KR102132768B1 - Organic light emitting diode - Google Patents

Abstract

The present invention relates to organic light emitting diodes (OLEDs), and more particularly, to an OLED in which a back cover and an OLED panel can be easily separated.
The OLED of the present invention further includes a support middle that supports and guides the OLED panel while allowing the support middle to be assembled and fastened through a back cover and a screw, thereby eliminating the magnetic pad for fixing the OLED panel on the back cover. Thereby, it is possible to prevent the problem that the manufacturing cost of the OLED by the magnetic pad is increased and the efficiency of the process is lowered.
In addition, since only the back edge is supported by the support middle, the OLED panel can prevent the OLED panel from being pressed by the magnetic pad or the back cover, thereby preventing the image quality from being deteriorated. In addition, a heat dissipation design for heat dissipation of the OLED panel can be formed between the back cover and the OLED panel, so that high-temperature heat generated from the OLED panel can be effectively released to the outside. In addition, since the OLED panel and the back cover can be easily separated, when the defect or defect of the OLED panel occurs, only the defective OLED panel or back cover can be disposed of, thereby improving the efficiency of the process. Can.

Description

Organic light emitting diode {Organic light emitting diode}

The present invention relates to an organic light emitting diode (OLED), and more particularly, to an OLED in which a back cover and an OLED panel can be easily separated.

An organic light emitting diode (OLED) is composed of a hole injection electrode, an organic light emitting layer, and an electron injection electrode, and excitons generated by combining electrons and holes inside the organic light emitting layer fall from the excited state to the ground state. Light emission is made by the energy generated at the time.

With this principle, OLED has a self-luminous property and, unlike a liquid crystal display device, does not require a separate light source, so it can reduce thickness and weight. In addition, OLEDs are regarded as next-generation display devices for portable electronic devices because they exhibit high quality characteristics such as low power consumption, high luminance, and high reaction speed.

In general, OLED has an OLED panel including organic light emitting layers therein, a cabinet for guiding the edge of the OLED panel, a back cover for storing the OLED panel behind the OLED panel, and a cover for protecting the OLED panel in front of the OLED panel. It includes a cover window.

The OLED panel is supported and fixed on the back cover through a magnetic pad located between the back cover and the OLED panel, and the magnetic pad is attached through a double-sided adhesive tape on the back cover.

Here, the general OLED has a problem in that the efficiency of the process is remarkably lowered by using a magnetic pad and a double-sided adhesive tape in the process of modularizing the OLED panel.

That is, the magnetic pad used to fix the OLED panel to the back cover is made of an expensive material, thereby improving the manufacturing cost of the OLED, and also causing a problem of increasing the weight of the OLED.

In addition, the OLED panel is pressed against the OLED panel by the non-smooth surface of the magnetic pad or the back cover when the entire surface of the back surface is formed so that the surface of the magnetic pad or the back cover is not smooth through the magnetic pad. This can happen.

This causes a deterioration in the quality of the OLED panel.

In addition, when the weight of the OLED panel is heavy, it is difficult to fix the OLED panel only by the magnetic force of the magnetic pad, so that the back edge of the OLED panel is supported and attached through a double-sided adhesive tape on the cabinet to improve the fixing power of the OLED panel. do. Therefore, as a separate double-sided adhesive tape is further required, the process cost is also improved through this.

In addition, since the cabinet is assembled and fastened through a back cover and a double-sided adhesive tape, separation of the OLED panel and the back cover becomes difficult. This means that if the OLED panel is defective or the back cover is defective, both the OLED panel and the back cover must be disposed of together, thus increasing the process cost and increasing the process time. It is lowered significantly.

In addition, as the magnetic pad is positioned on the back of the OLED panel, it is difficult to form a heat dissipation design of the OLED panel, and variations in luminance between pixels between OLEDs occur, resulting in deterioration in image quality such as afterimages and deterioration in life. do.

This, in turn, reduces the reliability of the product.

The present invention is to solve the above problems, the first object is to stably modularize the OLED panel, and the second object is to improve the efficiency of the process.

In addition, a third object is to prevent the degradation of the image quality of the OLED, and a fourth object is to provide an OLED having an effective heat dissipation design.

In order to achieve the object as described above, the present invention is an OLED panel; A support frame having a rectangular frame shape including a horizontal portion to which a rear edge of the OLED panel is attached, and a burring tap formed to protrude from the rear surface of the horizontal portion and having a first screw hole; The support middle is formed in a plate shape on which it is seated, and includes a back cover including a second screw hole corresponding to the first screw hole, and the support middle and the back cover are provided in the first and second screw holes. It provides an organic light emitting device that is assembled and fastened to each other through a screw that passes through.

At this time, the support middle and the back cover are separated from each other when the screw is disassembled, and the support middle includes the horizontal portion and a vertical portion bent vertically from the horizontal portion toward one direction in which the burring tab is protruded. A first step is formed on the inner edge of the horizontal portion.

In addition, a double-sided adhesive tape is provided on the first step, and a rear edge of the OLED panel is attached to the horizontal portion of the support middle, and a second step is provided along the edge of the back cover. The support middle rests on the second step.

In addition, the height and width of the second stepped side correspond to the height and width of the support middle, and the back cover includes aluminum (Al), copper (Cu), zinc (Zn), silver (Ag), and gold (Au). , Iron (Fe), electro galvanized steel sheet (EGI).

In addition, the back cover is made of an inorganic layer interposed between the first and second metal layers and the first and second metal layers, and the first and second metal layers are made of aluminum (Al), and the inorganic layer is adhered. It consists of a silicone-based resin having properties.

At this time, a heat radiation member is provided on the rear surface of the OLED panel, and includes a cover window positioned in front of the OLED panel.

As described above, the OLED of the present invention further includes support middles for guiding and supporting the OLED panel, and fixing the OLED panel on the back cover by allowing the support middles to be assembled and fastened through a back cover and a screw. Since it is possible to remove the magnetic pad for the OLED, the manufacturing cost of the OLED by the magnetic pad increases, and there is an effect of preventing the problem that the efficiency of the process is lowered.

In addition, since only the back edge is supported by the support middle, the OLED panel can prevent the OLED panel from being pressed by a magnetic pad or a back cover, and thus has an effect of preventing deterioration of image quality.

In addition, a heat dissipation design for heat dissipation of the OLED panel can be formed between the back cover and the OLED panel, thereby effectively discharging high-temperature heat generated from the OLED panel to the outside.

In addition, since the OLED panel and the back cover can be easily separated, when a defect or defect in the back panel occurs, only the defective OLED panel or back cover can be disposed of, thereby improving the efficiency of the process. It has the effect.

Therefore, there is an effect that can improve the reliability of the product.

1 is a perspective view schematically showing an OLED according to an embodiment of the present invention.
2 is a cross-sectional view schematically showing the OLED panel of FIG. 1.
Figure 3a is a perspective view schematically showing a part of the support middle according to an embodiment of the present invention.
Figure 3b is a perspective view schematically showing a part of the back of Figure 3a.
4A to 4B are perspective views schematically showing a part of a back cover according to an embodiment of the present invention.
Figure 5 is a process flow diagram schematically showing the modularization process of the OLED according to an embodiment of the present invention.
6A is a schematic cross-sectional view of a portion of a modular OLED according to an embodiment of the present invention.
Figure 6b is a cross-sectional view schematically showing a part of the OLED panel and the back cover is separated.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.

1 is a perspective view schematically showing an OLED according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view schematically showing the OLED panel of FIG. 1.

As shown in the figure, the OLED 100 has a large OLED panel 110 for realizing an image, a support middle 120 for guiding the edge of the OLED panel 110, and a bag for storing the OLED panel 110. It includes a cover window (140) and a cover window (140) for protecting the OLED panel 110.

In this case, if the direction on the drawing is defined for convenience of explanation, the OLED panel 110 with the support middle 120 surrounding the edge of the OLED panel 110 under the premise that the display surface of the OLED panel 110 faces forward. ), the back cover 130 is located behind, and the cover window 140 is positioned in front of the OLED panel 110 to be combined and integrated in the front and rear.

Here, the OLED panel 110 will be described in detail with reference to FIG. 2.

In the OLED panel 110, the substrate 101 on which the driving thin film transistor DTr and the light emitting diode E are formed is encapsulated by the encapsulation substrate 102.

That is, the semiconductor layer 104 is formed in the pixel region P on the substrate 101, and the semiconductor layer 104 is made of silicon, and the central portion of both sides of the active region 104a and the active region 104a forming a channel. It is composed of source and drain regions 104b and 104c doped with high concentrations of impurities.

A gate insulating layer 105 is formed on the semiconductor layer 104.

Above the gate insulating layer 105, a gate electrode 107 corresponding to the active region 104a of the semiconductor layer 104 and a gate wiring extending in one direction are formed although not shown in the drawing.

In addition, a first interlayer insulating film 106a is formed on the front surface of the gate electrode 107 and the gate wiring (not shown), wherein the first interlayer insulating film 106a and the gate insulating film 105 below the active area ( 104a) first and second semiconductor layer contact holes 109 for exposing the source and drain regions 104b and 104c located on both sides, respectively.

Next, the source and drain regions exposed through the first and second semiconductor layer contact holes 109 spaced apart from each other above the first interlayer insulating film 106a including the first and second semiconductor layer contact holes 109 ( Source and drain electrodes 108a and 108b are respectively formed in contact with 104b and 104c.

Then, the second interlayer having a drain contact hole 112 exposing the drain electrode 108b to the top of the first interlayer insulating film 106a exposed between the source and drain electrodes 108a, 108b and the two electrodes 108a, 108b. The insulating film 106b is formed.

At this time, the semiconductor layer 104 including the source and drain electrodes 108a and 108b and the source and drain regions 104b and 104c contacting these electrodes 108a and 108b and a gate insulating film formed on the semiconductor layer 104 The 105 and gate electrode 107 form a driving thin film transistor DTr.

On the other hand, although not shown in the drawing, a data wiring (not shown) defining a pixel area P crossing the gate wiring (not shown) is formed. The switching thin film transistor (not shown) has the same structure as the driving thin film transistor DTr, and is connected to the driving thin film transistor DTr.

In addition, in the drawing, the switching thin film transistor (not shown) and the driving thin film transistor DTr show a co-planar type in which the semiconductor layer 104 is formed of a polysilicon semiconductor layer as an example. And it may be formed of a bottom gate (bottom gate) type made of amorphous silicon of impurities.

In addition, the light emitting diode E is formed of a material having a relatively high work function value, for example, in an area connected to the drain electrode 108b of the driving thin film transistor DTr and substantially displaying an image on the second interlayer insulating film 106b. ), a first electrode 111 forming an anode is formed as one component.

The first electrode 111 is formed for each pixel region P, and a bank 119 is positioned between the first electrodes 111 formed for each pixel region P.

That is, the first electrode 111 is formed in a structure separated from each pixel region P by using the bank 119 as a boundary for each pixel region P.

In addition, the organic emission layer 113 is formed on the first electrode 111.

Here, the organic light emitting layer 113 may be composed of a single layer made of a light emitting material, and a hole injection layer, a hole transport layer, a light emitting material layer, and electrons to increase luminous efficiency It may be composed of multiple layers of an transport layer and an electron injection layer.

The organic light emitting layer 113 expresses colors of red (R), green (G), and blue (B), and in general, red (R), green (G), and blue for each pixel region (P). (B) Separate organic materials 113a, 113b, and 113c that emit color are used by patterning.

In addition, a second electrode 115 forming a cathode is formed on the front of the organic light emitting layer 113.

At this time, the second electrode 115 has a double layer structure and includes a translucent metal film thinly depositing a metal material having a low work function. At this time, the second electrode 115 may be a two-layer structure in which a transparent conductive material is thickly deposited on a semi-transparent metal film.

Therefore, the light emitted from the organic light emitting layer 113 is driven in a top emission type that is emitted toward the second electrode 115.

Alternatively, the second electrode 115 is made of an opaque metal film, and the light emitted from the organic light emitting layer 113 may be driven by a bottom emission type emitted toward the first electrode 111.

When a predetermined voltage is applied to the first electrode 111 and the second electrode 115 according to the selected color signal, the OLED panel 110 may have holes injected from the first electrode 111 and a second electrode 115. The electrons provided from are transported to the organic light emitting layer 113 to form an exciton, and when these excitons transition from an excited state to a ground state, light is generated and emitted in the form of visible light.

At this time, since the emitted light passes through the transparent second electrode 115 or the first electrode 111 and goes out, the OLED panel 110 implements an arbitrary image.

In addition, an encap substrate 102 is provided on the driving thin film transistor DTr and the light emitting diode E, and the substrate 101 and the encap substrate 102 are separated from each other through an adhesive film 103 having adhesive properties. And joins.

Through this, the OLED panel 110 is encapsulated.

At this time, the adhesive film 103 is a film to protect the driving thin film transistor (DTr) and the light emitting diode (E) formed on the substrate 101 by preventing the external moisture from penetrating into the light emitting diode (E), the light emitting diode It surrounds (E) and is formed on the substrate 101.

The adhesive film 103 is formed of a selected one of OCA (Optical Cleared Adhesive), a heat curable resin or a heat curable encapsulant to seal the driving thin film transistor (DTr) and the light emitting diode (E) on the substrate 101.

Meanwhile, the substrate 101 and the encap substrate 102 may be formed of glass, plastic, stainless steel, metal foil, or the like.

A printed circuit board 118 is connected to one edge of the OLED panel 110 via a connecting member 116 such as a flexible circuit board or a tape carrier package (TCP).

The OLED panel 110 is supplied with a driving signal from driving circuit elements (not shown) mounted on the printed circuit board 118 through the connecting member 116.

The OLED panel 110 is finally modularized through the support middle 120, the back cover 130, and the cover window 140. The support middle 120 is formed into a square frame surrounding the edge of the OLED panel 110. Is done.

The horizontal portion 121 of the support middle 120 is formed with a burring tap (burring tap: 125, see FIG. 3B), and the burring tab 125 (see FIG. 3B) protrudes vertically from the horizontal portion 121. A first screw hole 125b (see Fig. 3b) is formed so that the screw 150 can be inserted in the center of the pillar surface (125a, see Fig. 3b) and the pillar surface (125a, see Fig. 3b) forming the inner hollow portion.

At this time, the OLED panel 110 is attached and fixed through the first double-sided adhesive tape 160 (see FIG. 5) on the horizontal portion 121 of the support middle 120.

The support middle 120 surrounding the edge of the OLED panel 110 is mounted on the back cover 130, the back cover 130 is made of a plate (plate) shape covering the back surface of the OLED panel 110, the back A second screw hole 133 corresponding to the first screw hole 125b (see FIG. 3B) of the support middle 120 is formed along the edge of the cover 130, so that the back cover 130 and the support middle 120 ) Are assembled and fastened to each other through screws 150 passing through the first and second screw holes 125 (see FIG. 3B, 133 ).

Here, the screw 150 includes a shaft 151 and a head 153 provided at its end, similar to the shape of a general screw.

At this time, along the outer surface of the shaft 151, male and female threads corresponding to the female threads formed on the inner surfaces of the first and second screw holes 125 (see FIG. 3B and 133) are formed.

And, in front of the OLED panel 110 is located a cover window 140 that can protect the OLED panel 110, the OLED panel 110 and the second double-sided adhesive tape (not shown) in close contact Is attached.

The cover window 140 protects the OLED panel 110 from external impact, and transmits light emitted from the OLED panel 110 so that the image displayed on the OLED panel 110 can be viewed from the outside.

The cover window 140 may be made of a plastic material or glass material, such as acrylic, which has impact resistance and light transmittance.

Therefore, the OLED panel 110, the edge is guided by the support middle 120, the cover window 140 is located forward, and the back cover 130 is located behind the OLED panel 110, respectively Combined in front and rear, it is modularized in one piece.

At this time, the support middle 120 is also referred to as a cabinet, a support main, and a guide panel, and the back cover 130 is also called a cover bottom, a bottom cover, and a lower cover.

Here, the characteristic configuration of the present invention further includes a support middle 120 that supports and guides the OLED panel 110 at the same time, and the support middle 120 is assembled and assembled through the back cover 130 and the screw 150 and It is concluded.

Through this, the OLED 100 according to the embodiment of the present invention can remove the magnetic pad for fixing the OLED panel 110 on the back cover 130, so that the manufacturing cost of the OLED 100 by the magnetic pad It is possible to prevent the problem that the rise and the efficiency of the process were lowered.

In addition, the OLED panel 110 is supported on the support middle 120 only at the rear edge, so that a certain separation space may exist between the OLED panel 110 and the back cover 130, through which a magnetic pad or a back cover 130 ) Can prevent the OLED panel 110 from being pressed.

Through this, it is possible to prevent the problem that the image quality is deteriorated.

In addition, as a space between the back cover 130 and the OLED panel 110, it is possible to form a heat dissipation design for heat dissipation of the OLED panel 110, so that high-temperature heat generated from the OLED panel 110 can be effectively applied to the outside. Can release.

In addition, since the OLED panel 110 and the back cover 130 can be easily separated, when the defect of the OLED panel 110 or the defect of the back cover 130 occurs, the OLED panel 110 and the back cover 130 are removed. After separation, only the defective OLED panel 110 or the back cover 130 can be disposed of, thereby improving the efficiency of the process.

Therefore, finally, the OLED 100 according to the embodiment of the present invention can improve the reliability of the product.

3A is a perspective view schematically showing a part of the support middle according to an embodiment of the present invention, and FIG. 3B is a perspective view schematically showing a part of the rear surface of FIG. 3A.

And, Figures 4a ~ 4b is a perspective view schematically showing a part of the back cover according to an embodiment of the present invention.

As shown in Figure 3a ~ 3b, the support middle 120 is a horizontal portion 121 supporting a portion of the rear edge of the OLED panel 110, and vertically bent from the horizontal portion 121 to the horizontal portion 121 It is made of a rectangular frame shape made of a vertical portion 123 to support.

Here, the horizontal portion 121 is formed with a burring tap (burring tap: 125) protruding toward one direction in which the vertical portion 123 is formed, the burring tab 125 protrudes vertically from the rear surface of the horizontal portion 121 The first screw hole 125b is formed so that a screw (150 in FIG. 1) can be inserted in the center of the pillar surface 125a forming the inner hollow portion and the pillar surface 125a.

At this time, a first stepped 127 is formed along the inner edge of the horizontal portion 121, and the first double-sided adhesive for attaching a part of the rear edge of the OLED panel (110 of FIG. 2) to the first stepped 127 The tape 160 (see FIG. 5) is positioned.

Accordingly, even if the first double-sided adhesive tape 160 (see FIG. 5) is positioned on the horizontal portion 121, the OLED modulated by the first double-sided adhesive tape (160, see FIG. 5) (100 in FIG. 1) ) The thickness of the OLED panel (110 of FIG. 2) can be stably supported and fixed to the upper portion of the horizontal portion 121 of the support middle 120 while preventing the thickness from being thickened.

Here, the support middle 120 is any one selected from the group consisting of aluminum (Al), copper (Cu), zinc (Zn), silver (Ag), gold (Au), iron (Fe), and alloys of the above metals It may be made of a material, or may be made of an electro-galvanized steel sheet (EGI, hereinafter referred to as EGI).

Further, the support middle 120 may be made of polycarbonate (PC) resin, acrylonitrile butadiene styrene copolymer (ABS) resin, PMMA, or the like.

In addition, the back cover 130 on which the support middle 120 is seated is a plate shape corresponding to the rear surface of the OLED panel (110 of FIG. 2 ), as shown in FIG. 4A, and has high thermal conductivity. It may be made of any one material selected from the group consisting of aluminum (Al), copper (Cu), zinc (Zn), silver (Ag), gold (Au), iron (Fe), and alloys of the above metals.

At this time, when the back cover 130 is formed of aluminum, the aluminum has a purity of 99.5%, and further improves the heat absorption rate when a black oxide film is formed on the surface through an anodizing treatment. I can do it.

Alternatively, the back cover 130 may use EGI, which is competitive in price and mass production, as a raw material.

A second step 131 having a thickness thinner than the thickness of the center of the back cover 130 is formed along the edge of the plate-shaped back cover 130.

A second screw hole 133 corresponding to the first screw hole 125b formed in the support middle 120 is formed in the second stepped 131.

At this time, the first and second screw holes 125b and 133 are formed on an inner circumferential surface with a female thread corresponding to a male thread formed on a shaft (151 of FIG. 1) of a screw (150 of FIG. 1).

Here, the height and width of the second stepped 131 is formed corresponding to the height and width of the support middle 120, through which the thickness of the OLED (100 in FIG. 1) modularized by the support middle 120 is thick. It is possible to prevent the loss and prevent the widening of the non-display area bezel area.

In addition, the back cover 130 according to an embodiment of the present invention may be made of a triple structure in which the inorganic layer 130c is interposed between the first and second metal layers 130a and 130b, as illustrated in FIG. 4B. In this case, the second stepped 131 formed along the edge of the back cover 130 may be formed of only the first and second metal layers 130a and 130b by removing the inorganic layer 130c.

Here, the first and second metal layers 130a and 130b are aluminum (Al), copper (Cu), zinc (Zn), silver (Ag), gold (Au), iron (Fe), and upper having high thermal conductivity. It can be made of any one selected from the group consisting of alloys of metal, it is preferable to be formed of aluminum (Al) having a high thermal conductivity, low light weight and low cost characteristics.

In this case, when the first and second metal layers 130a and 130b are formed of aluminum, the aluminum has a purity of 99.5%, and through an anodizing treatment, a black oxide film is formed on the surface. Therefore, the heat absorption rate can be further improved.

Alternatively, the first and second metal layers 130a and 130b may be made of electrolytic galvanized iron (EGI).

In addition, the inorganic layer 130c serves to bond the first and second metal layers 130a and 130b. The inorganic layer 130c includes a silicon oxide film (SiO2) and a silicon nitride film (SiNx) having adhesive properties. It may be made of a silicone-based resin.

The support middle 120 and the back cover 130 are assembled and fastened to each other through screws (150 in FIG. 1) penetrating the first and second screw holes 125b and 133, with reference to FIG. Let's take a closer look.

5 is a process flow diagram schematically showing a modularization process of an OLED according to an embodiment of the present invention, FIG. 6A is a cross-sectional view schematically showing a part of the modularized OLED according to an embodiment of the present invention, and FIG. 6B is an OLED It is a cross-sectional view schematically showing a part of the state in which the panel and the back cover are separated.

As shown in FIG. 5, the support middle 120 having a rectangular frame shape is positioned on the second stepped 131 formed along the edge of the back cover 130, wherein the support middle 120 is of the support middle 120 The horizontal portion 121 is positioned on the second stepped 131 of the back cover 130 so that the horizontal portion 121 is facing forward and the vertical portion 123 is facing outward.

At this time, the second screw hole 133 formed in the second stepped 131 of the back cover 130 is the first screw hole (125b in FIG. 3b) formed in the burring tab (125 in FIG. 3b) of the support middle 120. Corresponding to, the end of the shaft 151 of the screw 150 penetrates the second screw hole 133 of the back cover 130 from the back surface of the back cover 130, and the burring tab of the support middle 120 (FIG. By being inserted into the first screw hole (125b of FIG. 3b) formed in 125 of 3b, the back cover 130 and the support middle 120 are integrally combined.

At this time, the support middle 120 assembled and fastened to the second stepped 131 of the back cover 130 is formed to form the same plane as the inner surface of the back cover 130.

Next, after attaching the first double-sided adhesive tape 160 to the top of the first step 127 of the support middle 120 that is integrally modular with the back cover 130, the OLED panel 110 is supported by the support middle ( 120) seated on the horizontal portion 121 of the OLED panel 110 so that a part of the rear edge of the OLED panel 110 is seated and fixed on the horizontal portion 121 of the support middle 120 through the first double-sided adhesive tape 160 do.

Finally, by attaching the cover window 140 through the second double-sided adhesive tape (not shown) in front of the OLED panel 110, the modularization process of the OLED (100 in FIG. 1) is completed.

In this way, by assembling and fastening the support middle 120 and the back cover 130 to each other through the screw 150, when the defect of the OLED panel 110 occurs or the defect of the back cover 130 occurs, the OLED panel The 110 and the back cover 130 can be easily separated.

That is, when the support middle 120 and the back cover 130 are separated by loosening the fastening of the screw 150 from the support middle 120 and the back cover 130 including the OLED panel 110, the OLED panel 110 And the back cover 130 are easily separated, so that only the OLED panel 110 or the back cover 130 having a defect can be disposed of, thereby improving the efficiency of the process.

That is, as illustrated in FIG. 6A, the back cover 130 and the support middle 120 are burrs of the second screw hole 133 and the support middle 120 of the back cover 130 from the back surface of the back cover 130. Through the screw 150 inserted into the first screw hole 125b of the ring tab 125, they are assembled and fastened to each other, and to the upper portion of the horizontal portion 121 of the support middle 120 assembled and fastened with the back cover 130. The OLED panel 110 is attached and fixed through the first double-sided adhesive tape 160.

Then, the cover window 140 is attached and fixed to the front side of the OLED panel 110 through a second double-sided adhesive tape (not shown).

At this time, the support middle 120 is located on the second stepped 131 of the back cover 130 so that the inner surface of the back cover 130 and the support middle 120 are formed to have the same height, and the first double-sided adhesive tape 160 is located on the first step 127 of the support middle (120).

Through this, the modular OLED of the present invention (100 of FIG. 1) can prevent the thickness of the OLED (100 of FIG. 1) from being thickened or the non-display area of the bezel area is widened by the support middle 120.

That is, when the support middle 120 is assembled and fastened with the back cover 130 without forming the second step 131 on the back cover 130, the modular OLED (100 in FIG. 1) is the support middle 120 ), or the support middle 120 is formed to guide the side surface of the OLED panel 110, so that the non-display area, the bezel area, can be widened.

In addition, when the first step 127 is not formed in the support middle 120, the thickness of the OLED (100 in FIG. 1) modularized by the thickness of the first double-sided adhesive tape 160 may be thickened.

Here, when the defect of the OLED panel 110 occurs in the modular OLED (100 in FIG. 1) or the defect of the back cover 130 occurs, as shown in FIG. 6B, it penetrates from the rear surface of the back cover 130. By unscrewing the inserted screw 150, the back cover 130 and the support middle 120 are separated. At this time, the OLED panel 110 is attached through the support middle 120 and the first double-sided adhesive tape 160, and Since it is fixed, the OLED panel 110 and the back cover 130 are separated.

Therefore, only the OLED panel 110 or the back cover 130 having a defect can be disposed of, compared to the existing process in which both the OLED panel 110 and the back cover 130 are disposed together. It is possible to reduce the cost and the process time, thereby improving the efficiency of the process.

In addition, since the magnetic pad for fixing the OLED panel 110 to the back cover 130 can be deleted, the manufacturing cost of the OLED (100 in FIG. 1) by the magnetic pad increases, and the efficiency of the process is lowered. This can be prevented from occurring.

In addition, the OLED panel 110 is supported on the support middle 120 only at the rear edge, so that a certain separation space may exist between the OLED panel 110 and the back cover 130, through which a magnetic pad or a back cover 130 ) Can prevent the OLED panel 110 from being pressed.

In addition, as a space between the back cover 130 and the OLED panel 110, a heat dissipation design for heat dissipation of the OLED panel 110 can be formed. For example, a heat radiation pad or a heat dissipation metal plate is provided on the rear surface of the OLED panel 110. By placing the heat dissipation member 170 made of the high-temperature heat generated from the OLED panel 110 can be effectively discharged to the outside.

That is, when the OLED panel 110 is driven, the temperature is increased to about 80 to 90°C by the heat generated with the deterioration of the driving thin film transistor (DTr in FIG. 2 ). Due to such high heat, the lifespan of the OLED (100 in FIG. 1) is rapidly reduced.

Therefore, the OLED (100 in FIG. 1) is important in heat dissipation design for rapidly discharging high-temperature heat generated from the OLED panel 110 to the outside, the OLED according to the embodiment of the present invention (100 in FIG. 1) ), because the magnetic pad is not located on the back of the OLED panel 110, the heat dissipation design can be implemented by placing the heat dissipation member 170 made of a heat dissipation pad or a heat dissipation metal plate on the back of the OLED panel 110. The high-temperature heat generated from the 110 can be effectively radiated to the outside.

Therefore, the OLED according to the embodiment of the present invention (100 in FIG. 1) can finally improve the reliability of the product.

The present invention is not limited to the above-described embodiments, and can be implemented by variously changing within the limits without departing from the spirit of the present invention.

110: OLED panel
120: support middle (121: horizontal portion, 123: vertical portion, 125: burring tab, 125a: the first screw hole, 127: the first stepped)
130: back cover (130a, 130b: first and second metal layers, 130c: inorganic layer, 131: second stepped, 133: second screw hole)
140: cover window
150: screw (151: shaft, 153: head)
160: first double-sided adhesive tape
170: heat dissipation member

Claims (12)

OLED panel;
A support frame having a rectangular frame shape including a horizontal portion to which a rear edge of the OLED panel is attached, and a burring tap formed to protrude from the rear surface of the horizontal portion and having a first screw hole;
A back cover comprising a second screw hole corresponding to the first screw hole, made of a plate shape in which the support middle is seated
Including, the support middle and the back cover are assembled and fastened to each other through screws passing through the first and second screw holes,
The support middle includes a horizontal portion where the burring tab is located, and a first step is located at an inner edge of the horizontal portion,
A second step is provided along the edge of the back cover, so that the support middle is seated on the second step,
The height of the support middle corresponds to the height of the second stepped, and the upper surface of the horizontal portion and the inner surface of the back cover form the same height.
According to claim 1,
The support middle and the back cover are organic light emitting devices that are separated from each other when the screw is disassembled.
According to claim 1,
The support middle is an organic light emitting device including a vertical portion bent vertically from the horizontal portion.
The method of claim 3,
An organic light emitting device having a double-sided adhesive tape provided on the first step, and having a rear edge of the OLED panel attached to the horizontal portion of the support middle.
delete According to claim 1,
The width of the second stepped organic light emitting device corresponding to the width of the support middle.
According to claim 1,
The back cover is an organic light-emitting device comprising at least one of aluminum (Al), copper (Cu), zinc (Zn), silver (Ag), gold (Au), iron (Fe), and electro-galvanized steel sheet (EGI).
According to claim 1,
The back cover is an organic light emitting device made of an inorganic layer interposed between the first and second metal layers and the first and second metal layers.
The method of claim 8,
The second stepped organic light emitting device comprising the first and second metal layers.
The method of claim 8,
The first and second metal layers are made of aluminum (Al), and the inorganic layer is an organic light emitting device made of a silicone-based resin having adhesive properties.
According to claim 1,
The rear surface of the OLED panel is provided with a heat radiation member in contact,
The heat dissipation member is an organic light emitting device that is in contact with the inner surface of the back cover.
According to claim 1,
An organic light emitting device comprising a cover window positioned in front of the OLED panel.

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