KR101517543B1 - Holder to be equipped with battery protection circuits module package, method of fabricating the same, and method of fabricating battery pack using the same - Google Patents

Abstract

The present invention relates to a holder capable of mounting a battery protection circuit module package configured to easily miniaturize and integrate a battery pack, a method of manufacturing the holder, and a method of manufacturing a battery pack using the holder. A body portion made of resin, which can support the battery protection circuit module package on the upper surface; And a fixing plate having one end embedded and fixed by the body and the other end being protruded and extended from the body so as to be fixed to the upper surface of the battery pack, Is provided.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a holder for mounting a battery protection circuit module package, a method for manufacturing the holder, and a method for manufacturing a battery pack using the holder pack using the same}

The present invention relates to a holder capable of mounting a battery protection circuit module package, a method of manufacturing the holder, and a method of manufacturing a battery pack using the holder. More specifically, A method of manufacturing the holder, and a method of manufacturing the battery pack using the holder.

Generally, batteries are used in mobile terminals such as mobile phones and PDAs. Lithium-ion batteries are the most widely used batteries in portable handsets, and they have overcharging and over-currents, and when the temperature rises due to the heat generation, the performance deteriorates as well as the risk of explosion. Therefore, a normal battery may include a protection circuit device that detects overcharge, over-discharge, and over-current and blocks battery operation. Such a conventional protection circuit device is generally formed by bonding a protection IC, a field effect transistor, a resistor, and a capacitor to a printed circuit board (PCB) by soldering. However, the conventional protection circuit device has a problem that the space occupied by the printed circuit board or the like is relatively large, which limits the miniaturization. In addition, the process of electrically connecting the protection circuit device to the external connection terminal or the internal connection terminals through a separate wiring, wire bonding, or exposed terminals of the printed circuit board is complicated and easy .

Disclosure of Invention Technical Problem [8] Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and an object of the present invention is to provide a holder capable of mounting a battery protection circuit module package configured to easily miniaturize and integrate a battery pack, And a method of manufacturing a battery pack using the same. However, these problems are exemplary and do not limit the scope of the present invention.

There is provided a holder for mounting a battery protection circuit module package according to an aspect of the present invention. The holder capable of mounting the battery protection circuit module package can support the battery protection circuit module package on the upper surface of the battery core pack. And a fixing plate having one end embedded and fixed by the body and the other end being protruded and extended from the body so as to be fixed to the upper surface of the battery pack.

In the holder capable of mounting the battery protection circuit module package, the fixing plate is disposed in the injection mold, and the molten resin is injected to insert injection molding the body part, whereby one end of the fixing plate is inserted into the body part And can be embedded and fixed.

In the holder capable of mounting the battery protection circuit module package, the fixing plate may be bent in a gull-form form.

In a holder capable of mounting the battery protection circuit module package, the battery protection circuit module package includes a lead frame composed of a plurality of spaced leads, a protection circuit component on the lead frame, And may include an encapsulant.

Wherein the lead frame is disposed at both edge portions of the holder and is exposed by the sealing material and electrically connected to the electrode portion of the battery core pack, A lead for an internal connection terminal and a lead for a second internal connection terminal; A lead for an external connection terminal, which is disposed between the lead for the first internal connection terminal and the lead for the second internal connection terminal and constitutes a plurality of external connection terminals; And a device mounting lead, which is disposed between the lead for the first internal connection terminal and the lead for the second internal connection terminal, and on which the protection circuit component is mounted.

 Wherein the holder for mounting the battery protection circuit module package further includes at least one through hole formed in the body portion, wherein one of the lead for the first internal connection terminal and the lead for the second internal connection terminal And may be electrically connected to the electrode portion of the battery core pack through the through hole.

Wherein the protection circuit component comprises a protection IC, a field effect transistor and at least one passive element, wherein the passive element comprises at least one of a plurality of spaced apart leads Wherein the battery protection circuit module package further includes an electrical connection member electrically connecting any two of the protection IC, the field effect transistor, and the plurality of leads, A battery protection circuit can be constructed without using a printed circuit board. The electrical connecting member may include a bonding wire or a bonding ribbon.

In the holder in which the battery protection circuit module package can be mounted, the protection IC and the field effect transistor are not inserted and fixed in the form of a semiconductor package on the lead frame, but are mounted on the surface of the lead frame And may be mounted and fixed on at least a part of the semiconductor chip in the form of a chip die not sealed with a separate sealing material.

There is provided a method of manufacturing a holder capable of mounting a battery protection circuit module package according to another aspect of the present invention. A method of manufacturing a holder capable of mounting the battery protection circuit module package includes disposing a fixing plate made of metal inside an injection mold; And a body portion capable of supporting a battery protection circuit module package is formed by inserting a resin molten material into the injection mold having the fixing plate and inserting injection molding to fix the one end of the fixing plate, ; ≪ / RTI >

A method of manufacturing a battery pack according to another aspect of the present invention is provided. The method of manufacturing the battery pack includes the steps of: providing a holder capable of mounting the battery protection circuit module package; Fixing the holder to the battery core pack by bonding the fixing plate to the upper surface of the battery core pack; And mounting the battery protection circuit module package on the holder.

In the method of manufacturing the battery pack, the bonding between the upper surface of the battery core pack and the fixing plate may be performed using at least one selected from the group consisting of laser welding, resistance welding, soldering, conductive adhesive, .

According to some embodiments of the present invention as described above, a holder capable of mounting a battery protection circuit module package configured to easily miniaturize and integrate a battery pack, a method of manufacturing the holder, and a battery using the holder A method of manufacturing a pack can be provided. Furthermore, according to some embodiments of the present invention as described above, the bonding force between the components can be improved and the quality of the battery pack can be improved. Of course, the scope of the present invention is not limited by these effects.

1 is a perspective view illustrating a battery pack according to some embodiments of the present invention.
2 is an exploded perspective view illustrating a battery pack according to some embodiments of the present invention.
FIG. 3 is a flowchart illustrating a method of manufacturing a holder capable of mounting a battery protection circuit module package according to some embodiments of the present invention, and a method of manufacturing a battery pack using the same.
4 is a conceptual diagram illustrating a configuration in which a fixing plate is disposed in an injection mold in a method of manufacturing a holder capable of mounting a battery protection circuit module package according to some embodiments of the present invention.
5 is a diagram illustrating a holder capable of mounting a battery protection circuit module package according to some embodiments of the present invention.
6 is a perspective view illustrating a configuration in which a holder capable of mounting a battery protection circuit module package according to some embodiments of the present invention is bonded to a battery core pack.
7 is a circuit diagram of a battery protection circuit to be implemented by a battery protection circuit module package according to some embodiments of the present invention.
8 is a diagram illustrating an arrangement structure of a stacked chip constituting a part of a battery protection circuit module package according to some embodiments of the present invention.
9 is a circuit diagram of a modified battery protection circuit that a battery protection circuit module package according to some embodiments of the present invention is intended to implement.
10 is a plan view illustrating a structure of a basic package that forms part of a battery protection circuit module package according to some embodiments of the present invention.
11 is a diagram illustrating a battery protection circuit module package in accordance with some embodiments of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Some embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art, and the following embodiments may be modified in various other forms, The present invention is not limited to the following examples. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art. In the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of explanation.

It is to be understood that throughout the specification, when an element such as a film, region or substrate is referred to as being "on", "connected to", "laminated" or "coupled to" another element, It is to be understood that elements may be directly "on", "connected", "laminated" or "coupled" to another element, or there may be other elements intervening therebetween. On the other hand, when one element is referred to as being "directly on", "directly connected", or "directly coupled" to another element, it is interpreted that there are no other components intervening therebetween do. Like numbers refer to like elements. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various elements, components, regions, layers and / or portions, these members, components, regions, layers and / It is obvious that no. These terms are only used to distinguish one member, component, region, layer or section from another region, layer or section. Thus, a first member, component, region, layer or section described below may refer to a second member, component, region, layer or section without departing from the teachings of the present invention.

Also, relative terms such as "top" or "above" and "under" or "below" can be used herein to describe the relationship of certain elements to other elements as illustrated in the Figures. Relative terms are intended to include different orientations of the device in addition to those depicted in the Figures. For example, in the figures the elements are turned over so that the elements depicted as being on the top surface of the other elements are oriented on the bottom surface of the other elements. Thus, the example "top" may include both "under" and "top" directions depending on the particular orientation of the figure. If the elements are oriented in different directions (rotated 90 degrees with respect to the other direction), the relative descriptions used herein can be interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups.

Hereinafter, some embodiments of the present invention will be described with reference to the drawings schematically illustrating ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention should not be construed as limited to the particular shapes of the regions shown herein, but should include, for example, changes in shape resulting from manufacturing.

In some embodiments of the present invention, the lead frame may be structured such that the lead terminals are patterned on the metal frame, and the structure and the thickness of the printed circuit board on which the metal wiring layer is formed on the insulating core.

1 and 2 are a perspective view and an exploded perspective view illustrating a battery pack according to some embodiments of the present invention.

1 and 2, a battery pack 800 according to some embodiments of the present invention includes a battery core pack 600, a holder 400, a battery protection circuit module package 300, and an upper case 700 ). Furthermore, the battery pack 800 may further include a lower case (not shown) coupled to the lower surface 650 of the battery core pack 600.

The battery core pack 600 may include one or at least two or more unit cells capable of charging and discharging. Here, the unit cell may be a secondary battery, for example, a lithium secondary battery. The unit cell may be a polymer type battery. The plurality of unit cells may be connected to each other in series or in parallel to constitute the core pack 600. Of course, the number of the unit cells and the connection method of the core pack 600 are not limited to the above, and may be variously configured. The core pack 600 may supply power to various electronic devices including mobile phones such as a mobile phone, a smart phone, a PDA, a smart pad, and a tablet computer.

The battery core pack 600 can be understood as a battery bare cell including an electrode assembly in which a positive electrode plate and a negative electrode plate are wound with a separator interposed therebetween, and a cap assembly sealing the electrode assembly while exposing the pole terminal and the negative electrode terminal.

The electrode assembly includes, for example, a positive electrode plate formed by applying a positive electrode active material to a positive electrode collector, a negative electrode plate formed by applying a negative electrode active material to a negative electrode collector, and a negative electrode plate interposed between the positive electrode plate and the negative electrode plate, And a separator for allowing movement of ions. The positive electrode tab attached to the positive electrode plate and the negative electrode tab attached to the negative electrode plate are drawn out from the electrode assembly.

The cap assembly includes an anode terminal 610, a gasket 620, a cap plate 630, and the like. The cap plate 630 may serve as a positive electrode terminal. The cathode terminal 610 may be referred to as a cathode cell or an electrode cell. The gasket 620 may be formed of an insulating material to insulate the cathode terminal 610 from the cap plate 630. Therefore, the electrode portion of the battery core pack 600 may include the negative electrode terminal 610 and the cap plate 630. That is, the electrode portion of the battery core pack 600 includes a plate 630 of a first polarity (for example, an anode) and an electrode cell of a second polarity (for example, a cathode) 610).

The battery protection circuit module package 300 is mounted on the upper surface 640 of the battery core pack 600 via the holder 400. The battery protection circuit module package 300 includes a lead frame 50 composed of a plurality of leads separated from each other, a protection circuit component on the lead frame 50, and a sealing material 250 sealing the protection circuit component can do. The encapsulant 250 exposes a part of the lead frame 50. For example, the encapsulant 250 may include a lead (B +) for a first internal connecting terminal disposed at both ends of the lead frame 50 and a lead P-, and CF-) disposed between the lead (B +) for the first internal connection terminal and the lead (B-) for the second internal connection terminal and exposing the plurality of external connection terminals (P + It is possible to expose the lead for the external connection terminal.

The holder 400 may include a body 420 formed of resin and may optionally further include at least one through hole 440 formed in the body 420. The holder 400 serves as a guide for accurately mounting the battery protection circuit module package 300 on the upper surface 640 of the battery core pack 600 and further includes a battery protection circuit module package 300 And can be supported firmly on the upper surface 640 of the battery core pack 600. The shape, shape or number of the body part 420 or the through hole 440 constituting the holder 400 can be appropriately changed and designed so as to effectively perform this role. The holder 400 includes a fixed plate 490, which is made of metal, for example nickel. One end of the fixing plate 490 is embedded and fixed by the body portion 420 and the other end of the fixing plate 490 is protruded and extended from the body portion 420 to be connected to the upper surface 640 of the battery core pack 600 So that they can be bonded and fixed.

A portion of the battery protection circuit module package 300 may be electrically connected to the electrode portion of the battery core pack 600 through the through hole 440 of the holder 400. [ The second internal connection terminal lead B- constituting the lead frame 50 of the battery protection circuit module package 300 is connected to the battery core pack 600 through the through hole 440 of the holder 400. [ The electrode cell 610 may be electrically connected.

The upper case 700 is coupled to the battery core pack 600 via the battery protection circuit module package 300 and the holder 400. The upper case 700 is made of resin and a through hole 550 may be formed in a corresponding portion of the lead frame 50 so that the external connection terminals P +, CF, and P- may be exposed.

FIG. 3 is a flowchart illustrating a method of manufacturing a holder capable of mounting a battery protection circuit module package according to some embodiments of the present invention, and a method of manufacturing a battery pack using the same. FIG. 4 is a conceptual view illustrating a configuration in which a fixing plate according to some embodiments of the present invention is disposed in an injection mold, and FIG. 5 is a perspective view of a holder capable of mounting a battery protection circuit module package according to some embodiments of the present invention. FIG.

3 to 5, a method of manufacturing a holder capable of mounting a battery protection circuit module package according to some embodiments of the present invention includes the steps of attaching a fixing plate 490 made of metal to an injection mold 510 (S100); And one end of the fixing plate 490 is buried and fixed by inserting the molten resin into the injection mold 510 in which the fixing plate 490 is disposed and by insert injection molding to support the battery protection circuit module package (S200) of forming the body part 420, which can be formed on the body part.

4, an injection mold 510 includes an upper mold 511 and a lower mold 512 in a step S100 of disposing a fixing plate 490 made of metal inside the injection mold 510 And a molding space 534 is formed between the upper mold 511 and the lower mold 512 for injection molding. The upper mold 511 may have an injection port 532 connected to the molding space 534 to inject the melted resin. The shape of the molding space 534 shown in FIG. 4 is schematically illustrated and can be appropriately designed and modified according to the shape of the holder 400 to be implemented. 4 and 5, the fixing plate 490 is disposed inside the injection mold 510, the melt of the resin is injected, and the body part 420 is insert injection molded, And is once embedded and fixed by the body portion 420. If necessary, the fixing plate 490 may have a bent shape in the form of a gull-form.

The fixing plate 490 is provided only on one side of the body portion 420 for convenience sake, but the fixing plate 490 may be provided on the other side of the body portion 420, if necessary. For example, one fixed plate 490 may be provided on each of four sides of the body portion 420 to implement a holder 400 including a total of four fixed plates 490.

6 is a perspective view illustrating a configuration in which a holder capable of mounting a battery protection circuit module package according to some embodiments of the present invention is bonded to a battery core pack.

3 and 6, a method of manufacturing a battery pack according to some embodiments of the present invention includes attaching the holder 400 to the upper surface 640 of the battery core pack 600 by attaching the fixing plate 490 to the upper surface 640 of the battery core pack 600, To the battery core pack 600 (S300); And mounting the battery protection circuit module package 300 on the holder 400 (S400).

The process of joining the fastening plate 490 to the upper surface 640 of the battery core pack 600 may be performed by any suitable method selected from the group consisting of, for example, laser welding, resistance welding, soldering, conductive adhesive, And may include at least any one of them. It is possible to prevent the body portion 420 of the holder 400 from being tilted on the upper surface 640 of the battery core pack 600 by bonding the fixing plate 490. [ That is, since the other end of the fixing plate 490 can be firmly fixed to the upper surface 640 of the battery core pack 600 by welding or the like, the holder 400 is prevented from being deformed on the upper surface of the battery core pack 600 The battery protection circuit module package 300 can be precisely aligned on the upper surface 640 of the battery core pack 600 in the process of mounting the battery protection circuit module package 300 on the holder 400, The effect of mounting can be expected.

Hereinafter, a battery protection circuit module package 300 to be supported by the holder 400 will be described.

7 is a circuit diagram of a battery protection circuit to be implemented by a battery protection circuit module package according to some embodiments of the present invention. As shown in FIG. 7, the battery protection circuit 10 according to some embodiments of the present invention includes first and second internal connection terminals B + and B- for connecting to a battery cell, And first to third external connection terminals P +, CF, and P- for connecting to an electronic device (e.g., a portable terminal or the like) operated by a battery power when discharging. Here, the first external connection terminal P + and the third external connection terminal P- of the first to third external connection terminals P +, CF, and P- are for power supply and the other is an external connection terminal The second external connection terminal CF divides the battery and charges the battery according to the battery. In addition, the second external connection terminal CF can be a thermistor which is a part for sensing the battery temperature during charging, and other functions are applied and utilized as a terminal.

The battery protection circuit 10 includes a dual field effect transistor chip 110, a protection IC 120, resistors R1, R2 and R3, a varistor V1 and capacitors C1 and C2. As shown in FIG. The dual field effect transistor chip 110 is composed of a first field effect transistor (FET1) and a second field effect transistor (FET2) having a drain common structure. The protection integrated circuit unit 120 is connected to the first internal connection terminal B + which is the positive terminal of the battery through the resistor R 1 and receives a voltage for applying a charging voltage or a discharging voltage through the first node n 1, (VDD terminal) for sensing the battery voltage, a reference terminal (VSS terminal) serving as a reference for the operation voltage inside the protection IC 120, a sensing terminal (V- terminal) for sensing charging / (DO terminal) for turning off the first field effect transistor FET1 in the previous state and a charge cutoff signal output terminal (C0 terminal) for turning off the second field effect transistor FET2 in the overcharge state .

At this time, the inside of the protection IC 120 includes a reference voltage setting unit, a comparison unit for comparing the reference voltage with the charge / discharge voltage, an overcurrent detection unit, and a charge / discharge detection unit. Here, the criterion of charging and discharging states can be changed to a specification (SPEC) required by the user, and the charging / discharging state is determined by recognizing the voltage difference of each terminal of the protection IC 120 according to the determined standard.

When the protection IC 120 reaches an over-discharge state at the time of discharging, the DO terminal becomes LOW to turn off the first field effect transistor FET1, and when the overcharge state is reached, the CO terminal becomes low, The field effect transistor FET2 is turned off and the second field effect transistor FET2 is turned off at the time of charging when the overcurrent flows and the first field effect transistor FET1 at the time of discharging.

The resistor R1 and the capacitor C1 serve to stabilize the variation of the power supply of the protection IC 120. [ The resistor R1 is connected between the first node n1 which is the supply node of the battery power supply V1 and the VDD terminal of the protection IC 120 and the capacitor C1 is connected between the VDD terminal and the VSS terminal of the protection IC do. Here, the first node n1 is connected to the first internal connection terminal B + and the first external connection terminal P +. When the resistance R1 is increased, the detection voltage becomes higher due to the current penetrated into the protection IC 120 at the time of voltage detection. Therefore, the value of the resistor R1 is set to an appropriate value of 1 K or less. Also, for stable operation, the value of the capacitor C1 may have an appropriate value of 0.01 [mu] F or more, for example, 0.1 [mu] F.

And the resistors R1 and R2 become current limiting resistors when the high voltage charger or charger exceeding the absolute maximum rating of the protection IC 120 is connected upside down. The resistor R2 is connected between the V- terminal of the protection IC 120 and the second node n2 to which the source terminal S2 of the second field effect transistor FET2 is connected. Since the resistors R1 and R2 may cause power consumption, the sum of the resistance values of the resistors R1 and R2 is usually set to be larger than 1 K ?. If the resistance R2 is too large, the return may not occur after the overcharge cutoff, so that the value of the resistance R2 is set to a value of 10K or less. For example, the resistor R1 may have a value of 1 K ?, and the resistor R2 may have a value of 2.2 K ?.

The capacitor C2 is connected between the second node n2 (or the third external connection terminal P-) and the source terminal S1 (or the VSS terminal) of the first field effect transistor FET1 . The capacitor C2 does not significantly affect the characteristics of the battery protection circuit product, but is added for user's request or stability. The capacitor C2 is for stabilizing the system by improving the resistance to voltage fluctuation and external noise. For a stable operation, the value of the capacitor C2 may have a value of, for example, 0.1 [mu] F.

The resistor R3 and the varistor V1 are elements for ESD (Electrostatic Discharge) and surge protection and are connected in parallel to each other. The second external connection terminal CF and the second node n2 (Or the third external connection terminal P-). The resistance of the varistor (V1) is lowered when an overvoltage occurs. When the overvoltage is generated, the resistance of the varistor (V1) is lowered, thereby minimizing circuit damage due to overvoltage.

In some embodiments of the present invention, the battery protection circuit module 10 configured by packaging the battery protection circuit 10 of FIG. 7 including the external connection terminals P +, P-, and CF and the internal connection terminals B + and B- Package. Passive elements such as resistors R1, R2, R3, varistor V1, and capacitors C1, C2; A protection IC 120; And the dual field effect transistor chip 110 may be sealed and packaged with an encapsulating material M to realize a package of the battery protection circuit module.

The protection circuit according to some embodiments of the present invention described above is exemplary and the configuration, number, arrangement, etc. of the protection IC, the field effect transistor or the passive element can be appropriately modified in accordance with the additional function of the protection circuit.

8 is a diagram illustrating an arrangement structure of a stacked chip constituting a battery protection circuit module package according to some embodiments of the present invention.

8, the arrangement of the dual field effect transistor chip 110 and the protection IC 120 is such that the dual field effect transistor chip 110 and the protection IC 120 are stacked vertically or adjacent to each other . For example, the dual field effect transistor chip 110 may have a structure in which the protection IC 120 is stacked on the upper surface, or may be adjacent to the left or right side of the protection IC 120, .

The dual field effect transistor chip 110 includes a first field effect transistor and a second field effect transistor having a common drain structure, that is, two field effect transistors. The external terminal is connected to a first gate terminal And the second source terminal G2 and the second source terminal S2 of the second field effect transistor are provided on the upper surface of the dual field effect transistor chip 110, I have. In addition, a common drain terminal may be provided on the lower surface of the dual field effect transistor chip 110.

The protection ICs 120 are stacked on the upper surface of the dual field effect transistor chips 110. The protection IC 120 is stacked on a region (for example, a central portion) excluding the portion where the external terminals on the dual field effect transistor chip 110 are disposed. At this time, an insulating film for insulation may be disposed between the protection IC 120 and the dual field effect transistor chip 110, and the protection IC 120 and the dual field effect transistor chip 110 may be bonded with an adhesive of an insulating material . The size of the dual field effect transistor chip 110 is larger than that of the protection IC 120 so that the protection IC 120 is stacked on top of the dual field effect transistor chip 110.

After the protection IC 120 is stacked on the upper surface of the dual field effect transistor chip 110, the DO terminal DO of the protection IC 120 is electrically connected to the first gate terminal G1 via a wire or a wiring And the CO terminal (CO) of the protection IC 120 is electrically connected to the second gate terminal G2 through a wire or a wiring. The connection structure of the remaining terminals will be described later. The protection IC 120 and the dual field effect transistor chip 110 having the above-described laminated structure will be collectively referred to as a 'laminated chip 100a'.

In the battery protection circuit module package according to some embodiments of the present invention, the protection IC 120 having the laminated structure and the laminated chip 100a of the dual field effect transistor chip are introduced so that the area to be mounted on the lead frame The size of the battery can be reduced or the capacity of the battery can be increased.

9 is a circuit diagram of another battery protection circuit that a battery protection circuit module package according to some embodiments of the present invention is intended to implement. FIG. 9 is a circuit diagram of a battery protection circuit in a case where the first field effect transistor, the second field effect transistor, and the protection IC are integrally provided on one chip, and is an equivalent circuit diagram of FIG.

As shown in Fig. 9, when the circuit is constructed by implementing the flip chip 100b in which the protection IC 120 of Fig. 7 and the two FETs FET1 and FET2 of the common drain structure are integrated, It is possible to realize a simpler circuit while performing the same operation as described in FIGS. The flip chip 100b includes a first field effect transistor and a second field effect transistor having a common drain structure functioning as switching elements in an overdischarge state and an overcharge state, and a protection IC circuit for controlling overdischarge and overcharge operations . 7, the flip chip 100b is implemented by integrating the protection IC 120 and the portion 100a including the two field effect transistors FET1 and FET2 having the common drain structure into one chip into a single chip, The operation and circuit configuration of the chip 100b are the same as the operation and circuit configuration of the protection IC 120 of FIG. 7 and the portion 100a including the two field effect transistors FET1 and FET2 of the common drain structure.

Accordingly, the flip chip 100b has a voltage applying terminal VDD for applying a charging voltage and a discharging voltage to one surface, a sensing terminal V- for sensing a charging / discharging state, a source terminal of a first field effect transistor The first source terminal S1 and the second source terminal S2, which are the source terminals of the second field effect transistor, are exposed to external terminals for external connection. 7, the discharge cutoff signal output terminal DO and the charge cutoff signal output terminal CO of the protection IC 120 are embedded in the flip chip 100b, so that they are not exposed to the external terminal. The external terminals VDD, V-, S1, and S2 have a solder ball structure for external connection and bonding, and are coupled by a flip chip bonding method. The positions of the external terminals VDD, V-, S1, and S2 may be varied as needed, and the number of terminals may be increased or decreased variously in order to improve the electric conductivity or to efficiently arrange the terminals. For example, the external connection terminals for external connection and bonding of the flip chip 100b may have a three-row, three-column arrangement structure. One row includes a voltage application terminal VDD for applying a charging voltage and a discharge voltage, A test terminal TP for a test and a sensing terminal V- for sensing a charge and discharge state are arranged in three rows and two rows of the first source terminal S1 may be arranged in a three- The third row may have the second source terminals S2 arranged in a three-column structure.

Since the flip chip 100b is soldered and electrically connected to a lead or the like which requires electrical connection without requiring additional wire bonding, the electrical conductivity of the flip chip 100b can be improved compared to the wire bonding, the production cost can be reduced, and the process can be simplified. And it has the advantage of reducing the volume occupied.

In addition, in some modified embodiments of the present invention, a resistor R4 or a capacitor C4 is provided instead of the varistor V1 in a surge protection circuit configured for surge protection such as ESD (Electrostatic Discharge) . That is, the circuit for surge protection includes a configuration in which two resistors R3 and R4 are connected in parallel or a configuration in which one resistor R3 and one capacitor C4 are connected in parallel and one resistor R3 and one Of the varistors V1 of the first transistor Q1 are connected in parallel.

The present invention implements a package of the battery protection circuit module formed by packaging the battery protection circuit of FIG. 6 including the external connection terminals P +, P-, and CF and the internal connection terminals B + and B-. Passive elements such as resistors R1, R2, R3, R4, varistor V1, and capacitors C1, C2, C3; And the flip chip 100b are sealed with an encapsulating material M and packaged to realize a package of the battery protection circuit module.

FIG. 10 is a plan view illustrating a structure of a basic package that constitutes a part of a battery protection circuit module package according to some embodiments of the present invention, and FIG. 11 is a plan view of a battery protection circuit module package according to some embodiments of the present invention. These are drawings to illustrate.

10, the basic package 200a includes the lead frame 50 and the protection circuit components 100a, 130 mounted on the lead frame 50. As shown in FIG. The upper surface 50a of the lead frame 50 is a surface on which the protection circuit elements 100a and 130 are mounted and the lower surface of the lead frame 50 may be an opposite surface of the upper surface 50a. All or a portion of the lower surface of the lead frame 50 corresponding to the external connection terminal area A2 may be plated. The plating material may be at least one selected from gold, silver, nickel, tin and chromium. The lead frame 50 has a protection circuit region of the first internal connection terminal region A1, the external connection terminal region A2, the element region A3 and the chip region A4, and the second internal connection terminal region A5 And are sequentially arranged. The protection circuit region is disposed between the external connection terminal region A2 and the second internal connection terminal region A5. The arrangement order of the element region A3 and the chip region A4 may be variously changed.

The first internal connection terminal region A1 and the second external terminal region A5 are provided at both edge portions of the package module and are electrically connected to the electrode portion of the battery core pack 600, A lead (B +) for a first internal connection terminal functioning as a terminal and a lead (B-) for a second internal connection terminal serving as a second internal connection terminal are arranged, respectively. For example, the lead (B +) for the first internal connection terminal may be joined to the positive electrode tab of the battery cell, and the lead (B-) for the second internal connection terminal may be joined to the negative electrode tab of the battery cell , The kind of polarity to be bonded may be reversed.

The external connection terminal region A2 is connected to the first to third external connection terminal leads P +, P +, which are adjacent to the first internal connection terminal region A1 and are lead terminals for a plurality of external connection terminals functioning as a plurality of external connection terminals, CF, and P-) are sequentially arranged. The arrangement order of the first to third external connection terminal leads (P +, CF, P-) may be variously changed. Here, the first external connection terminal lead (P +) and the first internal connection terminal lead (B +) are connected to each other. That is, the first internal connection terminal lead B + may extend from the first external connection terminal lead P + or the first external connection terminal lead P + may extend from the first internal connection terminal lead B + As shown in FIG. Of course, the lead (B +) for the first internal connection terminal may be disposed apart from the lead (P +) for the first external connection terminal.

The element region A3 is for disposing a plurality of passive elements 130 (R1, R2, R3, C1, C2, C3, V1 in FIG. 1 or 3) constituting the battery protection circuit. And the first to sixth passive element leads L1, L2, L3, L4, L5, and L6 constituted of a plurality of conductive lines may be disposed. For example, the first to third passive element leads L1, L2, and L3 may have a sequential arrangement structure on the upper side of the element region A3, and the fourth to sixth passive element leads L4 , L5, and L6 may be disposed on the lower side of the element region A3. The first passive element lead L1 is arranged in a predetermined size in the element region A3 adjacent to the external connection terminal region A2 and the second passive element lead L2 is arranged in the element region A3 adjacent to the external connection terminal region A2 in the first passive element lead L1 As shown in FIG. The third passive element lead L3 may be disposed at a predetermined size adjacent to the second passive element lead L2 in the element region A3 adjacent to the chip area A4. The fourth passive element lead L4 is arranged in a predetermined size in the element region A3 adjacent to the external connection terminal region A2 and the fifth passive element lead L5 and the sixth passive element lead L6 May be disposed adjacent to the fourth passive element lead L1 in such a manner that the fifth passive element lead L5 surrounds the sixth passive element lead L6.

As described above, in the element region A3, the lead frame 50 may be formed of a plurality of leads spaced from each other, and the passive element 130 may electrically connect at least some of the plurality of spaced leads . For example, at least one of the passive elements R1, R2, R3, C1, C2, C3, and V1 may be disposed over a lead different from any one of the plurality of leads spaced apart from each other.

The chip area A4 is an area adjacent to the element area A3 and in which the protection IC 120 and the dual field effect transistor chip 110 constituting the battery protection circuit are disposed. For example, the chip area A4 ); Or a die pad DP for mounting the flip chip 100b. For example, the die pad DP may be electrically connected to the common drain terminal of the dual field effect transistor chip 110 constituting the multilayer chip 100a, and may be exposed as a result of packaging in a subsequent process, And at the same time, the heat radiation characteristics can be improved. Of course, in the chip area A4 of the modified embodiments of the present invention, the protection IC chip and the field effect transistor chip may be provided separately from each other.

The multilayer chip 100a is mounted on the die pad DP of the chip area A4 and the reference voltage terminal VSS of the protection IC 120 constituting the multilayer chip 100a is connected to the first Can be electrically connected to the source terminal of the field effect transistor (FET1) or the third passive element lead (L3) by wire bonding. The terminal VDD for sensing the voltage applied to the charge voltage and the discharge voltage in the protection IC 120 and the battery voltage is electrically connected to the second passive element lead L2 through the bonding wire 220 or the like The sensing terminal V- for sensing charge / discharge and overcurrent states in the protection IC 120 may be electrically connected to the sixth passive element lead L6 via the bonding wire 220. [ The source terminal S1 of the first field effect transistor FET1 is electrically connected to the third passive element lead L3 through the bonding wire 220 and the like and the source terminal S1 of the second field effect transistor FET2 S2 may be electrically connected to the fifth passive element lead L5 through a bonding wire 220 or the like. Next, the first passive element lead L1 and the first external connection terminal lead P + are electrically connected through the bonding wire 220, and the third passive element lead L3 and the second passive element lead The connection terminal lead B- can be electrically connected through the bonding wire 220 or the like. The fourth passive element lead L4 is electrically connected to the second external connection terminal lead CF through the bonding wire 220 and the fifth passive element lead L5 is electrically connected to the third external connection terminal lead L0, (L3) and the bonding wire (220). The first resistor R1 of the plurality of passive elements is disposed between the lead L1 for the first passive element and the lead L2 for the second passive element, The second passive element R2 may be disposed between the fifth passive element lead L5 and the sixth passive element lead L6. The third resistor R3 constituting the surge protection circuit among the plurality of passive elements is disposed between the fourth passive element lead L4 and the fifth passive element lead L5, The first capacitor C1 is disposed between the second passive element lead L2 and the third passive element lead L3 and the second one of the plurality of passive elements C2 is connected to the third passive element C2, And may be disposed between the lead L3 and the fifth passive element lead L5. The varistor V1 constituting the surge protection circuit among the plurality of passive elements is formed in parallel with the third resistor R3 so that the fourth passive element lead L4 and the fifth passive element lead L5.

The basic package 200a implementing the battery protection circuit having the above-described arrangement structure can be understood as a structure prior to forming the encapsulant 250, and then, through a process such as molding with the encapsulant 250 Thereby implementing the battery protection circuit module package 300 shown in FIG. That is, the protection circuit components 100a, 100b, and 130 are sealed in the basic package 200a shown in FIG. 10, and the lead (B +) for the first internal connection terminal and the second internal connection terminal An encapsulant 250 is formed to expose the lead (B-) for the battery protection circuit module package 300 so that the battery protection circuit module package 300 can be realized. The battery protection circuit module package 300 may be referred to as a protection circuits module package (PMP).

 The lead frame 50 may be composed of a plurality of leads spaced from each other. The passive element 130 may be arranged to connect at least some of the plurality of spaced leads. The laminated chip 100a or the flip chip 100b including the protection IC and the field effect transistor may be arranged to connect at least a part of the plurality of spaced apart leads. Furthermore, when the electrical connecting member 220 is formed of the protection IC, the field effect transistor (for example, the laminated chip 100a or the flip chip 100b including the protection IC and the field effect transistor) and the plurality of leads Any two selected from the group can be electrically connected. The electrical connection member 220 may include a bonding wire or a bonding ribbon. Due to such a configuration, the battery protection circuit module package according to some embodiments of the present invention can constitute a battery protection circuit without using a separate printed circuit board.

The battery protection circuit module package 300 according to some embodiments of the present invention has a lead frame 50 having a plurality of spaced mounting leads but may also include an electrical connecting member 220 such as a bonding wire or bonding ribbon Since the circuit is constructed by arranging the lead frame 50 on the lead frame 50, the process of designing and manufacturing the lead frame 50 for constituting the battery protection circuit can be simplified. In some embodiments of the present invention, if the electrical connection member 220 is not implemented in implementing the battery protection circuit component, the configuration of the plurality of leads constituting the lead frame 50 becomes very complicated, 50 may not be easy to provide effectively.

In addition, in the battery protection circuit module package 300 according to some embodiments of the present invention, the protection IC chip; A field effect transistor chip; Or the laminated chip 100a or the flip chip 100b including the protection IC and the field effect transistor are not inserted and fixed in the form of a semiconductor package on the lead frame 50 but are mounted on the surface mounting technology And may be mounted and fixed on at least a part of the surface of the lead frame 50 in the form of a chip die, which is sawed from a wafer that is not sealed with a separate encapsulant. Here, a chip die is a wafer on which a plurality of array structures (for example, a protection IC chip or a field effect transistor chip) are formed, Means an individual structure implemented. A protection IC chip on the lead frame 50; A field effect transistor chip; And a multilayer chip 100a or a flip chip 100b including a protection IC and a field effect transistor are mounted in a state in which they are not sealed with a separate encapsulation material, A protection IC chip by the encapsulant 250; A field effect transistor chip; Alternatively, since the laminated chip 100a or the flip chip 100b including the protection IC and the field effect transistor is sealed, in order to implement the battery protection circuit module package 300, the process of forming the sealing material is performed only once . On the other hand, the protection IC chip; A field effect transistor chip; Alternatively, when the multilayer chip 100a or the flip chip 100b including the protection IC and the field effect transistor is separately inserted into the printed circuit board (PCB) and fixed or mounted, a single molding process is performed for each component first Further, another molding process is further required for each mounted component after fixing or mounting on a printed circuit board, so that the manufacturing process is complicated and the manufacturing cost is increased.

The battery protection circuit module package 300 described above is manufactured separately from the holder 400 and the case where the battery protection circuit module package 300 is mounted on the holder 400 has been described.

However, in a modified embodiment of the present invention, a battery pack may be realized by bonding an assembly structure in which the battery protection circuit module package 300 and the holder 400 are combined to the battery core pack 600. [ Providing a base package comprising, for example, a leadframe consisting of a plurality of spaced leads and a protection circuit component on the leadframe; And a step of simultaneously forming an encapsulant and a holder by disposing the base package in a first injection mold and injecting a molten resin into the first injection mold and performing insert injection molding, An assembly structure in which the protection circuit module package 300 and the holder 400 are combined can be implemented. In an assembly structure in which a battery protection circuit module package 300 and a holder 400 are combined, the sealing material exposes a part of the lead frame to seal the protection circuit component, Circuit module package, and the holder can be coupled to the battery protection circuit module package by the insert injection molding. In this case, the step of forming the sealing material and the holder at the same time may further include disposing a fixing plate made of metal in the first injection mold, inserting the molten resin into the injection mold, And forming a holder having a body part for embedding and fixing the holder.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

50: Lead frame
200a: Basic Package
250: Encapsulant
300: Battery protection circuit module package
400: Holder
490: Fixing plate
600: Battery Core Pack
700: upper case
800: Battery pack

Claims (12)

A body portion made of a resin capable of supporting the battery protection circuit module package on the upper surface of the battery core pack; And
The battery pack comprising: a fixing plate having one end fixedly embedded in the body and the other end protruding from the body to be fixed to the upper surface of the battery pack;
Lt; / RTI >
Wherein the battery protection circuit module package comprises a lead frame composed of a plurality of leads spaced apart, a protection circuit component on the lead frame, and an encapsulating material sealing the protection circuit component, Can holders. The method according to claim 1,
The fixing plate is disposed inside the injection mold, and the molten resin is injected to insert injection molding the body part, thereby mounting the battery protection circuit module package, one end of the fixing plate being embedded and fixed by the body part Can holders. The method according to claim 1,
Wherein the fixing plate is folded in a Gull-Form form to mount a battery protection circuit module package. delete The method according to claim 1,
The lead frame includes:
A lead for a first internal connection terminal and a lead for a second internal connection terminal, which are respectively disposed at both edge portions and are exposed by the sealing material and can be electrically connected to the electrode portion of the battery core pack; A lead for an external connection terminal, which is disposed between the lead for the first internal connection terminal and the lead for the second internal connection terminal and constitutes a plurality of external connection terminals; And an element mounting lead which is disposed between the lead for the first internal connection terminal and the lead for the second internal connection terminal and on which the protection circuit element is mounted,
Holder for mounting battery protection circuit module package. 6. The method of claim 5,
And at least one through hole formed in the body portion,
Wherein one of the leads for the first internal connection terminal and the lead for the second internal connection terminal can be electrically connected to the electrode portion of the battery core pack through the through hole, The holder. The method according to claim 1,
Wherein the protection circuit component comprises a protection IC, a field effect transistor and at least one passive element,
The passive element is arranged to connect at least a part of the plurality of spaced apart leads, and the passive element is electrically connected to an electrical connection member electrically connecting any two selected from the group consisting of the protection IC, the field effect transistor, So that the battery protection circuit module package can constitute a battery protection circuit without using a separate printed circuit board,
Holder for mounting battery protection circuit module package. 8. The method of claim 7,
Wherein the electrical connecting member comprises a bonding wire or a bonding ribbon. 8. The method of claim 7,
The protection IC and the field effect transistor are not inserted and fixed in the form of a semiconductor package on the lead frame but are formed on at least a part of the surface of the lead frame by surface mounting technology, In the form of a chip die, mounted and fixed,
Holder for mounting battery protection circuit module package. Disposing a fixing plate made of metal inside the injection mold; And
A body portion capable of supporting a battery protection circuit module package by embedding and melting an end of the fixing plate by injecting a molten resin into the injection mold having the fixing plate disposed therein and insert injection molding step;
Lt; / RTI >
Wherein the battery protection circuit module package comprises a lead frame composed of a plurality of leads spaced apart, a protection circuit component on the lead frame, and an encapsulating material sealing the protection circuit component, / RTI > Providing a holder capable of mounting a battery protection circuit module package according to any one of claims 1 to 3 and 5 to 9;
Fixing the holder to the battery core pack by bonding the fixing plate to the upper surface of the battery core pack; And
Mounting the battery protection circuit module package on the holder;
Wherein the battery pack is mounted on the battery pack. 12. The method of claim 11,
Wherein the bonding between the upper surface of the battery core pack and the fixing plate is performed using at least one selected from the group consisting of laser welding, resistance welding, soldering, conductive adhesive, and conductive tape. Way.

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