KR20100123465A - Organic light emitting diode display and manufacturing method thereof - Google Patents

Abstract

PURPOSE: An organic light emitting diode display and a manufacturing method thereof are provided to improve the capacitance of an organic luminescence display by applying high current to a test wring. CONSTITUTION: A plurality of unit cells including display elements are formed on a substrate. A first wiring is formed between the unit cells and inspects the electrical characteristic of a display device. The substrate is combined with a sealing substrate. A scribe line is formed on the substrate and the sealing substrate to be overlapped with the first wiring.

Description

Organic light-emitting display device and manufacturing method therefor {ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF}

The present invention relates to an organic light emitting display device and a method of manufacturing the same, and more particularly, to a panel of the organic light emitting display device and a method of manufacturing the same.

Recently, display panels using organic light emitting diodes (OLEDs) have been attracting attention due to rapidly developing semiconductor technologies among various display panels applied to display devices.

In an active driving type organic light emitting display using organic light emitting diodes, pixels, which are basic units of image expression, are arranged on a substrate in a matrix manner, and thin film transistors (TFTs) and organic light emitting diodes are disposed for each pixel. Control the pixels independently. The organic light emitting device includes a hole injection electrode, an organic emission layer, and an electron injection electrode, and is formed by energy generated when an exciton generated by combining electrons and holes in an organic emission layer falls from an excited state to a ground state. Light emission is achieved.

In this way, the organic light emitting diode display has a self-luminous property and, unlike a liquid crystal display, does not require a separate light source, thereby reducing thickness and weight. In addition, the organic light emitting diode display has high quality characteristics such as low power consumption, high luminance, and high response speed, and thus is suitable for use in mobile electronic devices.

In general, an organic light emitting diode display includes a unit cell of a display element including a display area in which light emitting elements are formed on a mother substrate, and a pad area in which pads are formed so that wirings and driving circuit elements of the display area are connected. After forming a plurality, the sealing substrate is adhered to the mother substrate with a sealant, and then the mother cell and the sealing substrate are scribed to prepare the unit cells separately. The separate unit cell is electrically connected to an external circuit board such as a printed circuit board in the pad area.

Here, before the unit cells are individually separated, an electrical property (for example, a lighting test) of the display device is inspected to lower the defective rate of the product. For this purpose, test wirings are formed on the mother substrate.

Meanwhile, in the scribing process, foreign substances such as glass chips are generated, causing defects in the organic light emitting display device, such as causing scratches on the pad area or damage to a mechanically vulnerable part during the scribing process. There is a case.

In order to prevent such a defect, the inspection wiring is formed so as not to overlap with the scribing line, whereby the inspection wiring is formed in the space between the display region where the display elements are formed and the scribing line, and thus spatially restricted. The line width becomes smaller. In this case, since the resistance of the inspection wiring is large, the inspection wiring can be easily generated by current applied during the inspection of the electrical characteristics of the display element or the aging process, and this result prevents the inspection of the display element. .

An organic light emitting display device having an improved structure and a method of manufacturing the same are provided to minimize heat generation of an inspection wire.

In a method of manufacturing an organic light emitting display device according to an embodiment of the present invention, a plurality of unit cells including a display element are formed on a parent substrate, and first wirings for inspecting electrical characteristics of the display element between the unit cells. And a sealing substrate bonded to the mother substrate, and a scribing line is formed on the mother substrate and the sealing substrate so as to overlap the first wiring, and the mother substrate is formed along the scribing line. Cutting the encapsulation substrate to separate the plurality of unit cells.

The first wiring may be formed over the adjacent unit cells.

A second wiring for transmitting an electrical signal to the display element may be formed in the same width as that of the first wiring.

The unit cell may include a display area in which the display element is formed and a pad area in which pads are electrically connected to the second wiring and the printed circuit board.

The first wiring may not be electrically connected to the printed circuit board.

The method may further include aging the unit cells using the first wiring.

The cutting of the mother substrate and the encapsulation substrate may include performing a first cut on the mother substrate and the encapsulation substrate using a heel or a laser, and applying a physical force to the mother substrate and the encapsulation substrate to perform the second cut. It may include a step.

An organic light emitting diode display according to an exemplary embodiment includes a first substrate including a display area and a pad area, a second substrate disposed opposite to the first substrate, and between the first substrate and the second substrate. The first substrate and the second substrate to overlap the cut surfaces of the first substrate and the second substrate in a direction perpendicular to a length direction of the sealing member and the pad region, the second substrate being coupled to the first substrate and the second substrate. An inspection first wiring disposed between the second substrates is included.

The pad area may include a second wire formed in the display area and a pad electrically connected to the printed circuit board, and the first wire may not be electrically connected to the printed circuit board.

The first wiring may be formed of the same layer as the second wiring.

The organic light emitting diode display may be portable.

According to an embodiment of the present invention, by reducing the resistance by increasing the line width of the inspection wiring for inspecting the electrical characteristics of the organic light emitting display panel per unit cell in the parent substrate unit to minimize the heat generation of the inspection wiring during the lighting inspection and aging process can do. As a result, a high current power source can be applied to the inspection wiring, and the lighting inspection or aging processing time can be shortened, and the capacitance of the organic light emitting display panel can be improved.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

In order to clearly describe the present invention, parts irrelevant to the description are omitted, and like reference numerals designate like elements throughout the specification.

In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. Whenever a portion such as a layer, film, region, plate, or the like is referred to as being "on" or "on" another portion, it includes not only the case where it is "directly on" another portion but also the case where there is another portion in between. On the contrary, when a part is "just above" another part, there is no other part in the middle.

In addition, when a part of the specification is said to be "connected" to another part, this includes the case where it is "directly connected". In addition, when a part is said to "include" a certain component, this means that it may further include other components, except to exclude other components unless otherwise stated.

1 is a flowchart schematically illustrating a manufacturing process of an organic light emitting diode display according to an exemplary embodiment of the present invention.

Referring to FIG. 1, a method of manufacturing an organic light emitting diode display according to an exemplary embodiment includes a plurality of display elements (hereinafter, referred to as an organic light emitting display panel) on a mother substrate, and the organic light emitting display panel may be applied to a panel of the organic light emitting diode display. Forming a first wiring (hereinafter, referred to as an “inspection wiring”) between the display elements, bonding the mother substrate and an encapsulation substrate disposed opposite to each other, and inspecting the same. Inspecting the electrical characteristics of the organic light emitting display panels using the wiring lines, forming a scribing line on the mother substrate and the encapsulation substrate, and performing a braking operation along the scribing lines. Separating the panels.

2 is a partial plan view schematically illustrating a state of a parent substrate 10 in which a plurality of organic light emitting display panels 100 are formed.

Referring to FIG. 2, a plurality of display elements, for example, an organic light emitting display panel 100, is formed on the mother substrate 10. In the organic light emitting display panel 100, a display area DA in which an actual image is displayed is formed. For example, when the organic light emitting display panel 100 has an active matrix (AM) structure, the organic light emitting diode (not shown) and the organic light emitting diode are driven on the mother substrate 10 in response to the display area DA. A thin film transistor (not shown) and a wire (second wire) (not shown) electrically connected to them may be formed. The pad area PA in which the pad 102 (shown in FIG. 5) extending from the wirings of the display area DA is formed is formed outside the display area DA.

An inspection wiring (first wiring) 20 is formed between the organic light emitting display panels 100. The inspection wiring 20 is formed on the mother substrate 10 along the y-axis direction of FIG. 2, and is arranged perpendicular to the pad regions PA of the organic light emitting display panels 100.

The inspection wiring 20 is formed over the organic light emitting display panels 100. For example, one inspection line 20 may be located in adjacent organic light emitting display panels 100.

As a result, the inspection wiring 20 is positioned to overlap the scribing line L1 in the y-axis direction formed on the mother substrate 10. In this case, since the test wiring 20 is not restricted in space compared with the case where the test wiring 20 is formed between the display area DA and the scribing line L1, the line width W of the test wiring 20 is increased. Can be formed. The inspection wiring 20 may be formed to have substantially the same line width, for example, 50 to 100 μm, as wires (not shown) formed in the display area DA of the organic light emitting display panel 100.

3 is a perspective view illustrating a state in which the mother substrate 10 and the encapsulation substrate 30 shown in FIG. 2 are bonded to each other.

Referring to FIG. 3, an encapsulation substrate 30 having a size corresponding to the parent substrate 10 is prepared, and the parent substrate 10 and the encapsulation substrate 30 are bonded to each other using a sealing member (not shown). . After that, as shown in FIG. 3, a part of the encapsulation substrate 30 is removed to expose the inspection wiring 20 formed on the mother substrate 10.

The exposed inspection wiring 20 receives a signal from the outside through a separate transmission means, for example, a probe (not shown), and the signal is connected to each organic light emitting display panel 100. Electrical properties such as a lighting test may be inspected with respect to the organic light emitting display panels 100 formed on the mother substrate 10 by supplying the light source. That is, the inspection wiring 20 may be used to inspect whether the organic light emitting display panels 100 are defective in the parent substrate 10.

In this embodiment, the inspection wiring 20 has a wide line width regardless of overlapping with the scribing line L1, thereby reducing the resistance of the inspection wiring 20, so that a current is applied to the inspection wiring 20. Even if is applied, it does not easily generate heat. In particular, compared with the case where the inspection wiring is narrowly formed so as not to overlap with the scribing line L1, even if a high current power is applied to the inspection wiring 20, it does not easily generate heat.

On the other hand, since the organic light emitting display panel 100 has a short life span of the organic material itself, the characteristics of the device must be stabilized by improving the interface characteristics of the electrode and the organic material formed on the organic light emitting display panel 100. That is, prior to driving the organic light emitting display panel 100, the so-called aging process may be performed to stabilize the organic light emitting display panel 100 in a short time, thereby improving performance of the device and extending the life of the device. do.

In the present exemplary embodiment, not only the electrical characteristics of each organic light emitting display panel 100 are inspected by using the test wiring 20, but the stabilization process of the organic light emitting display panel 100 is performed by using currents supplied to the respective wirings. Can be done. At this time, since the line width of the inspection wiring 20 is wide and a high current power can be applied, an aging process can be performed within a short time. In addition, since the resistance of the test wiring 20 and the aging process time are reduced, parasitic capacitance generated in the insulating layer or the like in the organic light emitting display panel 100 can be reduced. Accordingly, capacitance of the organic light emitting display panel 100 may be improved.

When the lighting test and the aging process are completed with respect to the organic light emitting display panels 100 in the parent substrate 10 state, the organic light emitting display panel 100 is separately separated. As shown in FIG. 3, scribing lines L1, L2, and L3 are formed on the mother substrate 10 and the encapsulation substrate 30, respectively.

A scribing line L1 is formed in the parent substrate 10 along the x-axis and y-axis directions of FIG. 3. Here, the scribing line L1 may be formed on the outer surface of the mother substrate 10 on which organic light emitting devices (not shown) are not formed. The scribing process uses a diamond wheel or a laser to the outer surface of the parent substrate 10 to form a plurality of scribing lines L1 side by side along one direction, for example, in the x-axis direction. A plurality of scribing lines L1 ′ are formed side by side in the direction crossing the scribing lines L1, that is, the y-axis direction, and the mother substrate 10 is primarily cut.

Scribing lines L2 and L3 are formed in the encapsulation substrate 30 along the x-axis direction of FIG. 3. Here, the scribing line L3 is formed to expose the pad area PA (shown in FIG. 4) of the organic light emitting display panels 100.

As described above, the scribing lines L1, L1 ′, L2, and L3 are formed on the mother substrate 10 and the encapsulation substrate 30 to form the mother substrate 10 and the encapsulation substrate 30. After the cutting, the breaking operation is performed to separate each region along the scribing lines L1, L1 ', L2, and L3. In this case, the scribing lines L1, L1 ′, L2, and L3 are intensively stressed to separate the organic light emitting display panel 100, and serve as display elements.

4 is a perspective view showing an organic light emitting display panel 100 manufactured by a manufacturing method according to an embodiment of the present invention, Figure 5 is a state in which a printed circuit board is connected to the organic light emitting display panel 100 of FIG. It is a perspective view shown.

4 and 5, the display panel 100 includes a first substrate 10 ′ and a second substrate 30 ′ having a size smaller than that of the first substrate 10 ′. In the organic light emitting display panel 100, a display area DA in which an actual image is displayed is formed, and a pad area PA is formed in a portion extending from the second substrate 30 ′ on the first substrate 10 ′. do. The pad 102 extending from the wiring of the display area DA is positioned in the pad area PA, and a part of the inspection wiring 20 formed at both edges of the first substrate 10 ′ is exposed. The pads 102 are electrically connected to the printed circuit board 18 through the flexible printed circuit board 16.

The integrated circuit chip 12 is mounted in the pad area PA of the first substrate 10 ′ to control the organic light emitting display panel 100. At this time, the integrated circuit chip 12 is mounted so as to be positioned only on the pads 102 of the first substrate 10 ′ and is not electrically connected to the inspection wiring 20 of the first substrate 10 ′.

The integrated circuit chip 12 generates a plurality of timing signals for applying the data driving signal and the gate driving signal at the direct time. The signals are applied to data lines and gate lines of the organic light emitting display panel 100, respectively. A protective film 14 is formed around the integrated circuit chip 12 to protect the integrated circuit chip 12.

Electronic components (not shown) for processing driving signals are mounted on the printed circuit board 18, and connectors (not shown) for transmitting external signals to the printed circuit board 18 are installed.

The display panel 100 formed as described above is accommodated in a bezel (not shown) or the like and installed in a case constituting a real product (eg, a cellular phone) to display an image desired by a user.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the range of.

1 is a flowchart illustrating a manufacturing method of an organic light emitting diode display according to an exemplary embodiment of the present invention.

FIG. 2 is a partial plan view schematically illustrating a mother substrate state during a process of manufacturing an organic light emitting display device according to the manufacturing method of FIG. 1.

FIG. 3 is a perspective view of the mother substrate and the sealing substrate of FIG. 2 bonded to each other. FIG.

4 is a perspective view of an organic light emitting display panel according to an embodiment of the present invention.

5 is a perspective view of a state in which a printed circuit board is connected to the organic light emitting display panel of FIG. 4.

<Description of reference numerals for the main parts of the drawings>

100; An organic light emitting display panel 10; Substrate

30; Sealing substrate 20; Inspection wiring

Claims (11)

A plurality of unit cells including display elements are formed on the mother substrate, Forming first wirings between the unit cells to inspect electrical characteristics of the display device; Bonding the sealing substrate to the mother substrate, Forming a scribing line on the mother substrate and the encapsulation substrate so as to overlap the first wiring; The plurality of unit cells are separated by cutting the mother substrate and the encapsulation substrate along the scribing line. A method of manufacturing an organic light emitting display device comprising the step. The method of claim 1, And forming the first wiring over the adjacent unit cells. The method of claim 1, And forming a second wiring that transmits an electrical signal to the display element to the mother substrate, the second wiring having the same width as that of the first wiring. The method of claim 3, The unit cell may include a display area in which the display element is formed and a pad area in which pads are electrically connected to the second wiring and the printed circuit board. The method of claim 4, wherein The method of claim 1, wherein the first wiring is not electrically connected to the printed circuit board. The method of claim 1, And aging the unit cells by using the first wiring. The method of claim 1, The cutting of the mother substrate and the encapsulation substrate may include performing a first cut on the mother substrate and the encapsulation substrate using a heel or a laser, and applying a physical force to the mother substrate and the encapsulation substrate to perform the second cut. A method of manufacturing an organic light emitting display device comprising the step. A first substrate including a display area and a pad area; A second substrate disposed opposite the first substrate; A sealing member disposed between the first substrate and the second substrate to bond the first substrate and the second substrate; And First wiring for inspection disposed between the first substrate and the second substrate to overlap the cut surfaces of the first substrate and the second substrate in a direction perpendicular to the longitudinal direction of the pad region. An organic light emitting display device comprising a. The method of claim 8, And a pad electrically connected to a second wiring formed in the display area and a printed circuit board, and the first wire is not electrically connected to the printed circuit board. The method of claim 8, The first wiring is formed of the same layer as the second wiring. The method of claim 8, The organic light emitting diode display is a portable organic light emitting diode display.

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