KR20160032132A - 표면 센서 - Google Patents
표면 센서 Download PDFInfo
- Publication number
- KR20160032132A KR20160032132A KR1020167002479A KR20167002479A KR20160032132A KR 20160032132 A KR20160032132 A KR 20160032132A KR 1020167002479 A KR1020167002479 A KR 1020167002479A KR 20167002479 A KR20167002479 A KR 20167002479A KR 20160032132 A KR20160032132 A KR 20160032132A
- Authority
- KR
- South Korea
- Prior art keywords
- opening
- dielectric layer
- sensor
- wire
- sensing area
- Prior art date
Links
- 239000004020 conductor Substances 0.000 claims abstract description 39
- 239000003989 dielectric material Substances 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 32
- 238000012545 processing Methods 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 7
- 239000013013 elastic material Substances 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 238000002847 impedance measurement Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 61
- 239000000758 substrate Substances 0.000 description 27
- 230000008878 coupling Effects 0.000 description 8
- 238000010168 coupling process Methods 0.000 description 8
- 238000005859 coupling reaction Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000010409 thin film Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 230000005672 electromagnetic field Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
-
- G06K9/0002—
-
- G06K9/00053—
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Image Input (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Geophysics And Detection Of Objects (AREA)
- Push-Button Switches (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Ceramic Engineering (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NO20130970A NO336318B1 (no) | 2013-07-12 | 2013-07-12 | Overflatesensor |
NO20130970 | 2013-07-12 | ||
PCT/EP2014/063139 WO2015003891A1 (fr) | 2013-07-12 | 2014-06-23 | Capteur de surface |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20160032132A true KR20160032132A (ko) | 2016-03-23 |
Family
ID=50979790
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020167002479A KR20160032132A (ko) | 2013-07-12 | 2014-06-23 | 표면 센서 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9818014B2 (fr) |
EP (1) | EP3019997A1 (fr) |
KR (1) | KR20160032132A (fr) |
CN (1) | CN105431865A (fr) |
NO (1) | NO336318B1 (fr) |
WO (1) | WO2015003891A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102027541B1 (ko) * | 2018-03-23 | 2019-11-14 | (주)파트론 | 지문 센서 패키지 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10095906B2 (en) * | 2014-02-21 | 2018-10-09 | Idex Asa | Sensor employing overlapping grid lines and conductive probes for extending a sensing surface from the grid lines |
TWI537837B (zh) * | 2015-06-11 | 2016-06-11 | 南茂科技股份有限公司 | 指紋辨識晶片封裝結構及其製作方法 |
WO2019172781A1 (fr) * | 2018-03-05 | 2019-09-12 | Stretchsense Limited | Composant électronique souple à connexion améliorée |
WO2020188313A2 (fr) * | 2018-07-10 | 2020-09-24 | Next Biometrics Group Asa | Revêtement thermoconducteur et protecteur pour dispositif électronique |
CN111242052B (zh) * | 2020-01-16 | 2023-08-08 | 成都唐源电气股份有限公司 | 一种接触网刚柔导线自动判别方法及装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NO304766B1 (no) | 1997-06-16 | 1999-02-08 | Sintef | Fingeravtrykksensor |
NO315017B1 (no) | 2000-06-09 | 2003-06-23 | Idex Asa | Sensorbrikke, s¶rlig for måling av strukturer i en fingeroverflate |
US7099496B2 (en) | 2000-12-05 | 2006-08-29 | Validity Sensors, Inc. | Swiped aperture capacitive fingerprint sensing systems and methods |
US7505811B2 (en) * | 2001-11-19 | 2009-03-17 | Dune Medical Devices Ltd. | Method and apparatus for examining tissue for predefined target cells, particularly cancerous cells, and a probe useful in such method and apparatus |
NO316776B1 (no) | 2001-12-07 | 2004-05-03 | Idex Asa | Pakkelosning for fingeravtrykksensor |
FI115109B (fi) | 2003-01-22 | 2005-02-28 | Nokia Corp | Tunnistusjärjestely ja tunnistusjärjestelyn käsittävä matkaviestin |
FI20030102A0 (fi) * | 2003-01-22 | 2003-01-22 | Nokia Corp | Henkilön varmennusjärjestely |
WO2006041780A1 (fr) | 2004-10-04 | 2006-04-20 | Validity Sensors, Inc. | Groupes de detection d'empreintes digitales comprenant un substrat |
US8116540B2 (en) | 2008-04-04 | 2012-02-14 | Validity Sensors, Inc. | Apparatus and method for reducing noise in fingerprint sensing circuits |
NO20083766L (no) | 2008-09-01 | 2010-03-02 | Idex Asa | Overflatesensor |
NO20093601A1 (no) * | 2009-12-29 | 2011-06-30 | Idex Asa | Overflatesensor |
US9262019B2 (en) | 2011-11-22 | 2016-02-16 | Atmel Corporation | Touch sensor with conductive lines having different widths |
GB201208680D0 (en) * | 2012-05-17 | 2012-06-27 | Origold As | Method of manufacturing an electronic card |
-
2013
- 2013-07-12 NO NO20130970A patent/NO336318B1/no not_active IP Right Cessation
-
2014
- 2014-06-23 CN CN201480039690.XA patent/CN105431865A/zh active Pending
- 2014-06-23 EP EP14731667.3A patent/EP3019997A1/fr not_active Withdrawn
- 2014-06-23 WO PCT/EP2014/063139 patent/WO2015003891A1/fr active Application Filing
- 2014-06-23 US US14/904,527 patent/US9818014B2/en not_active Expired - Fee Related
- 2014-06-23 KR KR1020167002479A patent/KR20160032132A/ko not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102027541B1 (ko) * | 2018-03-23 | 2019-11-14 | (주)파트론 | 지문 센서 패키지 |
Also Published As
Publication number | Publication date |
---|---|
NO336318B1 (no) | 2015-08-03 |
US20160148035A1 (en) | 2016-05-26 |
CN105431865A (zh) | 2016-03-23 |
US9818014B2 (en) | 2017-11-14 |
NO20130970A1 (no) | 2015-01-13 |
WO2015003891A1 (fr) | 2015-01-15 |
EP3019997A1 (fr) | 2016-05-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |