KR20160015148A - Photoelectric sensor and mehtod for manufacturing photoelectric seonsor - Google Patents

Photoelectric sensor and mehtod for manufacturing photoelectric seonsor Download PDF

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Publication number
KR20160015148A
KR20160015148A KR1020150068777A KR20150068777A KR20160015148A KR 20160015148 A KR20160015148 A KR 20160015148A KR 1020150068777 A KR1020150068777 A KR 1020150068777A KR 20150068777 A KR20150068777 A KR 20150068777A KR 20160015148 A KR20160015148 A KR 20160015148A
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South Korea
Prior art keywords
light
frame
receiving element
circuit board
cover
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KR1020150068777A
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Korean (ko)
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KR101985055B1 (en
Inventor
료수케 남바
모투 나이토
Original Assignee
파나소닉 디바이스 썬크스 주식회사
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00—Prospecting or detecting by optical means
    • G01V8/10—Detecting, e.g. by using light barriers
    • G01V8/12—Detecting, e.g. by using light barriers using one transmitter and one receiver
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details

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  • Switches Operated By Changes In Physical Conditions (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Geophysics And Detection Of Objects (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geophysics (AREA)

Abstract

An object of the present invention is to provide a photoelectric sensor excellent in water resistance. A photoelectric sensor that houses a circuit board having a light emitting element and a light receiving element for detecting the object to be detected and a control circuit for outputting a detection signal when detecting the object to be detected based on the operation of the light emitting element and the light receiving element, A frame member having a light emitting element, a light receiving element and a circuit board, a cover member covering the frame member, and a case molded to cover the frame member and the cover member, Is formed into a thermoplastic resin.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a photoelectric sensor,

The present invention relates to a photoelectric sensor.

The photoelectric sensor is provided such that the light projecting portion and the light receiving portion are opposed to each other and the object to be detected can be detected when the detection light such as infrared ray output from the light projecting portion toward the light receiving portion is blocked by the object to be detected.

A control circuit for controlling the output operation of the detection light from the light projecting unit and a control circuit for controlling the output operation of the detection light from the light projecting unit and the light receiving unit, And outputs the detection signal to a control system that performs position control or the like of the to-be-detected portion.

In a control system in which such a photoelectric sensor is installed, cleaning of the system may be performed by spraying washing water. Therefore, it is necessary to secure the water resistance required by the photoelectric sensor.

Patent Document 1 discloses a photosensor in which the amplifier portion is molded with resin and further accommodated in a case.

(Patent Document 1) JP Publication No. 11-145505

In the photo sensor disclosed in Patent Document 1, the amplifier portion is molded with resin to have water resistance, but the terminals of the amplifier portion, the lead portion connecting the light-projecting portion and the light-receiving portion to the amplifier portion are not molded.

Therefore, when the washing water enters the case, the terminals of the lead or the amplifier are short-circuited, and the photosensor is not normally operated.

The present invention has been made in view of such circumstances, and its object is to provide a photoelectric sensor excellent in water resistance.

A photoelectric sensor that solves the above problems includes a light emitting element and a light receiving element that detect a detected object and a control circuit that outputs a detection signal when the detected object is detected based on the operation of the light emitting element and the light receiving element A photoelectric sensor in which a circuit board is housed in a case, the photoelectric sensor comprising: a frame member holding the light emitting element, the light receiving element, and the circuit board; a cover member covering the frame member; Wherein the frame member, the cover member, and the case are formed of a thermoplastic resin.

With this configuration, the interface between the case and the frame member and the cover member is melted to improve water tightness.

Further, in the photoelectric sensor, it is preferable that a space is provided between the circuit element mounting surface of the circuit board and the cover member.

With this configuration, thermal stress applied to the circuit elements on the circuit board at the time of molding the case is reduced.

Further, in the photoelectric sensor, the light-emitting element, the light-receiving element, and the circuit board are mounted on a metal frame, and a frame member holding the light-emitting element, a frame member holding the light- And the metal frame is folded so that a frame member holding the light transmitting element and a frame member holding the light receiving element are vertically erected on both sides of the frame member holding the circuit board, The cover member is integrally formed to cover the frame member.

With this configuration, the frame members cover the frame members at the time of forming the case.

In the photoelectric sensor, it is preferable that the wiring connected to the circuit board is covered with a covering member, and the case is formed such that the wiring covered with the covering member is exposed from the case.

This configuration improves watertightness between the case and the wiring.

A method of manufacturing a light receiving sensor that solves the above problems is characterized by including the steps of forming a terminal for connecting a light emitting element, a light receiving element, a circuit board, and a wiring on a metal frame, A light receiving element frame, a base member holding the circuit board, and a terminal member holding the terminal are formed on the metal frame by thermoplastic resin, and the light transmitting element and the light receiving element are electrically connected to the circuit board The metal frame is folded so that the light projecting element and the light receiving element are opposed to each other so that the light transmitting element frame and the light receiving element frame and the base member are attached with a cover member molded from thermoplastic resin, And molding the case of the thermoplastic resin so as to cover the terminal member.

With this configuration, the interface between the case and the frame member and the cover member is melted to improve water tightness.

According to the photoelectric sensor of the present invention, the water resistance of the photoelectric sensor can be improved.

1 is a perspective view showing a photoelectric sensor.
2 is a perspective view showing a main part of the photoelectric sensor.
3 is a perspective view showing the cover member.
4 is a perspective view showing the cover member.
5 is a perspective view showing a state in which the cover member is attached to a main portion;
6 is a perspective view showing a state in which the cover member is attached to the main part.
7 is a front view showing a state in which a cover member is attached to a main part.
8 is a sectional view showing a state in which the cover member is attached to a main portion.
9 is a sectional view showing the substrate cover.

Hereinafter, one embodiment of the photoelectric sensor will be described with reference to the drawings. The photoelectric sensor shown in Fig. 1 has an attachment piece 2 formed on one side of a case 1 formed integrally with a thermoplastic resin, and two attachment holes 3 are formed in the attachment piece 2 in the vertical direction. So that it can be fixed to a predetermined attaching position by inserting an attaching screw or the like into the attaching hole 3. In this embodiment, the case 1 is formed of PBT (polybutylene terephthalate) so that the strength to prevent buckling from occurring when screws are tightened is secured.

On the upper surface of the case 1, the light projecting portion 4 and the light receiving portion 5 are provided so as to extend upward so as to face each other with a predetermined gap therebetween. A light-receiving element is incorporated in the light-projecting portion 4 and a light-receiving element is incorporated in the light-receiving portion 5. The infrared light output from the light-projecting element is received by the light-receiving element through the outer frame of the light- It is possible.

Next, the main parts of the light receiving sensor accommodated in the case 1 will be described.

The main portion M shown in Fig. 2 is formed by molding a resin frame with PBT for each of the circuit board 6, the light projecting element 7 and the light receiving element 8 electrically connected on the lead frame, folding the resin frame appropriately Respectively.

On the circuit board 6, a control circuit composed of passive elements such as an IC chip, a resistor and a capacitor, and a light emitting element 25 are mounted. A base member 9 having a rectangular frame shape is formed so as to surround the circuit board 6 to constitute the base portion 10.

A light-transmissive element frame 11 is vertically erected on one side in the long side direction of the substrate portion 10 and a light-receiving element frame 12 is vertically erected on the other side in the long side direction. The light transmitting element frame 11 is a resin frame for protecting the light transmitting element 7 and the light receiving element frame 12 is a resin frame for protecting the light receiving element 8. [

In the state that the light transmitting element frame 11 and the light receiving element frame 12 are vertically bent while being bent at the lead portion between the light transmitting element frame 11 and the light receiving element frame 12 and the base member 9, 7 and the light receiving element 8 are opposed to each other.

The reinforcing portion 13 and the terminal member 14 connected to the base member 9 through leads are bent so as to turn into the back surface of the base member 9 at the lead portion. As shown in Figs. 6 and 7, the uncovered ends of the wirings 16a to 16d are respectively connected to the four terminals 15a to 15d exposed on the back surface of the terminal member by soldering or the like. The wirings 16a to 16d are power supply wirings and signal lines, and the terminal member 14 is covered by the covering member 17 all the way to the bottom.

3 shows a cover member 18 attached so as to cover the substrate portion 10, the light-transmitting element frame 11 and the light-receiving element frame 12 prior to the molding of the case 1. As shown in Fig. The cover member 18 is formed of a thermoplastic resin that transmits visible light and a thermoplastic resin that does not transmit visible light, and is formed of PC (polycarbonate) in this embodiment.

A substrate cover 19 formed in a lid shape covering the upper surface of the substrate portion 10 is formed in a red color and is vertically erected at both end portions in the longitudinal direction of the substrate cover 19, And the frame covers 20 and 21 covering the opposed surfaces of the light receiving element frame 12 are formed of black resin.

As shown in Fig. 4, on the back surface of the substrate cover 19, a frame portion 22 is formed on the outer periphery of the substrate cover 19 so as to be fittable to the outer peripheral portion of the base member 9. As shown in Fig. On the back of the substrate cover 19 on the inside of the frame shape portion 22, a plurality of concavities and convexities 23 having a wavy section in cross section along the long side direction of the substrate cover 19 are formed as shown in Fig.

When the substrate cover 19 of the cover member 18 is fitted to the base member 9 as shown in Fig. 5, the opposed faces of the translucent element frame 11 and the light receiving element frame 12 to the frame covers 20, The surface is covered.

A space 24 is secured between the circuit element mounting surface of the circuit board 6 and the lower surface of the substrate cover 19 as shown in Fig.

The cover member 18 is set on the mold with the cover member 18 attached to the substrate unit 10, the light-transmitting element frame 11 and the light-receiving element frame 12, and the upper surface and the side surface of the substrate cover 19 are exposed The case 1 is molded. 1, except for the substrate cover 19, the substrate portion 10, the light-transmitting element frame 11, the light receiving element frame 12, and the frame covers 20 and 21 are covered with the case 1, . At this time, the wiring lines 16a and 16d are exposed from the case 1 as a portion covered with the covering member 17, and the covering member 17 is held in a watertight state with respect to the case.

Next, the operation of the photoelectric sensor constructed as described above will be described.

In the photoelectric sensor, the substrate 10, the light-transmitting element frame 11 and the light-receiving element frame 12, the wirings 16a to 16d, and the leads for connecting them are connected to the case (not shown) 1 and the substrate cover 19, respectively.

Since the case 1, the base member 9, the base member 10, the reinforcing member 13, the terminal member 14 and the cover member 18 molded by PBT are all made of thermoplastic resin, 1, the boundary between the case 1 and the other member is melted to improve water tightness.

A space 24 is secured between the substrate cover 19 and the circuit board 6 in the substrate portion 10 during the molding of the case 1. [ Therefore, PBT does not flow on the circuit board 6 at the time of molding the case 1, so that the heat stress acting on the circuit element is reduced.

In the installation apparatus, when the object to be detected passes between the transparent portion 4 and the light receiving portion 5, infrared light output from the light transmitting element toward the light receiving element is blocked by the object to be detected. Then, in the control circuit mounted on the substrate unit 10, the passage of the object to be detected is detected, and the detection signal is outputted to the control system connected to the wirings 16a to 16d, and simultaneously the light emitting element 25 is turned on.

When the light emitting element 25 is turned on, the visible light is scattered by the projections and depressions 23 on the back surface of the substrate cover 19 and passes through the substrate cover 19. Since the scattered light is emitted from the upper surface and the side surface of the substrate cover 19, almost all of the substrate cover 19 is turned on in red.

In the photoelectric sensor as described above, the following effects can be obtained.

(1) The base member 9, the base member 10, the reinforcing member 13, the terminal member 14 and the cover member 18 molded of PC, which is a thermoplastic resin, molded substantially of PBT, which is a thermoplastic resin, Since the case 1 is molded with PBT, the interface between the case 1 and the other member at the time of molding the case 1 is mutually melted, and water tightness is improved. Therefore, a photoelectric sensor having excellent water resistance can be formed.

(2) The case 1 can be formed in a state in which the space 24 is secured between the circuit board 6 and the substrate cover 19 by the substrate portion 10 and the substrate cover 19. Accordingly, it is possible to reduce the failure due to thermal stress of the circuit element on the circuit board, thereby improving the yield in the production.

(3) Since the substrate cover 19 of the cover member 18 is molded with a red PC, the substrate cover 19 can be turned on in red by the visible light output from the light emitting element 25 on the circuit board 6 have.

(4) The visible light output from the light emitting element 25 is scattered by the space between the circuit board 6 and the substrate cover 19 and the projections and depressions 23 of the substrate cover 19, do. Therefore, since the upper surface and the entire side surface of the substrate cover 19 are turned on in red, visibility from the periphery of the photoelectric sensor can be improved.

(5) Since the frame covers 20 and 21 are formed of a black PC, reception of visible light by the light receiving element 8 of the light receiving element frame 12 can be substantially blocked. Therefore, it is possible to prevent the visible light from entering the light receiving element 8, thereby preventing malfunction due to reception of visible light.

(6) Since the base member 9 is formed around the circuit board 6 to form the base 10, when the terminal member 14 is folded back to the circuit board 6, The action of mechanical stress can be alleviated. Therefore, damage to the circuit board 6 and the circuit elements due to mechanical stress can be prevented, and the yield during manufacturing can be improved.

The above embodiment may be modified as follows.

The substrate 10, the light-transmitting element frame 11 and the light-receiving element frame 12 of the above embodiment are formed by ABS (acrylonitrile butadiene styrene), PC, PPS (polyphenylene sulfide) instead of PBT It is possible. The cover member 18 may also be made of PMMA (polymethyl methacrylate) instead of PC.

The substrate cover 19 may be formed of a PC resin of a color that easily transmits visible light other than red.

1 case
6 circuit boards
7 floodlight element
8 Light receiving element
9 frame member (base member)
11 Frame member (light emitting element frame)
12 Frame member (light receiving element frame)
14 terminal member
15a to 15d terminals
16a to 16d wiring
17 coating member
18 cover member
19 substrate cover
23 unevenness
24 spaces

Claims (5)

A light-emitting element and a light-receiving element for detecting the object to be detected, and
And a control circuit for outputting a detection signal when detecting the object to be detected based on the operation of the light-emitting element and the light-
In the photoelectric sensor,
A frame member holding the light-emitting element, the light-receiving element, and the circuit board respectively;
A cover member covering the frame member; And
A case member molded to cover the frame member and the cover member
/ RTI >
Wherein the frame member, the cover member, and the case are formed of a thermoplastic resin. The method according to claim 1,
And a space is provided between the circuit element mounting surface of the circuit board and the cover member. 3. The method according to claim 1 or 2,
The light receiving element and the circuit board are mounted on a metal frame, and a frame member holding the light projector, a frame member holding the light receiving element, and a frame member holding the circuit board are mounted on a metal frame And the metal frame is folded so that a frame member holding the light transmitting element and a frame member holding the light receiving element are vertically erected on both sides of the frame member holding the circuit board, Is formed integrally so as to cover the light emitting element. 3. The method according to claim 1 or 2,
Wherein the wiring connected to the circuit board is covered with a covering member, and the case is formed such that a wiring covered with the covering member is exposed from the case. A light receiving element frame for holding the light receiving element, a base member for holding the circuit board, a light receiving element for holding the light receiving element, a terminal for connecting the light emitting element, the light receiving element, And a terminal member holding the terminal is formed on the metal frame by thermoplastic resin, and a metal frame for electrically connecting the light-transmitting element and the light-receiving element to the circuit board is folded to oppose the light-transmitting element and the light- , A cover member formed of a thermoplastic resin is attached to the light-transmitting element frame, the light-receiving element frame and the base member to mold the case of the thermoplastic resin to cover the light-transmitting element frame, the light receiving element frame, the base member and the terminal member Wherein the photoelectric sensor comprises a plurality of photoelectric sensors.
KR1020150068777A 2014-07-30 2015-05-18 Photoelectric sensor and mehtod for manufacturing photoelectric seonsor KR101985055B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014155046A JP6452978B2 (en) 2014-07-30 2014-07-30 Photoelectric sensor and method for manufacturing photoelectric sensor
JPJP-P-2014-155046 2014-07-30

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KR20160015148A true KR20160015148A (en) 2016-02-12
KR101985055B1 KR101985055B1 (en) 2019-05-31

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CN (1) CN204613424U (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6510346B2 (en) * 2015-07-23 2019-05-08 パナソニック デバイスＳｕｎｘ株式会社 Photoelectric sensor, manufacturing method of photoelectric sensor
TWM592592U (en) * 2019-11-20 2020-03-21 禾昌興業股份有限公司 Light sensing switch structure

Citations (5)

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Publication number Priority date Publication date Assignee Title
JPH11145505A (en) * 1997-11-11 1999-05-28 Omron Corp Photosensor and manufacture thereof
JP2004257857A (en) * 2003-02-26 2004-09-16 Omron Corp Photoelectric sensor
JP2008135683A (en) * 2006-10-24 2008-06-12 Sharp Corp Photo coupler and its manufacturing method, and electronic device using photo coupler
CN101832918A (en) * 2010-04-14 2010-09-15 南京大学 Ultraviolet photoelectric microsensor device for monitoring water quality on line and monitoring method
JP2011216372A (en) * 2010-03-31 2011-10-27 Panasonic Electric Works Sunx Co Ltd Multiple optical-axis photoelectric sensor and manufacturing method of multiple optical axis photoelectric sensor

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62149177A (en) * 1985-12-23 1987-07-03 Sharp Corp Manufacture optocoupler with connector
JPH04342916A (en) * 1991-05-20 1992-11-30 Omron Corp Photoelectric switch
JPH10242498A (en) * 1997-02-24 1998-09-11 Omron Corp Photosensor and manufacture thereof
JP2006073282A (en) * 2004-08-31 2006-03-16 Sunx Ltd Detection sensor and its manufacturing method
JP2007305673A (en) * 2006-05-09 2007-11-22 Mitsubishi Rayon Co Ltd Photoelectric sensor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11145505A (en) * 1997-11-11 1999-05-28 Omron Corp Photosensor and manufacture thereof
JP2004257857A (en) * 2003-02-26 2004-09-16 Omron Corp Photoelectric sensor
JP2008135683A (en) * 2006-10-24 2008-06-12 Sharp Corp Photo coupler and its manufacturing method, and electronic device using photo coupler
JP2011216372A (en) * 2010-03-31 2011-10-27 Panasonic Electric Works Sunx Co Ltd Multiple optical-axis photoelectric sensor and manufacturing method of multiple optical axis photoelectric sensor
CN101832918A (en) * 2010-04-14 2010-09-15 南京大学 Ultraviolet photoelectric microsensor device for monitoring water quality on line and monitoring method

Also Published As

Publication number Publication date
KR101985055B1 (en) 2019-05-31
JP2016031338A (en) 2016-03-07
CN204613424U (en) 2015-09-02
JP6452978B2 (en) 2019-01-16

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