KR101479307B1 - Package of battery protection circuits module and battery pack including the same - Google Patents

Abstract

The present invention relates to a package of a battery protection circuit module suitable for integration and miniaturization. The package of a battery protection circuit module includes a lead frame which includes leads separated from each other and can be electrically bonded and connected to the electrode terminal of a battery cell; an insulating pattern on the lead frame; a conductive pattern on the insulating pattern; a battery protection circuit component mounted on the conductive pattern; and an encapsulating material which exposes parts of the lead frame and encapsulates the battery protection circuit component.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a battery protection circuit module package and a battery pack including the same,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a package of a battery protection circuit module and a battery pack, and more particularly, to a battery protection circuit module package and a battery pack which can be downsized.

Generally, batteries are used in mobile terminals such as mobile phones and PDAs. Lithium-ion batteries are the most widely used batteries in portable handsets, and they have overcharging and over-currents, and when the temperature rises due to the heat generation, the performance deteriorates as well as the risk of explosion. Therefore, a conventional battery is equipped with a protection circuit module for detecting and blocking overcharge, over-discharge, and over-current, or a protection circuit for detecting overcharge, over-discharge, . Such a conventional protection circuit is generally formed by connecting a protection integrated circuit (IC), a fieled effect transistor (FET), a resistor, and a capacitor to a printed circuit board (PCB) by soldering . However, such a conventional protection circuit has a problem that the space occupied by the protection IC, the FET, the resistor, and the capacitor is too large to be miniaturized. In addition, a separate operation is required to attach the protection circuit to the battery pack. After attaching the protection circuit, the protection circuit may be connected to the external connection terminal or the inside via a separate wiring, wire bonding, a pattern of the PCB substrate, There is a problem that the operation is complicated, for example, connection with the connection terminals is required.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a battery protection circuit module package which is advantageous for integration and miniaturization, and a battery pack including the same. However, these problems are exemplary and do not limit the scope of the present invention.

A battery protection circuit module package according to an aspect of the present invention can be provided. Wherein the battery protection circuit module package includes a plurality of leads spaced apart from each other and can be electrically connected to the electrode terminals of the battery cell; An insulating pattern on the lead frame; A conductive pattern on the insulating pattern; A battery protection circuit component mounted on the conductive pattern; And an encapsulant for sealing the battery protection circuit component while exposing a part of the lead frame.

In the battery protection circuit module package, the insulating pattern may be disposed on the upper surface of the lead frame, and the conductive pattern may be disposed on the upper surface of the insulating pattern.

The battery protection circuit module package may further include a via pattern electrically connecting the conductive pattern and the lead frame.

In the battery protection circuit module package, the battery protection circuit component may include a protection IC, a field effect transistor, and at least one passive element. The protection IC and the field effect transistor are not inserted and fixed in the form of a semiconductor package on the conductive pattern but are formed on at least a part of the surface of the conductive pattern by a surface mounting technique, And can be mounted and fixed in the form of a die (chip die).

In the battery protection circuit module package, the conductive pattern is formed of a plurality of patterns spaced apart from each other, and the passive element is arranged to connect any two patterns selected from the plurality of spaced patterns, A battery protection circuit can be constructed without using a substrate.

The battery protection circuit module package may further include an electrical connection member configured to connect the protection IC or the field effect transistor with the conductive pattern.

In the battery protection circuit module package, the lead frame is disposed at both edge portions, exposed by the sealing material, and electrically connected to the electrode terminals of the battery cell, Leads for leads and second internal connection terminals; And a lead for an external connection terminal, which is disposed between the lead for the first internal connection terminal and the lead for the second internal connection terminal and constitutes a plurality of external connection terminals.

In the battery protection circuit module package, the lead frame may be made of nickel or nickel plated on a copper plate, and the conductive pattern may include copper.

The battery protection circuit module package may include a PTC device, a metal layer attached to a first surface of the PTC device, the first surface being a top surface of the PTC device, and a second surface of the PTC device, Wherein the metal layer is electrically connected to one of the leads for the first internal connection terminal and the lead for the second internal connection terminal and is electrically connected to the first internal connection terminal and the second internal connection terminal, And can be electrically connected to the electrode terminal.

A battery pack according to another aspect of the present invention can be provided. The battery pack includes the battery protection circuit module package described above; And the battery cell including the electrode terminal having a first polarity plate and a second polarity electrode cell disposed at the center in the plate of the first polarity, and the lead for the first internal connection terminal And the leads for the second internal connection terminal may be electrically connected directly to the electrode cells of the second polarity by electrically connecting to the first polarity plate.

In the battery pack, the battery protection circuit module package may be disposed on one side of the upper surface of the battery cell with respect to the electrode cell of the second polarity.

According to some embodiments of the present invention as described above, it is possible to provide a battery protection circuit module package and a battery pack which are advantageous for integration and miniaturization. Of course, the scope of the present invention is not limited by these effects.

1 is a cross-sectional view illustrating a battery protection circuit module package according to an embodiment of the present invention.
2 to 9 are views illustrating a method of manufacturing a battery protection circuit module package according to an embodiment of the present invention.
10A and 10B are perspective views illustrating a battery protection circuit module package according to an embodiment of the present invention.
11 is a diagram illustrating a process of coupling a battery protection circuit module package according to an embodiment of the present invention to a battery can.
12 is a view illustrating a battery protection circuit module package according to another embodiment of the present invention.
13 is a diagram illustrating a process of coupling a battery protection circuit module package according to another embodiment of the present invention to a battery can.
14 is a perspective view illustrating a battery pack according to another embodiment of the present invention.
15A and 15B are circuit diagrams of various battery protection circuits implemented by a battery protection circuit module package according to an embodiment of the present invention.
16 is a plan view illustrating the structure of the lead frame and the arrangement of the protection circuit elements in the battery protection circuit module package according to the comparative example of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified into various other forms, The present invention is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art. In the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of explanation.

It is to be understood that throughout the specification, when an element such as a film, region or substrate is referred to as being "on", "connected to", "laminated" or "coupled to" another element, It is to be understood that elements may be directly "on", "connected", "laminated" or "coupled" to another element, or there may be other elements intervening therebetween. On the other hand, when one element is referred to as being "directly on", "directly connected", or "directly coupled" to another element, it is interpreted that there are no other components intervening therebetween do. Like numbers refer to like elements. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various elements, components, regions, layers and / or portions, these members, components, regions, layers and / It is obvious that no. These terms are only used to distinguish one member, component, region, layer or section from another region, layer or section. Thus, a first member, component, region, layer or section described below may refer to a second member, component, region, layer or section without departing from the teachings of the present invention.

Also, relative terms such as "top" or "above" and "under" or "below" can be used herein to describe the relationship of certain elements to other elements as illustrated in the Figures. Relative terms are intended to include different orientations of the device in addition to those depicted in the Figures. For example, in the figures the elements are turned over so that the elements depicted as being on the top surface of the other elements are oriented on the bottom surface of the other elements. Thus, the example "top" may include both "under" and "top" directions depending on the particular orientation of the figure. If the elements are oriented in different directions (rotated 90 degrees with respect to the other direction), the relative descriptions used herein can be interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing ideal embodiments of the present invention. In the drawings, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention should not be construed as limited to the particular shapes of the regions shown herein, but should include, for example, changes in shape resulting from manufacturing.

In the embodiments of the present invention, the lead frame may be divided into a structure in which the lead terminals are patterned on the metal frame, and a structure and thickness of the lead frame are different from those of the printed circuit board on which the metal wiring layer is formed.

1 is a cross-sectional view illustrating a battery protection circuit module package according to an embodiment of the present invention.

Referring to FIG. 1, a battery protection circuit module package 300 according to an embodiment of the present invention includes a lead frame 50 including a plurality of spaced leads, a conductive pattern 54a on a lead frame 50, The battery protection circuit elements 100a and 130 mounted on the pattern 54a and the sealing material 250 sealing the battery protection circuit elements 100a and 130 while exposing a part of the lead frame 50 . The lead frame 50 may be electrically connected to electrode terminals (410 and 430 in FIG. 13) of the battery cell (400 in FIG. 13). The lead frame 50 may be made of, for example, nickel, or nickel plated on a copper plate. The conductive pattern 54a may comprise, for example, copper or nickel.

The battery protection circuit module package 300 according to an embodiment of the present invention may further include an insulating pattern 52a interposed between the lead frame 50 and the conductive pattern 54a. The insulating pattern 52a may include, for example, an adhesive member interposed between the lead frame 50 and the conductive pattern 54a. The adhesive member is attached to the upper surface of the lead frame 50, and the conductive pattern 54a can be attached to the upper surface of the adhesive member. The adhesive member may include an insulating material, for example, an adhesive epoxy or an adhesive film.

Meanwhile, in the battery protection circuit module package according to the modified embodiment of the present invention, the insulating pattern 52a may include an insulating pattern rather than an adhesive member. The insulating pattern other than the adhesive member may include at least one selected from the group consisting of, for example, oxides, nitrides and oxynitrides, and may be formed by a deposition and etching process.

The battery protection circuit module package 300 according to an embodiment of the present invention may include a plurality of grooves H1 and H2 constituting a part of the conductive pattern 54a and / or the insulating pattern 52a. These grooves H1 and H2 can be understood as a spacing space between the conductive pattern 54a and the insulating pattern 52a and can be a hole, a trench, a slit and / Or a cavity. The sealing material 250 can fill the first groove H1 exposing the upper surface of the insulating pattern 52a. The via pattern 56 electrically connecting the conductive pattern 54a and the lead frame 50 can fill the second groove H2 exposing the upper surface of the lead frame 50. [

Since the battery protection circuit components 100a and 130 are mounted on the conductive pattern 54a without being mounted on the lead frame 50 in the battery protection circuit module package 300 according to the embodiment of the present invention, The configuration of the plurality of spaced leads constituting the frame 50 can be relatively simplified. That is, the lead frame 50 can expect an advantageous effect that it does not need to include leads of complicated configurations in which the battery protection circuit components 100a and 130 are mounted.

Hereinafter, a method of manufacturing the battery protection circuit module package 300 according to an embodiment of the present invention will be described with reference to FIGS. 2 to 8. FIG.

FIG. 2 is a cross-sectional view illustrating a configuration in which an insulating member layer 52 and a conductive member layer 54 are disposed on a lead frame 50, and FIG. 3 is a view illustrating a bonding process for implementing such a configuration.

Referring to Figs. 2 and 3, a lead frame 50 including a plurality of spaced leads 50-1 to 50-7 is provided. The lead frame 50 is disposed at both edge portions and is exposed at least a part by the sealing material 250. The lead frame 50-1 is electrically connected to the electrode terminals of the battery cell, And a lead 50-7 for the second internal connection terminal. The lead frame 50 is disposed between the lead 50-1 for the first internal connection terminal and the lead 50-7 for the second internal connection terminal and has a plurality of external connection terminals And leads 50-2, 50-3, 50-4, 50-5, and 50-6. The plurality of external connection terminals may include, for example, three or four external connection terminals. The lead frame 50 may be made of nickel, copper, nickel plated copper or other metal. Further, at least a part of the leads 50-2, 50-3, 50-4, 50-5, and 50-6 for the external connection terminals of the lead frame 50 is formed on the outwardly facing surface of the battery (for example, All of the lower surface in FIG. 3) or a part thereof may be plated. The plating material may be at least one selected from gold, silver, nickel, tin and chromium. The insulating member layer 52 is formed on the upper surface of the lead frame 50 and the conductive member layer 54 is formed on the upper surface of the insulating member layer 52. [

FIGS. 4 and 5 are a cross-sectional view and a perspective view illustrating a step of forming an insulating pattern and a conductive pattern by etching the insulating member layer and the conductive member layer formed on the lead frame, FIG. 6 is a cross- Is an exploded perspective view illustrating the configuration of the pattern.

4 to 6, at least a part of the insulating member layer 52 and / or the conductive member layer 54 on the lead frame 50 is etched to form the insulating member layer 52 and / or the insulating member layer 52 And a plurality of grooves H1 and H2 passing through the upper and lower portions. The grooves H1 and H2 can be understood as a hole, a trench, a slit and / or a cavity depending on the size and shape. By forming the first groove H1 and the second groove H2, the conductive member layer 54 is realized as the conductive pattern 54a, and the insulating member layer 52 is realized as the insulating pattern 52a.

For example, at least one first groove H1 that penetrates only the conductive member layer 54 and does not penetrate the insulating member layer 52 is formed by applying an appropriate mask (not shown) and adjusting the etching process . The first groove H1 may be filled with the encapsulant 250 in a subsequent process. On the other hand, by applying an appropriate mask (not shown) and adjusting the etching process, at least one second groove H2 that penetrates the conductive member layer 54 and further penetrates to the insulating member layer 52 can be formed . At least one of the leads for a plurality of external connection terminals 50-2, 50-3, 50-4, 50-5, and 50-6 may be exposed by the second groove H2.

On the other hand, in the modified embodiment of the present invention, the insulating pattern 52a on which the second groove H2 has already been formed can be directly bonded without bonding the insulating member layer 52 on the lead frame 50. [ Subsequently, a first modified embodiment of directly bonding the conductive pattern 54a in which the first groove H1 and the second groove H2 already formed on the insulating pattern 52a on which the second groove H2 has already been formed is directly bonded Or the first groove H1 and the second groove H2 are formed in the conductive member layer 54 by first bonding the conductive member layer 54 on the insulating pattern 52a on which the second groove H2 has already been formed The conductive patterns 54a including the first grooves H1 and the second grooves H2 are printed on the insulating patterns 52a on which the second grooves H2 have already been formed a third modified embodiment of printing can be performed. According to the first to third modified embodiments, it is not necessary to perform the etching process for separately forming the second trenches H2 in the insulating member layer 52, so that the etching of the lead frame 50 An advantageous effect of preventing damage can be expected.

FIGS. 7 and 8 are cross-sectional views sequentially illustrating subsequent processes performed on the structure shown in FIG. 9 is a partially cutaway perspective view illustrating the battery protection circuit module package shown in FIG.

7, the second groove H2 may be filled with a via pattern 56 electrically connecting the conductive pattern 54a and the lead frame 50. [ The via pattern 56 may comprise, for example, a solder paste or a conductive epoxy. The via pattern 56 electrically connects at least one lead selected from the plurality of external connection terminal leads 50-2, 50-3, 50-4, 50-5, and 50-6 to the conductive pattern 54a. And can be configured to connect.

7 to 9, the battery protection circuit components 100a and 130 can be mounted on the conductive pattern 54a. The battery protection circuit component may include, for example, a protection IC and a field effect transistor. 7 to 9, the protection IC and the field effect transistor may be mounted on the conductive pattern 54a with the vertically stacked structure 100a, but in the modified embodiment, And may be mounted on the respective mounting portions 54a.

The protection IC and the field effect transistor are not inserted and fixed in the form of a semiconductor package on the conductive pattern 54a but are formed on at least a part of the surface of the conductive pattern 54a by Surface Mounting Technology, Can be mounted and fixed in the form of a chip die, which is sawed on a wafer that is not sealed with a separate encapsulant. Here, a chip die refers to an individual structure implemented by performing a sowing process on a wafer on which an array-type protection IC and / or a field effect transistor is formed, without sealing the wafer with a separate encapsulant. That is, according to the embodiment of the present invention, when the protection IC and the field effect transistor are mounted on the conductive pattern 54a without being sealed with a separate sealing material, Since the protection IC and the field effect transistor are sealed by the protection IC module 300 and the protection IC module 300, the process of forming the encapsulation material can be performed only once.

On the other hand, when the protection IC and / or the field effect transistor are separately inserted into the printed circuit board (PCB) and fixed or mounted, a single molding process is first required for each component, The molding process is further required for each component mounted after fixing or mounting, which complicates the manufacturing process and increases the manufacturing cost.

Meanwhile, the battery protection circuit component may include at least one passive device 130, for example. The conductive pattern 54a is composed of a plurality of patterns spaced apart from each other. The passive element 130 is arranged to connect any two patterns selected from a plurality of spaced patterns constituting the conductive pattern 54a, The battery protection circuit can be constituted without using the printed circuit board of FIG.

Meanwhile, the battery protection circuit module package 300 may further include an electrical connection member 220a configured to connect the protection IC or the field effect transistor with the conductive pattern 54a. The electrical connection member 220a may include a bonding wire, a bonding ribbon, and / or a bonding clip. Since the electrical connecting member 220a is disposed on the conductive pattern 54a to constitute a circuit, it has an important advantage that the process of designing and manufacturing the conductive pattern 54a for constituting the battery protection circuit can be simplified. In the embodiments of the present invention, the configuration of the conductive pattern 54a may be very complicated unless the electrical connection member is introduced in realizing the battery protection circuit component.

An encapsulating material 250 for encapsulating the battery protection circuit elements 100a and 130, the electrical connecting member 220a, the insulating pattern 52a and the conductive pattern 54a while exposing a part of the lead frame 50, . The encapsulant 250 may comprise, for example, an epoxy molding compound (EMC).

10A and 10B are perspective views illustrating a battery protection circuit module package according to an embodiment of the present invention.

10A and 10B, a battery protection circuit module package 300 according to an embodiment of the present invention includes a lead frame 50 exposed by an encapsulant 250 in a structure shown in FIG. 8, The first internal connection terminal lead 50-1 and the second internal connection terminal lead 50-7 may be bent in a gull form in order to connect the first internal connection terminal lead 50-1 and the second internal connection terminal lead 50-7 to the electrode terminal of the battery cell. One side of the leads 50-2, 50-3, 50-4, 50-5, and 50-6 for the external connection terminals constituting the plurality of external connection terminals is covered with the sealing material 250, And is exposed to the outside without being sealed.

Hereinafter, a battery pack including a configuration for electrically connecting the battery protection circuit module package 300 with the battery cell will be described.

FIG. 11 is a view illustrating a process of assembling a battery protection circuit module package according to an embodiment of the present invention with a battery can. FIG. 14 is a perspective view illustrating a battery pack according to another embodiment of the present invention.

11 and 14, the module package 300 of the battery protection circuit having the above-described structure has the upper surface of the battery cell (battery bare cell) built in the battery can 400 and the upper surface of the upper case 500 So that the battery pack 600 as shown in FIG. 14 is formed. The upper case 500 is formed of a plastic or metal material and has a through hole 550 formed in a corresponding portion so that external connection terminals (for example, P +, TH, P-, and ID shown in FIG. 10B) . The battery pack 600 is generally understood as a battery inserted into a cell phone, a terminal, or the like.

The battery bare cell includes an electrode assembly and a cap assembly.

The electrode assembly includes a positive electrode plate formed by applying a positive electrode active material to a positive electrode collector, a negative electrode plate formed by applying a negative electrode active material to a negative electrode collector, and a negative electrode plate interposed between the positive electrode plate and the negative electrode plate. The separator may be made of a separator. The positive electrode tab attached to the positive electrode plate and the negative electrode tab attached to the negative electrode plate are drawn out from the electrode assembly.

The cap assembly includes an anode terminal 410, a gasket 420, a cap plate 430, and the like. The cap plate 430 may serve as a positive electrode terminal. The cathode terminal 410 may be referred to as a cathode cell or an electrode cell. The gasket 420 may be formed of an insulating material to insulate the cathode terminal 410 from the cap plate 430. Therefore, the electrode terminal of the battery cell may include the cathode terminal 410 and the cap plate 430.

That is, the electrode terminal of the battery cell includes a plate 430 of a first polarity (for example, an anode) and an electrode cell 410 of a second polarity (for example, a cathode) disposed in the center of the plate 430 And the lead (B +, 50-1) for the first internal connection terminal of the lead frame 50 is electrically connected to the plate 430 of the first polarity (for example, an anode) The second internal connection terminal leads B- and 50-7 of the first and second connection terminals 50 and 50 may be electrically connected to the electrode cell 410 of the second polarity (for example, a cathode).

In this case, the length of the lead frame 50 is set such that the length L (L) from one end of the plate 430 of the first polarity (for example, an anode) to the electrode cell 410 of the second polarity / 2). The battery protection circuit module package 300 according to an embodiment of the present invention has four or more external connection terminals 50-2, 50-3, 50-4, 50-5, and 50-6, Since the battery protection circuit module package 300 is mounted using only one side region of the upper portion with respect to the electrode cell 410 of the bipolarity (for example, the cathode), it is possible to realize the miniaturization or high capacity of the battery. For example, it is possible to contribute to miniaturization of an application product having such a battery by further forming a cell on the other side of the electrode cell 410 to increase the capacity of the battery or disposing a chip or the like having another additional function.

Furthermore, at least one of the first internal connection terminal lead (B +, 50-1) and the second internal connection terminal lead (B-, 50-7) It can be bent. For example, the lead (B +, 50-1) for the first internal connection terminal may be bent in a hanging form so as to be joined and fixed to the plate 430 of the first polarity (for example, an anode). The leads (B-, 50-7) for the second internal connection terminal are fixedly connected to the negative terminal (410) of the second polarity (for example, the negative electrode). The bonding can be bonded in any one of the methods selected from the group consisting of laser welding, resistance welding, soldering and a conductive adhesive (e.g., conductive epoxy), conductive tape.

Therefore, the battery protection circuit module package 300 can be stably fixed because the leads B + for the first internal connection terminal and the leads B- for the second internal connection terminal are bonded to the electrode terminals of the battery cell. Therefore, according to the embodiments of the present invention, since the side surface of the lead frame is separately bent so that the side surface of the bent lead frame is not separately bonded to the battery can 400 having the battery cell built therein, the manufacturing process is simplified, The battery can be downsized.

In the battery protection circuit module package 300 according to the modified embodiment of the present invention, the electrode terminal of the battery cell may have a first polarity terminal (not shown) instead of the first polarity (e.g., May be formed. In this case, the lead (B +) for the first internal connection terminal is electrically connected to the terminal (not shown) of the first polarity, and the lead (B-) for the second internal connection terminal has a second polarity The cathode electrode 410 may be electrically connected to the electrode cell 410 of the cathode.

In this case, the length of the lead frame 50 may correspond to the length from the terminal (not shown) of the first polarity to the electrode cell 410 of the second polarity (for example, the cathode). Also in this case, since the battery protection circuit module package 300 is mounted using only the region on one side with respect to the electrode cell 410 of the second polarity (for example, the cathode), it is possible to realize miniaturization or high capacity of the battery .

FIG. 12 is a view illustrating a battery protection circuit module package according to another embodiment of the present invention, and FIG. 13 is a view illustrating a process of coupling a battery protection circuit module package according to another embodiment of the present invention with a battery can .

Referring to FIGS. 12 to 13, the battery protection circuit module package 300 according to another embodiment of the present invention includes a PTC structure 350. The PTC structure 350 includes a PTC device 310 and a metal layer 320 attached to a first surface of the PTC device 310. The PTC device 350 includes an upper surface and a lower surface of the PTC device 310, And a conductive connecting member 340 attached to a second surface that is a surface of the conductive connecting member 340. The metal layer 320 is bonded to any one lead selected from the first internal connecting terminal lead B + and the second internal connecting terminal lead B-, and the connecting member 340 is electrically connected to the electrode terminal 13 < / RTI > 410). For example, the metal layer 320, the connecting member 340, and / or the lead frame 50 may be made of nickel, copper, nickel plated copper or other metal. The metal layer 320 is electrically connected to one of the leads for the first internal connection terminal B + and the second internal connection terminal B- by laser welding, resistance welding, soldering, and a conductive adhesive For example, conductive epoxy), and conductive tape.

The PTC (Positive Temperature Coefficient) element 310 can be formed, for example, by dispersing conductive particles in a crystalline polymer. Therefore, the PTC element 310 becomes a passage through which the current flows between the metal layer 320 and the conductive connecting member 340 at a set temperature or lower. However, when the temperature exceeds the set temperature due to the occurrence of the overcurrent, the crystalline polymer swells and the resistance between the conductive particles dispersed in the crystalline polymer is separated and the resistance is rapidly increased. Accordingly, the current flow between the metal layer 320 and the conductive connecting member 340 is cut off or the flow of the current is reduced.

Since the flow of the current can be cut off by the PTC device 310, the PTC device 310 serves as a safety device for preventing the battery from rupturing. When the temperature is lower than the set temperature again, the PTC element 310 shrinks the crystalline polymer and restores the connection between the conductive particles, so that the current flows smoothly.

The lead frame 50 constituting the module package 300 of the battery protection circuit is electrically connected to the electrode terminal of the battery cell via the PTC structure. For example, the leads (B-, 50-7) for the second internal connection terminal of the lead frame 50 may be electrically connected to the negative terminal 410 of the battery cell via the PTC structure 350. That is, the leads B- and 50-7 for the second internal connection terminal of the lead frame 50 are connected to the metal layer 320 and are electrically connected to the battery cell via the PTC element 310, And is electrically connected to the cathode terminal 410.

12 (b), the metal layer 320 is defined within the lower surface on the lower surface of the PTC device 310, and the connection member 340 is formed on the upper surface of the PTC device 310. In this case, To the negative terminal 410 of the battery cell. The connecting member 340 is connected to the negative electrode terminal 410 of the battery cell by any one method selected from the group consisting of laser welding, resistance welding, soldering and a conductive adhesive (for example, conductive epoxy) Can be bonded.

The length of the lead frame 50 in the module package 300 of the battery protection circuit having the above-described structure is set such that the lead frame 50 is located at the center of the upper surface of the battery cell (for example, As shown in Fig. Further, the module package 300 of the battery protection circuit coupled with the PTC structure shown in FIG. 12 is configured to be disposed on one side with respect to the center (for example, the negative terminal 410) of the upper surface of the battery cell . For example, the length of the module package 300 of the battery protection circuit coupled with the PTC structure 350 may be half (L / 2) of the total length L of the cap plate 430.

The electrical connection between the lead B- for the second internal connection terminal and the PTC device 310 is formed by the metal layer 320 which is limited within the lower surface of the PTC device 310 on the lower surface of the PTC device 310, The PTC device 310 can be disposed directly on the lead B- for the second internal connection terminal. The battery protection circuit module package 300 according to still another embodiment of the present invention is formed by the structure of the PTC structure 350 and the structure in which the battery protection circuit components 100a and 130 are mounted on the conductive pattern 54a Has a length of the module package 300 of the battery protection circuit coupled with the PTC structure while having four or more external connection terminals 50-2, 50-3, 50-4, 50-5, and 50-6. (L / 2) of the entire length L of the cap plate 430, for example. If the PTC device 310 is disposed in the longitudinal direction of the package 300 without being disposed directly on the lead B- for the second internal connection terminal, The length of the module package 300 of the circuit is relatively increased.

According to the embodiment of the present invention described above, the battery protection circuit module package can be mounted using only one side region of the cap plate 430 with respect to the negative terminal 410 of the battery, have. For example, by forming a cell in the other area of the negative terminal 410 where the module package 300 of the battery protection circuit is not disposed, the battery capacity can be increased or a chip or the like having other additional functions can be disposed. It can contribute to downsizing of an application product having a battery.

Further, when the lead frame is used as a substrate in the device package of the battery protection circuit module package according to the above-described embodiments of the present invention, a protective circuit is mounted on a printed circuit board (PCB) It is possible to form a lead that can be connected to the battery cell while mounting the protection circuit using only the lead frame, so that the manufacturing cost can be reduced and the total height can be remarkably reduced You can expect. That is, the printed circuit board typically has a thickness of about 2 mm, while the lead frame has a thickness of about 0.8 mm, so that the battery can be miniaturized by the difference in thickness or the battery size can be increased by the difference in thickness. Can be implemented.

Further, according to the embodiments of the present invention described above, it is possible to reduce the size of the PTC structure by simplifying and miniaturizing the connection structure to be connected to the lead frame while maintaining the size of the PTC device.

Hereinafter, a battery protection circuit to be implemented by the battery protection circuit module package 300 will be described.

15A and 15B are circuit diagrams of various battery protection circuits implemented by a battery protection circuit module package according to an embodiment of the present invention.

15A, a battery protection circuit 10 implemented by a battery protection circuit module package according to an embodiment of the present invention includes first and second internal connection terminals B + and B The first to third external connection terminals P +, CF, and P- for connecting to an electronic device (e.g., a portable terminal or the like) that is connected to the charger when charged and discharged by battery power, Respectively.

Here, the first external connection terminal P + and the third external connection terminal P- of the first to third external connection terminals P +, CF, and P- are for power supply and the other is an external connection terminal The second external connection terminals CF and TH divides the battery, for example, and charges the battery according to the battery. The second external connection terminals CF and TH may be a thermistor which is a component for sensing the battery temperature during charging, and may be used as a terminal to which other functions are applied.

The battery protection circuit 10 is connected to the connection structure of the dual FET chip 110, the protection integrated circuit 120, the resistors R1, R2 and R3, the varistor V1 and the capacitors C1 and C2 . The resistors R1, R2 and R3, the varistor V1 and the capacitors C1 and C2 correspond to the passive element 130 described above. The dual FET chip 110 includes a first field effect transistor (FET1) and a second field effect transistor (FET2) having a drain common structure. The protection IC 120 is connected to the first internal connection terminal B + which is the positive terminal of the battery through the resistor R1 and is connected to the first node n1 through the first node n1, A terminal (VDD terminal) for sensing a voltage application and a battery voltage, a reference terminal (VSS terminal) serving as a reference for an operation voltage inside the protection IC 110, a sensing terminal (V- A discharge cutoff signal output terminal (DO terminal) for turning off the first field effect transistor FET1 in the overdischarge state, a charge cutoff signal output terminal C0 for turning off the second field effect transistor FET2 in the overcharge state, Terminal).

At this time, the inside of the protection IC 120 includes a reference voltage setting unit, a comparison unit for comparing the reference voltage with the charge / discharge voltage, an overcurrent detection unit, and a charge / discharge detection unit. Here, the criterion of charging and discharging states can be changed to a specification (SPEC) required by the user, and the charging / discharging state is determined by recognizing the voltage difference of each terminal of the protection IC 120 according to the determined standard.

When the protection IC 120 reaches an over-discharge state at the time of discharging, the DO terminal becomes LOW to turn off the first field effect transistor FET1, and when the overcharge state is reached, the CO terminal becomes low, The field effect transistor FET2 is turned off and the second field effect transistor FET2 is turned off at the time of charging when the overcurrent flows and the first field effect transistor FET1 at the time of discharging.

The resistor R1 and the capacitor C1 serve to stabilize the variation of the power supply of the protection IC 120. [ The resistor R1 is connected between the first node n1 which is the supply node of the battery power supply V1 and the VDD terminal of the protection IC 120 and the capacitor C1 is connected between the VDD terminal and the VSS terminal of the protection IC do. Here, the first node n1 is connected to the first internal connection terminal B + and the first external connection terminal P +. When the resistance R1 is increased, the detection voltage becomes higher due to the current penetrated into the protection IC 120 at the time of voltage detection. Therefore, the value of the resistor R1 is set to an appropriate value of 1 K or less. Also, for stable operation, the value of the capacitor C1 has an appropriate value of 0.01 mu F or more.

And the resistors R1 and R2 become current limiting resistors when the high voltage charger or charger exceeding the absolute maximum rating of the protection IC 120 is connected upside down. The resistor R2 is connected between the V- terminal of the protection IC 120 and the second node n2 to which the source terminal S2 of the second field effect transistor FET2 is connected. Since the resistors R1 and R2 may cause power consumption, the sum of the resistance values of the resistors R1 and R2 is usually set to be larger than 1 K ?. If the resistance R2 is too large, the return may not occur after the overcharge cutoff, so that the value of the resistance R2 is set to a value of 10K or less.

The capacitor C2 is connected to the source terminal S1 of the first node n2 (or the third external connection terminal P-) and the first field effect transistor FET1 (or the VSS terminal, the second internal connection terminal B -)). The capacitor C2 does not significantly affect the characteristics of the battery protection circuit product, but is added for user's request or stability. The capacitor C2 is for stabilizing the system by improving the resistance to voltage fluctuation and external noise.

The resistor R3 and the varistor V1 are elements for ESD (Electrostatic Discharge) and surge protection and are connected in parallel to each other. The second external connection terminal CF and the second node n2 Or the third external connection terminal P-). The resistance of the varistor (V1) is lowered when an overvoltage occurs. When the overvoltage is generated, the resistance of the varistor (V1) is lowered, thereby minimizing circuit damage due to overvoltage.

In a modified embodiment of the present invention, the battery protection circuit 10 of FIG. 15A including the external connection terminals P +, P-, and CF and the internal connection terminals B + and B- A module package of the protection circuit can be implemented. The protection circuit according to one embodiment of the present invention described above is an example, and the configuration, number, arrangement, etc. of the protection IC, FET, or passive element can be appropriately modified in accordance with the additional function of the protection circuit.

Referring to FIG. 15B, an authentication chip circuit configuration unit 132 may be added to the battery protection circuit configuration unit including the battery protection circuit configured by modifying FIG. 15A to support the authentication function. This authentication function may include any additional functions for authentication or identification of a battery, a terminal equipped with the battery, a user using the terminal, and the like. The added authentication chip circuit configuration section 132 may include, for example, an ID chip 134 and at least one passive element C5, V1, R4, and R5. The number, type, arrangement, and the like of the passive elements constituting the authentication chip circuit configuration unit 132 shown in FIG. 15B are illustrative, and can be changed depending on the use or arrangement of the authentication function. The authentication chip circuit configuration unit 132 may be connected to the outside through an authentication chip external connection terminal (ID).

In addition to the configuration of the battery protection circuit shown in FIG. 15A, when the authentication chip circuit configuration unit 132 is configured, in addition to the three external connection terminals P +, TH, and P-, (ID), the number of external connection terminals implemented in the battery protection circuit module package is four or more. If the number of external connection terminals is four or more, it may not be easy to implement the battery protection circuit module package in terms of miniaturization. However, according to the embodiment of the present invention, the battery protection circuit components 100a, 50), but mounted on the conductive pattern 54a disposed on the lead frame 50, this problem can be overcome.

16 is a plan view illustrating the structure of the lead frame and the arrangement of the protection circuit elements in the battery protection circuit module package according to the comparative example of the present invention.

16, the battery protection circuit components 100a and 130 are mounted on the lead frame 50 without introducing the conductive pattern 54a disclosed in the embodiment of the present invention. In this case, in order to implement the battery protection circuit shown in Fig. 15A or 15B, the configuration of the element region A3 of the lead frame 50 on which the passive elements are mounted can be introduced very complicatedly. In order to implement the battery protection circuit shown in FIG. 15A or 15B, an electrical connecting member 220b for electrically connecting a plurality of leads spaced apart from each other may be introduced.

The passive element 130 is mounted on the conductive pattern 54a disposed on the upper surface of the lead frame 50 without being mounted on the lead frame 50. In this case, ) Can be expected to be advantageously simplified. In the embodiment of the present invention, by introducing the via pattern 56 for electrically connecting the conductive pattern 54a and the lead frame 50, a plurality of leads spaced apart from each other as shown in FIG. 16 are electrically connected to each other An effect that the electrical connecting member 220b is unnecessary can be expected.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

10: Battery protection circuit
50: Lead frame
52: Insulating member layer
52a: Insulation pattern
54: conductive member layer
54a: conductive pattern
56: Via pattern
250: Encapsulant
220a: electrical connecting member
300: Battery protection circuit module package
350: PTC structure
600: Battery pack

Claims (12)

A lead frame including a plurality of spaced leads, the lead frame being connectable and electrically connected to an electrode terminal of the battery cell;
An insulating pattern on the lead frame;
A conductive pattern on the insulating pattern;
A battery protection circuit component mounted on the conductive pattern; And
An encapsulant for sealing the battery protection circuit component while exposing a part of the lead frame;
And,
Wherein the battery protection circuit component comprises a protection IC, a field effect transistor and at least one passive element,
Wherein the conductive pattern is composed of a plurality of patterns spaced apart from each other,
Wherein the passive element is configured to connect any two patterns selected from the plurality of spaced apart patterns so that a battery protection circuit can be configured without using a separate printed circuit board. The method according to claim 1,
Wherein the insulating pattern is disposed on an upper surface of the lead frame, and the conductive pattern is disposed on an upper surface of the insulating pattern. The method according to claim 1,
Further comprising a via pattern electrically connecting the conductive pattern to the lead frame. delete The method according to claim 1,
The protection IC and the field effect transistor are not inserted and fixed in the form of a semiconductor package on the conductive pattern but are formed on at least a part of the surface of the conductive pattern by a surface mounting technique, A battery protection circuit module package, which is mounted and fixed in the form of a die. delete The method according to claim 1,
Further comprising an electrical connection member configured to connect the protection IC or the field effect transistor with the conductive pattern. The method according to claim 1,
The lead frame includes:
A lead for a first internal connection terminal and a lead for a second internal connection terminal, which are respectively disposed at both edge portions and are exposed by the sealing material and can be electrically connected to the electrode terminals of the battery cell; And
A lead for an external connection terminal, which is disposed between the lead for the first internal connection terminal and the lead for the second internal connection terminal and constitutes a plurality of external connection terminals;
And a battery protection circuit module package. The method according to claim 1,
Wherein the lead frame comprises nickel or nickel plated on a copper plate, the conductive pattern comprising copper or nickel. The method according to claim 1,
A PTC device comprising: a PTC device; a metal layer attached to a first surface of the PTC device, the first surface being a top surface and the bottom surface; and a connection member attached to a second surface of the PTC device; Respectively,
Wherein the metal layer is electrically connected to one of the first internal connection terminal lead and the second internal connection terminal lead and electrically connected to the electrode terminal of the battery cell, Protection circuit module package. The battery protection circuit module package according to any one of claims 1 to 3, 5, and 7 to 9; And
The battery cell including the electrode terminal including a plate of a first polarity and an electrode cell of a second polarity arranged in the center in the plate of the first polarity;
And,
Wherein the lead for the first internal connection terminal is directly connected to and electrically connected to the plate of the first polarity and the lead for the second internal connection terminal is electrically connected to the electrode cell of the second polarity, pack. 12. The method of claim 11,
Wherein the battery protection circuit module package is disposed on one side of the upper surface of the battery cell with respect to the electrode cell of the second polarity.

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