KR20150118026A - heating apparatus for substrate - Google Patents

heating apparatus for substrate Download PDF

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Publication number
KR20150118026A
KR20150118026A KR1020150041659A KR20150041659A KR20150118026A KR 20150118026 A KR20150118026 A KR 20150118026A KR 1020150041659 A KR1020150041659 A KR 1020150041659A KR 20150041659 A KR20150041659 A KR 20150041659A KR 20150118026 A KR20150118026 A KR 20150118026A
Authority
KR
South Korea
Prior art keywords
hot plate
slider
guide channel
heating apparatus
thermal expansion
Prior art date
Application number
KR1020150041659A
Other languages
Korean (ko)
Inventor
정동준
이새봄
Original Assignee
주식회사 좋은기술
이새봄
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 좋은기술, 이새봄 filed Critical 주식회사 좋은기술
Priority to PCT/KR2015/003132 priority Critical patent/WO2015156530A1/en
Publication of KR20150118026A publication Critical patent/KR20150118026A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Abstract

An apparatus for heating a substrate will be described. Substrate heating apparatus: a hot plate; A table for supporting a hot plate; And a plurality of supporters mounted on the periphery of the center of the hot plate to guide radial thermal expansion of the hot plate by supporting the hot plate on the table.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heating apparatus such as a wafer used in a semiconductor manufacturing process and the like, and more particularly to a heating apparatus including a hot plate.

In a conventional substrate heating apparatus, the hot plate includes a plate-shaped heat source and upper and lower plates. The plate member is made of metal such as aluminum, and the upper and lower plates are joined together by a bolt or the like with a heat source interposed therebetween. The hot plate is fixed with respect to the fixed table, and a wafer lifting finger is located at the center thereof, and is fixed by the fixing structure at its periphery.

In this way, in the heating apparatus, if the hot plate is heated to a high temperature by an internal heat source in a state where the edge is fixed to the fixing table, thermal expansion occurs. At this time, since the edge of the hot plate is fixed firmly by the fixing structure, the thermal expansion occurs not in the plane direction with respect to the heating surface of the hot plate but in the vertical direction perpendicular thereto, and at this time, Deformation occurs. According to this, the upper surface of the hot plate, especially the heating surface, rises most at the central portion, and the heating surface is distorted in the form of a Gaussian curve.

As a result, during the wafer process, the wafer in a high temperature state lying on the distorted heating surface (upper surface) of the hot plate is distorted and deformed, and is thus defective. If the wafer is placed on a distorted hot plate, the temperature imbalance is intensified and causes a process failure. Even in this case, it was not possible to find out the cause, and therefore it was impossible to prepare an alternative.

The present invention provides a substrate heating apparatus capable of effectively suppressing distortion of a heating surface due to thermal expansion of a hot plate.

A substrate heating apparatus according to the present invention comprises:

A hot plate;

A table for supporting a hot plate;

And a plurality of supporters mounted on the periphery of the center of the hot plate for guiding or allowing thermal expansion of the hot plate by supporting the hot plate on the table.

According to one embodiment of the invention, the radial thermal expansion by the supports is in the radial direction passing through the center of the hot plate.

According to an embodiment of the present invention, at least three support portions are provided, one end of which is fixed to a hot plate, and the other end of which is movably coupled along a guide channel formed on the table.

According to an embodiment of the present invention, a slider is provided at a lower end portion of each support portion, and the slider is coupled to the guide channel so as to reciprocate in one direction.

According to an embodiment of the present invention, the support portions are disposed at regular angular intervals around the bottom surface of the hot plate, and the support portions guide or guide the thermal expansion and contraction of the hot plate in a radial direction passing through the center of the hot plate. Allow.

According to an embodiment of the present invention, at least three support portions are provided, one end of which is fixed to a hot plate, and the other end of which is movably coupled along a guide channel formed on the table. A slider is movably coupled to the guide channel at the other end of the support.

The hot plate can freely thermally expand and contract in the radial plane direction. Therefore, as in the conventional structure in which the edge is completely fixed to the table, the prevention of the thermal expansion in the planar direction and thus the curvature of the heating surface are fundamentally prevented. Therefore, during the wafer process, the wafer is prevented from being defective due to the abnormal heating surface distortion of the hot plate.

1 is a schematic perspective view of a substrate heating apparatus according to an embodiment of the present invention.
2 is a side view of the substrate heating apparatus shown in Fig.
3 is a plan view of the substrate heating apparatus shown in Fig.
4 is an enlarged view of a portion A in Fig.
5 is an enlarged view of a portion B in Fig.
FIG. 6 shows the entire structure of the support portion applied to the substrate heating apparatus according to the embodiment of the present invention, and the state of connection between the upper and lower hot plates and the table.
FIG. 7 is an exploded perspective view showing the arrangement structure of a supporting portion with respect to a table in a substrate heating apparatus according to an embodiment of the present invention. FIG.
8 is a side view of the guide channel portion viewed from the direction C in Fig.

Hereinafter, a substrate heating apparatus according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

Fig. 1 is a schematic perspective view of a substrate heating apparatus 1 according to an embodiment of the present invention, Fig. 2 is a side view of the substrate heating apparatus 1 shown in Fig. 1, and Fig. 3 is a plan view thereof.

Referring first to FIGS. 1 and 2, a substrate heating apparatus according to the present invention includes a table 30 and a hot plate 10 which is floated by a plurality of supports 20 on a table 10.

The hot plate 10 has a structure in which the upper plate 10a, the lower plate 10c, and the heater 10b between them are assembled into a single sandwich structure. The hot plate 10 generally has a disc-like structure in conformity with the outer shape of the wafer (substrate), and is installed in the table 20 as a base plate.

As shown in FIGS. 1 to 3, the hot plate 10 is installed on the table 30 by a support portion 20 located at a peripheral portion around the center portion 10d. The support portion 20 is disposed at the peripheral portion along the bottom edge portion of the hot plate 10. [

The support 20 fixes the hot plate 10 on the table 30 and permits or guides radial expansion and contraction (arrow directions in FIGS. 2 and 3) of the hot plate by thermal expansion.

2, while the hot plate 10 is supported on the table 20 at a predetermined height as shown in Fig. 2, the hot plate 10 is guided so that thermal expansion and contraction can be naturally performed by its own heat .

One end of the support part 20 is fixed to the hot plate 10 or the table 30 and the other end is coupled to the table 30 or the hot plate 10 so as to reciprocate in the plane direction.

One end (upper end in the drawing) of the support portion 20 is fixed to the bottom surface of the hot plate 10 and the other end (lower end in the drawing) is coupled to the guide channel 31 provided on the hot plate 20 in this embodiment. The guide channel (31) supports the other end of the support part (20) so that it can reciprocate in the thermal expansion and contraction direction of the hot plate (10).

Fig. 4 and Fig. 5 are enlarged views of part A and part B in Fig.

4 and 5, a slider 21 is provided at the other end (lower end) of the support portion 20, and a guide channel (not shown) (Not shown).

The guide channel 31 guides the slider 21 to reciprocate for a predetermined distance, and does not allow movement of the slider 21 in the vertical direction, that is, in the longitudinal direction of the support portion 20. [ On the other hand, a sliding bushing 23 corresponding to a neck portion 32 of the guide channel 31 is provided on the slider 21 for reducing friction and smooth movement of the slider 21. The slider 21 is located in a relatively wide guide channel 31 and the neck 32 prevents the slider 21 from moving in the vertical direction so that the lower end of the support 20 is separated from the table 30 . The sliding bushing 23 serves as a kind of rotating bearing.

6 shows the overall structure of the support portion 20 and the state of connection between the upper and lower hot plates 10 and the table 30. As shown in FIG.

A screw portion 24a coupled to the hot plate 10 and a nut 25 for preventing the screw portion 24a from being loosened are provided at the upper end of the support portion 20. The threaded portion 24a is a part of the support body 24. The lower end of the support body 24 is screwed into the nut type sleeve 22. The lower end surface of the nut type sleeve 22 is in contact with the upper surface of the table 30, and the slider 21 is engaged with the lower surface thereof. The slider 21 has a threaded portion 21a at an upper portion thereof and is screwed to the lower end of the sleeve 22 through the threaded portion 21a. At this time, a cylindrical sliding bushing 23 is interposed between the sleeve 22 and the slider 21.

The slider 21 is located in the guide channel 33 of the table and the sliding bushing 23 is located in the upper neck portion 32 of the guide channel 33 to reduce friction do.

7 is an exploded perspective view showing the arrangement structure of the support portion 20 with respect to the table 30. FIG. 8 is a side view of the guide channel 31 portion viewed from the direction C in FIG.

As shown in FIG. 7, three guide channels 31 are formed on the table 30, and the lower end of the support portion 20 is coupled thereto. The lower end of the support portion 20 coupled to the guide channel 31 is a slider 21 as shown in Fig. In this embodiment, three guide channels 31 and corresponding three support portions 20 are provided, but according to another embodiment of the present invention, four or more guide channels 31 may be provided. As described above, the movement direction of the slider by the guide channel 31 is a radial direction passing through the center portion of the hot plate 10. [

In the above substrate heating apparatus of the present invention, the hot plate supporter moves in the plane direction of the hot plate when the hot plate expands thermally. At this time, the guide channel of the table allows the support to move. As described above, since the movement direction is the limited movement in which the movement direction is the center of the hot plate (10d in Fig. 1 and Fig. 2) and can not move in the radially outward direction toward the center, There is no deviation of the supporting portion with respect to the table except for movement or movement. As such, the plane support member is moved in the radial direction in compliance with the expansion of the hot plate, so that the plane distortion of the hot plate is prevented.

In the embodiment described above, the structure of the slider fitted in the guide channel of the table (base plate) can be modified in various forms. That is, in the substrate heating apparatus of the present invention, the technical scope of the structure for supporting the movement of the support portion with respect to the table or the base plate, that is, the specific structure such as the slider and the roller is not limited.

According to a preferred embodiment of the present invention, three supports and corresponding three summary guide channels are applied, so that the hot plate is supported in a three-point support structure by three supports. As described above, the three supports are allowed to move by the slider and the guide channel of the table that supports the slider so as to move in the direction toward the center of the hot plate, that is, in the radial direction.

Such a structure may be slidable individually because the slider is slidably coupled to the guide channel. However, since the three support portions are connected together by the hot plate, a rigid structure that does not generate relative movement between the hot plate and the table due to thermal expansion Bond structure.

In the conventional substrate heating apparatus, since the entire support structure of the hot plate is a completely fixed structure, the thermal expansion of the hot plate in the planar direction is suppressed, thereby distorting the plane of the hot plate and deforming the wafer. However, as described above, the present invention prevents the plane distortion of the hot plate, thereby preventing the wafer located on the hot plate from becoming defective.

While this invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Therefore, the true scope of protection of the present invention should be defined only by the appended claims.

Claims (7)

A hot plate;
A table for supporting the hot plate;
And the hot plate is supported on the table,
And a plurality of supports installed at the periphery of the center of the hot plate to guide radial thermal expansion of the hot plate. The method according to claim 1,
Wherein the radial thermal expansion by the supports is in a radial direction passing through the center of the hot plate. 3. The method according to claim 1 or 2,
Wherein at least three support portions are provided and one end thereof is fixed to a hot plate and the other end thereof is movably coupled along a guide channel formed on the table. The method of claim 3,
Wherein a slider is provided at a lower end of each of the support portions, and the guide channel of the table is coupled to allow the slider to reciprocate in one direction. 3. The method according to claim 1 or 2,
Wherein the support portions are disposed on the bottom surface of the hot plate at predetermined angular intervals,
Wherein the support portion guides thermal expansion and contraction of the hot plate in a radial direction passing through the center of the hot plate. 6. The method of claim 5,
Wherein at least three support portions are provided and one end thereof is fixed to a hot plate and the other end thereof is movably coupled along a guide channel formed on the table. The method according to claim 6,
And a slider is movably coupled to the guide channel at the other end of the support portion.
KR1020150041659A 2014-04-11 2015-03-25 heating apparatus for substrate KR20150118026A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/KR2015/003132 WO2015156530A1 (en) 2014-04-11 2015-03-31 Substrate heating device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020140043689 2014-04-11
KR20140043689 2014-04-11

Publications (1)

Publication Number Publication Date
KR20150118026A true KR20150118026A (en) 2015-10-21

Family

ID=54400319

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150041659A KR20150118026A (en) 2014-04-11 2015-03-25 heating apparatus for substrate

Country Status (1)

Country Link
KR (1) KR20150118026A (en)

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