KR20160034168A - Printed circuit board and manufacturing method thereof - Google Patents

Abstract

The present invention provides a printed circuit board which is a coreless substrate, and can suppress modification of bending, twisting or the like, and a manufacturing method thereof. The present invention relates to the printed circuit board which comprises: a first circuit layer; a first insulating layer arranged on the first circuit layer; a high stiffness layer arranged on the first insulating layer; and a second circuit layer arranged on the high stiffness layer, and connected to the first circuit layer by a first via penetrating the first insulating layer and the high stiffness layer. The high stiffness layer has larger stiffness than the stiffness of the first insulating layer.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a printed circuit board

The present invention relates to a printed circuit board and a manufacturing method thereof.

BACKGROUND ART As electronic products have become increasingly more sophisticated, smaller, and thinner, there has been a demand for higher density circuit patterns of printed circuit boards. In order to satisfy such a demand, a coreless board has been proposed in which a core substrate (supporting substrate) thicker than the interlayer insulating layer and having a high strength is removed.

The coreless substrate is prepared by preparing a carrier substrate as a supporting substrate, building up a necessary number of circuit layers and insulating layers on the carrier substrate, and finally removing the carrier substrate.

Korea Patent Publication No. 2011-0054345

The present invention relates to a printed circuit board capable of suppressing deformation such as warping or twisting while being a coreless substrate, and a manufacturing method thereof.

One embodiment of the present invention is a semiconductor device comprising a first circuit layer, a first insulating layer disposed on the first circuit layer, a high-stiffness layer disposed on the first insulating layer, and a high- And a second circuit layer connected to the first circuit layer by a first via passing through the high-strength layer.

According to one embodiment of the present invention, it is possible to provide a coreless substrate capable of suppressing deformation such as warping or twisting.

1 is a cross-sectional view showing a structure of a printed circuit board according to an embodiment of the present invention.
2 to 6 are sectional views showing the structure of a printed circuit board according to another embodiment of the present invention.
7A to 71 are views sequentially showing a method of manufacturing a printed circuit board according to an embodiment of the present invention.
8A to 8C are views sequentially showing a method of manufacturing a printed circuit board according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shapes and sizes of the elements in the drawings may be exaggerated for clarity of description, and the elements denoted by the same reference numerals in the drawings are the same elements.

It is to be understood that, although the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, Will be described using the symbols.

Throughout the specification, when an element is referred to as "comprising ", it means that it can include other elements as well, without excluding other elements unless specifically stated otherwise.

Printed circuit board

1 is a cross-sectional view showing a structure of a printed circuit board according to an embodiment of the present invention.

1, a printed circuit board according to an embodiment of the present invention includes a first circuit layer 110, a first insulation layer 210 disposed on the first circuit layer 110, A high-stiffness layer 220 disposed on the first layer 210 and a first via 150 disposed on the high-stiffness layer 220 and through the first insulation layer 210 and the high-stiffness layer 220 And a second circuit layer (120) connected to the first circuit layer (110).

The printed circuit board according to one embodiment of the present invention is a support substrate which is different from the general form in which build-up layers are continuously formed on both sides or one side of a core substrate, ) Substrate.

In the case of another embodiment in which the core-less substrate is formed, since there is no core substrate as a supporting substrate, it is difficult to secure sufficient rigidity and distortion such as warping or twisting occurs in the production of the substrate.

Accordingly, one embodiment of the present invention improves the mechanical strength by forming at least one high-strength layer (220) on the coreless substrate, thereby suppressing deformation such as warping or twisting.

The first and second circuit layers 110 and 120 are not limited as long as they are used as a conductive metal for a circuit pattern. For example, copper (Cu) may be used.

In one embodiment of the present invention, a circuit pattern of the first circuit layer 110 is embedded in the first insulating layer 210. The first insulating layer 210 surrounds the first circuit layer 110 such that one side of the circuit pattern of the first circuit layer 110 is exposed. At this time, one surface of the circuit pattern of the first circuit layer 110 is buried so as to be exposed to the first surface of the first insulating layer 210.

By forming the first circuit layer 110 so as to be embedded in the first insulation layer 210, the interlayer connection of the circuit patterns can be further densified and a more detailed circuit can be realized.

A resin insulating layer is used for the first insulating layer 210.

As the resin insulating layer, a thermosetting resin such as an epoxy resin, or a thermoplastic resin such as polyimide may be used.

Further, a resin impregnated with a reinforcing material such as a glass fiber or an inorganic filler, for example, a prepreg may be used, but is not particularly limited thereto.

The high-strength layer 220 uses an insulating material having a higher rigidity than the first insulating layer 210.

The highly rigid insulating layer 220 may be made of glass or metal. The metal may be, for example, a high-rigidity alloy containing iron (Fe).

By including the high-strength layer 220, the mechanical strength can be improved and deformation such as warping or twisting can be suppressed.

A second circuit layer 120 is disposed on the high-strength layer 220 and the first circuit layer 110 and the second circuit layer 120 are connected by a first via 150.

The first via 150 is formed to penetrate the first insulating layer 210 and the high-strength layer 220 to connect the first and second circuit layers 110 and 120.

The first via 150 may be made of the same material as that of the circuit layer. For example, copper (Cu) may be used. However, the first via 150 is not limited thereto, .

A second insulating layer 230 is further formed on the second circuit layer 120 and a third circuit layer 130 is further formed on the second insulating layer 230. The second circuit layer 120 and the third circuit layer 130 are connected by a second via 160 formed to penetrate the second insulation layer 230.

In an embodiment of the present invention, all the vias formed on the printed circuit board are formed in such a shape that the diameter decreases from one surface side to the other surface side of the printed circuit board.

For example, as shown in FIG. 1, all of the first and second vias 150 and 160 are formed in a tapered shape having a smaller diameter from the top to the bottom, all in one direction.

However, the present invention is not limited thereto, and all of the first and second vias 150 and 160 may have a teaper shape having a larger diameter from the upper part to the lower part.

1, the three layers of the first, second and third circuit layers 110, 120 and 130 are shown. However, the present invention is not limited to the three layers, and if the layers are formed within a range that can be utilized by those skilled in the art, Can also be formed.

1, the high-stiffness layer 220 is disposed between the first circuit layer 110 and the second circuit layer 120, which are the lowermost circuit layers. However, the present invention is not limited thereto. The insulating layer may be formed on at least one of the insulating layers.

A solder resist (300) formed to expose a circuit pattern for an external connection pad is disposed on a surface of the printed circuit board.

2 to 6 are sectional views showing the structure of a printed circuit board according to another embodiment of the present invention.

2, a printed circuit board according to another embodiment of the present invention includes a resin insulating portion 250 covering the high-strength layer 220 between the first circuit layer 110 and the second circuit layer 120 Respectively.

As the resin insulating portion 250, a thermosetting resin such as an epoxy resin, or a thermoplastic resin such as polyimide may be used. Further, it may further include an inorganic filler.

The resin insulating portion 250 is formed to cover the side surface and the upper surface of the high-strength layer 220.

It is possible to prevent cracks from being generated in the high-stiffness layer 220 made of, for example, glass when the resin-insulated portion 251 covering the side surface of the high-strength layer 220 is cut into individual printed circuit boards.

When the circuit layer is formed on the high-stiffness layer 220, the adhesion between the high-stiffness layer 220 and the circuit layer may be deteriorated. The resin-insulated portion 252 covering the upper surface of the high-strength layer 220 is formed By forming the second circuit layer 120 on the upper surface of the resin insulating portion 252, the problem of adhesion between the high-stiffness layer 220 and the circuit layer can be improved and lifting of the circuit layer can be prevented.

Except for the configuration of the resin insulating portion 250, the configuration that overlaps with the configuration of the printed circuit board according to the embodiment of the present invention described above can be similarly applied.

Referring to FIG. 3, the printed circuit board according to another embodiment of the present invention further includes the resin insulating portion 250 between the high-strength layer 220 and the first via 150.

The adhesion between the high stiffness layer 220 and the vias may be deteriorated when the vias are formed in the high stiffness layer 220. The resin insulating portion 253 may be formed between the high stiffness layer 220 and the first vias 150, The adhesion between the high-stiffness layer 220 and the circuit layer is improved by the resin insulating portion 253 formed between the high-stiffness layer 220 and the first via 150, thereby preventing lifting of the via.

Also, when vias are formed directly in the high-stiffness layer 220, it is possible to prevent cracks from being generated in the high-stiffness layer 220 made of, for example, glass during via hole processing using a laser or the like.

The structure overlapping the structure of the printed circuit board according to the above-described embodiment of the present invention is the same except for the structure of the resin insulating portion 253 formed between the high-stiffness layer 220 and the first via 150 .

Referring to FIGS. 4A and 4B, a printed circuit board according to another embodiment of the present invention has a circuit pattern of the first circuit layer 110 'disposed and protruded on the surface of the first insulating layer 210.

Accordingly, the outermost circuit layer of the printed circuit board, for example, the first and third circuit layers 110 'and 130, may have a structure protruding in opposite directions to each other.

4A shows a structure in which the circuit patterns of the first circuit layer 110 'are protruded while the resin insulating portions 251 and 252 cover the side surfaces and the upper surface of the high-strength layer 220, The resin insulating portions 251, 252 and 253 cover the side surfaces and the upper surface of the high-stiffness layer 220 and are formed between the first vias 150.

Except for the configuration of the protruded first circuit layer 110 ', the same configuration as that of the printed circuit board according to the above-described embodiment of the present invention can be applied.

Referring to FIG. 5, another embodiment of the present invention is formed in an hourglass shape in which the first via 150 'is reduced in diameter from the first and second circuit layers 110' and 120 toward the center.

In this case, the first circuit layer 110 'may be a protruding structure disposed on the surface of the first insulating layer 210.

Except for the configuration of the hourglass-shaped first via 150 ', the same configuration as that of the printed circuit board according to the above-described embodiment of the present invention can be applied.

Referring to FIG. 6, another embodiment of the present invention further includes an inner wiring layer 140 on the upper surface of the high-strength layer 220.

The internal wiring layer 140 may be implemented by a circuit pattern, an inductor, a capacitor, a resistor, or the like.

The inner wiring layer 140 may be connected to the third circuit layer 130 and the third vias 170 disposed on the second insulating layer 230.

Except for the configuration of the internal wiring layer 140, the same configuration as that of the above-described configuration of the printed circuit board according to the embodiment of the present invention can be applied.

Manufacturing method of printed circuit board

7A to 71 are views sequentially showing a method of manufacturing a printed circuit board according to an embodiment of the present invention.

Referring to FIG. 7A, a carrier substrate 10 is provided and a first circuit layer 110 is formed on both sides of a carrier substrate 10.

The carrier substrate 10 includes a core portion 13, an inner layer metal plate 12 disposed on both surfaces of the core portion 13 and an outer layer metal plate 11 disposed on the inner layer metal plate 12.

The inner layer metal sheet 12 and the outer layer metal sheet 11 may be copper foil, but are not limited thereto.

At least one of the bonding surfaces of the inner layer metal sheet 12 and the outer layer metal sheet 11 may be surface treated to facilitate separation of the inner layer metal sheet 12 and the outer layer metal sheet 11. [

The first circuit layer 110 is formed by forming a plating resist having an opening for forming a first circuit layer on the outer layer metal plate 11 and filling the opening with a conductive metal.

The conductive metal may be filled by, for example, a process such as electrolytic plating. The conductive metal may be any metal having excellent electrical conductivity. For example, copper (Cu) may be used. have.

Referring to FIG. 7B, a first insulation layer 210 covering the first circuit layer 110 is formed on the outer metal plate 11 on which the first circuit layer 110 is formed.

A resin insulating layer is used for the first insulating layer 210.

As the resin insulating layer, a thermosetting resin such as an epoxy resin, or a thermoplastic resin such as polyimide may be used.

Further, a resin impregnated with a reinforcing material such as a glass fiber or an inorganic filler, for example, a prepreg may be used, but is not particularly limited thereto.

Referring to FIG. 7C, a high-strength layer 220 is formed on the first insulating layer 210.

The high-strength layer 220 uses an insulating material having a higher rigidity than the first insulating layer 210.

The highly rigid insulating layer 220 may be made of glass or metal. The metal may be, for example, a high-rigidity alloy containing iron (Fe).

Referring to FIG. 7D, a side opening 221 and a via opening 222 are formed in the high-strength layer 220.

The side openings 221 are continuously formed along the boundary between the plurality of unit printed circuit board regions.

In the high-strength layer 200, a plurality of unit printed circuit board regions are set, and a boundary portion between the regions of the unit printed circuit boards when cut into each unit printed circuit board can be set.

The side opening 221 may be formed in a trench shape along four sides of the high-strength layer 220, and the opening 222 for forming a via may be formed in a tapered shape.

The side openings 221 and the via forming openings 222 may be formed by firstly forming a hole using a mechanical drill or a laser drill and then widening the second through hole through chemical etching , But are not necessarily limited thereto.

Referring to FIG. 7E, the resin insulating portion 250 is formed to cover the high-strength layer 220.

As the resin insulating portion 250, a thermosetting resin such as an epoxy resin, or a thermoplastic resin such as polyimide may be used. Further, it may further include an inorganic filler.

The side openings 221 and the via forming openings 222 are filled with the resin insulating portion 250 and the upper surface of the high strength layer 220 is covered with the resin insulating portion 250.

Referring to FIG. 7F, a first via hole 225 is formed in the first insulating layer 210 and the resin insulating portion 250 formed in the opening 222 for forming a via.

At this time, the first via hole 225 may be formed using a mechanical drill or a laser drill, but is not limited thereto.

Here, the laser drill may be a CO ₂ laser or a YAG laser, but is not limited thereto.

The first via-hole 225 may have a tapered shape with a smaller diameter toward the carrier substrate 10 side.

7G, a first via 150 is formed by filling the first via hole 225, and a second circuit layer (not shown) is formed on the resin insulating portion 250 formed on the upper surface of the high-strength layer 220 120 are formed.

An electroless plating seed layer (not shown) is formed on the resin insulating portion 250, a plating resist having an opening for forming a second circuit layer is formed, and then a process such as electrolytic plating is applied to fill the conductive metal The first via 150 and the second circuit layer 120 can be formed.

Referring to FIG. 7H, a second insulating layer 230 is formed on the second circuit layer 120, and a second via hole 231 is formed in the second insulating layer 230.

The second via hole 231 may be tapered to have a smaller diameter toward the carrier substrate 10 side.

Referring to FIG. 7I, an electroless plating layer 180 is formed on the second insulating layer 230.

Referring to FIG. 7J, a second via hole 160 is formed by filling the second via hole 231, and a third circuit layer 130 is formed on the second insulating layer 230.

The third circuit layer 13 can be formed by forming a plating resist having an opening for forming a third circuit layer and then filling the conductive metal with a process such as electrolytic plating.

The circuit layer may be formed in three or more layers as long as the vias and the circuit layers described above are repeatedly formed within a range that can be utilized by those skilled in the art.

7K, the inner metal plate 12 and the outer metal plate 11 are peeled off.

At this time, the peeling can be performed using a blade, but not limited thereto, and any method known in the art can be used.

The peeled printed circuit board A is formed such that the first circuit layer 110 is embedded in the first insulating layer 210.

7L, an outer layer metal plate 11 formed on one surface of the printed circuit board A is etched and removed, and a circuit pattern for an external connection pad among the outermost circuit layers is exposed on the surface of the printed circuit board A So that the solder resist 300 is formed.

8A to 8C are views sequentially showing a method of manufacturing a printed circuit board according to another embodiment of the present invention.

Referring to FIG. 8A, the first insulating layer 210 is directly formed on the carrier substrate 10 without forming the first circuit layer 110.

The steps that are the same as the steps of manufacturing the printed circuit board according to the embodiment of the present invention described above can be applied to the same point except that the first circuit layer 110 is not formed.

8B, the first circuit layer 110 'is formed on the outer layer metal plate 11 of the peeled printed circuit board B and the first circuit layer 110' Is removed by etching.

Thus, a first circuit layer 110 'protruding on the surface of the first insulating layer 210 is formed. That is, the outermost circuit layer of the printed circuit board, for example, the first and third circuit layers 110 'and 130 may have a structure protruding in opposite directions.

Referring to FIG. 8C, the solder resist 300 is formed on the surface of the printed circuit board B such that the circuit pattern for the external connection pad among the outermost circuit layers is exposed.

It is to be understood that the present invention is not limited to the disclosed embodiments and that various substitutions and modifications can be made by those skilled in the art without departing from the scope of the present invention Are to be construed as being within the scope of the present invention, and constituent elements which have been described in the present embodiment but not described in the claims are not construed as essential elements of the present invention.

10: carrier substrate
11: outer layer metal plate
12: inner layer metal plate
13: core part
110, 120, 130: first, second and third circuit layers
140: capacitor electrode layer
150, 160, 170: first to third vias
180: Electroless plating layer
210, 230: first and second insulating layers
220: high strength layer
221: side opening
222: opening for forming a via
225: first via hole
231: Second via hole
250: resin insulating portion
300: Solder resist

Claims (20)

A first circuit layer;
A first insulating layer disposed on the first circuit layer;
A high-strength layer disposed on the first insulating layer; And
And a second circuit layer disposed on the high stiffness layer and connected to the first circuit layer by a first via passing through the first insulating layer and the high stiffness layer,
Wherein the high-strength layer has greater rigidity than the first insulating layer.
The method according to claim 1,
Wherein the high-strength layer comprises at least one selected from the group consisting of glass and metal.
The method according to claim 1,
A second insulating layer disposed on the second circuit layer; And
A third circuit layer disposed on the second insulating layer and connected to the second circuit layer by a second via passing through the second insulating layer;
And a printed circuit board.
The method according to claim 1,
Wherein the first insulating layer surrounds the first circuit layer so that one side of the circuit pattern of the first circuit layer is exposed.
The method according to claim 1,
Wherein the first circuit layer is disposed so as to protrude on a surface of the first insulating layer.
The method according to claim 1,
Wherein all the vias formed on the printed circuit board have a smaller diameter from one side of the printed circuit board to the other side.
The method according to claim 1,
A resin insulating portion covering the side surface and the upper surface of the high-strength layer;
And a printed circuit board.
The method according to claim 1,
A resin insulating portion formed between the first via and the high-strength layer;
And a printed circuit board.
The method according to claim 1,
Wherein the first vias have an hourglass shape with a smaller diameter toward the center.
8. The method of claim 7,
An inner wiring layer disposed on an upper surface of the high-strength layer;
And a printed circuit board.
The method according to claim 1,
Wherein the first insulating layer is a resin insulating layer.
A printed circuit board comprising an insulating layer and a circuit layer laminated thereon and a via formed to penetrate the insulating layer and connecting circuit layers disposed above and below the insulating layer,
All the vias formed in each of the insulating layers have a smaller diameter from one surface side to the other surface side of the printed circuit board,
Wherein at least one of the insulating layers includes a high-stiffness layer having greater rigidity than the resin insulating layer.
13. The method of claim 12,
Wherein the high-strength layer comprises at least one selected from the group consisting of glass and metal.
13. The method of claim 12,
A resin insulating portion covering the side surface and the upper surface of the high-strength layer;
And a printed circuit board.
13. The method of claim 12,
A resin insulating portion formed between the via and the high-strength layer;
And a printed circuit board.
Forming a first circuit layer on one side of the metal plate;
Forming a first insulating layer on one surface of the metal plate to cover the first circuit layer;
Forming a high-stiffness layer having a greater stiffness than the first insulating layer on the first insulating layer;
A first via penetrating the first insulating layer and the high-stiffness layer; and forming a second circuit layer on the high-stiffness layer; And
Removing the metal plate;
And a step of forming the printed circuit board.
17. The method of claim 16,
Wherein the high-strength layer comprises at least one selected from the group consisting of glass and metal.
17. The method of claim 16,
After forming the high-strength layer on the first insulating layer,
Forming side openings continuously formed along the boundary between the plurality of unit printed circuit board regions in the high-strength layer; And
Forming a resin on the high-stiffness layer on which the side openings are formed to form a resin-insulated portion covering upper and side surfaces of the high-stiffness layer;
Further comprising the steps of:
17. The method of claim 16,
After forming the high-strength layer on the first insulating layer,
Forming an opening for forming a via in the high-strength layer; And
Forming a resin insulating portion by filling the opening for via formation with a resin,
Wherein the first via is formed by forming a via hole in the resin insulating portion and filling the via hole with a conductive metal.
Forming a first insulating layer on one surface of the metal plate;
Forming a high-stiffness layer having a greater stiffness than the first insulating layer on the first insulating layer;
A first via penetrating the first insulating layer and the high-stiffness layer; and forming a second circuit layer on the high-stiffness layer; And
Forming a first circuit layer on the other surface opposite to one surface of the metal plate;
And a step of forming the printed circuit board.

Images