KR101595501B1 - Package of battery protection circuits module and battery pack - Google Patents

Abstract

The present invention relates to a battery protection circuit module package and a battery pack, which are advantageous for integration and miniaturization. The battery protection circuit module package includes a lead for a first internal connection terminal electrically connected to an electrode terminal of a battery bare cell, A lead for an external connection terminal constituting a plurality of external connection terminals and a lead for a first internal connection terminal and a lead for external connection disposed so as to be electrically isolated from the lead for the external connection terminal, frame; An element package mounted on the terminal lead frame to be electrically connected to at least a part of the terminal lead frame, the element package including a substrate on which a battery protection circuit element and a PTC structure are disposed; And sealing the battery protection circuit element to seal at least a portion of the terminal leadframe to seal at least a portion in an inward direction and expose the remainder of the anvil lid, And an encapsulant that encapsulates the battery pack.

Description

[0001] The present invention relates to a battery protection circuit module and a battery pack,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a package of a battery protection circuit module and a battery pack having the battery protection circuit module, and more particularly, to a battery protection circuit module package and a battery pack which can be downsized and are easy to mount.

Generally, batteries are used in mobile terminals such as mobile phones and PDAs. Lithium-ion batteries are the most widely used batteries in portable handsets, and they have overcharging and over-currents, and when the temperature rises due to the heat generation, the performance deteriorates as well as the risk of explosion. Therefore, a normal battery may include a protection circuit device that detects overcharge, over-discharge, and over-current and blocks battery operation.

Such a protection circuit device is generally mounted on a battery bare cell in combination with a holder. The holder includes a body portion formed of resin, and optionally, at least one through hole formed in the body portion. The holder serves as a guide for mounting the battery protection circuit package accurately aligned on the upper surface of the battery bare cell and further serves as a support for fixing the battery protection circuit package on the upper surface of the battery bare cell have. Recently, a technique has been developed in which a fixing portion is formed on one side of a holder by insert injection, and the fixing portion is bonded on the upper surface of the battery bare cell.

However, even when the battery protection circuit package is mounted using the holder having the fixing portion, there is a problem that the holder is lifted and the manufacturing cost is increased. SUMMARY OF THE INVENTION It is an object of the present invention to provide a battery protection circuit module package and a battery pack which are advantageous for integration and miniaturization. However, these problems are exemplary and do not limit the scope of the present invention.

A battery protection circuit module package according to an aspect of the present invention can be provided. The battery protection circuit module package includes: a lead for a first internal connection terminal electrically connected to an electrode terminal of a battery bare cell; A lead for an external connection terminal which is disposed apart from the lead for the first internal connection terminal and constitutes a plurality of external connection terminals; And a lower lead disposed to be spaced apart from the main lead so as to be electrically insulated from the leads for the first internal connection terminal and the leads for the external connection terminal. An element package mounted on the terminal lead frame to be electrically connected to at least a part of the terminal lead frame, the element package including a substrate on which a battery protection circuit element and a PTC structure are disposed; And sealing the battery protection circuit element to seal at least a portion of the terminal leadframe to seal at least a portion in an inward direction and expose the remainder of the anvil lid, And an encapsulating material.

In the battery protection circuit module package, the substrate includes a printed circuit board, and the battery protection circuit element includes a protection IC disposed on the printed circuit board, a field effect transistor (FET) Passive devices.

In the battery protection circuit module package, the substrate includes a mounting lead frame having a plurality of spaced mounting leads, the battery protection circuit element including a protection IC directly mounted on the mounting lead frame, a field effect transistor, Wherein the passive element is arranged to connect at least a portion of the plurality of spaced apart mounting leads, wherein the passive element is not inserted and fixed on the mounting leadframe, Wherein the protection IC and the field effect transistor are mounted on the mounting lead frame in the form of a semiconductor package and are not fixedly mounted on the mounting lead frame by the surface mounting technique, On at least part of the surface of the mounting leadframe And a plurality of mounting leads are electrically connected to each other in the form of a chip die that is not sealed with a separate encapsulant, The battery protection circuit can be constructed without using a separate printed circuit board by providing the electrical connecting member including the bonding wire or the bonding ribbon to be connected.

In the battery protection circuit module package, the leads for the first internal connection terminal and the lead for the underlays, which are respectively disposed at both edges of the terminal lead frame, are formed of a plate having a first polarity and a lead The battery cell may be connected to the first polarity plate among the electrode terminals of the battery bare cell including the bipolar electrode cell, and the PTC structure may be electrically connected to the electrode cell of the second polarity among the electrode terminals of the battery bare cell .

In the battery protection circuit module package, a portion of the substrate corresponding to at least part of the lead for the external connection terminal is attached to the terminal lead frame via a conductive adhesive, and at least a part of the lead- And a corresponding portion may be attached to the terminal lead frame via an insulating adhesive.

In the battery protection circuit module package, the PTC structure includes a PTC device and a metal connecting member attached to one surface of a top surface and a bottom surface of the PTC device. The PTC device is sealed by the sealing material, And at least a part of the metal connecting member exposed through the second through-hole formed in the sealing material may be electrically connected to the electrode cell of the second polarity.

In the battery protection circuit module package, the lead for the first internal connection terminal and the lead for the unused lead may be bent in a gull-form form to join with the plate of the first polarity.

In the battery protection circuit module package, the leads for the first internal connection terminal and the lead for the underlays, which are respectively disposed at both edges of the terminal lead frame, are formed of a plate having a first polarity and a lead Wherein the terminal lead frame is disposed between the lead for the external connection terminal and the lead for the first polarity, and the terminal lead frame is disposed between the lead for the external connection terminal and the lead for the non- And a lead for a second internal connection terminal that can be directly connected and electrically connected to the electrode cell of the second polarity.

In the battery protection circuit module package, the substrate may be attached to the lead for the external connection terminal via a conductive adhesive.

In the battery protection circuit module package, the PTC structure may include a PTC device and a metal connecting member attached to one of the upper and lower surfaces of the PTC device, and the PTC device and the metal connecting member may be connected to the sealing material All can be sealed.

In the battery protection circuit module package, the lead for the first internal connection terminal and the lead for the unused lead are bent in the form of a sieve for bonding with the plate of the first polarity, and the lead for the second internal connection terminal is bent And may be folded in the form of a pellet to join with the electrode cell of polarity.

In the battery protection circuit module package, the sealing material may include a first encapsulant and a second encapsulant spaced from each other, and the first encapsulant may include at least a part of the lead for the external connection terminal, the substrate, and the PTC structure And the second encapsulation member may seal at least a part of the lead for the second internal connection terminal and the at least part of the aesthetic lead so as to seal the spacing space between the lead for the second internal connection terminal and the longer lead.

In the battery protection circuit module package, the substrate may be formed with an upper surface and / or a lower surface with an unsealed exposed terminal by the encapsulation material. The exposed terminal may be electrically connected to at least a part of the terminal lead frame.

A battery pack according to another aspect of the present invention can be provided. The battery pack comprising: a battery bare cell having an electrode terminal including a first polarity plate and a second polarity electrode cell disposed in the first polarity plate; And the battery protection circuit module package, which is disposed on the upper surface of the battery bare cell.

According to some embodiments of the present invention as described above, it is possible to provide a battery protection circuit module package and a battery pack which are advantageous for integration and miniaturization. Of course, the scope of the present invention is not limited by these effects.

1 is a circuit diagram of a battery protection circuit constituting a part of a battery protection circuit module package according to some embodiments of the present invention.
2 and 3 are perspective views illustrating a battery protection circuit module package according to an embodiment of the present invention.
4 is an exploded perspective view illustrating a battery protection circuit module package according to an embodiment of the present invention.
5 is a perspective view illustrating a structure implemented in an intermediate process of manufacturing a battery protection circuit module package according to an embodiment of the present invention.
6 is a perspective view illustrating a battery pack coupled to a battery bare cell according to an embodiment of the present invention.
7 and 8 are combined perspective views illustrating a battery protection circuit module package according to another embodiment of the present invention.
9 is an exploded perspective view illustrating a battery protection circuit module package according to another embodiment of the present invention.
10 is a perspective view illustrating a structure implemented in an intermediate process of manufacturing a battery protection circuit module package according to another embodiment of the present invention.
11 is a perspective view illustrating a battery pack coupled to a battery bare cell according to another embodiment of the present invention.
12 is a perspective view illustrating a battery pack in which a battery protection circuit module package according to a comparative example of the present invention is coupled to a battery bare cell.
13 is a perspective view illustrating a configuration in which a battery protection circuit module package according to embodiments of the present invention is further coupled to a battery pack coupled to a battery bare cell.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified in various other forms, The present invention is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art. In the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of explanation.

It is to be understood that throughout the specification, when an element such as a film, region or substrate is referred to as being "on", "connected to", "laminated" or "coupled to" another element, It is to be understood that elements may be directly "on", "connected", "laminated" or "coupled" to another element, or there may be other elements intervening therebetween. On the other hand, when one element is referred to as being "directly on", "directly connected", or "directly coupled" to another element, it is interpreted that there are no other components intervening therebetween do. Like numbers refer to like elements. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various elements, components, regions, layers and / or portions, these members, components, regions, layers and / It is obvious that no. These terms are only used to distinguish one member, component, region, layer or section from another region, layer or section. Thus, a first member, component, region, layer or section described below may refer to a second member, component, region, layer or section without departing from the teachings of the present invention.

Also, relative terms such as "top" or "above" and "under" or "below" can be used herein to describe the relationship of certain elements to other elements as illustrated in the Figures. Relative terms are intended to include different orientations of the device in addition to those depicted in the Figures. For example, in the figures the elements are turned over so that the elements depicted as being on the top surface of the other elements are oriented on the bottom surface of the other elements. Thus, the example "top" may include both "under" and "top" directions depending on the particular orientation of the figure. If the elements are oriented in different directions (rotated 90 degrees with respect to the other direction), the relative descriptions used herein can be interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention should not be construed as limited to the particular shapes of the regions shown herein, but should include, for example, changes in shape resulting from manufacturing.

In the embodiments of the present invention, the lead frame may be divided into a structure in which the lead terminals are patterned on the metal frame, and a structure and thickness of the lead frame are different from those of the printed circuit board on which the metal wiring layer is formed.

1 is a circuit diagram of a battery protection circuit constituting a part of a battery protection circuit module package according to some embodiments of the present invention.

1, the battery protection circuit 10 according to some embodiments of the present invention includes first and second internal connection terminals B + and B- for connecting to a battery cell, And first to third external connection terminals P +, CF, and P- for connecting to an electronic device (e.g., a portable terminal or the like) operated by a battery power when discharging. Here, the first external connection terminal P + and the third external connection terminal P- of the first to third external connection terminals P +, CF, and P- are for power supply and the other is an external connection terminal The second external connection terminal CF divides the battery and charges the battery according to the battery. Alternatively, the second external connection terminal CF may be a thermistor, which is a component for sensing the battery temperature during charging, and may be used as a terminal to which other functions are applied.

The battery protection circuit 10 is connected to the power supply terminals of the dual FET chip 110, the protection IC 120, the resistors R1, R2 and R3, the varistor V1 and the capacitors C1 and C2 Connection structure.

The dual FET chip 110 includes a first field effect transistor (FET1) and a second field effect transistor (FET2) having a drain common structure. The protection IC 120 is connected to the first internal connection terminal B + which is the positive terminal of the battery through the resistor R1 and is connected to the first node n1 through the first node n1, A terminal (VDD terminal) for sensing a voltage application and a battery voltage, a reference terminal (VSS terminal) serving as a reference for an operation voltage inside the protection IC 110, a sensing terminal (V- A discharge cutoff signal output terminal (DO terminal) for turning off the first field effect transistor FET1 in the overdischarge state, a charge cutoff signal output terminal C0 for turning off the second field effect transistor FET2 in the overcharge state, Terminal).

At this time, the inside of the protection IC 120 includes a reference voltage setting unit, a comparison unit for comparing the reference voltage with the charge / discharge voltage, an overcurrent detection unit, and a charge / discharge detection unit. Here, the criterion of charging and discharging states can be changed to a specification (SPEC) required by the user, and the charging / discharging state is determined by recognizing the voltage difference of each terminal of the protection IC 120 according to the determined standard.

When the protection IC 120 reaches an over-discharge state at the time of discharging, the DO terminal becomes LOW to turn off the first field effect transistor FET1, and when the overcharge state is reached, the CO terminal becomes low, The field effect transistor FET2 is turned off and the second field effect transistor FET2 is turned off at the time of charging when the overcurrent flows and the first field effect transistor FET1 at the time of discharging.

The resistor R1 and the capacitor C1 serve to stabilize the variation of the power supply of the protection IC 120. [ The resistor R1 is connected between the first node n1 which is the supply node of the battery power supply V1 and the VDD terminal of the protection IC 120 and the capacitor C1 is connected between the VDD terminal and the VSS terminal of the protection IC do. Here, the first node n1 is connected to the first internal connection terminal B + and the first external connection terminal P +. When the resistance R1 is increased, the detection voltage becomes higher due to the current penetrated into the protection IC 120 at the time of voltage detection. Therefore, the value of the resistor R1 is set to an appropriate value of 1 K or less. Also, for stable operation, the value of the capacitor C1 has an appropriate value of 0.01 mu F or more.

And the resistors R1 and R2 become current limiting resistors when the high voltage charger or charger exceeding the absolute maximum rating of the protection IC 120 is connected upside down. The resistor R2 is connected between the V- terminal of the protection IC 120 and the second node n2 to which the source terminal S2 of the second field effect transistor FET2 is connected. Since the resistors R1 and R2 may cause power consumption, the sum of the resistance values of the resistors R1 and R2 is usually set to be larger than 1 K ?. If the resistance R2 is too large, the return may not occur after the overcharge cutoff, so that the value of the resistance R2 is set to a value of 10K or less.

The capacitor C2 is connected to the source terminal S1 of the first node n2 (or the third external connection terminal P-) and the first field effect transistor FET1 (or the VSS terminal, the second internal connection terminal B -)). The capacitor C2 does not significantly affect the characteristics of the battery protection circuit product, but is added for user's request or stability. The capacitor C2 is for stabilizing the system by improving the resistance to voltage fluctuation and external noise.

The resistor R3 and the varistor V1 are elements for ESD (Electrostatic Discharge) and surge protection and are connected in parallel to each other. The second external connection terminal CF and the second node n2 Or the third external connection terminal P-). The resistance of the varistor (V1) is lowered when an overvoltage occurs. When the overvoltage is generated, the resistance of the varistor (V1) is lowered, thereby minimizing circuit damage due to overvoltage.

In some embodiments of the present invention, the battery protection circuit 10, which includes the external connection terminals P +, P-, and CF and the internal connection terminals B + and B-, It implements the package of the module.

The protection circuit according to some embodiments of the present invention described above is exemplary and the configuration, number, arrangement, etc. of the protection IC, the FET structure, or the passive element can be appropriately modified in accordance with the additional function of the protection circuit. Hereinafter, a modified embodiment of the battery protection circuit element will be described.

The dual FET chip 110 and the protection IC 120 may have a structure in which the dual FET chip 110 and the protection IC 120 are vertically stacked or disposed adjacent to each other. That is, the dual FET chip 110 may have a structure in which the protection IC 120 is stacked on the upper surface, or the dual FET chip 110 may be disposed adjacent to the left or right side of the protection IC 120.

The dual FET chip 110 includes a first field effect transistor and a second field effect transistor having a common drain structure, that is, two field effect transistors (FETs), and the external connection terminal includes a first field effect transistor A structure is employed in which the terminal G1 and the first source terminal S1 and the second gate terminal G2 and the second source terminal S2 of the second field effect transistor are provided on the upper surface of the dual FET chip 110 . In addition, the common drain terminal D may be provided on the lower surface of the dual FET chip 110.

The protection IC 120 may have a structure that is stacked on the upper surface of the dual FET chip 110, for example. The protection IC 120 is stacked on a region (for example, a central portion) excluding a portion where external connection terminals on the dual FET chip 110 are disposed. At this time, an insulating film for insulation may be disposed between the protection IC 120 and the dual FET chip 110, and the protection IC 120 and the dual FET chip 110 may be bonded with an adhesive of an insulating material. Since the size of the dual FET chip 110 is larger than that of the protection IC 120, a configuration in which the protection IC 120 is stacked on top of the dual FET chip 110 is adopted.

After the protection IC 120 is stacked on the upper surface of the dual FET chip 110, the DO terminal DO of the protection IC 120 is electrically connected to the first gate terminal G1 via a wire or a wiring And the CO terminal (CO) of the protection IC 120 is electrically connected to the second gate terminal G2 through a wire or a wiring. The connection structure of the remaining terminals will be described later. The protection IC 120 and the dual FET chip 110 having the above-described laminated structure can be referred to as a laminated chip. In the battery protection circuit module package according to some embodiments of the present invention, the area to be mounted on the substrate to be described later can be reduced by introducing the lamination chip of the protection IC having the laminated structure and the dual FET chip, High capacity can be realized.

Hereinafter, a battery protection circuit module package according to an embodiment of the present invention to which the above-described battery protection circuit element is applied will be described.

FIGS. 2 and 3 are perspective views illustrating a battery protection circuit module package according to an embodiment of the present invention. FIG. 4 is an exploded perspective view illustrating a battery protection circuit module package according to an embodiment of the present invention. FIG. 6 is a perspective view illustrating a structure of a battery protection circuit module package according to an embodiment of the present invention. FIG. 6 is a perspective view illustrating a structure of a battery protection circuit module package according to an embodiment of the present invention. FIG. 2 is a perspective view illustrating a battery pack coupled to the battery pack.

2 to 6, a battery protection circuit module package 300 according to an embodiment of the present invention includes a terminal lead frame 50, an element package 60, and an encapsulant 90.

The terminal lead frame 50 includes a first internal connection terminal lead 50a electrically connected to the electrode terminals 410 and 430 of the battery bare cell 400; Leads 50b, 50c, 50d, and 50e for external connection terminals, which are spaced apart from the first internal connection terminal lead 50a and constitute a plurality of external connection terminals; The leads 50a and 50b for the first internal connection terminal and the leads 50b and 50b for the first internal connection terminal are electrically insulated from the first internal connection terminal lead 50a and the external connection terminal leads 50b, 50c, 50c, 50d, and 50e, and spaced apart from each other. The terminal lead frame 50 may be made of nickel, copper, nickel plated copper or other metal.

The first internal connection terminal lead 50a may be the first internal connection terminal B + shown in FIG. 1 for connection to the battery cell. Any three leads selected from the external connection terminal leads 50b, 50c, 50d, and 50e are electrically connected to the first, second, and third external connection terminal leads P +, CF, and P- Or arranged in any order. The arrangement order of the first to third external connection terminal leads (P +, CF, P-) may be variously changed. The number and usage of the external connection terminal leads 50b, 50c, 50d, and 50e may be appropriately changed in accordance with the configuration of the battery protection circuit module package.

The remaining unused leads 50f are electrically insulated from the battery protection circuit elements 110, 120, 130, and 140 constituting the element package 60. [

The first internal connection terminal lead 50a and the second lead terminal 50f are bonded to the upper surface of the battery bare cell 400 so that the battery protection circuit module package 300 is mounted on the upper surface of the battery bare cell 400 without a holder Can be fixed. Further, even when the battery protection circuit module package 300 is to be fixed to the upper surface of the battery bare cell 400 using the holder, it is not necessary to form the fixing portion on one side of the holder by injection molding, .

The bonding may be bonded in any one of the methods selected from the group consisting of laser welding, resistance welding, soldering and a conductive adhesive (for example, a conductive epoxy), an insulating adhesive, a conductive tape and an insulating tape.

The device package 60 is mounted on the terminal lead frame 50 to be electrically connected to the terminal lead frame 50 and the battery protection circuit elements 110, 120, 130, 140 and the PTC structure 80 are disposed And a substrate 62.

The encapsulant 90 seals the battery protection circuit elements 110, 120, 130 and 140 and seals at least a portion thereof in the inward direction (e.g., in the negative direction of the x axis) At least a portion of the terminal leadframe 50 is sealed to expose the remainder of the aesthetic lead 50f and at least a portion of the PTC structure 80 is sealed. The encapsulant 90 may comprise, for example, an epoxy molding compound (EMC).

The substrate 62 on which the battery protection circuit elements 110, 120, 130 and 140 may be disposed in the device package 60 may include a lead frame, a printed circuit board, a ceramic substrate, or a glass substrate .

The substrate 62, illustratively, with reference to FIG. 5, may include a printed circuit board. In this case, the battery protection circuit elements 110, 120, 130 and 140 include a dual FET chip 110, a protection IC 120 and at least one passive element 130 disposed on the printed circuit board, And an electrical connecting member 140. The electrical connection member 140 may include a bonding wire or a bonding ribbon.

On the other hand, as another example, the substrate 62 may include a mounting lead frame having a plurality of mounting leads spaced apart. In this case, the battery protection circuit elements 110, 120, 130, and 140 may include a protection IC directly mounted on the mounting lead frame, a field effect transistor, and at least one passive element. The passive element is arranged to connect at least a part of the plurality of spaced apart mounting leads, and the passive element is not inserted and fixed on the mounted lead frame, but is mounted on the surface of the mounted lead frame And can be mounted and fixed at least on part thereof. The protection IC and the field effect transistor are not inserted and fixed in the form of a semiconductor package on the mounting leadframe but are sealed with at least part of the surface of the mounting leadframe by a surface mounting technique, And can be mounted and fixed in a chip die form. Furthermore, by further including an electrical connecting member including a bonding wire or a bonding ribbon for electrically connecting any two selected from the group consisting of the protection IC, the field effect transistor, and the plurality of mounting leads, A battery protection circuit can be constructed without using a circuit board.

In the case where the board 62 includes a mounting lead frame having a plurality of mounting leads spaced apart from each other, a circuit is formed by disposing an electrical connecting member such as a bonding wire or a bonding ribbon on the mounting lead frame. It is an important advantage that the process of designing and manufacturing a mounting lead frame for constituting the printed circuit board can be simplified. If the electrical connecting member described in the embodiments of the present invention is not introduced in constituting the battery protection circuit, the configuration of the plurality of leads constituting the mounted lead frame becomes very complicated, so that it is easy to effectively provide a proper mounted lead frame I can not.

In the case where the substrate 62 is constituted by the mounted lead frame, the protection IC and the field effect transistor are not fixedly inserted into the mounting lead frame in the form of a semiconductor package but are mounted by surface mounting technology Can be mounted and fixed on at least a part of the surface of the mounting leadframe in the form of a chip die sawed from a wafer not sealed with a separate encapsulant. Here, a chip die is a chip die, which is formed by performing a sowing process on a wafer on which a plurality of array structures (for example, a protection IC and a field effect transistor) are formed, ≪ / RTI > That is, after the protection IC and the field effect transistor are mounted on the mounting lead frame without being sealed with a separate sealing material, the protection IC and the field effect transistor The process of forming the sealing material can be performed only once when the battery protection circuit module package 300 is implemented. On the other hand, when a passive element, a protection IC, and a field effect transistor are separately inserted into a printed circuit board to be fixed or mounted, a single molding process is required first for each component and fixed or mounted on a printed circuit board Since another molding process is further required for each component mounted thereafter, the manufacturing process is complicated and the manufacturing cost is increased.

Furthermore, in the case of using the lead frame in the device package 60 of the battery protection circuit module package 300 according to the embodiment of the present invention, as compared with the case where the protection circuit is mounted on the printed circuit board (PCB) It is expected that the total height can be drastically reduced. That is, the printed circuit board typically has a thickness of about 2 mm, while the lead frame has a thickness of about 0.8 mm, so that the battery can be miniaturized by the difference in thickness or the battery size can be increased by the difference in thickness. Can be implemented.

In the battery protection circuit module package 300 according to an embodiment of the present invention, the leads 50a and 50f for the first internal connection terminal, which are respectively disposed at both edges of the terminal lead frame 50, The plate 430 of the first polarity among the electrode terminals of the battery bare cell 400 including the plate 430 of the first polarity and the electrode cell 410 of the second polarity disposed in the plate 430 of the first polarity, As shown in FIG. The PTC structure 80 may be directly electrically connected to the electrode cell 410 of the second polarity among the electrode terminals of the battery bare cell 400.

When the element package 60 is mounted on one surface of the external connection terminal leads 50b, 50c, 50d and 50e constituting the terminal lead frame 50, All or some of the portions corresponding to the other surfaces of the leads 50b, 50c, 50d, and 50e may be selectively plated. The plating material may be at least one selected from gold, silver, nickel, tin and chromium.

Portions of the substrate 62 corresponding to at least a part of the external connection terminal leads 50b, 50c, 50d, and 50e can be attached to the terminal lead frame 50 via a conductive adhesive. In this case, a conductive pad may be formed on a part of the substrate 62 which contacts the terminal lead frame 50, and the conductive adhesive may be interposed between the terminal lead frame 50 and the conductive pad.

A portion of the substrate 62 corresponding to at least a part of the hairless leads 50f may be attached to the terminal lead frame 50 with an insulating adhesive interposed therebetween. Therefore, the battery charger 50f is connected to the first polarity plate 430, which is the electrode terminal of the battery bare cell 400, while the battery protection circuit module package 300 is connected to the battery charger 50f via the battery charger 50f. And is not electrically connected to the electrode terminal of the cell 400. However, the connection between the battery protection circuit module package 300 and the battery bare cell 400 is further facilitated by connecting the unused lead 50f to the first polarity plate 430, which is the electrode terminal of the battery bare cell 400. [ It is robustly implemented.

The PTC structure 80 includes a PTC element 82 and a metal connecting member 84 attached to either the upper surface or the lower surface of the PTC element 82.

The PTC (Positive Temperature Coefficient) element 82 can be formed, for example, by dispersing conductive particles in a crystalline polymer. The PTC element 82 becomes a passage through which current flows between the metal connecting member 84 and the conductive pad 64 formed on the substrate 62. [ However, when the temperature exceeds the set temperature due to the occurrence of the overcurrent, the crystalline polymer swells and the resistance between the conductive particles dispersed in the crystalline polymer is separated and the resistance is rapidly increased. Therefore, the flow of the current between the metal connecting member 84 and the conductive pad 64 is cut off or the flow of the electric current is reduced. Since the flow of the current can be cut off by the PTC element 82, the PTC element 82 plays the role of a safety device for preventing the battery from rupturing. When the temperature is lower than the set temperature again, the PTC element 82 shrinks the crystalline polymer and restores the connection between the conductive particles, so that the current flows smoothly. The PTC element 82 is sealed by the sealing material 90. [

At least a portion of the metal connecting member 84 exposed through the first through-hole 65 formed in the substrate 62 and the second through-hole 95 formed in the sealing material 90 is electrically connected to the electrode cell 410 of the second polarity And can be electrically connected to each other. The battery protection circuit elements 110, 120, and 130 disposed on the substrate 62 may be electrically connected to the conductive pads 64 formed on the substrate 62 through predetermined wiring circuits. Further, the PTC elements 82 And the metal connecting member 84 to the electrode cell 410 of the second polarity of the battery bare cell 400. [ Therefore, in the battery protection circuit module package 300 according to the embodiment of the present invention, the lead (B-) for the second internal connection terminal shown in FIG. 1 is connected to a separate lead But may be understood as a metal connecting member 84 of the PTC structure 80. [

In the battery protection circuit module package 300 according to an embodiment of the present invention, the leads 50a and 50f for the first internal connection terminal are connected to the package 300 of the battery protection circuit module And may be bent in a gull-form form for joining with the plate 430 of the first polarity while horizontally aligning.

The substrate 62 constituting the device package 60 may be formed with exposed terminals 66, 67, 68, 69 that are not sealed by the encapsulant 90 on the upper and / or lower surface. The exposed terminals 66, 67, 68, 69 formed on the upper and / or lower surface of the substrate 62 may be electrically connected to at least a portion of the terminal lead frame 50.

The element package 60 is mounted on the terminal lead frame 50 so as to be electrically connected to the terminal lead frame 50. For example, the device package 60 may be mounted using the Surface Mounting Technology on the terminal lead frame 50. The device package 60 may have at least one exposed terminal (not shown) on the lower surface thereof. Furthermore, the device package 60 may have at least one exposed terminal 66, 67, 68, 69 formed on the upper surface thereof. The sealing member 90 for sealing the battery protection circuit elements 110, 120, 130, and 140 may be formed to expose the above-described exposed terminals. On the other hand, at least one of the exposure terminals formed on the lower surface of the element package 60 is electrically connected to at least a part of the terminal lead frame 50 to constitute at least a part of the circuit shown in Fig. 1 .

For example, the exposed terminals 66, 67, 68, and 69 shown in the figure may be NFC connection terminals formed to electrically connect the NFC antenna and the NFC matching element. Specifically, in addition to the configuration of the battery protection circuit shown in FIG. 1, an NFC circuit is added to support Near Field Communication (NFC). The NFC circuit to be added may include, for example, an NFC connection terminal and an NFC matching element. The NFC connection terminal may be in contact with the end of the NFC antenna disposed in the periphery of the battery pack. The NFC antenna may be, for example, a loop-shaped antenna. When the end of the NFC antenna contacts the NFC connection terminal, the NFC matching element and the NFC antenna are electrically connected to form a closed loop. The NFC matching element may be, for example, a capacitor for frequency matching. For example, both ends of the NFC loop antenna are connected to a capacitor, which is the NFC matching device, to form a closed loop, and a frequency region for NFC communication at 13. 56 MHz is generated using the NFC antenna and the resonance generated in the capacitor, And can communicate with the device. Of course, the technical spirit of the present invention is not limited by the exemplary numbers, arrangements, and uses described above of the exposed terminals 66, 67, 68, 69 shown in the drawings.

The battery protection circuit module package 300 according to an embodiment of the present invention is mounted on the upper surface of the battery bare cell 400 to form a battery pack 500.

The battery bare cell 400 comprises an electrode assembly and a cap assembly. The electrode assembly includes a positive electrode plate formed by applying a positive electrode active material to a positive electrode collector, a negative electrode plate formed by applying a negative electrode active material to a negative electrode collector, and a negative electrode plate interposed between the positive electrode plate and the negative electrode plate. The separator may be made of a separator. The positive electrode tab attached to the positive electrode plate and the negative electrode tab attached to the negative electrode plate are drawn out from the electrode assembly.

The cap assembly includes a first polarity plate 430, a second polarity electrode cell 410, and the like. The plate 430 having the first polarity may serve as a cathode terminal, and may be called a cap plate. The electrode cell 410 of the second polarity may serve as a negative terminal, and may be called a negative electrode cell.

The first inner connecting terminal lead 50a and the second outer connecting lead 50f constituting both edges of the battery protection circuit module package 300 according to the embodiment of the present invention are connected to the plate 430 of the first polarity, Thereby fixing the battery protection circuit module package 300 to the battery bare cell 400. The electrode cell 410 of the second polarity which is the electrode terminal of the battery bare cell 400 is bonded to the metal connecting member 84 of the PTC structure 80 through the second through hole 95 in the sealing material 90 And is electrically connected.

Hereinafter, a battery protection circuit module package according to another embodiment of the present invention to which the above-described battery protection circuit element is applied will be described.

7 and 8 are exploded perspective views illustrating a battery protection circuit module package according to another embodiment of the present invention, FIG. 9 is an exploded perspective view illustrating a battery protection circuit module package according to another embodiment of the present invention, and FIG. 10 is a perspective view illustrating a structure implemented in an intermediate process of manufacturing a battery protection circuit module package according to another embodiment of the present invention. FIG. 11 is a perspective view illustrating a structure of a battery protection circuit module package according to another embodiment of the present invention. FIG. 2 is a perspective view illustrating a battery pack coupled to the battery pack.

7 to 11, a battery protection circuit module package 300 according to another embodiment of the present invention includes a terminal lead frame 50, an element package 60, and an encapsulant 90.

The terminal lead frame 50 includes a first internal connection terminal lead 50a and a second internal connection terminal lead 50g which are electrically connected to the electrode terminals 410 and 430 of the battery bare cell 400; External connection terminal leads 50b, 50c, 50d, and 50e disposed between the first internal connection terminal lead 50a and the second internal connection terminal lead 50g and constituting a plurality of external connection terminals; And the first internal connection terminal lead (50a), the second internal connection terminal lead (50g) and the external connection terminal leads (50b, 50c, 50d, 50e) so as to be electrically insulated from the first internal connection terminal lead 50a, 50a, 50b, 50c, 50d, 50e, 50e, 50e, 50e, 50e, 50e, 50e, and 50e. The first internal connection terminal lead 50a and the second lead terminal 50f are disposed on both edges of the terminal lead frame 50, respectively.

The first internal connection terminal lead 50a and the second internal connection terminal lead 50g are connected to the first internal connection terminal B + and the second internal connection terminal B- ). Any three leads selected from the external connection terminal leads 50b, 50c, 50d, and 50e are electrically connected to the first, second, and third external connection terminal leads P +, CF, and P- Or arranged in any order. The arrangement order of the first to third external connection terminal leads (P +, CF, P-) may be variously changed. The number and usage of the external connection terminal leads 50b, 50c, 50d, and 50e may be appropriately changed in accordance with the configuration of the battery protection circuit module package.

The remaining unused leads 50f are electrically insulated from the battery protection circuit elements 110, 120, 130, and 140 constituting the element package 60. [ The lead 50a for the first internal connecting terminal and the lead for the unused lead 50f are bonded to the upper surface of the battery bare cell 400 (for example, the first polarity plate 430) 300 may be fixed to the upper surface of the battery bare cell 400 without a holder. Furthermore, the second internal connection terminal lead 50g is bonded to the upper surface (for example, the second polarity electrode cell 410) of the battery bare cell 400, And can be further fixed to the upper surface of the bare cell 400 without a holder.

The bonding may be bonded in any one of the methods selected from the group consisting of laser welding, resistance welding, soldering and a conductive adhesive (for example, a conductive epoxy), an insulating adhesive, a conductive tape and an insulating tape.

The element package 60 is mounted on the terminal lead frame 50 so as to be electrically connected to the terminal lead frame 50. The device package 60 includes a substrate 62 on which the battery protection circuit elements 110, 120, 130, 140 and the PTC structure 80 are disposed.

The encapsulant 90 seals the battery protection circuit elements 110, 120, 130 and 140 and seals at least a portion thereof in the inward direction (e.g., in the negative direction of the x axis) At least a portion of the terminal leadframe 50 is sealed to expose the remainder of the aesthetic lead 50f and at least a portion of the PTC structure 80 is sealed.

The first inner connecting terminal lead 50a and the second outer connecting lead 50f disposed at both edges of the terminal lead frame 50 are connected to the first polarity plate 430 and the first polarity plate 430 And may be connected to the first polarity plate 430 among the electrode terminals 410 and 430 of the battery bare cell 400 including the second polarity electrode cell 410 disposed therein.

The second internal connection terminal lead 50g constituting the terminal lead frame 50 is disposed between the external connection terminal leads 50b, 50c, 50d and 50e and the remaining unused leads 50f, And may be directly connected and electrically connected to the cell 410.

In the battery protection circuit module package 300 according to another embodiment of the present invention, the substrate 62 may be attached to the external connection terminal leads 50b, 50c, 50d, and 50e through a conductive adhesive. In this case, a conductive pad may be formed on a part of the substrate 62 which contacts the terminal lead frame 50, and the conductive adhesive may be interposed between the terminal lead frame 50 and the conductive pad.

The substrate 62, illustratively, with reference to FIG. 10, may include a printed circuit board. In this case, the battery protection circuit elements 110, 120, 130 and 140 include a dual FET chip 110, a protection IC 120 and at least one passive element 130 disposed on the printed circuit board, And an electrical connecting member 140. The electrical connection member 140 may include a bonding wire or a bonding ribbon.

On the other hand, as another example, the substrate 62 may include a mounting lead frame having a plurality of mounting leads spaced apart. In this case, the battery protection circuit elements 110, 120, 130, and 140 may include a protection IC directly mounted on the mounting lead frame, a field effect transistor, and at least one passive element. The passive element is arranged to connect at least a part of the plurality of spaced apart mounting leads, and the passive element is not inserted and fixed on the mounted lead frame, but is mounted on the surface of the mounted lead frame And can be mounted and fixed at least on part thereof. The protection IC and the field effect transistor are not inserted and fixed in the form of a semiconductor package on the mounting leadframe but are sealed with at least part of the surface of the mounting leadframe by a surface mounting technique, And can be mounted and fixed in a chip die form. Furthermore, by further including an electrical connecting member including a bonding wire or a bonding ribbon for electrically connecting any two selected from the group consisting of the protection IC, the field effect transistor, and the plurality of mounting leads, A battery protection circuit can be constructed without using a circuit board.

In the battery protection circuit module package 300 according to another embodiment of the present invention, the PTC structure 80 includes a PTC element 82 and a metal connecting member 82 attached to one surface of the PTC element 82, . ≪ / RTI >

The PTC (Positive Temperature Coefficient) element 82 can be formed, for example, by dispersing conductive particles in a crystalline polymer. Therefore, the PTC element 82 becomes a passage through which the electric current flows under the set temperature. However, when the temperature exceeds the set temperature due to the occurrence of the overcurrent, the crystalline polymer swells and the resistance between the conductive particles dispersed in the crystalline polymer is separated and the resistance is rapidly increased. The current flow between the metal connecting member 84 and the substrate 62 is cut off or the flow of the electric current is reduced. Since the flow of the current can be cut off by the PTC element 82, the PTC element 82 plays the role of a safety device for preventing the battery from rupturing. When the temperature is lower than the set temperature again, the PTC element 82 shrinks the crystalline polymer and restores the connection between the conductive particles, so that the current flows smoothly. The PTC element 82 and the metal connecting member 84 are all sealed by the sealing material 90. [

The first internal connection terminal lead 50a and the second external connection terminal lead 50f are bent in the form of a sash to bond with the plate 430 of the first polarity and the lead 50g for the second internal connection terminal is bent May be folded in the form of a sieve to bond with the electrode cell 410 of FIG.

The encapsulant 90 may include a first encapsulant 92 and a second encapsulant 94 that are spaced apart from each other. The first encapsulant 92 seals the external connection terminal leads 50b, 50c, 50d and 50e and at least a part of the substrate 62 and further seals the PTC structure 80 completely. The second encapsulant 94 has a second inner connecting terminal lead 50g and a second inner connecting terminal lead 50g so as to seal the spacing space between the second inner connecting terminal lead 50g and the non- At least a part of which is sealed. The first encapsulant 92 and the second encapsulant 94 may be simultaneously formed by a single encapsulation process.

The battery protection circuit module package 300 according to another embodiment of the present invention is mounted on the upper surface of the battery bare cell 400 to form a battery pack 500.

The first inner connecting terminal lead 50a and the second inner connecting terminal 50f constituting the both edges of the battery protection circuit module package 300 according to another embodiment of the present invention are connected to the plate 430 of the first polarity, Thereby fixing the battery protection circuit module package 300 to the battery bare cell 400. The electrode cell 410 of the second polarity, which is the electrode terminal of the battery bare cell 400, is electrically connected to the second internal connection terminal lead 50g.

The battery protection circuit module package 300 according to another embodiment of the present invention described with reference to FIGS. 7 to 11 is described in detail with reference to FIGS. 2 to 6, The battery protection circuit module package 300 according to the present invention will be omitted here.

12 is a perspective view illustrating a battery pack in which a battery protection circuit module package according to a comparative example of the present invention is coupled to a battery bare cell.

A battery protection circuit package 600 according to a comparative example of the present invention is mounted on a battery bare cell 400 in combination with a holder 700. The battery protection circuit package 600 includes a sealing material 640 formed so as to expose the leads 620 for internal connection terminals on both edges thereof without forming the hairless leads. Furthermore, a PTC structure 660 bonded to the lead 620 for the internal connection terminal is further constructed. The holder 700 is easily lifted from the upper surface of the battery bare cell 400. Therefore, a fixing portion 720 is formed on one side of the holder 700 to fix the holder 700 on the upper surface of the battery bare cell 400, and is bonded onto the plate 430 of the first polarity. The fixing portion 720 may be formed together with the holder 700 by, for example, a nickel insert injection method. The introduction of the holder 700 and the fixing portion 720 inevitably raises the manufacturing cost.

On the contrary, the battery protection circuit module package 300 according to the embodiments of the present invention can be firmly fixed to the battery bare cell 400 without introducing a holder, so that a battery pack of good quality is manufactured at a relatively low manufacturing cost It can have an advantageous advantage that can be realized. Further, even when the battery protection circuit module package 300 is to be fixed to the upper surface of the battery bare cell 400 using the holder, it is not necessary to form the fixing portion 720 on one side of the holder by insert injection, The unit price can be reduced.

In the battery protection circuit module package 300 according to the embodiments of the present invention, the leads 50a for the first internal connection terminal and the lead leads 50f are fixedly connected to the plate 430 having the first polarity The second internal connection terminal lead 50g may be fixedly connected to the electrode cell 410 of the second polarity. Therefore, since the battery protection circuit module package 300 is bonded to the electrode terminal of the battery bare cell 400, it can be stably fixed. According to the embodiments of the present invention, since the side surface of the lead frame is separately bent so that the side surface of the bent lead frame is not separately bonded to the side of the battery bare cell 400 other than the upper surface, the manufacturing process is simplified, Can be miniaturized.

13 is a perspective view illustrating a configuration in which a battery protection circuit module package according to embodiments of the present invention is further coupled to a battery pack coupled to a battery bare cell. The battery pack 570 shown in Fig. 13 can be implemented by coupling the upper case 550 to the structure 500 shown in Figs. 6 and 11.

Referring to FIG. 13, the upper case 550 may be made of a plastic material, and a through hole may be formed at a corresponding portion to expose the external connection terminals 50a, 50b, 50c, and 50d. Optionally, the upper case 550 can be coupled to the holder. Taping work or labeling work for wrapping the side surface in the battery pack 570 shown in FIG. 13 may be further performed.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

10: Battery protection circuit
50: Terminal lead frame
60: Device package
90: sealing material
110: Dual FET Chip
120: Protection IC
130: Passive element
140: electrical connecting member
300: Battery protection circuit module package
400: battery bare cell
410: electrode cell of the second polarity
430: plate of the first polarity
500, 570: Battery pack

Claims (15)

A lead for a first internal connection terminal electrically connected to an electrode terminal of the battery bare cell; A lead for an external connection terminal which is disposed apart from the lead for the first internal connection terminal and constitutes a plurality of external connection terminals; And a lower lead disposed to be spaced apart from the main lead so as to be electrically insulated from the leads for the first internal connection terminal and the leads for the external connection terminal.
An element package mounted on the terminal lead frame to be electrically connected to at least a part of the terminal lead frame, the element package including a substrate on which a battery protection circuit element and a PTC structure are disposed; And
Sealing the battery protection circuit element and sealing at least a portion of the terminal leadframe to seal at least a portion inwardly of the backside lid and to expose the remainder of the backside lid, And an encapsulating material,
The terminal lead frame is formed by patterning the lead for the first internal connection terminal, the lead for the external connection terminal,
The lead for the first internal connection terminal and the lead for the undermentioned which are respectively disposed at both edges of the terminal lead frame include a plate of a first polarity and an electrode cell of a second polarity arranged in the plate of the first polarity The battery cell may be connected to the first polarity plate among the electrode terminals of the battery bare cell,
Wherein the PTC structure is electrically connected to a second polarity electrode cell among the electrode terminals of the battery bare cell,
Battery protection circuit module package. The method according to claim 1,
The substrate includes a printed circuit board,
Wherein the battery protection circuit element comprises a protection IC, a field effect transistor (FET), and at least one passive element disposed on the printed circuit board. The method according to claim 1,
Wherein the substrate includes a mounting lead frame having a plurality of spaced mounting leads, the battery protection circuit element including a protection IC directly mounted on the mounting lead frame, a field effect transistor, and at least one passive element,
The passive element is arranged to connect at least a part of the plurality of spaced apart mounting leads, and the passive element is not inserted and fixed on the mounted lead frame, but is mounted on the surface of the mounted lead frame At least partially mounted and fixed,
The protection IC and the field effect transistor are not inserted and fixed in the form of a semiconductor package on the mounting leadframe but are sealed with at least part of the surface of the mounting leadframe by a surface mounting technique, Mounted and fixed in the form of a chip die,
Further comprising an electrical connecting member including a bonding wire or a bonding ribbon for electrically connecting any two selected from the group consisting of the protection IC, the field effect transistor, and the plurality of mounting leads, Which constitutes a battery protection circuit without using a battery,
Battery protection circuit module package. delete The method according to claim 1,
A portion of the substrate corresponding to at least part of the lead for the external connection terminal is attached to the terminal lead frame via a conductive adhesive,
Wherein at least a part of the substrate corresponding to at least a part of the at least one remaining lead is attached to the terminal lead frame via an insulating adhesive.
Battery protection circuit module package. The method according to claim 1,
Wherein the PTC structure includes a PTC element and a metal connecting member attached to one of upper and lower surfaces of the PTC element,
The PTC device is sealed by the sealing material,
Wherein at least a part of the metal connecting member exposed through the first through hole formed in the substrate and the second through hole formed in the sealing member is electrically connected to the electrode electrode of the second polarity,
Battery protection circuit module package. The method according to claim 1,
Wherein the first inner connecting terminal lead and the second outer connecting lead are bent in a gull-form form to join with the first polarity plate,
Battery protection circuit module package. The method according to claim 1,
The lead for the first internal connection terminal and the lead for the undermentioned which are respectively disposed at both edges of the terminal lead frame include a plate of a first polarity and an electrode cell of a second polarity arranged in the plate of the first polarity The battery cell may be connected to the first polarity plate among the electrode terminals of the battery bare cell,
Wherein the terminal lead frame further comprises a lead for a second internal connection terminal which is disposed between the lead for the external connection terminal and the lead wire for the second connection and is directly connected to and electrically connected to the electrode cell of the second polarity,
Battery protection circuit module package. 9. The method of claim 8,
Wherein the substrate is attached to the lead for the external connection terminal via a conductive adhesive. 9. The method of claim 8,
Wherein the PTC structure includes a PTC element and a metal connecting member attached to one of upper and lower surfaces of the PTC element,
Wherein the PTC element and the metal connection member are all sealed by the sealing material,
Battery protection circuit module package. 9. The method of claim 8,
The lead for the first internal connection terminal and the lead for the unused lead are bent in the form of a slit for bonding with the plate of the first polarity,
Wherein the lead for the second internal connection terminal is bent in the form of a strip for bonding with the electrode cell of the second polarity,
Battery protection circuit module package. 9. The method of claim 8,
Wherein the sealing material comprises a first sealing material and a second sealing material spaced from each other,
The first sealing member seals at least a part of the lead for the external connection terminal, the substrate, and the PTC structure,
Wherein the second sealing member seals at least a part of the lead for the second internal connection terminal and the at least one lead for covering the space for separating the lead for the second internal connection terminal from the lead for the second lead. . The method according to claim 1,
Wherein the substrate has exposed terminals that are not sealed by the encapsulant on the top and / or bottom surfaces. 14. The method of claim 13,
And the exposed terminal is electrically connected to at least a part of the terminal lead frame. A battery bare cell having an electrode terminal including a plate of a first polarity and an electrode cell of a second polarity disposed in the plate of the first polarity; And
The battery protection circuit module package according to any one of claims 1 to 3 and 5 to 14, arranged on the upper surface of the battery bare cell.
And a battery pack.

Images