KR20160002647A - Finger Device for Adhesive Type of Pad Articles and Method for the Same - Google Patents

Abstract

The present invention relates to a finger device for an adhesive pad product and a method for manufacturing the same. More specifically, the present invention enables an adhesive pad product where an adhesive material or a stick material is formed on the surface. The finger device comprises: a finger body (11) where a finger plate (111) is disposed on one side surface; an extension portion (12) extended from the finger body (11); and a pair of fingers (10a, 10b) facing each other and having a coupling portion (13) formed on one side end of the extension portion (12). The surface of the finger plate (111) is coated by powder protrusions.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a finger device for a sticky pad article,

FIELD OF THE INVENTION The present invention relates to a finger device for a tacky pad article and a method of manufacturing the same, and more particularly to a finger device for a tacky pad article which enables the movement of a tacky pad article having a tacky or adhesive substance on its surface, .

In a production line in which a product is assembled while a plurality of articles are continuously supplied, the plate-shaped pad articles are stacked and sequentially supplied by fingers. An adhesive or pressure-sensitive adhesive layer may be formed on the surface of the pad article so that it can be attached or bonded to other articles during assembly. In the process of transferring the pad product in the production line, a part of the adhesive or the adhesive may be adhered to the finger, and various problems may be caused thereby.

Prior art relating to fingers of pad-shaped articles is disclosed in Korean Patent Publication No. 2005-0005847 " gripper for crash pad of vehicle ". The prior art includes a main frame mounted on one end of an arm of a robot for inputting a crash pad into a vehicle body and forming a plurality of slots in a cross section thereof; Left and right adsorption means configured to adsorb opposite ends of the crash pad for driving the adsorption cylinder at both side ends of the main frame; A center suction means mounted on one side of the center of the main frame through a bracket to absorb a center upper end of the crash pad; Left and right grip means configured to be slidably mounted on both side ends of the main frame adjacent to the left and right suction means via rails in the longitudinal direction to regulate the crash pad through tool holes formed at both ends of the crash pad ; Grip driving means connected to the left and right grip means through a connecting bar at a rear surface of the main frame and driving the rack pinion by the operation of a grip cylinder to slidely drive the left and right grip means; And specification detecting means for detecting the specifications of the crash pad and outputting the signals to the controller, the gripper gripper being provided at both ends of the main frame.

Another prior art related to fingers of pad-shaped articles is disclosed in Korean Patent Publication No. 2010-0002063 'gripping device, plate-like member and gripping method'. The prior art includes a long plate-shaped main body, a first concave portion formed as a part of the main body and having a concave shape in a short longitudinal direction of the main body, and a second concave portion formed at a position spaced apart from the first concave portion in the long- And a second concave portion formed in a part of the main body and having a concave shape in the short-length direction. In the above-described prior art, the gripping device is configured to move the plate-like member in the short-length direction so as to face the first movable member and the second movable member in a short lengthwise direction by cooperation of the first movable member and the second movable member Wherein the first movable member is pressed against the bottom of the concave shape of the first concave portion and at least two concave portions of the concave shape of the second concave portion are pressed against the bottom of the concave shape of the first concave portion, And the second movable member is pressed against the plate-like member to grasp the plate-like member.

The presented prior art does not disclose a transported portion of an article to which an adhesive or adhesive material, such as, for example, an automotive brake pad, is imparted. In the case of such a viscous article, means is required to prevent the viscous article from adhering to the fingers and to move the article accurately at a predetermined position.

The present invention has been made to solve the problems of the prior art and has the following purpose.

Prior Art Document 1: Korean Patent Publication No. 2005-0005847 (published by Hyundai Motor Co., Ltd. on January 15, 2005) Gripper for a crash pad of a vehicle Prior Art 2: Korean Patent Publication No. 2010-0002063 (published by Fuji Xerox Co., Ltd., Jan. 6, 2010) Handling device, plate-like member and gripping method

SUMMARY OF THE INVENTION It is an object of the present invention to provide a finger device for a sticky pad article for gripping and positioning a pad article having an adhesive or tacky material on its surface.

It is another object of the present invention to provide a method of manufacturing a finger device that enables gripping and positioning of a pad article having an adhesive or adhesive layer.

According to a preferred embodiment of the present invention, the finger device comprises: a finger body having a finger plate disposed on one side; An extension extending from the finger body; And a pair of opposed fingers including a fastening portion formed at one end of the extension portion, the surface of the finger plate being coated by the powder projection.

According to another preferred embodiment of the present invention, the powder protrusions are made of iron powder, carbon powder, nickel powder, chrome powder, molybdenum powder, titanium dioxide powder, aluminum powder, tungsten powder, silicon powder, boron powder, niobium powder, And at least one alloy powder.

According to another preferred embodiment of the present invention, a method of manufacturing a finger device for transferring a pad article imparted with a sticky or adhesive material comprises: forming a finger shape having a plane; Spraying a metal or non-metal powder onto the plane; Applying pressure to the metal or non-metal powder while heating the plane; And melting and bonding the metal or non-metal powder to the plane.

The finger device according to the present invention has an advantage that a pad-shaped article having an adhesive or sticky material, which is stacked in a plurality of layers and moved in order, is accurately positioned at a predetermined position. Further, the finger device according to the present invention has an advantage that production efficiency is improved by preventing sticky or adhesive material from being attached to the finger. In addition, the finger device according to the present invention has an advantage that the feeding error is reduced by improving the gripping performance of the pad-shaped article.

1 shows an embodiment of a finger device according to the present invention.
2 is an enlarged view of an embodiment of a finger device according to the present invention.
FIG. 3 illustrates various embodiments of a finger plate applied to a finger device according to the present invention.
FIG. 4 illustrates a manufacturing process of a finger device according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the embodiments shown in the accompanying drawings, but the present invention is not limited thereto. In the following description, components having the same reference numerals in different drawings have similar functions, so that they will not be described repeatedly unless necessary for an understanding of the invention, and the known components will be briefly described or omitted. However, It should not be understood as being excluded from the embodiment of Fig.

1 shows an embodiment of a finger device according to the present invention.

Referring to FIG. 1, a finger device 10 according to the present invention includes a finger body 11 having a finger plate 111 disposed on one side thereof; An extension portion (12) extending from the finger body (11); And a pair of opposing fingers 10a and 10b including a fastening portion 13 formed at one end of the extension portion 12 and the surface of the finger plate 111 is coated with a powder projection .

The finger device 10 according to the present invention can be applied, for example, to transfer a pad to a predetermined position in a production line of an automotive brake pad. An adhesive or tacky material layer is formed on one side of the pad and thereby the transfer means may be adhered or tacky. Adhesive or sticky materials applied to such a transfer means must be removed in the same way as cleaning, since they may cause various types of errors in a continuous transfer process. The finger device 10 according to the present invention can reduce or prevent the remaining adhesive or sticky material. Or transfer errors due to remaining adhesive material or adhesive material are prevented. On the other hand, the finger device 10 according to the present invention has an advantage that the grip performance of the pad-shaped article is improved. This has the advantage of preventing the occurrence of errors such as slippage during the transfer process. The finger device 10 according to the present invention is therefore particularly suitable for, but not limited to, pad transfer with adhesive or adhesive layers. For example, the finger device 10 may be applied for placement of an adhesive pad magazine or transfer pad. The finger device 10 can be applied to the movement of the material to which various adhesive or sticky materials are imparted through appropriate structural changes.

The finger device 10 can be made up of a pair of opposing fingers 10a and 10b and each finger 10a and 10b can hold both sides of the pad P. [ The pad P can be moved to or from the base substrate B. The pads P can be in a plate shape and each of the fingers 10a and 10b can hold the both ends of the pad P and can transfer the pad P. [

The finger body 11 may be, for example, a polyhedron or a cylindrical shape formed with a finger plate 111 formed at a portion contacting the edge of the pad P, but is not limited thereto. The finger plate 111 may have a suitable structure that can be in contact with at least a portion of one edge of the pad P. [

The extension portion 12 can extend from the finger body 11 and the fastening portion 13 can be formed at one end of the extension portion 12. [ The extension portion 12 or the fastening portion 13 may have various shapes as an additional portion for the operation of the finger body 11. For example, the extension portion 12 and the finger body 11 can have an integral structure or can be made as a separate structure and can be made in the form of a joint. The fastening portion 13 may also have any suitable structure that can be connected to a drive means for actuation of the finger body 11. [ Therefore, the present invention is not limited by the structure of the extension portion 12 or the fastening portion 13.

The fingers 10a and 10b may be formed as a pair, and each of the fingers 10a and 10b may hold one edge of the pad P and be operated together to move the pad P to a predetermined position. The fingers 10a, 10b can be moved by various actuating devices and the invention is not limited by the device for the operation of the fingers 10a, 10b.

An embodiment of the fingers 10a, 10b will be described below.

2 is an enlarged view of an embodiment of a finger device according to the present invention.

Fig. 2 (a) shows the structure viewed from the front of the finger 10a and Fig. 2 (b) shows the structure viewed from the side, respectively.

Referring to FIG. 2, the finger body 11 may have a thick rectangular plate-like plate structure and the extending portion 12 from one side may extend in a bar shape. A fastening portion 13 having a fastening hole 131 formed in a vertically bent shape may be formed at an end portion of the extension portion 12. The finger plate 111 may be formed on one side of the finger body 11 and the finger plate 111 may be coated or coated with powder.

The fingers 10a may be integrally formed with the finger body 11 and the extension portion 12 and the fastening portion 13 may be integrally formed with the extension portion 12 depending on processing conditions. Such a structure has an advantage that the finger 10a can be easily manufactured, and the overall shape can be made solid. The finger body 11 has a structure protruding downward with respect to the extending portion 12 for the purpose of gripping the pad. The finger body 12 and the extending portion 12 can be connected in various structures.

The surface of the finger plate 111 may be coated or applied, for example, by a stainless steel powder or silica powder having an average diameter of 1 to 1,000 mu m. The finger plate 111 can be manufactured integrally with the finger body 11 or can be manufactured independently and attached to the finger body 11. Alternatively, the finger plate 111 may be formed in such a manner that the metal powder is sprayed and melt-pressed on one side of the finger body 11. Alternatively, the finger plate 111 may be formed by a method of forming various types of scratches on one side of the finger body 11.

The finger plate 111 can be formed in various ways, and the present invention is not limited by the method in which the finger plate 111 is formed.

Various embodiments of the finger plate 111 are described below.

FIG. 3 illustrates various embodiments of a finger plate applied to a finger device according to the present invention.

3 (a) shows an embodiment in which the powder body is directly coated or applied to the finger body 11, and FIG. 3 (b) shows an embodiment in which a scratch structure is formed in the finger body 11 And FIG. 3 (C) shows an embodiment in which a finger plate formed of a separate independent substrate is attached to the finger body 11, respectively.

Referring to FIG. 3 (a), the powder 311 may be melt-pressed on one side of the finger body 11. The melt-pressing may be performed, for example, by a method of forming the adhesive layer 31 or not forming the adhesive layer 31, and if necessary, the powder 311 is composed of the core 311a and the coating layer 311b . The adhesive layer 31 may be, for example, a resin layer or a flexible metal layer. When it is formed of a resin layer, it needs to be determined in consideration of properties of a pressure-sensitive adhesive material or an adhesive material applied to the pad. When the adhesive layer 31 is formed of a resin component, it is advantageous to select the adhesive material or the resin material having properties not to bond to the adhesive material. On the other hand, the adhesive layer 31 can be made of a soft metal material such as aluminum, for example. When the adhesive layer 31 is formed of a soft metal material or a metal material having a low softening point, the powder 311 can be easily pressed by heat. Alternatively, the finger body 11 itself can be made of a soft metal material

As shown in FIG. 3 (a), the powder 311 can have various shapes and can be, for example, spherical, hemispherical, ellipsoidal or polygonal. In addition, the coating layer 311b may be made of a non-sticky soft metal material to improve the bonding force of the powder 311 to the finger body 11 while at the same time preventing the adhesive component or the adhesive material from adhering to the finger plate. have. The powders may be bonded to the finger plates in a variety of ways, such as, for example, plasma coating, spray coating or spray coating.

Referring to FIG. 3 (b), the finger plate can be made by a method of forming a scratch 312 on the finger body 11. The scratches 312 may be formed in the shape of mountains and valleys along the longitudinal direction as shown on the right side of (B) of Fig. 3, but may be made irregularly.

3, the powder 311 is coated on a separate powder substrate 32 and then bonded to the finger body 11 by the adhesive layer 31 on the powder substrate 32 A finger plate can be made. The powder substrate 31 may be made of, for example, a synthetic resin material or a metal material, but is not limited thereto. For example, the powder substrate 31 may be made of a pulp material. The powder substrate 32 can be made of various materials and the present invention is not limited to the embodiments shown.

According to the present invention, the powder is at least one of iron powder, carbon powder, nickel powder, chromium powder, molybdenum powder, titanium dioxide powder, copper powder, tin powder aluminum powder, tungsten powder, silicon powder, boron powder, niobium powder, Of at least one of the following: For example, the powder 311 may be composed of 0.02 wt% carbon, 10 wt% nickel, 10 wt% nickel, and iron powder making the total 100 wt%. Each of the powders may be synthesized into one powder particle or the powder 311 may be produced in such a state that each of the powders is independently mixed. In addition, the powder 311 may comprise a resin adhesive component and may comprise, for example, a silicone adhesive.

According to the present invention, the height from the upper plane of the finger body 11 to the uppermost portion of the powder 311 or the diameter of the powder 311 may be, for example, 1 to 1,000 mu m, but is not limited thereto. Also, the roughness may be, for example, 10 to 100 占 퐉, but the height and roughness may be appropriately adjusted depending on the object to be transported.

Finger plates may be formed in various ways and the present invention is not limited to the embodiments shown.

The manufacturing process of the finger plate according to the present invention will be described below.

FIG. 4 illustrates a manufacturing process of a finger device according to the present invention.

Referring to FIG. 4, the finger device according to the present invention includes a step P41 of forming a finger shape having a plane; Spraying (44) a metal or non-metallic powder onto the plane; Applying pressure to the metal or nonmetal powder while heating the plane (P45); And melting and bonding the metal or nonmetal powder to the plane (P46).

The finger shape may have various structures, but it is necessary to have a plane at least where the finger plate can be formed. When such a finger substrate is prepared (P41), powder or metal powder (P42) may be prepared. The powder may be at least one selected from the group consisting of iron powder, carbon powder, nickel powder, chromium powder, molybdenum powder, titanium dioxide powder, aluminum powder, tungsten powder, silicon powder, boron powder, niobium powder, May be selected from at least one selected from the group consisting of. If necessary, an adhesive layer may be formed on the finger substrate (P43). However, the adhesive layer may not be formed depending on the manufacturing process of the finger plate. For example, when a plasma coating method or a spray coating method is applied, there is no need to separately form an adhesive layer.

When the metal powder is prepared (P42), the metal powder may be sprayed onto the finger substrate (P44). The spray can be sprayed, for example, using a metal powder spray device or by charging the metal powder with an anode and applying a voltage to the substrate. When the metal powder is sprayed, heat can be applied to the finger substrate, and at the same time, the upper portion of the metal powder can be pressed by the press apparatus (P45). And thereby the powder can be bonded or bonded to the finger substrate while being melted (P46). Melting means a level at which the hardness of the metal powder is weakened and does not need to be changed to a liquid state. In other words, it means that the hardness of the gold powder itself is lowered while maintaining the shape of the metal powder itself. The finger substrate can also be melted in this state.

As described above, the metal powder may be bonded to the finger substrate by various methods such as spray coating or plasma coating or sputtering to form the finger plate, and the present invention is not limited to the embodiments shown.

The finger device according to the present invention has an advantage that a pad-shaped article having an adhesive or sticky material, which is stacked in a plurality of layers and moved in order, is accurately positioned at a predetermined position. Further, the finger device according to the present invention has an advantage that production efficiency is improved by preventing sticky or adhesive material from being attached to the finger. In addition, the finger device according to the present invention has an advantage that the feeding error is reduced by improving the gripping performance of the pad-shaped article.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention . The invention is not limited by these variations and modifications, but is limited only by the claims appended hereto.

10: finger device 10a, 10b: finger
11: finger body 12: extension part
13: fastening part 31: adhesive layer
32: Powder substrate 111: Finger plate
131: fastening hole 311: powder
311a: Core 311b: Coating layer
312: scratch

Claims (1)

A finger device for holding and conveying a side surface of a pad-shaped article having a sticky or adhesive layer,
A finger body (11) having a finger plate (111) disposed on one side thereof in contact with a side surface of the pad-shaped article;
An extension portion (12) extending from the finger body (11); And
And a pair of fingers (10a, 10b) facing each other including a fastening portion (13) formed at one end of the extending portion (12)
The finger body 11 is formed to protrude downward with respect to the extending portion 12 while the fastening portion 13 has a shape bent vertically at an end portion of the extending portion 12,
The surface of the finger plate 111 is coated by a powder projection including a resin adhesive component,
Wherein the powder protrusion is an iron powder, a carbon powder, a nickel powder, a chromium powder, a molybdenum powder, a titanium dioxide powder, an aluminum powder, a tungsten powder, a silicon powder, a boron powder or a niobium powder or at least one alloy powder thereof The finger device.

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