TWI596794B - Photoelectric sensor and method for manufacturing the same - Google Patents
Photoelectric sensor and method for manufacturing the same Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V8/00—Prospecting or detecting by optical means
- G01V8/10—Detecting, e.g. by using light barriers
- G01V8/12—Detecting, e.g. by using light barriers using one transmitter and one receiver
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
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- H—ELECTRICITY
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- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/04—Pins or blades for co-operation with sockets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/10—Sockets for co-operation with pins or blades
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Description
本發明涉及關於光電傳感器及光電傳感器的製造方法。The present invention relates to a method of manufacturing a photosensor and a photosensor.
透射型的光電傳感器具有對峙地配置的投光部和受光部，從投光部朝向受光部射出檢測光。光電傳感器基於受光部中的檢測光的受光量將檢測信號輸出。基於該檢測信號，能檢測投光部與受光部之間的被檢測物（例如，參照專利文獻1）。The transmissive photoelectric sensor has a light projecting portion and a light receiving portion that are disposed to face each other, and emits detection light from the light projecting portion toward the light receiving portion. The photosensor outputs a detection signal based on the amount of light received by the detection light in the light receiving unit. The object to be detected between the light projecting unit and the light receiving unit can be detected based on the detection signal (for example, refer to Patent Document 1).
現有技術文獻 專利文獻 專利文獻1 ：日本特開平11－145505號公報PRIOR ART DOCUMENT Patent Document Patent Document 1: Japanese Patent Laid-Open No. Hei 11-145505
但是，根據設置場所，需要投光部和受光部的方向、電纜的引出方向不同、即外形形狀不同的種類的光電傳感器。並且，要求降低這樣的多種光電傳感器的製造相關成本。However, depending on the installation location, a photoelectric sensor of a type in which the direction of the light projecting unit and the light receiving unit and the direction in which the cables are taken out are different, that is, different shapes are required. Moreover, it is required to reduce the manufacturing-related costs of such a variety of photosensors.
本發明是為了解決上述問題而完成的，其目的在於提供能降低製造相關成本的光電傳感器。The present invention has been made to solve the above problems, and an object thereof is to provide a photoelectric sensor capable of reducing manufacturing-related costs.
解決上述問題的光電傳感器包含安裝於引線框中的投光元件、受光元件以及電路部件，所述光電傳感器具有主要部和內部連接器，所述主要部包含：電路基座，其包含安裝有所述電路部件的所述引線框的部分；投光元件基座和受光元件基座，其經由引線部連接到所述電路基座的兩端部，分別包含安裝有所述投光元件和所述受光元件的所述引線框的部分；彎曲基座，其經由引線部連接到所述電路基座的一端部；以及加強基座，其經由所述引線框所包含的連接部與所述彎曲基座連接，所述內部連接器具有多個連接端子，具有外部連接器插入的凹部，所述投光元件基座和所述受光元件基座以所述投光元件和所述受光元件相互對峙的方式且以相對於所述電路基座呈直角的方式彎曲地配置有所述引線部，所述連接部沿著與所述投光元件基座以及所述受光元件基座平行的方向配置，所述內部連接器的連接端子配置成沿著與所述連接部正交的方向延伸，連接到所述引線部，所述主要部是引線框被部分地模塑、具有藉由所述引線框的引線部連接的平面配置的電路基座、投光元件基座、受光元件基座、彎曲基座、加強基座以及端子基座的成形品中將所述加強基座與所述端子基座之間的引線部切斷而形成的。A photosensor that solves the above problems includes a light projecting element, a light receiving element, and a circuit component mounted in a lead frame, the photosensor having a main portion and an internal connector, the main portion including: a circuit base including a mounting a portion of the lead frame of the circuit component; a light projecting element base and a light receiving element base connected to both end portions of the circuit base via a lead portion, respectively including the light projecting element mounted thereon a portion of the lead frame of the light receiving element; a curved base connected to one end portion of the circuit base via a lead portion; and a reinforcing base via a connecting portion included in the lead frame and the curved base a socket connection, the internal connector having a plurality of connection terminals having a recess into which the external connector is inserted, the light projecting element base and the light receiving element base being opposed to each other by the light projecting element and the light receiving element And the lead portion is curvedly disposed at right angles to the circuit base, the connecting portion being along the light projecting element base and the light receiving element a seat is disposed in a parallel direction, the connection terminal of the internal connector is configured to extend in a direction orthogonal to the connection portion, and is connected to the lead portion, the main portion is a lead frame partially molded, having The reinforcing base is formed in a molded article of a circuit base, a light projecting element base, a light receiving element base, a curved base, a reinforcing base, and a terminal base which are arranged in a plane in which the lead portions of the lead frame are connected The lead portion is cut off from the terminal base.
根據該構成，用於光電傳感器的主要部相對於將引線框模塑而形成的成形品不包含端子基座，例如將成形品的加強基座與端子基座之間的引線部切斷而得到。另一方面，能使用具有端子基座的成形品，製作在端子基座上連接內部連接器的連接端子的其他形狀的光電傳感器。這樣，關於形狀不同的光電傳感器，主要的部分（電路基座、投光元件基座、受光元件基座、彎曲基座以及加強基座）共用。因此，如果預先準備1種成形品，能形成形狀不同的2種以上光電傳感器，所以製造相關成本降低。According to this configuration, the main portion for the photosensor does not include the terminal pedestal with respect to the molded article formed by molding the lead frame, and for example, the lead portion between the reinforced base of the molded article and the terminal pedestal is cut. . On the other hand, a molded article having a terminal base can be used, and a photosensor of another shape in which a connection terminal of the internal connector is connected to the terminal base can be produced. Thus, with respect to the photoelectric sensors having different shapes, the main portions (the circuit base, the light projecting element base, the light receiving element base, the curved base, and the reinforcing base) are shared. Therefore, if one type of molded article is prepared in advance, two or more types of photosensors having different shapes can be formed, and thus the manufacturing cost is lowered.
上述的光電傳感器較佳為：所述連接部具有切口部，所述連接端子插入到切口部與所述連接部連接。 根據該構成可藉著切口部使連接端子和連接部的連接部分變大，而使連接變得牢固。In the above photoelectric sensor, it is preferable that the connecting portion has a cutout portion, and the connection terminal is inserted into the cutout portion to be connected to the connection portion. According to this configuration, the connection portion between the connection terminal and the connection portion can be made larger by the notch portion, and the connection can be made firm.
解決上述問題的光電傳感器包含安裝於引線框中的投光元件、受光元件以及電路部件，所述光電傳感器的特徵在於，具有主要部和內部連接器，所述主要部由成形品構成，該成形品包含：電路基座，其包含安裝有所述電路部件的所述引線框的部分；投光元件基座和受光元件基座，其經由引線部連接到所述電路基座的兩端部，分別包含安裝有所述投光元件和所述受光元件的所述引線框的部分；彎曲基座，其經由引線部與所述電路基座的一端部串聯連接；加強基座，其經由所述引線框所包含的連接部與所述彎曲基座連接；以及端子基座，其經由引線部連接到所述加強基座，具有連接部，所述內部連接器具有多個連接端子，具有外部連接器插入的凹部，所述投光元件基座和所述受光元件基座以所述投光元件和所述受光元件相互對峙的方式且以相對於所述電路基座呈直角的方式彎曲地配置有所述引線部，所述端子基座所包含的引線框具有連接面，該連接面沿著與所述投光元件基座以及所述受光元件基座平行的方向形成，所述內部連接器的連接端子與所述端子基座的連接面平行地配置，連接到所述連接面。A photosensor that solves the above problems includes a light projecting element, a light receiving element, and a circuit component mounted in a lead frame, the photosensor having a main portion and an internal connector, the main portion being composed of a molded article, the forming The product includes: a circuit base including a portion of the lead frame on which the circuit component is mounted; a light projecting element base and a light receiving element base connected to both ends of the circuit base via a lead portion, a portion including the lead frame on which the light projecting element and the light receiving element are mounted; a curved base connected in series to one end of the circuit base via a lead portion; and a reinforcing base through which a connection portion included in the lead frame is connected to the curved base; and a terminal base connected to the reinforcement base via a lead portion, having a connection portion, the internal connector having a plurality of connection terminals, having an external connection a recessed portion into which the light projecting element base and the light receiving element base are opposed to each other with respect to the light projecting element and the light receiving element The lead base is bent at a right angle to the lead portion, and the lead frame included in the terminal base has a connecting surface along the base of the light projecting element and the base of the light receiving element The parallel direction is formed, and the connection terminal of the internal connector is disposed in parallel with the connection surface of the terminal base, and is connected to the connection surface.
根據該構成，成形品將引線框模塑而形成，在彎曲基座與加強基座之間具有連接部。因此，能利用連接部將連接端子連接。因此，能製作不利用端子基座的形狀的光電傳感器。如此般，關於形狀不同的光電傳感器，能使用包含主要部的成形品製作，所以製造相關成本降低。According to this configuration, the molded article is formed by molding the lead frame, and has a connection portion between the curved base and the reinforcing base. Therefore, the connection terminals can be connected by the connection portion. Therefore, it is possible to manufacture a photoelectric sensor that does not utilize the shape of the terminal base. As described above, the photoelectric sensor having a different shape can be produced using a molded article including the main portion, so that the manufacturing cost is lowered.
上述的光電傳感器較佳為具有：蓋構件，其覆蓋所述主要部；連接器蓋，其覆蓋所述內部連接器；以及殼體，其被成型為覆蓋所述主要部、所述蓋構件、所述連接器蓋，所述連接面彎曲成使得所述連接面位於所述殼體的中心。The above photosensor preferably has a cover member covering the main portion, a connector cover covering the internal connector, and a case formed to cover the main portion, the cover member, In the connector cover, the connecting surface is curved such that the connecting surface is located at the center of the housing.
根據該構成，因為連接面配設於殼體的中心，所以連接到該連接面的連接端子也配設於殼體的中心。因此，能使包含具有連接端子的連接器的光電傳感器小型化。According to this configuration, since the connection surface is disposed at the center of the casing, the connection terminal connected to the connection surface is also disposed at the center of the casing. Therefore, the photoelectric sensor including the connector having the connection terminal can be miniaturized.
解決上述問題的光電傳感器的製造方法包含以下步驟：將引線框部分地模塑，形成藉由所述引線框的引線部連接的平面配置的電路基座、投光元件基座、受光元件基座、彎曲基座、加強基座以及端子基座的成形品；將具有連接端子的連接器收納在連接器蓋中，並使所述連接端子從所述連接器蓋的貫穿孔突出；藉由將所述加強基座與所述端子基座之間的引線部切斷形成主要部；將所述主要部的引線構件折彎使所述投光元件基座和所述受光元件基座相互對峙；將所述電路基座和所述彎曲基座之間的引線部折彎，將包含所述彎曲基座和所述加強基座之間的引線部的連接部沿著與所述投光元件基座以及所述受光元件基座延伸的方向平行的方向配置；將從連接器蓋突出的所述連接端子以沿著與所述連接部正交的方向延伸的方式配置，將所述連接端子連接在所述連接部；安裝覆蓋所述電路基座、所述投光元件基座和所述受光元件基座的蓋構件；以及將所述主要部、所述蓋構件、所述連接器以及所述連接器蓋插入到模具內，並在所述模具內射出樹脂成形殼體。A method of manufacturing a photosensor that solves the above problems includes the steps of partially molding a lead frame to form a planar circuit substrate, a light projecting element base, and a light receiving element base that are connected by a lead portion of the lead frame a molded article of the bent base, the reinforcing base, and the terminal base; the connector having the connection terminal is housed in the connector cover, and the connection terminal is protruded from the through hole of the connector cover; The lead portion between the reinforcing base and the terminal base is cut to form a main portion; the lead member of the main portion is bent such that the light projecting element base and the light receiving element base face each other; And bending a lead portion between the circuit base and the curved base to connect a connecting portion including a lead portion between the curved base and the reinforcing base along a base of the light projecting element Arranging the seat and the direction in which the light receiving element base extends in parallel; the connection terminal protruding from the connector cover is disposed to extend in a direction orthogonal to the connection portion, and the connection terminal is connected In the office a connecting portion; a cover member covering the circuit base, the light projecting element base, and the light receiving element base; and the main portion, the cover member, the connector, and the connector The cover is inserted into the mold, and a resin molded case is injected into the mold.
根據該構成，用於光電傳感器的主要部相對於將引線框模塑而形成的成形品不包含端子基座，例如將成形品的加強基座與端子基座之間的引線部切斷而得到。另一方面，能使用具有端子基座的成形品，製作在端子基座上連接內部連接器的連接端子的其他形狀的光電傳感器。這樣，關於形狀不同的光電傳感器，主要的部分（電路基座、投光元件基座、受光元件基座、彎曲基座以及加強基座）共用。因此，如果預先準備1種成形品，能形成形狀不同的2種以上光電傳感器，所以製造相關成本降低。According to this configuration, the main portion for the photosensor does not include the terminal pedestal with respect to the molded article formed by molding the lead frame, and for example, the lead portion between the reinforced base of the molded article and the terminal pedestal is cut. . On the other hand, a molded article having a terminal base can be used, and a photosensor of another shape in which a connection terminal of the internal connector is connected to the terminal base can be produced. Thus, with respect to the photoelectric sensors having different shapes, the main portions (the circuit base, the light projecting element base, the light receiving element base, the curved base, and the reinforcing base) are shared. Therefore, if one type of molded article is prepared in advance, two or more types of photosensors having different shapes can be formed, and thus the manufacturing cost is lowered.
解決上述問題的光電傳感器的製造方法包含以下步驟：將引線框部分地模塑，形成藉由所述引線框的引線部連接的平面配置的電路基座、投光元件基座、受光元件基座、彎曲基座、加強基座以及端子基座的成形品；將具有連接端子的連接器收納在連接器蓋中，並使所述連接端子從所述連接器蓋的貫穿孔突出；將所述成形品的引線構件折彎使所述投光元件基座和所述受光元件基座相互對峙；將所述電路基座和所述彎曲基座之間的引線部、所述彎曲基座和所述加強基座的引線部、以及所述加強基座和所述端子基座之間的引線部折彎，將所述端子基座的連接部以沿著與所述投光元件基座以及所述受光元件基座延伸的方向平行的方向配置；將連接端子沿著與所述連接部平行的方向配置，並將所述連接端子與所述連接部連接；安裝覆蓋所述電路基座、所述投光元件基座和所述受光元件基座的蓋構件；以及將所述成形品、所述蓋構件、所述連接器以及所述連接器蓋插入到模具內，並在所述模具內射出樹脂成形殼體。A method of manufacturing a photosensor that solves the above problems includes the steps of partially molding a lead frame to form a planar circuit substrate, a light projecting element base, and a light receiving element base that are connected by a lead portion of the lead frame a molded article of the bent base, the reinforcing base, and the terminal base; the connector having the connection terminal is received in the connector cover, and the connection terminal is protruded from the through hole of the connector cover; The lead member of the molded article is bent such that the light projecting element base and the light receiving element base face each other; a lead portion between the circuit base and the curved base, the curved base, and the a lead portion of the reinforcing base, and a lead portion between the reinforcing base and the terminal base are bent, and the connecting portion of the terminal base is along the base and the light projecting element Arranging the direction in which the direction in which the light-receiving element base extends is parallel; arranging the connection terminal in a direction parallel to the connection portion, and connecting the connection terminal to the connection portion; mounting the circuit base and the cover Report a component base and a cover member of the light receiving element base; and inserting the molded article, the cover member, the connector, and the connector cover into a mold, and injecting a resin into the mold case.
根據該構成，成形品將引線框模塑而形成，在彎曲基座與加強基座之間具有連接部。因此，能利用連接部將連接端子連接。因此，能製作不利用端子基座的形狀的光電傳感器。這樣，關於形狀不同的光電傳感器，能使用包含主要部的成形品製作，所以製造相關成本降低。According to this configuration, the molded article is formed by molding the lead frame, and has a connection portion between the curved base and the reinforcing base. Therefore, the connection terminals can be connected by the connection portion. Therefore, it is possible to manufacture a photoelectric sensor that does not utilize the shape of the terminal base. As described above, the photoelectric sensor having a different shape can be produced using a molded article including the main portion, so that the manufacturing cost is lowered.
根據本發明的光電傳感器、光電傳感器的製造方法，能降低製造相關成本。According to the method of manufacturing a photosensor or a photosensor of the present invention, the manufacturing-related cost can be reduced.
以下說明一實施方式。 此外，附圖有時為了易於理解而將構成要素放大示出。構成要素的尺寸比率有時與實際尺寸或者其他附圖中的尺寸不同。另外，在剖視圖中，為了易於理解，有時將一部分構成要素的剖面線省略。An embodiment will be described below. Further, the drawings are sometimes shown enlarged in order to facilitate understanding. The size ratio of the constituent elements is sometimes different from the actual size or the size in other drawings. Further, in the cross-sectional view, the hatching of a part of the constituent elements may be omitted for the sake of easy understanding.
此外，在以下說明中，使用箭頭記號表示的方向。這些方向表示光電傳感器的裝配方向的一例。另外，在一部分圖中，用箭頭表示各方向。另外，有時在各圖的說明中對沒有示出的構件省略附圖標記。Further, in the following description, the direction indicated by the arrow mark is used. These directions indicate an example of the assembly direction of the photosensor. In addition, in some of the figures, the directions are indicated by arrows. In addition, in the description of each drawing, the reference numeral is omitted for members not shown.
圖1所示的光電傳感器10是第1類型的光電傳感器。將該類型設為K型。 K型的光電傳感器10具有基座部11、投光部12、受光部13、裝配部14、15，上述各部利用樹脂一體成形。樹脂是例如熱可塑性樹脂。基座部11、投光部12、受光部13包含後述的基座等成形品，以該成形品的一部分露出的方式被樹脂覆蓋。樹脂是例如PBT（聚對苯二甲酸丁二醇酯）。將該樹脂作為殼體10a。即，K型的光電傳感器10在殼體10a中埋設形成各部的成形品。The photosensor 10 shown in Fig. 1 is a photoelectric sensor of the first type. Set this type to K type. The K-type photosensor 10 includes a base portion 11, a light projecting portion 12, a light receiving portion 13, and mounting portions 14 and 15, and the respective portions are integrally molded by a resin. The resin is, for example, a thermoplastic resin. The base portion 11, the light projecting portion 12, and the light receiving portion 13 include a molded article such as a susceptor to be described later, and are covered with a resin so that a part of the molded article is exposed. The resin is, for example, PBT (polybutylene terephthalate). This resin was used as the casing 10a. In other words, the K-type photosensor 10 has a molded article in which each portion is formed in the casing 10a.
對各部依次說明。 基座部11形成為大致長方體狀。在基座部11的後方，投光部12和受光部13以隔著一定間隔對峙的方式向後方延設。在投光部12內內置有投光元件，在受光部13內內置有受光元件。從投光元件射出的檢測光（例如紅外光）經由投光部12和受光部13的外框由受光元件受光。Each part will be described in order. The base portion 11 is formed in a substantially rectangular parallelepiped shape. Behind the base portion 11, the light projecting portion 12 and the light receiving portion 13 are extended rearward so as to face each other at a constant interval. A light projecting element is built in the light projecting unit 12, and a light receiving element is incorporated in the light receiving unit 13. The detection light (for example, infrared light) emitted from the light projecting element is received by the light receiving element via the outer frame of the light projecting unit 12 and the light receiving unit 13.
在基座部11的左右兩端分別形成有裝配部14、15。在裝配部14、15中形成有在上下方向貫通裝配部14、15的裝配孔14a、15a。另外，在裝配部14、15中形成有在前後方向貫通裝配部14、15的裝配孔14b、15b。裝配部14、15利用成形殼體10a的樹脂一體成形。樹脂是例如PBT（聚對苯二甲酸丁二醇酯），確保在擰緊螺釘時可防止發生壓曲的強度。Mounting portions 14 and 15 are formed at the left and right ends of the base portion 11, respectively. Mounting holes 14a and 15a penetrating the fitting portions 14 and 15 in the vertical direction are formed in the fitting portions 14 and 15. Further, in the fitting portions 14 and 15, the fitting holes 14b and 15b penetrating the fitting portions 14 and 15 in the front-rear direction are formed. The fitting portions 14 and 15 are integrally molded by the resin of the molded casing 10a. The resin is, for example, PBT (polybutylene terephthalate), which ensures that the buckling strength is prevented when the screw is tightened.
在基座部11的前部埋設有被連接器蓋16覆蓋的連接器（內部連接器）17。連接器蓋16和連接器17的前方開口，在連接器17內配設有多個連接端子18。在該連接器17上插入接續用連接器（外部連接器）201。K型的光電傳感器10經由接續用連接器201連接到電纜202。A connector (internal connector) 17 covered by the connector cover 16 is buried in the front portion of the base portion 11. The connector cover 16 and the front opening of the connector 17 are provided with a plurality of connection terminals 18 in the connector 17. A connector (external connector) 201 is inserted into the connector 17. The K-type photosensor 10 is connected to the cable 202 via the connection connector 201.
接著，對光電傳感器的主要部進行說明。 圖2所示的K型用主要部20具有放大器基座21、投光元件基座22、受光元件基座23、彎曲基座24、加強基座25、端子基座26。這些基座藉由將引線框模塑而形成。即，該K型用主要部20是將引線框模塑而形成的成形品。並且，將引線框折彎而形成圖2所示的形狀的K型用主要部20。Next, the main part of the photosensor will be described. The K-type main portion 20 shown in FIG. 2 includes an amplifier base 21, a light projecting element base 22, a light receiving element base 23, a curved base 24, a reinforcing base 25, and a terminal base 26. These pedestals are formed by molding a lead frame. That is, the K-shaped main portion 20 is a molded article formed by molding a lead frame. Further, the lead frame is bent to form the K-shaped main portion 20 having the shape shown in FIG. 2 .
如圖2所示，放大器基座21具有形成為大致矩形板狀的基座部21a。在基座部21a中以引線框27從基座部21a的表面露出的方式埋設有引線框27。在基座部21a的表面的端部形成有四角框狀的基座框21b。即，放大器基座21具有使引線框27露出的矩形凹部。在被該基座框21b包圍的基座部21a的表面露出的引線框27上安裝有構成放大器電路的電路部件。電路部件包含發光元件31和IC晶片等晶片部件。As shown in FIG. 2, the amplifier base 21 has a base portion 21a formed in a substantially rectangular plate shape. The lead frame 27 is buried in the base portion 21a so that the lead frame 27 is exposed from the surface of the base portion 21a. A base frame 21b having a rectangular frame shape is formed at an end portion of the surface of the base portion 21a. That is, the amplifier base 21 has a rectangular recess that exposes the lead frame 27. A circuit component constituting the amplifier circuit is mounted on the lead frame 27 exposed on the surface of the base portion 21a surrounded by the base frame 21b. The circuit component includes a wafer component such as a light-emitting element 31 and an IC chip.
投光元件基座22和受光元件基座23形成為大致長方體狀。在投光元件基座22上形成有使引線框27露出的矩形的凹部22a。並且，在從該凹部22a處露出的引線框27中安裝中投光元件32。The light projecting element base 22 and the light receiving element base 23 are formed in a substantially rectangular parallelepiped shape. A rectangular recess 22a that exposes the lead frame 27 is formed on the light projecting element base 22. Further, the center light projecting element 32 is mounted on the lead frame 27 exposed from the concave portion 22a.
此外，雖然圖2中沒有示出，但是在受光元件基座23中與投光元件基座22同樣形成有使引線框露出的凹部，在從該凹部處露出的引線框中安裝有受光元件33。Further, although not shown in FIG. 2, a concave portion for exposing the lead frame is formed in the light receiving element base 23 similarly to the light projecting element base 22, and the light receiving element 33 is attached to the lead frame exposed from the concave portion. .
圖3示出覆蓋放大器基座21、投光元件基座22、受光元件基座23的蓋構件40。蓋構件40具有放大器蓋41、投光部蓋42、受光部蓋43。如圖6所示，蓋構件40固定於K型用主要部20。3 shows a cover member 40 that covers the amplifier base 21, the light projecting element base 22, and the light receiving element base 23. The cover member 40 has an amplifier cover 41, a light projecting portion cover 42, and a light receiving portion cover 43. As shown in FIG. 6, the cover member 40 is fixed to the K-shaped main portion 20.
放大器蓋41形成為覆蓋圖2所示的放大器基座21的基座框21b的蓋狀。放大器蓋41用具有使可見光透射的性質的樹脂、例如紅色的樹脂形成。投光部蓋42和受光部蓋43相對於放大器蓋41垂直地形成於放大器蓋的長度方向兩端部。The amplifier cover 41 is formed in a lid shape covering the base frame 21b of the amplifier base 21 shown in Fig. 2 . The amplifier cover 41 is formed of a resin having a property of transmitting visible light, for example, a red resin. The light projecting portion cover 42 and the light receiving portion cover 43 are formed perpendicularly to the amplifier cover 41 at both end portions in the longitudinal direction of the amplifier cover.
投光部蓋42和受光部蓋43以覆蓋圖2所示的投光元件基座22和受光元件基座23的對峙面的方式形成。投光部蓋42和受光部蓋43用具有使可見光不透射的性質的樹脂、例如黑色的樹脂形成。即，蓋構件40是二色成形的。蓋構件40使用例如PC（聚碳酸酯）等熱可塑性樹脂。The light projecting unit cover 42 and the light receiving unit cover 43 are formed to cover the opposing faces of the light projecting element base 22 and the light receiving element base 23 shown in FIG. 2 . The light projecting portion cover 42 and the light receiving portion cover 43 are formed of a resin having a property of not transmitting visible light, for example, a black resin. That is, the cover member 40 is formed in two colors. As the cover member 40, a thermoplastic resin such as PC (polycarbonate) is used.
如圖4所示，在放大器蓋41的內面的外周部形成有框狀部41a，框狀部41a能嵌合放大器基座21的外周部。另外，在框狀部41a的內側，且在放大器蓋41的內面形成有沿著放大器蓋41的長度方向延伸的多個凹部41b。由於這些凹部41b，放大器蓋41的內面形成為波狀截面。As shown in FIG. 4, a frame-like portion 41a is formed on the outer peripheral portion of the inner surface of the amplifier cover 41, and the frame-like portion 41a can be fitted to the outer peripheral portion of the amplifier base 21. Further, inside the frame-like portion 41a, a plurality of concave portions 41b extending in the longitudinal direction of the amplifier cover 41 are formed on the inner surface of the amplifier cover 41. Due to these recessed portions 41b, the inner surface of the amplifier cover 41 is formed in a wavy cross section.
當使這樣的蓋構件40的放大器蓋41與放大器基座21嵌合時，形成有被放大器基座21和放大器蓋41包圍的空間。在該空間中配設有圖2所示的發光元件31等的電路部件。另外，投光部蓋42和受光部蓋43覆蓋投光元件基座22和受光元件基座23的對峙面。並且，形成被投光元件基座22和投光部蓋42包圍的空間，在該空間中配有圖2所示的投光元件32。同樣，形成被受光元件基座23和受光部蓋43包圍的空間，在該空間中配設有圖2所示的受光元件33。When the amplifier cover 41 of such a cover member 40 is fitted to the amplifier base 21, a space surrounded by the amplifier base 21 and the amplifier cover 41 is formed. A circuit component such as the light-emitting element 31 shown in Fig. 2 is disposed in this space. Further, the light projecting unit cover 42 and the light receiving unit cover 43 cover the facing surfaces of the light projecting element base 22 and the light receiving element base 23. Further, a space surrounded by the light projecting element base 22 and the light projecting unit cover 42 is formed, and the light projecting element 32 shown in Fig. 2 is disposed in the space. Similarly, a space surrounded by the light-receiving element base 23 and the light-receiving portion cover 43 is formed, and the light-receiving element 33 shown in Fig. 2 is disposed in the space.
蓋構件40的放大器蓋41利用紅色的樹脂成形。由於從安裝於引線框27的發光元件31射出的可見光，放大器蓋41點亮為紅色。從發光元件31射出的可見光由於放大器蓋41的凹部41b成為散射光並通過放大器蓋41。因此，放大器蓋41的上表面和側面整體成為點亮為紅色的狀態，所以從K型的光電傳感器10的周圍的能見性提高。The amplifier cover 41 of the cover member 40 is formed using a red resin. The amplifier cover 41 is lit in red due to visible light emitted from the light-emitting element 31 mounted on the lead frame 27. The visible light emitted from the light-emitting element 31 becomes scattered light by the concave portion 41b of the amplifier cover 41 and passes through the amplifier cover 41. Therefore, the entire upper surface and the side surface of the amplifier cover 41 are in a state of being lit red, so the visibility from the periphery of the K-type photosensor 10 is improved.
圖7示出將引線框折彎前的K型用主要部20。該圖7所示的K型用主要部20作為成形品形成。 引線框27包含多個引線構件。將該引線框27內裝於模具中，利用樹脂模塑規定部位而形成放大器基座21、投光元件基座22、受光元件基座23、彎曲基座24、加強基座25、端子基座26。將連結各基座的引線框作為引線部。即，在放大器基座21的長度方向端部經由引線部27a、27b連接有投光元件基座22和受光元件基座23。在放大器基座21的寬度方向一端經由引線部27a、27d、7e串聯連接有彎曲基座24、加強基座25以及端子基座26。Fig. 7 shows the K-shaped main portion 20 before the lead frame is bent. The K-shaped main portion 20 shown in Fig. 7 is formed as a molded article. The lead frame 27 includes a plurality of lead members. The lead frame 27 is housed in a mold, and a predetermined portion of the resin is molded to form an amplifier base 21, a light projecting element base 22, a light receiving element base 23, a curved base 24, a reinforcing base 25, and a terminal base. 26. A lead frame connecting the pedestals is used as a lead portion. In other words, the light projecting element base 22 and the light receiving element base 23 are connected to the end portion of the amplifier base 21 in the longitudinal direction via the lead portions 27a and 27b. The curved base 24, the reinforcing base 25, and the terminal base 26 are connected in series to the one end in the width direction of the amplifier base 21 via the lead portions 27a, 27d, and 7e.
此外，在圖7中，用粗線示出引線框27，用細線示出各基座。放大器基座21的引線框27在圖7的內面側露出，在該露出的引線框27上連接有包含圖2所示的發光元件31在內的電路部件。同樣，投光元件基座22和受光元件基座23的引線框在圖7的內面側露出，在該露出的引線框27上分別連接有圖2所示的發光元件31和受光元件33。端子基座26的引線框27在圖7的外表面側露出。該露出的引線框27作為相對於連接器的端子的連接部51發揮作用。Further, in Fig. 7, the lead frame 27 is shown by a thick line, and each of the pedestals is shown by a thin line. The lead frame 27 of the amplifier base 21 is exposed on the inner surface side of FIG. 7, and a circuit component including the light-emitting element 31 shown in FIG. 2 is connected to the exposed lead frame 27. Similarly, the lead frame of the light projecting element base 22 and the light receiving element base 23 is exposed on the inner surface side of FIG. 7, and the light emitting element 31 and the light receiving element 33 shown in FIG. 2 are connected to the exposed lead frame 27, respectively. The lead frame 27 of the terminal base 26 is exposed on the outer surface side of FIG. The exposed lead frame 27 functions as a connection portion 51 with respect to the terminal of the connector.
彎曲基座24與加強基座25之間的引線部27d作為相對於連接器的端子的連接部52發揮作用。詳細地說，引線框27具有彎曲基座24與加強基座25之間的引線部27d。另外，引線框27具有保持於加強基座25的大致矩形板狀的保持部52a。該保持部52a從加強基座25朝向彎曲基座24突出。引線框27還具有從保持部52a朝向彎曲基座24與引線部27d平行地突出的突出部52b。引線部27d、保持部52a以及突出部52b在彎曲基座24與加強基座25之間構成大致ㄇ字狀的連接部52。因此，連接部52具有利用引線部27d、保持部52a以及突出部52b形成的切口部。該連接部52被利用於後述的L型的光電開關中。The lead portion 27d between the curved base 24 and the reinforcing base 25 functions as a connecting portion 52 with respect to the terminal of the connector. In detail, the lead frame 27 has a lead portion 27d between the curved base 24 and the reinforcing base 25. Further, the lead frame 27 has a substantially rectangular plate-shaped holding portion 52a held by the reinforcing base 25. The holding portion 52a protrudes from the reinforcing base 25 toward the curved base 24. The lead frame 27 further has a protruding portion 52b that protrudes in parallel with the lead portion 27d from the holding portion 52a toward the curved base 24. The lead portion 27d, the holding portion 52a, and the protruding portion 52b form a substantially U-shaped connecting portion 52 between the curved base 24 and the reinforcing base 25. Therefore, the connecting portion 52 has a cutout portion formed by the lead portion 27d, the holding portion 52a, and the protruding portion 52b. This connection portion 52 is used in an L-type photoelectric switch to be described later.
如圖8所示，引線部27c被折彎，彎曲基座24配置於放大器基座21的側方（在圖8中為放大器基座21的上側）。而且，引線部27d、27e分別被折彎，加強基座25和端子基座26配設於放大器基座21的內面側（在圖8中為放大器基座21的左側）。此時，端子基座26配設成，使其端子基座26所包含的引線框27（連接部51）與受光元件基座23延伸的方向（在圖8中為左右方向）平行。As shown in FIG. 8, the lead portion 27c is bent, and the curved base 24 is disposed on the side of the amplifier base 21 (the upper side of the amplifier base 21 in Fig. 8). Further, the lead portions 27d and 27e are respectively bent, and the reinforcing base 25 and the terminal base 26 are disposed on the inner surface side of the amplifier base 21 (on the left side of the amplifier base 21 in Fig. 8). At this time, the terminal base 26 is disposed such that the lead frame 27 (connecting portion 51) included in the terminal base 26 and the direction in which the light receiving element base 23 extends (the horizontal direction in FIG. 8) are parallel.
如圖9所示，端子基座26的連接部51與連接器17的連接端子18連接。 如圖10所示，連接器17具有多個連接端子18。本實施方式的連接器17具有4個連接端子18。2個連接端子是提供K型的光電傳感器10的工作電源的電源端子。2個連接端子是從K型的光電傳感器10輸出2個檢測信號的信號輸出端子。2個檢測信號是例如互補信號。As shown in FIG. 9, the connection portion 51 of the terminal base 26 is connected to the connection terminal 18 of the connector 17. As shown in FIG. 10, the connector 17 has a plurality of connection terminals 18. The connector 17 of the present embodiment has four connection terminals 18. The two connection terminals are power supply terminals that supply the operating power of the K-type photosensor 10. The two connection terminals are signal output terminals that output two detection signals from the K-type photosensor 10. The two detection signals are, for example, complementary signals.
連接器17具有圖1所示的接續用連接器201插入的凹部17a。連接端子18與插入到該凹部17a中的接續用連接器201的連接端子（省略圖示）電連接。連接端子18形成為矩形截面，從連接器17的後面突出。The connector 17 has a recess 17a into which the connection connector 201 shown in Fig. 1 is inserted. The connection terminal 18 is electrically connected to a connection terminal (not shown) of the connection connector 201 inserted into the recess 17a. The connection terminal 18 is formed in a rectangular cross section and protrudes from the rear of the connector 17.
如圖11（a）所示，連接器17被連接器蓋16覆蓋。如圖10所示，連接器蓋16具有收納連接器17的凹部16a。在連接器蓋16的凹部16a的內表面與連接器17的外表面之間遍及全周或者部分地形成有間隙。凹部16a的開口端、即插入連接器17的連接器插入口朝向連接器蓋16的內部形成有錐形面16b。藉由該錐形面16b，使得連接器17容易向凹部16a插入。As shown in FIG. 11(a), the connector 17 is covered by the connector cover 16. As shown in FIG. 10, the connector cover 16 has a recess 16a in which the connector 17 is housed. A gap is formed over the entire circumference or partially between the inner surface of the recess 16a of the connector cover 16 and the outer surface of the connector 17. The open end of the recess 16a, that is, the connector insertion opening into which the connector 17 is inserted, is formed with a tapered surface 16b toward the inside of the connector cover 16. By the tapered surface 16b, the connector 17 is easily inserted into the recess 16a.
在連接器蓋16的開口端形成有切口16c。切口16c使連接器17的卡合凸部17b露出。藉著該切口16c，插入到連接器17中的接續用連接器201（參照圖1）的卡合部201a與卡合凸部17b卡合，防止接續用連接器201脫離。A slit 16c is formed at the open end of the connector cover 16. The slit 16c exposes the engaging convex portion 17b of the connector 17. By the slit 16c, the engaging portion 201a of the joint connector 201 (see FIG. 1) inserted into the connector 17 is engaged with the engaging convex portion 17b, and the joint connector 201 is prevented from being detached.
在連接器蓋16的後板16d中形成有與連接器17的連接端子18對應的多個（4個）貫通孔16e（在圖10中示出2個）。貫通孔16e形成為與連接端子18大致相同的大小。連接器17的連接端子18形成為四邊形截面。貫通孔16e形成為，使得連接端子18與該貫通孔16e的內周面抵接或者從內周面稍微進入連接器蓋16。藉著如此形成貫通孔16e，從而限制插入到凹部16a的連接器17的移動，防止成形時的錯位。A plurality of (four) through holes 16e (two shown in FIG. 10) corresponding to the connection terminals 18 of the connector 17 are formed in the rear plate 16d of the connector cover 16. The through hole 16e is formed to have substantially the same size as the connection terminal 18. The connection terminal 18 of the connector 17 is formed in a quadrangular cross section. The through hole 16e is formed such that the connection terminal 18 abuts against the inner circumferential surface of the through hole 16e or slightly enters the connector cover 16 from the inner circumferential surface. By forming the through hole 16e in this manner, the movement of the connector 17 inserted into the concave portion 16a is restricted, and the displacement at the time of molding is prevented.
如圖11（a）和圖11（b）所示，在連接器蓋16的外表面形成有多種凹部16f。在該凹部16f中填充有成形圖1所示的殼體10a的樹脂。凹部16f與成形後的殼體10a卡合。例如，在上下方向（在圖11（a）中為上下方向）延伸的凹部16f在圖1所示的接續用連接器201的插拔方向上與成形後的殼體10a卡合。藉此防止連接器蓋16和連接器17相對於殼體10a脫落。As shown in FIGS. 11(a) and 11(b), a plurality of recesses 16f are formed on the outer surface of the connector cover 16. The recess 16f is filled with a resin for molding the casing 10a shown in Fig. 1. The recess 16f is engaged with the molded casing 10a. For example, the concave portion 16f extending in the vertical direction (the vertical direction in FIG. 11(a)) is engaged with the molded casing 10a in the insertion and removal direction of the joint connector 201 shown in FIG. Thereby, the connector cover 16 and the connector 17 are prevented from falling off relative to the housing 10a.
圖12所示的光電傳感器60是第2類型的光電傳感器。將該類型設為L型。 L型的光電傳感器60具有基座部61、投光部62、受光部63、裝配部64、65，上述各部利用樹脂一體成形。將該樹脂設為殼體60a。The photosensor 60 shown in Fig. 12 is a second type of photosensor. Set this type to L type. The L-type photosensor 60 includes a base portion 61, a light projecting portion 62, a light receiving portion 63, and attachment portions 64 and 65, and the respective portions are integrally molded by a resin. This resin is referred to as a casing 60a.
L型的光電傳感器60與圖1所示的K型的光電傳感器10大體上相同，但是投光部62和受光部63相對於基座部61的延伸方向不同。重點說明該不同部分。此外，在說明中，對與圖1所示的K型的光電傳感器10所包含的構件同樣的構件標注相同附圖標記，省略說明的一部分或者全部。The L-type photosensor 60 is substantially the same as the K-type photosensor 10 shown in FIG. 1, but the light projecting portion 62 and the light receiving portion 63 are different from each other in the extending direction of the base portion 61. Highlight the different parts. In the description, the same members as those of the K-type photosensor 10 shown in FIG. 1 are denoted by the same reference numerals, and a part or all of the description will be omitted.
基座部61形成為大致長方體狀。在基座部61的上方，投光部62和受光部63以隔著一定間隔對峙的方式向上方延設。在投光部62內內置有投光元件，在受光部63內內置有受光元件。從投光元件射出的檢測光（例如紅外光）經由投光部62和受光部63的外框由受光元件受光。The base portion 61 is formed in a substantially rectangular parallelepiped shape. Above the base portion 61, the light projecting portion 62 and the light receiving portion 63 are extended upward with a predetermined interval therebetween. A light projecting element is incorporated in the light projecting unit 62, and a light receiving element is incorporated in the light receiving unit 63. The detection light (for example, infrared light) emitted from the light projecting element is received by the light receiving element via the outer frame of the light projecting unit 62 and the light receiving unit 63.
在基座部61的左右兩端分別形成有裝配部64、65。在裝配部64、65中形成有在上下方向貫通裝配部64、65的裝配孔64a、65a。另外，在裝配部64、65中形成有在前後方向貫通裝配部64、65的裝配孔64b、65b。裝配部64、65利用成形殼體60a的樹脂一體成形。樹脂是例如PBT（聚對苯二甲酸丁二醇酯），確保在擰緊螺釘時可防止發生壓曲的強度。Mounting portions 64 and 65 are formed at the left and right ends of the base portion 61, respectively. Mounting holes 64a and 65a that penetrate the fitting portions 64 and 65 in the vertical direction are formed in the fitting portions 64 and 65. Further, in the fitting portions 64 and 65, fitting holes 64b and 65b penetrating the fitting portions 64 and 65 in the front-rear direction are formed. The fitting portions 64 and 65 are integrally molded by the resin of the molded casing 60a. The resin is, for example, PBT (polybutylene terephthalate), which ensures that the buckling strength is prevented when the screw is tightened.
在基座部61的前部埋設有被連接器蓋16覆蓋的連接器17。連接器蓋16和連接器17的前方開口，在連接器17內配設有多個連接端子。在該連接器17上插入接續用連接器201。L型的光電傳感器60經由接續用連接器201連接到電纜202。A connector 17 covered by the connector cover 16 is embedded in the front portion of the base portion 61. The connector cover 16 and the front opening of the connector 17 are provided with a plurality of connection terminals in the connector 17. A connector 201 for connection is inserted into the connector 17. The L-type photosensor 60 is connected to the cable 202 via the connection connector 201.
圖15所示的L型用主要部20a具有放大器基座21、投光元件基座22、受光元件基座23、彎曲基座24、加強基座25。即，該L型用主要部20a相對於圖2所示的K型用主要部20省略了端子基座26。該L型用主要部20a是加工成形品而形成的。The L-shaped main portion 20a shown in FIG. 15 has an amplifier base 21, a light projecting element base 22, a light receiving element base 23, a curved base 24, and a reinforcing base 25. In other words, the L-shaped main portion 20a omits the terminal base 26 with respect to the K-shaped main portion 20 shown in Fig. 2 . The L-shaped main portion 20a is formed by processing a molded article.
如圖13所示，將作為成形品的K型用主要部20的引線部在虛線所示的位置切斷，形成L型用主要部20a。將該L型用主要部20a的引線框27折彎而形成圖15所示的形狀的L型用主要部20a。As shown in FIG. 13, the lead portion of the K-type main portion 20 as a molded article is cut at a position indicated by a broken line to form an L-shaped main portion 20a. The lead frame 27 of the L-shaped main portion 20a is bent to form the L-shaped main portion 20a having the shape shown in Fig. 15 .
如圖14（a）所示，引線部27c被折彎，彎曲基座24配置於放大器基座21的側方（在圖14（a）中為放大器基座21的左側）。As shown in Fig. 14 (a), the lead portion 27c is bent, and the curved base 24 is disposed on the side of the amplifier base 21 (the left side of the amplifier base 21 in Fig. 14 (a)).
此時，彎曲基座24與加強基座25之間的引線部27d沒有被折彎。因此，蓋引線部27d與受光元件基座23延伸的方向（在圖14（a）中為上下方向）平行地延伸。並且，對該引線部27d配設有從連接器蓋16突出的連接端子18。At this time, the lead portion 27d between the curved base 24 and the reinforcing base 25 is not bent. Therefore, the cover lead portion 27d extends in parallel with the direction in which the light receiving element base 23 extends (in the vertical direction in FIG. 14(a)). Further, the lead portion 27d is provided with a connection terminal 18 that protrudes from the connector cover 16.
如圖16所示，在L型用主要部20a中，在彎曲基座24與加強基座25之間形成有連接部52。連接部52包含引線部27d、保持部52a以及突出部52b，形成為大致ㄇ字狀。並且，在引線部27d與突出部52b之間配設有連接端子18。並且，連接端子18和連接部52藉由焊錫連接。As shown in FIG. 16, in the L-shaped main portion 20a, a connecting portion 52 is formed between the curved base 24 and the reinforcing base 25. The connecting portion 52 includes a lead portion 27d, a holding portion 52a, and a protruding portion 52b, and is formed in a substantially U shape. Further, a connection terminal 18 is disposed between the lead portion 27d and the protruding portion 52b. Further, the connection terminal 18 and the connection portion 52 are connected by solder.
此外，該L型的光電傳感器60具有覆蓋圖14（b）所示的放大器基座21、投光元件基座22、受光元件基座23的蓋構件。該蓋構件具有與圖1所示的K型的光電傳感器10的蓋構件40（參照圖3）相同的形狀。因此，省略附圖和說明。Further, the L-type photosensor 60 has a cover member that covers the amplifier base 21, the light projecting element base 22, and the light receiving element base 23 shown in FIG. 14(b). This cover member has the same shape as the cover member 40 (see FIG. 3) of the K-type photosensor 10 shown in FIG. Therefore, the drawings and the description are omitted.
（作用） 接著，說明上述的光電傳感器10（60）的作用。 在K型的光電傳感器10中，放大器基座21、投光元件基座22、受光元件基座23、蓋構件40、連接器蓋16由殼體10a大致覆蓋。在殼體10a成形時，殼體10a和其他構件的表面相互熔融而密合。由此，K型的光電傳感器10的水密性提高。(Action) Next, the action of the above-described photosensor 10 (60) will be described. In the K-type photosensor 10, the amplifier base 21, the light projecting element base 22, the light receiving element base 23, the cover member 40, and the connector cover 16 are substantially covered by the casing 10a. When the casing 10a is formed, the surfaces of the casing 10a and other members are mutually melted and adhered. Thereby, the watertightness of the K-type photosensor 10 is improved.
圖2所示的放大器基座21和圖3所示的放大器蓋41形成被圖2所示的基座部21a、基座框21b以及放大器蓋41包圍的空間。在該空間內收納有電路部件收納（安裝於引線框27）。因此，在殼體10a成形時，作用於電路元件的熱應力減小。同樣，關於投光元件32和受光元件33，熱應力也減小。The amplifier base 21 shown in Fig. 2 and the amplifier cover 41 shown in Fig. 3 form a space surrounded by the base portion 21a, the base frame 21b, and the amplifier cover 41 shown in Fig. 2 . The circuit component is housed in the space (mounted on the lead frame 27). Therefore, when the casing 10a is formed, the thermal stress acting on the circuit component is reduced. Also, with respect to the light projecting element 32 and the light receiving element 33, the thermal stress is also reduced.
如圖7所示，將引線框27部分地模塑，形成包含平面配置的放大器基座21、投光元件基座22、受光元件基座23、彎曲基座24、加強基座25、端子基座26在內的K型用主要部20（成形品）。各基座藉由引線框27的引線部連接。藉由將引線部27a、27b折彎，從而使投光元件基座22的投光元件32和受光元件基座23的受光元件33相互對峙。另外，藉由將引線部27c～27e折彎，從而與投光元件基座22以及受光元件基座23延伸的方向平行地配置連接部51。藉由對該連接部51連接連接器17的連接端子18，成形殼體10a，從而形成連接器17的插入方向和投光部12以及受光部相對於基座部11延伸的方向平行的K型的光電傳感器10。As shown in FIG. 7, the lead frame 27 is partially molded to form an amplifier base 21 including a planar arrangement, a light projecting element base 22, a light receiving element base 23, a curved base 24, a reinforcing base 25, and a terminal base. The K-shaped main portion 20 (molded article) including the seat 26 is used. Each of the susceptors is connected by a lead portion of the lead frame 27. By folding the lead portions 27a and 27b, the light projecting element 32 of the light projecting element base 22 and the light receiving element 33 of the light receiving element base 23 are opposed to each other. Further, by bending the lead portions 27c to 27e, the connecting portion 51 is disposed in parallel with the direction in which the light projecting element base 22 and the light receiving element base 23 extend. By connecting the connection terminal 18 of the connector 17 to the connection portion 51, the casing 10a is molded, and the insertion direction of the connector 17 and the K-type in which the light projecting portion 12 and the light receiving portion are parallel to the direction in which the base portion 11 extends are formed. Photoelectric sensor 10.
另外，如圖13所示，將K型用主要部20的引線部27e切斷，形成L型用主要部20a。如圖14（a）所示，藉由將L型用主要部20a的引線部27c折彎，從而形成與投光元件基座22以及受光元件基座23延伸的方向平行地延伸的連接部52。將連接器17的連接端子18配設成沿著與該連接部52正交的方向延伸，在連接部52上連接連接端子18。並且，藉由成形殼體10a，從而形成連接器17的插入方向和投光部12以及受光部13相對於基座部11延伸的方向正交的L型的光電傳感器60。Further, as shown in FIG. 13, the lead portion 27e of the K-type main portion 20 is cut to form an L-shaped main portion 20a. As shown in Fig. 14 (a), the lead portion 27c of the L-shaped main portion 20a is bent to form a connecting portion 52 extending in parallel with the direction in which the light projecting element base 22 and the light receiving element base 23 extend. . The connection terminal 18 of the connector 17 is disposed to extend in a direction orthogonal to the connection portion 52, and the connection terminal 18 is connected to the connection portion 52. Further, by molding the casing 10a, the L-shaped photosensor 60 in which the insertion direction of the connector 17 and the light projecting portion 12 and the light receiving portion 13 are orthogonal to the direction in which the base portion 11 extends are formed.
這樣，將作為K型用主要部20的成形品設為形狀不同的光電傳感器10、60的共用部件。因此，只要針對形狀不同的光電傳感器10、60預先準備1種成形品即可，製造相關成本降低。In this way, the molded article of the K-type main portion 20 is a common member of the photosensors 10 and 60 having different shapes. Therefore, as long as one type of molded article is prepared in advance for the photoelectric sensors 10 and 60 having different shapes, the manufacturing cost is lowered.
連接器17收納於連接器蓋16的凹部16a。並且，連接器17的連接端子18焊接於端子基座26的連接部51、52。並且，將K型用主要部20、蓋構件40、連接器蓋16以及連接器17設置於模具內，射出在模具內熔融的樹脂，成形殼體10a。圖5示出設置在模具內的構件。The connector 17 is housed in the recess 16a of the connector cover 16. Further, the connection terminals 18 of the connector 17 are soldered to the connection portions 51 and 52 of the terminal base 26. Further, the K-type main portion 20, the lid member 40, the connector cover 16, and the connector 17 are placed in a mold, and the resin melted in the mold is injected to form the casing 10a. Figure 5 shows the components disposed within the mold.
在成形時，在連接器蓋16的外周面被施加在模具內射出的樹脂的射出壓力。在一體成形前，連接器蓋16的凹部16a形成為能鬆動插入連接器17的大小。即，在連接器蓋16的凹部16a的內表面與連接器17的外表面之間設有間隙。藉由該間隙，即使由於射出壓力使連接器蓋16變形，也因為在連接器蓋16與連接器17之間形成有間隙，所以射出壓力不直接影響連接器17。因此，在一體成形中，連接器17難以變形。At the time of molding, the injection pressure of the resin which is injected into the mold is applied to the outer peripheral surface of the connector cover 16. The recess 16a of the connector cover 16 is formed to be loosely insertable into the connector 17 before being integrally formed. That is, a gap is provided between the inner surface of the recess 16a of the connector cover 16 and the outer surface of the connector 17. With this gap, even if the connector cover 16 is deformed due to the injection pressure, since the gap is formed between the connector cover 16 and the connector 17, the injection pressure does not directly affect the connector 17. Therefore, the connector 17 is difficult to deform in integral molding.
在連接器17中插入圖1所示的接續用連接器201。因此，當連接器17變形時，接續用連接器201的插入變得困難。因此，接續用連接器201的插入變得困難的光電傳感器被篩選成不良品。The connector 201 shown in Fig. 1 is inserted into the connector 17. Therefore, when the connector 17 is deformed, the insertion of the connector 201 for the connection becomes difficult. Therefore, the photoelectric sensor in which the insertion of the connector 201 is difficult is selected as a defective product.
對此，在本實施方式中，連接器17被連接器蓋16覆蓋。連接器蓋16抑制連接器17的變形。因此，能容易插入接續用連接器201。In this regard, in the present embodiment, the connector 17 is covered by the connector cover 16. The connector cover 16 suppresses deformation of the connector 17. Therefore, the connector 201 for connection can be easily inserted.
另外，模具的溫度是在既定的溫度下，以確保成形殼體10a的樹脂的流動性。另外，將殼體10a成形的樹脂被加熱到規定溫度而具有流動性。因此，設置在模具內的連接器蓋16受到模具等的熱。連接器17被連接器蓋16大致覆蓋。另外，在成形前，在連接器17與連接器蓋16之間形成有間隙。因此，連接器17受到成形時的熱的影響變少。藉此可抑制連接器17的變形。Further, the temperature of the mold is at a predetermined temperature to ensure the fluidity of the resin of the molded casing 10a. Further, the resin molded into the casing 10a is heated to a predetermined temperature to have fluidity. Therefore, the connector cover 16 provided in the mold receives heat from a mold or the like. The connector 17 is substantially covered by the connector cover 16. Further, a gap is formed between the connector 17 and the connector cover 16 before forming. Therefore, the connector 17 is less affected by the heat at the time of molding. Thereby, the deformation of the connector 17 can be suppressed.
在如上述的光電傳感器中，能得到下面所示的效果。 （1）用於K型的光電傳感器10的K型用主要部20是將引線框27部分地模塑的成形品，該成形品具有平面配置的放大器基座21、投光元件基座22、受光元件基座23、彎曲基座24、加強基座25以及端子基座26。並且，使用將連接加強基座25和端子基座26的引線部27e切斷得到的L型用主要部20a製作L型的光電傳感器60。如此般，關於外形的形狀不同的光電傳感器10、60，能使用1種成形品製作。因此，能降低製造相關成本（用於製作各個主要部的模具等）。另外，針對外形的形狀不同的光電傳感器10、60只要預先準備1種成形品即可，所以管理的部件數量變少，能降低管理成本。In the photosensor as described above, the effects shown below can be obtained. (1) The K-type main portion 20 for the K-type photosensor 10 is a molded article in which the lead frame 27 is partially molded, and the molded article has a planar arrangement of the amplifier base 21, the light projecting element base 22, The light receiving element base 23, the curved base 24, the reinforcing base 25, and the terminal base 26. Further, an L-type photosensor 60 is produced by using the L-shaped main portion 20a obtained by cutting the lead portion 27e connecting the reinforcing base 25 and the terminal base 26. In this manner, the photoelectric sensors 10 and 60 having different shapes of the outer shape can be produced using one type of molded article. Therefore, it is possible to reduce the manufacturing-related costs (for making molds for each main part, etc.). In addition, it is only necessary to prepare one type of molded product in advance for the photoelectric sensors 10 and 60 having different shapes of the outer shape, so that the number of components to be managed is reduced, and the management cost can be reduced.
（2）將接續用連接器201連接的連接器17被連接器蓋16覆蓋，埋設於基座部11。該基座部11利用與投光部12、受光部13一起一體成形的殼體10a形成。將形成該殼體10a的樹脂在模具內射出時的壓力施加於連接器蓋16，對收納於連接器蓋16的連接器17的影響較少。因此，能抑制連接器17的變形。(2) The connector 17 connected to the connection connector 201 is covered by the connector cover 16 and embedded in the base portion 11. The base portion 11 is formed by a casing 10a integrally formed with the light projecting portion 12 and the light receiving portion 13. The pressure at which the resin forming the casing 10a is ejected in the mold is applied to the connector cover 16, and the influence on the connector 17 housed in the connector cover 16 is less. Therefore, the deformation of the connector 17 can be suppressed.
（3）在連接器17的外表面與連接器蓋16的凹部16a之間，在成形前形成有間隙。藉由該間隙，使得即使由於將形成該殼體10a的樹脂在模具內射出時的壓力使連接器蓋16變形，對收納於連接器蓋16的連接器17的影響也較小。因此，能抑制連接器17的變形。(3) A gap is formed between the outer surface of the connector 17 and the recess 16a of the connector cover 16 before forming. With this gap, even if the connector cover 16 is deformed by the pressure at which the resin forming the casing 10a is ejected in the mold, the influence on the connector 17 housed in the connector cover 16 is small. Therefore, the deformation of the connector 17 can be suppressed.
（4）如圖8所示，端子基座26的連接部52藉由將引線部27c～27e折彎而配置於殼體10a的大致中心（在圖8中為上下方向的大致中心）。因此，連接到該連接部52的連接端子18配置於殼體10a的大致中心。因此，能將K型的光電傳感器10的厚度減薄，即，能使K型的光電傳感器10小型化。(4) As shown in FIG. 8, the connection portion 52 of the terminal base 26 is disposed substantially at the center of the casing 10a (the center in the vertical direction in FIG. 8) by bending the lead portions 27c to 27e. Therefore, the connection terminal 18 connected to the connection portion 52 is disposed substantially at the center of the casing 10a. Therefore, the thickness of the K-type photosensor 10 can be reduced, that is, the K-type photosensor 10 can be miniaturized.
（5）用於L型的光電傳感器60的製作的連接部52利用引線部27d、保持部52a以及突出部52b形成為具有切口部的ㄇ字狀。在該切口部插入連接端子18，連接到連接部52。如此般，具有切口部的連接部52與連接端子18的連接部分與僅使用引線部27d的情況相比變大。因此，能使連接端子18和連接部52的連接牢固。另外，能減少連接部分的電阻。(5) The connection portion 52 for the production of the L-type photosensor 60 is formed in a U-shape having a notch portion by the lead portion 27d, the holding portion 52a, and the protruding portion 52b. The connection terminal 18 is inserted into the cutout portion and connected to the connection portion 52. As described above, the connection portion between the connection portion 52 having the cutout portion and the connection terminal 18 becomes larger than the case where only the lead portion 27d is used. Therefore, the connection of the connection terminal 18 and the connecting portion 52 can be made firm. In addition, the resistance of the connecting portion can be reduced.
（6）殼體10a以大致覆蓋用熱可塑性樹脂成形的放大器基座21、彎曲基座24、加強基座25、端子基座26、以及用熱可塑性樹脂成形的蓋構件40的方式成形，所以在殼體10a成形時殼體10a和其他構件的界面相互熔融，水密性提高。因此，能形成耐水性優良的光電傳感器。(6) The casing 10a is formed so as to substantially cover the amplifier base 21 formed by the thermoplastic resin, the curved base 24, the reinforcing base 25, the terminal base 26, and the cover member 40 formed of a thermoplastic resin. When the casing 10a is formed, the interfaces of the casing 10a and other members are mutually melted, and watertightness is improved. Therefore, a photoelectric sensor excellent in water resistance can be formed.
（7）利用放大器基座21和放大器蓋41，在確保了收納電路部件的空間的狀態下將殼體10a成形。因此，能減少由於電路部件的熱應力導致的故障，能提高製造時的成品率。(7) The housing 10a is formed in a state in which the space for accommodating the circuit component is secured by the amplifier base 21 and the amplifier cover 41. Therefore, it is possible to reduce the failure due to the thermal stress of the circuit component, and it is possible to improve the yield at the time of manufacture.
（8）因為在埋設引線框27的基座部21a的周邊將基座框21b成形而形成放大器基座21，所以在將加強基座25和端子基座26向放大器基座21的裡側折彎時，能減小對引線框27的機械應力的作用。因此，能防止由於機械應力導致的電路部件的損傷，能提高製造時的成品率。(8) Since the base frame 21b is formed around the base portion 21a of the buried lead frame 27 to form the amplifier base 21, the reinforcing base 25 and the terminal base 26 are folded toward the inner side of the amplifier base 21. When bent, the effect on the mechanical stress of the lead frame 27 can be reduced. Therefore, it is possible to prevent damage of circuit components due to mechanical stress, and it is possible to improve the yield at the time of manufacture.
此外，上述實施方式也可以按如下變更。 ・也可以適當地變更成型上述實施方式的放大器基座21、投光元件基座22、受光元件基座23等的樹脂。例如可使用ABS（丙烯腈-丁二烯-苯乙烯）、PC、PPS（聚苯硫醚）作為樹脂。另外，形成蓋構件40的樹脂也能使用PMMA（聚甲基丙烯酸甲酯）。Further, the above embodiment may be modified as follows. The resin of the amplifier base 21, the light projecting element base 22, and the light receiving element base 23 of the above-described embodiment can be appropriately changed. For example, ABS (acrylonitrile-butadiene-styrene), PC, PPS (polyphenylene sulfide) can be used as the resin. Further, PMMA (polymethyl methacrylate) can also be used as the resin forming the cover member 40.
・放大器蓋41也可以用容易使紅色以外的可見光透射的色彩的樹脂成形。The amplifier cover 41 may be formed of a resin that easily transmits a color other than red.
10‧‧‧光電傳感器
10a‧‧‧殼體
11‧‧‧基座部
12‧‧‧投光部
13‧‧‧受光部
16‧‧‧連接器蓋
16a‧‧‧凹部
16e‧‧‧貫通孔
16f‧‧‧凹部
17‧‧‧連接器
17a‧‧‧凹部
18‧‧‧連接端子
20‧‧‧K型用主要部（成形品）
20a‧‧‧L型用主要部（主要部）
21‧‧‧放大器基座（電路基座）
22‧‧‧投光元件基座
22a‧‧‧凹部
23‧‧‧受光元件基座
24‧‧‧彎曲基座
25‧‧‧加强基座
26‧‧‧端子基座
27‧‧‧引線框
27a～27e‧‧‧引線部
32‧‧‧投光元件
33‧‧‧受光元件
40‧‧‧蓋構件
41b‧‧‧凹部
51、52‧‧‧連接部
52a‧‧‧保持部
52b‧‧‧突出部
60‧‧‧光電傳感器
60a‧‧‧殼體10‧‧‧Photoelectric sensor
10a‧‧‧shell
11‧‧‧Base section
12‧‧‧Projecting Department
13‧‧‧Receiving Department
16‧‧‧ Connector cover
16a‧‧‧ recess
16e‧‧‧through hole
16f‧‧‧ recess
17‧‧‧Connector
17a‧‧‧ recess
18‧‧‧Connecting terminal
20‧‧‧K main part (formed product)
20a‧‧‧L-type main department (main department)
21‧‧‧Amplifier base (circuit base)
22‧‧‧Projector base
22a‧‧‧ recess
23‧‧‧Receiving element base
24‧‧‧Bent base
25‧‧‧ Strengthening the base
26‧‧‧Terminal base
27‧‧‧ lead frame
27a～27e‧‧‧ lead parts
32‧‧‧Lighting elements
33‧‧‧Light-receiving components
40‧‧‧covering components
41b‧‧‧ recess
51, 52‧‧‧ Connections
52a‧‧‧ Keeping Department
52b‧‧‧Protruding
60‧‧‧Photoelectric sensor
60a‧‧‧shell
圖1是示出K型的光電傳感器的立體圖。 圖2是示出K型的光電傳感器的K型用主要部的立體圖。 圖3是示出蓋構件的立體圖。 圖4是示出蓋構件的立體圖。 圖5是示出將殼體除去的各構件的立體圖。 圖6是示出在K型用主要部固定有蓋構件的狀態的立體圖。 圖7是示出引線框的說明圖。 圖8是示出模塑狀態的說明圖。 圖9是示出引線框和連接器的連接的說明圖。 圖10是連接器和連接器蓋的立體圖。 圖11（a）、（b）是連接器和連接器蓋的立體圖。 圖12是示出L型的光電傳感器的立體圖。 圖13是示出引線框的說明圖。 圖14（a）、（b）是示出引線框和連接器的連接的說明圖。 圖15是示出L型的光電傳感器的L型用主要部的立體圖。 圖16是示出引線框和連接器端子的連接的說明圖。FIG. 1 is a perspective view showing a K-type photosensor. 2 is a perspective view showing a main portion of a K-type photosensor for a K-type. Fig. 3 is a perspective view showing a cover member. Fig. 4 is a perspective view showing a cover member. Fig. 5 is a perspective view showing each member that removes the casing. Fig. 6 is a perspective view showing a state in which a cover member is fixed to a main portion for a K-shape. Fig. 7 is an explanatory view showing a lead frame. Fig. 8 is an explanatory view showing a molded state. Fig. 9 is an explanatory view showing the connection of a lead frame and a connector. Figure 10 is a perspective view of the connector and connector cover. Figures 11 (a) and (b) are perspective views of the connector and the connector cover. Fig. 12 is a perspective view showing an L-type photosensor. Fig. 13 is an explanatory view showing a lead frame. 14(a) and 14(b) are explanatory views showing the connection of a lead frame and a connector. Fig. 15 is a perspective view showing an L-shaped main portion of an L-type photosensor. Fig. 16 is an explanatory view showing the connection of a lead frame and a connector terminal.
20‧‧‧主要部 20‧‧‧ Main Department
21‧‧‧放大器基座(電路基座) 21‧‧‧Amplifier base (circuit base)
22‧‧‧投光元件基座 22‧‧‧Projector base
23‧‧‧受光元件基座 23‧‧‧Receiving element base
24‧‧‧彎曲基座 24‧‧‧Bent base
25‧‧‧加強基座 25‧‧‧ Strengthening the base
26‧‧‧端子基座 26‧‧‧Terminal base
27‧‧‧引線框 27‧‧‧ lead frame
27a~27e‧‧‧引線部 27a~27e‧‧‧ lead part
51‧‧‧連接部 51‧‧‧Connecting Department
52‧‧‧連接部 52‧‧‧Connecting Department
52a‧‧‧保持部 52a‧‧‧ Keeping Department
52b‧‧‧突出部 52b‧‧‧Protruding
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| JP2010062238A (en) * | 2008-09-02 | 2010-03-18 | Juki Corp | Photointerrupter |
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| US5076801A (en) | 1990-06-22 | 1991-12-31 | Xerox Corporation | Electronic component including insulation displacement interconnect means |
| JPH0935594A (en) * | 1995-07-18 | 1997-02-07 | Omron Corp | Photosensor |
| JPH11145505A (en) * | 1997-11-11 | 1999-05-28 | Omron Corp | Photosensor and manufacture thereof |
| JP2005328082A (en) * | 2005-07-25 | 2005-11-24 | Sharp Corp | Manufacturing method of optically coupled semiconductor |
| JP2008098471A (en) | 2006-10-13 | 2008-04-24 | Sharp Corp | Optical coupling device and manufacturing method thereof, and electronic apparatus using optical coupling device |
| JP2008135683A (en) | 2006-10-24 | 2008-06-12 | Sharp Corp | Photo coupler and its manufacturing method, and electronic device using photo coupler |
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| JP6452978B2 (en) * | 2014-07-30 | 2019-01-16 | パナソニック デバイスＳｕｎｘ株式会社 | Photoelectric sensor and method for manufacturing photoelectric sensor |
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