JP6349809B2 - Photo sensor - Google Patents

Photo sensor Download PDF

Info

Publication number
JP6349809B2
JP6349809B2 JP2014052826A JP2014052826A JP6349809B2 JP 6349809 B2 JP6349809 B2 JP 6349809B2 JP 2014052826 A JP2014052826 A JP 2014052826A JP 2014052826 A JP2014052826 A JP 2014052826A JP 6349809 B2 JP6349809 B2 JP 6349809B2
Authority
JP
Japan
Prior art keywords
portion
lead
direction
light receiving
light projecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014052826A
Other languages
Japanese (ja)
Other versions
JP2015177078A (en
Inventor
毅 宮田
毅 宮田
一也 大槻
一也 大槻
中嶋 淳
淳 中嶋
誠司 宮下
誠司 宮下
清司 今井
清司 今井
Original Assignee
オムロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オムロン株式会社 filed Critical オムロン株式会社
Priority to JP2014052826A priority Critical patent/JP6349809B2/en
Publication of JP2015177078A publication Critical patent/JP2015177078A/en
Application granted granted Critical
Publication of JP6349809B2 publication Critical patent/JP6349809B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4911Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191Disposition
    • H01L2924/19101Disposition of discrete passive components
    • H01L2924/19107Disposition of discrete passive components off-chip wires

Description

  The present invention relates to a photosensor.

  Photosensors usually have connection terminals (leads) that protrude from the case and circuit sealing portions that seal integrated circuits that control the light projecting portion and the light receiving portion (see, for example, Patent Document 1). The circuit sealing portion is generated by injection molding.

Japanese Patent Laid-Open No. 11-145505

  In Patent Document 1, a connection terminal having a constant terminal width is provided, and a part of the connection terminal is sealed by a circuit sealing portion. On the terminal of the connection terminal located at one end of such a circuit sealing part, bubbles at the time of injection molding are likely to accumulate, and insufficient filling of the resin may occur.

  Accordingly, an object of the present invention is to solve the above-described problems and to provide a photosensor that is less likely to cause insufficient resin filling during injection molding.

  The photosensor according to the first aspect of the present invention includes a light projecting unit, a light receiving unit, an integrated circuit, a circuit sealing unit, and a first external connection terminal. The light receiving unit receives light from the light projecting unit and outputs a light reception signal. The integrated circuit processes the received light signal. The circuit sealing unit seals the integrated circuit. The first external connection terminal protrudes from the circuit sealing portion. The first external connection terminal includes a first circuit connection portion, a first inner terminal portion, and a first outer terminal portion. The first circuit connection unit is connected to the integrated circuit. The first inner terminal portion extends from the first circuit connection portion. The first outer terminal portion extends from the first inner terminal portion. The first inner terminal portion includes a first portion located outside the circuit sealing portion. The dimension of the first portion in the direction perpendicular to the direction in which the first inner terminal portion extends is shorter than the dimension of the first outer terminal portion in the direction perpendicular to the direction in which the first outer terminal portion extends. Therefore, the probability that air is caught by the first external connection terminal and stops and bubbles are generated is reduced, and insufficient filling of the resin caused by the bubbles can be reduced.

  The photosensor may further include a second external connection terminal protruding from the circuit sealing portion. The first outer terminal portion may include a first end portion on a side opposite to the side connected to the first inner terminal portion. The first end portion may have a first through hole for soldering. The second external connection terminal may include a second circuit connection portion, a second inner terminal portion, and a second outer terminal portion. The second circuit connection unit is connected to the integrated circuit. The second inner terminal portion extends from the second circuit connection portion. The second outer terminal portion extends from the second inner terminal portion. The second outer terminal portion may include a second end portion that is an end portion on the opposite side to the side connected to the second inner terminal portion. The second end portion may have a second through hole for soldering. The distance between the first through hole and the first circuit connection part may be shorter than the distance between the second through hole and the second circuit connection part.

  The surface area of the first external connection terminal may be smaller than the surface area of the second external connection terminal.

  The first inner terminal portion may include a second portion and a third portion. The second portion is adjacent to the first portion and is located inside the circuit sealing portion. The third part is closer to the first circuit connection than the second part. The dimension of the third portion in the direction perpendicular to the direction in which the first inner terminal portion extends is longer than the dimension of the second portion in the perpendicular direction. Thereby, even if the resin in contact with the second portion melts, the first external connection terminal is difficult to come off from the circuit sealing portion.

  The first inner terminal portion may include a third through hole. The circuit sealing portion may include a hole sealing portion that seals a part of the third through hole. Thereby, the air accumulated in the third through hole escapes from the unsealed third through hole. Therefore, the probability that bubbles are generated is reduced, and insufficient filling of the resin caused by the bubbles can be reduced.

  The circuit sealing portion may further include an inlet corresponding portion provided at a position corresponding to the resin inlet when the resin is injection-molded. The hole sealing portion may be located at one end of the circuit sealing portion, and the injection port corresponding portion may be provided at the other end of the circuit sealing portion. In this case, the hole sealing portion is at a position opposite to the position of the circuit sealing portion having the inlet corresponding portion. Therefore, air tends to accumulate particularly in the third through hole. In such a case, it is particularly effective for the air accumulated in the third through hole to escape from the unsealed third through hole.

  In the photosensor according to the first aspect, the width of the first portion located outside the circuit sealing portion is shorter than the width of the first outer terminal portion. Therefore, the probability that air is caught by the first external connection terminal and stops and bubbles are generated is reduced, and insufficient filling of the resin caused by the bubbles can be reduced.

It is a front view of the photosensor which concerns on one Embodiment. It is a top view of the photosensor which concerns on one Embodiment. It is a disassembled perspective view of the photosensor which concerns on one Embodiment. It is sectional drawing of a photosensor when cut | disconnecting by the cut surface line IV-IV of FIG. It is sectional drawing of a photosensor when cut | disconnecting by the cut surface line VV of FIG. It is a top view of the sensor module concerning one embodiment. It is a top view which shows the primary molded product of the sensor module which concerns on one Embodiment. It is a top view which shows the detail of the circuit inside the member covered with resin of the sensor module of FIG. It is an enlarged view near a protrusion part. It is a flowchart which shows the manufacturing method of the sensor module which concerns on one Embodiment. It is a flowchart which shows another manufacturing method of the sensor module which concerns on one Embodiment. It is a side view of the sensor module of FIG. It is an enlarged view of a plurality of connecting terminals and its circumference. It is an enlarged view near the first inner terminal portion and the third inner terminal portion. It is the figure which showed the 1st inner side terminal part and 3rd inner side terminal part which concern on the modification of one Embodiment. It is the figure which showed the 1st inner side terminal part and 3rd inner side terminal part which concern on the modification of one Embodiment. It is a top view of the modification of a sensor module. It is a top view which shows the primary molded product of the modification of a sensor module. It is the side view which looked at the sensor module at the time of bending a light projection / reception lead in L shape from the optical axis direction. It is detail drawing of a subcase. It is a front view of the photosensor which concerns on one Embodiment. It is a top view of the photosensor which concerns on one Embodiment. It is a disassembled perspective view of the photosensor which concerns on one Embodiment. It is sectional drawing of a photosensor when cut | disconnecting by the cut surface line XXIII-XXIII of FIG.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. In the drawings referred to below, the same or corresponding members are denoted by the same reference numerals.

  FIG. 1 is a front view of the photosensor 1. FIG. 2 is a top view of the photosensor 1. FIG. 3 is an exploded perspective view of the photosensor 1. Referring to FIG. 3, the photosensor 1 includes a sensor module 5, a case 60, a sub case 80, and a bottom plate 98.

  As shown in FIG. 1, the case 60 includes a case main body portion 61, a light projecting case portion 62, and a light receiving case portion 63. FIG. 4 is a cross-sectional view of the photosensor taken along the cutting plane line IV-IV in FIG. In FIG. 4, the sensor module 5 is displayed without being cut. Referring to FIG. 4, the case main body 61 accommodates a circuit sealing portion 90 described later. The light projecting case unit 62 accommodates a light projecting unit 10, a first light projecting lead 20, and a second light projecting lead 22 described later. The light receiving case portion 63 accommodates a light receiving portion 15, a first light receiving lead 24, and a second light receiving lead 26 described later. The light projecting case portion 62 and the light receiving case portion 63 extend upward from the case main body portion 61. FIG. 5 is a cross-sectional view of the photosensor when cut along the cutting plane line VV in FIG. 1. Referring to FIG. 5, the light projecting case part 62 has a light projecting slit 66 on the surface facing the light receiving case part 63. The light receiving case 63 has a light receiving slit 67 on the surface facing the light projecting case 62.

  In the present embodiment, the direction is defined as follows except when the direction is particularly defined. The direction from the light projecting slit 66 toward the light receiving slit 67 is called the right direction, and the opposite direction is called the left direction. In the drawing, the positive direction of the X axis is shown as the right direction. The left-right direction corresponds to the optical axis Ax direction of light traveling from the light projecting unit 10 to the light receiving unit 15 described later. A direction from the connection terminal 50 toward the light projecting / receiving case portions 62 and 63 is referred to as an upward direction, and the opposite direction is referred to as a downward direction. In the drawing, the positive direction of the Y-axis is shown as the upward direction. The direction from the center of the photosensor 1 toward the surface of the case 60 on which the indicator lamp window 68 is formed is referred to as a front direction, and the opposite direction is referred to as a rear direction. In the drawing, the forward direction is shown as the positive direction of the Z axis.

  The light projecting case portion 62 and the light receiving case portion 63 are opposed to each other. The photosensor 1 has a pair of opposed light projecting and receiving slits 66 and 67 at the top of the case 60. The light projecting case portion 62 and the light receiving case portion 63 are arranged with a gap in the optical axis Ax (x-axis direction). As shown in FIGS. 1 and 2, the case 60 has a mounting hole 69a that penetrates the case 60 in a direction (Y-axis direction, Z-axis direction in FIG. 1) perpendicular to the direction in which the light projecting and receiving slits 66 and 67 are opposed. , 69b, 69c, 69d are formed.

  In the photosensor 1, a plurality of connection terminals 50 that are a part of the sensor module 5 protrude from the bottom of the bottom plate 98 to the outside. As shown in FIG. 1, the case 60 has a rectangular indicator lamp window 68 formed on the front surface. Through the indicator light window 68, the operator can visually recognize the operation indicator lamp (hereinafter referred to as the operation indicator 92). The operation indicator light emits light when the light reception signal from the light receiving unit 15 exceeds a predetermined threshold value or falls below the threshold value. The light emission conditions of the operation indicator will be described later.

  As shown in FIG. 3, the sub case 80 and the sensor module 5 are sequentially inserted into the case 60, and a bottom plate 98 having a hole 99 through which the connection terminal 50 is inserted is attached to the bottom of the case 60.

  FIG. 6 is a plan view of the sensor module 5. FIG. 7 is a plan view showing a primary molded product of the sensor module 5. In other words, FIG. 7 is a development view of the sensor module 5 of FIG. In the following description, the sensor module 5 developed on the flat plate shown in FIG. FIG. 8 is a plan view showing details of a circuit inside the member covered with the resin of the sensor module 4 of FIG.

  Referring to FIG. 6, the sensor module 5 includes a light projecting unit 10, a light receiving unit 15, a first light projecting lead 20, a second light projecting lead 22, a first light receiving lead 24, and a second light receiving lead 26. And an integrated circuit 41, a circuit sealing portion 90, and a plurality of connection terminals 50. In the following description, the first light projecting lead 20, the second light projecting lead 22, the first light receiving lead 24, the second light receiving lead 26, and the plurality of connection terminals 50 are collectively referred to as the lead frame 8. Call. In addition, the sensor module may be referred to as a photo sensor component. The lead frame 8 is formed of a flat plate member having conductivity. That is, the first light projecting lead 20, the second light projecting lead 22, the first light receiving lead 24, the second light receiving lead 26, and the plurality of connection terminals 50 are flat.

  The light projecting unit 10 includes a light projecting element 11 and a light projecting sealing unit 12. The light projecting sealing unit 12 includes a light projecting base unit 13 and a light projecting lens unit 14. The light projecting element 11 is, for example, a light emitting diode. However, an element different from the light emitting diode may be used as the light projecting element 11. The light projecting sealing unit 12 seals the light projecting element 11 with resin. The light projecting base unit 13 covers the light projecting element 11. The light projecting lens portion 14 has a curved shape and protrudes from the light projecting base portion 13. The light projecting lens unit 14 is circular when viewed in the light projecting direction. The light projecting lens unit 14 converts light emitted from the light projecting element 11 into parallel light. That is, the light projecting lens unit 14 suppresses the spread of light from the light projecting element 11.

  The light receiving unit 15 receives light from the light projecting unit 10 and outputs a light reception signal. The light receiving unit 15 includes a light receiving element 16 and a light receiving sealing unit 17. The light receiving sealing portion 17 includes a light receiving base portion 18 and a light receiving lens portion 19. The light receiving element 16 is, for example, a phototransistor. However, an element different from the phototransistor may be used as the light receiving element 16. The light receiving element 16 and the light projecting element 11 are arranged to face each other. That is, the photosensor 1 according to the present embodiment is a so-called transmission type photosensor that detects whether or not the light receiving element 16 can directly receive the light emitted from the light projecting element 11. The light receiving sealing portion 17 seals the light receiving element 16 with resin. The light receiving base portion 18 covers the light receiving element 16. The light receiving lens portion 19 has a curved shape and protrudes from the light receiving base portion 18. The light receiving lens unit 19 is circular when viewed in the light receiving direction. The light projecting lens unit 14 condenses the light from the light projecting element 11 on the light receiving element 16.

  Referring to FIG. 8, the light projecting element 11 is mounted on the first light projecting lead 20. That is, the light projecting element 11 is mounted on the lead frame 8. The light receiving element 16 is mounted on the second light receiving lead 26. That is, the light receiving element 16 is mounted on the lead frame 8.

  The integrated circuit 41 is electrically connected to the light projecting element 11 and the light receiving element 16. The integrated circuit 41 is mounted on the main body lead portion 30 that is a part of the lead frame 8. For example, the integrated circuit 41 is mounted on the lead frame 8 by being fixed by die bonding and wired by wire bonding. Therefore, the lead frame 8 includes the main body lead portion 30 and is connected to the integrated circuit 41. The main body lead portion 30 is a portion of the lead frame 8 that is sealed by a circuit sealing portion that will be described later, excluding the leads that form the plurality of connection terminals 50. The leads forming the plurality of connection terminals 50 will be described later.

  The first light projecting lead 20 and the second light projecting lead 22 connect the light projecting unit 10 and the circuit sealing unit 90. Specifically, the first light projecting lead 20 connects the light projecting element 11 and the main body lead part 30. The second light projecting lead 22 and the wire wiring W <b> 11 connect the light projecting element 11 and the main body lead part 30. Since the main body lead part 30 is connected to the integrated circuit 41, the light projecting part 10 is connected to the integrated circuit 41 via the first light projecting lead 20 and the second light projecting lead 22. Here, the downward direction (the direction in which the plurality of connection terminals 50 extend: the Y-axis negative direction) is defined as the first direction. A plane parallel to the first direction is taken as a first plane. Specifically, the first plane is, for example, a plane (XY plane) formed by the surfaces of the plurality of connection terminals 50. At this time, the first light projecting lead 20 and the second light projecting lead 22 are parallel to the first plane and intersect with the first direction (left direction: X axis negative direction) from the circuit sealing portion 90. Protruding. The first light projecting lead 20 and the second light projecting lead 22 extend in a direction opposite to the first direction (Y-axis positive direction).

  The first light receiving lead 24 and the second light receiving lead 26 connect the light receiving unit 15 and the circuit sealing unit 90. More specifically, the first light receiving lead 24 and the wire wiring W12 connect the light receiving element 16 and the main body lead portion 30. Since the main body lead portion 30 is connected to the integrated circuit 41, the light receiving portion 15 is connected to the integrated circuit 41 via the first light receiving lead 24 and the second light receiving lead 26. Here, as shown in FIG. 6, a plane that is perpendicular to the optical axis Ax direction of light traveling from the light projecting unit 10 to the light receiving unit 15 and that passes through the center of the light projecting unit 10 and the light receiving unit 15 is planar The first light receiving lead 24 and the second light receiving lead 26, which are C1, are parallel to the first plane and cross the first direction, and are the first light projecting lead 20 and the second light projecting lead. It protrudes from the circuit sealing part 90 in the direction opposite to the direction in which 22 protrudes (right direction: X-axis positive direction). For example, when the circuit sealing portion 90 is a rectangular parallelepiped, the first light receiving lead 24 and the second light receiving lead 26 protrude from the surface opposite to the surface from which the first light projecting lead 20 and the second light projecting lead 22 project. . At that time, the angle of the lead does not matter. The first light receiving lead 24 and the second light receiving lead 26 protrude and bend by a predetermined length from the circuit sealing portion 90 and extend in the direction opposite to the first direction (Y-axis positive direction).

  As shown in FIG. 6, in the sensor module 5, the first light projecting lead 20 and the second light projecting lead 22, and the first light receiving lead 24 and the second light receiving lead 26 are bent, so The part 15 is deformed so as to face the part 15. That is, the light receiving unit 15 is disposed to face the light projecting unit 10. In the example of FIG. 6, the first light projecting lead 20 and the second light projecting lead 22, and the first light receiving lead 24 and the second light receiving lead 26 are bent one time. The lead 20 and the second light projecting lead 22, and the first light receiving lead 24 and the second light receiving lead 26 may be bent or twisted a plurality of times. Detailed shapes and bending characteristics of the first light projecting lead 20 and the second light projecting lead 22, and the first light receiving lead 24 and the second light receiving lead 26 will be described later.

  The integrated circuit 41 includes, for example, an IC chip. The integrated circuit 41 applies a voltage to the gate of a transistor (not shown) connected to the light projecting element 11 to cause the light projecting element 11 to emit light by causing a current to flow. As a result, the integrated circuit 41 controls the light emission of the light projecting element 11. The integrated circuit 41 includes a current-voltage conversion circuit, an amplification circuit, and an A / D conversion circuit (not shown). The integrated circuit 41 converts the photocurrent output from the light receiving element 16 into a voltage, amplifies the voltage, and then obtains a received light signal value that is a digital value. Further, the integrated circuit 41 determines the presence or absence of light reception by the light receiving element 16 by comparing the magnitude relationship between the light reception signal value and a predetermined threshold value. This threshold value is obtained as a result of measuring the received light signal value in both the first case where there is a light shielding object between the light projecting unit 10 and the light receiving unit 15 and the second case where there is no light shielding object. This is a threshold value that can effectively discriminate between the second case and the second case. The threshold value is stored in a memory in the integrated circuit 41, for example.

  The sensor modules 4 and 5 include a light emitting element 42 that lights the operation display unit 92. The integrated circuit 41 is connected to the light emitting element 42 via the wire wiring W1. The integrated circuit 41 controls the light emitting element 42 based on the light reception determination result. The light emitting element 42 is a light emitting diode, for example, and is mounted on the main body lead portion 30. That is, the light emitting element 42 is mounted on the lead frame 8. In the following description, the integrated circuit 41 and the light emitting element 42 are collectively referred to as a circuit unit 40. The integrated circuit 41 processes the light reception signal from the light receiving unit 15 and when the signal value of the light reception signal is equal to or greater than the threshold value described above or less than the threshold value, a transistor (not shown) connected to the light emitting element 42. The light emitting element 42 is turned on by applying a control signal of a predetermined voltage to the gate of (1). The light emitting element 42 displays the operation of the photosensor 1, that is, the processing result of the integrated circuit 41.

The integrated circuit 41 executes one of the following two processing methods for the light reception signal from the light receiving unit 15.
[First Processing] The integrated circuit 41 outputs a control signal (ON signal: for example, a signal for outputting the power supply voltage Vcc) for lighting the light emitting element 42 when the signal value of the light reception signal is equal to or greater than a predetermined threshold value. Output. When the signal value of the light reception signal is less than a predetermined threshold value, the integrated circuit 41 outputs a control signal (OFF signal: for example, a signal that outputs 0 V) that turns off the light emitting element 42.
[Second Processing] The integrated circuit 41 outputs a control signal (OFF signal) for turning off the light emitting element 42 when the signal value of the light receiving signal is equal to or greater than a predetermined threshold value. The integrated circuit 41 outputs a control signal (ON signal) for lighting the light emitting element 42 when the signal value of the light reception signal is less than a predetermined threshold value.

<Switching terminal>
The integrated circuit 41 switches between the first process and the second process described above according to the voltage of the port P1. The voltage of the port P1 varies depending on whether or not the protruding portion 46 of the power supply voltage transmission wiring 44 is cut. Referring to FIG. 8, the power supply voltage transmission wiring 44 is a wire wiring and a lead for transmitting the power supply voltage Vcc toward the port P1. The power supply voltage transmission wiring 44 includes wire wirings W2, W3, and W4, a protruding portion 46, a first lead portion 32, and a second lead portion 34. The first lead part 32 and the second lead part 34 are included in the main body lead part 30. That is, the main body lead portion 30 includes the first lead portion 32 and the second lead portion 34. When the protruding portion 46 is connected to the first lead portion 32 and the second lead portion 34, the protruding portion 46, the first lead portion 32, and the second lead portion 34 are formed as one lead. That is, the lead frame 8 includes the protruding portion 46, the first lead portion 32, and the second lead portion 34.

  The power supply voltage Vcc is applied to the power supply connection terminal 51 among the plurality of connection terminals 50. The wire wirings W <b> 2 and W <b> 3 connect the power connection terminal 51 and the first lead part 32. The first lead portion 32 is connected to the port P2 of the integrated circuit 41 via the wire wiring W13. The protruding portion 46 is connected to the first lead portion 32 and protrudes outside the circuit sealing portion 90. The protruding portion 46 is connected to the second lead portion 34. The wire wiring W4 connects the second lead portion 34 and the port P1 of the integrated circuit 41. When the protruding portion 46 is not cut, the port P1 includes the wire wirings W2 and W3, the first lead portion 32, the protruding portion 46, the second lead portion 34, and the wire wiring from the power connection terminal 51. The power supply voltage Vcc is applied through W4. When the protruding portion 46 is cut, the second lead portion 34, the wire wiring W4, and the port P1 are in an electrically floating state (a state that is not electrically connected anywhere). That is, a voltage (for example, 0 V) other than the power supply voltage Vcc is applied to the port P1. When the power supply voltage Vcc is applied to the port P1, the integrated circuit 41 executes one of the first process and the second process described above. When a voltage other than the power supply voltage Vcc is applied to the port P1, the integrated circuit 41 executes the other of the first process and the second process described above. The drawings other than FIG. 8 illustrate the sensor module from which the protrusion 46 is removed.

  FIG. 9 is an enlarged view of the vicinity of the protrusion 46. Referring to FIG. 9, the protrusion 46 includes a first sub protrusion 464, a second sub protrusion 466, and an external connection portion 460. The first sub protruding portion 464 is connected to the first lead portion 32. The second sub projecting portion 466 is connected to the second lead portion 34. The first sub projecting portion 464 and the second sub projecting portion 466 project from different positions of the circuit sealing unit 90. The external connection portion 460 connects the first sub-projection 464 and the second sub-projection 466. The external connection part 460 extends from the first sub protrusion 464 in a direction different from the direction in which the first sub protrusion 464 protrudes. Similarly, the external connection portion 460 extends from the second sub protrusion 466 in a direction different from the direction in which the second sub protrusion 466 protrudes.

  Here, the first sub projecting portion 464 and the first lead portion 32 may be collectively referred to as a first lead frame. The second sub projecting portion 466 and the second lead portion 34 may be collectively referred to as a second lead frame. The sensor module 5 is fixed to one of a first state in which the first sub-projection 464 and the second sub-projection 466 are electrically connected and a second state in which the sensor module 5 is insulated. The sensor module 5 fixed in the first state executes one of the above-described first processing and second processing. The sensor module 5 fixed in the second state executes the other process of the first process and the second process described above.

  The width of the first sub protrusion 464 in the direction perpendicular to the direction in which the first sub protrusion 464 protrudes is D1. The width of the second sub protrusion 466 in the direction perpendicular to the direction in which the second sub protrusion 466 protrudes is D2. The first sub projecting portion 464 and the second sub projecting portion 466 have a width D1 or more on the end surface of the circuit sealing portion 90 from which the first sub projecting portion 464 and the second sub projecting portion 466 project and the width D2. They are separated by the distance D3. Accordingly, the first lead portion 32 and the second lead portion 34 do not come into contact with each other due to the burr generated when the protruding portion 46 is cut and removed.

  Further, as shown in FIG. 8, the protrusion 46 is disposed between the first light projecting lead 20 and the second light projecting lead 22 on the first plane (XY plane) described above. The protrusion 46 may be disposed between the first light receiving lead 24 and the second light receiving lead 26 on the first plane (XY plane) described above. Accordingly, when the sensor module 5 is inserted, the protrusion 46 is less likely to come into direct contact with the case 60. Therefore, when the sensor module 5 is inserted, the protruding portion 46 is prevented from being accidentally cut.

  In the description of FIG. 9, the case where the first process and the second process described above are switched depending on whether or not the protruding portion 46 is cut is shown. Instead, the external connection portion 460 may be a member having conductivity different from that of the first sub-projection 464 and the second sub-projection 466. At this time, the process of the sensor module 5 may be switched from one of the first process and the second process to the other by attaching or removing the external connection unit 460. Such an external connection portion 460 that is a separate member from the first sub-projection 464 and the second sub-projection 466 may be referred to as a connection chip. The connection chip is, for example, a rectangular member having a width of D3 or more.

  Next, a method for manufacturing a sensor module using the protrusion 46 will be described. FIG. 10 is a flowchart for manufacturing the sensor module 4 described above. First, in step S1, a first photosensor intermediate part is prepared. The first photosensor intermediate component is a sensor module (sensor component) having a protrusion 46 as shown in FIGS. 8 and 9 at a stage where it is not determined whether the protrusion 46 is cut or not. The first photosensor intermediate part is manufactured as follows, for example. First, the light projecting element 11, the light receiving element 16, the integrated circuit 41, and the light emitting element 42 are attached to the lead frame 8 by die bonding. Then, wire bonding between the frames is performed. Then, resin injection molding for generating the light projecting unit 10, the light receiving unit 15, and the circuit sealing unit 90 is performed. Next, the unnecessary lead frame 8 is cut. Then, the primary molded product is separated from the lead frame 8, and the burr is cut off.

  When step S <b> 1 is completed, the manufacturer places one of the protrusions 46 including the first sub-projection 464, the second sub-projection 466, and the external connection portion 460 in the first photosensor intermediate part. It is determined whether or not to cut (step S2). In step S2, when it is determined to cut (Yes in step S2), the manufacturer cuts the protruding portion 46 (step S3). When it is determined not to cut in step S2 (No in step S2), or when step S3 is performed, the manufacturing method ends.

  In addition, a method for manufacturing a sensor module capable of connecting the first sub-projection 464 and the second sub-projection 466 with the connection chip described above will be described. FIG. 11 is a flowchart of another method for manufacturing the sensor module 4. First, in step S11, a second photosensor intermediate part is prepared. This second photosensor intermediate component is different from the first photosensor intermediate component in that the protrusion 46 is formed by the first sub-protrusion 464 and the second sub-protrusion 466 and the external connection portion 460 is not included. Different. The method for manufacturing the second photosensor intermediate part is substantially the same as the method for manufacturing the first photosensor intermediate part described above.

  When step S11 ends, the manufacturer prepares a connection chip that can connect the first sub-projection 464 and the second sub-projection 466 (step S12). Any connection chip may be used as long as it is made of a conductive material. Next, the manufacturer determines whether or not to connect the first sub protrusion 464 and the second sub protrusion 466 in the second photosensor intermediate part (step S13). If it is determined in step S13 that the connection is made (Yes in step S13), the manufacturer connects the first sub-projection 464 and the second sub-projection 466 with a connection chip, for example, by soldering (step S13). S14). When it is determined not to connect in step S13 (No in step S13), or when step S14 is performed, the manufacturing method ends.

<Resin for circuit sealing part, light projecting part, light receiving part>
As shown in FIGS. 6 to 8, the circuit sealing unit 90 seals the circuit unit 40. FIG. 12 is a side view of the sensor module 4 of FIG. FIG. 12A is a left side view of the sensor module 4 of FIG. FIG. 12B is a right side view of the sensor module 4 of FIG. FIG. 12 shows the light projecting element 11, the light receiving element 16, and the light emitting element 42 by dotted lines.

  Referring to FIGS. 7, 8, and 12, the circuit sealing unit 90 includes a circuit sealing main body 91 and an operation display unit 92. The circuit sealing main body portion 91 seals the circuit portion 40. Specifically, the circuit sealing main body 91 seals the integrated circuit 41 with resin. Furthermore, the circuit sealing main body 91 seals the light emitting element 42 with resin. The operation display unit 92 is disposed on the circuit sealing main body 91. The operation display unit 92 faces the light emitting element 42. That is, the operation display unit 92 is formed so that the light emitted from the light emitting element 42 passes through the operation display unit 92.

  The light projecting sealing portion 12, the light receiving sealing portion 17, and the circuit sealing portion 48 are formed of the same resin containing the same concentration of the light diffusing agent. The light emitting sealing part 12, the light receiving sealing part 17, and the circuit sealing part 48 are connected via the lead frame 8. Referring to FIG. 12A, when the positive direction of the Z axis is the upward direction, the distance H11 from the upper end of the light projecting element 11 to the upper end of the light projecting base 13 is from the upper end of the light emitting element 42. It is smaller than the distance H21 to the upper end of the circuit sealing main body 91. The positive direction of the Z axis also corresponds to the light projecting direction of the light projecting element 11, and the positive direction of the Z axis also corresponds to the light emitting direction of the light emitting element 42. Therefore, the thickness H11 of the light projecting base 13 in the light projecting direction of the light projecting element 11 is smaller than the thickness H21 of the circuit sealing main body 91 in the light emitting direction of the light emitting element 42. Furthermore, when the positive direction of the Z-axis is the upward direction, the distance H12 from the upper end of the light projecting base unit 13 to the upper end (rear node) V1 of the light projecting lens unit 14 is the Z direction of the motion display unit 92 Less than the thickness H22. That is, the thickness H12 of the light projecting lens unit 19 in the light projecting direction of the light projecting element 11 is smaller than the thickness H22 of the operation display unit 92 in the light emitting direction of the light emitting element 42. Accordingly, when the positive direction of the Z-axis is the upward direction, the distance H1 from the upper end of the light projecting element 11 to the upper end V1 of the light projecting lens unit 19 is from the upper end of the light emitting element 42 to the upper end of the operation display unit 92. Is smaller than the distance H2. That is, the thickness H1 of the light emitting sealing portion 12 in the light projecting direction of the light projecting element 11 is larger than the thickness H2 of the circuit sealing portion 90 including the thickness of the operation display portion 92 in the light emitting direction of the light emitting element 42. small. H2 is about 1.5 times H1.

  Referring to FIG. 12B, when the positive direction of the Z axis is the upward direction, the distance H31 from the upper end of the light receiving element 16 to the upper end of the light receiving base 18 is a circuit seal from the upper end of the light emitting element 42. It is smaller than the distance H21 to the upper end of the stop main body 91. The negative direction of the Z axis also corresponds to the light receiving direction of the light receiving element 16, and the positive direction of the Z axis also corresponds to the light emitting direction of the light emitting element 42. Therefore, the thickness H31 of the light receiving base 18 in the light receiving direction of the light receiving element 16 is smaller than the thickness H21 of the circuit sealing main body 91 in the light emitting direction of the light emitting element 42. Further, when the positive direction of the Z-axis is the upward direction, the distance H32 from the upper end of the light receiving base 18 to the upper end (rear node) V2 of the light receiving lens 19 is the thickness of the operation display 92 in the Z direction. Is smaller than H22. That is, the thickness H32 of the light receiving lens portion 19 in the light receiving direction of the light receiving element 16 is smaller than the thickness H22 of the operation display portion 92 in the light emitting direction of the light emitting element. Accordingly, when the positive direction of the Z-axis is the upward direction, the distance H3 from the upper end of the light receiving element 16 to the upper end (rear node) V2 of the light receiving lens unit 19 is the operation display unit 92 from the upper end of the light emitting element 42. It is smaller than the distance H2 to the upper end of. That is, the thickness H3 of the light receiving sealing portion 17 in the light receiving direction of the light receiving element 16 is smaller than the thickness H2 of the circuit sealing portion 90 including the thickness of the operation display portion 92 in the light emitting direction of the light emitting element 42. H2 is about 1.5 times H3.

  Here, in order to increase the sensitivity of the photosensor 1, it is desirable that the light emitted by the light projecting element 11 and received by the light receiving element 16 is not diffused as much as possible. On the other hand, the light emitted by the light emitting element 42 is preferably diffused as much as possible in order to improve the visibility of the operator. Here, the thickness H1 of the light emitting sealing portion 12 is smaller than the thickness H2 of the circuit sealing portion 90, and the thickness H3 of the light receiving sealing portion 17 is smaller than the thickness H2 of the circuit sealing portion 90. Therefore, even if the light projecting sealing part 12, the light receiving sealing part 17, and the circuit sealing part 48 are formed of the same resin containing the same concentration of the light diffusing agent, the light projecting sealing part 12 and the light receiving sealing part 17 can reduce the degree of light diffusion, and the circuit sealing part 90 can increase the degree of light diffusion.

In order to diffuse light in the circuit sealing portion 90 to an extent effective in visibility,
The concentration of the light diffusing agent in the resin is preferably 0.3% by weight or more. In order to obtain the photocurrent of the light receiving element 16 to the extent that it does not affect the sensitivity of the photosensor 1, the concentration of the light diffusing agent in the resin is preferably 0.7% by weight or less. Therefore, the concentration of the light diffusing agent in the resin is preferably 0.3% by weight or more and 0.7% by weight or less. Ideally, the concentration of the light diffusing agent in the resin is 0.5% by weight.

<Connection terminal>
Referring to FIG. 8, the plurality of connection terminals 50 include the power supply terminal 51, the ground (GND) terminal 54, the first terminal 52, and the third terminal 53 described above. Here, the first terminal 52 and the third terminal 53 are collectively referred to as a first external connection terminal. The first terminal 52 and the third terminal 53 protrude from the circuit sealing unit 90. That is, the first external connection terminal protrudes from the circuit sealing portion 90. The power supply terminal 51 and the ground terminal 54 are collectively referred to as a second external connection terminal. The power supply terminal 51 and the ground terminal 54 protrude from the circuit sealing portion 90. That is, the second external connection terminal protrudes from the circuit sealing portion 90.

  FIG. 13 is an enlarged view of the plurality of connection terminals 50 and the periphery thereof. Referring to FIG. 13, the first terminal 52 includes a first circuit connection part 52a, a first inner terminal part 52c, and a first outer terminal part 52d. The first circuit connection part 52a is connected to the integrated circuit 41 via the wire wiring W5. The first circuit connection portion 52a is a portion to which the wire wiring W5 is connected, for example, a rectangular lead illustrated in FIG. Note that the shape of the first circuit connection portion 52a is not limited to the rectangle as shown in FIG.

  The first inner terminal portion 52c extends from the first circuit connection portion 52a. Specifically, the first inner terminal portion 52c extends leftward (x-axis negative direction) and downward (y-axis negative direction) from the first circuit connection portion 52a. As shown in FIG. 13, the upper end of the first inner terminal portion 52c is a boundary with the first circuit connection portion 52a. The lower end of the first inner terminal portion 52c is a straight line that passes through the lower end PE1 of the first through hole 523 and is perpendicular to the direction (y-axis negative direction) in which the first outer terminal portion 52d extends. The direction in which the first inner terminal portion 52c extends is not limited to the direction shown in FIG. The first inner terminal portion 52c is shaped so that the width of the portion in contact with the circuit sealing portion 90 (the length in the direction perpendicular to the direction in which the first inner terminal portion 52c extends (y-axis negative direction)) is first. Any shape may be used as long as it is narrower than the width of the lower end of the inner terminal portion 52c (the length in the direction perpendicular to the direction in which the first inner terminal portion 52c extends (y-axis negative direction)). Details of the shape of the first inner terminal portion 52c will be described later.

  The first outer terminal portion 52d extends from the first inner terminal portion 52c. Specifically, the first outer terminal portion 52d extends downward (y-axis negative direction) from the first inner terminal portion 52c. The first outer terminal portion 52d includes a first end portion 52b on the side opposite to the side connected to the first inner terminal portion 52c. The first end portion 52 b includes a second through hole 525. The second through hole 525 is a soldering hole. The dimension of the first outer terminal portion 52d in the direction perpendicular to the direction in which the first outer terminal portion 52d extends (x-axis direction) is D11, excluding the rounded portion near the first end portion 52b. Is constant.

  FIG. 14 shows the first inner terminal portion 52c in an enlarged manner. Referring to FIG. 14, the first inner terminal portion 52 c includes a first portion 521, a second portion 522, and a third portion 524. The first portion 521 includes a first left portion 1521 and a first right portion 2521. The second portion 522 includes a second left portion 1522 and a second right portion 2522. A first through hole 523 is formed by the first portion 521, the second portion 522, and the third portion 524. That is, the first inner terminal portion 52 c includes the first through hole 523.

  The 1st part 521 is a part located in the exterior of the circuit sealing part 90 among the 1st inner side terminal parts 52c. Specifically, when viewed from a direction perpendicular to the first plane (XY plane) described above, the outline of the circuit sealing portion 90 and the first inner terminal portion 52c overlap the upper end of the first portion 521. Part. The first left portion 1521 and the first right portion 2521 are located outside the circuit sealing unit 90. The first left portion 1521 is a portion located on the left side of the first through hole 523 in the first portion 521. The first right portion 2521 is a portion located on the right side of the first through hole 523 in the first portion 521. The first portion 521 is adjacent to the first outer terminal portion 52d. That is, the first left portion 1521 and the first right portion 2521 are adjacent to the first outer terminal portion 52d.

  The second part 522 is a part adjacent to the first part 521 and located inside the circuit sealing unit 90. Specifically, the lower end of the second portion 522 overlaps the outline of the circuit sealing portion 90 and the first inner terminal portion 52c when viewed from the direction perpendicular to the first plane (XY plane) described above. Part. The upper end of the second portion 522 is a straight line that passes through the upper end PE3 of the first through hole 523 and is perpendicular to the direction in which the first inner terminal portion 52c extends (the negative y-axis direction). The second left portion 1522 is a portion located on the left side of the first through hole 523 in the second portion 522. The second right portion 2522 is a portion located on the right side of the first through hole 523 in the second portion 522. That is, the second left portion 1522 is adjacent to the first left portion 1521 and is located inside the circuit sealing portion 90. The second right portion 2522 is adjacent to the first right portion 2521 and is located inside the circuit sealing portion 90.

  The third portion 524 is located closer to the first circuit connection portion 52a than the second portion 522. That is, the third portion 524 is located closer to the first circuit connection portion 52a than the second left portion 1522 and the second right portion 2522. Specifically, the upper end of the third portion 524 is a boundary with the first circuit connection portion 52a. The lower end of the third portion 524 is a straight line that passes through the upper end PE3 of the first through hole 523 and is perpendicular to the direction in which the first inner terminal portion 52c extends (y-axis negative direction).

  The dimension D12 of the first left portion 1521 in the direction perpendicular to the direction in which the first inner terminal portion 52c extends (x-axis direction) is the direction perpendicular to the direction in which the first outer terminal portion 52d extends (x-axis). Direction) is shorter than the dimension D11 of the first outer terminal portion 52d. Similarly, the dimension D13 of the first right portion 2521 in the direction perpendicular to the direction in which the first inner terminal portion 52c extends (x-axis direction) is the direction perpendicular to the direction in which the first outer terminal portion 52d extends. It is shorter than the dimension D11 of the first outer terminal portion 52d (in the x-axis direction). Here, the dimension of the first portion 521 in the direction (x-axis direction) perpendicular to the direction in which the first inner terminal portion 52c extends is D12 + D13. At this time, the dimension D12 + D13 of the first portion 521 in the direction perpendicular to the direction in which the first inner terminal portion 52c extends (x-axis direction) is the direction perpendicular to the direction in which the first outer terminal portion 52d extends ( shorter than the dimension D11 of the first outer terminal portion 52d in the x-axis direction). The first outer terminal portion 52d is a portion to be soldered when the plurality of connection terminals 50 are attached to an external circuit. When the first outer terminal portion 52d is soldered, heat is conducted toward the first circuit connection portion 52a. However, since the dimension D12 + D13 of the first portion 521 is shorter than the dimension D11 of the first outer terminal portion 52d, heat is not easily conducted toward the first circuit connection portion 52a. This suppresses the wire wiring W5 from being cut by heat.

  In addition, the dimension D14 of the second left portion 1522 in the direction perpendicular to the direction in which the first inner terminal portion 52c extends (x-axis direction) is a direction perpendicular to the direction in which the first inner terminal portion 52c extends ( It is not more than the dimension D12 of the first left portion 1521 in the x-axis direction). Similarly, the dimension D15 of the second right portion 2522 in the direction perpendicular to the direction in which the first inner terminal portion 52c extends (x-axis direction) is the direction perpendicular to the direction in which the first inner terminal portion 52c extends. It is the dimension D13 or less of the first right portion 2521 (in the x-axis direction). The dimension D16 of the boundary portion between the third portion 524 and the second portion 522 in the direction perpendicular to the direction in which the first inner terminal portion 52c extends (x-axis direction) is the direction in which the first inner terminal portion 52c extends. It is longer than the dimension D14 of the second left portion 1522 in the direction perpendicular to the x-axis direction. Similarly, the dimension D16 of the boundary portion between the third portion 524 and the second portion 522 in the direction perpendicular to the direction in which the first inner terminal portion 52c extends (x-axis direction) is the first inner terminal portion 52c. It is longer than the dimension D15 of the second right portion 2522 in the direction perpendicular to the extending direction (x-axis direction). Here, the dimension of the second portion 522 in the direction perpendicular to the direction in which the first inner terminal portion 52c extends (x-axis direction) is D14 + D15. At this time, the dimension D16 of the boundary portion between the third portion 524 and the second portion 522 in the direction (x-axis direction) perpendicular to the direction in which the first inner terminal portion 52c extends is such that the first inner terminal portion 52c It is longer than the dimension D14 + D15 of the second portion 522 in the direction perpendicular to the extending direction (x-axis direction). When the first outer terminal portion 52d is soldered, the resin in contact with the second portion 522 may be melted by the heat reaching the second portion 522. However, since the dimension D16 of the boundary part between the third part 524 and the second part 522 is longer than the dimension D14 + D15 of the second part 522, even if the resin in contact with the second part 522 is melted, the first terminal 52 is It is difficult for the circuit sealing part 90 to come off.

  A part of the first through hole 523 is filled with the resin described above. The portion filled with this resin is called a first hole sealing portion 93 (see FIG. 8). The first hole sealing portion 93 seals a part of the first through hole 523. In other words, the first through hole 523 has a portion that is not filled with resin. The circuit sealing portion 90 is molded by injection molding by injecting resin from an injection port (gate) G in FIG. When the molding of the circuit sealing portion 90 is completed, the gate G is cut out, and the trace of the gate G remains on the surface of the circuit sealing portion 90 as the inlet corresponding portion 97. That is, the inlet corresponding part 97 is provided at a position corresponding to the resin inlet G when the circuit sealing part 90 is injection-molded with resin. As shown in FIG. 8, the first hole sealing portion 93 is located at one end of the circuit sealing portion 90, and the injection port corresponding portion 97 is provided at the other end of the circuit sealing portion 90. For this reason, voids are easily accumulated in the first through holes 523. If the dimension (D12 + D13) of the first portion 521 is long, air is caught by the first external connection terminal and stopped, and bubbles are generated. However, since the dimension (D12 + D13) of the first portion 521 is shorter than the dimension D11 of the first outer terminal portion 52d, the probability that air is caught on the first external connection terminal can be reduced. Furthermore, if the terminal width (D12 + D13) is narrow, the portion where the bubbles are caught is reduced, and insufficient filling of the resin caused by the bubbles can be reduced. In addition, it is preferable that the 1st part 521 is provided with the length which does not produce a burr | flash when the circuit sealing part 90 is injection-molded with resin with respect to the direction where the 1st inner side terminal part 52c is extended.

  Next, referring to FIG. 13, the third terminal 53 includes a third circuit connecting portion 53a, a third inner terminal portion 53c, and a third outer terminal portion 53d. The third circuit connection portion 53a is connected to the integrated circuit 41 via the wire wiring W7, a part of the third lead portion 36 of the main body lead portion 30, and the wire wirings W7 and W8. The third circuit connection portion 53a is a portion to which the wire wiring W6 is connected, for example, a rectangular lead illustrated in FIG. Note that the shape of the third circuit connection portion 53a is not limited to the rectangle as shown in FIG.

  The third inner terminal portion 53c extends from the third circuit connection portion 53a. Specifically, the third inner terminal portion 53c extends downward (y-axis negative direction) while meandering on the plane from the third circuit connection portion 53a. As shown in FIG. 13, the upper end of the third inner terminal portion 53c is a boundary with the third circuit connection portion 53a. The lower end of the third inner terminal portion 53c is a straight line that passes through the lower end PE2 of the third through hole 533 and is perpendicular to the direction (y-axis negative direction) in which the third outer terminal portion 53d extends. The extending direction of the third inner terminal portion 53c is not limited to the direction shown in FIG. The shape of the third inner terminal portion 53c is such that the width of the portion in contact with the circuit sealing portion 90 (the length in the direction perpendicular to the direction in which the third inner terminal portion 53c extends (y-axis negative direction)) is third. Any shape may be used as long as it is narrower than the width of the lower end of the inner terminal portion 53c (the length in the direction perpendicular to the direction in which the third inner terminal portion 53c extends (y-axis negative direction)). Details of the shape of the third inner terminal portion 53c will be described later.

  The third outer terminal portion 53d extends from the third inner terminal portion 53c. Specifically, the third outer terminal portion 53d extends downward (y-axis negative direction) from the third inner terminal portion 53c. The third outer terminal portion 53d includes a third end portion 53b on the side opposite to the side connected to the third inner terminal portion 53c. The third end portion 53 b includes a fourth through hole 535. The fourth through hole 535 is a soldering hole. The dimension of the third outer terminal portion 53d in the direction perpendicular to the direction in which the third outer terminal portion 53d extends (x-axis direction) is D21, excluding the rounded portion near the third end portion 53b. Is constant.

  FIG. 14 shows the third inner terminal portion 53c in an enlarged manner. Referring to FIG. 14, the third inner terminal portion 53 c includes a fourth portion 531, a fifth portion 532, and a sixth portion 534. The fourth portion 531 includes a fourth left portion 1531 and a fourth right portion 2531. The fifth portion 532 includes a fifth left portion 1532 and a fifth right portion 2532. A third through hole 533 is formed by the fourth portion 531, the fifth portion 532, and the sixth portion 534. That is, the third inner terminal portion 53 c includes the third through hole 533.

  The fourth portion 531 is a portion located outside the circuit sealing portion 90 in the third inner terminal portion 53c. Specifically, when viewed from a direction perpendicular to the first plane (XY plane) described above, the upper end of the fourth portion 531 overlaps the outline of the circuit sealing portion 90 and the third inner terminal portion 53c. Part. The fourth left portion 1531 and the fourth right portion 2531 are located outside the circuit sealing unit 90. The fourth left portion 1531 is a portion located on the left side of the third through hole 533 in the fourth portion 531. The fourth right portion 2531 is a portion located on the right side of the third through hole 533 in the fourth portion 531. The fourth portion 531 is adjacent to the third outer terminal portion 53d. That is, the fourth left portion 1531 and the fourth right portion 2531 are adjacent to the third outer terminal portion 53d.

  The fifth portion 532 is a portion adjacent to the fourth portion 531 and located inside the circuit sealing portion 90. Specifically, the lower end of the fifth portion 532 overlaps the outline of the circuit sealing portion 90 and the third inner terminal portion 53c when viewed from the direction perpendicular to the first plane (XY plane) described above. Part. The upper end of the fifth portion 532 is a straight line that passes through the upper end PE4 of the third through hole 533 and is perpendicular to the direction (y-axis negative direction) in which the third inner terminal portion 53c extends. The fifth left portion 1532 is a portion located on the left side of the third through hole 533 in the fifth portion 532. The fifth right portion 2532 is a portion located on the right side of the third through hole 533 in the fifth portion 532. That is, the fifth left portion 1532 is adjacent to the fourth left portion 1531 and is located inside the circuit sealing portion 90. The fifth right portion 2532 is adjacent to the fourth right portion 2531 and is located inside the circuit sealing portion 90.

  The sixth portion 534 is located closer to the third circuit connection portion 53a than the fifth portion 532 is. That is, the sixth portion 534 is located closer to the third circuit connection portion 53a than the fifth left portion 1532 and the fifth right portion 2532 are. Specifically, the upper end of the sixth portion 534 is a boundary with the third circuit connection portion 53a. The lower end of the sixth portion 534 is a straight line that passes through the upper end PE4 of the third through hole 533 and is perpendicular to the direction in which the third inner terminal portion 53c extends (y-axis negative direction).

  The dimension D22 of the fourth left portion 1531 in the direction perpendicular to the direction in which the third inner terminal portion 53c extends (x-axis direction) is the direction perpendicular to the direction in which the third outer terminal portion 53d extends (x-axis). Direction) is shorter than the dimension D21 of the third outer terminal portion 53d. Similarly, the dimension D23 of the fourth right portion 2531 in the direction perpendicular to the direction in which the third inner terminal portion 53c extends (x-axis direction) is the direction perpendicular to the direction in which the third outer terminal portion 53d extends. It is shorter than the dimension D21 of the third outer terminal portion 53d (in the x-axis direction). Here, the dimension of the fourth portion 531 in the direction perpendicular to the direction in which the third inner terminal portion 53c extends (x-axis direction) is D22 + D23. At this time, the dimension D22 + D23 of the fourth portion 531 in the direction perpendicular to the direction in which the third inner terminal portion 53c extends (x-axis direction) is perpendicular to the direction in which the third outer terminal portion 53d extends ( shorter than the dimension D21 of the third outer terminal portion 53d (in the x-axis direction). The third outer terminal portion 53d is a portion to be soldered when the plurality of connection terminals 50 are attached to an external circuit. When the third outer terminal portion 53d is soldered, heat is conducted toward the third circuit connection portion 53a. However, since the dimension D22 + D23 of the fourth portion 531 is shorter than the dimension D21 of the third outer terminal portion 53d, it is difficult for heat to be conducted toward the third circuit connection portion 53a. As a result, the wire wirings W6 and W7 are prevented from being cut by heat.

  The dimension D24 of the fifth left portion 1532 in the direction perpendicular to the direction in which the third inner terminal portion 53c extends (x-axis direction) is a direction perpendicular to the direction in which the third inner terminal portion 53c extends ( The dimension D22 or less of the fourth left portion 1531 in the x-axis direction). Similarly, the dimension D25 of the fifth right portion 2532 in the direction perpendicular to the direction in which the third inner terminal portion 53c extends (x-axis direction) is the direction perpendicular to the direction in which the third inner terminal portion 53c extends. It is the dimension D23 or less of the fourth right portion 2531 (in the x-axis direction). The dimension D26 of the sixth portion 534 in the direction perpendicular to the direction in which the third inner terminal portion 53c extends (x-axis direction) is the direction perpendicular to the direction in which the third inner terminal portion 53c extends (x-axis direction). ) Longer than the dimension D24 of the fifth left portion 1532. Similarly, the dimension D26 of the sixth portion 534 in the direction perpendicular to the direction in which the third inner terminal portion 53c extends (x-axis direction) is the direction perpendicular to the direction in which the third inner terminal portion 53c extends ( longer than the dimension D25 of the fifth right portion 2532 in the x-axis direction). Here, the dimension of the fifth portion 532 in the direction (x-axis direction) perpendicular to the direction in which the third inner terminal portion 53c extends is D24 + D25. At this time, the dimension D26 of the sixth portion 534 in the direction perpendicular to the direction in which the third inner terminal portion 53c extends (x-axis direction) is the direction perpendicular to the direction in which the third inner terminal portion 53c extends ( longer than the dimension D24 + D25 of the fifth portion 532 (in the x-axis direction). When the third outer terminal portion 53d is soldered, the resin that contacts the fifth portion 532 may melt due to the heat reaching the fifth portion 532. However, since the dimension D26 of the sixth portion 534 is longer than the dimension D24 + D25 of the fifth portion 532, even if the resin in contact with the fifth portion 532 is melted, the third terminal 53 is not easily removed from the circuit sealing portion 90. ing.

  A part of the third through hole 533 is filled with the resin described above. The portion filled with this resin is called a third hole sealing portion 94 (see FIG. 8). The third hole sealing portion 94 seals a part of the third through hole 533. In other words, the third through hole 533 includes a portion that is not filled with resin. The third hole sealing portion 94 is located at one end of the circuit sealing portion 90, and the injection port corresponding portion 97 is provided at the other end of the circuit sealing portion 90. For this reason, voids (bubbles) tend to accumulate in the third through hole 533. If the dimension (D22 + D23) of the fourth portion 531 is long, air is caught by the first external connection terminal and stopped, and bubbles are generated. However, since the dimension (D22 + D23) of the fourth portion 531 is shorter than the dimension D21 of the third outer terminal portion 53d, the probability that air is caught by the first external connection terminal can be reduced. Furthermore, if the terminal width (D22 + D23) is narrow, the portion where the bubbles are caught is reduced, and insufficient filling of the resin caused by the bubbles can be reduced. In addition, it is preferable that the 4th part 531 is provided with the length which does not produce a burr | flash when the circuit sealing part 90 is injection-molded with resin with respect to the direction where the 3rd inner side terminal part 53c is extended.

  Referring to FIG. 13, the power supply terminal 51 includes a second circuit connection portion 51a, a second inner terminal portion 51c, and a second outer terminal portion 51d. The second circuit connection portion 51a is connected to the integrated circuit 41 via the wire wirings W2 and W3, the second lead portion 34, and the wire wiring W4. The second inner terminal portion 51c extends from the second circuit connection portion 51a. Specifically, the second inner terminal portion 51c extends in the left direction (x-axis negative direction) from the second circuit connection portion 51a. The second outer terminal portion 51d extends from the second inner terminal portion 51c. Specifically, the second outer terminal portion 51d extends downward (y-axis negative direction) from the second inner terminal portion 51c. The second outer terminal portion 51d includes a second end portion 51b on the side opposite to the side connected to the second inner terminal portion 51c. The second end portion 51 b includes a fifth through hole 515. The fifth through hole 515 is a soldering hole. The dimension of the second outer terminal portion 51d in the direction (x-axis direction) perpendicular to the direction in which the second outer terminal portion 51d extends is substantially constant.

  The ground terminal 54 includes a fourth circuit connection portion 54a, a fourth inner terminal portion 54c, and a fourth outer terminal portion 54d. The fourth circuit connection portion 54a is connected to the integrated circuit 41 via the first light receiving lead 24 and the wire wiring W9. The fourth inner terminal portion 54c extends from the fourth circuit connection portion 54a. Specifically, the fourth inner terminal portion 54c extends downward (y-axis negative direction) and rightward (x-axis positive direction) from the fourth circuit connection portion 54a. The fourth outer terminal portion 54d extends from the fourth inner terminal portion 54c. Specifically, the fourth outer terminal portion 54d extends downward (y-axis negative direction) from the fourth inner terminal portion 54c. The fourth outer terminal portion 54d includes a fourth end portion 54b on the side opposite to the side connected to the fourth inner terminal portion 54c. The fourth end portion 54 b includes a sixth through hole 545. The sixth through hole 545 is a soldering hole. The dimension of the fourth outer terminal portion 54d in the direction perpendicular to the direction in which the fourth outer terminal portion 54d extends (x-axis direction) is substantially constant.

  Here, the distance between the second through hole 525 and the first circuit connection part 52a is shorter than the distance between the fifth through hole 515 and the second circuit connection part 51a. Similarly, the distance between the fourth through hole 535 and the third circuit connection portion 53a is shorter than the distance between the fifth through hole 515 and the second circuit connection portion 51a. Further, the distance between the second through hole 525 and the first circuit connection portion 52a is shorter than the distance between the sixth through hole 545 and the fourth circuit connection portion 54a. Similarly, the distance between the fourth through hole 535 and the third circuit connection portion 53a is shorter than the distance between the sixth through hole 545 and the fourth circuit connection portion 54a. Note that the distance between the two parts here means not the distance on the straight line when the two parts are connected by a straight line, but the shortest distance on the lead connecting the two parts. That is, the power supply terminal 51 and the ground terminal 54 are easily cooled when heat is conducted from the end portion to the circuit connection portion because the distance between the end portion and the circuit connection portion is long. However, since the first terminal 52 and the third terminal 53 have a short distance between the end portion and the circuit connection portion, they are not easily cooled when heat is conducted from the end portion to the circuit connection portion. Therefore, heat conduction is suppressed by providing the first through hole 523 and the third through hole 533 in the first terminal 52 and the third terminal 53.

  Further, the surface area of the first terminal 52 is smaller than the surface areas of the power supply terminal 51 and the ground terminal 54. The surface area of the third terminal 53 is smaller than the surface areas of the power supply terminal 51 and the ground terminal 54. Since the power supply terminal 51 and the ground terminal 54 have a large surface area, they are easily cooled when heat is conducted from the end portion to the circuit connection portion. However, since the first terminal 52 and the third terminal 53 have a small surface area, they are not easily cooled when heat is conducted from the end portion to the circuit connection portion. Therefore, heat conduction is suppressed by providing the first through hole 523 and the third through hole 533 in the first terminal 52 and the third terminal 53.

  As described above, the extending direction and the shape of the first outer terminal portion 52d and the third outer terminal portion 53d are the same. Furthermore, the widths of the portions of the first inner terminal portion 52c and the third inner terminal portion 53c that are in contact with the circuit sealing portion 90 are narrower than the widths of the lower ends of the first inner terminal portion 52c and the third inner terminal portion 53c. Therefore, the first circuit connection part 52a and the third circuit connection part 53a may be interchanged. The first inner terminal portion 52c and the third inner terminal portion 53c may be interchanged. The first outer terminal portion 52d and the third outer terminal portion 53d may be interchanged. The first end 52b and the third end 53b may be interchanged. The first portion 521 and the fourth portion 531 may be interchanged. The second portion 522 and the fifth portion 532 may be interchanged. The third portion 524 and the sixth portion 534 may be interchanged. The first through hole 523 and the third through hole 533 may be interchanged. The first hole sealing portion 93 and the third hole sealing portion 94 may be interchanged.

  Similarly, the extending direction of the second outer terminal portion 51d and the fourth outer terminal portion 54d is the same. Therefore, the second circuit connection portion 51a and the fourth circuit connection portion 54a may be interchanged. The second inner terminal portion 51c and the fourth inner terminal portion 54c may be interchanged. The second outer terminal portion 51d and the fourth outer terminal portion 54d may be interchanged.

  Further, the first inner terminal portion 52c and the third inner terminal portion 53c do not necessarily have the through holes 523 and 533. 15A and 15B are views showing a first inner terminal portion and a third inner terminal portion according to a modification of the present embodiment. For example, as shown in FIG. 15A (a), the first terminal 152 includes a first inner terminal portion 152c including a first left portion 1521 and a second left portion 1522, a first circuit connection portion 52a, and a first outer portion. The third terminal 153 includes a fourth left portion 1531 and a fifth left portion 1532, a third inner terminal portion 153c including a fourth left portion 1531, a third circuit connection portion 53a, and a third outer terminal. It may be formed from the part 53d. Further, as shown in FIG. 15A (b), the first terminal 252 includes a first inner terminal portion 252c including a first right portion 2521 and a second right portion 2522, a first circuit connection portion 52a, and a first outer side. The third terminal 253 may include a third inner terminal portion 253c including a fourth right portion 2531 and a fifth right portion 2532, a third circuit connection portion 53a, and a third outer terminal. It may be formed from the part 53d. Even in this case, as described above, the effect of reducing the probability that air is trapped in the first external connection terminal and the effect of reducing insufficient filling of the resin can be obtained.

  As shown in FIG. 15B (c), the first terminal 352 includes a first inner terminal portion 352c including a first left portion 1521, a second left portion 1522, and a third portion 524, and a first circuit connection portion. 52a and the first outer terminal portion 52d, the third terminal 353 includes a fourth left portion 1531, a fifth left portion 1532 and a sixth portion 534, a third inner terminal portion 353c, You may form from the 3rd circuit connection part 53a and the 3rd outer side terminal part 53d. 15B (d), the first terminal 452 includes a first inner terminal portion 452c including a first right portion 2521, a second right portion 2522, and a third portion 524, and a first circuit connection portion. 52a and the first outer terminal portion 52d, the third terminal 453 includes a fourth right portion 2531, a fifth right portion 2532 and a sixth portion 534, a third inner terminal portion 453c, You may form from the 3rd circuit connection part 53a and the 3rd outer side terminal part 53d. In this case, not only the effect of reducing the probability that air is caught on the first external connection terminal and the effect of reducing insufficient filling of the resin, but also the first terminal when the resin of the second part or the fifth part is melted. There is also an effect that the 352 and 452 and the third terminals 353 and 453 are not easily removed from the circuit sealing portion 90.

  In the photosensor according to the present invention, the first terminal may be any of the first terminals 52, 152, 252, 352, 452 described above, and the third terminal may be the third terminal 53, Any of 153, 253, 353, and 453 may be used.

<Light emitting lead and light receiving lead>
In the sensor module 5 according to the present embodiment, the light projecting leads 20 and 22 and the light receiving leads 24 and 26 are protruded in the left-right direction due to restrictions on the pin arrangement of the integrated circuit 41 in the circuit sealing unit 90. . Moreover, the sensor module 5 can respond | correspond to two types, a planar shape (straight) type and an external shape L-shaped type. The first light projecting lead 20, the second light projecting lead 22, the first light receiving lead 24, and the second light receiving lead 26 have the following characteristics. As shown in FIG. 7, the first light projecting lead 20 includes a first light projecting lead unit 202, a second light projecting lead unit 204, a third light projecting lead unit 206, and a fourth light projecting lead unit 208. And a fifth light projecting lead part 210.

  As shown in FIG. 6, the first light projecting lead part 202 is parallel to the first plane (XY plane) described above and crosses the first direction (Y axis negative direction) described above. It protrudes from 90 and extends in the direction opposite to the first direction. Specifically, the first light projecting lead portion 202 includes a first light projecting lead projecting portion 202a, a first bent portion 202c, and a first light projecting lead extending portion 202b. The first light projecting lead protrusion 202a protrudes from the circuit sealing part 90 in a direction parallel to the first plane and intersecting the first direction. The first bent portion 202c connects the first light projecting lead projecting portion 202a and the first light projecting lead extending portion 202b. The first light projecting lead extending portion 202b extends from the first bent portion 202c to the first outer end portion 204b of the second light projecting lead portion 204 in a direction opposite to the first direction (Y-axis positive direction). The first light projecting lead protrusion 202a is provided for a length (a distance of about 0.3 to 0.4 mm) that can remove burrs generated when the circuit sealing portion 90 is injection molded.

  The second light projecting lead part 204 includes a first outer end part 204b, a first inner end part 204a, and a first straight line part 204c. The first outer end portion 204b connects the first light projecting lead extension portion 202b and the first straight portion 204c. The first outer end portion 204b is bent. The first straight portion 204c extends inward in the optical axis direction (x-axis direction) from the first outer end portion 204b to the first inner end portion 204a. Here, inward refers to a direction approaching the plane C1 described above in the optical axis direction (x-axis direction). Moreover, outward means the direction away from the plane C1 mentioned above in the optical axis direction (x-axis direction). The first inner end portion 204 a connects the first straight line portion 204 c and the third light projecting lead portion 206. The first inner end portion 204a is bent. The third light projecting lead unit 206 is connected to the second light projecting lead unit 204. Specifically, the third light projecting lead portion 206 has a direction opposite to the first direction (Y-axis positive direction) from the first inner end portion 204a to a second inner end portion 208a of the fourth light projecting lead portion 208 described later. ).

  The fourth light projecting lead portion 208 includes a second outer end portion 208b, a second inner end portion 208a, and a second straight portion 208c. The second inner end portion 208a connects the third light projecting lead portion 206 and the second straight portion 208c. The second inner end portion 208a is bent. The second straight portion 208c extends outward in the optical axis direction (x-axis direction) from the second inner end portion 208a to the second outer end portion 208b. Referring to FIG. 7, the fourth light projecting lead portion 208 is bent by the first bent portion B <b> 1 in order to make the light projecting portion 10 and the light receiving portion 15 face each other. As shown in FIG. 6, by being bent by the first bent portion B1, the first bent portion B1 and the second outer end portion 208b overlap each other when viewed from a direction perpendicular to the first plane (XY plane). As shown in FIG. 6, in the optical axis direction (x-axis direction), the first inner end portion 204a is positioned more inward than the second outer end portion 208b. Further, in the optical axis direction, the second inner end portion 208a is located inward of the first outer end portion 204b. In order to secure the bending margin of the first bent portion B1 in the fourth light projecting lead 208, the third light projecting lead portion 206 is disposed inward, and thus the positional relationship is established.

  The second outer end portion 208 b connects the second straight portion 208 c and the fifth light projecting lead portion 210. The second outer end portion 208b is bent. The fifth light projecting lead part 210 is connected to the second outer end part 208b. The fifth light projecting lead part 210 extends from the second outer end 208b to the light projecting part 10 while being bent in a direction opposite to the first direction (Y-axis positive direction).

  6 and 7, the second light projecting lead 22 is positioned inward of the first light projecting lead 20 in the optical axis direction (x-axis direction). The second light projecting lead 22 includes a sixth light projecting lead part 222, a third bent part 223, a seventh light projecting lead part 224, a fourth bent part 225, an eighth light projecting lead part 226, and a second light projecting lead part 226. A fifth bent portion 227, a ninth light projecting lead portion 228, a sixth bent portion 229, a tenth light projected lead portion 230, a seventh bent portion 231, an eleventh light projected lead portion 232, and an eighth bent portion. Part 233 and a twelfth light projecting lead part 234.

  The sixth light projecting lead part 222 protrudes from the circuit sealing part 90 in a direction parallel to the first plane (XY plane) and intersecting the first direction (Y-axis negative direction) described above, and the first direction. Extend in the opposite direction. Specifically, the sixth light projecting lead part 222 includes a sixth light projecting lead protruding part 222a, a second bent part 222c, and a sixth light projecting lead extending part 222b. The sixth light projecting lead protrusion 222a protrudes from the circuit sealing part 90 in a direction parallel to the first plane and intersecting the first direction. The second bent portion 222c connects the sixth light projecting lead protruding portion 222a and the sixth light projecting lead extending portion 222b. The sixth light projecting lead extension part 222b extends from the second bent part 222c to the third bent part 223 in the direction opposite to the first direction (Y-axis positive direction). The sixth light projecting lead protrusion 222a is provided for a length (a distance of about 0.3 to 0.4 mm) that can remove burrs generated when the circuit sealing portion 90 is injection molded. As shown in FIG. 6, a distance D1 between the second light projecting lead 22 and the first light projecting lead portion 202 (specifically, the sixth light projecting lead extending portion 222b and the first light projecting lead extending) The distance D1) between the portion 202b and the first light projecting lead 20 is separated from the second light projecting lead 22 by a distance sufficient to ensure insulation so as not to contact each other.

  The third bent portion 223 connects the sixth light projecting lead portion 222 and the seventh light projecting lead portion 224. The seventh light projecting lead portion 224 extends from the third bent portion 223 to the fourth bent portion 225 in the direction opposite to the above-described first direction (Y-axis negative direction) and inward. The seventh light projecting lead portion 224 corresponds to a light projecting inclined portion that is inclined so that the distance from the first light projecting lead portion 202 is increased in the optical axis direction.

  The fourth bent portion 225 connects the seventh light projecting lead portion 224 and the eighth light projecting lead portion 226. The eighth light projecting lead part 226 is connected to the seventh light projecting lead part 224. Specifically, the eighth light projecting lead portion 226 extends from the fourth bent portion 225 to the fifth bent portion 227 in the direction opposite to the first direction (Y-axis positive direction). As shown in FIG. 6, a distance D2 between the second light projecting lead 22 and the third light projecting lead portion 206 (specifically, the distance between the eighth light projecting lead portion 226 and the third light projecting lead portion 206). The distance D2) between the first light projecting lead 20 and the second light projecting lead 22 is separated by a distance sufficient to ensure insulation so as not to contact each other. Further, the distance D2 between the second light projecting lead 22 and the third light projecting lead part 206 is shorter than the distance D1 between the second light projecting lead 22 and the first light projecting lead part 202. This is because the third light projecting lead portion 206 is disposed as far as possible in the fourth light projecting lead 208 in order to secure a bending margin of a first bent portion B1 described later.

  The fifth bent portion 227 connects the eighth light projecting lead portion 226 and the ninth light projecting lead portion 228. The ninth light projecting lead portion 228 is outward in the optical axis direction (x-axis direction) from the fifth bent portion 227 to the sixth bent portion 229 (the seventh light projecting lead portion 224 is in the optical axis direction (x-axis direction)). In the direction opposite to the direction of inclination). The sixth bent portion 229 connects the ninth light projecting lead portion 228 and the tenth light projecting lead portion 230. The tenth light projecting lead part 230 is connected to the ninth light projecting lead part 228. Specifically, the tenth light projecting lead portion 230 extends from the sixth bent portion 229 to the seventh bent portion 231 in the direction opposite to the first direction (Y-axis positive direction). The seventh bent portion 231 connects the tenth light projecting lead portion 230 and the eleventh light projecting lead portion 232. The eleventh light projecting lead portion 232 extends from the seventh bent portion 231 to the eighth bent portion 233 in the direction opposite to the above-described first direction (Y-axis negative direction) and inward. The eleventh light projecting lead part 232 is inclined so that the distance from the first light projecting lead 20 increases in the optical axis direction. The eighth bent portion 233 connects the eleventh light projecting lead portion 232 and the twelfth light projecting lead portion 234. The twelfth light projecting lead portion 234 is connected to the eighth bent portion 233 and extends to the light projecting portion 10 in a direction opposite to the first direction (Y-axis positive direction).

  6 and 7, the first light receiving lead 24 includes a first light receiving lead portion 242, a second light receiving lead portion 244, a third light receiving lead portion 246, a fourth light receiving lead portion 248, 5 light receiving lead portion 250.

  As shown in FIG. 6, the first light receiving lead portion 242 is parallel to the first plane (XY plane) and intersects the first direction (Y-axis negative direction), and includes the first light projecting lead 20 and The second light projecting lead 22 protrudes from the circuit sealing portion 90 in a direction opposite to the direction in which the second light projecting lead 22 protrudes. Specifically, the first light receiving lead portion 242 includes a first light receiving lead protruding portion 242a, a ninth bent portion 242c, and a first light receiving lead extending portion 242b. The first light receiving lead protrusion 242a protrudes from the circuit sealing portion 90 to the first bent portion 202c in a direction parallel to the first plane and intersecting the first direction. The first bent portion 202c connects the first light receiving lead protrusion 242a and the first light receiving lead protrusion 242a. The first light receiving lead extension 242b extends in the direction opposite to the first direction (Y-axis positive direction) from the first bent portion 202c to the outer end 244b of the second light receiving lead 244. The first light receiving lead protrusion 242a is provided for a length (a distance of about 0.3 to 0.4 mm) that can remove burrs generated when the circuit sealing portion 90 is injection molded.

  The second light receiving lead portion 244 includes a third outer end portion 244b, a third inner end portion 244a, and a third linear portion 244c. The third outer end portion 244b connects the first light receiving lead extension portion 242b and the third linear portion 244c. The third outer end portion 244b is bent. The third straight portion 244c extends inward in the optical axis direction (x-axis direction) from the third outer end portion 244b to the third inner end portion 244a. The third inner end portion 244a connects the third straight portion 244c and the third light receiving lead portion 246. The third inner end 244a is bent. The third light receiving lead portion 246 is connected to the second light receiving lead portion 244. Specifically, the third light receiving lead portion 246 extends in a direction opposite to the first direction (Y-axis positive direction) from the third inner end portion 244a to a fourth inner end portion 248a of a fourth light receiving lead portion 248 described later. ing.

  The fourth light receiving lead portion 248 includes a fourth outer end portion 248b, a fourth inner end portion 248a, and a fourth linear portion 248c. The fourth inner end portion 248a connects the third light receiving lead portion 246 and the fourth straight portion 248c. The fourth inner end portion 248a is bent. The fourth straight portion 248c extends outward in the optical axis direction (x-axis direction) from the fourth inner end portion 248a to the fourth outer end portion 248b. Referring to FIG. 7, the fourth light receiving lead portion 248 is bent by the second bent portion B2 in order to make the light projecting portion 10 and the light receiving portion 15 face each other. As shown in FIG. 6, the second bent portion B2 and the fourth outer end portion 248b overlap each other when viewed from a direction perpendicular to the first plane (XY plane) by being bent by the second bent portion B2. As shown in FIG. 6, in the optical axis direction (x-axis direction), the inner end portion 244a of the second light receiving lead portion 244 is located inward of the fourth outer end portion 248b. Further, in the optical axis direction, the fourth inner end portion 248a is positioned more inward than the third outer end portion 244b. Since the third light receiving lead portion 246 is disposed inward in order to secure the bending margin of the second bent portion B2 in the fourth light receiving lead portion 248, such a positional relationship is established.

  The fourth outer end portion 248 b connects the fourth straight portion 248 c and the fifth light receiving lead portion 250. The fourth outer end portion 248b is bent. The fifth light receiving lead portion 250 is connected to the fourth outer end portion 248b. The fifth light receiving lead portion 250 extends from the fourth outer end portion 248b to the light receiving portion 15 while being bent in a direction opposite to the first direction (Y-axis positive direction).

  Referring to FIGS. 6 and 7, the second light receiving lead 26 is located inward of the first light receiving lead 24 in the optical axis direction (x-axis direction). The second light receiving lead 26 includes a sixth light receiving lead portion 262, an eleventh bent portion 263, a seventh light receiving lead portion 264, a twelfth bent portion 265, an eighth light receiving lead portion 266, and a thirteenth bent portion 267. A ninth light receiving lead portion 268, a fourteenth bent portion 269, a tenth light receiving lead portion 270, a fifteenth bent portion 271, an eleventh light receiving lead portion 272, a sixteenth bent portion 273, and a twelfth light receiving portion. Lead portion 274.

  The sixth light receiving lead portion 262 is parallel to the first plane (XY plane) and intersects the first direction (Y-axis negative direction) described above, and the first light projecting lead 20 and the second light projecting lead. 22 protrudes from the circuit sealing portion 90 in a direction opposite to the direction in which the protrusion 22 protrudes, and extends in the direction opposite to the first direction. Specifically, the sixth light receiving lead portion 262 includes a sixth light receiving lead protruding portion 262a, a tenth bent portion 262c, and a sixth light receiving lead extending portion 262b. The sixth light receiving lead protrusion 262a is parallel to the first plane and intersects the first direction, and is in a direction opposite to the direction in which the first light projecting lead 20 and the second light projecting lead 22 project. It protrudes from the sealing part 90. The tenth bent portion 262c connects the sixth light receiving lead projecting portion 262a and the sixth light receiving lead extending portion 262b. The sixth light receiving lead extension part 262b extends from the tenth bent part 262c to the eleventh bent part 263 in the direction opposite to the first direction. The sixth light receiving lead protrusion 262a is provided for a length (a distance of about 0.3 to 0.4 mm) that can remove burrs generated when the circuit sealing portion 90 is injection molded. As shown in FIG. 6, a distance D3 between the second light receiving lead 26 and the first light receiving lead portion 242 (specifically, between the sixth light receiving lead extending portion 262b and the first light receiving lead extending portion 242b). The distance D3) is separated from the first light receiving lead 20 and the second light receiving lead 22 so as to ensure insulation so as not to contact each other.

  The eleventh bent portion 263 connects the sixth light receiving lead portion 262 and the seventh light receiving lead portion 264. The seventh light receiving lead portion 264 extends from the eleventh bent portion 263 to the twelfth bent portion 265 in the direction opposite to the above-described first direction (negative Y-axis direction) and inward. The seventh light receiving lead portion 264 corresponds to a light projecting inclined portion that is inclined so that the distance from the sixth light receiving lead portion 262 increases in the optical axis direction.

  The twelfth bent portion 265 connects the seventh light receiving lead portion 264 and the eighth light receiving lead portion 266. The eighth light receiving lead portion 266 is connected to the seventh light receiving lead portion 264. Specifically, the eighth light receiving lead portion 266 extends from the twelfth bent portion 265 to the thirteenth bent portion 267 in the direction opposite to the first direction (Y-axis positive direction). As shown in FIG. 6, a distance D4 between the second light receiving lead 26 and the third light receiving lead portion 246 (specifically, a distance D4 between the eighth light receiving lead portion 266 and the third light receiving lead portion 246). The first light receiving lead 20 and the second light receiving lead 22 are separated by a distance sufficient to ensure insulation so as not to contact each other. Further, the distance D4 between the second light receiving lead 26 and the third light receiving lead portion 246 is shorter than the distance D3 between the second light receiving lead 26 and the first light receiving lead portion 242. This is because the third light receiving lead portion 246 is arranged as far as possible in the fourth light receiving lead portion 248 in order to secure a bending margin of a second bending portion B2 described later.

  The thirteenth bent portion 267 connects the eighth light receiving lead portion 266 and the ninth light receiving lead portion 268. The ninth light receiving lead portion 268 is inclined outward in the optical axis direction (x-axis direction) from the thirteenth bent portion 267 to the fourteenth bent portion 269 (the seventh light receiving lead portion 264 is inclined in the optical axis direction (x-axis direction)). Extending in the opposite direction). The fourteenth bent portion 269 connects the ninth light receiving lead portion 268 and the tenth light receiving lead portion 270. The tenth light receiving lead portion 270 is connected to the ninth light receiving lead portion 268. Specifically, the tenth light receiving lead portion 270 extends from the fourteenth bent portion 269 to the fifteenth bent portion 271 in the direction opposite to the first direction (Y-axis positive direction). The fifteenth bent portion 271 connects the tenth light receiving lead portion 270 and the eleventh light receiving lead portion 272. The eleventh light receiving lead portion 272 extends from the fifteenth bent portion 271 to the sixteenth bent portion 273 in the direction opposite to the first direction (negative Y-axis direction) and inward. The eleventh light receiving lead portion 272 is inclined so that the distance from the first light receiving lead 24 increases in the optical axis direction. The sixteenth bent portion 273 connects the eleventh light receiving lead portion 272 and the twelfth light receiving lead portion 274. The twelfth light receiving lead portion 274 is connected to the eighth bent portion 233 and extends to the light projecting portion 10 in the direction opposite to the first direction (Y-axis positive direction).

  In order to make the light projecting unit 10 and the light receiving unit 15 face each other as shown in FIG. 6 from the primary molded product (sensor module 4) of the sensor module 5 shown in FIG. 7, the first light projecting lead 20 and the second light projecting unit 20 are arranged. The optical lead 22 is bent along the first folding line L1. The first light receiving lead 24 and the second light receiving lead 26 are bent along the second bending line L2. The first fold line L1 is parallel to a second direction (Y-axis direction) perpendicular to the optical axis. The second fold line L2 is also parallel to the second direction (Y-axis direction). Specifically, the fourth light projecting lead portion 208 includes a first bent portion B1 that is bent along the first bend line L1. The fourth light receiving lead portion 248 includes a second bent portion B2 that is bent along the second bend line L2. The ninth light projecting lead portion 228 includes a third bent portion B3 that is bent along the first bend line L1. The ninth light receiving lead portion 268 includes a fourth bent portion B4 that is bent along the second bend line L2.

  As shown in FIG. 7, when the first light projecting lead 20 and the second light projecting lead 22 are unfolded along the first bend line L1 and expanded in a flat plate shape, the unfolded first light projecting lead 20 and The developed second light projecting lead 22 has a shape crossing the first fold line L1. When the first light receiving lead 24 and the second light receiving lead 26 are developed in a flat plate shape without being bent along the second folding line L2, the developed first light receiving lead 24 and the developed second light receiving lead 26 are: The shape crosses the second fold line L2.

  Note that the first light projecting lead 20, the second light projecting lead 22, the first light receiving lead 24, and the second light receiving lead 26 are sufficient to bend and support the light projecting unit 10 and the light receiving unit 15. It has a width (for example, 0.5 mm or more) that can secure a sufficient strength. In order to ensure the above-described strength, the first light projecting lead 20, the second light projecting lead 22, the first light receiving lead 24, and the second light receiving lead 26 are made of copper alloy, gold, iron, or nickel alloy. It is desirable to consist. Further, the distance in the optical axis direction between the fifth light projecting lead part 210 and the eighth light projecting lead part 226 is smaller than the sum of the vertical width D31 and the horizontal width D32 of the light projecting case part 62 (see FIG. 2). Further, the distance in the optical axis direction between the fifth light receiving lead portion 250 and the eighth light receiving lead portion 266 is smaller than the sum of the vertical width D31 and the horizontal width D33 of the light receiving case portion 63 (see FIG. 2). Accordingly, the light projecting leads 20 and 22 and the light receiving leads 24 and 26 can be stored in the light projecting case portion 62 and the light receiving case portion 63 that satisfy the industry standard, respectively.

The shapes of the first light projecting lead 20, the second light projecting lead 22, the first light receiving lead 24, and the second light receiving lead 26 shown in FIGS. 6 to 8 are merely examples, and the first The light projecting lead 20, the second light projecting lead 22, the first light receiving lead 24, and the second light receiving lead 26 may have other shapes as long as the following four conditions are satisfied.
[Condition 1] In the state where the first light projecting lead 20 is deployed as shown in FIG. 7, the maximum distance in the x-axis direction between the first light projecting lead 20 and the folding line L1 (the fifth light projecting lead portion 210, The distance in the x-axis direction with respect to the fold line L1 is smaller than the vertical width D31 of the light projecting case portion 62 shown in FIG.
[Condition 2] When the second light projecting lead 22 is deployed as shown in FIG. 7, the maximum distance in the x-axis direction between the second light projecting lead 22 and the bending line L1 (the eighth light projecting lead portion 226, The distance in the x-axis direction from the fold line L1 is smaller than the lateral width D32 of the light projecting case portion 62 shown in FIG.
[Condition 3] In the state where the first light receiving lead 24 is expanded as shown in FIG. In the x-axis direction) is smaller than the vertical width D31 of the light receiving case 63 shown in FIG.
[Condition 4] In the state where the second light receiving lead 26 is expanded as shown in FIG. In the x-axis direction) is smaller than the lateral width D33 of the light receiving case 63 shown in FIG.

  FIG. 16 is a plan view of Modification 5a of the sensor module. FIG. 17 is a plan view showing a primary molded product of the modified example 5a of the sensor module of FIG. In other words, FIG. 17 is a development view of the modified example 5a of FIG. In the following description, the sensor module 5a developed on the flat plate shown in FIG. 17 is referred to as a sensor module 4a. 16 and 17, the same components as those shown in FIGS. 6 and 7 are denoted by the same reference numerals, and the description thereof is omitted.

  Referring to FIGS. 16 and 17, the sensor module 5 a includes a first light projecting lead 21, a second light projecting lead 23, a first light receiving lead 25, and a second light receiving lead 27. The first light projecting lead 21, the second light projecting lead 23, the first light receiving lead 25, and the second light receiving lead 27 are plate-shaped. The first light projecting lead 21 and the second light projecting lead 23 connect the light projecting unit 10 and the circuit sealing unit 90. The first light projecting lead 21 and the second light projecting lead 23 are circuit-sealed in a direction (left direction: X-axis negative direction) parallel to the first plane (XY) described above and intersecting the first direction described above. Projects from the stop 90. The first light projecting lead 21 and the second light projecting lead 23 extend in a direction opposite to the first direction (Y-axis positive direction). The first light receiving lead 25 and the second light receiving lead 27 connect the light receiving unit 15 and the circuit sealing unit 90. The first light receiving lead 25 and the second light receiving lead 27 are parallel to the first plane and intersect with the first direction, and the first light projecting lead 21 and the second light projecting lead 23 protrude. It protrudes from the circuit sealing portion 90 in the direction opposite to the direction to be performed (right direction: X-axis positive direction). For example, when the circuit sealing part 90 is a rectangular parallelepiped, the first light receiving lead 25 and the second light receiving lead 27 protrude from the surface opposite to the surface from which the first light projecting lead 21 and the second light projecting lead 23 project. . At that time, the angle of the lead does not matter. The first light receiving lead 25 and the second light receiving lead 27 extend in a direction opposite to the first direction (Y-axis positive direction). The first light projecting lead 21 and the second light projecting lead 23 and the first light receiving lead 25 and the second light receiving lead 27 are deformed so that the light projecting unit 10 and the light receiving unit 15 face each other.

  As shown in FIG. 16, the first light projecting lead 21 includes a first light projecting lead portion 202, a seventeenth light projecting lead portion 205, an eighteenth light projecting lead portion 266d, a thirteenth bent portion 267, The 19th light projecting lead portion 268d, the 14th bent portion 269, the 20th light projected lead portion 270d, the 15th bent portion 271, the 21st light projected lead portion 272d, the 16th bent portion 273, and the 22nd light projected portion. An optical lead 274d. Here, the shape from the 18th light projecting lead portion 266d to the 22nd light projecting lead portion 274d is the same as the shape from the eighth light receiving lead portion 266 to the 11th light receiving lead portion 272 in FIG. Further, the first light projecting lead portion 202 has the same shape as the first light projecting lead portion 202 of FIG. Therefore, only the seventeenth light projecting lead part 205 is significantly different from the conventional one and will be described below.

  The seventeenth light projecting lead portion 205 includes a fifth outer end portion 205b, a fifth inner end portion 205a, and a fifth linear portion 205c. The fifth inner end portion 205a connects the first light projecting lead extending portion 202b and the fifth linear portion 204g. The fifth inner end portion 205a is bent. The fifth straight portion 204g extends outward in the optical axis direction (x-axis direction) from the fifth inner end portion 205a to the fifth outer end portion 205b. The fifth outer end portion 205b connects the fifth linear portion 205c and the eighteenth light projecting lead portion 266d. The fifth outer end portion 205b is bent. The eighteenth light projecting lead portion 266 d is connected to the seventeenth light projecting lead portion 205. Specifically, the eighteenth light projecting lead portion 266d extends from the fifth outer end portion 205b to the thirteenth bent portion 267 in the direction opposite to the first direction (Y-axis positive direction). Referring to FIG. 16, the nineteenth light projecting lead portion 268d extends inward in the optical axis direction (x-axis direction) from the thirteenth bent portion 267. As shown in FIG. 16, in the optical axis direction (x-axis direction), the fifth inner end portion 205a is inward of the thirteenth bent portion 267 (corresponding to the outer end portion of the nineteenth light projecting lead portion 268d). Located in. Further, in the optical axis direction, the fourteenth bent portion 269 corresponding to the inner end portion of the nineteenth light projecting lead portion 268d is located inward of the fifth outer end portion 205b. Since the eighteenth light projecting lead portion 266d is disposed outward in order to secure the bending margin of the first bent portion B1 in the nineteenth light projecting lead portion 268d, such a positional relationship is established.

  Referring to FIGS. 16 and 17, the second light projecting lead 23 is located inward of the first light projecting lead 21 in the optical axis direction (x-axis direction). The second light projecting lead 23 includes a sixth light projecting lead portion 222, a 23rd light projecting lead portion 244d, a 24th light projecting lead portion 246d, a 25th light projecting lead portion 248d, and a 26th light projecting lead portion. 250d. Here, the shape from the 23rd light projecting lead portion 244d to the 26th light projecting lead portion 250d is the same as the shape from the second light receiving lead portion 244 to the fifth light receiving lead portion 250 in FIG. Further, the sixth light projecting lead portion 222 has the same shape as the sixth light projecting lead portion 222 of FIG.

  As shown in FIG. 16, the first light receiving lead 24 includes a first light receiving lead portion 242, a seventeenth light receiving lead portion 245, an eighteenth light receiving lead portion 226d, a fifth bent portion 227, and a nineteenth light receiving lead portion. 228d, a sixth bent portion 229, a twentieth light receiving lead portion 230d, a seventh bent portion 231, a twenty-first light receiving lead portion 232d, an eighth bent portion 233, and a twenty-second light receiving lead portion 234d. Here, the shape from the eighteenth light receiving lead portion 226d to the twenty-second light receiving lead portion 234d is the same as the shape from the eighth light projecting lead portion 226 to the twelfth light projecting lead portion 234 in FIG. Accordingly, only the seventeenth light receiving lead portion 245 is greatly different from the conventional one, and will be described below.

  The seventeenth light receiving lead portion 245 includes a sixth outer end portion 245b, a sixth inner end portion 245a, and a sixth straight portion 245c. The sixth inner end portion 245a connects the first light projecting lead extending portion 242b and the sixth linear portion 245c. The sixth inner end 245a is bent. The sixth straight portion 245c extends outward in the optical axis direction (x-axis direction) from the sixth inner end portion 245a to the sixth outer end portion 245b. The sixth outer end portion 245b connects the sixth straight portion 245c and the eighteenth light receiving lead portion 226d. The sixth outer end portion 245b is bent. The eighteenth light receiving lead portion 226d is connected to the seventeenth light receiving lead portion 245. Specifically, the eighteenth light receiving lead portion 226d extends from the sixth outer end portion 245b to the fifth bent portion 227 in the direction opposite to the first direction (Y-axis positive direction). The nineteenth light receiving lead portion 228d extends inward in the optical axis direction (x-axis direction) from the fifth bent portion 227. As shown in FIG. 16, in the optical axis direction (x-axis direction), the sixth inner end portion 245a is positioned more inward than the fifth bent portion 227 corresponding to the outer end portion of the nineteenth light receiving lead portion 228d. . Further, in the optical axis direction, the sixth bent portion 229 corresponding to the inner end portion of the nineteenth light receiving lead portion 228d is located inward of the sixth outer end portion 245b. Since the eighteenth light receiving lead portion 226d is disposed outward in order to secure the bending margin of the second bending portion B2 in the nineteenth light receiving lead portion 228d, such a positional relationship is established.

  Referring to FIGS. 16 and 17, the second light receiving lead 27 is located inward of the first light receiving lead 25 in the optical axis direction (x-axis direction). The second light receiving lead 27 includes a sixth light receiving lead portion 262, a 23rd light receiving lead portion 204d, a 24th light receiving lead portion 206d, a 25th light receiving lead portion 208d, and a 26th light receiving lead portion 210d. Here, the shape from the 23rd light receiving lead portion 204d to the 26th light receiving lead portion 210d is the same as the shape from the second light projecting lead portion 204 to the fifth light projecting lead portion 210 in FIG. Further, the sixth light receiving lead portion 262 has the same shape as the sixth light receiving lead portion 262 of FIG.

  In order to make the light projecting portion 10 and the light receiving portion 15 face each other as shown in FIG. 16 from the primary molded product (sensor module 4a) of the sensor module 5 shown in FIG. The optical lead 23 is bent along the first bending line L1. The first light receiving lead 25 and the second light receiving lead 27 are bent along the second bending line L2. The first fold line L1 is parallel to a second direction (Y-axis direction) perpendicular to the optical axis. The second fold line L2 is also parallel to the second direction (Y-axis direction). Specifically, the nineteenth light projecting lead portion 268d includes a first bent portion B1 bent along the first bend line L1. The nineteenth light receiving lead portion 228d includes a second bent portion B2 bent along the second bend line L2. The twenty-fifth light projecting lead portion 248d includes a third bent portion B3 that is bent along the first bend line L1. The twenty-fifth light receiving lead portion 208d includes a fourth bent portion B4 bent along the second bend line L2.

  As shown in FIG. 17, when the first light projecting lead 21 and the second light projecting lead 23 are deployed in a flat plate shape without being bent along the first folding line L1, the developed first light projecting lead 21 and The developed second light projecting lead 23 has a shape crossing the first fold line L1. When the first light receiving lead 25 and the second light receiving lead 27 are expanded in a flat plate shape without being bent along the second bending line L2, the expanded first light receiving lead 25 and the expanded second light receiving lead 27 are: The shape crosses the second fold line L2.

  In this shape, the first light projecting lead portion 202, the sixth light projecting lead portion 222, the first light receiving lead portion 242 and the sixth light receiving lead portion 262 have the same shape, and therefore the circuit sealing portion 90 is injection molded. The light projecting leads 20 and 22 and the light receiving leads 24 and 26 are arranged so as to be separated from the circuit sealing portion 90 by a distance of about 0.3 to 0.4 mm so that the burr generated at the time can be removed. Further, as apparent from FIG. 16, the distance between the first light projecting lead 21 and the second light projecting lead 23 is clearly larger than the distance D2 in FIG. The leads 23 are spaced apart from each other to ensure insulation so that they do not contact each other. Similarly, since the distance between the first light receiving lead 25 and the second light receiving lead 27 is clearly larger than the distance D4 in FIG. 6, the first light receiving lead 25 and the second light receiving lead 27 are insulated so as not to contact each other. As long as the distance is assured. Further, the first light projecting lead 21, the second light projecting lead 23, the first light receiving lead 25, and the second light receiving lead 27 are sufficient to bend and support the light projecting unit 10 and the light receiving unit 15. What is necessary is just to ensure the width (for example, 0.5 mm or more) which can ensure sufficient intensity | strength. Furthermore, in order to ensure the above-described strength, the first light projecting lead 21, the second light projecting lead 23, the first light receiving lead 25, and the second light receiving lead 27 are made of copper alloy, gold, iron, or nickel alloy. It is desirable to consist. Moreover, it is desirable that the first light projecting lead 21, the second light projecting lead 23, the first light receiving lead 25, and the second light receiving lead 27 satisfy [Condition 1] to [Condition 4] described above. Accordingly, the sensor module 5 in which the light projecting / receiving lead is projected from the side of the circuit sealing portion 90 can be realized.

  Next, the case where the sensor module 4 of FIG. 7 is made to correspond to the outer shape L-shaped type will be described. Referring to FIG. 7, in the case of corresponding to the outer shape L-shaped type, the first light projecting lead 20 and the second light projecting light are also provided in the third fold line L3 and the fourth fold line L4 in addition to the fold lines L1 and L2. The lead 22, the first light receiving lead 24, and the second light receiving lead 26 are bent. FIG. 18 is a right side view of the sensor module viewed from the optical axis direction when the light projecting / receiving lead is bent into an L shape. Referring to FIGS. 7 and 18, the first light projecting lead 20, the second light projecting lead 22, the first light receiving lead 24, and the second light receiving lead 26 are the first plane (described above) at the fourth bending line L4. It is bent 45 degrees from the (XY plane). The first light projecting lead 20, the second light projecting lead 22, the first light receiving lead 24, and the second light receiving lead 26 are bent portions B6, B8, which are portions bent by a fourth bending line L4, respectively. B10 and B12 are included. The first light projecting lead 20, the second light projecting lead 22, the first light receiving lead 24, and the second light receiving lead 26 are bent at the fourth folding line L4, the first light projecting lead 20, the second light projecting lead. 22, the first light receiving lead 24 and the second light receiving lead 26 are bent 45 degrees along the third bending line L3. The first light projecting lead 20, the second light projecting lead 22, the first light receiving lead 24, and the second light receiving lead 26 are bent portions B5, B7, which are portions bent by the third bending line L3, respectively. B9 and B11 are included. That is, the first light projecting lead 20, the second light projecting lead 22, the first light receiving lead 24, and the second light receiving lead 26 bent along the third folding line L3 are in relation to the first plane (XY plane). Orthogonal. In the following description, as shown in FIG. 18, a sensor module bent so as to correspond to the L-shaped outer shape type is referred to as a sensor module 6.

  Here, the portions from the bent portions B5 to B6, the portions from the bent portions B7 to B8, the portions from the bent portions B9 to B10, and the portions from the bent portions B11 to B12 are referred to as direction changing portions. The portion from the bent portions B7 to B8 of the second light projecting lead 22 is particularly referred to as a first direction changing portion, and the portion from the bent portions B11 to B12 of the second light receiving lead 26 is particularly preferably the first. It will be called a two-way changing section.

  The feature of the shape of the outer shape L-shaped type described above will be described using the second light projecting lead 22 and the second light receiving lead 26. The sixth light receiving lead portion 262 includes a sixth light receiving lead protruding portion 262a extending from the circuit sealing portion 90 in the optical axis direction (x-axis direction). xy plane). The sixth light receiving lead portion 262 includes a sixth light receiving lead extending portion 262b extending in a direction (y-axis positive direction) perpendicular to the optical axis direction on the first plane. Thereby, since the 2nd light reception lead 26 protrudes from the side surface of the circuit sealing part 90, the bending by the bending line L4 is realizable. Note that the sixth light receiving lead portion 262 and the sixth light receiving lead extension portion 262b may be referred to as a first light receiving base lead portion and a first light receiving linear lead portion, respectively.

  The eighth light receiving lead portion 266 extends in a direction (z-axis positive direction) perpendicular to the optical axis direction on a second plane (xz plane) perpendicular to the first plane. The seventh light receiving lead portion 264 connects the sixth light receiving lead portion 262 and the eighth light receiving lead portion 266. Here, the eighth light receiving lead portion 266 may be referred to as a second light receiving base lead portion or a second light receiving linear lead portion. Further, the seventh light receiving lead portion 264 may be referred to as a light projecting connection lead portion.

  The sixth light receiving lead extending portion 262b has a bent portion B12 that is bent at the fourth bending line L4. That is, the sixth light receiving lead extension 262b has a bent shape. The eighth light receiving lead portion 266 has a bent portion B11 that is bent at the third bend line L3. That is, the eighth light receiving lead portion 266 has a bent shape. Both the sixth light receiving lead extending part 262b and the eighth light receiving lead part 266 have a linear shape. Bending is facilitated by bending the lead portion. Referring to FIG. 18, the second light receiving lead 26 is bent 45 degrees at the sixth light receiving lead extending part 262 b and is bent 45 degrees at the eighth light receiving lead part 266. That is, the sum of the bending angle of the sixth light receiving lead extension 262b and the bending angle of the eighth light receiving lead 266 is 90 degrees. As shown in FIG. 18, in addition to bending 45 degrees twice, the second light receiving lead 26 may be bent so that the total is 90 degrees by bending it three times or more. Further, the second light receiving lead 26 may be bent into a curved surface so that the angle formed by the surface before bending of the second light receiving lead 26 and the surface after bending is 90 degrees.

  Here, the second light receiving lead 26 is located on the surface of the circuit sealing portion 90 from the third base S3 of the second light receiving lead 26 to the fourth base S4 of the second light receiving lead 26 on the surface of the light projecting portion 10. It extends to. The second light receiving lead 26 changes the direction in which the second light receiving lead 26 extends between the third base S3 to the fourth base S4 from the first plane (xy plane) to the direction perpendicular to the first plane. Includes a turning section. The second light receiving lead 26 has a shape bent at a plurality of locations between the third base S3 and the fourth base S4. Referring to FIG. 18, the length of the second light receiving lead 26 from the third base S3 through the second direction changing portion to the fourth base S4 as seen from the optical axis direction (x-axis direction) is the optical axis. The linear distance D31 from the third base S3 to the second direction changing portion (bending portion B12) of the second light receiving lead 26 viewed from the direction (x-axis direction) and the second light receiving lead 26 viewed from the optical axis direction. The linear distance D32 from the second direction changing portion (bending portion B11) to the fourth base portion S4 and one end of the second direction changing portion viewed from the optical axis direction in contact with the second light receiving lead 26 from the third base portion S3. And the linear distance D33 between the second light receiving lead 26 and the other end in contact with the fourth base S4. When viewed from the optical axis direction, the length of the second light receiving lead 26 from the third base S3 to the fourth base S4 through the second direction changing portion is 90 degrees once from the third base S3 to the fourth base S4. The L-shaped second imaginary lead wire 26v bent in the direction (shown by a two-dot chain line in FIG. 18) is shorter than the length (D41 + D42) viewed from the optical axis direction.

  Referring to FIG. 7, the sixth light projecting lead part 222 includes a sixth light projecting lead projecting part 222 a extending from the circuit sealing part 90 in the optical axis direction (x-axis direction). 90 extends on the first plane (xy plane) described above. The sixth light projecting lead part 222 includes a sixth light projecting lead extending part 222b extending in a direction (y-axis positive direction) perpendicular to the optical axis direction on the first plane. Thereby, since the 2nd light projection lead 22 protrudes from the side surface of the circuit sealing part 90, the bending by the bending line L4 is realizable. The sixth light projecting lead part 222 and the sixth light projecting lead extending part 222b may be referred to as a first light projecting base lead part and a first light projecting straight lead part, respectively.

  The eighth light projecting lead portion 226 extends in a direction (z-axis positive direction) perpendicular to the optical axis direction on a second plane (xz plane) perpendicular to the first plane. The seventh light projecting lead part 224 connects the sixth light projecting lead part 222 and the eighth light projecting lead part 226. Here, the eighth light projecting lead portion 226 may be referred to as a second light projecting base lead portion or a second light projecting straight lead portion. Further, the seventh light projecting lead part 224 may be called a light projecting connection lead part.

  The sixth light projecting lead extending portion 222b has a bent portion B8 that is bent at the fourth bending line L4. That is, the sixth light projecting lead extending part 222b has a bent shape. The eighth light projecting lead portion 226 has a bent portion B7 that is bent at the third bending line L3. That is, the eighth light projecting lead portion 226 has a bent shape. Both the sixth light projecting lead extending part 222b and the eighth light projecting lead part 226 have a linear shape. Bending is facilitated by bending the lead portion. The second light projecting lead 22 is bent 45 degrees at the sixth light projecting lead extending part 222 b and is bent 45 degrees at the eighth light projecting lead part 226. That is, the sum of the bending angle of the sixth light projecting lead extending part 222b and the bending angle of the eighth light projecting lead part 226 is 90 degrees. As shown in FIG. 18, in addition to bending 45 degrees twice, the second light projecting lead 22 may be bent so that the total is 90 degrees by bending it three or more times. Further, the second light projecting lead 22 may be bent into a curved surface so that the angle formed by the surface before bending and the surface after bending of the second light projecting lead 22 is 90 degrees.

  Here, the second light projecting lead 22 is formed on the surface of the circuit sealing unit 90 from the first base S1 of the second light projecting lead 22 to the surface of the light projecting unit 10. It extends to two bases S2 (see FIG. 7). The second light projecting lead 22 changes the direction in which the second light projecting lead 22 extends between the first base S1 and the second base S2 from the first plane (xy plane) to a direction perpendicular to the first plane. A first direction change part is included. The second light projecting lead 22 has a shape bent at a plurality of locations between the first base and the second base. Further, the length of the second light projecting lead 22 from the first base S1 through the first direction changer to the second base S2 as viewed from the optical axis direction (x-axis direction) is the optical axis direction (x-axis direction). ) Of the second light projecting lead 22 viewed from the first base S1 to the first direction changing portion (bending portion B6) and the first direction of the second light projecting lead 22 viewed from the optical axis direction. A linear distance from the turning part (bending part B7) to the second base part S2, a first end of the first direction changing part viewed from the optical axis direction, the second projecting lead 22 from the first base part S1, and a second end; It is defined by the sum of the linear distance between the second projecting lead 22 and the other end in contact with the base S2. When viewed from the optical axis direction, the length of the second light projecting lead 22 from the first base S1 through the first direction changing portion to the second base S2 is 90 times from the first base S1 to the second base S2. The length of the L-shaped first virtual lead wire bent in degrees is shorter than the length (D41 + D42) viewed from the optical axis direction. As a result, by bending one sensor module 4, it is possible to cope with both a planar (straight) type and an L-shaped outer shape. FIG. 18 shows the left side surface of the sensor module, and the second light projecting lead 22 is not displayed. However, as described above, since the second light projecting lead 22 is a surface object on the second light receiving lead 26 and the plane C1 (see FIG. 6), the second light projecting lead 22 is the same as FIG. The same bend as that shown in FIG. The shape of the first virtual lead wire is the same as the shape of the second virtual lead wire 26v.

  In this way, by bending the first light projecting lead 20, the second light projecting lead 22, the first light receiving lead 24, and the second light receiving lead 26, the Z axis between the light projecting unit 10 and the circuit sealing unit 90. The distance in the direction and the distance in the Z-axis direction between the light receiving unit 15 and the circuit sealing unit 90 can be freely designed. As a result, the degree of freedom in designing the outer shape (optical axis Ax) of the photosensor 1 can be increased.

<Case for storing sensor module>
Next, a case for housing the above-described sensor module 5 will be described. When the sensor module 5 is stored in the case 60, the sub case 80 is also stored. The sub case 80 guides the light projecting unit 10 and the light receiving unit 15 when the sensor module 5 is housed in the case 60, and the first light projecting lead 20, the second light projecting lead 22, the first light receiving lead 24, The second light receiving lead 26 is prevented from being deformed by contact with the inner wall of the case 60. FIG. 19A is a front view of the sub case 80. FIG. 19B is a bottom view of the sub case 80. FIG. 19C is a left side view of the sub case 80. FIG. 19D is a right side view of the sub case 80.

  As illustrated in FIG. 4, the case 60 includes the light projecting unit 10, the first light projecting lead 20, the second light projecting lead 22, the light receiving unit 15, the first light receiving lead 24, and the second light receiving lead of the sensor module 5. 26 and the subcase 80 are accommodated. The case body 61 accommodates the circuit sealing part 90. The light projecting case unit 62 accommodates the light projecting unit 10, the first light projecting lead 20, and the second light projecting lead 22. The light receiving case part 63 accommodates the light receiving part 15, the first light receiving lead 24, and the second light receiving lead 26. The circuit sealing portion 90 is supported by the bottom plate 98 from below. The bottom plate 98 is attached by engaging with a part of the case main body 61.

  The sub case 80 includes a first top plate portion 81, a second top plate portion 83, a first wall portion 82, a second wall portion 84, and a bottom plate portion 85. The sub case 80 is formed of a member that transmits light of a specific frequency (for example, infrared light) emitted from the light projecting element 11. The first wall portion 82 extends in the vertical direction from one end portion of the bottom plate portion 85. The second wall portion 84 extends from the other end portion of the bottom plate portion 85 in the vertical direction and in the same direction as the direction in which the first wall portion 82 extends. In other words, the bottom plate portion 85 connects the first wall portion 82 and the second wall portion 84. Here, the direction in which the first wall portion 82 and the second wall portion 84 extend from the bottom plate portion 85 is defined as a third direction. The first top plate portion 81 extends in the first outer direction from the tip portion in the third direction opposite to the end portion in the third direction of the first wall portion 82 in contact with the bottom plate portion 85. The first outward direction means a direction from the end of the second wall 84 toward the end of the first wall 82 in the third direction. The second top plate portion 83 extends in the second outer direction from the tip portion in the third direction opposite to the end portion in the third direction of the second wall portion 84 in contact with the bottom plate portion 85. The second outward direction means a direction from the end portion of the first wall portion 82 toward the end portion of the second wall portion 84. The first top plate portion 81, the second top plate portion 83, and the bottom plate portion 85 are parallel to each other. The first wall portion 82 is parallel to the second wall portion 84.

  As shown in FIGS. 4 and 5, the first top plate portion 81 and the first wall portion 82 are inserted into the light projecting case portion 62. The second top plate portion 83 and the second wall portion 84 are inserted into the light receiving case portion 63. Referring to FIG. 5, the first wall portion 82 is in contact with the first inner wall surface 64 a of the light projecting case portion 62 that faces the light projecting portion 10. The second wall portion 84 is in contact with the second inner wall surface 65 a of the light receiving case portion 63 that faces the light receiving portion 15. Referring to FIG. 4, the end portion 81a of the first top plate 81 facing the direction opposite to the traveling direction of the light from the light projecting unit 10 (x-axis negative direction) faces the first inner wall surface 64a. It contacts the third inner wall surface 64b of the light case 62. The end 83a of the second top plate portion 83 that faces the light traveling direction (x-axis positive direction) is in contact with the fourth inner wall surface 65b of the light receiving case portion 63 that faces the second inner wall surface 65a. Note that the end portion 81a and the end portion 83a may have a convex shape or a pointed shape instead of a flat surface. The third inner wall surface 64 b extends from the inside of the light projecting case portion 62 to the end of the case main body portion 61. The fourth inner wall surface 65 b extends from the inside of the light receiving case portion 63 to the end of the case main body portion 61. Accordingly, the sub case 80 can be inserted into the case 60 while being in sliding contact with the first inner wall surface 64a, the second inner wall surface 65a, the third inner wall surface 64b, and the fourth inner wall surface 65b of the case 60. Therefore, it becomes easy to insert the subcase 80 into the case 60. Further, when the sub case 80 is inserted, the first wall portion 82 and the second wall portion 84 are prevented from hitting the inner wall surface of the case 60 and deformed. Since the sub case 80 and the case 60 have the above-described configuration, the sub case 80 can be easily inserted by a machine.

  Furthermore, as shown in FIG. 4, the first top plate portion 81 faces the fifth inner wall surface 64 c of the light projecting case portion 62 that faces the case main body portion 61. That is, the first top plate portion 81 faces the case main body portion 61. Further, the second top plate portion 83 faces the sixth inner wall surface 65 c of the light receiving case portion 63 facing the case main body portion 61. That is, the second top plate portion 83 faces the case main body portion 61. Thereby, when the sub case 80 is inserted into the case 60 by a machine, the pressure generated by the first top plate portion 81 touching the fifth inner wall surface 64c and the second top plate portion 83 touching the sixth inner wall surface 65c. If the machine detects this, it can be detected that the insertion of the sub case has been completed, so that the insertion of the sub case 80 by the machine is further facilitated.

  Referring to FIGS. 19B and 5, the first wall portion 82 includes a first wall surface 82 a, a second wall surface 82 b, a first groove portion 82 c, and a first protruding portion 82 d. The first wall surface 82a is in contact with the first inner wall surface 64a. The second wall surface 82b is a wall surface on the opposite side of the first wall surface 82a. The 1st groove part 82c is provided in the 2nd wall surface 82b, and a part of light projection lens part 14 contacts. The first protruding portion 82 d is provided on the first wall surface 82 a and protrudes in the direction toward the second wall portion 84. 82 d of 1st protrusion parts protrude in the shape corresponding to the dent of the 1st groove part 82c.

  Referring to FIGS. 19B and 5, the second wall portion 84 includes a third wall surface 84a, a fourth wall surface 84b, a second groove portion 84c, and a second protruding portion 84d. The third wall surface 84a is in contact with the second inner wall surface 65a. The fourth wall surface 84b is a wall surface on the opposite side of the third wall surface 84a. The second groove portion 84c is provided on the fourth wall surface 84b, and a part of the light receiving lens portion 19 is in contact therewith. The second protruding portion 84d is provided on the third wall surface 84a and protrudes in the direction toward the first wall portion 82. The second protrusion 84d protrudes in a shape corresponding to the recess of the second groove 84c.

  Here, when the sensor module 5 is inserted into the case 60 in which the sub case 80 is inserted, the light projecting lens portion 14 and the light receiving lens portion 19 slide with the first groove portion 82c and the second groove portion 84c, respectively. To do. Therefore, even when the sensor module 5 is inserted by a machine, it can be inserted in a state where the optical axis of the light projecting unit 10 and the optical axis of the light receiving unit 15 are matched. In addition, since the position and orientation of the light projecting unit 10 and the light receiving unit 15 are fixed by the first groove 82c and the second groove 84c, respectively, the light projecting lens unit 14 is caused by the vibration of the photosensor 1 or the like. Is significantly prevented from deviating from the optical axis of the light receiving lens portion 19.

  Further, as shown in FIG. 5, the first projecting portion 82 d and the second projecting portion 84 d engage with the light projecting slit 66 and the light receiving slit 67, respectively. Therefore, the light projecting slit 66 and the light receiving slit 67 function as a guide when the sub case 80 is inserted into the case 60. Therefore, the operation of inserting the sub case 80 into the case 60 is further facilitated.

  As shown in FIGS. 4 and 5, the sub case 80 includes a light projecting unit 10 and a first top plate portion 81, a second top plate portion 83, a first wall portion 82, and a second wall portion 84. The upper part of the light receiving unit 15, the right side and upper side of the light projecting lens unit 14 of the light projecting unit 10, and the left side and upper side of the light receiving lens unit 19 of the light receiving unit 15 are covered. Accordingly, the light projecting element 11, the light receiving element 16, the first light projecting lead 20, the second light projecting lead 22, the first light receiving lead 24, and the second light receiving lead 26 include the light projecting case unit 62 and the light receiving case unit 63. The influence of static electricity generated around the can be reduced.

  Note that the above-described sub case 80 is inserted even in an L-shaped case. FIG. 20 is a front view of a photosensor 2 of an outer shape L-shaped type. FIG. 21 is a top view of the external L-shaped photosensor 2. FIG. 22 is an exploded perspective view of a photosensor 2 of an outer shape L-shaped type. 20 to 22, the same components as those in FIGS. 1 to 3 are denoted by the same reference numerals, and description thereof is omitted.

  As shown in FIGS. 20 to 22, the photosensor 2 is different in the shape of the case 60 a from the photosensor 1. The case 60 a has the same light projecting case portion 62 and light receiving case portion 63 as the case 60. Therefore, the photosensor 2 has all the features related to the sub case 80, the light projecting case 62, and the light receiving case 63 described above. Therefore, the description of the features related to the sub case 80, the light projecting case 62, and the light receiving case 63 described above is omitted.

  The case 60 a is different from the case main body 61 in the shape of the case main body 61 a. As shown in FIG. 21, in the case main body 60a, an indicator lamp window 68 for opening the operation display unit 92 to be visible is formed to open forward. Mounting holes 69e and 69f penetrating the case 60 are formed in a direction perpendicular to the direction in which the light projecting and receiving slits face (Y-axis direction in FIG. 21). In the photosensor 2, a plurality of connection terminals 50 that are a part of the sensor module 5 protrude forward from the case 60 a. As shown in FIG. 22, the sub case 80 and the sensor module 6 are sequentially inserted into the case 60a, and a bottom plate 98a that supports the circuit sealing portion 90 is attached to the bottom of the case 60a.

  23 is a cross-sectional view of the photosensor 2 taken along the cutting plane line XXIII-XXIII in FIG. In FIG. 23, only the internal features of the case body 61a will be described. First, the third inner wall surface 64b extends from the inside of the light projecting case portion 62 to the end of the case main body portion 61a. The fourth inner wall surface 65b extends from the inside of the light receiving case portion 63 to the end of the case main body portion 61a. The circuit sealing portion 90 is supported by the bottom plate 98a. The circuit sealing portion 90 is in contact with the bottom plate portion 85 of the sub case 80 and supports the bottom plate portion 85.

  As mentioned above, although one Embodiment of this invention was described, this invention is not limited to the said embodiment, A various change is possible in the range which does not deviate from the summary of invention.

  The position of the light projecting unit 10 and the position of the light receiving unit 15 may be opposite. When the position of the light projecting unit 10 and the position of the light receiving unit 15 are opposite, the position of the first light projecting lead 20 and the position of the first light receiving lead 24 correspond to the position of the light projecting unit 10 and the position of the light receiving unit 15. Are switched, and the position of the second light projecting lead 22 and the position of the second light receiving lead 26 are switched. Further, the positions of the light projecting case unit 62 and the light receiving case unit 63 are switched.

  The shapes of the light projecting lens unit 14 and the light receiving lens unit 19 are not limited to a circle. For example, the shapes of the light projecting lens unit 14 and the light receiving lens unit 19 may be elliptical.

  The number of connection terminals is not limited to four. The sensor modules 4, 5, 6 may have fewer than four or more than four connection terminals. In the sensor modules 4, 5, and 6, the operation indicator lamp (operation display unit) 92 may be omitted.

  ADVANTAGE OF THE INVENTION According to this invention, the photosensor which cannot raise | generate insufficient filling of resin at the time of injection molding can be provided.

1, 2 Photosensor 10 Light projecting unit 15 Light receiving unit 41 Integrated circuit 90 Circuit sealing unit 52 First terminal (first external connection terminal)
53 Third terminal (first external connection terminal)
52a 1st circuit connection part 53a 3rd circuit connection part (1st circuit connection part)
52c First inner terminal portion 53c Third inner terminal portion (first inner terminal portion)
52d First outer terminal portion 53d Third outer terminal portion (first outer terminal portion)
51 Power supply terminal (second external connection terminal)
54 Ground terminal (second external connection terminal)
51a Second circuit connection portion 54a Fourth circuit connection portion (second circuit connection portion)
51c 2nd inner side terminal part 54c 4th inner side terminal part (2nd inner side terminal part)
51d Second outer terminal portion 54d Fourth outer terminal portion (second outer terminal portion)
52b First end 525 Second through hole (first through hole)
53b Third end (first end)
535 Fourth through hole (first through hole)
51b Second end portion 515 Fifth through hole (second through hole)
54b Fourth end (second end)
545 Sixth through hole (second through hole)
521 1st part 531 4th part (1st part)
522 Second part 532 Fifth part (second part)
524 Third part 534 Sixth part (third part)
523 1st through hole (3rd through hole)
533 Third through hole 93, 94 Hole sealing part 97 Inlet corresponding part

Claims (6)

  1. A light projecting unit;
    A light receiving unit that receives light from the light projecting unit and outputs a light reception signal;
    An integrated circuit for processing the received light signal;
    A circuit sealing portion for sealing the integrated circuit;
    A first external connection terminal protruding from the circuit sealing portion;
    With
    The first external connection terminal is:
    A first circuit connection for connecting to the integrated circuit;
    A first inner terminal portion extending from the first circuit connection portion;
    A first outer terminal portion extending from the first inner terminal portion;
    Including
    The first inner terminal portion includes a first portion located outside the circuit sealing portion,
    The dimension of the first portion in the direction perpendicular to the direction in which the first inner terminal portion extends is the dimension of the first outer terminal portion in the direction perpendicular to the direction in which the first outer terminal portion extends. rather short than,
    A third through hole is provided at a substantially center in a direction perpendicular to a direction in which the first inner terminal portion of the first portion extends;
    The dimension in the direction in which the first inner terminal portion of the first portion extends is divided by the third through hole ,
    Photo sensor.
  2. A second external connection terminal protruding from the circuit sealing portion;
    The first outer terminal portion includes a first end portion on a side opposite to a side connected to the first inner terminal portion,
    The first end portion has a first through hole for soldering,
    The second external connection terminal is
    A second circuit connection for connecting to the integrated circuit;
    A second inner terminal portion extending from the second circuit connection portion;
    A second outer terminal portion extending from the second inner terminal portion;
    Including
    The second outer terminal portion includes a second end portion which is an end portion on the opposite side of the side connected to the second inner terminal portion,
    The second end portion has a second through hole for soldering,
    A distance between the first through hole and the first circuit connection portion is shorter than a distance between the second through hole and the second circuit connection portion;
    The photosensor according to claim 1.
  3. The surface area of the first external connection terminal is smaller than the surface area of the second external connection terminal,
    The photosensor according to claim 2.
  4. The first inner terminal portion is
    A second portion located adjacent to the first portion and located inside the circuit sealing portion;
    A third portion closer to the first circuit connection portion than the second portion and having a dimension in a direction perpendicular to a direction in which the first inner terminal portion extends is longer than a dimension of the second portion in the perpendicular direction When,
    including,
    The photosensor according to claim 1.
  5. Before SL circuit sealing portion includes a Anafu stop portions for sealing a portion of the third through hole,
    The photosensor according to claim 4.
  6. The circuit sealing portion further includes an injection port corresponding portion provided at a position corresponding to the injection port of the resin at the time of injection molding with resin,
    The hole sealing portion is located at one end of the circuit sealing portion, and the inlet corresponding portion is provided at the other end of the circuit sealing portion.
    The photosensor according to claim 5.
JP2014052826A 2014-03-15 2014-03-15 Photo sensor Active JP6349809B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014052826A JP6349809B2 (en) 2014-03-15 2014-03-15 Photo sensor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014052826A JP6349809B2 (en) 2014-03-15 2014-03-15 Photo sensor
CN201520109686.8U CN204575097U (en) 2014-03-15 2015-02-15 Photoelectric sensor

Publications (2)

Publication Number Publication Date
JP2015177078A JP2015177078A (en) 2015-10-05
JP6349809B2 true JP6349809B2 (en) 2018-07-04

Family

ID=53867719

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014052826A Active JP6349809B2 (en) 2014-03-15 2014-03-15 Photo sensor

Country Status (2)

Country Link
JP (1) JP6349809B2 (en)
CN (1) CN204575097U (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6510346B2 (en) * 2015-07-23 2019-05-08 パナソニック デバイスSunx株式会社 Photoelectric sensor, manufacturing method of photoelectric sensor
CN108067567A (en) * 2016-11-07 2018-05-25 无锡华润华晶微电子有限公司 A kind of cutter

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2744273B2 (en) * 1988-02-09 1998-04-28 キヤノン株式会社 Method for manufacturing photoelectric conversion device
JPH11145505A (en) * 1997-11-11 1999-05-28 Omron Corp Photosensor and manufacture thereof
JP4902114B2 (en) * 2004-12-16 2012-03-21 日亜化学工業株式会社 Light emitting device
US20060197474A1 (en) * 2005-03-07 2006-09-07 Olsen Jeremy E Modular lighting system
DE102005018941B4 (en) * 2005-04-22 2010-07-08 Infineon Technologies Ag Semiconductor device in a standard housing and method of making the same
JP2007180275A (en) * 2005-12-28 2007-07-12 Sharp Corp Optical semiconductor device and electronic device
US9129931B2 (en) * 2011-03-24 2015-09-08 Mitsubishi Electric Corporation Power semiconductor module and power unit device

Also Published As

Publication number Publication date
CN204575097U (en) 2015-08-19
JP2015177078A (en) 2015-10-05

Similar Documents

Publication Publication Date Title
US7499288B2 (en) Surface mounting semiconductor device
JP3794937B2 (en) Rotation detector
EP1351319B1 (en) Package for optical semiconductor
KR101410569B1 (en) Housing for an optoelectronic component and arrangment of an optoelectronic component in a housing
JP5228489B2 (en) Light emitting device, semiconductor device, and manufacturing method thereof
US6635955B2 (en) Molded electronic component
US8277093B2 (en) Connector, LED unit, and method for producing connector
JP4242401B2 (en) Semiconductor device
US7804105B2 (en) Side view type LED package
TWI278702B (en) Light source module and panel shape light source device
TW538517B (en) Conductor strip arrangement for a molded electronic component and process for molding
KR101251671B1 (en) Semiconductor device and manufacturing method thereof, and housing frame and manufacturing method thereof
US9612391B2 (en) Connector and connector assembly
JP2011238691A (en) Semiconductor device
JP2006301645A (en) Optical system with attachment structure that is insert molded to light guide
US20110187353A1 (en) Proximity sensor
DE10008203B4 (en) Method for producing electronic semiconductor components
US20140370661A1 (en) Dual Lead Frame Semiconductor Package and Method of Manufacture
WO2001069693A1 (en) Light-emitting semiconductor device and surface-emitting device
EP2899455A2 (en) Light source unit
EP2613372B1 (en) Light emitting device, and package array for light emitting device
JP2013191835A5 (en)
JP2012038536A (en) Light emitting device
JP5246662B2 (en) Package for semiconductor device and method for manufacturing the same
JP2014003851A (en) Electric connection box

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20161213

RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20170228

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20170228

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170809

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170905

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20171017

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180109

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180508

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180521

R150 Certificate of patent or registration of utility model

Ref document number: 6349809

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150