KR20160024466A - NFC antenna structure and package of battery protection circuits including the same - Google Patents

Abstract

The present invention relates to an NFC antenna structure and a battery protection circuit package, which are advantageous for integration and miniaturization. The present invention includes: at least one lead frame comprising multiple leads separated from each other; and an encapsulant sealing at least one part of the lead frame. At least one part of the leads forms at least one part of an antenna loop.

Description

[0001] The present invention relates to an NFC antenna structure and a battery protection circuit package including the NFC antenna structure.

The present invention relates to an NFC antenna structure and a battery protection circuit package including the NFC antenna structure. More particularly, the present invention relates to an NFC antenna structure and a battery protection circuit package including the NFC antenna structure.

Near Field Communication (NFC) is a non-contact short-range wireless communication standard that enables wireless communication between electronic devices at a short distance within 10 cm using a frequency of 13.56 MHz. It was developed jointly by NXP Semiconductor and Sony Japan. NFC's transmission rates per second are 106 Kbps, 212 Kbps, 424 Kbps or 848 Kbps. Its proximity characteristics and encryption technology provide excellent security and it is possible to identify devices without any complicated pairing procedure. There is an advantage that it can be recognized. In particular, NFC is a smart card type non-contact wireless communication technology that utilizes RFID technology. It is bi-directional compared to a smart card, has a relatively large storage memory space, and has a wide range of applicable services. Accordingly, this technology has been introduced to electronic devices such as smart phones and tablet PCs, which have recently been commercialized.

On the other hand, batteries are used in portable terminals such as smart phones and tablet PCs. Lithium-ion batteries are the most widely used batteries in portable handsets, but they also generate heat during overcharging and overcurrent, and when the temperature rises due to heat generation, they may deteriorate performance as well as the risk of explosion. Therefore, a conventional battery is equipped with a protection circuit device that detects and blocks overcharge, over-discharge, and over-current, or a protection circuit structure that detects overcharge, over-discharge, do.

Recently, products combining an NFC antenna structure with a battery of a portable terminal have been introduced. However, in this case, a process of separately coupling an NFC antenna structure with a battery is further required, which increases manufacturing cost and requires additional space Resulting in a large-sized battery for the purpose of charging.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an NFC antenna structure and a battery protection circuit package including the NFC antenna structure that can be miniaturized and can simplify a process to solve various problems including the above problems. However, these problems are exemplary and do not limit the scope of the present invention.

An NFC antenna structure according to one aspect of the present invention is provided. Wherein the NFC antenna structure comprises at least one lead frame made up of a plurality of leads spaced apart from each other; And an encapsulant that seals at least a portion of the lead frame, wherein at least a portion of the plurality of leads form at least a portion of an antenna loop.

In the NFC antenna structure, the antenna loop may consist of a single integrated lead.

The NFC antenna structure may further include an electrical connection member connecting the plurality of leads spaced apart from each other, and the antenna loop may include a plurality of spaced leads and the electrical connection member.

In the NFC antenna structure, the at least one lead frame includes a plurality of lead frames having a laminated structure, and a space between the plurality of lead frames is formed in the encapsulating material Can be filled.

Wherein the plurality of lead frames include a first lead frame and a second lead frame disposed in a layer immediately adjacent to the first lead frame, and one end of the antenna loop formed in the first lead frame is connected to the first lead frame, And may be connected to one end of the antenna loop formed in the second lead frame.

In the NFC antenna structure, the other end of the antenna loop formed in the uppermost lead frame of the plurality of lead frames may constitute an NFC connection terminal exposed by the sealing material so as to be electrically connected to the NFC matching device.

In the NFC antenna structure, the antenna loops have a laminated structure by a plurality of lead frames having the laminated structure, and the antenna loops having a laminated structure have a size of the antenna loops so as not to overlap each other And can be configured to be different from each other.

A package of a battery protection circuit according to another aspect of the present invention is provided. The package of the battery protection circuit may be electrically connected to the electrode terminal of the battery bare cell, An NFC antenna structure mounted on the substrate; And a battery protection circuit element mounted on the substrate, the protection circuit element including a protection IC, a field effect transistor (FET), and at least one passive element.

In the package of the battery protection circuit, the substrate may include a lead for a first internal connection terminal and a lead for a second internal connection terminal, which are respectively disposed at both edge portions and are electrically connected to the electrode terminals of the battery bare cell; And a lead for an external connection terminal which is disposed between the lead for the first internal connection terminal and the lead for the second internal connection terminal and constitutes a plurality of external connection terminals, Is an NFC external connection terminal and further includes an electrical connecting member for electrically connecting any two selected from the group consisting of the NFC antenna structure, the protection IC, the field effect transistor, and the plurality of leads, A battery protection circuit can be constructed without using a separate printed circuit board.

In the package of the battery protection circuit, at least one selected from the NFC antenna structure, the protection IC, and the field effect transistor is not inserted and fixed in the form of a semiconductor package on the lead frame, Can be mounted and fixed on at least a part of the surface of the frame in the form of a chip die which is not sealed with a separate sealing material.

In the package of the battery protection circuit, the substrate may include a printed circuit board.

According to some embodiments of the present invention as described above, an NFC antenna structure and a battery protection circuit package advantageous for integration and miniaturization can be realized. Of course, the scope of the present invention is not limited by these effects.

1A is a circuit diagram of a battery protection circuit to be implemented by a part of a battery protection circuit package according to a comparative example of the present invention.
1B is a diagram illustrating a configuration of a general short range wireless communication (NFC).
2 is an exploded perspective view of a battery pack having a battery protection circuit package according to a comparative example of the present invention.
3 is a perspective view of a battery protection circuit package according to a comparative example of the present invention.
4 is an assembled perspective view of a battery pack having a battery protection circuit package according to a comparative example of the present invention before a labeling process.
5 is an exploded perspective view of a battery pack having a battery protection circuit package according to some embodiments of the present invention.
6 is a diagram illustrating a configuration of a battery protection circuit package according to an embodiment of the present invention.
7 is a diagram illustrating a configuration of a battery protection circuit package according to another embodiment of the present invention.
Figure 8 is an assembled perspective view of a battery pack prior to a labeling process with a battery protection circuit package in accordance with some embodiments of the present invention.
9 is a perspective view illustrating an NFC antenna structure according to an embodiment of the present invention.
10 is a perspective view illustrating a plurality of lead frames constituting an NFC antenna structure according to an embodiment of the present invention.
11 is a plan view illustrating each of the lead frames constituting the NFC antenna structure according to an embodiment of the present invention.
12 is a diagram illustrating a path through which current flows between NFC connection terminals of an NFC antenna structure according to an embodiment of the present invention.
13 is a perspective view illustrating an NFC antenna structure according to another embodiment of the present invention.
14 is a perspective view illustrating a plurality of lead frames constituting an NFC antenna structure according to another embodiment of the present invention.
15 is a plan view illustrating each of the lead frames constituting the NFC antenna structure according to another embodiment of the present invention.
16 is a diagram illustrating a path through which current flows between NFC connection terminals of an NFC antenna structure according to another embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified in various other forms, The present invention is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art. In the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of explanation.

It is to be understood that throughout the specification, when an element such as a film, region or substrate is referred to as being "on", "connected to", "laminated" or "coupled to" another element, It is to be understood that elements may be directly "on", "connected", "laminated" or "coupled" to another element, or there may be other elements intervening therebetween. On the other hand, when one element is referred to as being "directly on", "directly connected", or "directly coupled" to another element, it is interpreted that there are no other components intervening therebetween do. Like numbers refer to like elements. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various elements, components, regions, layers and / or portions, these members, components, regions, layers and / It is obvious that no. These terms are only used to distinguish one member, component, region, layer or section from another region, layer or section. Thus, a first member, component, region, layer or section described below may refer to a second member, component, region, layer or section without departing from the teachings of the present invention.

Also, relative terms such as "top" or "above" and "under" or "below" can be used herein to describe the relationship of certain elements to other elements as illustrated in the Figures. Relative terms are intended to include different orientations of the device in addition to those depicted in the Figures. For example, in the figures the elements are turned over so that the elements depicted as being on the top surface of the other elements are oriented on the bottom surface of the other elements. Thus, the example "top" may include both "under" and "top" directions depending on the particular orientation of the figure. If the elements are oriented in different directions (rotated 90 degrees with respect to the other direction), the relative descriptions used herein can be interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention should not be construed as limited to the particular shapes of the regions shown herein, but should include, for example, changes in shape resulting from manufacturing.

FIG. 1A is a circuit diagram of a battery protection circuit to be implemented by a part of a battery protection circuit package according to a comparative example of the present invention, and FIG. 1B is a diagram illustrating a configuration of a general short range wireless communication (NFC). FIG. 3 is a perspective view of a battery protection circuit package according to a comparative example of the present invention, and FIG. 4 is a perspective view of a battery protection circuit package according to a comparative example of the present invention FIG. 2 is a perspective view illustrating a battery pack according to an embodiment of the present invention; FIG.

The battery protection circuit to be implemented by the battery protection circuit package according to some embodiments of the present invention may be the same as the protection circuit shown in FIG. In view of this, the battery protection circuit will be described below.

Referring to FIG. 1A, the battery protection circuit 10 includes first and second internal connection terminals B + and B- connected to a battery bare cell, and is connected to a charger during charging. And first to third external connection terminals P +, CF, and P- for connecting to an operating electronic device (e.g., a portable terminal or the like). Furthermore, it may further include a fourth external connection terminal NFC1. Here, the first external connection terminal P + and the third external connection terminal P- of the first to third external connection terminals P +, CF, and P- are for power supply and the other is an external connection terminal The second external connection terminal CF divides the battery, for example, and charges the battery according to the battery. The second external connection terminal CF may be a thermistor, which is a component for sensing the battery temperature during charging, and may be used as a terminal to which other functions are applied.

The battery protection circuit 10 is connected to the connection structure of the dual FET chip 110, the protection integrated circuit 120, the resistors R1, R2 and R3, the varistor V1 and the capacitors C1 and C2 . The dual FET chip 110 includes a first field effect transistor (FET1) and a second field effect transistor (FET2) having a drain common structure. The protection IC 120 is connected to the first internal connection terminal B + which is the positive terminal of the battery through the resistor R1 and is connected to the first node n1 through the first node n1, A terminal (VDD terminal) for sensing a voltage application and a battery voltage, a reference terminal (VSS terminal) serving as a reference for an operation voltage inside the protection IC 110, a sensing terminal (V- A discharge cutoff signal output terminal (DO terminal) for turning off the first field effect transistor FET1 in the overdischarge state, a charge cutoff signal output terminal C0 for turning off the second field effect transistor FET2 in the overcharge state, Terminal).

At this time, the inside of the protection IC 120 includes a reference voltage setting unit, a comparison unit for comparing the reference voltage with the charge / discharge voltage, an overcurrent detection unit, and a charge / discharge detection unit. Here, the criterion of charging and discharging states can be changed to a specification (SPEC) required by the user, and the charging / discharging state is determined by recognizing the voltage difference of each terminal of the protection IC 120 according to the determined standard.

When the protection IC 120 reaches an over-discharge state at the time of discharging, the DO terminal becomes LOW to turn off the first field effect transistor FET1, and when the overcharge state is reached, the CO terminal becomes low, The field effect transistor FET2 is turned off and the second field effect transistor FET2 is turned off at the time of charging when the overcurrent flows and the first field effect transistor FET1 at the time of discharging.

The resistor R1 and the capacitor C1 serve to stabilize the variation of the power supply of the protection IC 120. [ The resistor R1 is connected between the first node n1 which is the supply node of the battery power supply V1 and the VDD terminal of the protection IC 120 and the capacitor C1 is connected between the VDD terminal and the VSS terminal of the protection IC do. Here, the first node n1 is connected to the first internal connection terminal B + and the first external connection terminal P +. When the resistance R1 is increased, the detection voltage becomes higher due to the current penetrated into the protection IC 120 at the time of voltage detection. Therefore, the value of the resistor R1 is set to an appropriate value of 1 K or less. Also, for stable operation, the value of the capacitor C1 has an appropriate value of 0.01 mu F or more.

And the resistors R1 and R2 become current limiting resistors when the high voltage charger or charger exceeding the absolute maximum rating of the protection IC 120 is connected upside down. The resistor R2 is connected between the V- terminal of the protection IC 120 and the second node n2 to which the source terminal S2 of the second field effect transistor FET2 is connected. Since the resistors R1 and R2 may cause power consumption, the sum of the resistance values of the resistors R1 and R2 is usually set to be larger than 1 K ?. If the resistance R2 is too large, the return may not occur after the overcharge cutoff, so that the value of the resistance R2 is set to a value of 10K or less.

The capacitor C2 is connected to the source terminal S1 of the first node n2 (or the third external connection terminal P-) and the first field effect transistor FET1 (or the VSS terminal, the second internal connection terminal B -)). The capacitor C2 does not significantly affect the characteristics of the battery protection circuit product, but is added for user's request or stability. The capacitor C2 is for stabilizing the system by improving the resistance to voltage fluctuation and external noise.

The resistor R3 and the varistor V1 are elements for ESD (Electrostatic Discharge) and surge protection and are connected in parallel to each other. The second external connection terminal CF and the second node n2 Or the third external connection terminal P-). The resistance of the varistor (V1) is lowered when an overvoltage occurs. When the overvoltage is generated, the resistance of the varistor (V1) is lowered, thereby minimizing circuit damage due to overvoltage.

Meanwhile, in addition to the configuration of the battery protection circuit described above, an NFC circuit 141 may be added to support Near Field Communication (NFC). The added NFC circuit 141 may include, for example, an NFC external connection terminal NFC1, NFC connection terminals PD1 and PD2, and NFC matching elements C3, C4, C5, and C6. The NFC connection terminals PD1 and PD2 disclosed in the circuit diagram of FIG. 1A are implemented as terminals 60-1 and 60-2 in the package 300a shown in FIG. 3, (472, 474 in Fig. 2) of the NFC antenna (470 in Fig. 2) being placed. The NFC antenna 470 can be realized, for example, by incorporating a loop antenna in the film. When the ends 472 and 474 of the NFC antenna 470 are brought into contact with the NFC connection terminals PD1 and PD2, the NFC matching elements C3, C4, C5, and C6 and the NFC antenna 470 are electrically connected to each other A closed loop can be formed. The NFC matching elements C3, C4, C5, and C6 may be, for example, capacitors for frequency matching. For example, both ends 472 and 474 of the NFC antenna 470 are connected to capacitors, which are the NFC matching elements, to form a closed loop, and the NFC antenna 470 and the capacitors C3, C4, By using the generated resonance, a frequency region for NFC communication of 13.56 MHz can be generated and communicated with the NFC device.

Referring to FIG. 1B, a typical short range wireless communication (NFC) configuration includes an NFC control integrated circuit portion 142, a USIM CHIP 144, and a reader 148. A first inductor 146 and a second inductor 147 are provided between the waveguide chip 144 and the reader 148 and a first capacitor portion 145 is provided between the waveguide chip 144 and the first inductor 146, May be provided. A second capacitor portion 143 may be provided between the NFC control integrated circuit portion 142 and the idler chip 144.

The NFC antenna 470 corresponds to the first inductor 146 shown in FIG. 1B and the capacitors C3, C4, C5, and C6 correspond to the first capacitor 145 shown in FIG. 1B. do. The first inductor 146 and the first capacitor part 145 are connected to the NFC control integrated circuit part 142, the second capacitor part 143 and the buffer chip 144 through the NFC external connection terminal NFC1.

2 to 4, in the battery protection circuit package 300a and the battery pack 700a according to the comparative example of the present invention, the NFC antenna 470 is connected to the battery cell 400a constituting the battery pack 700a As shown in Fig. Specifically, when the side of the battery bare cell 400 is composed of a wide surface (a surface substantially perpendicular to the y-axis direction) and a narrow surface (a surface substantially perpendicular to the x-axis direction) (400). ≪ / RTI > The ends 472 and 474 of the NFC antenna 470 may be bonded to the terminal pads 60-1 and 60-2 of the battery protection circuit package 300a by, for example, a soldering process. However, since the battery protection circuit package 300a for the antenna soldering process requires the configuration of the terminal pads 60-1 and 60-2, it is disadvantageous in downsizing the package and involves a limitation in securing the space inside the package. Meanwhile, the manufacturing process of the battery pack may be complicated by the antenna soldering process. In addition, the joint portion between the NFC antenna 470 and the battery protection circuit package 300a is weak in structure, so that the shear strength may be low in view of the overall structure.

In the battery protection circuit package 300a and the battery pack 700a according to the comparative example of the present invention, the upper case 610 is fixed with the battery protection circuit package 300a on the upper surface of the battery bare cell 400, do. The upper case 610 includes a through hole 670 for exposing the external connection terminals 50-2, 50-3, 50-4, and 50-5 of the battery protection circuit package 300a to the outside.

In the battery pack according to the embodiments of the present invention, the NFC antenna structure is not provided separately from the package of the battery protection circuit, but the NFC antenna structure is disposed in the package of the battery protection circuit. Overcome. Further, the present invention overcomes the above-mentioned problems by providing an NFC antenna structure that is simple in construction and has a reduced manufacturing cost.

FIG. 5 is an exploded perspective view of a battery pack having a battery protection circuit package according to some embodiments of the present invention, FIG. 6 is a view illustrating a configuration of a battery protection circuit package according to an embodiment of the present invention, 8 is an assembled perspective view of a battery pack having a battery protection circuit package according to some embodiments of the present invention, prior to the labeling process.

5, 6, and 8, a battery protection circuit package 300b according to an embodiment of the present invention is a package that can be electrically connected to the electrode terminals 410 and 430 of the battery bare cell 400 An NFC antenna structure 1000 mounted on the substrate 50, 60 and the substrate 50, 60, and a battery protection circuit element. The battery protection circuit element is disposed on the substrates 50 and 60 and includes a protection IC 120, a field effect transistor 110, and at least one passive element 130. Here, the first substrate 50 is a lead frame composed of a plurality of leads 50-1 to 50-6 spaced from each other, and the second substrate 60 is a lead frame, Or the like. The NFC antenna structure 1000 and the battery protection circuit element may be mounted on the second substrate 60. If desired, the battery protection circuit package 300b according to an embodiment of the present invention may further include an encapsulant 250. The encapsulant 250 may seal at least one of the NFC antenna structure 1000 and the battery protection circuit element. For example, the encapsulant 250 may seal the NFC antenna structure 1000 and the battery protection circuit element integrally. As another example, the encapsulant 250 may be spaced apart from each other and may seal the NFC antenna structure 1000 and the battery protection circuit element, respectively.

Alternatively, a PTC structure 350 may be connected to one end of the battery protection circuit package 300b according to some embodiments of the present invention.

The PTC structure 350 includes a PTC device 310 and a metal layer 320 attached to a first surface of the PTC device 310. The PTC device 350 includes an upper surface and a lower surface of the PTC device 310, And a conductive connecting member 340 attached to a second surface that is a surface of the first conductive member 340. [ The metal layer 320 is bonded to one of the leads for the first internal connection terminal B + and the second internal connection terminal lead B-. The connection member 340 is electrically connected to the electrode terminal of the battery bare cell Can be bonded. For example, the metal layer 320, the connecting member 340, and / or the lead frame 50 may be made of nickel, copper, nickel plated copper or other metal. The metal layer 320 is electrically connected to one of the leads for the first internal connection terminal B + and the second internal connection terminal B- by laser welding, resistance welding, soldering, and a conductive adhesive For example, conductive epoxy), and conductive tape.

The PTC (Positive Temperature Coefficient) element 310 can be formed, for example, by dispersing conductive particles in a crystalline polymer. Therefore, the PTC element 310 becomes a passage through which the current flows between the metal layer 320 and the conductive connecting member 340 at a temperature lower than the set temperature. However, when the temperature exceeds the set temperature due to the occurrence of the overcurrent, the crystalline polymer swells and the resistance between the conductive particles dispersed in the crystalline polymer is separated and the resistance is rapidly increased. Accordingly, the flow of the current between the metal layer 320 and the conductive connecting member 340 is cut off or the flow of the current is reduced. Since the flow of the current can be cut off by the PTC device 310, the PTC device 310 serves as a safety device for preventing the battery from rupturing. When the temperature is lower than the set temperature again, the PTC element 310 shrinks the crystalline polymer and restores the connection between the conductive particles, so that the current flows smoothly.

The lead frame 50 constituting the battery protection circuit package 300b is electrically connected to the electrode terminal of the battery bare cell via the PTC structure. For example, the lead 50-6 for the second internal connection terminal of the lead frame 50 may be electrically connected to the negative terminal 410 of the battery bare cell via the PTC structure 350. That is, the lead 50-6 for the second internal connection terminal of the lead frame 50 is connected to the metal layer 320 and is connected to the negative terminal of the battery bare cell via the conductive connecting member 340 via the PTC element 310. [ (Not shown). In this case, the metal layer 320 is defined within the upper surface on one side of the PTC device 310, and the connecting member 340 is extended from the other side of the PTC device 310 to the negative terminal 410 of the battery bare cell. Lt; / RTI > The connection member 340 may be formed by any one method selected from the group consisting of laser welding, resistance welding, soldering and conductive adhesive (for example, conductive epoxy) and conductive tape to the negative electrode terminal 410 of the battery bare cell. . ≪ / RTI >

Referring to FIG. 7, a battery protection circuit package 300c according to a modified embodiment of the present invention is a package that can be electrically connected to the electrode terminals 410 and 430 of the battery bare cell 400 shown in FIG. 5 A substrate 60; An NFC antenna structure 1000 mounted on a substrate 60; And a battery protection circuit element. The battery protection circuit element is disposed on a substrate 60 and includes a protection IC 120, a field effect transistor 110, and at least one passive element 130. Here, the substrate 60 is a printed circuit board, and the NFC antenna structure 1000 and the battery protection circuit element may be mounted on the printed circuit board. Both ends of the substrate 60, which is a printed circuit board, may be bonded to a lead 55 that can be electrically connected to the battery bare cell.

Meanwhile, in the battery protection circuit package according to another embodiment of the present invention, the NFC antenna structure 1000 and the substrate on which the battery protection circuit element can be mounted are formed of a lead frame composed of a plurality of leads spaced from each other . That is, the substrate constituting the package 300b of the battery protection circuit shown in Fig. 6 may be formed only of the lead frame 50 without the printed circuit board 60. [

In this case, the battery protection circuit elements 110, 120, and 130 and the NFC antenna structure 1000 may be mounted using surface mounting technology on at least a portion of the surface of the lead frame 50. [ Further, the protection ICs 120, the field effect transistors 110, and the plurality of leads 50-2, 50-3, 50-4, and 50-5 are electrically connected to any two selected from the group consisting of the protection ICs 120, By further including the connecting member, the battery protection circuit can be configured without using a separate printed circuit board. The electrical connecting member may include a bonding wire or a bonding ribbon.

It is an important advantage that the process of designing and manufacturing the lead frame 50 for constituting the battery protection circuit can be simplified because an electrical connecting member such as a bonding wire or a bonding ribbon is disposed on the lead frame 50 . If the electrical connecting member is not incorporated in the battery protection circuit in the modified embodiment of the present invention, the configuration of the plurality of leads constituting the lead frame 50 becomes very complicated, It may not be easy to effectively provide.

The NFC antenna structure 1000, the protection IC 120, and / or the field effect transistor 110 are formed on the lead frame 50 in the modified embodiment of the present invention, A chip mounted on at least a part of the surface of the lead frame 50 by a surface mounting technology rather than being inserted and fixed in the form of a semiconductor package, And can be mounted and fixed in the form of a die (chip die). Here, a chip die is a chip die, which is formed by performing a sowing process on a wafer on which a plurality of array structures (for example, a protection IC and a field effect transistor) are formed, ≪ / RTI > That is, when the NFC antenna structure 1000, the protection IC 120, and / or the field effect transistor 110 are mounted on the lead frame 50 without being sealed with a separate encapsulation material, Since the NFC antenna structure 1000, the protection IC 120 and / or the field effect transistor 110 are sealed by the encapsulating material 250 of the encapsulating material 250, Can be performed only once. On the other hand, when the passive element 130, the antenna structure 140, the protection IC 120, and / or the field effect transistor 110 are separately inserted and fixed or mounted on a printed circuit board (PCB) A single molding process is required first, and another molding process is further required for each mounted component after fixing or mounting on a printed circuit board, so that the manufacturing process may be complicated and the manufacturing cost may be increased.

The length of the lead frame 50 in the battery protection circuit package having the structure as described above is set such that the lead frame 50 contacts the center of the upper surface of the battery bare cell 400 (for example, As shown in Fig. Further, the battery protection circuit package to which the PTC structure 350 is coupled may be configured to be disposed on one side with respect to the center of the upper surface of the battery bare cell 400 (e.g., the negative terminal 410). For example, the length of the battery protection circuit package coupled with the PTC structure 350 may be approximately half (L / 2) of the overall length L of the cap plate 430.

Hereinafter, the configuration of the NFC antenna structure 1000 will be described in detail. According to the technical idea of the present invention, the NFC antenna structure comprises at least one lead frame made up of a plurality of leads spaced apart from each other; And an encapsulant that seals at least a portion of the lead frame, wherein at least a portion of the plurality of leads form at least a portion of an antenna loop. The antenna loop referred to in the present specification includes a loop-shaped antenna, which means a shape having at least a part of a circle, an ellipse, a polygon, or any irregular shape and surrounding at least a part of a magnetic field line.

 FIG. 9 is a perspective view illustrating an NFC antenna structure according to an embodiment of the present invention, FIG. 10 is a perspective view illustrating a plurality of lead frames constituting an NFC antenna structure according to an embodiment of the present invention, FIG. 12 is a view illustrating a path through which current flows between NFC connection terminals of an NFC antenna structure according to an embodiment of the present invention. FIG. 12 is a plan view illustrating respective lead frames constituting the NFC antenna structure according to an embodiment of the present invention. FIG.

9 to 12, an NFC antenna structure 1000 according to an embodiment of the present invention includes a plurality of lead frames 1100 having a laminated structure. For example, a plurality of lead frames 1100 having a laminated structure include a first lead frame 1110_L1, a second lead frame 1110_L2, a third lead frame 1110_L3, and a fourth lead frame 1110_L4 . The first lead frame 1110_L1, the second lead frame 1110_L2, the third lead frame 1110_L3, and the fourth lead frame 1110_L4 are formed in order to prevent an electrical short between the plurality of lead frames 1100 having a laminated structure. May be filled by the encapsulant 1500. A ferrite sheet may be interposed between the NFC antenna structure 1000 and the substrate on which the NFC antenna structure 1000 is mounted.

A first antenna loop formed in the first lead frame 1110_L1, a second antenna loop formed in the second lead frame 1110_L2, a third antenna loop formed in the third lead frame 1110_L3, And the fourth antenna loop formed in the second antenna 1110_L4 may be formed as a single integrated lead.

Referring to region A, one end of the first antenna loop formed in the first lead frame 1110_L1 is connected to one end of the second antenna loop formed in the second lead frame 1110_L2, and the second lead frame 1110_L2 The other end of the second antenna loop formed in the third lead frame 1110_L2 is connected to one end of the third antenna loop formed in the third lead frame 1110_L3 and the other end of the third antenna loop formed in the third lead frame 1110_L3, Is connected to one end of a fourth antenna loop formed in the fourth lead frame 1110_L4.

For this connection, a part of the plurality of lead frames 1100 arranged in the vertically spaced relation to each other may form a step to match the heights in the A region, B region and C region. For example, at least one of the one end of the first antenna loop and the one end of the second antenna loop may be formed in a region A, the other end of the second antenna loop in the region B, And at least one of the other end of the third antenna loop and the end of the fourth antenna loop in the C region may be formed as a step.

The other end of the antenna loop formed in the uppermost one of the plurality of lead frames 1100 having a laminated structure is connected to an NFC connection (not shown) exposed by the encapsulant 1500 so as to be electrically connected to the NFC matching device Terminals (PD1 and PD2 in Fig. 1A). For example, the other end of the first antenna loop formed in the first lead frame 1110_L1 constitutes a first NFC connection terminal PD1, and the other end of the fourth antenna loop formed in the fourth lead frame 1110_L4 constitutes a second NFC connection The terminal PD2 can be constituted.

11 and 12 are the current paths flowing along the first antenna loop formed in the first lead frame 1110_L1 and the dotted arrows indicate the second antenna loop formed in the second lead frame 1110_L2 Arrows of the single lead line are current paths flowing along the third antenna loop formed in the third lead frame 1110_L3 and arrows of the double dotted line are current paths flowing in the fourth antenna loop formed in the fourth lead frame 1110_L4 It is the current path that flows along.

The first antenna loop, the second antenna loop, the third antenna loop, and the fourth antenna loop have a laminated structure by the plurality of lead frames 1100 having a laminated structure. In order to reduce interference caused by other patterns in the magnetic induction process, these antenna loops having a stacked structure may be constructed and arranged such that antenna loops have different sizes so that they do not overlap up and down stacked. For example, the size of the first antenna loop is the largest, the size of the second antenna loop is the next largest, and the size of the fourth antenna loop is the smallest.

The direction of the magnetic field induced in the plurality of lead frames 1100 having the laminated structure shown in the figure may be, for example, parallel to the z-axis direction. However, the technical idea of the present invention is not limited to the direction of this exemplary magnetic field. For example, depending on the orientation of the NFC antenna structure 1000 mounted on the substrate, the direction of the induced magnetic field may be parallel to the x axis direction or the y axis direction.

FIG. 13 is a perspective view illustrating an NFC antenna structure according to another embodiment of the present invention, FIG. 14 is a perspective view illustrating a plurality of lead frames constituting an NFC antenna structure according to another embodiment of the present invention, FIG. 16 is a view showing a path through which current flows between NFC connecting terminals of an NFC antenna structure according to another embodiment of the present invention. FIG. 16 is a plan view illustrating each lead frame constituting the NFC antenna structure according to another embodiment of the present invention. FIG.

13 to 16, an NFC antenna structure 1000 according to another embodiment of the present invention includes a plurality of lead frames 1100 having a laminated structure. For example, a plurality of lead frames 1100 having a laminated structure may include a first lead frame 1120_L1 and a second lead frame 1120_L2. The space between the first lead frame 1120_L1 and the second lead frame 1120_L2 is filled by the sealing material 1500 in order to prevent an electrical short between the plurality of lead frames 1100 having a laminated structure . A ferrite sheet may be interposed between the NFC antenna structure 1000 and the substrate on which the NFC antenna structure 1000 is mounted.

A plurality of spaced apart leads constituting the first lead frame 1120_L1 may be connected by the electrical connecting member 1400 and a plurality of spaced apart leads constituting the second lead frame 1120_L2 may be connected by the electrical connecting member 1400. [ Lt; RTI ID = 0.0 > 1400 < / RTI >

According to the NFC antenna structure 1000 according to another embodiment of the present invention, the first antenna loop formed in the first lead frame 1120_L1 and the third antenna loop formed in the second lead frame 1120_L2 are spaced apart from each other And the fourth antenna loop formed by the second antenna loop formed by the first lead frame 1120_L1 and the second antenna frame formed by the second lead frame 1120_L2 may be integrally formed It can be made of one lead.

Referring to the D region, the other end of the first antenna loop formed in the first lead frame 1120_L1 is connected to one end of the third antenna loop formed in the second lead frame 1120_L2. When referring to the E region, The other end of the third antenna loop formed in the frame 1120_L2 is connected to one end of the second antenna loop formed in the first lead frame 1120_L1 and the second antenna loop formed in the first lead frame 1120_L1, The other end of the two antenna loop is connected to one end of the fourth antenna loop formed in the second lead frame 1120_L2.

For this connection, a part of the plurality of lead frames 1100 which are stacked and arranged so as to be spaced apart from each other in the up-and-down direction may form a step to match the heights in the D region, E region and F region. For example, at least one of the one end of the first antenna loop and the other end of the third antenna loop may be formed in the D region, and the other end of the third antenna loop and the one end And at least one of the other end of the second antenna loop and the end of the fourth antenna loop in the F region may have a stepped portion.

The end portions of the antenna loops formed respectively in the uppermost lead frame of the plurality of lead frames 1100 having the laminated structure are connected to the NFC connection exposed by the encapsulant 1500 so as to be electrically connected to the NFC matching device 145 Terminals (PD1 and PD2 in Fig. 1A). For example, one end of the first antenna loop formed in the first lead frame 1120_L1 constitutes a first NFC connection terminal PD1, and the other end of the fourth antenna loop formed in the second lead frame 1120_L2 constitutes the second The NFC connection terminal PD2 can be configured.

15 and 16 is a current path flowing along the first antenna loop formed in the first lead frame 1120_L1 and an arrow with a dotted line is a current path through the third antenna formed in the second lead frame 1120_L2 The arrow of the one-dotted chain line is a current path that flows along the second antenna loop formed in the first lead frame 1120_L1, and the arrow of the double dotted line in the second lead frame 1120_L2 is the current path that flows along the loop, 4 is the current path through the antenna loop.

The first antenna loop, the third antenna loop, the second antenna loop, and the fourth antenna loop sequentially have a laminated structure by a plurality of lead frames 1100 having a laminated structure. In order to reduce interference caused by other patterns in the magnetic induction process, these antenna loops having a stacked structure may be constructed and arranged such that antenna loops have different sizes so that they do not overlap up and down stacked. For example, the size of the first antenna loop is the largest, the size of the third antenna loop is the next largest, and the size of the fourth antenna loop is the smallest.

The direction of the magnetic field induced in the plurality of lead frames 1100 having the laminated structure shown in the figure may be, for example, parallel to the z-axis direction. However, the technical idea of the present invention is not limited to the direction of this exemplary magnetic field. For example, depending on the orientation of the NFC antenna structure 1000 mounted on the substrate, the direction of the induced magnetic field may be parallel to the x axis direction or the y axis direction.

10 and FIG. 13, in forming four stacked antenna loops, the NFC antenna structure 1000 shown in FIG. 10 is implemented as a lead frame composed of four layers in total, and the NFC structure shown in FIG. The antenna structure 1000 is implemented as a lead frame composed of two layers in total.

The NFC antenna structure 1000 shown in FIG. 10 has an advantage that the total height H 1 is relatively high while the pattern and stacking structure of each lead frame is relatively simple. On the other hand, the NFC antenna structure 1000 shown in FIG. 13 has an advantage that the overall height H2 is relatively low, while the pattern and lamination structure of each lead frame is relatively complicated.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

10: Battery protection circuit
300a, 300b, 300c: battery protection circuit package
400: battery bare cell
410: negative terminal
430: cap plate
700a, 700b: battery pack
NFC1: NFC external connection terminal
PD1, PD2: NFC connection terminal
1000: NFC antenna structure
1100: a plurality of lead frames
1400: electrical connecting member
1500: Encapsulant

Claims (11)

At least one lead frame made up of a plurality of leads separated from each other; And
And an encapsulating material sealing at least a part of the lead frame,
At least some of the plurality of leads forming at least a portion of an antenna loop,
NFC antenna structure. The method according to claim 1,
Wherein the antenna loop comprises one lead integrally formed. The method according to claim 1,
And an electrical connection member for connecting the plurality of spaced leads,
Wherein the antenna loop comprises a plurality of spaced leads and the electrical connecting member. The method according to claim 1,
Wherein the at least one lead frame includes a plurality of lead frames having a laminated structure,
Wherein a space between the plurality of lead frames is filled with the sealing material to prevent an electrical short between the plurality of lead frames,
NFC antenna structure. 5. The method of claim 4,
Wherein the plurality of lead frames include a first lead frame and a second lead frame disposed in a layer immediately adjacent to the first lead frame,
One end of the antenna loop formed on the first lead frame is connected to one end of the antenna loop formed on the first lead frame and one end of the antenna loop formed on the second lead frame is connected to one end of the antenna loop formed on the second lead frame, At least one of which has a stepped portion,
NFC antenna structure. 6. The method of claim 5,
And the other end of the antenna loop formed respectively in the uppermost lead frame of the plurality of lead frames constitutes an NFC connection terminal exposed by the sealing material so as to be electrically connected to the NFC matching device. 5. The method of claim 4,
The antenna loop also has a laminated structure by a plurality of lead frames having the laminated structure,
The antenna loops having a laminated structure are configured such that the sizes of the antenna loops are different from each other so that the antenna loops do not overlap with each other in the stacked up and down directions.
NFC antenna structure. A package capable of being electrically connected to an electrode terminal of a battery bare cell,
Board;
The NFC antenna structure according to any one of claims 1 to 7, mounted on the substrate; And
A battery protection circuit element mounted on the substrate, the protection circuit element comprising a protection IC, a field effect transistor (FET) and at least one passive element;
The battery protection circuit package comprising: 9. The method of claim 8,
The substrate includes a lead for a first internal connection terminal and a lead for a second internal connection terminal which are respectively disposed at both edge portions and are electrically connected to the electrode terminals of the battery bare cell; And a lead for an external connection terminal, which is disposed between the lead for the first internal connection terminal and the lead for the second internal connection terminal and constitutes a plurality of external connection terminals,
Wherein one of the plurality of external connection terminals is an NFC external connection terminal,
And an electrical connecting member for electrically connecting any two selected from the group consisting of the NFC antenna structure, the protection IC, the field effect transistor, and the plurality of leads, A protection circuit,
Battery protection circuit package. 10. The method of claim 9,
At least one of the NFC antenna structure, the protection IC, and the field effect transistor is not inserted and fixed in the form of a semiconductor package on the lead frame, but is mounted on at least a part of the surface of the lead frame , The battery protection circuit package being mounted and fixed in the form of a chip die that is not sealed with a separate encapsulant. 9. The method of claim 8,
Wherein the substrate comprises a printed circuit board.

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