KR20160015149A - Photoelectric sensor - Google Patents

Photoelectric sensor Download PDF

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Publication number
KR20160015149A
KR20160015149A KR1020150068784A KR20150068784A KR20160015149A KR 20160015149 A KR20160015149 A KR 20160015149A KR 1020150068784 A KR1020150068784 A KR 1020150068784A KR 20150068784 A KR20150068784 A KR 20150068784A KR 20160015149 A KR20160015149 A KR 20160015149A
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KR
South Korea
Prior art keywords
light
substrate cover
cover
case
circuit
Prior art date
Application number
KR1020150068784A
Other languages
Korean (ko)
Inventor
료수케 남바
모투 나이토
Original Assignee
파나소닉 디바이스 썬크스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 파나소닉 디바이스 썬크스 주식회사 filed Critical 파나소닉 디바이스 썬크스 주식회사
Publication of KR20160015149A publication Critical patent/KR20160015149A/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01VGEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00Prospecting or detecting by optical means
    • G01V8/10Detecting, e.g. by using light barriers
    • G01V8/12Detecting, e.g. by using light barriers using one transmitter and one receiver
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00Photometry, e.g. photographic exposure meter
    • G01J1/02Details

Abstract

The objective of the present invention is to provide a photoelectric sensor which enables to visualize lighting of an indicating lamp easily. The photoelectric sensor comprises a case accommodating: a light transmitting device and a light receiving device detecting object to be detected; a circuit board (6) mounted with a control circuit which outputs a detection signal when detecting the object to be detected based on motion of the light transmitting device and the light receiving device; and an indicating lamp (25) provided on a mounting surface of a circuit device of the circuit board. On a top surface of the case, the light transmitting device and the light receiving device are installed, extending upward, facing each other, and having a preset interval therebetween. The sensor comprises a substrate cover (19) which is exposed to a surface of the case and at the same time covers the mounting surface of a circuit device and transmits visible light outputted from the indicating lamp (25), a space secured between the substrate cover and the mounting surface (24) of a circuit device, and a scattered light generation unit (23) which is provided in the substrate cover and scatters the visible light.

Description

[0001] PHOTOELECTRIC SENSOR [0002]

The present invention relates to a photoelectric sensor.

The photoelectric sensor is provided so that the transparent portion and the light receiving portion are opposed to each other and can detect the object to be detected when the detection light such as infrared ray output from the transparent portion to the light receiving portion is blocked by the object to be detected.

A control circuit for controlling the output operation of the detection light from the light projecting unit and a control circuit for controlling the output operation of the detection light from the light projecting unit and the light receiving unit, And outputs the detection signal to a control system that performs position control or the like of the to-be-detected portion. There is also a photoelectric sensor in which an indicator lamp is turned on when a detected object is detected.

Patent Document 1 discloses a photosensor having a display lamp in an amp portion and a lamp window in a case accommodating the amplifier portion.

(Patent Document 1) JP Publication No. 11-145505

In the photo sensor disclosed in Patent Document 1, it is possible to visually check whether or not the indicator lamp is turned on from the indicator light window provided in the case. However, it is possible to visually confirm that the indicator lamp is turned on almost only at the front of the indicator light window. Therefore, there is a problem that it is difficult to confirm whether or not the indicator lamp is turned on.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a photoelectric sensor capable of easily recognizing lighting of an indicator lamp.

A photoelectric sensor for solving the above-described problem is provided with a light-emitting element and a light-receiving element for detecting an object to be detected, and a control circuit for outputting a detection signal when detecting the object to be detected based on the operation of the light- 1. A photoelectric sensor comprising a circuit board and an indicator lamp provided on a circuit element mounting surface of the circuit board, the light sensor being provided on an upper surface of the case and extending upward so as to oppose the light- A substrate cover which is exposed on the surface of the case and covers the circuit element mounting surface and transmits visible light output from the indicator lamp; and a space secured between the substrate cover and the circuit element mounting surface.

With this configuration, the entire surface of the substrate cover at the time of lighting of the indicator becomes brighter.

It is preferable that the photoelectric sensor further includes a scattered light generating unit for scattering the visible light on the substrate cover.

With this configuration, since the visible light output from the indicator is scattered by the scattered light generator, the entire surface of the substrate cover becomes brighter when the indicator lamp is turned on.

In the photoelectric sensor, a frame member holding the light emitting element, the light receiving element, and the circuit board respectively, a cover member integrally molding the substrate cover while covering the frame member, The cover member, and the case are preferably formed of a thermoplastic resin.

With this configuration, the interface between the case and the frame member and the cover member is melted to improve water tightness.

In the photoelectric sensor, it is preferable that the scattered light generating portion is a plurality of irregularities provided on a surface of the substrate cover facing the circuit element mounting surface.

This configuration produces scattered light in many irregularities.

In the photoelectric sensor, it is preferable that the irregularities are irregularities having a wavy shape in cross section provided along the long side direction of the substrate cover.

With this configuration, scattered light is generated in the irregularities whose cross-section is wavy.

In the photoelectric sensor, it is preferable that the case is formed so as to cover the cover member while exposing the upper surface and the side surface of the substrate cover.

With this configuration, the upper surface and the side surface of the substrate cover become brighter when the indicator lights.

According to the photoelectric sensor of the present invention, the lighting of the indicator can be easily recognized.

1 is a perspective view showing a photoelectric sensor.
2 is a perspective view showing a main part of the photoelectric sensor.
3 is a perspective view showing the cover member.
4 is a perspective view showing the cover member.
5 is a perspective view showing a state in which the cover member is attached to a main portion;
6 is a perspective view showing a state in which the cover member is attached to the main part.
7 is a front view showing a state in which a cover member is attached to a main part.
8 is a sectional view showing a state in which the cover member is attached to a main portion.
9 is a sectional view showing the substrate cover.

Hereinafter, one embodiment of the photoelectric sensor will be described with reference to the drawings. The photoelectric sensor shown in Fig. 1 has an attachment piece 2 formed on one side of a case 1 formed integrally with a thermoplastic resin, and two attachment holes 3 are formed in the attachment piece 2 in the vertical direction. So that it can be fixed to a predetermined attaching position by inserting an attaching screw or the like into the attaching hole 3. In this embodiment, the case 1 is formed of PBT (polybutylene terephthalate) so that the strength to prevent buckling from occurring when screws are tightened is secured.

On the upper surface of the case 1, the light projecting portion 4 and the light receiving portion 5 are provided so as to extend upward so as to face each other with a predetermined gap therebetween. A light-receiving element is incorporated in the light-projecting portion 4 and a light-receiving element is incorporated in the light-receiving portion 5. The infrared light output from the light-projecting element is received by the light-receiving element through the outer frame of the light- It is possible.

Next, the main parts of the light receiving sensor accommodated in the case 1 will be described.

The main portion M shown in Fig. 2 is formed by molding a resin frame with PBT for each of the circuit board 6, the light projecting element 7 and the light receiving element 8 electrically connected on the lead frame, folding the resin frame appropriately Respectively.

On the circuit board 6, a control circuit composed of passive elements such as an IC chip, a resistor and a capacitor, and a light emitting element 25 are mounted. A base member 9 having a rectangular frame shape is formed so as to surround the circuit board 6 to constitute the base portion 10.

A light-transmissive element frame 11 is vertically erected on one side in the long side direction of the substrate portion 10 and a light-receiving element frame 12 is vertically erected on the other side in the long side direction. The light transmitting element frame 11 is a resin frame for protecting the light transmitting element 7 and the light receiving element frame 12 is a resin frame for protecting the light receiving element 8. [

In the state that the light transmitting element frame 11 and the light receiving element frame 12 are vertically bent while being bent at the lead portion between the light transmitting element frame 11 and the light receiving element frame 12 and the base member 9, 7 and the light receiving element 8 are opposed to each other.

The reinforcing portion 13 and the terminal member 14 connected to the base member 9 through leads are bent so as to turn into the back surface of the base member 9 at the lead portion. As shown in Figs. 6 and 7, the uncovered ends of the wirings 16a to 16d are respectively connected to the four terminals 15a to 15d exposed on the back surface of the terminal member by soldering or the like. The wirings 16a to 16d are power supply wirings and signal lines, and the terminal member 14 is covered by the covering member 17 all the way to the bottom.

3 shows a cover member 18 attached so as to cover the substrate portion 10, the light-transmitting element frame 11 and the light-receiving element frame 12 prior to the molding of the case 1. As shown in Fig. The cover member 18 is formed of a thermoplastic resin that transmits visible light and a thermoplastic resin that does not transmit visible light, and is formed of PC (polycarbonate) in this embodiment.

A substrate cover 19 formed in a lid shape covering the upper surface of the substrate portion 10 is formed in a red color and is vertically erected at both end portions in the longitudinal direction of the substrate cover 19, And the frame covers 20 and 21 covering the opposed surfaces of the light receiving element frame 12 are formed of black resin.

As shown in Fig. 4, on the back surface of the substrate cover 19, a frame portion 22 is formed on the outer periphery of the substrate cover 19 so as to be fittable to the outer peripheral portion of the base member 9. As shown in Fig. On the back of the substrate cover 19 on the inside of the frame shape portion 22, a plurality of concavities and convexities 23 having a wavy section in cross section along the long side direction of the substrate cover 19 are formed as shown in Fig.

When the substrate cover 19 of the cover member 18 is fitted to the base member 9 as shown in Fig. 5, the opposed faces of the translucent element frame 11 and the light receiving element frame 12 to the frame covers 20, The surface is covered.

A space 24 is secured between the circuit element mounting surface of the circuit board 6 and the lower surface of the substrate cover 19 as shown in Fig.

The cover member 18 is set on the mold with the cover member 18 attached to the substrate unit 10, the light-transmitting element frame 11 and the light-receiving element frame 12, and the upper surface and the side surface of the substrate cover 19 are exposed The case 1 is molded. 1, except for the substrate cover 19, the substrate portion 10, the light-transmitting element frame 11, the light receiving element frame 12, and the frame covers 20 and 21 are covered with the case 1, . At this time, the wiring lines 16a and 16d are exposed from the case 1 as a portion covered with the covering member 17, and the covering member 17 is held in a watertight state with respect to the case.

Next, the operation of the photoelectric sensor constructed as described above will be described.

In the photoelectric sensor, the substrate 10, the light-transmitting element frame 11 and the light-receiving element frame 12, the wirings 16a to 16d, and the leads for connecting them are connected to the case (not shown) 1 and the substrate cover 19, respectively.

Since the case 1, the base member 9, the base member 10, the reinforcing member 13, the terminal member 14 and the cover member 18 molded by PBT are all made of thermoplastic resin, 1, the boundary between the case 1 and the other member is melted to improve water tightness.

A space 24 is secured between the substrate cover 19 and the circuit board 6 in the substrate portion 10 during the molding of the case 1. [ Therefore, PBT does not flow on the circuit board 6 at the time of molding the case 1, so that the heat stress acting on the circuit element is reduced.

In the installation apparatus, when the object to be detected passes between the transparent portion 4 and the light receiving portion 5, infrared light output from the light transmitting element toward the light receiving element is blocked by the object to be detected. Then, in the control circuit mounted on the substrate unit 10, the passage of the object to be detected is detected, and the detection signal is outputted to the control system connected to the wirings 16a to 16d, and simultaneously the light emitting element 25 is turned on.

When the light emitting element 25 is turned on, the visible light is scattered by the projections and depressions 23 on the back surface of the substrate cover 19 and passes through the substrate cover 19. Since the scattered light is emitted from the upper surface and the side surface of the substrate cover 19, almost all of the substrate cover 19 is turned on in red.

In the photoelectric sensor as described above, the following effects can be obtained.

(1) The base member 9, the base member 10, the reinforcing member 13, the terminal member 14 and the cover member 18 molded of PC, which is a thermoplastic resin, molded substantially of PBT, which is a thermoplastic resin, Since the case 1 is molded with PBT, the interface between the case 1 and the other member at the time of molding the case 1 is mutually melted, and water tightness is improved. Therefore, a photoelectric sensor having excellent water resistance can be formed.

(2) The case 1 can be formed in a state in which the space 24 is secured between the circuit board 6 and the substrate cover 19 by the substrate portion 10 and the substrate cover 19. Accordingly, it is possible to reduce the failure due to thermal stress of the circuit element on the circuit board, thereby improving the yield in the production.

(3) Since the substrate cover 19 of the cover member 18 is molded with a red PC, the substrate cover 19 can be turned on in red by the visible light output from the light emitting element 25 on the circuit board 6 have.

(4) The visible light output from the light emitting element 25 is scattered by the space between the circuit board 6 and the substrate cover 19 and the projections and depressions 23 of the substrate cover 19, do. Therefore, since the upper surface and the entire side surface of the substrate cover 19 are turned on in red, visibility from the periphery of the photoelectric sensor can be improved.

(5) Since the frame covers 20 and 21 are formed of a black PC, reception of visible light by the light receiving element 8 of the light receiving element frame 12 can be substantially blocked. Therefore, it is possible to prevent the visible light from entering the light receiving element 8, thereby preventing malfunction due to reception of visible light.

(6) Since the base member 9 is formed around the circuit board 6 to form the base 10, when the terminal member 14 is folded back to the circuit board 6, The action of mechanical stress can be alleviated. Therefore, damage to the circuit board 6 and the circuit elements due to mechanical stress can be prevented, and the yield during manufacturing can be improved.

The above embodiment may be modified as follows.

The substrate 10, the light-transmitting element frame 11 and the light-receiving element frame 12 of the above-described embodiment may be formed of ABS (acrylonitrile butadiene styrene), PC, or PPS (polyphenylene sulfide) instead of PBT It is possible. The cover member 18 may also be made of PMMA (polymethyl methacrylate) instead of PC.

O The substrate cover 19 may be formed of a PC resin of a color easily visible light other than red.

1 case
6 circuit boards
7 floodlight element
8 Light receiving element
9 frame member (base member)
11 Frame member (light emitting element frame)
12 Frame member (light receiving element frame)
14 terminal member
15a to 15d terminals
16a to 16d wiring
17 coating member
18 cover member
19 substrate cover
23 unevenness
24 spaces

Claims (6)

A light-emitting element and a light-receiving element for detecting the object to be detected,
A circuit board mounted with a control circuit for outputting a detection signal when detecting the object to be detected based on the operation of the light-emitting element and the light-receiving element, and
A display lamp provided on the circuit element mounting surface of the circuit board
As a photoelectric sensor,
And a photoelectric sensor provided on the upper surface of the case so as to extend upward to oppose the light-transmitting element and the light-receiving element at predetermined intervals,
A substrate cover which is exposed on the surface of the case and covers the circuit element mounting surface and transmits visible light output from the indicator lamp,
And a space secured between the substrate cover and the circuit element mounting surface.
The method according to claim 1,
Wherein the substrate cover is provided with a scattered light generating unit for scattering the visible light.
3. The method according to claim 1 or 2,
A frame member holding the light-emitting element, the light-receiving element, and the circuit board,
A cover member covering the frame member and integrally molding the substrate cover, and
The frame member and the cover member,
And,
Wherein the frame member, the cover member, and the case are formed of a thermoplastic resin.
3. The method of claim 2,
Wherein the scattered light generating unit is a plurality of irregularities provided on a surface of the substrate cover facing the circuit element mounting surface.
5. The method of claim 4,
Wherein the concavities and convexities are irregularly formed in a wavy shape in cross section provided along a long side direction of the substrate cover.
The method of claim 3,
Wherein the case is formed so as to cover the cover member with the top and side surfaces of the substrate cover exposed.
KR1020150068784A 2014-07-30 2015-05-18 Photoelectric sensor KR20160015149A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014155047A JP6349189B2 (en) 2014-07-30 2014-07-30 Photoelectric sensor
JPJP-P-2014-155047 2014-07-30

Publications (1)

Publication Number Publication Date
KR20160015149A true KR20160015149A (en) 2016-02-12

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KR1020150068784A KR20160015149A (en) 2014-07-30 2015-05-18 Photoelectric sensor

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KR (1) KR20160015149A (en)
CN (1) CN204613423U (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6774920B2 (en) * 2017-09-27 2020-10-28 株式会社キーエンス Photoelectric switch and sensor unit
CN109435146B (en) * 2018-12-31 2023-04-25 欣灵电气股份有限公司 Photoelectric switch and production process thereof and corresponding production die

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JPS6345723A (en) * 1986-08-13 1988-02-26 株式会社日立製作所 Call register for elevator
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JP6349189B2 (en) 2018-06-27
JP2016031904A (en) 2016-03-07
CN204613423U (en) 2015-09-02

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