substrate detaching apparatus which detaches an auxiliary substrate from a panel substrate by using a plurality of stepped substrates having a step shape. According to the present invention, the substrate detaching apparatus comprises: the stepped substrates having one or more stepped layers, and overlapped with a predetermined part thereof; a plurality of vacuum members coupled to holes formed in each of the stepped substrates; and a plurality of vacuum adsorbing pads connected to the vacuum members, and adsorbed to the substrate. The stepped substrates are sequentially and vertically lifted from the stepped substrate connected to the vacuum adsorbing pads adsorbing to an outmost layer of a substrate among the vacuum adsorbing pads to an inner direction.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate detachment apparatus and a method of manufacturing a display apparatus using the same,

The present invention relates to a substrate removing apparatus, and more particularly, to a method of manufacturing a display apparatus using a substrate removing apparatus.

In the modern information society, it is demanded that the display industry includes a large size, a flat screen, and various functions in the image industry. In addition, in order to freely record and exchange information at any time, there is a demand for a display device which is easy to carry and which is light. However, the glass substrate used in the conventional display device is formed to have a predetermined thickness, and it has disadvantages that it is fragile and difficult to bend due to the characteristics of the glass. Therefore, in order to overcome these disadvantages, a flexible substrate having a bending characteristic in recent years is being developed.

A flexible substrate such as plastic or metal foil is used to implement the flexible display device. Flexible substrates can be difficult to meet suitability for existing processes due to flexibility, which is different from the hardness of glass substrates of conventional display devices. That is, when the pattern (a thin film transistor having a laminated structure, a plurality of lines, etc.) is formed on a flexible substrate, the flexible characteristic may cause difficulty in pattern alignment. Accordingly, there has been proposed a transfer technique in which a flexible substrate can be adhered to a hard shape such as a glass substrate and transported and processed.

On the other hand, after the patterning process, a desorption technology for desorbing the flexible substrate and the glass substrate from each other is required. Illustratively, the substrate desorption apparatus includes a plurality of vacuum adsorption pads adsorbed on a glass substrate adhered on a flexible substrate. The substrate desorption apparatus separates the flexible substrate from the glass substrate using these vacuum adsorption pads. However, in this case, due to the difference in attraction force between the vacuum adsorption pads, there arises a problem that the glass substrate is broken at the initial adsorption portion and the final adsorption portion.

An object of the present invention is to provide a substrate detachment device for detaching an auxiliary substrate from a panel substrate using a plurality of stepped substrates having a step shape, and a method of manufacturing a display using the same.

According to an aspect of the present invention, there is provided a substrate removing apparatus comprising: a plurality of stepped substrates each having at least one step layer and overlapping each other by a predetermined distance; And a plurality of vacuum adsorption pads connected to the vacuum members and adsorbed to the substrate, wherein the stepped substrates are adsorbed on the outermost side of the substrate among the vacuum adsorption pads The substrate is vertically raised sequentially in the inward direction from the stepped substrate connected to the vacuum adsorption pads.

According to an embodiment of the present invention, the apparatus further includes a plurality of suction devices connected to the vacuum members, respectively, for vertically lifting the stepped substrates.

According to an embodiment of the present invention, each of the stepped substrates includes a first step layer extended in the horizontal direction, a second stepped portion overlapping one region of the first step layer to have a stepped shape with the first stepped layer, And a third step layer superimposed on one region of the second step layer to have a stepped shape with the second step layer.

According to an embodiment of the present invention, the holes for coupling the vacuum members are formed in the second step layer.

According to an embodiment of the present invention, in the two first stepped substrates and the second stepped substrates adjacent to each other of the stepped substrates, a region of the third stepped layer of the first stepped substrate and a region of the second stepped substrate One step level layer region overlaps with each other with a predetermined gap.

According to the embodiment of the present invention, the second stepped substrate is arranged further outward than the first stepped substrate.

According to the embodiment of the present invention, after the second stepped substrate is raised vertically, the first stepped substrate is vertically raised.

According to an embodiment of the present invention, when the second stepped substrate is vertically raised, the first stepped layer of the second stepped substrate is brought into contact with the third stepped layer of the first stepped substrate.

According to an embodiment of the present invention, each of the second step layers of the stepped substrates is formed to have a height in a position parallel to each other.

According to an embodiment of the present invention, the extended length of the second step layer is longer than the extended length of the first or third step layer.

According to another aspect of the present invention, there is provided a method of manufacturing a display device, comprising: providing an auxiliary substrate and a panel substrate; attaching the auxiliary substrate to the panel substrate; And separating the auxiliary substrate from the panel substrate. The step of separating the auxiliary substrate may be performed in a stepped shape. The step of separating the auxiliary substrate may include at least one step layer, Providing a plurality of stepped substrates, coupling a plurality of vacuum members to holes formed in each of the stepped substrates, connecting the plurality of vacuum adsorption pads to the vacuum members, A vacuum adsorption step of adsorbing the pads, a vacuum adsorption step of adsorbing outermost sides of the auxiliary substrates among the vacuum adsorption pads And successively vertically lifting the stepped substrate connected to the pads in the inward direction.

According to another embodiment of the present invention, the method further comprises connecting a plurality of suction apparatuses to the vacuum members, wherein the suction apparatus sequentially vertically lifts the stepped substrates from the outermost side to the inward side.

According to another embodiment of the present invention, each of the stepped substrates includes a first stepped layer extending in a horizontal direction, a second stepped layer extending in a second direction overlapping one region of the first stepped layer to have a stepped shape with the first stepped layer, And a third step layer superimposed on one region of the second step layer to have a step shape with the second step layer.

According to another embodiment of the present invention, in the two first stepped substrates and the second stepped substrates which are adjacent to each other of the stepped substrates, the first stepped substrate and the second stepped substrate, One region of the first step layer is overlapped with each other with a predetermined gap.

According to another embodiment of the present invention, the second stepped substrate is arranged further outward than the first stepped substrate.

According to an embodiment of the present invention, a plurality of stepped substrates having a stepped shape are provided. As the plurality of stepped substrates sequentially rise vertically, the vacuum adsorption pads connected to the stepped substrates can sequentially separate the auxiliary substrate from the panel substrate. As a result, the auxiliary substrate and the panel substrate can be separated from each other without breakage. As a result, the overall process cost in the manufacturing process of the display device can be reduced.

1 is a perspective view showing a panel substrate and auxiliary substrates.
2 is a perspective view illustrating a substrate removing apparatus disposed on an auxiliary substrate and a panel substrate according to an embodiment of the present invention.
3 is a cross-sectional view taken along line I-I 'shown in FIG.
4 is a view showing the structure of the stepped substrates cut along the line I-I 'shown in FIG.
5 to 8 are views showing a process of attaching / detaching between a panel substrate and an auxiliary substrate.

The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

Like reference numerals are used for like elements in describing each drawing. In the attached drawings, the dimensions of the structures are shown enlarged or reduced in size for clarity of the present invention. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component. The singular expressions include plural expressions unless the context clearly dictates otherwise.

In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

1 is a perspective view showing a panel substrate and auxiliary substrates.

Referring to FIG. 1, the auxiliary substrate 100 may be formed of a glass substrate. The auxiliary substrate 100 may be disposed under the panel substrate 200 to support the panel substrate 200. Although the auxiliary substrate 100 shown in FIG. 1 is formed to have the same size as the panel substrate 200, the auxiliary substrate 100 may be formed to be larger or smaller than the panel substrate 200.

The panel substrate 200 may be disposed on the auxiliary substrate 100. A plurality of gate lines and a plurality of data lines for displaying an image may be disposed on the panel substrate 200. The gate lines and the data lines may be provided on different layers and may be electrically insulated from each other to be insulated. In addition, a plurality of pixels connected to the gate lines and the data lines may be disposed on the panel substrate 200. In this case, a thin film process for arranging the pixels on the panel substrate 200 can be performed. During the thin film process, the auxiliary substrate 100 plays a role of supporting the panel substrate 200 to be fixed.

After the thin film process is completed on the panel substrate 200, the process of detaching the auxiliary substrate 100 from the panel substrate 200 proceeds. In this case, a substrate removing apparatus (see FIG. 2) may be used to separate the auxiliary substrate 100 from the panel substrate 200.

2 is a perspective view illustrating a substrate removing apparatus disposed on an auxiliary substrate and a panel substrate according to an embodiment of the present invention.

Referring to FIG. 2, the auxiliary substrate 100 and the panel substrate 200 are shown inverted from each other in comparison with FIG. That is, it is shown that the auxiliary substrate 100 is disposed on the panel substrate 200.

The substrate desorption apparatus is disposed above the auxiliary substrate 100, and the auxiliary substrate 100 can be detached from the panel substrate 200. [ In detail, the substrate desorption apparatus includes a plurality of vacuum adsorption pads 310, a plurality of vacuum members 320, and a bonded substrate 330.

The vacuum adsorption pads 310 may be adsorbed on the auxiliary substrate 100. The vacuum adsorption pads 310 may be disposed on the auxiliary substrate 100 at regular intervals. One end of each vacuum adsorption pad may be attached to the auxiliary substrate 100 and the other end may be coupled to the vacuum member 320. The vacuum adsorption pads 310 can remove the auxiliary substrate 100 from the panel substrate 200 by an external adsorption pressure. On the other hand, when the auxiliary substrate 100 is lifted in the vertical direction by the vacuum adsorption pads 310, the panel substrate 200 can be kept fixed by external factors.

Vacuum members 320 are coupled onto vacuum adsorption pads 310 and may be disposed below coupling substrate 330. Vacuum members 320 may be formed corresponding to the number of vacuum adsorption pads 310. That is, the number of the vacuum members 320 and the number of the vacuum adsorption pads 310 may be the same. According to the embodiment, one end of each vacuum member may be coupled to one vacuum adsorption pad, and the other end may be coupled to the coupling substrate 330. Vacuum members 320 may be connected to vacuum adsorption pads 310 to support bonded substrate 330.

The coupled substrate 330 may include a plurality of first to sixth stepped substrates 330_1 to 330_6. According to the embodiment, the first to sixth stepped substrates 330_1 to 330_6 may be formed as separate structures. In addition, the first to sixth stepped substrates 330_1 to 330_6 may be formed to have at least one stepped layer. That is, each step substrate according to the present invention can be realized in a stepped shape. Hereinafter, the first to sixth stepped substrates 330_1 to 330_6 are described as having three stepped layers.

In detail, the first stepped substrate 330_1 may be disposed on the basis of the center point of the coupled substrate 330. [ In this case, the outer edge of the first stepped substrate 330_1 may be arranged to overlap the upper surface of the second stepped substrate 330_2. Here, the outer end portion may be one region of the highest step layer among the step layers formed on each step substrate.

The second stepped substrate 330_2 may be configured to surround the first stepped substrate 330_1. In this case, the inner edge of the second stepped substrate 330_2 may be arranged to overlap the lower surface of the first stepped substrate 330_1. Here, the inner end portion may be one region of the lowest step layer among the step layers formed on each step substrate. Further, the outer end of the second stepped substrate 330_2 may be arranged to overlap the upper surface of the third stepped substrate 330_3.

The third level substrate 330_3 may be configured to surround the second level substrate 330_2. In this case, the inner edge of the third level substrate 330_3 may be arranged to overlap the lower level of the second level substrate 330_2. In addition, the outer edge of the third level substrate 330_3 may be arranged to overlap the upper surface of the fourth level substrate 330_4.

The fourth level substrate 330_4 may be configured to surround the third level substrate 330_3. In this case, the inner edge of the fourth level substrate 330_4 may be arranged to overlap the lower level of the third level substrate 330_3. Further, the outer end of the fourth stepped substrate 330_4 may be arranged to overlap the upper portion of the fifth stepped substrate 330_5.

The fifth level substrate 330_5 may be configured to surround the fourth level substrate 330_4. In this case, the inner edge of the fifth level substrate 330_5 may be arranged to overlap the lower surface of the fourth level substrate 330_4. Further, the outer end of the fifth step substrate 330_5 may be arranged to overlap the upper surface of the sixth step substrate 330_6.

The sixth stepped substrate 330_6 may be configured to surround the fifth stepped substrate 330_5. In this case, the inner edge of the sixth level substrate 330_6 may be arranged to overlap the lower level of the fifth level substrate 330_5.

In the description of the present invention, the coupled substrate 330 includes the first to sixth stepped substrates 330_1 to 330_6, but is not limited thereto. That is, the bonded substrate 330 may include at least one stepped substrate.

Further, each of the first to sixth stepped substrates 330_1 to 330_6 may have a plurality of holes P for coupling the vacuum members 320 thereto. A plurality of vacuum members 320 may be coupled to the holes formed in each of the first to sixth substrate 330_1 to 330_6. On the other hand, a suction device (not shown) may be disposed in each of the holes formed in the first to sixth stepped substrates 330_1 to 330_6. The suction device may be connected to a vacuum member coupled to each hole to perform a suction operation for separating the auxiliary substrate 100 from the panel substrate 200. [

3 is a sectional view taken along the line I-I 'shown in FIG. 4 is a view showing the structure of the stepped substrates cut along the line I-I 'shown in FIG.

3, the structures of the panel substrate 200, the auxiliary substrate 100, the vacuum adsorption pads 310, and the vacuum members 320 are the same as those described in FIG. Therefore, description thereof will be omitted in the following. The coupled substrate 300 may include the first to sixth stepped substrates 330_1 to 330_6. The vacuum members 320 may be coupled to the holes P (see FIG. 2) formed in the first to sixth stepped substrates 330_1 to 330_6.

In addition, a plurality of suction devices 340 may be disposed on the first to sixth stepped substrates 330_1 to 330_6. According to the embodiment, the suction devices 340 may be formed to correspond to the number of the vacuum members 320. That is, one suction device can be attached to the top of one vacuum member. As the vacuum adsorption pads 310 perform the adsorption operation by the suction devices 340, the auxiliary substrate 100 can be detached from the panel substrate 200.

Referring to FIG. 4, a coupling structure between any two adjacent stepped substrates among the first to sixth stepped substrates 330_1 to 330_6 shown in FIG. 3 is shown. In the following, any two stepped substrates shown in FIG. 4 are described as an inner stepped substrate 350 and an outer stepped substrate 360. Further, based on the coupling structure between the inner and outer stepped substrates 350 and 360 shown in FIG. 4, the structure between the plurality of stepped substrates can be described.

The inner stepped substrate 350 includes first to third inner step layers 351 to 353. In detail, the first inner step layer 351 is disposed under the second inner step layer 352, and the second inner step layer 352 is disposed under the third inner step layer 353. That is, the first to third inner step layers 351 to 353 may have a stepped shape having different heights.

In detail, the second inner step layer 352 may extend longer in the horizontal direction than the first and third inner step layers 351 and 353. The second inside step layer 352 includes a region overlapping the top of the first inside step layer 351 and a region overlapping with the bottom of the third inside step layer 353. In addition, a hole P region for coupling the vacuum member may be formed at the center of the second inner step layer 352. The third inner step layer 353 includes a region overlapping the upper portion of the second inner step layer 352 and a region overlapping the first outer step layer 361 of the outer step substrate.

The outer stepped substrate includes first to third outer step layers 361 to 363. In detail, the first outside step layer 361 is disposed under the second outside step layer 362, and the second outside step layer 362 is disposed under the third outside step layer 363. [ That is, the first to third outer step layers 361 to 363 may have a stepped shape having different heights from the reference bottom surface.

Meanwhile, according to the embodiment, the first inner step layer 351 and the first outer step layer 361 may have the same height. The second inner step layer 352 and the second outer step layer 362 may be configured to have the same height. The third inner step layer 353 and the third outer step layer 363 may be configured to have the same height.

In detail, the first outer step layer 361 includes a region overlapping with the third inner step layer 353 and a region overlapping with the second outer step layer 362. A step gap corresponding to the height H of the second inner or second outer step layer may be formed between the first outer step layer 361 and the third inner step layer 353.

The second outer step layer 362 may extend longer in the horizontal direction than the first and third outer step layers 361 and 363. The second outer step layer 362 may include a region overlapping the upper portion of the first outer step layer 361 and a region overlapping the third outer step layer 363. In addition, a hole P region for coupling the vacuum member may be formed at the center of the second outer step layer 362.

The third outer step layer 363 may overlap the next overlapping area and the area overlapping the top of the second outer step layer 362. [

As described above, three step layers may be formed on each stepped substrate included in the coupled substrate 330. [ In particular, two step-like substrates adjacent to each other can be coupled to each other through overlapping overlapping regions. This will be described in detail with reference to Figs. 5 to 8. Fig.

5 to 8 are views showing a process of attaching / detaching between a panel substrate and an auxiliary substrate.

Referring to FIGS. 5 to 8, a cross-sectional view of four step substrates adjacent to each other among the first to sixth step substrates 330_1 to 330_6 shown in FIG. 2 is shown. In other words, a process in which the auxiliary substrate 100 is detached from the panel substrate 200 by the first to fourth step-like substrates S1 to S4 will be described.

The first level substrate S1 is arranged outward from the center of the bonding substrate 330 (see Fig. 2) than the second level substrate S2. The second level substrate S2 is arranged outside the third level substrate S3 from the center of the bonding substrate 330. [ The third stepped substrate S3 is arranged outside the center of the coupled substrate 330 than the fourth stepped substrate S4.

On the other hand, the first stepped substrate S1 may be composed of a stepped layer that is smaller than the second to fourth stepped substrates S2 to S4. For example, the first stepped substrate S1 may have two step layers, and the second to fourth stepped substrates S2 to S4 may have three step layers. This is because there is no stepped substrate overlapping the outer portion of the first stepped substrate S1 as the first stepped substrate S1 is arranged outermost from the center of the bonded substrate 330. [ However, the number of the step layers of the first stepped substrate S1 arranged outermost is not limited thereto.

In addition, the first vacuum member 320_1 coupled to the first level substrate S1 may be coupled to the first vacuum adsorption pad 310_1 and the first suction device 340_1. The second vacuum member 320_2 coupled to the second step substrate S2 may be coupled to the second vacuum adsorption pad 310_2 and the second suction device 340_2. The third vacuum member 320_3 coupled to the third step substrate S3 may be coupled to the third vacuum adsorption pad 310_3 and the third suction device 340_3. The fourth vacuum member 320_4 coupled to the fourth step S4 may be coupled to the fourth vacuum adsorption pad 310_4 and the fourth suction device 340_4.

According to the embodiment of the present invention, the first to fourth suction devices 340_1 to 340_4 can be operated sequentially from the outermost suction device, not simultaneously. For example, after the operation of the outermost arranged first suction device 340_1, the second suction device 340_2 may be operated.

In detail, the first suction device 340_1 arranged outermost from the center of the bonded substrate 330 can be raised in the vertical direction. As a result, the first coupling region P1 in which the first stepped substrate S1 and the second stepped substrate S2 are coupled to each other can be formed. The first coupling regions P1 may be formed by joining together the first and second stepped substrates S1 and S2 which are spaced apart from each other with the first step gap H1. That is, as the first suction device 340_1 is lifted in the vertical direction, one end of the lowermost layer of the first stepped substrate S1 contacts one end of the uppermost layer of the second stepped substrate S2, Can be formed.

In addition, as the first suction device 340_1 is lifted in the vertical direction, the auxiliary substrate 100 can be detached from the panel substrate 200 by the first vacuum adsorption pad 310_1. In this case, the area of the auxiliary substrate 100 corresponding to the lower portion of the first vacuum adsorption pad 310_1 can be removed from the panel substrate 200 with the first desorption height D11.

Thereafter, referring to FIG. 6, the second suction device 340_2 can be raised in the vertical direction. As a result, the second joining region P2 in which the second step substrate S2 and the third step substrate S3 are coupled to each other can be formed. The second coupling regions P2 may be formed by joining together the second and third stepped substrates S2 and S3 which are spaced apart from each other with the second stepped gap H2. That is, as the second suction device 340_2 is lifted in the vertical direction, one end of the lowermost layer of the second step substrate S2 contacts one end of the uppermost layer of the third step substrate S3, Can be formed. On the other hand, the first coupling region P1 in which the first and second stepped substrates S1 and S2 are coupled maintains the coupled state.

Further, as the second suction device 340_2 is raised in the vertical direction, the auxiliary substrate 100 can be further detached from the panel substrate 200 by the second vacuum adsorption pad 310_2. In this case, the area of the auxiliary substrate 100 corresponding to the lower portion of the second vacuum adsorption pad 310_2 can be removed from the panel substrate 200 with the second desorption height D21. The area of the auxiliary substrate 100 corresponding to the lower portion of the first vacuum adsorption pad 310_1 can be detached from the panel substrate 200 to the first desorption height D12 longer than the existing first desorption height D11 have. Here, the first desorption height D12 may be longer than the second desorption height D21.

Thereafter, referring to FIG. 7, the third suction device 340_3 can be raised in the vertical direction. As a result, a third coupling region P3 in which the third step substrate S3 and the fourth step substrate S4 are coupled to each other can be formed. The third coupling region P3 may be formed by joining together the third and fourth stepped substrates S3 and S4 which are spaced apart from each other with the third step gap H3 therebetween. That is, as the third suction device 340_3 is raised in the vertical direction, one end of the lowermost layer of the second step substrate S2 contacts one end of the uppermost layer of the third step substrate S3, Can be formed. The first coupling region P1 coupled to the first and second stepped substrates S1 and S2 and the second coupled region P2 coupled to the second and third stepped substrates S2 and S3 Continue to maintain the combined state.

In addition, as the third suction device 340_3 is lifted in the vertical direction, the auxiliary substrate 100 can be further detached from the panel substrate 200 by the third vacuum adsorption pad 310_3. In this case, the area under the third vacuum adsorption pad 310_3 of the area of the auxiliary substrate 100 can be removed from the panel substrate 200 with the third desorption height D31. The area under the second vacuum adsorption pad 310_2 of the area of the auxiliary substrate 100 can be detached from the panel substrate 200 by the second desorption height D22 longer than the existing second desorption height D21 have. The area of the auxiliary substrate 100 corresponding to the lower portion of the first vacuum adsorption pad 310_1 can be detached from the panel substrate 200 to the first desorption height D13 longer than the existing first desorption height D12 have. Here, the first desorption height D13 is longer than the second desorption height D22, and the second desorption height D22 may be longer than the third desorption height D31.

8, the fourth suction device 340_4 can be raised in the vertical direction. In this case, the first coupling region P1, the second and third stepped substrates S2 and S3 coupled to the first and second stepped substrates S1 and S2, And the third coupling region P3, to which the third and fourth stepped substrates S3 and S4 are coupled, continues to maintain the coupled state. Further, as the fourth suction device 340_4 is lifted in the vertical direction, the auxiliary substrate 100 can be further detached from the panel substrate 200 by the fourth vacuum adsorption pad 310_4.

As described above, the substrate detachment apparatus according to the present invention is sequentially detached from the outermost stepped substrate, so that the auxiliary substrate 100 can be separated from the panel substrate 200 at a predetermined angle. As a result, cracking that occurs when the auxiliary substrate 100 is simultaneously removed from the panel substrate 200 can be prevented.

The embodiments have been disclosed in the drawings and specification as described above. Although specific terms have been employed herein, they are used for purposes of illustration only and are not intended to limit the scope of the invention as defined in the claims or the claims. Therefore, those skilled in the art will appreciate that various modifications and equivalent embodiments are possible without departing from the scope of the present invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

100: auxiliary substrate
200: panel substrate
310: Vacuum adsorption pad
320: Vacuum member
330: bonded substrate
340: Suction device

Claims (15)

A plurality of step-like substrates, each of which is formed in a step-like shape and has at least one step layer,
A plurality of vacuum members coupled to holes formed in each of the stepped substrates; And
And a plurality of vacuum adsorption pads connected to the vacuum members and adsorbed to the substrate,
Wherein the stepped substrates are sequentially vertically lifted inward from a stepped substrate connected to vacuum adsorption pads adsorbed on the outermost side of the substrate among the vacuum adsorption pads. The method according to claim 1,
Further comprising a plurality of suction devices connected to the vacuum members, respectively, for vertically lifting the stepped substrates. The method according to claim 1,
Each of the step-like substrates,
A first step layer extending in a horizontal direction;
A second step layer superimposed on one region of the first step layer to have a step shape with the first step layer; And
And a third step layer superimposed on one region of the second step layer to have a stepped shape with the second step layer. The method of claim 3,
And the holes for coupling the vacuum members are formed on the second step layer. The method of claim 3,
In two of the first stepped substrates and the second stepped substrates adjacent to each other of the stepped substrates,
Wherein one region of the third stepped layer of the first stepped substrate and one region of the first stepped layer of the second stepped substrate overlap each other with a predetermined gap therebetween. 6. The method of claim 5,
Wherein the second stepped substrate is arranged further outward than the first stepped substrate. 6. The method of claim 5,
Wherein the first stepped substrate is vertically raised after the second stepped substrate is vertically raised. 8. The method of claim 7,
Wherein when the second stepped substrate is vertically raised, the first stepped layer of the second stepped substrate is brought into contact with and joined to the third stepped layer of the first stepped substrate. The method of claim 3,
Wherein each of the second step layers of the stepped substrates is formed to have a height in a position parallel to each other. The method of claim 3,
Wherein an extended length of the second step layer is longer than an extended length of the first or third step layer. Providing an auxiliary substrate and a panel substrate;
Attaching the auxiliary substrate to the panel substrate;
The method comprising the steps of: preparing a display panel on the panel substrate; And
And separating the auxiliary substrate from the panel substrate,
Wherein the step of separating the auxiliary substrate comprises:
Providing a plurality of stepped substrates, each of the stepped substrates being at least one of the stepped layers and overlapping each other by a predetermined distance;
Coupling a plurality of vacuum members to holes formed in each of the stepped substrates;
Connecting the plurality of vacuum adsorption pads to the vacuum members;
Adsorbing the vacuum adsorption pads on the auxiliary substrate; And
And vertically elevating the stepped substrate sequentially in the inward direction from the stepped substrate connected to the vacuum adsorption pads adsorbed on the outermost side of the auxiliary substrates among the vacuum adsorption pads. 12. The method of claim 11,
Further comprising connecting a plurality of suction devices to the vacuum members,
Wherein the suction devices vertically raise the step-plates sequentially from the outermost side to the inward side. 12. The method of claim 11,
Each of the step-like substrates,
A first step layer extending in a horizontal direction;
A second step layer superimposed on one region of the first step layer to have a step shape with the first step layer; And
And a third stepped layer overlapping the second stepped layer with one region of the second stepped layer so as to have a stepped shape. 14. The method of claim 13,
In two of the first stepped substrates and the second stepped substrates adjacent to each other of the stepped substrates,
Wherein the third stepped layer region of the first stepped substrate and the first stepped layer region of the second stepped substrate overlap each other with a predetermined gap therebetween. 15. The method of claim 14,
Wherein the second stepped substrate is arranged further outward than the first stepped substrate.

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