KR20160020028A - A Moving Equipment in the panel of organic light emitting diode device - Google Patents

Abstract

The present invention relates to moving equipment capable of moving an organic light emitting diode (OLED) panel during a process of manufacturing an OLED. According to the present invention, an OLED panel and a printed circuit board (PCB) connected to the OLED panel are supported and moved through a jig including a support unit and a guide unit. Thus, even if the OLED panel is not modularized with a back cover and a cabinet, a compensation process and an aging process can be performed. Even if the OELD panel has a very thin thickness, the OELD panel is prevented from being damaged due to deformation such as warpage or the like. In addition, even if high-temperature heat is generated from the PCB or the OLED, the high-temperature heat can be easily emitted to the outside, thereby preventing malfunction or a defect of the OLED panel. Also, even if a defect occurs while the compensation process or the aging process is performed, the defective OLED panel or driving circuit can be easily separated to be discarded, thereby not requiring a process of disassembling a modularized OLED to shorten a process time and enhance efficiency of the process. Also, only the recently required OLED panel can be provided to consumers.

Description

[0001] The present invention relates to an organic light emitting diode (OLED)

A feature of the present invention relates to mobile equipment capable of moving into the OLED panel state in the manufacturing process of the OLED.

An organic light emitting diode (OLED) is composed of a hole injection electrode, an organic light emitting layer and an electron injection electrode. Excitons generated by the combination of electrons and holes in the organic light emitting layer fall from the excited state to the ground state The light is emitted by the generated energy.

As a result of this principle, OLEDs have self-luminescence characteristics and do not require a separate light source unlike liquid crystal display devices, thereby reducing thickness and weight. In addition, OLEDs are considered to be the next generation display devices for portable electronic devices because they exhibit high-quality characteristics such as low power consumption, high luminance and high response speed.

Generally, the manufacturing process of an OLED can be broadly divided into two processes: a step of forming a driving thin film transistor (DTr) as a switching element and an organic light emitting layer on a substrate, and an encapsulation step of protecting the organic light emitting layer And a modularization process in which driver circuits such as a driver IC, a source PCB, and an FPC are connected to the fabricated OLED panel, and then a module is formed through a back cover and a cabinet.

Meanwhile, the OLED performs the compensation process of matching the T-con of the OLED panel with the driving circuit and the aging process of checking the quality of the OLED panel after all the modularization process. In the course of the compensation process and the aging process, In case of defective OLED panel or driving circuit, it is necessary to dismantle all of the modulated OLED, so that the process time is increased and the efficiency of the process is lowered.

In addition, even if a defect occurs in the OLED panel, the back cover or the cabinet, which modularized the OLED panel, is difficult to be reused and there is a problem of discarding the OLED panel together with the OLED panel in which the defect has occurred.

As a result, the process cost is further increased, and the process efficiency is further lowered such that the process time is further increased.

In recent years, there is an increasing demand for OLED panels, rather than modularized OLEDs. As a result, it is necessary to study the compensation and aging processes of OLED panels.

SUMMARY OF THE INVENTION It is a first object of the present invention to improve the efficiency of a process by shortening a process time or a process cost in manufacturing an OLED.

A second object of the present invention is to enable the compensation process and the aging process to proceed in the state of the OLED panel.

In order to achieve the above-mentioned object, the present invention provides a display device comprising: a plate-shaped support plate having an OLED panel attached to a front surface thereof and having a through hole; A horizontal holding part provided on a back surface of the support plate and supporting and guiding one edge of the printed circuit board connected to the OLED panel; A vertical holding part for supporting and guiding the other edge opposite to the one edge of the printed circuit board; And a heat spread covering the printed circuit board.

At this time, the printed circuit board is connected to the OLED panel through a connection member, and the connection member extends to the back surface of the support plate through the through hole, and the horizontal holding unit supports the back surface of the support plate in the first direction And a pair of fixing portions which are horizontally movable along the longitudinal direction of the first guide rail.

Each of the pair of fixing portions includes a first fixing holder formed of a first horizontal portion protruding vertically from the first guide rail and a first vertical portion bent vertically upward from the first horizontal portion, One horizontal portion supports a side surface of one side of the printed circuit board. The first vertical portion guides a front surface of one edge of the printed circuit board. The first vertical portion and the inner surface of the first horizontal portion serve as a cushion Respectively.

Each of the pair of fixing portions includes a fixed holder fixing portion connected to the first fixing holder, and the fixing holder fixing portion vertically moves a screw motion from the first guide rail by rotation, The fixed holder fixing portion is flanked with a step formed in the guide hole of the first guide rail, and the fixed position is fixed in the first guide rail.

At this time, the pair of fixing portions move horizontally along the longitudinal direction of the first guide rail corresponding to the length of one edge of the printed circuit board, and the vertical holding portion supports the horizontal holding portion and the through- A second guide rail formed along a second direction perpendicular to the first direction between the holes, a spring provided inside the second guide rail, and a spring provided at one end of the spring, And a second fixed holder that linearly moves along the second fixed holder.

The second fixing holder includes a second vertical portion connected to one end of the spring, a second horizontal portion bent perpendicularly from the second vertical portion and vertically protruding from the second guide rail, And a bent portion bent perpendicularly from the horizontal portion so as to face the second vertical portion, wherein the second fixing holder corresponds to a height from one edge to the other edge of the printed circuit board, And linearly moves along the longitudinal direction of the second guide rail.

At this time, a pad serving as a cushion is provided on the second vertical portion, the second horizontal portion, and the bent portion, and the heat spread is hinged at one edge parallel to the longitudinal direction of the horizontal holding portion, And is held so as to cover and cover the circuit board.

The heat spread may be made of at least one of aluminum (Al), copper (Cu), zinc (Zn), silver (Ag), gold (Au), iron (Fe), or an electrolytic galvanized iron (EGI), and a heat dissipating member is disposed on the inner surface of the heat spread, and the heat dissipating member is made of copper (Cu), silver (Ag), aluminum (Al), iron (Fe), nickel (Ni), and tungsten W), or the outer surface is made of at least one of nickel (Ni), silver (Ag) and gold (Au), or is made of a silicone composition, And a heat transfer filler containing copper (Cu).

At this time, the heat dissipating member is positioned corresponding to a field programmable gate array (FPGA) mounted on the printed circuit board.

As described above, when the OELD panel and the printed circuit board connected to the OLED panel are supported through the jig according to the present invention, the OLED panel can be used for a compensation process and an aging process .

In this case, it is possible to prevent the OLED panel from being broken due to deformation such as warpage even when the OLED panel is made to have a very thin thickness, and in the process of matching the timing controller of the compensation process with the OLED panel, Temperature heat is generated in the OLED panel itself or heat is generated in the OLED panel itself in the course of the aging process or the high temperature heat is generated in the driving circuit, , It is possible to prevent an erroneous operation or failure of the OLED panel from occurring.

In addition, even if a failure occurs in the course of the compensation process or the aging process, the defective OLED panel or the driving circuit can be easily separated and discarded, and the modulated OLED is not decomposed, Can be shortened and the efficiency of the process can be improved.

In particular, it is possible to dispose only defective OLED panels, which can reduce the process cost and time compared to the existing ones in which the defective OLED panels were discarded together with the back covers or cabinets that were modularized, and improve the efficiency of the process There is an effect that can be.

In addition, there is an effect that only the recently required OLED panel can be supplied to the consumer.

1 is a cross-sectional view schematically illustrating an OLED panel according to an embodiment of the present invention.
FIG. 2A is a perspective view schematically showing a jig according to an embodiment of the present invention; FIG.
FIG. 2B is a rear perspective view of FIG. 2A. FIG.
3A is a perspective view schematically showing a guide portion of a jig;
FIG. 3B is a perspective view schematically showing a printed circuit board fixed to the guide portion of FIG. 3A. FIG.
Figure 3c is a partial cross-sectional view of Figure 3b.
FIG. 3D is a perspective view schematically showing a printed circuit board protected by a heat spread; FIG.
FIG. 3E is a partial cross-sectional view of FIG. 3D. FIG.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.

1 is a cross-sectional view schematically showing an OLED panel according to an embodiment of the present invention.

As shown, the OLED panel 110 can be divided into a panel unit and a driving unit. In the panel unit, the substrate 101 on which the driving thin film transistor DTr and the light emitting diode E are formed is mounted on the in- Encapsulation. ≪ / RTI >

In other words, a semiconductor layer 104 is formed in the pixel region P on the substrate 101. The semiconductor layer 104 is made of silicon, and its central portion is composed of an active region 104a and active regions 104a, And source and drain regions 104b and 104c doped with a high concentration of impurities.

A gate insulating layer 105 is formed on the semiconductor layer 104.

On the gate insulating film 105, gate electrodes 107 corresponding to the active regions 104a of the semiconductor layer 104 and gate wirings extending in one direction, though not shown in the figure, are formed.

A first interlayer insulating film 106a and a gate insulating film 105 under the first interlayer insulating film 106a are formed on the entire upper surface of the gate electrode 107 and the gate wiring (not shown) And first and second semiconductor layer contact holes 109 exposing the source and drain regions 104b and 104c, respectively, located on both sides of the semiconductor layer 104a.

Next, on the first interlayer insulating film 106a including the first and second semiconductor layer contact holes 109, source and drain regions (the first and second semiconductor layer contact holes 109, Source and drain electrodes 108a and 108b which are in contact with the source and drain electrodes 104a and 104b and 104c are formed.

The second interlayer insulating film 106b having the drain contact hole 112 exposing the drain electrode 108b over the first interlayer insulating film 106a exposed between the source and drain electrodes 108a and 108b and the two electrodes 108a and 108b, An insulating film 106b is formed.

At this time, the semiconductor layer 104 including the source and drain electrodes 108a and 108b and the source and drain regions 104b and 104c contacting the electrodes 108a and 108b and the gate insulating film 104 formed on the semiconductor layer 104 The gate electrode 105 and the gate electrode 107 constitute a driving thin film transistor DTr.

On the other hand, although not shown in the drawing, data lines (not shown) are formed which cross the gate wiring (not shown) and define the pixel region P. The switching thin film transistor (not shown) has the same structure as the driving thin film transistor DTr and is connected to the driving thin film transistor DTr.

In the drawings, the switching thin film transistor (not shown) and the driving thin film transistor DTr are shown as an example of a co-planar type in which the semiconductor layer 104 is a polysilicon semiconductor layer. As a variation thereof, And a bottom gate type of impurity amorphous silicon.

A portion of the second interlayer insulating film 106b that is connected to the drain electrode 108b of the driving thin film transistor DTr and displays an image substantially includes a light emitting diode E A first electrode 111 constituting an anode is formed.

The first electrode 111 is formed for each pixel region P and a bank 119 is located between the first electrodes 111 formed for each pixel region P. [

That is, the first electrode 111 is formed in a structure in which the bank 119 is divided into the pixel regions P with the boundary portion for each pixel region P being separated.

An organic light emitting layer 113 is formed on the first electrode 111.

Here, the organic light emitting layer 113 may be a single layer made of a light emitting material. In order to increase the light emitting efficiency, a hole injection layer, a hole transport layer, an emitting material layer, An electron transport layer, and an electron injection layer.

In general, the organic light emitting layer 113 displays red (R), green (G), and blue (B) colors. (B) a separate organic material emitting a color is used in a pattern.

A second electrode 115, which forms a cathode, is formed on the entire surface of the organic light emitting layer 113.

At this time, the second electrode 115 has a bilayer structure and includes a semitransparent metal film in which a metal material having a low work function is thinly deposited. At this time, the second electrode 115 may have a bilayer structure in which a transparent conductive material is thickly deposited on the semitransparent metal film.

Therefore, the light emitted from the organic light emitting layer 113 is driven to the top emission type, which is emitted toward the second electrode 115.

As another example, the second electrode 115 may be formed of an opaque metal film, and light emitted from the organic light emitting layer 113 may be driven to a bottom emission type, which is emitted toward the first electrode 111 .

When a predetermined voltage is applied to the first electrode 111 and the second electrode 115 according to a selected color signal, the OLED panel 110 emits a positive voltage, which is injected from the first electrode 111, The excitons are transported to the organic light emitting layer 113 to form excitons. When the excitons are transited from the excited state to the ground state, light is emitted and emitted in the form of visible light.

At this time, the emitted light passes through the transparent second electrode 115 or the first electrode 111 and exits to the outside, so that the OLED panel 110 realizes an arbitrary image.

The substrate 101 and the encapsubstrate 102 are spaced apart from each other by an adhesive film 103 having an adhesive property, Respectively.

Thereby, the OLED panel 110 is encapsulated.

The adhesive film 103 protects the driving thin film transistor DTr and the light emitting diode E formed on the substrate 101 by preventing external moisture from penetrating into the light emitting diode E. In this case, (E) and is formed on the substrate (101).

The adhesive film 103 is formed of a selected one of OCA (Optical Cleared Adhesive), a thermosetting resin, and a thermosetting encapsulant to seal the driving thin film transistor DTr and the light emitting diode E on the substrate 101.

Meanwhile, the in-cap substrate 102 may be formed of glass, plastic material, stainless steel, or the like, and the substrate 101 is preferably formed of a metal foil including a metal material .

Here, when the substrate 101 is formed of a metal foil, the substrate 101 can be formed to have a thickness of 5 to 100 mu m, so that the substrate 101 can be formed to have a thinner thickness than the case of forming the substrate 101 by a glass or rolling method, The overall thickness of the OLED panel 110 can be reduced.

In addition, it is possible to improve the durability of the OLED panel 110 itself even though the thickness of the OLED panel 110 is reduced.

A driving unit connected to the printed circuit board 120 via a connection member 123 such as a flexible circuit board or a tape carrier package (TCP) is provided along one edge of the OLED panel 110.

The OLED panel 110 receives driving signals from driving circuit elements (not shown) mounted on the printed circuit board 120 through the connecting member 123 of the driving unit.

At this time, a plurality of drive circuits such as a timing controller and a field programmable gate array (FPGA) are mounted on the printed circuit board 120.

The OLED panel 110 is modularized through a back cover and a cabinet to complete an OLED.

Here, in the embodiment of the present invention, the OLED panel 110 is characterized in that the compensation process and the aging process are performed before modularization through the back cover and the cabinet.

However, the OLED panel 110 has a very thin thickness of 1 mm or less, which may cause the OLED panel 110 to be damaged by deformation such as warpage.

This is a serious problem in the process of moving the OLED panel 110 to perform the compensation process, the aging process, or the modularization process.

In addition, in the process of matching the timing controller of the compensation process with the OLED panel 110, high-temperature heat may be generated in the driving circuit mounted on the printed circuit board 120, and in the course of the aging process, The OLED panel 110 may generate heat at a high temperature or may generate heat at a high temperature in the driving circuit, causing malfunction or failure of the OLED panel 110.

In addition, since there is no separate fixing structure of the driving part connected to the OLED panel 110, it can cause damage to the driving circuit mounted on the printed circuit board 120 of the driving part in the process of moving the OLED panel 110 .

Therefore, the present invention can be applied to a compensating process (see FIG. 2A) before the OLED panel 110 is modularized through a back cover, a cabinet or the like, using a jig 200 as a moving equipment for moving the OLED panel 110 And the aging step can be carried out.

Thus, when the OLED panel 110 or the driving circuit is defective in the process of performing the compensation process and the aging process, the OLED panel 110 or the driving circuit in which the failure occurs can be easily separated and discarded And it is unnecessary to disassemble the modulated OLED, so that the process time can be shortened and the process efficiency can be improved.

Particularly, it is possible to dispose only the OLED panel 110 in which a defect has occurred, so that the process cost and time can be saved as compared with the conventional case in which the back cover or the cabinet, which modularized the OLED panel 110, The efficiency of the process can be improved.

In addition, it is possible to supply only the recently required OLED panel 110 to the consumer.

2A) for supporting the OLED panel 110 and a guide unit 220 (see FIG. 2A) for guiding the printed circuit board 120 connected to the OLED panel 110. The jig 200 , See FIG. 2B), which will be described in detail with reference to FIGS. 2A to 2B.

FIG. 2A is a perspective view schematically showing a jig according to an embodiment of the present invention, and FIG. 2B is a rear perspective view of FIG. 2A.

2A, the jig 200 is divided into a support portion 210 for supporting the OLED panel 110 and a guide portion 220 for guiding the printed circuit board 120 connected to the OLED panel 110. As shown in FIG. Wherein the support 210 includes a plate-like support plate 211 to which the OLED panel 110 is directly attached and supported and a support plate 211 which is formed along the edge of the support plate 211 to cover the edge of the OLED panel 110 And a frame 213.

At this time, the OLED panel 110 is attached and fixed to the support plate 211 using a magnet sheet (not shown).

1) of the OLED panel 110 is formed of a metal foil, the gap between the support plate 211 and the substrate (101 in FIG. 1) (Not shown), the OLED panel 110 is attached and fixed to the support plate 211 by the magnetic force of the magnet sheet (not shown).

A through hole 215 is formed in the support plate 211 so that the connection member 123 connected to the OLED panel 110 is extended to the back surface of the support plate 211 through the through hole 215.

The connection member 123 extending to the back surface of the support plate 211 is connected to the printed circuit board 120 fixed to the back surface of the support plate 211 as shown in FIG. And the position thereof is fixed by the guide portion 220 mounted on the back surface of the support plate 211.

The guide part 220 includes a vertical holding part 221, a horizontal holding part 222 and a heat spreader 223, which are arranged in the Z-axis direction defined in the drawing, And the horizontal holding part 222 serves to fix the printed circuit board 120 in the X axis direction defined in the drawing.

The heat spread 223 covers the printed circuit board 120 fixed on the back surface of the support plate 211 by the vertical holding portion 221 and the horizontal holding portion 222, It easily dissipates the heat of the generated high temperature to the outside. Let's take a closer look at this later.

The jig 200 is formed with a rigid bar 217 for improving the rigidity of the jig 200 itself along the rear edge of the jig plate 211 so that the jig 200 can stably fix the OLED panel 110 It is preferable to make it possible to support it.

That is, the OLED panel 110 according to the embodiment of the present invention can be supported by the jig 200 before being modularized into a back cover and a cabinet, so that the OLED panel 110 has a very thin thickness It is possible to prevent the OLED panel 110 from being damaged by deformation such as warpage.

In the process of matching the timing controller (not shown) of the compensation process with the OLED panel 110, high temperature heat is generated in the driving circuit mounted on the printed circuit board 120, or during the aging process, Even if the panel 110 generates heat at a high temperature or generates heat at a high temperature in the driving circuit, it is possible to easily discharge heat at a high temperature to the outside, thereby causing a malfunction or failure of the OLED panel 110 .

Accordingly, even if a failure occurs in the course of the compensation process or the aging process, the process time and the process cost can be shortened, and the efficiency of the process can be improved.

In addition, it is possible to supply only the recently required OLED panel 110 to the consumer.

3A is a perspective view schematically showing a guide part of a jig, and FIG. 3B is a perspective view schematically showing a printed circuit board fixed to the guide part of FIG. 3A.

FIG. 3C is a partial cross-sectional view of FIG. 3B, and FIG. 3D is a perspective view schematically illustrating a state in which the printed circuit board is protected by heat spread.

FIG. 3E is a partial cross-sectional view of FIG. 3D.

Prior to the description, the heat spreads of Figs. 3A to 3C are made of opaque materials, but are shown transparently for convenience of explanation.

3A, the guide unit 220 includes a vertical holding unit 222, a horizontal holding unit 221, and a heat spread 223. The horizontal holding unit 221 includes a support plate 211, A first guide rail 225 formed at a central portion of the support plate 211 along a first direction (X-axis direction) that is the longitudinal direction of the first guide rail 225 and a second guide rail 225 mounted to the first guide rail 225, And a pair of fixing parts 227 horizontally movable along the longitudinal direction.

Each of the pair of fixing portions 227 has a first horizontal portion 227a projecting from the first guide rail 225 perpendicularly to the Y axis direction defined in the drawing, And a fixed holder fixing portion 227d connected to the first fixing holder 227c. The first fixing holder 227c is composed of a first vertical portion 227b formed by a first vertical portion 227b.

The pair of fixing portions 227 are formed by inserting one end of each first horizontal portion 227a into a guide hole 225a formed along the longitudinal direction of the first guide rail 225. [

At this time, each first fixing holder 227c of the pair of fixing portions 227 is provided with a first pad 227e as an inner surface of the first horizontal portion 227a and the first vertical portion 227b.

The first pad 227e serves as a cushion capable of absorbing an external shock.

The fixed holder fixing portion 227d is formed in a screw shape and performs a screw motion in the Y axis direction defined by the drawing by rotation. That is, the fixed holder fixing portion 227d linearly moves at a constant rate in the axial direction while rotating about one axis as in the case of rotating the screw.

At this time, the guide hole 225a is formed with a step 225b along the edge of the guide hole 225a. The fixed holder fixing portion 227d is engaged with the step 225b by screw motion, 225). ≪ / RTI >

Therefore, as the position of the fixed holder fixing portion 227d is fixed, the position of the first fixing holder 227c connected to the fixing holder fixing portion 227d is also fixed, so that the pair of fixing portions 227 are fixed to the first And its position is fixed on the guide rail 225.

The vertical holding part 222 is positioned between the horizontal holding part 221 and the through hole 215 formed in the support plate 211 and is formed perpendicular to the horizontal holding part 221 to be movable in the second direction Z A second guide rail 224 formed along the axial direction of the first guide rail 224 and a spring 226 mounted inside the second guide rail 224 and a second fixed holder 228 provided at one end of the spring 226 .

The vertical holding part 222 is linearly moved along the longitudinal direction of the second guide rail 224 in the second guide rail 224 by the elastic force of the spring 226 .

The second fixing holder 228 includes a second vertical portion 228a connected to one end of the spring 226, a second horizontal portion 228b bent perpendicularly from the second vertical portion 228a, And a bent portion 228c bent perpendicularly from the first vertical portion 228b to face the second vertical portion 228a. The second horizontal portion 228b is configured to protrude from the second guide rail 224 in the Y axis direction defined by the drawing.

At this time, the second vertical portion 228a, the second horizontal portion 228b, and the bent portion 228c of the second fixing holder 228 may have a second pad (Not shown).

The heat spread 223 is hinged at one edge parallel to the longitudinal direction of the first guide rail 225 of the horizontal holding portion 221 in the form of a plate so that the vertical spreading portion 222 and the horizontal holding portion 221 It can be assembled to cover it.

The heat spread 223 may be made of any one of aluminum (Al), copper (Cu), zinc (Zn), silver (Ag), gold (Au) , And it is preferable to be formed of aluminum (Al) having high thermal conductivity, low weight, and low cost characteristics.

Alternatively, the heat spread 223 may be formed of electrolytic galvanized iron (EGI).

A heat dissipating member 223a is provided on the inner surface of the heat spread 223 so that the heat dissipating member 223a is made of copper (Cu), silver (Ag), aluminum (Al), iron (Fe), nickel Tungsten (W), or an alloy material containing at least one of these metals. The outer surface of the metal material may be any one of nickel (Ni), silver (Ag), and gold (Au) Or more of an alloy material that can be plated.

As another example, the heat radiating pad may be made of a silicone composition having excellent heat conduction characteristics. As another example, a heat radiation pad in which a heat transfer filler is contained in a resin composition such as epoxy may be provided.

Here, the heat transfer filler may be provided in the form of powder of a material having excellent thermal conductivity such as aluminum (Al), graphite, copper (Cu), or the like.

When the OLED panel 110 is attached and fixed to the front side of the jig plate 211 through the magnet sheet (not shown), the jig 200 is attached to the OLED panel 110 through the connection member 123 The circuit board 120 is fixed by the guide part 220 on the back surface of the jig plate 211. [

3B and 3C, the printed circuit board 120 is supported and fixed at one edge by a pair of fixing portions 227 of the horizontal holding portion 221, And the edge is supported and fixed by the second fixing holder 228 of the vertical holding portion 222. [

The first horizontal portion 227a of the first fixing holder 227c of the pair of fixing portions 227 supports the side surface of the one edge of the printed circuit board 120, The front surface of the one side of the printed circuit board 120 is partially guided.

The pair of fixing portions 227 are positioned on both sides of the longitudinal direction of the one edge of the printed circuit board 120 to support and guide the printed circuit board 120 so that one edge of the printed circuit board 120 is divided into a pair As shown in FIG.

The pair of fixing portions 227 are fixed in the first guide rail 225 through the fixing holder fixing portion 227d to stably support one edge of the printed circuit board 120. [

The second horizontal portion 228b of the second fixing holder 228 of the vertical holding portion 222 supports the side of the other edge of the printed circuit board 120 and the bent portion 228c is bent Thereby partially guiding the entire front surface of the other edge of the base 120.

The second fixing holder 228 of the vertical holding part 222 supports and guides the other edge of the printed circuit board 120 while being stretched by the elastic force of the spring 226, The other edge receives a force in the -Z axis direction defined by the drawing by the elastic force of the spring 226.

Accordingly, a force applied in the -Z-axis direction defined in the drawing to the printed circuit board 120 is transmitted to the one edge of the printed circuit board 120. At this time, one edge of the printed circuit board 120 is held by the horizontal holding portion The printed circuit board 120 is firmly fixed by the first and second fixing holders 227c and 228 as it is supported and guided by the first fixing holder 227c of the printed circuit board 221. [

The pair of fixing portions 227 can horizontally move along the longitudinal direction of the first guide rail 225 corresponding to the length of one edge of the printed circuit board 120, Can be fixed.

The second fixing holder 228 of the vertical holding part 222 is fixed to the second guide rail 224 by the elastic force of the spring 226 corresponding to the height of the printed circuit board 120 from one edge to the other edge. So that the printed circuit board 120 having various heights can be fixed.

At this time, the first and second vertical portions 227b and 228a and the first and second horizontal portions 227a and 228b of the first and second fixing holders 227c and 228, which are in contact with the printed circuit board 120, The first and second fixing holders 227c and 228 are formed on the inner surface of the bent portion 228c by pads 227e and 228d serving as a cushion for absorbing an external impact, It is possible to prevent the printed circuit board 120 from being damaged.

When the printed circuit board 120 is fixed through the guide unit 220 provided on the back surface of the jig plate 211 of the jig 200 as described above and the heat spread 223 is rotated So that the heat spread 223 covers and covers the printed circuit board 120.

Thus, the printed circuit board 120 is protected from the outside.

Further, when high-temperature heat is generated from the printed circuit board 120, the high-temperature heat generated from the printed circuit board 120 is rapidly discharged to the outside through the heat spread 223 made of a metal having high thermal conductivity .

Particularly, since the heat dissipating member 223a is provided on the inner surface of the heat spread 223 corresponding to a field programmable gate array (FPGA) that generates heat at the highest temperature on the printed circuit board 120, The heat of the high temperature generated on the printed circuit board 120 can be released to the outside more quickly.

When the OELD panel 110 and the printed circuit board 120 connected to the OLED panel 110 are supported through the jig 200 as described above, the OLED panel 110 can be divided into a back cover and a cabinet, The aging process can be performed.

At this time, even if the OLED panel 110 is formed to have a very thin thickness, it is possible to prevent the OLED panel 110 from being damaged due to deformation such as warpage, and to match the timing controller of the compensation process with the OLED panel 110 Temperature heat is generated in the driving circuit mounted on the printed circuit board 120 or high temperature heat is generated in the OLED panel 110 during the aging process or high temperature heat is generated in the driving circuit It is possible to easily discharge the heat of the high temperature to the outside, thereby preventing the OLED panel 110 from malfunctioning or failing.

In addition, even if a defect occurs in the process of performing the compensation process or the aging process, the OLED panel 110 or the driving circuit in which a defect has occurred can be easily separated and discarded, and the module OLED is not disassembled , The process time can be shortened, and the efficiency of the process can be improved.

Particularly, it is possible to dispose only the OLED panel 110 in which a defect has occurred, so that the process cost and time can be saved as compared with the conventional case in which the back cover or the cabinet, which modularized the OLED panel 110, The efficiency of the process can be improved.

In addition, it is possible to supply only the recently required OLED panel 110 to the consumer.

The present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the spirit of the present invention.

110: OLED panel
120: printed circuit board, 123: connecting member
200: jig
210: support part (211: support plate, 213: frame)
215: Through hole, 217: Rigid bar
220: guide part (221: horizontal holding part; 222: vertical holding part; 223: heat spread)

Claims (16)

A plate-shaped support plate having a through hole and an OLED panel attached to the front surface;
A horizontal holding part provided on a back surface of the support plate and supporting and guiding one edge of the printed circuit board connected to the OLED panel;
A vertical holding part for supporting and guiding the other edge opposite to the one edge of the printed circuit board;
A heat spread covering the printed circuit board
And an organic electroluminescent device.
The method according to claim 1,
Wherein the printed circuit board is connected to the OLED panel through a connection member and the connection member extends to the backside of the support plate through the through hole.
The method according to claim 1,
Wherein the horizontal holding portion includes a first guide rail which crosses the back surface of the support plate along a first direction and a pair of fixing portions which are horizontally movable along the longitudinal direction of the first guide rail, equipment.
The method of claim 3,
Wherein each of the pair of fixing portions includes a first fixing holder including a first horizontal portion projecting vertically from the first guide rail and a first vertical portion vertically bent upward from the first horizontal portion, Wherein the first vertical portion supports a side of one edge of the printed circuit board, and the first vertical portion guides a front edge of the one edge of the printed circuit board.
5. The method of claim 4,
And a pad serving as a cushion is provided on the inner surface of the first horizontal portion.
5. The method of claim 4,
Wherein each of the pair of fixing portions includes a fixing holder fixing portion connected to the first fixing holder, and the fixing holder fixing portion is a fixing portion for fixing the organic light emitting diode Moving equipment of the panel.
The method according to claim 6,
Wherein the fixed holder fixing part is flanked with a step formed in a guide hole of the first guide rail and fixed in the first guide rail.
The method according to claim 6,
Wherein the pair of fixing portions are horizontally moved along a longitudinal direction of the first guide rail corresponding to a length of one edge of the printed circuit board.
The method according to claim 1,
Wherein the vertical holding part includes a second guide rail formed on a rear surface of the support plate along a second direction perpendicular to the first direction between the horizontal holding part and the through hole, And a second fixing holder provided at one end of the spring and linearly moving along the longitudinal direction of the second guide rail.
10. The method of claim 9,
The second fixed holder includes a second vertical portion connected to one end of the spring, a second horizontal portion bent perpendicularly from the second vertical portion and vertically protruding from the second guide rail, And a bent portion bent perpendicularly to face the second vertical portion.
10. The method of claim 9,
Wherein the second fixing holder linearly moves along the longitudinal direction of the second guide rail by the elastic force of the spring corresponding to the height from one edge to the other edge of the printed circuit board, .
11. The method of claim 10,
And a pad serving as a cushion is provided on the inner surface of the second vertical portion and the second horizontal portion and the bent portion.
The method according to claim 1,
Wherein the heat spread is hinged at one edge parallel to the longitudinal direction of the horizontal holding part and is hinged to cover and cover the printed circuit board.
14. The method of claim 13,
The heat spread may be made of at least one of aluminum (Al), copper (Cu), zinc (Zn), silver (Ag), gold (Au), iron (Fe), electrolytic galvanized iron ). ≪ / RTI >
14. The method of claim 13,
A heat dissipating member is provided on the inner surface of the heat spread,
The heat dissipating member may be made of at least one of copper (Cu), silver (Ag), aluminum (Al), iron (Fe), nickel (Ni), and tungsten (W)
The outer surface is made of at least one of nickel (Ni), silver (Ag), and gold (Au)
Silicone composition,
A moving equipment for a panel for an organic light emitting element in which a resin composition contains a heat transfer filler containing aluminum (Al), graphite, and copper (Cu).
16. The method of claim 15,
Wherein the heat dissipation member is positioned corresponding to a field programmable gate array (FPGA) mounted on the printed circuit board.

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