KR102547014B1 - Organic light emitting diode - Google Patents

Abstract

The present invention relates to organic light emitting diodes (OLEDs).
A feature of the present invention is that the back cover supporting the OLED panel is provided with a plurality of wire patterns, and the first and second power sources are simultaneously supplied to both edges of the OLED panel facing each other through the wire patterns. Therefore, even if the number of pixels increases due to the size and/or high resolution of the OLED, power can be stably supplied to the entire OLED panel.
In particular, the OLED of the present invention does not require a separate FFC while supplying stable power to the OLED panel, so it is possible to prevent screen stains caused by a ringing phenomenon caused by the separately provided FFC, and also to prevent the occurrence of screen stains due to the FFC. By preventing the occurrence of the lifting phenomenon of the OLED panel, the occurrence of poor quality or damage of the OLED panel can also be prevented.
In addition, through FFC deletion, process efficiency can be improved by minimizing process cost and process time due to modularization of OLED.

Description

Organic light emitting device {Organic light emitting diode}

The present invention relates to organic light emitting diodes (OLEDs).

Organic light emitting diodes (OLEDs) consist of a hole injection electrode, an organic light emitting layer, and an electron injection electrode. Excitons generated by combining electrons and holes inside the organic light emitting layer fall from an excited state to a ground state Light is emitted by the energy generated when

Due to this principle, OLED has a self-luminous property and, unlike a liquid crystal display device, does not require a separate light source, so its thickness and weight can be reduced. In addition, since OLED exhibits high quality characteristics such as low power consumption, high luminance and high response speed, it is considered as a next-generation display device for portable electronic devices.

In general, an OLED includes an OLED panel including organic light emitting layers therein, a cabinet for guiding the edge of the OLED panel, a back cover for supporting the OLED panel at the rear of the OLED panel, and a cover for protecting the OLED panel at the front of the OLED panel. Includes a cover window.

On the other hand, as the size and resolution of these OLEDs have recently increased, the number of pixels has increased, so that a sufficient amount of common voltage and driving voltage must also be supplied.

To this end, in order to supply stable power, a common voltage or driving voltage is supplied from both edges of the OLED panel using a plurality of flexible flat cables (FFCs) prepared separately from the driving unit.

However, as a plurality of FFCs provided separately are located on the back side of the OLED panel, steps are formed in the back cover in response to the plurality of FFCs in consideration of the step margin caused by the FFCs. On the OLED panel supported by the cover, a screen stain is caused by a ringing phenomenon caused by a region where a step is formed and a region where a step is not formed.

In addition, a lifting phenomenon of the OLED panel may occur due to FFC having a flexible property, which causes poor image quality or damage of the OLED panel.

The present invention is to solve the above problems, and a first object is to supply stable power to an OLED panel.

In addition, the second purpose is to prevent screen smudges caused by the sound bullying phenomenon through FFC deletion, and to prevent poor image quality or damage to the OLED panel by improving the lifting phenomenon of the OLED panel.

In addition, the third object is to improve the efficiency of the process by minimizing the process cost and process time due to modularization of OLED.

In order to achieve the object as described above, the present invention provides an OLED panel, first and second printed circuit boards connected along edges of both sides facing each other of the OLED panel, the OLED panel is seated and supported, and the inner surface It provides an organic light emitting device including a back cover provided with a plurality of wire patterns electrically connecting the first and second printed circuit boards.

As described above, according to the present invention, the back cover supporting the OLED panel is provided with a plurality of wire patterns, and the first and second power sources are simultaneously supplied to both edges of the OLED panel facing each other through the wire patterns, Even if the number of pixels increases due to the size and/or high resolution of the OLED, there is an effect of stably supplying power to the entire OLED panel.

In particular, by not requiring a separate FFC while supplying stable power to the OLED panel, there is an effect of preventing the occurrence of screen smudges due to the ringing phenomenon caused by the separately provided FFC, and also the OLED panel due to the FFC. By preventing the occurrence of the lifting phenomenon, there is an effect that can also prevent the occurrence of poor image quality or damage of the OLED panel.

In addition, through FFC deletion, there is an effect of improving process efficiency by minimizing process cost and process time due to modularization of OLED.

1 is a perspective view schematically illustrating an OLED according to an embodiment of the present invention;
Figure 2 is a cross-sectional view schematically showing the OLED panel of Figure 1;
Figure 3a is a perspective view schematically showing a back cover of an OLED according to an embodiment of the present invention.
Figure 3b is a cross-sectional view schematically showing a portion of Figure 3a.
FIG. 4 is a perspective view schematically showing how first and second printed circuit boards according to an embodiment of the present invention and the conductive wire patterns of the back cover are connected to each other; FIG.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.

1 is a perspective view schematically showing an OLED according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view schematically showing the OLED panel of FIG. 1 .

As shown, the OLED 100 includes an OLED panel 110 for realizing an image, a cabinet 120 for guiding the edge of the OLED panel 110, and a back cover for supporting the OLED panel 110. (130) and a cover window (140) for protecting the OLED panel (110).

At this time, if the direction in the drawing is defined for convenience of description, the OLED panel 110 is placed in a state where the cabinet 120 surrounds the edge of the OLED panel 110 under the premise that the display surface of the OLED panel 110 faces forward. The back cover 130 is located at the rear of the, and the cover window 140 is located at the front of the OLED panel 110, and is combined and integrated from the front and rear.

Here, with reference to FIG. 2 , the OLED panel will be examined in detail.

In the OLED panel 110, the substrate 101 on which the driving thin film transistor DTr and the light emitting diode E are formed is encapsulated by the encapsulation substrate 102.

That is, the semiconductor layer 104 is formed in the pixel region P on the substrate 101. The semiconductor layer 104 is made of silicon, and the central portion thereof is formed by the active region 104a constituting a channel and both sides of the active region 104a. It consists of source and drain regions 104b and 104c doped with high-concentration impurities.

A gate insulating film 105 is formed above the semiconductor layer 104 .

A gate electrode 107 and a gate wiring extending in one direction (not shown) are formed above the gate insulating film 105 to correspond to the active region 104a of the semiconductor layer 104 .

In addition, a first interlayer insulating film 106a is formed on the entire upper surface of the gate electrode 107 and the gate wiring (not shown), and at this time, the first interlayer insulating film 106a and the gate insulating film 105 below the active region 104a) first and second semiconductor layer contact holes 109 exposing source and drain regions 104b and 104c located on both sides, respectively.

Next, the upper portion of the first interlayer insulating film 106a including the first and second semiconductor layer contact holes 109 is spaced apart from each other and exposed through the first and second semiconductor layer contact holes 109 ( Source and drain electrodes 108a and 108b contacting 104b and 104c, respectively, are formed.

And, a second interlayer having a drain contact hole 112 exposing the drain electrode 108b above the first interlayer insulating film 106a exposed between the source and drain electrodes 108a and 108b and the two electrodes 108a and 108b. An insulating film 106b is formed.

At this time, the semiconductor layer 104 including the source and drain electrodes 108a and 108b and the source and drain regions 104b and 104c in contact with the electrodes 108a and 108b and a gate insulating film formed on the semiconductor layer 104 105 and the gate electrode 107 form a driving thin film transistor (DTr).

Meanwhile, although not shown in the drawing, a data line (not shown) intersecting with a gate line (not shown) to define the pixel region P is formed. Also, the switching thin film transistor (not shown) has the same structure as the driving thin film transistor DTr and is connected to the driving thin film transistor DTr.

In addition, the switching thin film transistor (not shown) and the driving thin film transistor (DTr) are shown as an example of a co-planar type in which the semiconductor layer 104 is made of a polysilicon semiconductor layer in the drawing, and as a modification thereof, pure And it may be formed as a bottom gate type made of amorphous silicon of impurities.

In addition, it is connected to the drain electrode 108b of the driving thin film transistor DTr, and a light emitting diode (E As one component constituting the ), a first electrode 111 constituting an anode is formed.

The first electrodes 111 are formed for each pixel region P, and a bank 119 is positioned between the first electrodes 111 formed for each pixel region P.

That is, the first electrode 111 is formed in a structure separated for each pixel region P by using the bank 119 as a boundary for each pixel region P.

An organic emission layer 113 is formed on the first electrode 111 .

Here, the organic light emitting layer 113 may be composed of a single layer made of a light emitting material, and to increase light emitting efficiency, a hole injection layer, a hole transport layer, an emitting material layer, and an electron It may be composed of multiple layers of an electron transport layer and an electron injection layer.

The organic light emitting layer 113 expresses red (R), green (G), and blue (B) colors. In a general method, red (R), green (G), and blue colors are displayed for each pixel area (P). (B) Separate organic materials (113a, 113b, 113c) emitting color are patterned and used.

In addition, a second electrode 115 forming a cathode is formed on the upper side of the organic light emitting layer 113 .

At this time, the second electrode 115 has a double layer structure and includes a translucent metal film in which a metal material having a low work function is thinly deposited. In this case, the second electrode 115 may have a two-layer structure in which a transparent conductive material is thickly deposited on a translucent metal film.

Accordingly, light emitted from the organic light emitting layer 113 is driven in a top emission type that is emitted toward the second electrode 115 .

Alternatively, the second electrode 115 may be formed of an opaque metal film, and light emitted from the organic light emitting layer 113 may be driven in a bottom emission type that is emitted toward the first electrode 111 .

When a predetermined voltage is applied to the first electrode 111 and the second electrode 115 according to the selected color signal, the OLED panel 110 generates holes injected from the first electrode 111 and the second electrode 115. Electrons provided from are transported to the organic light emitting layer 113 to form excitons, and when these excitons transition from an excited state to a ground state, light is generated and emitted in the form of visible light.

At this time, since the emitted light passes through the transparent second electrode 115 or the first electrode 111 and goes out, the OLED panel 110 implements an arbitrary image.

In addition, an encapsulation substrate 102 is provided above the driving thin film transistor DTr and the light emitting diode E, and the substrate 101 and the encapsulation substrate 102 are spaced apart from each other through an adhesive film 103 having adhesive properties. become and coalesce

Through this, the OLED panel 110 is encapsulated.

At this time, the adhesive film 103 is a film that protects the driving thin film transistor DTr and the light emitting diode E formed on the substrate 101 by preventing external moisture from penetrating into the light emitting diode E. It surrounds (E) and is formed on the substrate 101.

The adhesive film 103 is formed of one selected from OCA (Optical Cleared Adhesive), a thermosetting resin, and a thermosetting encapsulant to seal the driving thin film transistor DTr and the light emitting diode E on the substrate 101 .

Meanwhile, the substrate 101 and the encapsulation substrate 102 may be formed of glass, plastic material, stainless steel, metal foil, or the like as a material.

Here, when the substrate 101 and the encapsulation substrate 102 are formed with metal foil, they can be formed to have a thickness of 5 to 100 μm, and the substrate 101 and the encapsulation substrate 102 are formed by a glass or rolling method. Since it can be formed with a thinner thickness than in the case of doing so, the overall thickness of the OLED panel 110 can be reduced.

In addition, durability of the OLED panel 110 itself can be improved despite reducing the thickness of the OLED panel 110 .

Along both edges of the OLED panel 110 facing each other, first and second printed circuit boards 118a, 118b) is connected.

The OLED panel 110 receives driving signals from driving circuit elements (not shown) mounted on the first and second printed circuit boards 118a and 118b.

The first and second printed circuit boards 118a and 118b are brought into close contact with the rear surface of the OLED panel 110 through the connection member 116 during the modularization process.

The OLED panel 110 is finally modularized through the cabinet 120, the back cover 130, and the cover window 140, and the cabinet 120 has a square frame shape surrounding the edge of the OLED panel 110.

The cabinet 120 is seated on the back cover 130. The back cover 130 has a plate shape covering the rear surface of the OLED panel 110 and has high thermal conductivity of aluminum (Al) or copper (Cu). ), zinc (Zn), silver (Ag), gold (Au), iron (Fe), or an alloy of the above metals, which has high thermal conductivity, low light weight, and low cost. Aluminum ( Al) is preferred.

Alternatively, the back cover 130 may be formed of electrolytic galvanized iron (EGI).

At this time, on the inside of the back cover 130, first and second pockets correspond to the first and second printed circuit boards 118a and 118b connected to both edges of the OLED panel 110 facing each other and brought into close contact with each other. Grooves 133a and 133b are provided.

Through this, the OLED 100 of the present invention does not require a separate cover shield (not shown) for protecting the first and second printed circuit boards 118a and 118b, thereby reducing the process cost of the OLED 100. can be reduced, and the process time can be shortened to improve the efficiency of the process.

In addition, it is possible to reduce the increase in the thickness and weight of the OLED 100 due to the cover shield (not shown), thereby providing the recently requested lightweight and thin OLED 100.

In addition, the rear surface of the OLED 100, that is, the shape of the rear surface of the back cover 130 can be simplified, so that the usable area of the rear surface of the OLED 100 is wide. Through this, space utilization of the OLED 100, interior and improve the merits of the design.

In addition, a cover window 140 capable of protecting the OLED panel 110 is assembled and fastened to the front of the OLED panel 110 where the image is implemented. The OLED panel 110 and the double-sided adhesive tape (not shown) It is used and attached tightly.

The cover window 140 protects the OLED panel 110 from external impact, and transmits light emitted from the OLED panel 110 so that an image displayed on the OLED panel 110 can be viewed from the outside.

The cover window 140 may be made of a plastic material such as acrylic or a glass material having impact resistance and light transmission.

Therefore, the OLED panel 110 is surrounded by the cabinet 120, the cover window 140 is located in the front, and the back cover 130 is located in the rear of the OLED panel 110, respectively. It is combined at the front and rear and is integrally modularized.

At this time, the cabinet 120 is also referred to as a guide panel, a support main, or a mold frame, and the back cover 130 is also referred to as a cover bottom, a bottom cover, and a lower cover.

Meanwhile, various structures may be fixed to the back surface of the back cover 130, and on the system board 150, which is one of the structures, a power supply unit for supplying first and second power sources (EVDD, EVSS) to the OLED panel 110. (not shown) is mounted.

The system board 150 is electrically connected to the first printed circuit board 118a connected to one edge of the OLED panel 110 to supply first and second power sources (EVDD, EVSS) to the OLED panel 110. However, the OLED 100 according to the embodiment of the present invention is simultaneously supplied with the first and second power sources EVDD and EVSS from both edges of the OLED panel 110 .

That is, the OLED 100 of the present invention supplies the first and second power sources (EVDD, EVSS) to both edges of the OLED panel 110 facing each other, so that the OLED 100 has a larger pixel size and/or higher resolution. Even if the number of is increased, power is stably supplied to the entire OLED panel 110 .

In particular, the OLED 100 of the present invention does not require a separate FFC (not shown) while supplying stable power to the OLED panel 110, thereby causing a ringing phenomenon caused by a separately provided FFC (not shown). It is possible to prevent the occurrence of screen stains, and also to prevent the occurrence of a lifting phenomenon of the OLED panel 110 due to FFC (not shown), thereby preventing the occurrence of poor image quality or damage of the OLED panel 110. can

In addition, through the deletion of FFC (not shown), process efficiency can be improved by minimizing process cost and process time due to modularization of the OLED 100 .

This can be implemented by providing a wire pattern (135, see FIG. 3A) to the back cover 130 of the present invention.

Looking at this in more detail, the OLED 100 according to the embodiment of the present invention is the inner surface of the back cover 130, and both edges corresponding to both edges of the OLED panel 110 facing each other, that is, the back cover 130 It is provided with a wire pattern (135, see FIG. 3A) crossing from the first pocket groove 133a to the second pocket groove 133b.

The lead pattern 135 (see FIG. 3A) electrically connects the first and second printed circuit boards 118a and 118b connected to both edges of the OLED panel 110 facing each other, so that the first and second printed circuit boards 118a and 118b simultaneously receive first and second power sources EVDD and EVSS from the system board 150 connected to the first printed circuit board 118a.

The first and second power supplies (EVDD and EVSS) supplied to the first and second printed circuit boards 118a and 118b are supplied to the OLED panel 110 through both opposite edges of the OLED panel 110, The OLED 100 according to the embodiment of the present invention receives the first and second power sources EVDD and EVSS at the same time from both edges of the OLED panel 110 facing each other.

Through this, power is stably supplied to the entire OLED panel 110, and it is not necessary to separately provide an FFC (not shown), thereby preventing problems caused by the FFC (not shown) from occurring.

This will be examined in more detail with reference to FIGS. 3A to 3B and FIG. 4 .

3A is a perspective view schematically showing a back cover of an OLED according to an embodiment of the present invention, and FIG. 3B is a cross-sectional view schematically showing a portion of FIG. 3A.

And, FIG. 4 is a perspective view schematically showing how the first and second printed circuit boards and the conductive wire patterns of the back cover are connected to each other according to an embodiment of the present invention.

On the other hand, for convenience of description in FIG. 4, the OLED panel 110 is shown on the back, but the OLED panel 110 has the display surface facing forward so that the rear surface of the OLED panel 110 is aligned with the inner surface of the back cover 130. It is seated on the back cover 130 facing each other.

As shown in FIGS. 3A and 3B, the back cover 130 is formed in a plate shape, and the back cover 130 has high thermal conductivity of aluminum (Al), copper (Cu), and zinc (Zn). ), made of any one of silver (Ag), gold (Au), and iron (Fe), or made of an alloy of the above metals or electrolytic galvanized iron (EGI), in OLED (100 in FIG. 1) The generated high-temperature heat is dissipated to the outside.

That is, when the OLED panel 110 is driven, the temperature rises to about 80 to 90° C. due to heat generated along with deterioration of the driving thin film transistor (DTr in FIG. 2). Due to such high heat, the lifetime of the OLED (100 in FIG. 1) is rapidly reduced.

Therefore, it is important for the OLED (100 in FIG. 1) to have a heat dissipation design for quickly dissipating high-temperature heat generated from the OLED panel 110 to the outside. ) can effectively dissipate high-temperature heat generated from the OLED panel 110 to the outside by using a material with high thermal conductivity for the back cover 130.

In addition, the inner surface of the back cover 130 is connected to both edges of the first and second printed circuit boards 118a and 118b in FIG. 1 facing each other of the OLED panel 110 seated on the back cover 130. First and second pocket grooves 133a and 133b are provided at both edges corresponding to .

The first and second pocket grooves 133a and 133b have sizes and shapes corresponding to the first and second printed circuit boards 118a and 118b in FIG. 1 connected to both edges of the OLED panel 110 facing each other. , When the first and second printed circuit boards 118a (118b in FIG. 1) are brought into close contact with the rear surface of the OLED panel 110 in the modularization process, the first and second printed circuit boards 118a (118b in FIG. 1) are It is guided and seated on the first and second pocket grooves 133a and 133b of the back cover 130.

At this time, the first and second pocket grooves 133a and 133b are formed 1.2 times larger than the length and width of the first and second printed circuit boards 118a ( 118b in FIG. 1 ), so that the first and second printing It is preferable to ensure that the circuit board 118a (118b in FIG. 1) is stably positioned in the first and second pocket grooves 133a and 133b, respectively.

In particular, the back cover 130 according to the embodiment of the present invention has a plurality of grooves in a direction perpendicular to the longitudinal direction of the back cover 130 crossing from the first pocket groove 133a to the second pocket groove 133b. 132 is provided, and a plurality of grooves 132 are provided with a first insulating film 137a covering both sides of the grooves 132 and the horizontal surface.

In addition, a plurality of wire patterns 135 are provided on the upper portion of the first insulating film 137a of the plurality of grooves 132, and the wire patterns 135 may be formed to a thickness of about 5 to 20 μm, In general, a metal material such as copper foil (Cu) is used, and preferably, tin (Zn), gold (Au), nickel (Ni) or solder is plated on the surface of the copper foil.

A method of forming a copper foil, which is an example of the wire pattern 135, includes casting, laminating, electroplating, and the like. Here, casting is a method of spraying a liquid base film on a rolled copper foil (Cu) and thermally curing it, and laminating is a method of placing a rolled copper foil (Cu) on a base film and thermally compressing the base film.

In addition, electroplating is a method of forming copper foil (Cu) by depositing a copper (Cu) seed layer on a base film, then placing the base film in an electrolyte in which copper (Cu) is dissolved, and flowing electricity. Here, the wiring patterned on the copper foil (Cu) is formed to configure a predetermined circuit by selectively etching the copper foil (Cu) by performing a photo/etching process on the copper foil (Cu).

And, the second insulating film 137b is provided on the inner surface of the back cover 130 including the plurality of wire patterns 135 .

Accordingly, each of the plurality of wire patterns 135 is insulated from the back cover 130 made of metal by the first and second insulating films 137a and 137b, and the plurality of wire patterns 135 are first and second insulating films 137a and 137b. The insulating films 137a and 137b are protected from external impact or corrosive substances.

At this time, both ends of each of the plurality of wire patterns 135 are exposed to the first and second pocket grooves 133a and 133b of the back cover 130, and the wire patterns 135 exposed to the first pocket grooves 133a One end 135a of is electrically connected to the first power pad 117 provided on the first printed circuit board 118, and the other end 135b of the wire pattern 135 exposed through the second pocket groove 133b. is electrically connected to a second power pad (not shown) provided on the second printed circuit board (118b in FIG. 1).

That is, as shown in FIG. 4, the first and second printed circuit boards 118a (118b in FIG. 1) connected to both edges of the OLED panel 110 facing each other are used in the modularization process of the OLED (100 in FIG. 1). It is bent to the rear surface of the OLED panel 110 through the connecting member 116 and is fixed in close contact.

A plurality of first and second power pads 117 (not shown) are provided on the first and second printed circuit boards 118a (118b in FIG. 1), respectively. The plurality of first power pads 117 are electrically connected to one end 135a of the plurality of wire patterns 135 exposed through the first pocket groove 133a of the back cover 130, respectively, and the second printed circuit A plurality of second power pads (not shown) provided on the substrate (118b in FIG. 1) are electrically connected to the other ends 135b of the plurality of conductive wire patterns 135 exposed through the second pocket grooves 133b, respectively. will be.

At this time, in order to improve electrical connectivity between the first and second power pads 117 (not shown) and the wire pattern 135, both ends of the first and second power pads 117 (not shown) and the wire pattern 135 A conductive pad (not shown) may be further provided between (135a, 135b). The conductive pad (not shown) may be made of poron or urethane material to absorb shock. ), when a predetermined pressure is applied, it absorbs the applied predetermined pressure.

Alternatively, it may be made of natural or artificial materials having high elasticity, such as silicone, gelatin, latex, synthetic rubber, and elastic polyurethane. Such a conductive pad (not shown) has a high modulus of elasticity.

Through this, in the OLED (100 in FIG. 1) according to the embodiment of the present invention, even though the system board (150 in FIG. 1) on which the power supply unit (not shown) is mounted is connected only to the first printed circuit board 118a, The first and second power sources EVDD and EVSS are simultaneously supplied to the first and second printed circuit boards 118a ( 118b in FIG. 1 ) connected to both edges of the OLED panel 110 facing each other.

That is, when the first and second power supplies (EVDD and EVSS) are delivered to the first printed circuit board 118a from a power supply unit (not shown) mounted on the system board (150 in FIG. 1), the first printed circuit board The first and second power sources EVDD and EVSS are supplied to one side edge of the OLED panel 110 through 118a.

And, the first and second power sources EVDD and EVSS delivered to the first printed circuit board 118a are the back cover to which the first power pad 117 on the first printed circuit board 118a and one end 135a are connected. Through the lead pattern 135 of 130, the second printed circuit board (118b in FIG. 1) is connected to the other end 135b of the lead pattern 135 and a second power pad (not shown).

The first and second power supplies (EVDD, EVSS) delivered to the second printed circuit board (118b in FIG. 1) are supplied to the other edge of the OLED panel 110 through the second printed circuit board (118b in FIG. 1). do.

Therefore, the OLED (100 in FIG. 1 ) according to an embodiment of the present invention includes first and second printed circuit boards 118a and 118b in FIG. 1 connected to both edges of the OLED panel 110 facing each other. The second power sources (EVDD and EVSS) are simultaneously supplied.

By simultaneously supplying the first and second power sources (EVDD and EVSS) to both edges of the OLED panel 110 facing each other, even if the number of pixels increases due to the size and/or high resolution of the OLED (100 in FIG. 1), the OLED Power is stably supplied to the entire panel 110 .

In particular, the OLED (100 in FIG. 1) of the present invention supplies stable power to the OLED panel 110, but does not require a separate FFC (not shown), so there is no sound due to the separately provided FFC (not shown). It is possible to prevent the occurrence of screen stains due to development, and also to prevent the occurrence of a lifting phenomenon of the OLED panel 110 due to FFC (not shown), resulting in poor quality or damage of the OLED panel 110 It can also be prevented.

In addition, through the deletion of FFC (not shown), process efficiency can be improved by minimizing process cost and process time due to modularization of OLED (100 in FIG. 1).

Meanwhile, in the above description, it has been described that the first and second power sources (EVDD and EVSS) are simultaneously supplied to both edges of the OLED panel 110 through the plurality of wire patterns 135 provided on the back cover 130. In addition to the first and second power supplies (EVDD, EVSS) through the plurality of wire patterns 135 provided on the back cover 130, a plurality of driving circuit elements (not shown) mounted on the system board (150 in FIG. 1) It is also possible to supply various signals such as a driving signal and a data signal supplied from the time).

As described above, the OLED (100 in FIG. 1 ) according to the embodiment of the present invention includes a plurality of conductive wire patterns 135 on the back cover 130 supporting the OLED panel 110, thereby forming a conductive wire pattern 135. Through this, the first and second power sources (EVDD and EVSS) can be simultaneously supplied to both edges of the OLED panel 110 facing each other. Therefore, even if the number of pixels increases due to the size and/or high resolution of the OLED (100 in FIG. 1), the entire OLED panel 110 can be stably supplied with power.

In particular, the OLED (100 in FIG. 1) of the present invention supplies stable power to the OLED panel 110, but does not require a separate FFC (not shown), so there is no sound due to the separately provided FFC (not shown). It is possible to prevent the occurrence of screen stains due to development, and also to prevent the occurrence of a lifting phenomenon of the OLED panel 110 due to FFC (not shown), resulting in poor quality or damage of the OLED panel 110 It can also be prevented.

In addition, through the deletion of FFC (not shown), process efficiency can be improved by minimizing process cost and process time due to modularization of OLED (100 in FIG. 1).

The present invention is not limited to the above embodiments, and can be practiced with various changes without departing from the spirit of the present invention.

110: OLED panel
116: connecting member, 117a: first power pad, 118a: first printed circuit board
130: back cover
132: Home
133a: first pocket home
135: wire pattern (135a: one end)
137a, 137b first and second insulating films

Claims (7)

an OLED panel;
first and second printed circuit boards connected along both edges of the OLED panel facing each other;
A back cover on which the OLED panel is seated and supported, and a plurality of wire patterns electrically connecting the first and second printed circuit boards are provided on an inner surface thereof.
including,
The back cover is provided with first and second pocket grooves corresponding to the first and second printed circuit boards, one end of the wire pattern is exposed in the first pocket groove, and the other end of the wire pattern is exposed to the first pocket groove. 2 Organic light emitting device exposed in the pocket groove.
According to claim 1,
A first power pad connected to one end of the wire pattern is provided on the first printed circuit board, and a second power pad connected to the other end of the wire pattern is provided on the second printed circuit board. An organic light emitting device.
According to claim 1,
The length and width of the first and second pocket grooves are greater than the length and width of the first and second printed circuit boards. According to claim 1,
The first and second printed circuit boards are bent and adhered to the rear surface of the OLED panel, and the organic light emitting device is seated on the first and second pocket grooves, respectively.
According to claim 1,
A plurality of grooves are provided on the back cover, the wire pattern is seated in the groove, a first insulating film is provided on both sides of the groove and on a horizontal surface, and a second insulating film is provided on the inner surface of the back cover including the wire pattern. An organic light emitting device provided with an insulating film.
According to claim 1,
An organic light emitting device comprising a cover window positioned in front of the OLED panel and a cabinet guiding an edge of the OLED panel.
According to claim 5,
The first and second insulating films are provided between the first and second pocket grooves.

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